Wafer processing equipment

Abstract

This application belongs to the field of semiconductor manufacturing equipment technology, specifically relating to a wafer processing apparatus. The wafer processing apparatus includes: a furnace tube, a loading / unloading area, and an isolation gate device. The loading / unloading area includes a boat loading / unloading area and a wafer loading / unloading area connected via a connecting area. The boat loading / unloading area is connected to the furnace tube and includes a first boat loading / unloading machine, which is at least used to move the boat into or out of the furnace tube. The wafer loading / unloading area includes a wafer loading / unloading machine, which is used to move wafers into or out of the boat. The isolation gate device is disposed in the connecting area and can isolate the boat loading / unloading area and the wafer loading / unloading area. The isolation gate device is operational, allowing the boat to flow between the boat loading / unloading area and the wafer loading / unloading area through the connecting area. The isolation gate device blocks byproducts generated in the furnace tube from passing through the connecting area, reducing the risk of byproduct contamination of the boat and the wafers on the boat, and improving product yield.

Description

Technical Field

[0001] This application belongs to the field of semiconductor manufacturing equipment technology, specifically relating to a wafer processing apparatus. Background Technology

[0002] The wafer processing apparatus may include connected furnace tubes and loading / unloading areas. When wafers on the first wafer boat in the loading / unloading area are moved into the furnace tubes for heat treatment via a wafer boat elevator, the second wafer boat in the loading / unloading area may be loaded into a temporary storage position to improve production efficiency.

[0003] When the wafer processing on the first wafer boat is completed, the wafer boat elevator removes the first wafer boat from the furnace tube, the wafer boat conveyor places the first wafer boat in a temporary storage position, and the wafer boat conveyor then conveys the second wafer boat to the wafer boat elevator, which moves the second wafer boat into the furnace tube for heat treatment.

[0004] When the first wafer boat is removed from the furnace tube, the gas pressure inside the furnace tube is higher than that in the loading and unloading area. As a result, reaction byproducts inside the furnace tube are ejected and contaminate the wafers on the second wafer boat. In addition, before the second wafer boat is moved from the temporary storage area into the furnace tube and during the process of moving into the furnace tube, reaction byproducts on the first wafer boat also diffuse onto the second wafer boat and contaminate the wafers on the second wafer boat. Summary of the Invention

[0005] The purpose of this application is to provide a wafer processing apparatus to reduce the risk of wafer contamination and improve product yield.

[0006] To achieve the above objectives, this application provides a wafer processing apparatus, comprising:

[0007] Furnace tubes;

[0008] The loading and unloading area includes a boat loading and unloading area and a wafer loading and unloading area connected by a connecting area. The boat loading and unloading area is connected to the furnace tube. The boat loading and unloading area includes a first boat loading and unloading machine, which is at least used to move a boat into or out of the furnace tube. The wafer loading and unloading area includes a wafer loading and unloading machine, which is at least used to move a wafer into or out of the boat.

[0009] An isolation door device is provided in the connecting area. The isolation door device can isolate the crystal boat loading and unloading area and the wafer loading and unloading area. The isolation door device can also operate to allow the crystal boat to flow between the crystal boat loading and unloading area and the wafer loading and unloading area through the connecting area.

[0010] Optionally, the isolation door device can drive the crystal boat to move, allowing the crystal boat to flow between the crystal boat loading / unloading area and the wafer loading / unloading area through the connecting area.

[0011] Optionally, the isolation door device includes a first isolation door assembly, which includes a first isolation door and a plurality of wafer boat transfer mechanisms. Each wafer boat transfer mechanism is used to carry and move at least one wafer boat. The plurality of wafer boat transfer mechanisms include a first wafer boat transfer mechanism and a second wafer boat transfer mechanism. The first wafer boat transfer mechanism and the second wafer boat transfer mechanism are distributed on a first side and a second side opposite to the first isolation door. At least the plurality of wafer boat transfer mechanisms are capable of rotating around a rotation center to form a first state and a second state. In the first state, the first wafer boat transfer mechanism is located in the wafer loading and unloading area, and the second wafer boat transfer mechanism is located in the wafer loading and unloading area. In the second state, the second wafer boat transfer mechanism is located in the wafer loading and unloading area, and the first wafer boat transfer mechanism is located in the wafer loading and unloading area.

[0012] Optionally, the crystal boat transfer mechanism includes a support base for supporting the crystal boat and moving the supported crystal boat when rotating around the rotation center. The support bases of the first crystal boat transfer mechanism and the second crystal boat transfer mechanism are connected by a connector, which is connected to the first isolation door. The connector and the support base are located on the same side of the first isolation door. The support base, the connector, and the first isolation door can rotate synchronously around the rotation center, allowing the plurality of crystal boat transfer mechanisms to switch between the first state and the second state; and / or

[0013] The crystal boat transfer mechanism includes a crystal boat support and a support shaft. The crystal boat support is disposed on the support shaft, and the support shaft is connected to the first isolation door. The crystal boat support can rotate around the support shaft to hold the crystal boat and carry the crystal boat. The crystal boat support can also rotate around the support shaft to release the held crystal boat. The crystal boat support, the support shaft, and the first isolation door can synchronously rotate around the rotation center to move the held crystal boat and switch the plurality of crystal boat transfer mechanisms between the first state and the second state.

[0014] Optionally, the crystal boat support includes multiple crystal boat sub-supports, the support shaft includes multiple support sub-shafts, the crystal boat sub-supports are disposed on the support shafts, the support shafts are connected to the first isolation door, and the crystal boat support is capable of rotating around the support shafts;

[0015] The crystal boat support can rotate around the support axis to hold the crystal boat to carry the crystal boat, including the plurality of crystal boat sub-supports of the crystal boat support being able to rotate to converge and clamp the crystal boat to carry the crystal boat;

[0016] The ability of the boat support to rotate about the support axis to release the held boat includes the ability of the plurality of boat sub-supports of the boat support to rotate to separate to release the clamped boat.

[0017] Optionally, the crystal boat transfer mechanism includes the crystal boat support and the support shaft, and the crystal boat transfer mechanism is configured as follows:

[0018] Before the crystal boat support, the support shaft, and the first isolation door rotate about the rotation center to move the held crystal boat, the crystal boat support can rotate about the support shaft to hold the crystal boat to support it, and the crystal boat support can rise to lift the held crystal boat.

[0019] After the crystal boat support, the support shaft, and the first isolation door rotate about the rotation center to move the held crystal boat, the crystal boat support can be lowered to put down the held crystal boat, and the crystal boat support can be rotated about the support shaft to release the held crystal boat.

[0020] Optionally, the first isolation door and the crystal boat transfer mechanism can rotate synchronously. The first isolation door assembly also includes a seal. When the first isolation door and the crystal boat transfer mechanism rotate, the seal forms a gap with the first isolation door. When the first isolation door and the crystal boat transfer mechanism stop rotating, the seal seals the gap between the loading / unloading area and the first isolation door.

[0021] Optionally, the first isolation door is a multi-wing revolving door, which includes at least three door wings, including two main door wings and at least one secondary door wing. The two main door wings are connected to divide the first side and the second side of the first isolation door, and the at least one secondary door wing is located on the first side and / or the second side of the first isolation door.

[0022] The included angles between adjacent door wings are equal, and the crystal boat transfer mechanism is arranged one-to-one between adjacent door wings. The crystal boat transfer mechanism and the multi-wing rotating door can rotate around the rotation center, driving the crystal boat to flow between the crystal boat loading and unloading area and the wafer loading and unloading area through the connecting area.

[0023] Optionally, the wafer loading and unloading area includes multiple functional sub-areas and / or the wafer loading and unloading area includes multiple functional sub-areas, with isolation partitions formed between adjacent door wings. The multi-wing rotating door and the wafer transfer mechanism rotate around the rotation center, so that each isolation partition is sequentially connected to the functional sub-area.

[0024] Optionally, the wafer processing apparatus includes multiple loading and unloading areas and multiple furnace tubes, with each loading and unloading area corresponding to and connected to a furnace tube.

[0025] Optionally, the isolation door device can be opened when the crystal boat passes through and closed after the crystal boat passes through.

