Measuring device and semiconductor process apparatus

Abstract

The application discloses a measuring device and a semiconductor process equipment, and belongs to the technical field of measurement. The measuring device is applied to a semiconductor process chamber, the semiconductor process chamber comprises a rotating manipulator and at least two processing stations which are uniformly arranged along the circumferential direction of the rotating shaft of the rotating manipulator, each processing station is provided with a pedestal, the measuring device comprises a rotating measuring mechanism, the rotating measuring mechanism comprises a rotating plate and a first measuring assembly, the rotating plate is used for being connected with the rotating manipulator and is used for rotating with the rotating manipulator between the processing stations; the first measuring assembly is arranged on the rotating plate, and the first measuring assembly is used for measuring the position of the center of each pedestal. In the scheme, the rotating manipulator drives the rotating measuring mechanism to rotate between the processing stations, so that the position of the center of the pedestal of each processing station is measured, the measuring device does not need to be repeatedly disassembled and assembled, the measuring operation can be simplified, and installation errors can be reduced or eliminated, so that the measurement precision and accuracy are improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of measurement, and particularly relates to a measuring device and a semiconductor process equipment. BACKGROUND

[0002] With the increasingly strict requirements of semiconductor process on film performance and thickness, the requirements of semiconductor process equipment on hardware structure are also increasingly high. For example, when chemical vapor deposition (CVD) and atomic layer deposition (ALD) processes are performed, it is crucial to maintain a constant gas flow field and thermal field between a gas shower head and a silicon wafer for the process result. If the constant gas flow field and thermal field are to be maintained, it is necessary to first ensure that the silicon wafer and a susceptor are in a relatively stable position, at this time, it is required that the susceptor is in a precise fixed position, and it is required to ensure that the position of the silicon wafer after being conveyed between various processing stations of the semiconductor process equipment is still stable and precise. Therefore, when the semiconductor process equipment is shipped or after being used for a period of time, it is necessary to measure and calibrate the position of the susceptor of each processing station of the semiconductor process equipment to ensure that the position of the susceptor of each processing station is fixed.

[0003] In the prior art, a measuring table is installed on the susceptor and a measuring table is installed on the chamber body of the semiconductor process equipment, and the position of each susceptor is indirectly obtained according to the data measured by each measuring table. When the susceptor of each processing station is measured, the position of the susceptor of each processing station needs to be measured in sequence by using the measuring table, and thus the measuring table needs to be repeatedly disassembled and assembled, which leads to complicated measurement operation and is prone to cause installation errors, thereby reducing the measurement accuracy of the measuring table and leading to inaccurate measurement results.

[0004] Therefore, the existing measurement method of the susceptor has the defects of complicated measurement and inaccurate measurement results. SUMMARY

[0005] The purpose of the embodiments of the present application is to provide a measuring device and a semiconductor process equipment, which can solve the problem of complicated measurement and inaccurate measurement results of the measurement method of the susceptor in the related art.

[0006] In a first aspect, the embodiments of the present application provide a measuring device applied to a semiconductor process chamber, the semiconductor process chamber comprising a rotary robot and at least two processing stations uniformly arranged along the circumferential direction of the rotary shaft of the rotary robot, and each processing station being provided with a susceptor, the measuring device comprising a rotary measuring mechanism, the rotary measuring mechanism comprising:

[0007] a rotating plate for connecting with the rotating robot, the rotating plate being used for rotating with the rotating robot between each of the processing stations;

[0008] a first measuring assembly arranged on the rotating plate, the first measuring assembly being used for measuring the position of the center of each of the susceptor.

[0009] In a second aspect, the embodiments of the present application further provide a semiconductor process equipment, comprising a semiconductor process chamber and the above-mentioned measuring device, the semiconductor process chamber comprising a chamber body, a rotating robot and at least two processing stations arranged uniformly along the circumferential direction of the rotating shaft of the rotating robot, and each of the processing stations is provided with a susceptor, the rotating robot is rotatably arranged on the chamber body and coaxially arranged with the chamber body, the chamber body is provided with a chamber reference surface which is perpendicular to the axis of the chamber body, and the rotating measuring mechanism of the measuring device is used for connecting with the rotating robot.

[0010] In the embodiments of the present application, the rotating robot can drive the rotating measuring mechanism to rotate to each of the processing stations respectively, and the first measuring assembly measures the position of the center of each of the susceptor, so that the position of the susceptor can be calibrated and adjusted according to the position of the center of each of the susceptor, so as to keep each of the susceptor at a fixed position, and further ensure that the position of the silicon wafer after being transmitted between each of the processing stations is still stable and accurate.

[0011] In addition, the rotating robot drives the rotating measuring mechanism to rotate between each of the processing stations, and the rotating measuring mechanism measures the position of the center of the susceptor of each of the processing stations respectively, without repeatedly disassembling and assembling the measuring device, so as to simplify the measurement operation, reduce or eliminate the installation error, and thus facilitate to ensure the measurement accuracy of the measuring device and improve the accuracy of the measurement result. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a top view of the semiconductor process chamber disclosed by the embodiments of the present application;

[0013] Figure 2 is a top view of the susceptor disclosed by the embodiments of the present application;

[0014] Figure 3 is Figure 2 is a sectional view of the C-C direction in

[0015] Figure 4 is Figure 1 is a sectional view of the A-A direction in

[0016] Figure 5 is a sectional view of the B-B direction in Figure 1

[0017] ​Figure 6 is a top view of the chamber positioning mechanism disclosed by the embodiments of the present application;

[0018] Figure 7 is a side view of the chamber positioning mechanism disclosed by the embodiments of the present application;

[0019] Figure 8 is a side view of the base positioning mechanism disclosed by the embodiments of the present application;

[0020] Figure 9 is a top view of the base positioning mechanism disclosed by the embodiments of the present application; Figure 8 is an enlarged view of part E in FIG. 5;

[0021] Figure 10 is a bottom view of the base positioning mechanism disclosed by the embodiments of the present application;

[0022] Figure 11 is a top view of the base positioning mechanism disclosed by the embodiments of the present application; Figure 10 is an enlarged view of part F in FIG. 6;

[0023] Figure 12 is a bottom view (D direction) of the base positioning mechanism disclosed by the embodiments of the present application;

[0024] Figure 13 is an enlarged view of part G in FIG. 7; Figure 12

[0025] Figure 14 is a top view of the horizontal measurement mechanism disclosed by the embodiments of the present application;

[0026] Figure 15 is a side view of the horizontal measurement mechanism disclosed by the embodiments of the present application;

[0027] Figure 16 is a bottom view of the rotation measurement mechanism disclosed by the embodiments of the present application;

[0028] Figure 17 is a side view of the rotation measurement mechanism disclosed by the embodiments of the present application;

[0029] Figure 18 is a top view of the rotation measurement mechanism disclosed by the embodiments of the present application;

[0030] Figure 19 is a side view of the chamber pin shaft disclosed by the embodiments of the present application;

[0031] Figure 20 is a top view of the chamber pin shaft disclosed by the embodiments of the present application;

[0032] Figure 21 is one of the state diagrams when the second measurement assembly measures the rotation shaft disclosed by the embodiments of the present application;

[0033] Figure 22 ​is a state diagram of the second measurement assembly disclosed by the embodiment of the present application when measuring the rotating shaft;

[0034] Figure 23 is a state diagram of the horizontal measurement mechanism disclosed by the embodiment of the present application when measuring the base;

[0035] Figure 24 is a schematic diagram of the chamber positioning mechanism disclosed by the embodiment of the present application installed on the machining station;

[0036] Figure 25 is a schematic diagram of the base positioning mechanism disclosed by the embodiment of the present application installed on the chamber positioning mechanism;

[0037] Figure 26 is a schematic diagram of the rotating measurement mechanism disclosed by the embodiment of the present application when measuring the reference center point of the base;

[0038] Figure 27 is a schematic diagram of the rotating measurement mechanism disclosed by the embodiment of the present application when measuring the position deviation and the angle deviation of the base.

