Method and device for rapidly disassembling tool for CCGA column planting

Abstract

The invention provides a method and device for quickly disassembling a tool for CCGA column planting. The device comprises a positioning plate and a disassembling plate. A sinking area is arranged at the upper end of the positioning plate; the surface of the sinking area is provided with limiting holes consistent with the CCGA device packaging form; peripheral through holes are formed in the periphery of the limiting hole; an upward sinking area is arranged at the lower end of the positioning plate; four cylinders vertically fixed to the bottom plate are arranged at the upper end of the dismounting plate, and the bottom plate is arranged at the lower ends of the cylinders. By the adoption of the method, the CCGA plant column dismounting efficiency is remarkably improved. Through the application of the dismounting tool, the occurrence of dents and inclination on the side wall of the welding column is reduced, so that the qualified rate of the CCGA device is improved, secondary correction treatment on the device is reduced, and the overall quality of a product is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of packaging, and in particular relates to a method and a device for quickly disassembling a CCGA column planting tool. Background Art

[0002] As aerospace electronic products develop towards miniaturization and integration, ceramic column grid array (CCGA) devices are increasingly widely used. From the initial ceramic ball grid array (CBGA) to the ceramic column grid array (CCGA), the main difference is that CCGA uses solder columns to replace the solder balls in CBGA, and uses the creep of solder columns to alleviate the thermal stress fatigue problem caused by the mismatch of thermal expansion coefficients between the PCB board and the ceramic substrate, thereby improving the reliability of the solder joints. CCGA column planting research is not yet mature in China. The main difficulty lies in the difficulty of disassembling CCGA devices after column planting. Uneven disassembly force causes dents on the side wall of the solder column and the tooling to be squeezed, and the solder column tilts and deforms, resulting in unqualified solder column coplanarity, that is, unqualified CCGA devices. At present, the solution to the tilt and coplanarity of CCGA device solder columns is to correct them after disassembly, which seriously reduces production efficiency and has the risk of secondary damage to CCGA devices. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a method and device for quickly disassembling a CCGA column. The application of this method significantly improves the efficiency of CCGA column disassembly. The application of the disassembly tool reduces the occurrence of dents and tilts on the side walls of the solder column, improves the qualified rate of CCGA devices, reduces the secondary correction processing of the device, and improves the overall quality of the product.

[0004] A CCGA column quick disassembly tooling device of the present invention comprises a positioning plate and a disassembly plate; wherein, a sinking area is provided at the upper end of the positioning plate; a limiting hole consistent with the packaging form of the CCGA device is provided on the surface of the sinking area; through holes are provided around the limiting hole; a sinking area is provided at the lower end of the positioning plate; four cylinders vertically fixed to the bottom plate are provided at the upper end of the disassembly plate, and a bottom plate is provided at the lower end of the cylinder.

[0005] Preferably, a sinking area is provided at the upper end of the positioning plate, and the area of ​​the sinking area should be larger than the bottom plate size of the disassembly plate, so that the bottom plate of the disassembly plate can be embedded in through the through holes around the positioning plate.

[0006] Preferably, the surface of the sinking area is provided with limiting holes consistent with the packaging form of the CCGA device, and the center spacing of the limiting holes is consistent with the center spacing of the device pads. The diameter of the limiting holes is larger than the diameter of the solder column used by the CCGA device and smaller than the diameter of the CCGA device pad. The depth of the limiting holes needs to be determined according to the height of the CCGA solder column.

[0007] Preferably, the limiting hole is surrounded by through holes, the center spacing of the through holes is consistent with the spacing of the outer dimensions of the CCGA device, and the radius of the through holes is smaller than the distance from the corner of the CCGA device to the nearest pad.

[0008] Preferably, a sinking area is provided at the lower end of the positioning plate, the size of the sinking area is consistent with the size of the CCGA device, and the minimum sinking height is not less than the height of the solder paste on the CCGA device pad.

[0009] Preferably, the upper end of the disassembly plate is provided with four cylinders vertically fixed to the bottom plate, the diameter of the cylinder is smaller than the diameter of the through holes around the positioning plate, and the height of the cylinder is greater than the sum of the height of the CCGA device solder column and the depth of the through holes around the positioning plate.