[0026] Optionally, the isolation door device includes a second isolation door assembly;

[0027] The second isolation door assembly includes a second isolation door, and the second isolation door assembly includes a third state and a fourth state, wherein in the third state, the second isolation door closes the communication area, and in the fourth state, the second isolation door opens the communication area; and / or

[0028] The second isolation door assembly includes a second wafer loading / unloading machine, which is disposed in the wafer loading / unloading area. The second wafer loading / unloading machine is used to move the wafer into the wafer loading / unloading area and close the communication area, and the second wafer loading / unloading machine is also used to move the wafer out of the wafer loading / unloading area.

[0029] Optionally, the second isolation door assembly includes a second isolation door, the furnace tube and the wafer loading / unloading area are located on the same side of the wafer loading / unloading area, and the second isolation door assembly includes a fifth state in which the second isolation door closes the connection between the furnace tube and the wafer loading / unloading area.

[0030] Optionally, the second isolation door assembly includes a second isolation door and a door drive mechanism. The door drive mechanism includes a door hinge and a crossbeam. The door hinge is rotatably disposed between the furnace tube and the wafer loading / unloading area, and the crossbeam connects the second isolation door and the door hinge.

[0031] Optionally, the furnace tube and the wafer loading / unloading area are arranged vertically, and the furnace tube and the wafer loading / unloading area are located on the same side of the wafer loading / unloading area. When loading and unloading the wafer, the first wafer loading / unloading machine and the second wafer loading / unloading machine drive the wafer to move vertically.

[0032] Optionally, the wafer processing apparatus further includes a transfer area and at least one transfer port. The transfer area is disposed on one side of the wafer loading / unloading area and is used to place wafer cassettes. The transfer port is disposed on an isolation wall between the wafer loading / unloading area and the transfer area. The isolation wall partially surrounds the wafer loading / unloading machine, and the axial direction of the isolation wall is parallel to the vertical direction. The transfer port is used at least for the passage of wafers within the wafer cassettes. The wafer loading / unloading machine is used to move wafers from the wafer cassettes into a wafer boat within the wafer loading / unloading area, and also to move wafers from the wafer boat into wafer cassettes in the transfer area. A support assembly is disposed on the side of the isolation wall away from the wafer loading / unloading machine. The support assembly includes at least one wafer cassette support, which is used to support the wafer cassettes in the transfer area.

[0033] The support assembly includes n columns of the crystal cell support arranged circumferentially along the isolation wall, and the at least one transmission port is arranged in n columns circumferentially along the isolation wall, where n≥1, and the column position of each column of the crystal cell support corresponds to the column position of each column of the transmission port.

[0034] Optionally, the isolation wall is equidistantly positioned around the wafer loading / unloading machine, where n ≥ 2.

[0035] Optionally, in the n columns of the cell support, the m-th column of the cell support includes multiple cell supports, and the m-th column of the cell support is divided into i m There are 1 cell support unit, 1≤m≤n, i m ≥2, the cell support unit includes j m The aforementioned crystal cell support, j m ≥1, the i m Each cell support unit is distributed along the vertical direction;

[0036] In the n columns of transmission ports, the m-th column of transmission ports includes j m The m-th column of the transmission ports corresponds to the column position of the m-th column of the crystalline cell support. The j-th column of the transmission ports... m The transmission port is connected to any of the cell support units in the m-th column of the cell support, where j is... m The positions of the crystal cell supports are the same;

[0037] The m-th column cell support can move vertically, so that any cell support unit of the m-th column cell support is aligned with the m-th column transmission port.

[0038] Optional, j m ≥2, in the m-th column of the crystal cell support, the crystal cell supports in any two adjacent crystal cell support units are alternately arranged in the vertical direction.

[0039] The wafer processing apparatus disclosed in this application has the following beneficial effects:

[0040] The wafer processing apparatus in this application includes: a furnace tube, a loading and unloading area, and an isolation door device. The loading and unloading area includes a wafer loading and unloading area and a wafer loading and unloading area connected by a connecting area. The wafer loading and unloading area is connected to the furnace tube. The wafer loading and unloading area includes a first wafer loading and unloading machine, which is used at least to move the wafer into or out of the furnace tube. The wafer loading and unloading area includes a wafer loading and unloading machine, which is used to move the wafer into or out of the wafer boat. The isolation door device is disposed in the connecting area. The isolation door device can isolate the wafer loading and unloading area and the wafer loading and unloading area, and the isolation door device can work to allow the wafer boat to flow between the wafer loading and unloading area and the wafer loading and unloading area through the connecting area. Because the isolation door device is only briefly opened when the crystal boat passes through, the crystal boat can flow between the crystal boat loading and unloading area and the wafer loading and unloading area through the connecting area. When no crystal boat passes through, the crystal boat loading and unloading area and the wafer loading and unloading area are isolated by the isolation door device, which blocks the by-products generated in the furnace tube from passing through the connecting area, reduces the risk of by-products contaminating the crystal boat and the wafers on the crystal boat, and improves the product yield.

[0041] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0042] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0043] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0044] Figure 1 This is a front view schematic diagram of the wafer processing apparatus in Embodiment 1 of this application.

[0045] Figure 2 This is a top view schematic diagram of the wafer processing apparatus in Embodiment 1 of this application.

[0046] Figure 3 This is a schematic diagram showing byproducts ejected from the furnace tubes and contaminating the wafers.

[0047] Figure 4 This is a schematic diagram of a wafer contaminated by the diffusion of byproducts.

[0048] Figure 5 This is a schematic diagram of a contaminated wafer.

[0049] Figure 6 This is a schematic diagram of the crystal boat holder holding the crystal boat in Embodiment 1 of this application.

[0050] Figure 7 This is a schematic diagram of the crystal boat support releasing the crystal boat in Embodiment 1 of this application.

[0051] Figure 8 This is a schematic diagram of the support base carrying the crystal boat in Embodiment 1 of this application.

[0052] Figure 9 This is a schematic diagram of the closure of the first isolation door in Embodiment 1 of this application.

[0053] Figure 10 This is a schematic diagram of the opening of the first isolation door in Embodiment 1 of this application.

[0054] Figure 11 This is a schematic diagram of the first isolation door assembly forming multiple isolation zones in Embodiment 1 of this application.

[0055] Figure 12 This is a schematic diagram of a wafer processing apparatus with multiple furnace tubes in Embodiment 1 of this application.

[0056] Figure 13 This is a schematic diagram of loading and unloading wafers in the first wafer carrier unit of Embodiment 1 of this application.

[0057] Figure 14 This is a schematic diagram of wafer loading and unloading in the second wafer carrier unit in Embodiment 1 of this application.

[0058] Figure 15 This is a front view schematic diagram of the wafer processing apparatus in Embodiment 2 of this application.

[0059] Figure 16 This is a top view schematic diagram of the wafer processing apparatus in Embodiment 2 of this application.

[0060] Explanation of reference numerals in the attached figures:

[0061] 100. Furnace tubes;

[0062] 200. Crystal boat loading and unloading area; 201. Temporary storage location; 210. First crystal boat loading and unloading machine;

[0063] 300. Wafer loading and unloading area; 310. Wafer loading and unloading machine;

[0064] 400. First isolation door assembly; 410. First isolation door; 411. Door wing; 421. Crystal boat bracket; 422. Bracket pivot; 431. Support base; 432. Connector; 440. Sealing element;

[0065] 500. Transfer area; 510. Transmission port; 520. Isolation wall;

[0066] 600, Support assembly; 610, Cell support unit; 611, Cell support;

[0067] 700. Second isolation door assembly; 710. Second isolation door; 720. Door drive mechanism; 721. Door hinge; 722. Crossbeam; 730. Second crystal boat loading and unloading machine;

[0068] 800. Crystal boat transfer device;

[0069] 901. First crystal boat; 902. Second crystal boat; 903. Wafer box. Detailed Implementation

[0070] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0071] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0072] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present application, and should not be construed as limiting the present application.