[0039] Explanation of reference signs:

[0040] 100-chamber body; 110-machining station; 111-first station; 112-second station;

[0041] 113-third station; 114-fourth station; 120-chamber reference surface; 130-chamber connecting hole;

[0042] 200-base; 201-first base positioning groove; 202-second base positioning groove;

[0043] 203-base reference surface; 300-rotating shaft; 400-base adjusting mechanism;

[0044] 410-first connecting piece; 420-second connecting piece; 500-chamber positioning mechanism; 510-positioning ring;

[0045] 511-first positioning groove; 512-second positioning groove; 520-connecting piece; 521-connecting pin;

[0046] 522-first handle; 523-positioning lower reference surface; 524-positioning upper reference surface;

[0047] 600-base positioning mechanism; 610-positioning piece; 620-first reference rod; 630-second reference rod;

[0048] 640-first positioning pin; 650-second positioning pin; 700-horizontal measurement mechanism;

[0049] 710 - horizontal measurement member; 720 - horizontal measurement reference plate; 721 - horizontal measurement upper reference surface;

[0050] 722 - horizontal measurement lower reference surface; 730 - bracket; 740 - bracket fixing screw;

[0051] 750 - second handle; 800 - rotation measurement mechanism; 810 - rotation plate; 811 - rotation plate center hole;

[0052] 8121 - first positioning hole; 8122 - second positioning hole; 820 - first measurement assembly;

[0053] 821 - first measurement element; 8211 - first direction measurement element; 8212 - second direction measurement element;

[0054] 822 - second measurement element; 830 - second measurement assembly; 831 - manipulator coaxial detection element;

[0055] 832 - manipulator horizontal detection element; 840 - power supply; 850 - positioning sleeve; 900 - chamber pin shaft;

[0056] 910 - first part; 920 - second part; 921 - pin shaft measurement surface; 930 - protrusion. DETAILED DESCRIPTION

[0057] The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0058] The terms "first", "second", and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually a class, not limited to the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in a "or" relationship.

[0059] The measurement device and semiconductor process equipment provided by the embodiments of the present application will be described in detail below with reference to the drawings and specific embodiments and their application scenarios.

[0060] Reference Figures 1-27As shown, the measuring device provided by the embodiment of the present application can be applied to a semiconductor process chamber, wherein the semiconductor process chamber can include a rotary robot and at least two processing stations 110 (generally four processing stations 110) arranged uniformly along the circumference of the rotary shaft 300 of the rotary robot, and each processing station 110 can be provided with a susceptor 200, where the susceptor 200 can be a heating susceptor.

[0061] The measuring device can include a rotary measuring mechanism 800, which can include a rotary plate 810 and a first measuring assembly 820, the rotary plate 810 can be used to connect with the rotary robot, the rotary plate 810 can be used to rotate with the rotary robot between the processing stations 110, and the first measuring assembly 820 can be arranged on the rotary plate 810, and the first measuring assembly 820 can be used to measure the position of the center of each susceptor 200.

[0062] In this way, the rotary measuring mechanism 800 can be driven by the rotary robot to rotate to each processing station 110 respectively, and the first measuring assembly 820 can measure the position of the center of each susceptor 200, so that the position of the susceptor 200 can be calibrated and adjusted according to the position of the center of each susceptor 200, so as to keep each susceptor 200 at a fixed position, thereby ensuring the position accuracy and consistency of the silicon wafer after being transferred between the processing stations 110.

[0063] In addition, the rotary measuring mechanism 800 can be driven by the rotary robot to rotate between the processing stations 110, and the rotary measuring mechanism 800 can measure the position of the center of the susceptor 200 of each processing station 110 respectively, without the need to repeatedly disassemble and assemble the measuring device, so as to simplify the measurement operation, reduce or eliminate the installation error, thereby facilitating the measurement accuracy of the measuring device and improving the accuracy of the measurement result.

[0064] In an optional embodiment of the present application, the measuring device can further include a susceptor positioning mechanism 600, which can include a positioning member 610 and a first reference rod 620, the first reference rod 620 can be arranged on the positioning member 610, the first reference rod 620 can be coaxially arranged with the positioning member 610, the positioning member 610 can be used to connect with the susceptor 200 or the chamber reference surface 120 of the semiconductor process chamber, the positioning member 610 needs to be coaxially arranged with the susceptor 200, and the first measuring assembly 820 can be used to measure the position of the first reference rod 620.

[0065] Since the positioning member 610 is coaxially arranged with the susceptor 200, the axis of the first reference rod 620 can coincide with the axis of the susceptor 200 when the positioning member 610 is connected with the susceptor 200. In this way, the first measuring assembly 820 can obtain the position of the center of the susceptor 200 by measuring the position of the first reference rod 620.

[0066] When the positioning member 610 is connected with the chamber reference surface 120, the axis of the first reference rod 620 can coincide with the axis of the processing station 110. In this way, the first measurement assembly 820 can obtain the position of the reference center of the processing station 110 by measuring the position of the first reference rod 620.

[0067] Here, by comparing the position of the center of the susceptor 200 with the position of the reference center of the processing station 110, the deviation of the center of the susceptor 200 can be obtained, and then the distance that the susceptor 200 needs to be adjusted can be determined so as to adjust the susceptor 200 to the reference position.

[0068] In the embodiment, the first measurement assembly 820 measures the position of the center of the susceptor 200 or the position of the reference center of the processing station 110 by measuring the position of the first reference rod 620, and compared with directly measuring the position of the center of the susceptor 200 or the position of the reference center of the processing station 110 by the first measurement assembly 820, a suitable measurement position can be established to facilitate the measurement of the first measurement assembly 820.

[0069] In other embodiments, the measurement device can also not include the susceptor positioning mechanism 600, and the first measurement assembly 820 can directly measure the position of the center of the susceptor 200.

[0070] Optionally, the first measurement assembly 820 can include a first measurement element 821, and the first measurement element 821 can be used to measure the position of the first reference rod 620.

[0071] Further optionally, the first measurement element 821 can include a first direction measurement element 8211 and a second direction measurement element 8212, the first direction measurement element 8211 can be used to measure the position of the first reference rod 620 in the first direction, and the second direction measurement element 8212 can be used to measure the position of the first reference rod 620 in the second direction. In this way, the position of the first reference rod 620 can be more accurately positioned, and the adjustment accuracy of the susceptor 200 can be improved. It should be noted that the first direction and the second direction can intersect, and further, the two can be perpendicular to each other. Specifically, the first direction can be a horizontal direction in the horizontal plane, and the second direction can be a vertical direction in the horizontal plane. The first direction measurement element 8211 can measure the coordinates of the first reference rod 620 in the horizontal direction, and the second direction measurement element 8212 can measure the coordinates of the first reference rod 620 in the vertical direction, so as to obtain the position of the first reference rod 620.

[0072] In the embodiment, the first direction measurement element 8211 and the second direction measurement element 8212 can both be distance measurement sensors.

[0073] When the positioning member 610 is connected with the chamber reference surface 120, the rotary measuring mechanism 800 can rotate to the machining station 110 with the rotary robot and make the first positioning hole 8121 on the rotary plate 810 described below opposite to the first reference rod 620, at this time, the position of the rotary measuring mechanism 800 is the reference measurement position of the machining station 110. At this time, the position of the first reference rod 620 measured by the first measuring assembly 820 is the position of the reference center of the machining station 110, in order to facilitate calculation, the measurement values of the first direction measuring element 8211 and the second direction measuring element 8212 at this time can be zeroed.

