Measuring device and semiconductor process equipment

Abstract

The invention discloses a measuring device and semiconductor process equipment, and belongs to the technical field of measurement. The measuring device is applied to the semiconductor process chamber, the semiconductor process chamber comprises a rotary manipulator and at least two processing stations uniformly arranged in the circumferential direction of a rotary shaft of the rotary manipulator, each processing station is provided with a base, the measuring device comprises a rotary measuring mechanism, and the rotary measuring mechanism comprises a rotary plate and a first measuring assembly. The rotating plate is used for being connected with a rotating mechanical arm and rotating among the machining stations along with the rotating mechanical arm. The first measuring assembly is arranged on the rotating plate, and the first measuring assembly is used for measuring the position of the center of each base. According to the scheme, the rotary measuring mechanism is driven by the rotary manipulator to rotate among the machining stations, so that the center position of the base of each machining station is measured, the measuring device does not need to be repeatedly disassembled and assembled, the measuring operation can be simplified, the mounting error can be reduced or eliminated, and the measuring precision and accuracy can be improved.

Description

Technical Field

[0001] The present application belongs to the field of measurement technology, and specifically relates to a measurement device and semiconductor process equipment. Background Art

[0002] As the semiconductor process has increasingly stringent requirements on film performance and thickness, the semiconductor process equipment has also increasingly higher requirements on hardware structure. For example, when performing chemical vapor deposition (CVD) and atomic layer deposition (ALD) processes, maintaining a constant gas flow field and thermal field between the gas shower head and the silicon wafer plays a vital role in the process results. If a constant gas flow field and thermal field are to be maintained, it is first necessary to ensure that the silicon wafer and the base are in a relatively stable position. At this time, the base is required to be in a precise fixed position, and the position of the silicon wafer after being transferred between the various processing stations of the semiconductor process equipment must remain stable and accurate. Therefore, when the semiconductor process equipment leaves the factory or after being used for a period of time, the position of the base of each processing station of the semiconductor process equipment needs to be measured and calibrated to ensure that the position of the base of each processing station is fixed.

[0003] In the prior art, a measuring meter is installed on the base and on the chamber body of the semiconductor process equipment, and the position of each base is indirectly obtained based on the data measured by each measuring meter. When measuring the base of each processing station, it is necessary to use the measuring meter to measure the position of the base of each processing station in turn. In this way, the measuring meter needs to be repeatedly disassembled and assembled, resulting in cumbersome measurement operations and easy installation errors, which leads to reduced measurement accuracy of the measuring meter, resulting in inaccurate measurement results.

[0004] Therefore, the existing method of measuring the base has the defects of cumbersome measurement and inaccurate measurement results. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a measuring device and semiconductor process equipment, which can solve the problem that the method of measuring the base in the related art has cumbersome measurement and inaccurate measurement results.

[0006] In a first aspect, an embodiment of the present application provides a measuring device, which is applied to a semiconductor process chamber, wherein the semiconductor process chamber comprises a rotary manipulator and at least two processing stations uniformly arranged along the circumference of a rotation axis of the rotary manipulator, and each of the processing stations is provided with a base, wherein the measuring device comprises a rotary measuring mechanism, and the rotary measuring mechanism comprises: A rotating plate, the rotating plate is used to be connected to the rotating manipulator, and the rotating plate is used to rotate between the processing stations along with the rotating manipulator; The first measuring component is arranged on the rotating plate, and is used for measuring the position of the center of each of the bases.

[0007] In the second aspect, an embodiment of the present application also provides a semiconductor process equipment, including a semiconductor process chamber and the above-mentioned measuring device, the semiconductor process chamber including a chamber body, a rotating manipulator and at least two processing stations evenly arranged along the circumference of the rotation axis of the rotating manipulator, and each of the processing stations is provided with a base, the rotating manipulator is rotatably arranged on the chamber body and coaxially arranged with the chamber body, the chamber body is provided with a chamber reference plane, the chamber reference plane is perpendicular to the axis of the chamber body, and the rotating measuring mechanism of the measuring device is used to connect with the rotating manipulator.

[0008] In the embodiment of the present application, the rotating manipulator can drive the rotating measuring mechanism to rotate to each processing station respectively, and the first measuring component can measure the position of the center of each base. In this way, the position of the base can be calibrated and adjusted according to the position of the center of each base, so as to keep each base in a fixed position, thereby ensuring that the position of the silicon wafer after being transferred between the processing stations remains stable and accurate.

[0009] Furthermore, the rotary measuring mechanism is driven by the rotary manipulator to rotate between the various processing stations, and the rotary measuring mechanism measures the position of the center of the base of each processing station respectively, without the need to repeatedly disassemble and assemble the measuring device, so as to simplify the measuring operation and reduce or eliminate installation errors, thereby facilitating the measuring accuracy of the measuring device and improving the accuracy of the measurement results. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a top view of a semiconductor process chamber disclosed in an embodiment of the present application; Figure 2 is a top view of the base disclosed in the embodiment of the present application; Figure 3 yes Figure 2 The cross-sectional view along the CC direction; Figure 4 yes Figure 1 The AA section view; Figure 5 yes Figure 1 The cross-sectional view along the BB direction; Figure 6 is a top view of the chamber positioning mechanism disclosed in the embodiment of the present application; Figure 7 is a side view of the chamber positioning mechanism disclosed in the embodiment of the present application; Figure 8 is a side view of the base positioning mechanism disclosed in the embodiment of the present application; Fig. 9 yes Figure 8 Enlarged view of part E in the middle; Fig.10 is a top view of the base positioning mechanism disclosed in the embodiment of the present application; Fig.11 yes Fig.10 Enlarged view of part F; Fig.12 It is a bottom view (direction D) of the base positioning mechanism disclosed in the embodiment of the present application; Fig.13 yes Fig.12 An enlarged view of part G in FIG. Fig.14 is a top view of the level measurement mechanism disclosed in the embodiment of the present application; Fig.15 is a side view of the level measurement mechanism disclosed in the embodiment of the present application; Fig.16 is a bottom view of the rotation measurement mechanism disclosed in the embodiment of the present application; Fig.17 is a side view of the rotation measurement mechanism disclosed in the embodiment of the present application; Fig.18 is a top view of the rotation measurement mechanism disclosed in the embodiment of the present application; Fig.19 is a side view of a chamber pin disclosed in an embodiment of the present application; Fig. 20 is a top view of the chamber pin disclosed in the embodiment of the present application; Fig.21 It is one of the state diagrams when the second measuring component disclosed in the embodiment of the present application measures the rotating shaft; Fig. 22 This is the second state diagram of the second measuring component disclosed in the embodiment of the present application measuring the rotating shaft; Fig.23 It is a state diagram of the horizontal measurement mechanism disclosed in the embodiment of the present application when measuring the base; Fig.24 is a schematic diagram of a chamber positioning mechanism disclosed in an embodiment of the present application installed on a processing station; Fig.25 is a schematic diagram of a base positioning mechanism disclosed in an embodiment of the present application being installed on a chamber positioning mechanism; Fig.26 It is a schematic diagram of the rotary measuring mechanism disclosed in the embodiment of the present application measuring the reference center point; Fig. 27 It is a schematic diagram of the rotation measurement mechanism disclosed in the embodiment of the present application measuring the position deviation and angle deviation of the base.