[0073] Example 1

[0074] See Figure 1 and Figure 2 As shown, the wafer processing apparatus in this embodiment includes: a furnace tube 100, a loading / unloading area, and an isolation door device. The loading / unloading area includes a boat loading / unloading area 200 and a wafer loading / unloading area 300 connected by a connecting area, with the boat loading / unloading area 200 communicating with the furnace tube 100. The boat loading / unloading area 200 includes a first boat loading / unloading machine 210, which is at least used to move a boat into or out of the furnace tube 100. The wafer loading / unloading area 300 includes a wafer loading / unloading machine 310, which is at least used to move wafers into or out of a boat. The wafer loading / unloading machine 310 is used to move wafers into or out of a wafer cassette 903.

[0075] An isolation door device is installed in the connecting area. In a static state, the isolation door device can isolate the wafer loading / unloading area 200 and the wafer loading / unloading area 300. The isolation door device is also operational, allowing the wafer to pass through the connecting area between the wafer loading / unloading area 200 and the wafer loading / unloading area 300. In other words, the isolation door device only opens briefly when a wafer passes through, allowing the wafer to pass through the connecting area between the wafer loading / unloading area 200 and the wafer loading / unloading area 300. When no wafer passes through, the wafer loading / unloading area 200 and the wafer loading / unloading area 300 are isolated by the isolation door device.

[0076] In existing wafer processing equipment, while wafers on the first wafer boat in the loading / unloading area are moved into the furnace tube for heat treatment via a wafer boat elevator, wafers on the second wafer boat in the loading / unloading area can be loaded into a temporary storage position to improve production efficiency. When wafer processing on the first wafer boat is completed, the wafer boat elevator removes the first wafer boat from the furnace tube, the wafer boat transfer device places the first wafer boat in the temporary storage position, and the wafer boat transfer device then transfers the second wafer boat to the wafer boat elevator, which moves the second wafer boat into the furnace tube for heat treatment.

[0077] See Figures 3 to 5 As shown, when the first wafer boat 901 is removed from the furnace tube, the gas pressure inside the furnace tube is higher than that in the loading / unloading area. This causes reaction byproducts to be ejected from the furnace tube, contaminating the wafers on the second wafer boat 902. Even with purge gas in the loading / unloading area, the velocity of the byproducts ejected is much greater than the velocity of the purge gas, meaning the contamination of the wafers on the second wafer boat 902 cannot be completely prevented. Furthermore, before and during the transfer of the second wafer boat 902 from the temporary storage area into the furnace tube, reaction byproducts from the first wafer boat 901 also diffuse onto the second wafer boat 902, contaminating the wafers there. Even with gas purging in the loading / unloading area, the purge gas can only remove some of the diffused byproducts and cannot fundamentally solve the wafer contamination problem. The contamination problem is more pronounced on the side of the wafers on the second wafer boat 902 closest to the furnace tube.

[0078] In this embodiment, the wafer processing apparatus includes: a furnace tube 100, a loading and unloading area, and an isolation door device. The loading and unloading area includes a wafer loading and unloading area 200 and a wafer loading and unloading area 300 connected by a connecting area. The wafer loading and unloading area 200 is connected to the furnace tube 100. The wafer loading and unloading area 200 includes a first wafer loading and unloading machine 210, which is at least used to move the wafer into or out of the furnace tube 100. The wafer loading and unloading area 300 includes a wafer loading and unloading machine 310, which is used to move the wafer into or out of the wafer boat. The isolation door device is disposed in the connecting area. The isolation door device can isolate the wafer loading and unloading area 200 and the wafer loading and unloading area 300, and the isolation door device can work to allow the wafer boat to flow between the wafer loading and unloading area 200 and the wafer loading and unloading area 300 through the connecting area. Because the isolation door device is only briefly opened when the wafer boat passes through, the wafer boat can flow between the wafer boat loading / unloading area 200 and the wafer loading / unloading area 300 through the connecting area. When no wafer boat passes through, the wafer boat loading / unloading area 200 and the wafer loading / unloading area 300 are in a state of isolation by the isolation door device, which blocks the by-products generated in the furnace tube 100 from passing through the connecting area, reduces the risk of by-products contaminating the wafer boat and the wafers on the wafer boat, and improves the product yield.

[0079] It should be noted that when the crystal boat is removed from the furnace tube 100, the crystal boat loading and unloading area 200 and the wafer loading and unloading area 300 are separated by the isolation door device. Gas purging can be set in the crystal boat loading and unloading area 200 and the wafer loading and unloading area 300. When the reaction by-products on the crystal boat in the crystal boat loading and unloading area 200 and the wafer loading and unloading area 300 are purged to meet the requirements, the isolation door device is activated, that is, the crystal boat loading and unloading area 200 and the wafer loading and unloading area 300 are briefly connected, and the crystal boat can flow between the crystal boat loading and unloading area 200 and the wafer loading and unloading area 300, which further reduces the risk of by-product contamination of the crystal boat and the wafers on the crystal boat and improves the product yield.

[0080] In some embodiments, the isolation door device can drive the crystal boat to move, enabling the crystal boat to flow between the crystal boat loading / unloading area 200 and the wafer loading / unloading area 300 through the connecting area. That is, when the isolation door device is stationary, it isolates the crystal boat loading / unloading area 200 and the wafer loading / unloading area 300; when the isolation door device is working, it drives the first crystal boat 901 of the crystal boat loading / unloading area 200 to move to the wafer loading / unloading area 300, and drives the second crystal boat 902 of the wafer loading / unloading area 300 to move to the crystal boat loading / unloading area 200. After the second wafer boat 902 is fed into the furnace tube 100 for processing, and the first wafer boat 901 completes wafer loading and unloading in the wafer loading and unloading area 300 and is reloaded, the isolation door device can exchange the areas where the two wafer boats are located again, so that the two wafer boats circulate between the wafer loading and unloading area 200 and the wafer loading and unloading area 300, continuously feeding unprocessed wafers from the wafer loading and unloading area 300 into the furnace tube 100 for processing. After the wafers are processed, they are sent back to the wafer loading and unloading area 300 and flow to the next process.

[0081] The isolation door device not only isolates the crystal boat loading and unloading area 200 and the wafer loading and unloading area 300, but also swaps the areas of the two crystal boats when the isolation door device is opened, shortening the connection time between the crystal boat loading and unloading area 200 and the wafer loading and unloading area 300, which helps to reduce the risk of by-product contamination of the crystal boat and the wafers on the crystal boat.

[0082] For example, the isolation door device includes a first isolation door assembly 400, which includes a first isolation door 410 and a plurality of crystal boat transfer mechanisms. Each crystal boat transfer mechanism is used to carry and move at least one crystal boat. The plurality of crystal boat transfer mechanisms include a first crystal boat transfer mechanism and a second crystal boat transfer mechanism, which are distributed on a first side and a second side opposite to the first isolation door 410.

[0083] At least multiple crystal boat transfer mechanisms can rotate around the rotation center to form a first state and a second state. In the first state, the first crystal boat transfer mechanism is located in the crystal boat loading and unloading area 200, and the second crystal boat transfer mechanism is located in the wafer loading and unloading area 300. In the second state, the second crystal boat transfer mechanism is located in the crystal boat loading and unloading area 200, and the first crystal boat transfer mechanism is located in the wafer loading and unloading area 300. That is, the exchange of the areas where the first crystal boat 901 and the second crystal boat 902 are located is realized through the exchange of the areas where the crystal boat transfer mechanisms are located.

[0084] At least the wafer transfer mechanism can rotate around the rotation center. That is, the first isolation door 410 can be raised, lowered, or slid to connect the wafer loading / unloading area 200 and the wafer loading / unloading area 300. Only the rotation of the wafer transfer mechanism enables the exchange of areas where the two wafers are located. Alternatively, the wafer transfer mechanism can be connected to the first isolation door 410. This connection can be direct or indirect, movable or fixed, allowing the wafer transfer mechanism and the first isolation door 410 to rotate synchronously, thus achieving the exchange of areas where the two wafers are located. In some embodiments, the two wafer transfer mechanisms are arranged symmetrically at their centers. The common center point between the two wafer transfer mechanisms, i.e., the center of symmetry, can serve as the rotation center of the wafer transfer mechanism. In other embodiments, the rotation center is set according to the actual situation.