[0074] When the positioning member 610 is connected with the base 200, the rotary measuring mechanism 800 can still rotate to the reference measurement position of the machining station 110 with the rotary robot, at this time, the distance value between the first direction measuring element 8211 and the first reference rod 620 measured by the first direction measuring element 8211 itself indicates the position of the first reference rod 620 in the first direction, and the distance value between the second direction measuring element 8212 and the first reference rod 620 measured by the second direction measuring element 8212 itself indicates the position of the first reference rod 620 in the second direction.

[0075] In an optional embodiment, the base positioning mechanism 600 can further include a second reference rod 630, the second reference rod 630 can be arranged on the positioning member 610, and the first measuring assembly 820 can be further used to measure the position of the second reference rod 630.

[0076] Wherein, when the positioning member 610 is connected with the base 200, the axis of the second reference rod 630 can coincide with the measurement point;

[0077] When the positioning member 610 is connected with the chamber reference surface 120, the axis of the second reference rod 630 can coincide with the preset point.

[0078] It should be noted that the measurement point can be a point on the base 200 deviating from the center point of the base 200, the preset point can be a point deviating from the reference center point of the machining station 110, and when the center point of the base 200 coincides with the reference center point, the measurement point can coincide with the preset point.

[0079] In this way, when the positioning member 610 is connected to the base 200, the positions of the first reference rod 620 and the second reference rod 630 measured by the first measurement assembly 820 can be used to determine the position of the line connecting the center point of the base 200 and the measurement point; when the positioning member 610 is connected to the chamber reference surface 120, the positions of the first reference rod 620 and the second reference rod 630 measured by the first measurement assembly 820 can be used to determine the position of the line connecting the reference center point of the processing station 110 and the preset point, and the offset angle of the base 200 can be determined by the included angle of the two lines.

[0080] Optionally, the first measurement assembly 820 can further include a second measurement element 822, which can be used to measure the position of the second reference rod 630. Specifically, the second measurement element 822 can be a distance measurement sensor. When the second reference rod 630 coincides with the preset point, the measurement result of the second measurement element 822 is zero, i.e., the distance between the second measurement element 822 and the second reference rod 630 can be zero; when the second reference rod 630 coincides with the measurement point, the distance between the second measurement element 822 and the second reference rod 630 measured by the second measurement element 822 is the deviation between the measurement point and the preset point.

[0081] Of course, the second measurement element 822 can also be an angle sensor, which can be used to measure the included angle between the line connecting the first reference rod 620 and the second reference rod 630 when the base positioning mechanism 600 is connected to the base 200, and the line connecting the first reference rod 620 and the second reference rod 630 when the base positioning mechanism 600 is connected to the chamber reference surface 120, i.e., the offset angle of the base 200.

[0082] In an optional embodiment, the base 200 can be provided with a first base positioning groove 201, and the base positioning mechanism 600 can be provided with a first positioning pin 640, which can be embedded in the first base positioning groove 201, so that the connection between the base positioning mechanism 600 and the base 200 can be achieved.

[0083] Furthermore, when the center point of the susceptor 200 coincides with the reference center point, the projections of the center of the first susceptor positioning groove 201, the center of the susceptor 200 and the chamber center of the semiconductor processing chamber on the chamber reference surface 120 can be located on the same straight line, and the axis of the first positioning pin 640, the center of the first susceptor positioning groove 201 and the axis of the second reference rod 630 can coincide. When setting the position of the first susceptor positioning groove 201, the susceptor 200 can be placed in the reference position, at this time, any point located in the projection of the susceptor 200 on the chamber reference surface 120 and on the connecting line of the projection of the center of the susceptor 200 and the chamber center on the chamber reference surface 120 can be selected as the projection of the center of the first susceptor positioning groove 201, and then the position of the first susceptor positioning groove 201 on the susceptor 200 can be determined. By such arrangement, the setting position of the first susceptor positioning groove 201 on the susceptor 200 can be set, so as to facilitate setting the mounting position of the second reference rod 630.

[0084] Of course, the projections of the center of the first susceptor positioning groove 201, the center of the susceptor 200 and the chamber center of the semiconductor processing chamber on the chamber reference surface 120 can also not be located on the same straight line, specifically, as long as the projection of the center of the first susceptor positioning groove 201 and the preset point on the chamber reference surface 120 can coincide when the susceptor 200 is located at the reference position.

[0085] Alternatively, the susceptor 200 can further be provided with at least one second susceptor positioning groove 202, each second susceptor positioning groove 202 can be distributed along the circumference of the susceptor 200 and spaced apart from the first susceptor positioning groove 201, and the susceptor positioning mechanism 600 can further be provided with at least one second positioning pin 650, the second positioning pin 650 can be embedded in the second susceptor positioning groove 202, so as to improve the connection strength between the susceptor positioning mechanism 600 and the susceptor 200, and further improve the stability of the connection between the susceptor positioning mechanism 600 and the susceptor 200. It should be noted that the first susceptor positioning groove 201 and the second susceptor positioning groove 202 can be located on the same circle, and the center of the circle can coincide with the axis of the first reference rod 620.

[0086] In optional embodiments of the present application, the measuring device can further comprise a chamber positioning mechanism 500, which can comprise a positioning ring 510 and a connecting piece 520 connected with the positioning ring 510, wherein the connecting piece 520 can be used to connect with and be parallel to the chamber reference surface 120, the positioning ring 510 can be used to be arranged at the machining station 110, and the axis of the positioning ring 510 can coincide with the axis of the machining station 110, and here the positioning piece 610 can be coaxially connected with the positioning ring 510. Since the axis of the positioning ring 510 coincides with the axis of the machining station 110, and the positioning piece 610 is coaxially connected with the positioning ring 510, the first reference rod 620 can coincide with the axis of the machining station 110, and then the first measuring assembly 820 can measure the position of the reference center of the machining station 110 by measuring the position of the first reference rod 620.

[0087] In the present embodiment, the connecting piece 520 can be provided with a positioning lower reference surface 523, and the positioning ring 510 is provided with a positioning upper reference surface 524, which is parallel to the positioning lower reference surface 523. In the case that the chamber positioning mechanism 500 is connected with the chamber reference surface 120, the positioning lower reference surface 523 is in contact with the chamber reference surface 120, and in the case that the positioning piece 610 of the base positioning mechanism 600 is connected with the positioning ring 510, the positioning piece 610 is in contact with the positioning upper reference surface 524.

[0088] It should be noted that the reference center point of the machining station 110 is the ideal center point of the workpiece to be machined. Specifically, the workpiece to be machined can be a silicon wafer.

[0089] Here, the chamber positioning mechanism 500 not only facilitates the connection of the base positioning mechanism 600 with the chamber reference surface 120, but also positions the base positioning mechanism 600, so that the axis of the positioning piece 610 of the base positioning mechanism 600 coincides with the axis of the machining station 110, the axis of the first reference rod 620 coincides with the reference center point, and the axis of the second reference rod 630 coincides with the preset point, thereby improving the accuracy of the first measuring assembly 820 in measuring the reference position.

[0090] In other embodiments, the measuring device can also not comprise the chamber positioning mechanism 500, and specifically, the base positioning mechanism 600 can be directly connected with the chamber reference surface 120.

[0091] In optional embodiments, the positioning ring 510 can be provided with a first positioning groove 511, and the positioning piece 610 can be provided with a first positioning pin 640, which can be coaxially arranged with the second reference rod 630, and the first positioning pin 640 can be used to be embedded in the first positioning groove 511. In this way, the connection of the first positioning pin 640 and the first positioning groove 511 can realize the connection of the base positioning mechanism 600 with the chamber positioning mechanism 500.