[0011] Description of reference numerals: 100-chamber body; 110-processing station; 111-first station; 112-second station; 113 - third station; 114 - fourth station; 120 - chamber reference surface; 130 - chamber connecting hole; 200-base; 201-first base positioning groove; 202-second base positioning groove; 203-base reference surface; 300-rotation axis; 400-base adjustment mechanism; 410 - first connecting member; 420 - second connecting member; 500 - chamber positioning mechanism; 510 - positioning ring; 511-first positioning groove; 512-second positioning groove; 520-connecting member; 521-connecting pin; 522-first handle; 523-lower reference surface for positioning; 524-upper reference surface for positioning; 600-base positioning mechanism; 610-positioning member; 620-first reference rod; 630-second reference rod; 640-first positioning pin; 650-second positioning pin; 700-horizontal measuring mechanism; 710-level measuring piece; 720-level measuring reference plate; 721-level measuring upper reference surface; 722-lower reference surface for horizontal measurement; 730-bracket; 740-bracket fixing screw; 750-second handle; 800-rotating measuring mechanism; 810-rotating plate; 811-center hole of rotating plate; 8121-first positioning hole; 8122-second positioning hole; 820-first measuring component; 821-first measuring element; 8211-first direction measuring element; 8212-second direction measuring element; 822 - second measuring element; 830 - second measuring assembly; 831 - manipulator coaxial detection element; 832-manipulator level detection element; 840-power supply; 850-positioning sleeve; 900-chamber pin shaft; 910 - first part; 920 - second part; 921 - pin measuring surface; 930 - protrusion. DETAILED DESCRIPTION

[0012] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0013] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0014] The measuring device and semiconductor process equipment provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0015] refer to Figure 1-Figure 27 As shown, a measuring device provided in an embodiment of the present application can be applied to a semiconductor process chamber, wherein the semiconductor process chamber may include a rotating manipulator and at least two processing stations 110 evenly arranged along the circumference of a rotating axis 300 of the rotating manipulator, generally 4 processing stations 110, and each processing station 110 may be provided with a base 200, where the base 200 may be a heating base.

[0016] The measuring device may include a rotating measuring mechanism 800, which may include a rotating plate 810 and a first measuring component 820. The rotating plate 810 may be used to connect to a rotating manipulator, and the rotating plate 810 may be used to rotate between processing stations 110 with the rotating manipulator, and the first measuring component 820 may be disposed on the rotating plate 810, and the first measuring component 820 may be used to measure the position of the center of each base 200.

[0017] With such an arrangement, the rotating measuring mechanism 800 can be driven by the rotating manipulator to rotate to each processing station 110 respectively, and the first measuring component 820 can measure the position of the center of each base 200. In this way, the position of the base 200 can be calibrated and adjusted according to the position of the center of each base 200, so as to keep each base 200 in a fixed position, thereby ensuring that the position of the silicon wafer is accurate and consistent after being transferred between the processing stations 110.

[0018] Furthermore, the rotating measuring mechanism 800 is driven by the rotating manipulator to rotate between the various processing stations 110, and the rotating measuring mechanism 800 measures the position of the center of the base 200 of each processing station 110 respectively, without repeatedly disassembling and assembling the measuring device, so as to simplify the measuring operation and reduce or eliminate installation errors, thereby facilitating the measuring accuracy of the measuring device and improving the accuracy of the measurement results.

[0019] In an optional embodiment of the present application, the measuring device may further include a base positioning mechanism 600, the base positioning mechanism 600 may include a positioning member 610 and a first reference rod 620, the first reference rod 620 may be arranged on the positioning member 610, the first reference rod 620 may be coaxially arranged with the positioning member 610, the positioning member 610 may be used to connect with the base 200 or the chamber reference surface 120 of the semiconductor process chamber, the positioning member 610 needs to be coaxially arranged with the base 200, and the first measuring component 820 may be used to measure the position of the first reference rod 620.

[0020] Since the positioning member 610 is coaxially arranged with the base 200, when the positioning member 610 is connected with the base 200, the axis of the first reference rod 620 can coincide with the axis of the base 200. In this way, the first measuring assembly 820 can obtain the position of the center of the base 200 at this time by measuring the position of the first reference rod 620.

[0021] When the positioning member 610 is connected to the chamber reference surface 120, the axis of the first reference rod 620 can coincide with the axis of the processing station 110. In this way, the first measuring assembly 820 can obtain the position of the reference center of the processing station 110 (i.e., the axis of the processing station 110) by measuring the position of the first reference rod 620.

[0022] Here, by comparing the position of the center of the base 200 with the position of the reference center of the processing station 110, the deviation of the center of the base 200 can be obtained, and then the distance that the base 200 needs to be adjusted can be determined through the deviation to facilitate adjusting the base 200 to the reference position.

[0023] In this embodiment, the first measuring component 820 measures the position of the center of the base 200 or the position of the reference center of the processing station 110 by measuring the position of the first reference rod 620. Compared with the first measuring component 820 directly measuring the position of the center of the base 200 or the position of the reference center of the processing station 110, a suitable measurement position can be established to facilitate the measurement of the first measuring component 820.

[0024] In other embodiments, the measuring device may not include the base positioning mechanism 600 , and the first measuring component 820 may directly measure the position of the center of the base 200 .

[0025] Optionally, the first measuring component 820 may include a first measuring element 821 , and the first measuring element 821 may be used to measure the position of the first reference rod 620 .

[0026] Further optionally, the first measuring element 821 may include a first direction measuring element 8211 and a second direction measuring element 8212. The first direction measuring element 8211 may be used to measure the position of the first reference rod 620 in the first direction, and the second direction measuring element 8212 may be used to measure the position of the first reference rod 620 in the second direction. In this way, the position of the first reference rod 620 may be more accurately located, thereby improving the adjustment accuracy of the base 200. It should be noted that the first direction and the second direction may intersect, and further, the two may be perpendicular to each other. Specifically, the first direction may be a horizontal direction in a horizontal plane, and the second direction may be a longitudinal direction in a horizontal plane. The coordinates of the first reference rod 620 in the horizontal direction may be measured by the first direction measuring element 8211, and the coordinates of the first reference rod 620 in the longitudinal direction may be measured by the second direction measuring element 8212, thereby obtaining the position of the first reference rod 620.

[0027] In this embodiment, both the first direction measuring element 8211 and the second direction measuring element 8212 may be distance measuring sensors.

[0028] When the positioning member 610 is connected to the chamber reference surface 120, the rotating measuring mechanism 800 can rotate with the rotating manipulator to the processing station 110, and make the first positioning hole 8121 on the rotating plate 810 described below face the first reference rod 620. At this time, the position of the rotating measuring mechanism 800 is the reference measurement position of the processing station 110. At this time, the position of the first reference rod 620 measured by the first measuring component 820 is the position of the reference center of the processing station 110. For the convenience of calculation, the measurement values ​​of the first direction measurement element 8211 and the second direction measurement element 8212 at this time can be adjusted to zero.

[0029] When the positioning member 610 is connected to the base 200, the rotating measuring mechanism 800 can still rotate with the rotating manipulator to the reference measurement position of the processing station 110. At this time, the distance value between the first direction measuring element 8211 and the first reference rod 620 indicates the position of the first reference rod 620 in the first direction, and the distance value between the second direction measuring element 8212 and the first reference rod 620 indicates the position of the first reference rod 620 in the second direction.

[0030] In an optional embodiment, the base positioning mechanism 600 may further include a second reference rod 630 . The second reference rod 630 may be disposed on the positioning member 610 . The first measuring component 820 may also be used to measure the position of the second reference rod 630 .