[0010] A method for using a CCGA column quick disassembly tool of the present invention comprises the following steps:

[0011] S1. Remove the positioning plate from the CCGA column tooling after welding.

[0012] S2. Place the four cylinders in the disassembly plate into the through holes around the positioning plate from top to bottom.

[0013] S3. Turn over the positioning plate so that the bottom plate in the disassembly plate is placed under the positioning plate, and place the bottom plate of the disassembly plate on the desktop.

[0014] S4. Use your hands to press the areas around the through holes on the positioning plate at the same time to lift the soldering posts of the CCGA device vertically from the limiting holes of the positioning plate.

[0015] S5. When the bottom plate of the disassembly plate contacts the surface of the sunken area at the upper end of the positioning plate, the CCGA device has been completely removed from the positioning plate.

[0016] The beneficial effects of the present invention are

[0017] (1) During the manual disassembly process, the CCGA device is subjected to uneven force, one end of the CCGA device is lifted up, the solder column and the positioning plate are squeezed, and a dent is left on the side wall of the solder column, affecting the product quality. The disassembly tool applies force on all sides of the CCGA device at the same time, and the device is taken out parallel to the direction of the solder column, thereby improving product quality.

[0018] (2) The solder pillars of CCGA devices are high lead pillars and are made of soft material. When manually grabbing the frame of the CCGA device for disassembly, there is a risk of touching the edge and corner solder pillars of the device, causing the solder pillars to tilt after disassembly. Smaller tilts can be corrected, while larger tilts require secondary repair. The use of disassembly tools does not involve manual contact with CCGA devices, thus avoiding the occurrence of this problem.

[0019] (3) The use of CCGA device disassembly tooling has improved the efficiency of the column disassembly tooling, from the original single-piece disassembly time of 30 seconds to 15 seconds, an efficiency increase of 50%. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is an overall schematic diagram of the present invention.

[0021] Figure 2 This is the positioning board interface diagram. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] like Figure 1 , 2 As shown, a device for quick disassembly of CCGA column planting tools comprises a positioning plate and a disassembly plate; wherein, a sinking area is provided at the upper end of the positioning plate; a limiting hole consistent with the packaging form of the CCGA device is provided on the surface of the sinking area; through holes are provided around the limiting hole; a sinking area is provided at the lower end of the positioning plate; four cylinders vertically fixed to the bottom plate are provided at the upper end of the disassembly plate, and a bottom plate is provided at the lower end of the disassembly plate.

[0024] The upper end of the positioning plate is provided with a sinking area, and the area of ​​the sinking area should be larger than the bottom plate size of the disassembly plate, so that the bottom plate of the disassembly plate can be embedded in through the through holes around the positioning plate. Preferably, the area of ​​the sinking area is 60*60mm, and the bottom plate size is 35*35mm.

[0025] The surface of the sinking area is provided with a limiting hole consistent with the packaging form of the CCGA device, and the center spacing of the limiting hole is consistent with the center spacing of the device pad. The diameter of the limiting hole is larger than the diameter of the solder column used by the CCGA device, and smaller than the diameter of the CCGA device pad. The depth of the limiting hole needs to be determined according to the height of the CCGA solder column. Preferably, the diameter of the limiting hole is 0.57mm, the depth is 1.5mm, the diameter of the solder column is 0.5mm, the height is 2.21mm, and the pad diameter is 0.76mm.

[0026] The limiting hole is surrounded by through holes, and the center spacing of the through holes is consistent with the spacing of the surrounding dimensions of the CCGA device, and the radius of the through holes is smaller than the distance from the corner of the CCGA device to the nearest pad. Preferably, the diameter of the through holes is 1.8mm, the center spacing of the through holes and the surrounding dimensions of the CCGA device are both 29*29mm, and the distance from the corner of the CCGA device to the nearest pad is 1.6mm.

[0027] The lower end of the positioning plate is provided with a sinking area, the size of which is consistent with the size of the CCGA device, and the minimum sinking height is not less than the height of the solder paste on the CCGA device pad. Preferably, the sinking depth of the lower end of the positioning plate is 0.6 mm.