[0085] The first and second crystal boat transfer mechanisms are located on the first and second sides opposite to the first isolation door 410. The crystal boat transfer mechanisms can exchange the areas of the two crystal boats by rotating 180° around the rotation center.

[0086] See Figure 6 and Figure 7As shown, the crystal boat transfer mechanism includes a crystal boat support and a support shaft. The crystal boat support is rotatably mounted on the first isolation door 410 via the support shaft. The support shaft can be directly or indirectly connected to the first isolation door 410. The connection can be a movable connection or a fixed connection, as long as the support shaft can serve as the rotation axis of the crystal boat support and enable the crystal boat transfer mechanism to rotate synchronously with the first isolation door 410. The crystal boat support can rotate around the support shaft to hold the crystal boat and carry it. The crystal boat support can also rotate around the support shaft to release the held crystal boat. Furthermore, the crystal boat support, the support shaft, and the first isolation door 410 can rotate synchronously around the rotation center to move the held crystal boat, and multiple crystal boat transfer mechanisms can switch between a first state and a second state.

[0087] It should be noted that the crystal boat transfer mechanism includes a crystal boat support and a support shaft. The crystal boat support can rotate around the support shaft to hold or release the crystal boat, but it is not limited to this. The crystal boat transfer mechanism can also adopt a telescopic structure, in which the crystal boat transfer mechanism holds or releases the crystal boat through telescopic movement, depending on the specific situation.

[0088] The crystal boat transfer mechanism includes a crystal boat support and a support shaft. The crystal boat support rotates around the support shaft to hold or release the crystal boat. Compared with the crystal boat transfer mechanism that holds or releases the crystal boat by telescopic movement, the holding or releasing structure of the crystal boat is simpler, which can reduce the manufacturing cost of the wafer processing device and improve the robustness of the crystal boat transfer mechanism.

[0089] The crystal boat transfer mechanism includes a crystal boat support and a support shaft, which rotates around the support shaft to hold or release the crystal boat.

[0090] In some embodiments, the crystal boat support is a single-arm support, meaning the crystal boat transfer mechanism holds or releases the crystal boat by rotating the crystal boat support. Preferably, when the crystal boat support is a single-arm support, there is a mating structure between the crystal boat support and the crystal boat to ensure that the crystal boat support can stably hold the crystal boat. The mating structure is, for example, a hook mechanism or a gripping mechanism, which enables the holding or release of the crystal boat.

[0091] In some embodiments, the crystal boat support is a multi-arm clamping support, that is, the crystal boat support includes multiple crystal boat sub-supports 421, and the crystal boat carrying mechanism holds or releases the crystal boat by the multiple crystal boat supports 421 moving closer or further apart from each other. The structure is simple and the operation is convenient.

[0092] Specifically, the crystal boat support includes multiple crystal boat brackets 421, and the support shaft includes multiple bracket shafts 422. The bracket shafts 422 are connected to the first isolation door 410. The connection can be direct or indirect, movable or fixed, as long as the bracket shafts 422 can serve as the rotation axis of the crystal boat brackets 421 and enable the crystal boat transfer mechanism to rotate synchronously with the first isolation door 410. Each crystal boat bracket 421 is rotatably connected to the first isolation door 410 via each bracket shaft 422, and the crystal boat bracket 421 can rotate around the bracket shaft 422. Figure 6 and Figure 7 In the illustrated embodiment, the crystal boat support includes two crystal boat sub-supports 421, and the support shaft includes two support sub-shafts 422. The support sub-shafts 422 are fixedly disposed on the first isolation door 410 at least horizontally. The crystal boat support can be rotated around the support shaft to hold the crystal boat to carry the crystal boat, including the plurality of crystal boat sub-supports 421 of a crystal boat support being able to rotate to converge and clamp the crystal boat to carry the crystal boat; the crystal boat support can be rotated around the support shaft to release the held crystal boat, including the plurality of crystal boat supports 421 of a crystal boat support being able to rotate to separate to release the clamped crystal boat.

[0093] Preferably, the crystal boat support includes two crystal boat sub-supports 421, and the support shaft includes two support sub-shafts 422, such as... Figure 6 As shown, the structure is simple in design, easy to operate, and can hold the crystal boat relatively stably. A crystal boat support can be provided on each side of the first isolation door 410 to hold or release the crystal boat. In other embodiments, two or more crystal boat supports can also be provided on the same side of the first isolation door 410. Multiple crystal boat supports can be spaced apart vertically to clamp the crystal boat at multiple points, improving the stability of holding the crystal boat.

[0094] In some embodiments, the boat transfer mechanism is configured such that at least the boat support is capable of reciprocating in a vertical direction. Before the boat support, support shaft, and first isolation door 410 rotate about the rotation center to move the held boat, the boat support can rotate about the support shaft to hold the boat and carry it, and the boat support can rise to lift the held boat; after the boat support, support shaft, and first isolation door 410 rotate about the rotation center to move the held boat, the boat support can descend to put down the held boat, and the boat support can rotate about the support shaft to release the held boat. For example, after the first boat loading / unloading machine 210 removes the first boat 901 from the furnace tube 100, the boat support can rotate about the support shaft to hold the boat and carry it, and then the boat support can rise to lift the carried boat from the first boat loading / unloading machine 210, so that the boat support can rotate about the rotation center to switch between the first and second states to exchange the areas where the first boat 901 and the second boat 902 are located. Before the first crystal boat loading and unloading machine 210 moves the second crystal boat 902 into the furnace tube 100, the crystal boat support can be lowered to place the second crystal boat 902 on the first crystal boat loading and unloading machine 210, and then the crystal boat support can be rotated about the support axis to release the held crystal boat.

[0095] In some embodiments, the crystal boat support achieves the reciprocating motion in the vertical direction driven by the support shaft, which is movably connected to the first isolation door 410, allowing for reciprocating motion in the vertical direction. In some embodiments, the support shaft is fixedly and directly connected to the first isolation door 410, and the crystal boat support achieves the reciprocating motion in the vertical direction driven by both the support shaft and the first isolation door 410.

[0096] The wafer carrier can reciprocate vertically, lifting the wafer carrier from the first wafer carrier loading / unloading machine 210 when picking it up, and rotating it to position before lowering it to release it, thus preventing the wafer carrier from bumping into each other during transit and affecting product yield. Furthermore, the wafer carrier's vertical reciprocating movement and its ability to hold and release the wafer carrier ensure a smooth transfer of the wafer carrier to the first wafer carrier loading / unloading machine 210. This eliminates the need for a wafer carrier transfer device 800 in the wafer loading / unloading area 200 to transfer the wafer carrier from the first wafer carrier loading / unloading machine 210 to the wafer carrier transfer mechanism, reducing the manufacturing cost of the wafer processing equipment.

[0097] See Figure 8 As shown, in some embodiments, the crystal boat transfer mechanism includes support bases 431. Two support bases 431 are respectively disposed on the first side and the second side of the first isolation door 410. The support bases 431 are used to support the crystal boat and move the supported crystal boat when rotating around the rotation center. Figure 8In the illustrated embodiment, the two support bases 431 are symmetrically arranged, and the rotation center can be the common center point of the two support bases 431. In other embodiments, the rotation center of the support bases 431 is set according to actual needs. When the crystal boat transfer mechanism includes support bases 431, the crystal boat loading and unloading area 200 can be equipped with a crystal boat transfer device 800 for transferring the crystal boat from the first crystal boat loading and unloading machine 210 to the support base 431 or vice versa. In addition, the support base 431 can also be equipped with structures such as suction cups or slots to fix the crystal boat and prevent the crystal boat from tilting or shifting when the support base 431 rotates around the rotation center.

[0098] The crystal boat transfer mechanism includes a support base 431, which supports and moves the crystal boat, making it easier to exchange the areas where the two crystal boats are located.