[0031] Wherein, when the positioning member 610 is connected to the base 200, the axis of the second reference rod 630 may coincide with the measuring point; When the positioning member 610 is connected to the chamber reference surface 120 , the axis of the second reference rod 630 may coincide with the preset point.

[0032] It should be noted that the measuring point can be a point on the base 200 that deviates from the center point of the base 200, and the preset point can be a point that deviates from the reference center point of the processing station 110, and when the center point of the base 200 coincides with the reference center point, the measuring point can coincide with the preset point.

[0033] In this way, when the positioning member 610 is connected to the base 200, the position of the line connecting the center point of the base 200 and the measuring point can be obtained by measuring the positions of the first reference rod 620 and the second reference rod 630 through the first measuring component 820; when the positioning member 610 is connected to the chamber reference plane 120, the position of the line connecting the reference center point of the processing station 110 and the preset point can be obtained by measuring the positions of the first reference rod 620 and the second reference rod 630 through the first measuring component 820, and then the offset angle of the base 200 can be obtained through the angle between the two connecting lines.

[0034] Optionally, the first measuring component 820 may further include a second measuring element 822, and the second measuring element 822 may be used to measure the position of the second reference rod 630. Specifically, the second measuring element 822 may be a distance measuring sensor. When the second reference rod 630 coincides with the preset point, the measurement result of the second measuring element 822 is zero, that is, the distance between the second measuring element 822 and the second reference rod 630 may be zero; when the second reference rod 630 coincides with the measuring point, the distance value between the second measuring element 822 and the second reference rod 630 is the deviation between the measuring point and the preset point.

[0035] Of course, the second measuring element 822 can also be an angle sensor, which can be used to measure the angle between the line connecting the first reference rod 620 and the second reference rod 630 when the base positioning mechanism 600 is connected to the base 200 and the line connecting the first reference rod 620 and the second reference rod 630 when the base positioning mechanism 600 is connected to the chamber reference plane 120, that is, the offset angle of the base 200.

[0036] In an optional embodiment, a first base positioning groove 201 may be provided on the base 200, and the base positioning mechanism 600 may be provided with a first positioning pin 640, and the first positioning pin 640 may be embedded in the first base positioning groove 201, so that the connection between the base positioning mechanism 600 and the base 200 can be achieved.

[0037] Furthermore, when the center point of the base 200 coincides with the reference center point, the center of the first base positioning groove 201, the center of the base 200 and the projection of the chamber center of the semiconductor process chamber on the chamber reference plane 120 can be located on the same straight line, and the axis of the first positioning pin 640, the center of the first base positioning groove 201 and the axis of the second reference rod 630 can coincide. When setting the position of the first base positioning groove 201, the base 200 can be placed in the reference position. At this time, any point located within the projection of the base 200 on the chamber reference plane 120 and located on the line connecting the center of the base 200 and the projection of the chamber center on the chamber reference plane 120 can be selected as the projection of the center of the first base positioning groove 201, and then the position of the first base positioning groove 201 on the base 200 can be determined. This arrangement facilitates setting the setting position of the first base positioning groove 201 on the base 200, so as to facilitate setting the installation position of the second reference rod 630.

[0038] Of course, the projections of the center of the first base positioning groove 201, the center of the base 200 and the center of the chamber of the semiconductor process chamber on the chamber reference plane 120 may not be located on the same straight line. Specifically, as long as the base 200 is located at the reference position, the center of the first base positioning groove 201 and the projection of the preset point on the chamber reference plane 120 can coincide with each other.

[0039] Optionally, at least one second base positioning groove 202 may be provided on the base 200, and each second base positioning groove 202 and the first base positioning groove 201 may be distributed at intervals along the circumference of the base 200, and the base positioning mechanism 600 may be provided with at least one second positioning pin 650, and the second positioning pin 650 may be embedded in the second base positioning groove 202, so that the connection strength between the base positioning mechanism 600 and the base 200 can be improved, thereby improving the stability of the connection between the base positioning mechanism 600 and the base 200. It should be noted that the first base positioning groove 201 and the second base positioning groove 202 may be located on the same circle, and the center of the circle may coincide with the axis of the first reference rod 620.

[0040] In an optional embodiment of the present application, the measuring device may further include a chamber positioning mechanism 500, which may include a positioning ring 510 and a connecting member 520 connected to the positioning ring 510, wherein the connecting member 520 may be used to connect to and be parallel to the chamber reference surface 120, the positioning ring 510 may be used to be arranged at the processing station 110, and the axis of the positioning ring 510 may coincide with the axis of the processing station 110, and here, the positioning member 610 may be coaxially connected to the positioning ring 510. Since the axis of the positioning ring 510 coincides with the axis of the processing station 110, and the positioning member 610 is coaxially connected to the positioning ring 510, the first reference rod 620 may coincide with the axis of the processing station 110, and the first measuring assembly 820 may measure the position of the reference center of the processing station 110 by measuring the position of the first reference rod 620.

[0041] In this embodiment, the connecting member 520 may be provided with a lower positioning reference surface 523, and the positioning ring 510 may be provided with an upper positioning reference surface 524. The upper positioning reference surface 524 is parallel to the lower positioning reference surface 523. When the chamber positioning mechanism 500 is connected to the chamber reference surface 120, the lower positioning reference surface 523 is in contact with the chamber reference surface 120. When the positioning member 610 of the base positioning mechanism 600 is connected to the positioning ring 510, the positioning member 610 is in contact with the upper positioning reference surface 524.

[0042] It should be noted that the reference center point of the processing station 110 is the ideal center point of the workpiece to be processed. Specifically, the workpiece to be processed may be a silicon wafer.

[0043] Here, the chamber positioning mechanism 500 not only facilitates the connection between the base positioning mechanism 600 and the chamber reference surface 120, but also can position the base positioning mechanism 600, so that the axis of the positioning member 610 of the base positioning mechanism 600 coincides with the axis of the processing station 110, the axis of the first reference rod 620 coincides with the reference center point, and the axis of the second reference rod 630 coincides with the preset point, thereby improving the accuracy of the reference position measurement by the first measuring component 820.

[0044] In other embodiments, the measuring device may not include the chamber positioning mechanism 500 . Specifically, the base positioning mechanism 600 may be directly connected to the chamber reference surface 120 .

[0045] In an optional embodiment, the positioning ring 510 may be provided with a first positioning groove 511, the positioning member 610 may be provided with a first positioning pin 640, the first positioning pin 640 may be coaxially arranged with the second reference rod 630, and the first positioning pin 640 may be used to be embedded in the first positioning groove 511. In this way, the connection between the first positioning pin 640 and the first positioning groove 511 can realize the connection between the base positioning mechanism 600 and the chamber positioning mechanism 500.

[0046] Furthermore, when the positioning ring 510 is disposed at the processing station 110, the projection of the center of the positioning ring 510, the center of the first positioning groove 511, and the center of the chamber of the semiconductor process chamber on the chamber reference plane 120 can be located on the same straight line. In this way, it is convenient to set the position of the preset point, thereby facilitating the setting of the position of the second reference rod 630 on the positioning member 610.

[0047] In other embodiments, the projections of the center of the positioning ring 510 , the center of the first positioning groove 511 , and the center of the semiconductor process chamber on the chamber reference plane 120 may not be located on the same straight line.