[0092] In addition, in the case that the positioning ring 510 is arranged at the processing station 110, the center of the positioning ring 510, the center of the first positioning groove 511 and the projection of the center of the semiconductor processing chamber on the chamber reference surface 120 can be located on the same straight line. In this way, the position of the preset point can be set, so that the position of the second reference rod 630 on the positioning member 610 can be set.

[0093] In other embodiments, the center of the positioning ring 510, the center of the first positioning groove 511 and the projection of the center of the semiconductor processing chamber on the chamber reference surface 120 can also not be located on the same straight line.

[0094] Optionally, the positioning ring 510 can further be provided with at least one second positioning groove 512, and the second positioning groove 512 and the first positioning groove 511 can be distributed along the circumference of the positioning ring 510, and the positioning member 610 can further be provided with at least one second positioning pin 650, and in the case that the positioning ring 510 is arranged at the processing station 110, the second positioning pin 650 can be embedded in the second positioning groove 512. In this way, the connection strength of the base positioning mechanism 600 and the chamber positioning mechanism 500 can be improved, and the stability of the connection of the base positioning mechanism 600 and the chamber positioning mechanism 500 can be improved.

[0095] Of course, the positioning ring 510 can also not be provided with the second positioning groove 512, and the positioning member 610 can also not be provided with the second positioning pin 650, and the positioning member 610 can be connected with the positioning ring 510 only through the first positioning pin 640.

[0096] Optionally, in order to facilitate the carrying of the chamber positioning mechanism 500, the connecting member 520 can be provided with two first handles 522, and the two first handles 522 can be symmetrical about the center of the positioning ring 510, so as to facilitate the carrying of the operator.

[0097] Further optionally, the first positioning pin 640 and the second positioning pin 650 can both be of a tapered structure, so as to facilitate the embedding of the first positioning pin 640 in the first positioning groove 511 and the embedding of the second positioning pin 650 in the second positioning groove 512, and the processing of the first positioning pin 640 and the second positioning pin 650 is simple and the positioning is reliable. In some embodiments, the first positioning groove 511 and the second positioning groove 512 can both be strip-shaped grooves, and the strip-shaped grooves can extend along the radial direction of the positioning ring 510, so as to facilitate the adjustment of the positioning position of the first positioning pin 640 and the second positioning pin 650.

[0098] In an optional embodiment of the present application, the rotating plate 810 can be provided with a first positioning hole 8121 and a second positioning hole 8122, an axis of the first positioning hole 8121 can coincide with an axis of the machining station 110, and an axis of the second positioning hole 8122 can coincide with the preset point. In addition, the rotating measuring mechanism 800 can further include a positioning sleeve 850.

[0099] In the case where the axis of the first reference rod 620 coincides with the axis of the machining station 110, the positioning sleeve 850 can extend into the first positioning hole 8121 and be sleeved outside the first reference rod 620, and an outer wall of the positioning sleeve 850 can be in contact with a hole wall of the first positioning hole 8121, and an outer wall of the first reference rod 620 can be in contact with an inner wall of the positioning sleeve 850. In this way, whether the axis of the first reference rod 620 coincides with the axis of the machining station 110 can be determined by the cooperation of the positioning sleeve 850, the first positioning hole 8121 and the first reference rod 620, and then whether the center point of the base 200 coincides with the reference center point of the machining station 110 can be determined, so as to facilitate the adjustment of the position of the base 200.

[0100] In the case where the axis of the second reference rod 630 coincides with the preset point, the positioning sleeve 850 can extend into the second positioning hole 8122 and be sleeved outside the second reference rod 630, and an outer wall of the positioning sleeve 850 can be in contact with a hole wall of the second positioning hole 8122, and an outer wall of the second reference rod 630 can be in contact with an inner wall of the positioning sleeve 850. In this way, whether the axis of the second reference rod 630 coincides with the preset point can be determined by the cooperation of the positioning sleeve 850, the second positioning hole 8122 and the second reference rod 630, and then whether the measuring point of the base 200 coincides with the preset point can be determined, so as to determine whether the horizontal angle of the base 200 has been correctly positioned.

[0101] Specifically, the positioning sleeve 850 is installed in the first positioning hole 8121, and then the position of the base 200 is adjusted until the first reference rod 620 is installed in the positioning sleeve 850, at this time the positioning sleeve 850 positions the first positioning hole 8121 and the first reference rod 620, which indicates that the center point of the base 200 has been correctly positioned at this time.

[0102] The positioning sleeve 850 is installed in the second positioning hole 8122, and the horizontal angle of the base 200 is adjusted until the second reference rod 630 is installed in the positioning sleeve 850, at this time the positioning sleeve 850 positions the second positioning hole 8122 and the second reference rod 630, which indicates that the horizontal angle of the base 200 has been correctly positioned at this time.

[0103] In this way, the base 200 is facilitated to be adjusted, and during the adjustment, the position of the center and the horizontal angle of the base 200 do not need to be detected in real time, and the positions of the first reference rod 620 and the second reference rod 630 do not need to be additionally measured by the first measuring assembly 820 to determine whether the adjustment is in place, which is beneficial to simplify the measurement process.

[0104] In other embodiments, the first positioning hole 8121 and the second positioning hole 8122 can also not be arranged on the rotating plate 810, and the rotating measurement mechanism 800 can also not include the positioning sleeve 850. Specifically, during the adjustment of the base 200, the positions of the first reference rod 620 and the second reference rod 630 can be measured in real time by the first measuring assembly 820 to determine whether the base 200 is adjusted to be in place.

[0105] In optional embodiments of the present application, the rotating measurement mechanism 800 can further include a second measuring assembly 830, which can be arranged on the rotating plate 810. The second measuring assembly 830 can be used to measure the coaxiality of the rotating shaft 300 and the axis of the semiconductor process chamber (i.e., the center line of the semiconductor process chamber) and the perpendicularity of the rotating shaft 300 and the chamber reference surface 120 of the semiconductor process chamber. In this way, the rotating measurement mechanism 800 can automatically and accurately measure the perpendicularity of the rotating shaft 300 relative to the chamber reference surface 120 and the coaxiality of the rotating shaft 300 relative to the axis of the semiconductor process chamber, and then the rotating shaft 300 can be adjusted according to the measured coaxiality of the rotating shaft 300 and the axis of the semiconductor process chamber and the perpendicularity of the rotating shaft 300 and the chamber reference surface 120 of the semiconductor process chamber to ensure the installation and rotation accuracy of the rotating shaft 300, thereby avoiding that the rotating shaft 300 cannot accurately convey the workpiece to be processed due to a large installation error of the rotating shaft 300.

[0106] In optional embodiments, the chamber reference surface 120 can be provided with at least two chamber connecting holes 130, and the measuring device can further include at least two chamber pin shafts 900, each of which can be connected with each of the chamber connecting holes 130. Each of the chamber pin shafts 900 can be perpendicular to the chamber reference surface 120, and the distances from each of the chamber pin shafts 900 to the axis of the semiconductor process chamber can be the same.

[0107] For example, the semiconductor process chamber includes four processing stations 110, and the chamber reference surface 120 is provided with four chamber connecting holes 130. Any two processing stations 110 are provided with one chamber connecting hole 130, and the connecting line between the reference center of any processing station 110 and the center of the rotating robot is perpendicular to the connecting line between the two chamber connecting holes 130 adjacent to the processing station 110.