[0099] In some embodiments, the support base 431 of the first crystal boat transfer mechanism and the support base 431 of the second crystal boat transfer mechanism are connected by a connector 432. The connector 432 is connected to the first isolation door 410, and the connector 432 and the support base 431 are located on the same side of the first isolation door 410. The connector 432 and the support base 431 can be integrally connected, and a rotary drive device such as a motor can be located on the side of the connector 432 and the support base 431 away from the first isolation door 410. The support base 431, the connector 432, and the first isolation door 410 can rotate synchronously, allowing the areas where the first crystal boat transfer mechanism and the second crystal boat transfer mechanism are located to be interchanged, thus realizing the interchange of the areas where the two crystal boats are located.

[0100] The support base 431 serves as both a crystal boat transfer mechanism to drive the crystal boat to rotate and a base to drive the first isolation door 410 to rotate, thus simplifying the structure of the first isolation door assembly 400.

[0101] It should be noted that the crystal boat transfer mechanism includes a support base 431, or it may include a crystal boat bracket and a bracket pivot, but it is not limited to these. The crystal boat transfer mechanism may also include a support base 431, a crystal boat bracket, and a bracket pivot simultaneously, depending on the specific circumstances. The crystal boat transfer mechanism includes a support base 431, a crystal boat bracket, and a bracket pivot. The crystal boat held by the crystal boat bracket and the bracket pivot is placed on the support base 431. During the rotation of the crystal boat transfer mechanism and the first isolation door 410, the crystal boat is less likely to tilt or sway. Furthermore, with the support base 431 as support, the number of crystal boat sub-brackets 421 of the crystal boat bracket can be reduced, for example, to two.

[0102] See Figure 9 and Figure 10As shown, the first isolation door 410 and the crystal boat transfer mechanism can rotate synchronously. The first isolation door assembly 400 also includes a seal 440, which can be disposed between the first isolation door 410 and the inner wall of the loading / unloading area. Before the first isolation door 410 and the crystal boat transfer mechanism rotate, the seal 440 moves away from the first isolation door 410, so that when the first isolation door 410 and the crystal boat transfer mechanism rotate, the seal 440 forms a gap with the first isolation door 410. When the first isolation door 410 and the crystal boat transfer mechanism stop rotating, the seal 440 moves towards the first isolation door 410, sealing the gap between the loading / unloading area and the first isolation door 410.

[0103] A seal 440 is installed between the first isolation door 410 and the loading / unloading area to enhance the barrier effect of the first isolation door 410 and further reduce the risk of by-product contamination of the crystal boat and the wafers on the crystal boat.

[0104] See Figure 11 As shown, the first isolation door 410 is a multi-wing revolving door, comprising at least three door wings 411, including two main door wings and at least one secondary door wing. The two main door wings are connected to divide the first isolation door 410 into a first side and a second side, and the at least one secondary door wing is located on the first side and / or the second side of the first isolation door 410. All door wings 411 are arranged in a circular array and have a common rotation axis, i.e., a rotation center. The included angle formed between each pair of adjacent door wings 411 is equal, and isolation zones are formed between adjacent door wings 411. The included angle between the door wings 411 corresponding to each isolation zone is the same.

[0105] The first isolation gate assembly 400 includes multiple wafer transfer mechanisms, including a first wafer transfer mechanism, a second wafer transfer mechanism, ..., a p-th wafer transfer mechanism, where p is the number of isolation zones. The wafer transfer mechanisms are arranged one-to-one between adjacent gate wings 411, that is, one-to-one between the wafer transfer mechanisms in the isolation zones. The wafer transfer mechanisms can rotate around a rotation center, driving the wafers to flow between the wafer loading / unloading area 200 and the wafer loading / unloading area 300 through the connecting area.

[0106] Each wafer transfer mechanism can carry and move at least one wafer. The first isolation door 410 is a multi-wing rotating door. The door wings 411 of the multi-wing rotating door are arranged in a circular array to form multiple isolation zones. The wafer transfer mechanisms are arranged one-to-one between adjacent door wings 411. The wafer transfer mechanisms in the first isolation door assembly 400 and the first isolation door 410 can rotate synchronously, so that the first isolation door assembly 400 can carry and move more wafers at the same time, thereby improving the wafer processing efficiency of the wafer processing device.

[0107] See Figure 11As shown, the wafer loading / unloading area 200 includes at least one functional sub-area, and the wafer loading / unloading area 300 includes at least one functional sub-area. The number of functional sub-areas included in the wafer loading / unloading area 200 and the wafer loading / unloading area 300 may be the same or different. For example, some functional sub-areas of the wafer loading / unloading area 200 are used to connect to the furnace tube 100, and some functional sub-areas of the wafer loading / unloading area 200 are used for pre-processing, cooling, or temporary storage of the wafer; some functional sub-areas of the wafer loading / unloading area 300 are used for wafer transfer into or out of the wafer, and some functional sub-areas of the wafer loading / unloading area 300 are used for pre-processing, cooling, or temporary storage of the wafer, depending on the specific circumstances. The first isolation door 410 and the wafer transfer mechanism rotate around the rotation center, so that each isolation partition is sequentially connected to the functional sub-area, thereby allowing each wafer to flow sequentially between different functional sub-areas. It is understandable that when the first isolation door 410 rotates, the functional sub-areas are connected. After the first isolation door 410 has rotated and each isolation zone is connected to the functional sub-area, the first isolation door 410 is closed, thus creating isolation between the functional sub-areas.

[0108] The number of functional sub-regions contained in the crystal boat loading / unloading area 200 and the wafer loading / unloading area 300 can be set according to actual needs. It is understood that the sum of the number of functional sub-regions contained in the crystal boat loading / unloading area 200 and the wafer loading / unloading area 300 is the same as the number of isolation zones divided by the first isolation door 410, i.e., the multi-wing rotating door. In some embodiments, when there is an even number of isolation zones, the two main door wings connected in the first isolation door 410 form a 180-degree angle; when there is an odd number of isolation zones, the angle between the two main door wings connected in the first isolation door 410 is less than 180 degrees, but this is not limited to this; when there is an even number of isolation zones, the angle between the two main door wings connected in the first isolation door 410 can also be less than 180 degrees.

[0109] The wafer loading and unloading area 200 includes multiple functional sub-areas and / or the wafer loading and unloading area 300 includes multiple functional sub-areas. Multiple ring array door wings 411 form multiple isolation partitions. The wafer transfer mechanism is set in the isolation partitions one by one, so that each isolation partition is connected to the functional sub-area in sequence, thereby allowing each wafer to flow between different functional sub-areas in sequence. Setting more functional sub-areas for pre-processing, cooling or temporary storage of wafers can further improve the working efficiency of wafer processing device in processing wafers. Moreover, the isolation between multiple functional sub-areas is achieved through the first isolation door assembly 400 including the first isolation door 410, that is, the multi-wing rotating door, which further reduces contamination.

[0110] In some embodiments, see Figure 12 As shown, the wafer processing apparatus includes multiple loading and unloading areas and multiple furnace tubes 100. Each loading and unloading area includes a wafer boat loading and unloading area 200 and a wafer loading and unloading area 300 connected by a connecting area. First isolation door assemblies 400 are arranged one-to-one in the connecting area. The wafer boat loading and unloading area 200 and the furnace tube 100 are connected one-to-one.

[0111] The wafer processing apparatus includes multiple furnace tubes 100, which can process multiple wafer boats simultaneously, thereby improving the wafer processing efficiency of the wafer processing apparatus. Multiple wafer loading / unloading areas 300 in the wafer processing apparatus can share a wafer transfer machine, and correspondingly, can share a transfer area 500 and a transfer port 510, thereby reducing the cost of the wafer processing apparatus and minimizing the space it occupies.

[0112] See Figure 2 , Figure 13 and Figure 14 As shown ( Figure 13 and Figure 14 for Figure 2 The wafer processing apparatus (with cross-section AA) further includes a transfer area 500 and a transfer port 510, with at least one transfer port 510. The transfer area 500 is located on one side of the wafer loading / unloading area 300 and is used to place the wafer cassette 903. The transfer port 510 is located on a partition wall 520 between the wafer loading / unloading area 300 and the transfer area 500. The partition wall 520 partially surrounds the wafer loading / unloading machine 310, and the axial direction of the partition wall 520 is parallel to the vertical direction. The transfer port 510 is at least used to allow wafers to pass through the wafer cassette 903. Preferably, the transfer port 510 is a FIMS (Front Open Interface Mechanical Standard) device, and the transfer port 510 is also used to open or close the wafer cassette 903. The wafer loading / unloading machine 310 is used to move wafers from the wafer cassette 903 into a wafer boat in the wafer loading / unloading area 300, and the wafer loading / unloading machine 310 is used to move wafers from the wafer boat into the wafer cassette 903 in the transfer area 500.