[0048] Optionally, at least one second positioning groove 512 may be provided on the positioning ring 510, and the second positioning groove 512 and the first positioning groove 511 may be spaced apart along the circumference of the positioning ring 510, and at least one second positioning pin 650 may be provided on the positioning member 610, and when the positioning ring 510 is provided at the processing station 110, the second positioning pin 650 may be embedded in the second positioning groove 512. In this way, the connection strength between the base positioning mechanism 600 and the chamber positioning mechanism 500 may be improved, thereby improving the stability of the connection between the base positioning mechanism 600 and the chamber positioning mechanism 500.

[0049] Of course, the second positioning groove 512 may not be provided on the positioning ring 510 , and the second positioning pin 650 may not be provided on the positioning member 610 . The positioning member 610 may be connected to the positioning ring 510 only through the first positioning pin 640 .

[0050] Optionally, in order to facilitate the transportation of the chamber positioning mechanism 500, two first handles 522 may be provided on the connecting member 520, and the two first handles 522 may be symmetrical about the center of the positioning ring 510, so that it is convenient for operators to carry it.

[0051] Further optionally, the first positioning pin 640 and the second positioning pin 650 can both be tapered structures, so that it is convenient for the first positioning pin 640 to be embedded in the first positioning groove 511 and for the second positioning pin 650 to be embedded in the second positioning groove 512, and the first positioning pin 640 and the second positioning pin 650 are easy to process and reliably positioned. In some embodiments, the first positioning groove 511 and the second positioning groove 512 can both be strip grooves, which can extend along the radial direction of the positioning ring 510 to facilitate adjusting the positioning positions of the first positioning pin 640 and the second positioning pin 650.

[0052] In an optional embodiment of the present application, the rotating plate 810 may be provided with a first positioning hole 8121 and a second positioning hole 8122, the axis of the first positioning hole 8121 may coincide with the axis of the processing station 110, and the axis of the second positioning hole 8122 may coincide with the preset point. In addition, the rotating measuring mechanism 800 may further include a positioning sleeve 850.

[0053] In the case where the axis of the first reference rod 620 coincides with the axis of the processing station 110, the positioning sleeve 850 can extend into the first positioning hole 8121 and be sleeved outside the first reference rod 620, and the outer wall of the positioning sleeve 850 can contact the hole wall of the first positioning hole 8121, and the outer wall of the first reference rod 620 can contact the inner wall of the positioning sleeve 850. In this way, through the cooperation of the positioning sleeve 850, the first positioning hole 8121 and the first reference rod 620, it can be determined whether the axis of the first reference rod 620 coincides with the axis of the processing station 110, and further it can be determined whether the center point of the base 200 coincides with the reference center point of the processing station 110, so as to facilitate the adjustment of the position of the base 200.

[0054] When the axis of the second reference rod 630 coincides with the preset point, the positioning sleeve 850 can extend into the second positioning hole 8122 and be sleeved outside the second reference rod 630, and the outer wall of the positioning sleeve 850 can contact the hole wall of the second positioning hole 8122, and the outer wall of the second reference rod 630 can contact the inner wall of the positioning sleeve 850. In this way, through the cooperation of the positioning sleeve 850, the second positioning hole 8122 and the second reference rod 630, it can be determined whether the axis of the second reference rod 630 coincides with the preset point, and then it can be determined whether the measuring point of the base 200 coincides with the preset point, so that it can be determined whether the horizontal angle of the base 200 has been correctly positioned.

[0055] Specifically, the positioning sleeve 850 is installed in the first positioning hole 8121, and then the position of the base 200 is adjusted until the first reference rod 620 is installed in the positioning sleeve 850. At this time, the positioning sleeve 850 positions the first positioning hole 8121 and the first reference rod 620, indicating that the center point of the base 200 has been correctly positioned.

[0056] Insert the positioning sleeve 850 into the second positioning hole 8122, and adjust the horizontal angle of the base 200 until the second reference rod 630 is inserted into the positioning sleeve 850. At this time, the positioning sleeve 850 positions the second positioning hole 8122 and the second reference rod 630, indicating that the horizontal angle of the base 200 has been correctly positioned.

[0057] Such a configuration makes it easy to adjust the base 200, and during the adjustment process, there is no need to detect the position and horizontal angle of the center of the base 200 in real time, and there is no need to additionally measure the positions of the first reference rod 620 and the second reference rod 630 through the first measuring component 820 to determine whether the adjustment is in place, which is conducive to simplifying the measurement process.

[0058] In other embodiments, the first positioning hole 8121 and the second positioning hole 8122 may not be set on the rotating plate 810, and the rotating measuring mechanism 800 may not include the positioning sleeve 850. Specifically, in the process of adjusting the base 200, the positions of the first reference rod 620 and the second reference rod 630 can be measured in real time by the first measuring component 820 to determine whether the base 200 is adjusted into place.

[0059] In an optional embodiment of the present application, the rotation measurement mechanism 800 may further include a second measurement component 830, which may be disposed on the rotation plate 810. The second measurement component 830 may be used to measure the coaxiality between the rotation axis 300 and the axis of the semiconductor process chamber (i.e., the center line of the semiconductor process chamber), and the verticality between the rotation axis 300 and the chamber reference plane 120 of the semiconductor process chamber. In this way, the verticality of the rotation axis 300 relative to the chamber reference plane 120 and the coaxiality relative to the axis of the semiconductor process chamber may be automatically and accurately measured by the rotation measurement mechanism 800, and the rotation axis 300 may be adjusted according to the measured coaxiality between the rotation axis 300 and the axis of the semiconductor process chamber and the verticality between the rotation axis 300 and the chamber reference plane 120 of the semiconductor process chamber to ensure the installation and rotation accuracy of the rotation axis 300, thereby avoiding the inability to accurately transfer the workpiece due to the large installation error of the rotation axis 300.

[0060] In an optional embodiment, at least two chamber connecting holes 130 may be provided on the chamber reference plane 120, and the measuring device may further include at least two chamber pins 900, each chamber pin 900 may be respectively connected to each chamber connecting hole 130, each chamber pin 900 may be perpendicular to the chamber reference plane 120, and the distance between each chamber pin 900 and the axis of the semiconductor process chamber may be the same.

[0061] For example, taking a semiconductor process chamber including four processing stations 110, four chamber connection holes 130 are provided on the chamber reference surface 120, wherein one chamber connection hole 130 is provided between any two processing stations 110, and a line connecting the reference center of any processing station 110 and the center of the rotating robot is perpendicular to a line connecting two chamber connection holes 130 adjacent to the processing station 110.

[0062] Optionally, the second measuring component 830 may include a manipulator coaxial detection element 831, which may be used to detect the horizontal distance between the axis of the rotating shaft 300 and the axis of each chamber pin 900. In this way, by detecting the horizontal distance between the axis of each chamber pin 900 and the axis of the rotating shaft 300, it is possible to determine whether the rotating shaft 300 of the rotating manipulator is coaxial with the axis of the semiconductor process chamber. Specifically, the rotating manipulator drives the rotating plate 810 to rotate, so as to drive the manipulator coaxial detection element 831 to rotate. When the manipulator coaxial detection element 831 passes through each chamber pin 900, the horizontal distance between the axis of each chamber pin 900 and the rotating shaft 300 can be measured, and the horizontal distance between the axis of each chamber pin 900 and the rotating shaft 300 is compared to see whether they are the same. If they are the same, it means that the rotating shaft 300 is coaxial with the axis of the semiconductor process chamber. If they are not the same, it means that the rotating shaft 300 is not coaxial with the axis of the semiconductor process chamber.