[0028] The upper end of the disassembly plate is provided with four cylinders fixed vertically to the bottom plate, the diameter of the cylinder is smaller than the diameter of the through hole around the positioning plate, and the height of the cylinder is greater than the sum of the height of the CCGA device solder column and the depth of the through hole around the positioning plate. Preferably, the diameter of the cylinder is 1.6mm and the height is 5mm.

[0029] A method for quickly disassembling a CCGA column installation tool comprises the following steps:

[0030] S1. Remove the positioning plate from the CCGA column tooling after welding.

[0031] S2. Place the four cylinders in the disassembly plate into the through holes around the positioning plate from top to bottom.

[0032] S3. Turn over the positioning plate so that the bottom plate in the disassembly plate is placed under the positioning plate, and place the bottom plate of the disassembly plate on the desktop.

[0033] S4. Use your hands to press the areas around the through holes on the positioning plate at the same time to lift the soldering posts of the CCGA device vertically from the limiting holes of the positioning plate.

[0034] S5. When the bottom plate of the disassembly plate contacts the surface of the sunken area at the upper end of the positioning plate, the CCGA device has been completely removed from the positioning plate.

[0035] The time for disassembling a single CCGA device was reduced from 30s to 15s, which quickly improved the speed of the disassembly tooling. After disassembling, the coplanarity of the CCGA device was tested to be ≤0.15mm to ensure that the solder column was not tilted. A microscope was used to check if there were no dents on the side walls of the solder column, which improved the quality of device disassembly and ultimately determined that the CCGA device was qualified.

[0036] The present invention is not limited to the above specific implementations, and the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made to the above implementations based on the technical essence of the present invention shall be included in the protection scope of the present invention.

Claims

1. A CCGA column rapid disassembly tooling device, characterized by: It includes a positioning plate and a disassembly plate; wherein, a sinking area is provided at the upper end of the positioning plate; a limiting hole consistent with the packaging form of the CCGA device is provided on the surface of the sinking area; the limiting hole is surrounded by through holes; a sinking area is also provided at the lower end of the positioning plate; four cylinders vertically fixed to the bottom plate are provided at the upper end of the disassembly plate, and a bottom plate is provided at the lower end of the cylinder.

2. A CCGA column rapid disassembly tooling device according to claim 1, characterized in that: The area of ​​the sunken region is larger than the size of the bottom plate of the disassembly plate, so that the bottom plate of the disassembly plate can be embedded into the positioning plate through the through holes around the positioning plate.

3. The CCGA column rapid disassembly tooling device according to claim 1, characterized in that: The center spacing of the limiting holes is consistent with the center spacing of the device pads. The diameter of the limiting holes is larger than the diameter of the solder column used in the CCGA device and smaller than the diameter of the CCGA device pad. The depth of the limiting holes needs to be determined according to the height of the CCGA solder column.

4. The CCGA column rapid disassembly tooling device according to claim 1, characterized in that: The center spacing of the peripheral through holes is consistent with the spacing of the peripheral dimensions of the CCGA device, and the radius of the peripheral through holes is smaller than the distance from the corner of the CCGA device to the nearest pad.

5. The CCGA column rapid disassembly tooling device according to claim 1, characterized in that: The size of the sinking area is consistent with the size of the CCGA device, and its minimum sinking height is not less than the height of the solder paste on the CCGA device pad.

6. The CCGA column rapid disassembly tooling device according to claim 1, characterized in that: The diameter of the cylinder is smaller than the diameter of the through holes around the positioning plate, and the height of the cylinder is greater than the sum of the height of the CCGA device welding column and the depth of the through holes around the positioning plate.

7. A method for quickly disassembling a CCGA column, based on a CCGA column quickly disassembling device according to any one of claims 1 to 6, characterized in that: The steps include: S1. Remove the positioning plate from the CCGA column tooling after welding; S2. Place the four cylinders in the disassembly plate into the through holes around the positioning plate from top to bottom; S3. Flip the positioning plate so that the bottom plate of the disassembly plate is placed under the positioning plate, and place the bottom plate of the disassembly plate on the desktop; S4. Press the surrounding through-hole areas of the positioning plate with your hands at the same time to lift the soldering column of the CCGA device vertically from the limiting hole of the positioning plate; S5. When the bottom plate of the disassembly plate contacts the surface of the sunken area at the upper end of the positioning plate, the CCGA device has been completely removed from the positioning plate.

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