[0113] A support assembly 600 is provided on the side of the isolation wall 520 away from the wafer loading / unloading machine 310. The support assembly 600 includes at least one wafer cassette support 611, which is used to support a portion of the wafer cassettes 903 in the transfer area 500. The support assembly 600 includes n columns of wafer cassette supports 611 arranged circumferentially along the isolation wall 520. At least one transfer port 510 is arranged in n columns circumferentially along the isolation wall 520, where n is greater than or equal to 1. The column position of each column of wafer cassette supports 611 corresponds to the column position of each column of transfer ports 510.

[0114] When n equals 1, a column of transmission ports 510 may include multiple transmission ports 510; when n is greater than 1, multiple columns of transmission ports 510 are arranged around the wafer loading and unloading machine 310, so that the wafer loading and unloading machine 310 can access wafers in different wafer cassettes 903 as needed through multiple transmission ports 510, or when the access of wafers in one wafer cassette 903 is completed, the wafer loading and unloading machine 310 can access wafers in another wafer cassette 903 in a timely manner, which improves the internal structural operational flexibility and working efficiency of the wafer processing device.

[0115] The support assembly 600 is mounted on the isolation wall 520, and the wafer box 903 is placed on the support assembly 600. The distance between the wafer box 903 and the wafer boat is shortened, which reduces the time spent on wafer loading and unloading and improves the working efficiency of the wafer processing device.

[0116] In some embodiments, such as Figure 2 As shown, the partition wall 520 is equidistantly surrounding the wafer loading and unloading machine 310, where n is greater than or equal to 2. The partition wall 520 equidistantly surrounding the wafer loading and unloading machine 310 can be, at least multiple rows of transfer ports 510 on the partition wall 520 are equidistantly surrounding the wafer loading and unloading machine 310.

[0117] Multiple rows of wafer tray supports 611 are arranged around the partition wall 520, and multiple rows of conveyor ports 510 are arranged around the partition wall 520. The position of each row of wafer tray supports 611 corresponds to the position of each row of conveyor ports 510. The wafer loading and unloading machine 310 can load and unload wafers from the multiple rows of wafer tray supports 611. By configuring the partition wall 520 to surround the wafer loading and unloading machine 310 at equal intervals, the distance from the wafer loading and unloading machine 310 to each row of wafer tray supports 611 can be equal or approximately equal, which reduces the difficulty of wafer loading and unloading operations, improves the working efficiency of the wafer processing device, and simplifies the structural design of the wafer loading and unloading machine 310.

[0118] In some embodiments, in the n-column cell support 611, the m-th column of cell support 611 includes a plurality of cell supports 611 and the m-th column of cell support 611 is divided into i m There are 610 cell support units, 1 ≤ m ≤ n, i m Greater than or equal to 2. Cell support unit 610 includes j m 611, j A crystal cell support bracket m greater than or equal to 1, i m The cell support units 610 are distributed vertically. Among the n columns of transmission ports 510, the m-th column of transmission ports 510 includes j... m There are 510 transmission ports, and the m-th column transmission port 510 corresponds to the column position of the m-th column cell bracket 611. In the m-th column transmission port 510, j... m Each transmission port 510 connects to any of the cell support units 610 in the m-th column of the cell support 611, where j... m The cell holders 611 are positioned identically, and the m-th column of cell holders 611 can move vertically to align any cell holder unit 610 in the m-th column with the m-th column transmission port 510. For example... Figure 2 , Figure 13 and Figure 14 In the illustrated embodiment, n = 4, m = 1, 2, 3 or 4, i m =2,j m=2. It can be understood that for different columns of cell supports 611 in the n-column cell support 611, i.e., when the value of m changes, i m and j m The value of i can vary with m, or for each column of cell support 611, i m and j m The value of does not change with m, but depends on the specific situation.

[0119] The m-th column of the cell support 611 includes multiple cell supports 611, and the m-th column of the cell support 611 is divided into i m Each cell support unit 610 may have other cell supports 611 disposed above and below the multiple cell supports 611 included in the m-th column of cell supports 611. However, it is understood that these other cell supports 611 are not part of the multiple cell supports 611 included in the m-th column of cell supports 611.

[0120] The n-column die holder 611 can move synchronously or asynchronously along the vertical direction. The synchronous movement of the n-column die holder 611 along the vertical direction simplifies the design of the holder assembly 600; the asynchronous movement of the n-column die holder 611 along the vertical direction can improve the efficiency of wafer access.

[0121] Therefore, by moving the support assembly 600 vertically, the number of transmission ports 510 in at least one column of transmission ports 510 is less than the number of cassette supports 611 in the corresponding column. Multiple cassette supports 611 in the corresponding column share the at least one column of transmission ports 510, which reduces the number of transmission ports 510, lowers the manufacturing cost of the wafer processing device, and leaves enough space for the arrangement of transmission ports 510, reducing the difficulty of setting up transmission ports 510.

[0122] j m If the number is greater than or equal to 2, in the m-th column of the cell support unit 611, the cell supports 611 in any two adjacent cell support units 610 are alternately arranged in the vertical direction. For example, such as... Figure 13 and Figure 14 As shown, each column of cell support 611 includes four cell supports 611, which are divided into two cell support units 610. Each cell support unit 610 includes two cell supports 611, and the cell supports 611 in adjacent cell support units 610 are alternately arranged in the vertical direction. Each column of transmission ports 510 includes two transmission ports 510.

[0123] When two adjacent and alternately arranged cell support units 610 in the vertical direction differ by only one cell support 611, when the support assembly 600 is moved in the vertical direction, only the height of one cell support 611 needs to be moved to align the cell support 611 in the adjacent cell support unit 610 with the transfer port 510. This reduces the vertical travel of the support assembly 600, reduces collisions and contamination during the movement, and improves wafer processing efficiency.

[0124] In other embodiments, when two adjacent and alternately arranged cell support units 610 in the vertical direction differ in position by x cell support 611, moving the support assembly 600 in the vertical direction only requires moving the height of x cell support 611 to align the cell support 611 in the adjacent cell support unit 610 with the transmission port 510. Obviously, x < j m .

[0125] Preferably, i m =2,j m =2. That is to say, each column of cell support 611 includes two cell support units 610, and each cell support unit 610 includes two cell supports 611.

[0126] Each row of wafer holders 611 includes two wafer holder units 610, and each wafer holder unit 610 includes two wafer holders 611. This enables the wafer loading and unloading machine 310 to quickly access wafers, avoiding the wafer access speed becoming a bottleneck for improving the working efficiency of the wafer processing device. At the same time, it avoids having too many wafer holders 611, which would increase the manufacturing cost of the wafer processing device.

[0127] In some embodiments, the wafer processing apparatus further includes a sealing device, which may be disposed in the wafer loading / unloading area 200 and located on one side of the furnace tube 100. The sealing device can be used to seal the connection end between the furnace tube 100 and the wafer loading / unloading area 200. When the furnace tube 100 processes the wafer, the connection end between the furnace tube 100 and the wafer loading / unloading area 200 is sealed by the first wafer loading / unloading machine 210. After the first wafer loading / unloading machine 210 descends, the connection end between the furnace tube 100 and the wafer loading / unloading area 200 is sealed by the sealing device. This can prevent contaminants in the wafer loading / unloading area 200 from spreading into the furnace tube 100, avoid contaminating the wafers subsequently processed by the furnace tube 100, and reduce the frequency of cleaning and maintenance of the furnace tube 100.