[0063] Further optionally, the robot coaxial detection element 831 can be used to detect the minimum horizontal distance between it and the side wall of each chamber pin 900, so as to determine whether the rotating shaft 300 is coaxial with the axis of the semiconductor process chamber by the difference of the minimum horizontal distance between the robot coaxial detection element 831 and the side wall of each chamber pin 900. It should be noted that the structure and size of each chamber pin 900 are exactly the same.

[0064] In this embodiment, the chamber pin 900 may include a first portion 910 and a second portion 920 connected to the first portion 910. The first portion 910 may be embedded in the chamber connection hole 130, and a radially protruding protrusion 930 may be provided between the first portion 910 and the second portion 920. When the first portion 910 is embedded in the chamber connection hole 130, the protrusion 930 abuts against the chamber reference surface 120 to ensure that the chamber pin 900 is installed in place. Here, a pin measurement surface 921 is provided on the second portion 920. The pin measurement surface 921 is located on the side of the chamber pin 900 that is away from the center line (i.e., the axis) of the semiconductor process chamber. The robot coaxial detection element 831 may be used to detect the horizontal distance between it and the pin measurement surface 921.

[0065] Here, a robot coaxial detection element 831 is used to detect the horizontal distance between the axis of each chamber pin 900 and the axis of the rotating shaft 300, so as to determine whether the rotating shaft 300 is coaxial with the axis of the semiconductor process chamber. Compared with the method of connecting a dial indicator to at least two chamber connection holes 130 and using the dial indicator to measure the distance between them and the side wall of the rotating shaft 300, the measurement accuracy is higher.

[0066] In other embodiments, the measuring device may not include the chamber pin 900. Specifically, a dial indicator may be connected to at least two of the chamber connecting holes 130, and the distance between the dial indicator and the side wall of the rotating shaft 300 may be measured by the distance difference between at least two dial indicators and different positions of the side wall of the rotating shaft 300 to determine whether the rotating shaft 300 is coaxial with the axis of the semiconductor process chamber.

[0067] In an optional embodiment, the second measuring component 830 may further include a manipulator horizontal detection element 832, which may be used to detect the vertical distance between the rotating plate 810 and the chamber reference plane 120. In this way, since the rotating plate 810 is vertically connected to the rotating shaft 300, the vertical distance between the rotating plate 810 and the chamber reference plane 120 is detected by the manipulator horizontal detection element 832, that is, the verticality of the rotating shaft 300 and the chamber reference plane 120, that is, the horizontality of the rotating plate 810, can be detected. Specifically, the rotating plate 810 rotates synchronously with the rotating manipulator for one circle, and the vertical distances between the rotating plate 810 and multiple positions of the chamber reference plane 120 are measured during the rotation process. By comparing the measured multiple vertical distances, for example, by comparing the measured maximum vertical distance and the minimum vertical distance, it can be determined whether the rotating shaft 300 is perpendicular to the chamber reference plane 120 according to the difference obtained, so that the verticality of the rotating shaft 300 and the chamber reference plane 120 can be obtained.

[0068] It should be noted that both the robot coaxial detection element 831 and the robot horizontal detection element 832 can be distance sensors.

[0069] In an optional embodiment of the present application, the measuring device may further include a horizontal measuring mechanism 700, which may include a horizontal measuring reference plate 720 and at least two horizontal measuring pieces 710, wherein the horizontal measuring pieces 710 may be connected to the horizontal measuring reference plate 720, and the horizontal measuring reference plate 720 may be used to be detachably arranged on the processing station 110, and the horizontal measuring reference plate 720 may be parallel to the chamber reference plane 120 of the semiconductor process chamber, and each horizontal measuring piece 710 may be located at a different position of the processing station 110, and each horizontal measuring piece 710 may be in contact with the base 200 at the processing station 110, and be used to measure the vertical distance between the horizontal measuring reference plate 720 and the base 200. In this way, the vertical distance between the horizontal measurement reference plate 720 and the base 200 can be measured by each horizontal measurement member 710, and it can be obtained whether the base reference surface 203 of the base 200 is parallel to the horizontal measurement member 710, that is, it can be measured whether the base reference surface 203 of the base 200 is horizontal, so as to measure the horizontality of the base reference surface 203 of each base 200. It should be noted that the base reference surface 203 can be the upper surface of the base 200.

[0070] In this embodiment, the horizontal measurement reference plate 720 can be provided with a horizontal measurement upper reference surface 721 and a horizontal measurement lower reference surface 722, the horizontal measurement upper reference surface 721 is parallel to the horizontal measurement lower reference surface 722, and the horizontal measurement lower reference surface 722 can be in contact with the chamber reference surface 120, and the measuring end of the horizontal measurement piece 710 can contact the horizontal measurement upper reference surface 721.

[0071] Here, the method of detecting the horizontality of the base reference surface 203 of the base 200 by measuring the vertical distance between the horizontal measurement reference plate 720 and the base reference surface 203 of the base 200 by the horizontal measuring piece 710, compared with the method of measuring the horizontality of the base reference surface 203 of the base 200 by using a level meter, can cover a wider area by measuring the vertical distances of multiple positions, thereby more comprehensively evaluating the horizontality of the base reference surface 203 of the base 200, and multi-data point measurement can reduce error accumulation and improve measurement accuracy.

[0072] In other embodiments, the measuring device may not include the level measuring mechanism 700 . Specifically, the operator may use a level meter to measure the levelness of the base reference surface 203 of the base 200 .

[0073] Optionally, two second handles 750 may be provided on the level measurement reference plate 720 , and the two second handles 750 may be arranged opposite to each other for the operator to grasp, so that the operator can carry the level measurement mechanism 700 conveniently.

[0074] In an optional embodiment, the horizontal measurement mechanism 700 may further include at least two brackets 730, one end of each bracket 730 may be rotatably connected to the horizontal measurement reference plate 720, each horizontal measurement member 710 may be respectively raisably disposed at the other end of each bracket 730, and the rotation plane of the bracket 730 may be parallel to the horizontal measurement reference plate 720. In this way, it is convenient to adjust the position of the horizontal measurement member 710, and each horizontal measurement member 710 may adapt to the height of the base 200.

[0075] Of course, one end of each bracket 730 may also be non-detachably fixedly connected to the horizontal measurement reference plate 720 , and each horizontal measurement member 710 may also be non-detachably fixedly disposed on the other end of each bracket 730 .

[0076] Optionally, one end of the bracket 730 can be connected to the horizontal measurement reference plate 720 via a rotating shaft, where the rotating shaft can be a bracket fixing screw 740; the other end of each bracket 730 can be provided with a clamp, each clamp clamps each horizontal measurement member 710, and the clamp can hold or loosen the horizontal measurement member 710. When the height of the horizontal measurement member 710 needs to be adjusted, the clamp can be loosened, and then the horizontal measurement member 710 is moved up and down, and the horizontal measurement member 710 is held tightly after the adjustment is completed. The horizontal measurement member 710 can be a dial indicator or a micrometer.

[0077] When measuring the base reference surface 203 of the base 200 horizontally, first loosen the bracket fixing screw 740 and rotate the bracket 730 so that the measuring end of the horizontal measuring member 710 contacts the horizontal measurement reference plate 720, tighten the bracket fixing screw 740 and return the measurement result of the horizontal measuring member 710 to zero, that is, complete the zeroing operation; then, loosen the bracket fixing screw 740 again, rotate the bracket 730, rotate the horizontal measuring member 710 to within the range of the base reference surface 203 of the base 200, tighten the bracket fixing screw 740 again and adjust the height of the horizontal measuring member 710 so that the measuring end of the horizontal measuring member 710 contacts the base reference surface 203 of the base 200, and the measurement result of the horizontal measuring member 710 is the vertical distance between the base reference surface 203 of the measuring base 200 and the horizontal measurement reference plate 720. The horizontality of the base reference surface 203 of the base 200 can be obtained by the difference of the measurement results of each horizontal measuring member 710.