[0108] Optionally, the second measuring assembly 830 can include a robot coaxial detection element 831, which can be used to detect the horizontal distance between the axis of the rotating shaft 300 and the axis of each chamber pin shaft 900. In this way, by detecting the horizontal distance between the axis of each chamber pin shaft 900 and the axis of the rotating shaft 300, it can be determined whether the rotating shaft 300 of the rotating robot is coaxial with the axis of the semiconductor process chamber. Specifically, the rotating robot rotates the rotating plate 810 to rotate the robot coaxial detection element 831, and when the robot coaxial detection element 831 passes each chamber pin shaft 900, the horizontal distance between the axis of each chamber pin shaft 900 and the rotating shaft 300 can be measured. By comparing the horizontal distances between the axis of each chamber pin shaft 900 and the rotating shaft 300, if the horizontal distances are the same, it indicates that the rotating shaft 300 is coaxial with the axis of the semiconductor process chamber, and if the horizontal distances are different, it indicates that the rotating shaft 300 is not coaxial with the axis of the semiconductor process chamber.

[0109] Further optionally, the robot coaxial detection element 831 can be used to detect the minimum horizontal distance between the robot coaxial detection element 831 and the side wall of each chamber pin shaft 900, respectively, so as to determine whether the rotating shaft 300 is coaxial with the axis of the semiconductor process chamber by the difference between the minimum horizontal distances between the robot coaxial detection element 831 and the side wall of each chamber pin shaft 900. It should be noted that each chamber pin shaft 900 has the same structure and size.

[0110] In the present embodiment, the chamber pin shaft 900 can include a first portion 910 and a second portion 920 connected to the first portion 910. The first portion 910 can be embedded in the chamber connecting hole 130, and a radially protruding protrusion 930 can be arranged between the first portion 910 and the second portion 920. When the first portion 910 is embedded in the chamber connecting hole 130, the protrusion 930 abuts against the chamber reference surface 120 to ensure that the chamber pin shaft 900 is installed in place. Here, the second portion 920 is provided with a pin shaft measuring surface 921, which is located on the side of the chamber pin shaft 900 away from the center line (i.e., the axis) of the semiconductor process chamber. The robot coaxial detection element 831 can be used to detect the horizontal distance between the robot coaxial detection element 831 and the pin shaft measuring surface 921.

[0111] Here, the robot coaxial detection element 831 is used to detect the horizontal distance between the axis of each chamber pin shaft 900 and the axis of the rotating shaft 300, respectively, so as to determine whether the rotating shaft 300 is coaxial with the axis of the semiconductor process chamber. Compared with the method of connecting at least two chamber connecting holes 130 with a dial gauge and measuring the distance between the dial gauge and the side wall of the rotating shaft 300, the measurement accuracy is higher.

[0112] In other embodiments, the measuring device can also not include the chamber pin 900, and in particular, at least two dial gauges can be connected at the at least two chamber connecting holes 130, respectively, to measure the distance between the dial gauges and the sidewall of the rotating shaft 300, so as to determine whether the rotating shaft 300 is coaxial with the axis of the semiconductor process chamber by the distance difference between the at least two dial gauges and the sidewall of the rotating shaft 300 at different positions.

[0113] In optional embodiments, the second measuring assembly 830 can further include a robot level detection element 832, which can be used to detect the vertical distance between the rotating plate 810 and the chamber reference surface 120. In this way, since the rotating plate 810 is connected perpendicularly to the rotating shaft 300, the verticality of the rotating shaft 300 and the chamber reference surface 120, i.e., the levelness of the rotating plate 810, can be detected by detecting the vertical distance between the rotating plate 810 and the chamber reference surface 120 by the robot level detection element 832. In particular, the rotating plate 810 rotates one circle synchronously with the rotating robot, and the vertical distances between the rotating plate 810 and the chamber reference surface 120 at multiple positions during the rotation are measured, and the vertical distances measured are compared, for example, by comparing the maximum vertical distance and the minimum vertical distance, and the difference obtained therefrom can be used to determine whether the rotating shaft 300 is perpendicular to the chamber reference surface 120, so as to obtain the verticality of the rotating shaft 300 and the chamber reference surface 120.

[0114] It should be noted that the robot coaxial detection element 831 and the robot level detection element 832 described above can each be a distance sensor.

[0115] In optional embodiments of the present application, the measuring device can further include a level measuring mechanism 700, which can include a level measuring reference plate 720 and at least two level measuring elements 710. The level measuring elements 710 can be connected to the level measuring reference plate 720, the level measuring reference plate 720 can be used to be detachably arranged on the processing station 110, and the level measuring reference plate 720 can be parallel to the chamber reference surface 120 of the semiconductor process chamber. Each level measuring element 710 can be located at a different position of the processing station 110, and each level measuring element 710 can be in contact with the susceptor 200 at the processing station 110 and be used to measure the vertical distance between the level measuring reference plate 720 and the susceptor 200. In this way, the vertical distance between the level measuring reference plate 720 and the susceptor 200 can be measured by each level measuring element 710, and it can be determined whether the susceptor reference surface 203 of the susceptor 200 is parallel to the level measuring element 710, i.e., whether the susceptor reference surface 203 of the susceptor 200 is horizontal, so as to measure the levelness of the susceptor reference surface 203 of each susceptor 200. It should be noted that the susceptor reference surface 203 can be the upper surface of the susceptor 200.

[0116] In the embodiment, the horizontal measurement reference plate 720 can be provided with a horizontal measurement upper reference surface 721 and a horizontal measurement lower reference surface 722, the horizontal measurement upper reference surface 721 is parallel to the horizontal measurement lower reference surface 722, and the horizontal measurement lower reference surface 722 can be attached to the chamber reference surface 120, and the measurement end of the horizontal measurement member 710 can be in contact with the horizontal measurement upper reference surface 721.

[0117] Here, by measuring the vertical distance between the horizontal measurement reference plate 720 and the base reference surface 203 of the base 200 by the horizontal measurement member 710 to detect the levelness of the base reference surface 203 of the base 200, compared with the way of measuring the levelness of the base reference surface 203 of the base 200 by using a level, by measuring the vertical distance of multiple positions, a wider area can be covered, so that the levelness of the base reference surface 203 of the base 200 can be more comprehensively evaluated, and the multi-data-point measurement can reduce error accumulation and improve measurement accuracy.

[0118] In other embodiments, the measurement device can also not include the horizontal measurement mechanism 700, specifically, the operator can measure the levelness of the base reference surface 203 of the base 200 by using a level.

[0119] Optionally, two second handles 750 can be provided on the horizontal measurement reference plate 720, and the two second handles 750 can be oppositely arranged for the operator to hold. In this way, it is convenient for the operator to carry the horizontal measurement mechanism 700.

[0120] In optional embodiments, the horizontal measurement mechanism 700 can further include at least two supports 730, one end of each support 730 can be rotatably connected with the horizontal measurement reference plate 720, and each horizontal measurement member 710 can be respectively and liftably arranged at the other end of each support 730, and the rotation plane of the support 730 can be parallel to the horizontal measurement reference plate 720. In this way, it is convenient to adjust the position of the horizontal measurement member 710, and each horizontal measurement member 710 can also adapt to the height of the base 200.

[0121] Of course, one end of each support 730 can also be fixedly and non-detachably connected with the horizontal measurement reference plate 720, and each horizontal measurement member 710 can also be fixedly and non-detachably arranged at the other end of each support 730.

[0122] Optionally, one end of each support 730 can be connected with the horizontal measurement reference plate 720 through a rotating shaft, which can be a support fixing screw 740; the other end of each support 730 can be provided with a clamp, each clamp clamping each horizontal measurement member 710, and the clamp can tightly hold or release the horizontal measurement member 710; when the height of the horizontal measurement member 710 needs to be adjusted, the clamp can be released, then the horizontal measurement member 710 is moved up and down, and after the adjustment is completed, the horizontal measurement member 710 is tightly held. The horizontal measurement member 710 can be a dial gauge or a micrometer.