[0128] The wafer processing apparatus also includes a purge inlet and an exhaust outlet. The purge inlet is used to introduce inactive gas to purge the boat loading / unloading area 200 and / or the wafer loading / unloading area 300, and the exhaust outlet is used to discharge the introduced gas. In some embodiments, when the boat loading / unloading area 200 is purged to the required level of contamination, an isolation door device operates to allow the boat to flow between the boat loading / unloading area 200 and the wafer loading / unloading area 300, thereby further reducing contamination caused by reaction byproducts in the furnace tube 100. The furnace tube 100 and the boat loading / unloading area 200 are arranged vertically, the boat loading / unloading area 200 and the wafer loading / unloading area 300 are arranged along a first horizontal direction, and the purge inlet and exhaust outlet may be arranged along a second horizontal direction. Preferably, the first and second horizontal directions are perpendicular to each other to prevent the purge gas from causing airflow between the boat loading / unloading area 200 and the wafer loading / unloading area 300, which could lead to wafer contamination.

[0129] Example 2

[0130] The main difference between Embodiment 2 and Embodiment 1 is that the isolation door device is different.

[0131] In Embodiment 1, the isolation door device can drive the movement of the wafer boat, allowing it to flow between the wafer boat loading / unloading area 200 and the wafer loading / unloading area 300 through the connecting area. In Embodiment 2, the isolation door device can open when the wafer boat passes through and close after it has passed through. When the isolation door device is open, the wafer boat loading / unloading area 200 and the wafer loading / unloading area 300 are connected; when the isolation door device is closed, the wafer boat loading / unloading area 200 and the wafer loading / unloading area 300 are separated by the isolation door device.

[0132] The isolation door device can open when the crystal boat passes through and close after the crystal boat passes through, allowing the crystal boat to be moved without the aid of the isolation door device, thus simplifying the structure of the isolation door device.

[0133] See Figure 15 and Figure 16 As shown, in this embodiment, the isolation door device includes a second isolation door assembly 700. The second isolation door assembly 700 includes a second isolation door 710. The second isolation door assembly 700 includes a third state and a fourth state. In the third state, the second isolation door 710 closes the communication area, and in the fourth state, the second isolation door 710 opens the communication area. The second isolation door 710 can slide or rotate to open or close the communication area.

[0134] The second isolation door assembly 700 includes a second isolation door 710, which can slide or rotate to open or close the communication area, thereby enabling the connection or separation between the crystal boat loading and unloading area 200 and the wafer loading and unloading area 300, and has a simple structure.

[0135] In some embodiments, the furnace tube 100 and the wafer loading / unloading area 300 are located on the same side of the wafer boat loading / unloading area 200. That is, the furnace tube 100 and the wafer boat loading / unloading area 200 are arranged vertically, both above the wafer boat loading / unloading area 200, and both are arranged horizontally. The second isolation door assembly 700 includes a fifth state in which the second isolation door 710 closes the connection between the furnace tube 100 and the wafer boat loading / unloading area 200.

[0136] The second isolation door 710 can be used to isolate the wafer loading and unloading area 200 and the wafer loading and unloading area 300, and can also be used to close the connection between the furnace tube 100 and the wafer loading and unloading area 200. That is, the second isolation door 710 can be reused as the sealing device in the first embodiment to prevent contaminants in the wafer loading and unloading area 200 from spreading into the furnace tube 100, to prevent contamination of the wafers subsequently processed by the furnace tube 100, and to reduce the number of cleaning and maintenance times of the furnace tube 100, thus simplifying the structure of the wafer processing device.

[0137] For example, the second isolation door assembly 700 includes a second isolation door 710 and a door drive mechanism 720. The door drive mechanism 720 includes a door hinge 721 and a crossbeam 722. The door hinge 721 is rotatably disposed between the furnace tube 100 and the wafer loading / unloading area 300. The crossbeam 722 connects the second isolation door 710 and the door hinge 721. The second isolation door 710 rotates about the door hinge 721, which can close the lower end of the furnace tube 100 (i.e., the connection end between the furnace tube 100 and the wafer loading / unloading area 200, i.e., the fifth state) or the connecting area (i.e., the third state), or be located between the lower end of the furnace tube 100 and the connecting area (i.e., the fourth state). See also Figure 16 As shown, the second isolation door 710 can be located in the position shown in the diagram, i.e. Figure 16 The image shows the second isolation door assembly 700 in its fourth state; the second isolation door 710 can also be in... Figure 16 When the second isolation door 710 is located at the position indicated by the left dashed line, the second isolation door assembly 700 is in the fifth state; when the second isolation door 710 is located at the position indicated by the right dashed line, the second isolation door assembly 700 is in the third state.

[0138] The second isolation door 710 can be located in one of three positions: the lower end of the furnace tube 100, the connecting area, or between the lower end of the furnace tube 100 and the connecting area. The second isolation door 710 is driven to rotate by the door drive mechanism 720, so that the second isolation door 710 can move between the three positions: the lower end of the furnace tube 100, the connecting area, or between the lower end of the furnace tube 100 and the connecting area, so as to achieve position switching. The structure of the second isolation door assembly 700 is simpler.

[0139] In some embodiments, the second isolation door assembly 700 includes a second wafer boat loading / unloading machine 730 disposed in the wafer boat loading / unloading area 200. The second wafer boat loading / unloading machine 730 is used to move the wafer boat into the wafer loading / unloading area 300 and close the communication area, and the second wafer boat loading / unloading machine 730 is used to move the wafer boat out of the wafer loading / unloading area 300.

[0140] The second isolation door assembly 700 includes a second wafer boat loading and unloading machine 730, which is used to move the wafer boat into or out of the wafer loading and unloading area 300 and to isolate the communication area between the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300. Reusing the second wafer boat loading and unloading machine 730 can simplify the structure of the wafer processing device.

[0141] In some embodiments, the furnace tube 100 and the wafer loading / unloading area 200 are arranged vertically, and the furnace tube 100 and the wafer loading / unloading area 300 are located on the same side of the wafer loading / unloading area 200. During loading and unloading of the wafer boat, the first wafer loading / unloading machine 210 and the second wafer loading / unloading machine 730 drive the wafer boat to move vertically.

[0142] The furnace tube 100 and the wafer loading / unloading area 200 are arranged vertically. That is to say, the wafer processing apparatus includes a vertical furnace. The furnace tube 100 and the wafer loading / unloading area 300 are located on the same side of the wafer loading / unloading area 200. When loading and unloading the wafer boat, the first wafer loading / unloading machine 210 and the second wafer loading / unloading machine 730 drive the wafer boat to move vertically. The first wafer loading / unloading machine 210 and the second wafer loading / unloading machine 730 have the same structure, which helps to reduce the manufacturing cost of the wafer processing apparatus.

[0143] Preferably, the second isolation door assembly 700 includes a second isolation door 710 and a second crystal boat loading / unloading machine 730. When the wafer processing apparatus is operating: the first wafer boat 901 is processed inside the furnace tube 100. During processing, the first wafer boat loading / unloading machine 210 can seal the lower end of the furnace tube 100. The second wafer boat 902 loads wafers in the wafer loading / unloading area 300. At this time, the second wafer boat loading / unloading machine 730 can isolate the wafer loading / unloading area 200 and the wafer loading / unloading area 300. When the first wafer boat 901 finishes processing, the first wafer boat loading / unloading machine 210 descends, and the first wafer boat 901 carried by the first wafer boat loading / unloading machine 210 can be transferred by the wafer boat transfer device 800 to the temporary storage position 201 in the wafer loading / unloading area 200. The temporary storage position 201 can be used to temporarily store the wafer boat, allowing it to wait for the next processing step, preprocessing, or cooling. The second isolation door 710 can rotate to the lower end of the furnace tube 100 to close the furnace tube 100. The wafer loading / unloading area 300 is now complete. The second wafer-loaded boat 902 is moved to the wafer loading and unloading area 200 by the second wafer loading and unloading machine 730. The wafer transfer device 800 transfers the second wafer 902 to the first wafer loading and unloading machine 210, which then moves the second wafer 902 into the furnace tube 100 for processing. After the second wafer 902 descends, the second isolation door 710 can be rotated to the connecting area to separate the wafer loading and unloading area 200 from the wafer loading and unloading area 300. After the first wafer 901 cools down, the wafer transfer device 800 transfers the first wafer 901 to the second wafer loading and unloading machine 730. The second isolation door 710 rotates to a position between the lower end of the furnace tube 100 and the connecting area, and the second wafer loading and unloading machine 730 transfers the first wafer 901 to the wafer loading and unloading area 300, separating the wafer loading and unloading area 200 from the wafer loading and unloading area 300.