[0078] Optionally, the rotating measuring mechanism 800 may further include a power supply 840, which may be disposed on the rotating plate 810, and the power supply 840 may be electrically connected to the first measuring component 820 and the second measuring component 830, respectively, so as to be able to supply power to the first measuring component 820 and the second measuring component 830. Here, the power supply 840 may be a rechargeable mobile power supply.

[0079] Further optionally, the rotating measurement mechanism 800 may further include a display component, which may be disposed on the rotating plate 810, and the display component may be respectively connected to the first measurement component 820 and the second measurement component 830 for communicating with each other to display the measurement results of the first measurement component 820 and the second measurement component 830. Here, the display component may be a display table.

[0080] Based on the measuring device provided in the embodiment of the present application, the embodiment of the present application also provides a semiconductor process equipment, which may include a semiconductor process chamber and the measuring device described in any of the above embodiments. Wherein, the semiconductor process chamber may include a chamber body 100, a rotating manipulator, and at least two processing stations 110 uniformly arranged along the circumference of the rotating axis 300 of the rotating manipulator, and each processing station 110 is provided with a base 200, the rotating manipulator is rotatably arranged on the chamber body 100 and can be coaxially arranged with the chamber body 100, the chamber body 100 can be provided with a chamber reference surface 120, the chamber reference surface 120 can be perpendicular to the axis of the chamber body 100, and the rotating measuring mechanism 800 of the measuring device can be connected to the rotating manipulator and rotate synchronously with the rotating manipulator.

[0081] The beneficial effects achieved by the semiconductor process equipment provided in the embodiment of the present application are consistent with the beneficial effects achieved by the measuring device provided in the embodiment of the present application, and will not be repeated here.

[0082] In an optional embodiment, at least two chamber connection holes 130 may be provided on the chamber reference plane 120, the axes of the chamber connection holes 130 may be perpendicular to the chamber reference plane 120, and the horizontal distances between each chamber connection hole 130 and the axis of the chamber body 100 may be the same.

[0083] The measuring device may further include at least two chamber pins 900 and a second measuring assembly 830 . The measuring device may further include a chamber positioning mechanism 500 . The chamber positioning mechanism 500 includes a connecting member 520 . The connecting member 520 may be arranged along the circumference of the processing station 110 .

[0084] In which, when the second measuring component 830 measures the coaxiality between the rotating shaft 300 and the axis of the semiconductor process chamber, each chamber pin 900 can be connected to each chamber connecting hole 130 respectively.

[0085] When the chamber positioning mechanism 500 is connected to the chamber reference surface 120 , the connecting member 520 is connected to the chamber connecting hole 130 adjacent to the processing station 110 .

[0086] Such an arrangement allows the chamber pin 900 and the chamber positioning mechanism 500 to share the chamber connection hole 130, thereby eliminating the need to open more connection holes on the chamber reference surface 120 or to provide additional connection components or connection structures, thereby helping to simplify the structure of the semiconductor process chamber.

[0087] In other embodiments, when the chamber positioning mechanism 500 is connected to the chamber reference surface 120 , the connector 520 may not be connected to the chamber connecting hole 130 . Specifically, an additional mounting hole for connecting the connector 520 may be provided on the chamber reference surface 120 .

[0088] In an optional embodiment, the semiconductor process equipment may further include at least two base adjustment mechanisms 400, each base adjustment mechanism 400 is used to support each base 200, each base adjustment mechanism 400 can be respectively arranged on the chamber body 100 in a liftable manner through a first connecting member 410, and each first connecting member 410 can be movably connected to the chamber body 100, the first connecting member 410 can be moved relative to the chamber body 100 along a third direction, each base adjustment mechanism 400 can be movably connected to each base 200, each base 200 can be moved relative to the base adjustment mechanism 400 along a fourth direction, and the third direction and the fourth direction intersect. In this way, the base 200 can be adjusted from the third direction and the fourth direction, so as to adjust the base 200 to the reference position. Here, the base adjustment mechanism 400 can be connected to the base 200 through a second connecting member 420, and optionally, the second connecting member 420 can be an adjusting screw, and the height of the base 200 can be adjusted by rotating the adjusting screw. It should be noted that the third direction can be the same as the first direction described above, both can be horizontal, and the fourth direction can be the same as the second direction described above, both can be longitudinal. Of course, the third direction can also be different from the first direction, and the fourth direction can also be different from the second direction. Specifically, the third direction can be the radial direction of the processing station, and the fourth direction can be perpendicular to the third direction. Further optionally, the base 200 can be rotatably connected to the second connecting member 420 to facilitate adjusting the angle of the base 200.

[0089] In an optional embodiment, the semiconductor process chamber may include four processing stations 110 evenly arranged along the circumference of the rotating axis 300 of the rotary robot, and the four processing stations 110 are respectively a first station 111, a second station 112, a third station 113 and a fourth station 114.

[0090] The measurement process of the measurement device provided in the embodiment of the present application is as follows: First, if Fig. 22As shown, the chamber pin 900 is installed in the chamber connection hole 130, the rotation measurement mechanism 800 is installed on the rotating manipulator, and the rotation measurement mechanism 800 is sleeved outside the rotating shaft 300, that is, the rotating shaft 300 passes through the rotating plate center hole 811 on the rotating plate 810 and the two are fixedly connected. Then, the rotating manipulator drives the rotating measurement mechanism 800 to rotate, so that the manipulator coaxial detection element 831 measures the distance between it and each chamber pin 900 respectively. According to the difference between the distance between the manipulator coaxial detection element 831 and each chamber pin 900, it can be determined whether the rotating shaft 300 is coaxial with the axis of the chamber body 100 of the semiconductor process chamber. At the same time, during the process of the rotating manipulator rotating one circle, the manipulator horizontal detection element 832 measures the vertical distance between it and each position of the chamber reference plane 120 respectively. According to the difference between the maximum and minimum vertical distances measured by the manipulator horizontal detection element 832, it can be determined whether the rotating shaft 300 is perpendicular to the chamber reference plane 120.

[0091] like Fig.23 As shown, the horizontal measuring mechanism 700 is placed at the first station 111, the horizontal measuring lower reference surface 722 of the horizontal measuring reference plate 720 of the horizontal measuring mechanism 700 is fitted with the chamber reference surface 120, so that the measuring end of the horizontal measuring member 710 is located within the range of the base reference surface 203 of the base 200, the bracket fixing screw 740 is loosened and the bracket 730 is rotated to make the measuring end of the horizontal measuring member 710 contact with the horizontal measuring reference plate 720, and the bracket fixing screw 740 is tightened to return the measurement result of the horizontal measuring member 710 to the original position. Then, loosen the bracket fixing screw 740 again, rotate the bracket 730, rotate the horizontal measuring piece 710 to the range of the base reference surface 203 of the base 200, tighten the bracket fixing screw 740 again and adjust the height of the horizontal measuring piece 710, so that the measuring end of the horizontal measuring piece 710 contacts the base reference surface 203 of the base 200. At this time, the measurement result of the horizontal measuring piece 710 is the vertical distance between the base reference surface 203 of the measuring base 200 and the horizontal measurement reference plate 720. The horizontality of the base reference surface 203 of the base 200 can be obtained by the difference of the measurement results of each horizontal measuring piece 710.