[0123] When the base reference surface 203 of the base 200 is measured horizontally, first, the support fixing screw 740 is loosened and the support 730 is rotated, so that the measurement end of the horizontal measurement member 710 contacts the horizontal measurement reference plate 720, the support fixing screw 740 is tightened and the measurement result of the horizontal measurement member 710 is zeroed, that is, the zeroing operation is completed; then, the support fixing screw 740 is loosened again, the support 730 is rotated, the horizontal measurement member 710 is rotated to the range of the base reference surface 203 of the base 200, the support fixing screw 740 is tightened again and the height of the horizontal measurement member 710 is adjusted, so that the measurement end of the horizontal measurement member 710 contacts the base reference surface 203 of the base 200, at this time the measurement result of the horizontal measurement member 710 is the vertical distance between the base reference surface 203 of the base 200 and the horizontal measurement reference plate 720. The difference between the measurement results of each horizontal measurement member 710 can obtain the levelness of the base reference surface 203 of the base 200.

[0124] Optionally, the rotation measurement mechanism 800 can further include a power supply 840, which can be arranged on the rotating plate 810, and the power supply 840 can be electrically connected with the first measurement assembly 820 and the second measurement assembly 830 respectively, so as to supply power to the first measurement assembly 820 and the second measurement assembly 830. Here, the power supply 840 can be a rechargeable mobile power supply.

[0125] Further optionally, the rotation measurement mechanism 800 can further include a display component, which can be arranged on the rotating plate 810, and the display component can be in communication connection with the first measurement assembly 820 and the second measurement assembly 830 respectively, so as to display the measurement results of the first measurement assembly 820 and the second measurement assembly 830. Here, the display component can be a display table.

[0126] Based on the measuring device provided in the embodiments of the present application, the embodiments of the present application further provide a semiconductor process equipment. The semiconductor process equipment can include a semiconductor process chamber and the measuring device according to any one of the above embodiments. The semiconductor process chamber can include a chamber body 100, a rotary robot, and at least two processing stations 110 arranged uniformly along the circumference of the rotary shaft 300 of the rotary robot, and each processing station 110 is provided with a susceptor 200. The rotary robot is rotatably arranged on the chamber body 100 and can be coaxially arranged with the chamber body 100. The chamber body 100 can be provided with a chamber reference surface 120, which can be perpendicular to the axis of the chamber body 100. The rotary measuring mechanism 800 of the measuring device can be connected with the rotary robot and synchronously rotate with the rotary robot.

[0127] The semiconductor process equipment provided in the embodiments of the present application has the same beneficial effects as the measuring device provided in the embodiments of the present application, and thus will not be described here.

[0128] In optional embodiments, the chamber reference surface 120 can be provided with at least two chamber connecting holes 130. The axis of the chamber connecting hole 130 can be perpendicular to the chamber reference surface 120, and the horizontal distance between each chamber connecting hole 130 and the axis of the chamber body 100 can be the same.

[0129] The measuring device can further include at least two chamber pin shafts 900 and a second measuring assembly 830. The measuring device can further include a chamber positioning mechanism 500, which includes a connecting piece 520 arranged along the circumference of the processing station 110.

[0130] In the case where the second measuring assembly 830 measures the coaxiality of the rotary shaft 300 and the axis of the semiconductor process chamber, each chamber pin shaft 900 can be connected with each chamber connecting hole 130, respectively.

[0131] In the case where the chamber positioning mechanism 500 is connected with the chamber reference surface 120, the connecting piece 520 is connected with the chamber connecting hole 130 adjacent to the processing station 110.

[0132] In this way, the chamber pin shaft 900 and the chamber positioning mechanism 500 can share the chamber connecting hole 130, and thus it is not necessary to open more connecting holes or provide additional connecting components or connecting structures on the chamber reference surface 120, which is conducive to simplifying the structure of the semiconductor process chamber.

[0133] In other embodiments, in the case where the chamber positioning mechanism 500 is connected with the chamber reference surface 120, the connecting piece 520 can not be connected with the chamber connecting hole 130. Specifically, the chamber reference surface 120 can be additionally provided with a mounting hole for connecting the connecting piece 520.

[0134] In an optional embodiment, the semiconductor processing apparatus can further include at least two base adjusting mechanisms 400, each of the base adjusting mechanisms 400 is configured to support a base 200, each of the base adjusting mechanisms 400 can be movably disposed on the chamber body 100 by a first connecting member 410, and each of the first connecting members 410 can be movably connected with the chamber body 100, the first connecting members 410 can be moved relative to the chamber body 100 along a third direction, each of the base adjusting mechanisms 400 can be movably connected with the base 200, each of the bases 200 can be moved relative to the base adjusting mechanisms 400 along a fourth direction, and the third direction and the fourth direction are intersected. In this way, the base 200 can be adjusted from the third direction and the fourth direction, so as to adjust the base 200 to a reference position. Here, the base adjusting mechanisms 400 can be connected with the bases 200 by second connecting members 420, and the second connecting members 420 can be adjusting screws, and the height of the base 200 can be adjusted by rotating the adjusting screws. It should be noted that the third direction can be the same as the first direction described above, and both can be transverse, and the fourth direction can be the same as the second direction described above, and both can be longitudinal, of course, the third direction can be different from the first direction, and the fourth direction can be different from the second direction, specifically, the third direction can be the radial direction of the processing station, and the fourth direction can be perpendicular to the third direction. Further optionally, the base 200 can be rotatably connected with the second connecting member 420, so as to adjust the angle of the base 200.

[0135] In an optional embodiment, the semiconductor processing apparatus can further include at least two base adjusting mechanisms 400, each of the base adjusting mechanisms 400 is configured to support a base 200, each of the base adjusting mechanisms 400 can be movably disposed on the chamber body 100 by a first connecting member 410, and each of the first connecting members 410 can be movably connected with the chamber body 100, the first connecting members 410 can be moved relative to the chamber body 100 along a third direction, each of the base adjusting mechanisms 400 can be movably connected with the base 200, each of the bases 200 can be moved relative to the base adjusting mechanisms 400 along a fourth direction, and the third direction and the fourth direction are intersected. In this way, the base 200 can be adjusted from the third direction and the fourth direction, so as to adjust the base 200 to a reference position. Here, the base adjusting mechanisms 400 can be connected with the bases 200 by second connecting members 420, and the second connecting members 420 can be adjusting screws, and the height of the base 200 can be adjusted by rotating the adjusting screws. It should be noted that the third direction can be the same as the first direction described above, and both can be transverse, and the fourth direction can be the same as the second direction described above, and both can be longitudinal, of course, the third direction can be different from the first direction, and the fourth direction can be different from the second direction, specifically, the third direction can be the radial direction of the processing station, and the fourth direction can be perpendicular to the third direction. Further optionally, the base 200 can be rotatably connected with the second connecting member 420, so as to adjust the angle of the base 200.

[0136] The measurement process of the measurement device provided by the embodiments of the present application is as follows:

[0137] Firstly, as Figure 22As shown, the chamber pin 900 is installed into the chamber connection hole 130, and the rotary measuring mechanism 800 is installed on the rotary manipulator, with the rotary measuring mechanism 800 sleeved around the rotary shaft 300, so that the rotary shaft 300 passes through the rotary plate center hole 811 on the rotary plate 810 and the two are fixedly connected. Then, the rotary manipulator drives the rotary measuring mechanism 800 to rotate, causing the manipulator coaxial detection element 831 to measure the distance between it and each chamber pin 900. Based on the difference in the distance between the manipulator coaxial detection element 831 and each chamber pin 900, it can be determined whether the axis of the rotary shaft 300 and the chamber body 100 of the semiconductor process chamber are coaxial. At the same time, during the rotation of the rotary manipulator, the manipulator horizontal detection element 832 measures the vertical distance between it and each position on the chamber reference plane 120. Based on the difference between the maximum and minimum vertical distance measured by the manipulator horizontal detection element 832, it can be determined whether the rotary shaft 300 is perpendicular to the chamber reference plane 120.