[0144] The second isolation door assembly 700 includes a second isolation door 710 and a second wafer loading / unloading machine 730, which can quickly complete the exchange of the positions of the two wafers, reduce the connection time between the wafer loading / unloading area 200 and the wafer loading / unloading area 300, and help reduce the risk of by-product contamination of the wafers on the wafers.

[0145] It should be noted that the main difference between Embodiment 2 and Embodiment 1 is the isolation door device. The structures other than the isolation door device in Embodiment 1, including the conveying port 510, the support assembly 600, and the transfer area 500, are also applicable to Embodiment 2, so they will not be described again in Embodiment 2.

[0146] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0147] In this application, unless otherwise expressly specified and limited, the terms "assembly," "connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0148] In the description of this specification, references to terms such as "some embodiments," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0149] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.

Claims

1. A wafer processing apparatus, characterized in that, include: Furnace tubes; The loading and unloading area includes a boat loading and unloading area and a wafer loading and unloading area connected by a connecting area. The boat loading and unloading area is connected to the furnace tube. The boat loading and unloading area includes a first boat loading and unloading machine, which is at least used to move a boat into or out of the furnace tube. The wafer loading and unloading area includes a wafer loading and unloading machine, which is at least used to move a wafer into or out of the boat. An isolation door device includes a first isolation door assembly, which includes a first isolation door and a plurality of wafer transfer mechanisms. Each wafer transfer mechanism is used to carry and move at least one wafer. The first isolation door is a multi-wing revolving door, which includes at least three wings, including two main wings and at least one secondary wing. The two main wings are connected to divide the first isolation door into a first side and a second side. The at least one secondary wing is located on the first side and / or the second side of the first isolation door. The included angles between adjacent wings are equal. The wafer transfer mechanisms are arranged one-to-one between adjacent wings. The wafer transfer mechanisms and the multi-wing revolving door can rotate synchronously around a rotation center, driving the wafer to flow between the wafer loading / unloading area and the wafer loading / unloading area through the connecting area. The wafer loading and unloading area includes multiple functional sub-areas and / or the wafer loading and unloading area includes multiple functional sub-areas. At least one of the functional sub-areas is used for pre-processing, cooling or temporary storage of the wafer. An isolation partition is formed between adjacent door wings. The multi-wing rotating door and the wafer transfer mechanism rotate around the rotation center so that each isolation partition is sequentially connected to the functional sub-area. The first isolation door assembly also includes a seal, which forms a gap with the first isolation door when the first isolation door and the crystal boat transfer mechanism rotate, and seals the gap between the loading / unloading area and the first isolation door when the first isolation door and the crystal boat transfer mechanism stop rotating.

2. The wafer processing apparatus according to claim 1, characterized in that, The crystal boat transfer mechanism includes a support base for supporting the crystal boat and moving the supported crystal boat when rotating around the rotation center. Support bases of different crystal boat transfer mechanisms are connected by a connector, which is connected to the first isolation door. The connector and the support base are located on the same side of the first isolation door. The support base, connector, and first isolation door can rotate synchronously around the rotation center, driving the crystal boat to flow between the crystal boat loading / unloading area and the wafer loading / unloading area through the connecting area; and / or The crystal boat transfer mechanism includes a crystal boat support and a support shaft. The crystal boat support is disposed on the support shaft, and the support shaft is connected to the first isolation door. The crystal boat support can rotate around the support shaft to hold the crystal boat and carry it. The crystal boat support can also rotate around the support shaft to release the held crystal boat. The crystal boat support, the support shaft, and the first isolation door can synchronously rotate around the rotation center to move the held crystal boat and allow the crystal boat to flow between the crystal boat loading / unloading area and the wafer loading / unloading area through the connecting area.

3. The wafer processing apparatus according to claim 2, characterized in that, The crystal boat support includes multiple crystal boat sub-supports, the support shaft includes multiple support sub-shafts, the crystal boat sub-supports are disposed on the support shafts, the support shafts are connected to the first isolation door, and the crystal boat support is capable of rotating around the support shafts; The crystal boat support can rotate around the support axis to hold the crystal boat to support the crystal boat, including the plurality of crystal boat sub-supports of the crystal boat support being able to rotate to converge and clamp the crystal boat to support the crystal boat; The ability of the boat support to rotate about the support axis to release the held boat includes the ability of the plurality of boat sub-supports of the boat support to rotate to separate to release the clamped boat.

4. The wafer processing apparatus according to claim 2 or 3, characterized in that, The crystal boat transfer mechanism includes the crystal boat support and the support shaft, and the crystal boat transfer mechanism is configured as follows: Before the crystal boat support, the support shaft and the first isolation door rotate about the rotation center to move the held crystal boat, the crystal boat support can rotate about the support shaft to hold the crystal boat to carry the crystal boat, and the crystal boat support can rise to lift the held crystal boat. After the crystal boat support, the support shaft, and the first isolation door rotate about the rotation center to move the held crystal boat, the crystal boat support can be lowered to put down the held crystal boat, and the crystal boat support can be rotated about the support shaft to release the held crystal boat.

5. The wafer processing apparatus according to claim 1, characterized in that, The wafer processing apparatus includes multiple loading and unloading areas and multiple furnace tubes, with each wafer loading and unloading area corresponding to and connected to a furnace tube.

6. The wafer processing apparatus according to claim 1, characterized in that, The isolation door device can be opened when the crystal boat passes through and closed after the crystal boat passes through.

7. The wafer processing apparatus according to claim 1, characterized in that, The wafer processing apparatus further includes a transfer area and at least one transfer port. The transfer area is located on one side of the wafer loading / unloading area and is used to place wafer cassettes. The transfer port is located on an isolation wall between the wafer loading / unloading area and the transfer area. The isolation wall partially surrounds the wafer loading / unloading machine, and the axial direction of the isolation wall is parallel to the vertical direction. The transfer port is used at least for the passage of wafers within the wafer cassettes. The wafer loading / unloading machine is used to move wafers from the wafer cassettes into a wafer boat in the wafer loading / unloading area, and to move wafers from the wafer boat into wafer cassettes in the transfer area. A support assembly is provided on the side of the isolation wall away from the wafer loading / unloading machine. The support assembly includes at least one wafer cassette support, which is used to support the wafer cassettes in the transfer area. The support assembly includes n columns of the crystal cell support arranged circumferentially along the isolation wall, and the at least one transmission port is arranged in n columns circumferentially along the isolation wall, where n≥1, and the column position of each column of the crystal cell support corresponds to the column position of each column of the transmission port.

8. The wafer processing apparatus according to claim 7, characterized in that, The isolation wall is equidistantly positioned around the wafer loading and unloading machine, where n ≥ 2.

9. The wafer processing apparatus according to claim 7 or 8, characterized in that, In the n-column cell support structure, the m-th column of the cell support structure includes multiple cell support structures, and the m-th column of the cell support structure is divided into i m There are 1 cell support unit, 1≤m≤n, i m ≥2, the cell support unit includes j m The aforementioned crystal cell support, j m ≥1, the i m Each cell support unit is distributed along the vertical direction; In the n columns of transmission ports, the m-th column of transmission ports includes j m The m-th column of the transmission ports corresponds to the column position of the m-th column of the crystalline cell support. The j-th column of the transmission ports... m Each transmission port is connected to any of the cell support units in the m-th column of the cell support, where j is... m The positions of the crystal cell supports are the same; The m-th column cell support can move vertically, so that any cell support unit of the m-th column cell support is aligned with the m-th column transmission port.

10. The wafer processing apparatus according to claim 9, characterized in that, j m ≥2, in the m-th column of the crystal cell support, the crystal cell supports in any two adjacent crystal cell support units are alternately arranged in the vertical direction.

Images