[0092] After adjusting the rotating shaft 300 according to the measured coaxiality and horizontality of the rotating shaft 300 and adjusting the horizontality of the base reference surface 203 of the base 200, as shown in FIG. Fig.24As shown, the chamber positioning mechanism 500 is placed at the first station 111, so that the connecting pin 521 on the connecting piece 520 of the chamber positioning mechanism 500 is respectively connected to the two chamber connecting holes 130 adjacent to the first station 111, and the connecting piece 520 is fitted with the chamber reference surface 120. At this time, the axis of the positioning ring 510 of the chamber positioning mechanism 500 coincides with the reference center of the first station 111, and the axis of the first positioning groove 511 on the positioning ring 510 coincides with the preset point.

[0093] Then, if Fig.25 As shown, the base positioning mechanism 600 is placed at the first station 111, so that the first positioning pin 640 on the positioning member 610 of the base positioning mechanism 600 is connected to the first positioning groove 511, and the second positioning pin 650 is connected to the second positioning groove 512 on the positioning ring 510. At this time, the axis of the first reference rod 620 coincides with the reference center of the first station 111, and the axis of the second reference rod 630 coincides with the preset point, that is, the axis of the second reference rod 630 can pass through the line connecting the center of the semiconductor process chamber and the reference center of the first station 111. At this time, the axis of the first reference rod 620 coincides with the ideal center of the base 200, that is, coincides with the ideal center point of the workpiece to be processed on the base 200.

[0094] Then, if Fig.26 As shown, the rotating measuring mechanism 800 is mounted on the rotating manipulator and fixed. At this time, the orthographic projection of the rotation center of the rotating measuring mechanism 800 coincides with the center of the semiconductor process chamber. The rotating manipulator is rotated to the position where the first positioning hole 8121 coincides with the axis of the first reference rod 620. The positioning sleeve 850 is installed in the first positioning hole 8121 and sleeved on the outside of the first reference rod 620. At this time, the outer diameter of the positioning sleeve 850 contacts the hole wall of the first positioning hole 8121, the inner wall of the positioning sleeve 850 contacts the outer wall of the first reference rod 620, and the center of the chamber positioning mechanism 500 is It coincides with the center of the first positioning hole 8121. At this time, the position of the rotating measuring mechanism 800 is the reference measurement position of the first station 111. The operation locks the position of the rotating manipulator and removes the positioning sleeve 850. The measurement values ​​of the first direction measuring element 8211, the second direction measuring element 8212 and the second measuring element 822 are the reference values. For the convenience of calculation, the measurement values ​​of the first direction measuring element 8211, the second direction measuring element 8212 and the second measuring element 822 at this time can be reset to zero, and the software can be used to record the reference measurement position of the rotating manipulator at the first station 111.

[0095] After that, the rotary manipulator is rotated 90 degrees, the base positioning mechanism 600 and the chamber positioning mechanism 500 are removed, and then, as shown in FIG. Fig. 27As shown, the base positioning mechanism 600 is placed on the base 200 at the first workstation 111, so that the first positioning pin 640 is connected to the first base positioning groove 201, and the second positioning pin 650 is connected to the second base positioning groove 202, that is, the first positioning pin 640 coincides with the position of the first base positioning groove 201 and is positioned by the first reference positioning pin, and the second positioning pin 650 coincides with the position of the second base positioning groove 202 and is positioned by the second reference positioning pin. At this time, the axis of the first reference rod 620 coincides with the center of the base 200, and the axis of the second reference rod 630 coincides with the measuring point on the base 200. The rotating manipulator is controlled to drive the rotating measuring mechanism 800 to rotate to the reference measurement position of the first station 111, and the first direction measuring element 8211 and the second direction measuring element 8212 measure the position of the first reference rod 620, and the second measuring element 822 measures the position of the second reference rod 630. Then, according to the first direction measuring element 8211, the second direction measuring element 8212 and the second measuring element 822, the deviation between the center point of the base 200 and the reference center point of the first station 111 and the horizontal angle deviation between the base 200 and the first station 111 can be obtained.

[0096] If the measured values ​​of the first direction measuring element 8211, the second direction measuring element 8212 and the second measuring element 822 deviate from the reference values, the base 200 needs to be adjusted, the positioning sleeve 850 is installed in the first positioning hole 8121, and the position of the base 200 is adjusted until the first reference rod 620 can be extended into the positioning sleeve 850. At this time, the positioning sleeve 850 positions the first positioning hole 8121 and the first reference rod 620, indicating that the center point of the base 200 has been correctly positioned.

[0097] Install the positioning sleeve 850 into the second positioning hole 8122, and adjust the horizontal angle of the base 200 until the second reference rod 630 extends into the positioning sleeve 850. At this time, the positioning sleeve 850 positions the second positioning hole 8122 and the second reference rod 630, indicating that the horizontal angle of the base 200 is correctly positioned.

[0098] Afterwards, fix the base 200, remove the positioning sleeve 850, read the measurement values ​​of the first direction measuring element 8211, the second direction measuring element 8212 and the second measuring element 822 again, and check whether the center position and angle value of the base 200 are correct.

[0099] Finally, the base positioning mechanism 600 is placed on the base 200 at the second station 112, the third station 113 and the fourth station 114 in turn, and the above steps are repeated to calibrate the center and angle of the base 200 at the second station 112, the third station 113 and the fourth station 114.

[0100] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A measuring device, applied to a semiconductor process chamber, the semiconductor process chamber comprising a rotary manipulator and at least two processing stations (110) uniformly arranged along the circumference of a rotating axis (300) of the rotary manipulator, and each of the processing stations (110) is provided with a base (200), characterized in that: The measuring device comprises a rotating measuring mechanism (800), wherein the rotating measuring mechanism (800) comprises: a rotating plate (810), the rotating plate (810) being used to be connected to the rotating manipulator, and the rotating plate (810) being used to rotate along with the rotating manipulator between the processing stations (110); A first measuring component (820) is arranged on the rotating plate (810), and the first measuring component (820) is used to measure the position of the center of each of the bases (200).

2. The measuring device according to claim 1, characterized in that The measuring device further comprises a base positioning mechanism (600), the base positioning mechanism (600) comprising a positioning member (610) and a first reference rod (620), the first reference rod (620) being arranged on the positioning member (610) and being coaxially arranged with the positioning member (610), the positioning member (610) being used to connect with the base (200) or a chamber reference surface (120) of the semiconductor process chamber, and the first measuring component (820) being used to measure the position of the first reference rod (620); When the positioning member (610) is connected to the base (200), the axis of the first reference rod (620) coincides with the axis of the base (200); When the positioning member (610) is connected to the chamber reference surface (120), the axis of the first reference rod (620) coincides with the axis of the processing station (110).

3. The measuring device according to claim 2, characterized in that The base positioning mechanism (600) further comprises a second reference rod (630), wherein the second reference rod (630) is arranged on the positioning member (610), and the first measuring component (820) is further used to measure the position of the second reference rod (630); When the positioning member (610) is connected to the base (200), the axis of the second reference rod (630) coincides with the measuring point; When the positioning member (610) is connected to the chamber reference surface (120), the axis of the second reference rod (630) coincides with a preset point; The measuring point is a point on the base (200) that deviates from the center point of the base (200), the preset point is a point that deviates from the reference center point of the processing station (110), and when the center point of the base (200) coincides with the reference center point, the measuring point coincides with the preset point.