[0138] like Figure 23 As shown, the horizontal measuring mechanism 700 is placed at the first station 111. The horizontal measuring reference surface 722 of the horizontal measuring reference plate 720 of the horizontal measuring mechanism 700 is in contact with the chamber reference surface 120, so that the measuring end of the horizontal measuring component 710 is within the range of the base reference surface 203 of the base 200. Loosen the bracket fixing screw 740 and rotate the bracket 730 so that the measuring end of the horizontal measuring component 710 contacts the horizontal measuring reference plate 720. Tighten the bracket fixing screw 740 and return the measurement result of the horizontal measuring component 710 to the center. Zeroing is completed; then, loosen the bracket fixing screw 740 again, rotate the bracket 730, and rotate the horizontal measuring component 710 to the range of the base reference surface 203 of the base 200. Tighten the bracket fixing screw 740 again and adjust the height of the horizontal measuring component 710 so that the measuring end of the horizontal measuring component 710 contacts the base reference surface 203 of the base 200. At this time, the measurement result of the horizontal measuring component 710 is the vertical distance between the base reference surface 203 of the base 200 and the horizontal measuring reference plate 720. The levelness of the base reference surface 203 of the base 200 can be obtained by the difference between the measurement results of each horizontal measuring component 710.

[0139] After adjusting the rotating shaft 300 according to the measured coaxiality and levelness, and adjusting the levelness of the base reference surface 203 of the base 200, as follows: Figure 24As shown, the chamber positioning mechanism 500 is placed at the first station 111, and the connecting pins 521 on the connecting piece 520 of the chamber positioning mechanism 500 are connected to the two adjacent chamber connecting holes 130 of the first station 111 respectively, and the connecting piece 520 is made to fit against the chamber reference surface 120. At this time, the axis of the positioning ring 510 of the chamber positioning mechanism 500 coincides with the reference center of the first station 111, and the axis of the first positioning groove 511 on the positioning ring 510 coincides with the preset point.

[0140] Then, as Figure 25 As shown, the base positioning mechanism 600 is placed at the first station 111, with the first positioning pin 640 on the positioning member 610 of the base positioning mechanism 600 connected to the first positioning groove 511, and the second positioning pin 650 connected to the second positioning groove 512 on the positioning ring 510. At this time, the axis of the first reference rod 620 coincides with the reference center of the first station 111, and the axis of the second reference rod 630 coincides with the preset point, that is, the axis of the second reference rod 630 can be connected through the line connecting the center of the semiconductor process chamber and the reference center of the first station 111. At this time, the axis of the first reference rod 620 coincides with the ideal center of the base 200, that is, it coincides with the ideal center point of the workpiece on the base 200.

[0141] Then, as Figure 26 As shown, the rotary measuring mechanism 800 is mounted on and fixed to the rotary manipulator. The orthographic projection of the rotation center of the rotary measuring mechanism 800 coincides with the center of the semiconductor process chamber. The rotary manipulator rotates to a position where the axis of the first positioning hole 8121 coincides with the axis of the first reference rod 620. The positioning sleeve 850 is then inserted into the first positioning hole 8121 and fitted over the first reference rod 620. At this point, the outer diameter of the positioning sleeve 850 contacts the wall of the first positioning hole 8121, and the inner wall of the positioning sleeve 850 contacts the outer wall of the first reference rod 620. The center of the chamber positioning mechanism 500... When the center of the first positioning hole 8121 is coincident, the position of the rotating measuring mechanism 800 is the reference measurement position of the first station 111. The position of the rotating manipulator is locked and the positioning sleeve 850 is removed. The measurement values ​​of the first direction measuring element 8211, the second direction measuring element 8212 and the second measuring element 822 are the reference values. For ease of calculation, the measurement values ​​of the first direction measuring element 8211, the second direction measuring element 8212 and the second measuring element 822 can be zeroed at this time, and the reference measurement position of the rotating manipulator in the first station 111 can be recorded by software.

[0142] Next, rotate the robotic arm 90 degrees, remove the base positioning mechanism 600 and the chamber positioning mechanism 500, and then... Figure 27As shown, the base positioning mechanism 600 is placed on the base 200 at the first station 111, so that the first positioning pin 640 is connected with the first base positioning slot 201, and the second positioning pin 650 is connected with the second base positioning slot 202, that is, the first positioning pin 640 coincides with the position of the first base positioning slot 201 and is positioned by the first reference positioning pin, and the second positioning pin 650 coincides with the position of the second base positioning slot 202 and is positioned by the second reference positioning pin. At this time, the axis of the first reference rod 620 coincides with the center of the base 200, and the axis of the second reference rod 630 coincides with the measurement point on the base 200. The rotating manipulator drives the rotating measurement mechanism 800 to rotate to the reference measurement position of the first station 111, and the first direction measurement element 8211 and the second direction measurement element 8212 measure the position of the first reference rod 620, and the second measurement element 822 measures the position of the second reference rod 630. Then, according to the first direction measurement element 8211, the second direction measurement element 8212 and the second measurement element 822, the deviation of the center point of the base 200 from the reference center point of the first station 111 and the horizontal angle deviation of the base 200 from the first station 111 can be obtained.

[0143] If the measurement values of the first direction measurement element 8211, the second direction measurement element 8212 and the second measurement element 822 deviate from the reference values, the base 200 needs to be adjusted. The positioning sleeve 850 is installed in the first positioning hole 8121, and the position of the base 200 is adjusted until the first reference rod 620 can be inserted into the positioning sleeve 850. At this time, the positioning sleeve 850 positions the first positioning hole 8121 and the first reference rod 620, which indicates that the center point of the base 200 at this time has been correctly positioned.

[0144] The positioning sleeve 850 is installed in the second positioning hole 8122, and the horizontal angle of the base 200 is adjusted until the second reference rod 630 is inserted into the positioning sleeve 850. At this time, the positioning sleeve 850 positions the second positioning hole 8122 and the second reference rod 630, which indicates that the horizontal angle of the base 200 at this time has been correctly positioned.

[0145] After that, the base 200 is fixed, the positioning sleeve 850 is removed, and the measurement values of the first direction measurement element 8211, the second direction measurement element 8212 and the second measurement element 822 are read again to check whether the center position and angle values of the base 200 are correct.

[0146] Finally, the base positioning mechanism 600 is placed on the base 200 at the second station 112, the third station 113 and the fourth station 114 in turn, and the above steps are repeated to calibrate the center and angle of the base 200 at the second station 112, the third station 113 and the fourth station 114.

[0147] The embodiments of the present application are described above with reference to the accompanying drawings, but the present application is not limited to the specific embodiments described above, and the specific embodiments described above are merely illustrative, but not restrictive, and a person of ordinary skill in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims.

Claims

1. A measuring device applied in a semiconductor process chamber, the semiconductor process chamber comprising a rotary manipulator and at least two processing stations (110) uniformly arranged circumferentially along the rotation axis (300) of the rotary manipulator, and each of the processing stations (110) being provided with a base (200), characterized in that, The measuring device includes a rotating measuring mechanism (800), which comprises: A rotating plate (810) is used to connect to the rotating manipulator and to rotate with the rotating manipulator between the processing stations (110). A first measuring component (820) is disposed on the rotating plate (810) and is used to measure the position of the center of each of the bases (200).

2. The measuring device according to claim 1, characterized in that, The measuring device further includes a base positioning mechanism (600), which includes a positioning element (610) and a first reference rod (620). The first reference rod (620) is disposed on the positioning element (610) and coaxially disposed with the positioning element (610). The positioning element (610) is used to connect with the base (200) or the cavity reference surface (120) of the semiconductor process cavity, and the first measuring component (820) is used to measure the position of the first reference rod (620). When the positioning member (610) is connected to the base (200), the axis of the first reference rod (620) coincides with the axis of the base (200); When the positioning element (610) is connected to the cavity reference surface (120), the axis of the first reference rod (620) coincides with the axis of the machining station (110).