4. The measuring device according to claim 3, characterized in that The base (200) is provided with a first base positioning groove (201), and when the center point of the base coincides with the reference center point, the projections of the center of the first base positioning groove (201), the center of the base (200) and the center of the chamber of the semiconductor process chamber on the chamber reference plane (120) are located on the same straight line; The base positioning mechanism (600) is provided with a first positioning pin (640), the first positioning pin (640) can be embedded in the first base positioning groove (201), and the axis of the first positioning pin (640), the center of the first base positioning groove (201) and the axis of the second reference rod (630) coincide with each other.

5. The measuring device according to claim 4, characterized in that The base (200) is further provided with at least one second base positioning groove (202), and each of the second base positioning grooves (202) and the first base positioning grooves (201) are spaced apart and distributed along the circumference of the base (200); The base positioning mechanism (600) is further provided with at least one second positioning pin (650), and the second positioning pin (650) can be embedded in the second base positioning groove (202).

6. The measuring device according to claim 3, characterized in that Also included is a chamber positioning mechanism (500), the chamber positioning mechanism (500) comprising a positioning ring (510) and a connecting piece (520) connected to the positioning ring (510); The connecting member (520) is used to be connected to and parallel to the chamber reference surface (120); The positioning ring (510) is used to be arranged at the processing station (110), and the axis of the positioning ring (510) coincides with the axis of the processing station (110), and the positioning member (610) is coaxially connected to the positioning ring (510).

7. The measuring device according to claim 6, characterized in that The positioning ring (510) is provided with a first positioning groove (511), and when the positioning ring (510) is arranged at the processing station (110), the center of the positioning ring (510), the center of the first positioning groove (511) and the projection of the chamber center of the semiconductor process chamber on the chamber reference plane (120) are located on the same straight line; The positioning member (610) is provided with a first positioning pin (640), the first positioning pin (640) being coaxially arranged with the second reference rod (630), and the first positioning pin (640) being used to be embedded in the first positioning groove (511).

8. The measuring device according to claim 7, characterized in that The positioning ring (510) is further provided with at least one second positioning groove (512), wherein the second positioning groove (512) and the first positioning groove (511) are spaced apart and distributed along the circumference of the positioning ring (510); At least one second positioning pin (650) is also provided on the positioning member (610), and when the positioning ring (510) is arranged at the processing station (110), the second positioning pin (650) is embedded in the second positioning groove (512).

9. The measuring device according to claim 3, characterized in that The rotating plate (810) is provided with a first positioning hole (8121) and a second positioning hole (8122), the axis of the first positioning hole (8121) can coincide with the axis of the processing station (110), and the axis of the second positioning hole (8122) can coincide with the preset point; The rotation measurement mechanism (800) further comprises a positioning sleeve (850), and when the axis of the first reference rod (620) coincides with the axis of the processing station (110), the positioning sleeve (850) can extend into the first positioning hole (8121) and be sleeved outside the first reference rod (620), and the outer wall of the positioning sleeve (850) contacts the hole wall of the first positioning hole (8121), and the outer wall of the first reference rod (620) contacts the inner wall of the positioning sleeve (850); When the axis of the second reference rod (630) coincides with the preset point, the positioning sleeve (850) can extend into the second positioning hole (8122) and be sleeved outside the second reference rod (630), and the outer wall of the positioning sleeve (850) contacts the hole wall of the second positioning hole (8122), and the outer wall of the second reference rod (630) contacts the inner wall of the positioning sleeve (850).

10. The measuring device according to claim 1, characterized in that The rotation measurement mechanism (800) further comprises a second measurement component (830), wherein the second measurement component (830) is arranged on the rotation plate (810), and the second measurement component (830) is used to measure the coaxiality between the rotation axis (300) and the axis of the semiconductor process chamber, and the perpendicularity between the rotation axis (300) and the chamber reference plane (120) of the semiconductor process chamber.

11. The measuring device according to claim 10, characterized in that At least two chamber connection holes (130) are provided on the chamber reference surface (120); The measuring device further comprises at least two chamber pins (900), each of the chamber pins (900) being connected to each of the chamber connecting holes (130), each of the chamber pins (900) being perpendicular to the chamber reference plane (120), and each of the chamber pins (900) being at the same distance from an axis of the semiconductor process chamber; The second measuring component (830) comprises a manipulator coaxial detection element (831), and the manipulator coaxial detection element (831) is used to detect the horizontal distance between the axis of the rotating shaft (300) and the axis of each chamber pin shaft (900).

12. The measuring device according to claim 10, characterized in that The second measuring component (830) comprises a robot horizontal detection element (832), and the robot horizontal detection element (832) is used to detect the vertical distance between the rotating plate (810) and the chamber reference plane (120).

13. The measuring device according to claim 1, characterized in that The measuring device further comprises a horizontal measuring mechanism (700), wherein the horizontal measuring mechanism (700) comprises a horizontal measuring reference plate (720) and at least two horizontal measuring members (710) connected to the horizontal measuring reference plate (720), wherein the horizontal measuring reference plate (720) is used to be detachably arranged on the processing station (110), and the horizontal measuring reference plate (720) is parallel to the chamber reference plane (120) of the semiconductor process chamber, and each of the horizontal measuring members (710) is respectively located at a different position of the processing station (110), and each of the horizontal measuring members (710) is in contact with the base (200) at the processing station (110), and is used to measure the vertical distance between the horizontal measuring reference plate (720) and the base (200).

14. The measuring device according to claim 13, characterized in that The horizontal measurement mechanism (700) further comprises at least two brackets (730), one end of each of the brackets (730) being rotatably connected to the horizontal measurement reference plate (720), each of the horizontal measurement members (710) being liftably arranged at the other end of each of the brackets (730), and the rotation plane of the brackets (730) being parallel to the horizontal measurement reference plate (720).

15. A semiconductor process equipment, characterized in that: The invention comprises a semiconductor process chamber and a measuring device according to any one of claims 1 to 14, wherein the semiconductor process chamber comprises a chamber body (100), a rotating manipulator and at least two processing stations (110) uniformly arranged along the circumference of the rotating axis of the rotating manipulator, and each of the processing stations (110) is provided with a base (200), the rotating manipulator is rotatably arranged on the chamber body (100) and is coaxially arranged with the chamber body (100), the chamber body (100) is provided with a chamber reference plane (120), and the chamber reference plane (120) is perpendicular to the axis of the chamber body (100), and the rotating measuring mechanism (800) of the measuring device is used to be connected to the rotating manipulator.

16. The semiconductor process equipment according to claim 15, characterized in that: At least two chamber connection holes (130) are provided on the chamber reference surface (120), the axes of the chamber connection holes (130) are perpendicular to the chamber reference surface (120), and the horizontal distances between the chamber connection holes (130) and the axes of the chamber body (100) are the same; The measuring device further comprises at least two chamber pins (900) and a second measuring assembly (830); The measuring device further comprises a chamber positioning mechanism (500), wherein the chamber positioning mechanism (500) comprises a connecting piece (520), and the connecting piece (520) is used to be arranged along the circumference of the processing station (110); When the second measuring component (830) measures the coaxiality between the rotating shaft (300) and the axis of the semiconductor process chamber, each of the chamber pins (900) is respectively connected to each of the chamber connecting holes (130); When the chamber positioning mechanism (500) is connected to the chamber reference surface (120), the connecting member (520) is connected to the chamber connecting hole (130) adjacent to the processing station (110).

Images