3. The measuring device according to claim 2, characterized in that, The base positioning mechanism (600) further includes a second reference rod (630), which is disposed on the positioning member (610), and the first measuring component (820) is also used to measure the position of the second reference rod (630); When the positioning element (610) is connected to the base (200), the axis of the second reference rod (630) coincides with the measuring point; When the positioning element (610) is connected to the chamber reference surface (120), the axis of the second reference rod (630) coincides with the preset point; The measurement point is a point on the base (200) that is off from the center point of the base (200), and the preset point is a point that is off from the reference center point of the processing station (110). When the center point of the base (200) coincides with the reference center point, the measurement point coincides with the preset point.

4. The measuring device according to claim 3, characterized in that, The base (200) is provided with a first base positioning groove (201). When the center point of the base coincides with the reference center point, the projections of the center of the first base positioning groove (201), the center of the base (200), and the center of the semiconductor process chamber on the chamber reference plane (120) are on the same straight line. The base positioning mechanism (600) is provided with a first positioning pin (640), which can be embedded in the first base positioning groove (201), and the axis of the first positioning pin (640), the center of the first base positioning groove (201) coincides with the axis of the second reference rod (630).

5. The measuring device according to claim 4, characterized in that, The base (200) is also provided with at least one second base positioning groove (202), and each second base positioning groove (202) and the first base positioning groove (201) are distributed at intervals along the circumference of the base (200); The base positioning mechanism (600) is also provided with at least one second positioning pin (650), which can be embedded in the second base positioning groove (202).

6. The measuring device according to claim 3, characterized in that, It also includes a chamber positioning mechanism (500), which includes a positioning ring (510) and a connector (520) connected to the positioning ring (510). The connector (520) is used to connect to and be parallel to the chamber reference plane (120); The positioning ring (510) is used to be set at the processing station (110), and the axis of the positioning ring (510) coincides with the axis of the processing station (110). The positioning element (610) is coaxially connected with the positioning ring (510).

7. The measuring device according to claim 6, characterized in that, The positioning ring (510) is provided with a first positioning groove (511). When the positioning ring (510) is located at the processing station (110), the center of the positioning ring (510), the center of the first positioning groove (511) and the center of the semiconductor process chamber are projected onto the chamber reference plane (120) on the same straight line. The positioning component (610) is provided with a first positioning pin (640), which is coaxially arranged with the second reference rod (630) and is used to be embedded in the first positioning groove (511).

8. The measuring device according to claim 7, characterized in that, The positioning ring (510) is also provided with at least one second positioning groove (512), and the second positioning groove (512) and the first positioning groove (511) are distributed at intervals along the circumference of the positioning ring (510); The positioning member (610) is also provided with at least one second positioning pin (650). When the positioning ring (510) is located at the processing station (110), the second positioning pin (650) is embedded in the second positioning groove (512).

9. The measuring device according to claim 3, characterized in that, The rotating plate (810) is provided with a first positioning hole (8121) and a second positioning hole (8122). The axis of the first positioning hole (8121) can coincide with the axis of the processing station (110), and the axis of the second positioning hole (8122) can coincide with the preset point. The rotary measuring mechanism (800) further includes a positioning sleeve (850). When the axis of the first reference rod (620) coincides with the axis of the machining station (110), the positioning sleeve (850) can extend into the first positioning hole (8121) and be sleeved on the outside of the first reference rod (620). The outer wall of the positioning sleeve (850) contacts the hole wall of the first positioning hole (8121), and the outer wall of the first reference rod (620) contacts the inner wall of the positioning sleeve (850). When the axis of the second reference rod (630) coincides with the preset point, the positioning sleeve (850) can extend into the second positioning hole (8122) and be sleeved on the outside of the second reference rod (630), and the outer wall of the positioning sleeve (850) contacts the hole wall of the second positioning hole (8122), and the outer wall of the second reference rod (630) contacts the inner wall of the positioning sleeve (850).

10. The measuring device according to claim 1, characterized in that, The rotating measuring mechanism (800) further includes a second measuring component (830), which is disposed on the rotating plate (810). The second measuring component (830) is used to measure the coaxiality of the rotating shaft (300) and the axis of the semiconductor process chamber, as well as the perpendicularity of the rotating shaft (300) and the chamber reference plane (120) of the semiconductor process chamber.

11. The measuring device according to claim 10, characterized in that, At least two chamber connection holes (130) are provided on the chamber reference plane (120); The measuring device further includes at least two chamber pins (900), each chamber pin (900) is connected to each chamber connection hole (130), each chamber pin (900) is perpendicular to the chamber reference plane (120), and each chamber pin (900) is equidistant from the axis of the semiconductor process chamber. The second measuring component (830) includes a coaxial detection element (831) for detecting the horizontal distance between the axis of the rotating shaft (300) and the axis of each of the chamber pins (900).

12. The measuring device according to claim 10, characterized in that, The second measuring component (830) includes a robot arm horizontal detection element (832) for detecting the vertical distance between the rotating plate (810) and the chamber reference plane (120).

13. The measuring device according to claim 1, characterized in that, The measuring device further includes a horizontal measuring mechanism (700), which includes a horizontal measuring reference plate (720) and at least two horizontal measuring elements (710) connected to the horizontal measuring reference plate (720). The horizontal measuring reference plate (720) is detachably mounted on the processing station (110). The horizontal measuring reference plate (720) is parallel to the cavity reference plane (120) of the semiconductor process chamber. Each of the horizontal measuring elements (710) is located at a different position on the processing station (110), and each of the horizontal measuring elements (710) is in contact with the base (200) at the processing station (110) and is used to measure the vertical distance between the horizontal measuring reference plate (720) and the base (200).

14. The measuring device according to claim 13, characterized in that, The horizontal measuring mechanism (700) further includes at least two supports (730), one end of each support (730) is rotatably connected to the horizontal measuring reference plate (720), and each horizontal measuring component (710) is respectively vertically and vertically disposed at the other end of each support (730), and the rotation plane of the support (730) is parallel to the horizontal measuring reference plate (720).

15. A semiconductor process apparatus, characterized in that, The device includes a semiconductor process chamber and a measuring device according to any one of claims 1-14. The semiconductor process chamber includes a chamber body (100), a rotary manipulator, and at least two processing stations (110) uniformly arranged circumferentially along the rotation axis of the rotary manipulator. Each processing station (110) is provided with a base (200). The rotary manipulator is rotatably disposed on the chamber body (100) and coaxially disposed with the chamber body (100). The chamber body (100) is provided with a chamber reference surface (120), which is perpendicular to the axis of the chamber body (100). The rotating measuring mechanism (800) of the measuring device is used to connect with the rotary manipulator.

16. The semiconductor process equipment according to claim 15, characterized in that, At least two chamber connection holes (130) are provided on the chamber reference plane (120). The axis of the chamber connection hole (130) is perpendicular to the chamber reference plane (120), and the horizontal distance between each chamber connection hole (130) and the axis of the chamber body (100) is the same. The measuring device also includes at least two chamber pins (900) and a second measuring component (830). The measuring device further includes a chamber positioning mechanism (500), which includes a connector (520) for being arranged circumferentially along the processing station (110); When the second measuring component (830) measures the coaxiality of the rotating shaft (300) and the axis of the semiconductor process chamber, each chamber pin (900) is connected to each chamber connecting hole (130); When the chamber positioning mechanism (500) is connected to the chamber reference surface (120), the connector (520) is connected to the chamber connection hole (130) adjacent to the machining station (110).

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