A semiconductor circuit module and a manufacturing method thereof

Abstract

The application is suitable for the field of semiconductor technology, and particularly relates to a semiconductor circuit module and a manufacturing method thereof. Compared with the prior art, the application adopts a metal pin support as a fixed pin mode, and multiple pin mounting holes are arranged above the metal pin support according to the semiconductor circuit safety requirement, so that different pin schemes inside the semiconductor circuit can be installed and replaced at any time, the product design flexibility is improved, and the development cost is reduced. The application realizes stress-free packaging, solves the problem of insulation layer delamination of the semiconductor circuit in the industry, and improves the reliability of the semiconductor circuit. The seamless switching between the semi-encapsulation structure and the full encapsulation structure can be realized without changing the mold carrier, which not only reduces the cost and improves the efficiency, but also greatly improves the flexibility of the product. The test process and the test seat loss are reduced, and the design structure of the test process and the test seat is simplified.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a semiconductor circuit module and its manufacturing method. Background Technology

[0002] The semiconductor circuit, or Modular Intelligent Power System (MIPS), not only integrates power switching devices and drive circuits, but also incorporates fault detection circuits for overvoltage, overcurrent, and overheating, and can send the detection signals to the CPU or DSP for interrupt processing. It consists of high-speed, low-power dies, optimized gate-level drive circuits, and fast protection circuits. Even in the event of a load fault or improper use, the MIPS itself remains undamaged. MIPS typically uses IGBTs as power switching elements and integrates current sensors and drive circuits within its structure.

[0003] The existing MIPS modular intelligent power system integrates low-voltage control circuits such as IC drive control circuits, MIPS sampling amplification circuits, and PFC current protection circuits with inverter circuits composed of high-voltage semiconductor circuit modules on the same board. At the same time, the existing MIPS modular intelligent power systems only integrate a single MIPS module. Integration of multiple MIPS modular intelligent power systems has not yet been achieved. In the face of market competition for miniaturization and low cost, higher requirements are placed on the high integration and heat dissipation technology of MIPS modular intelligent power systems.

[0004] Therefore, there is an urgent need for a new semiconductor circuit module and its manufacturing method to solve the above problems. Summary of the Invention

[0005] This invention proposes a semiconductor circuit module and its manufacturing method, aiming to solve the problem of insulation layer delamination in existing semiconductor circuits, improve the reliability of semiconductor circuits, and allow for easy installation and replacement according to different pin schemes inside the semiconductor circuit, thereby increasing product design flexibility and reducing development costs.

[0006] In a first aspect, the present invention provides a semiconductor circuit module, the semiconductor circuit module comprising a metal substrate; a plurality of circuit components disposed at a predetermined position on the metal substrate; bonding metal wires for realizing electrical connection between the plurality of circuit components; and an encapsulation body covering the metal substrate;

[0007] The metal substrate is configured with multiple internal input / output pin connection points and multiple external input / output pin connection points. The package body has through-holes at corresponding positions above the internal and external input / output pin connection points.

[0008] The semiconductor circuit module also includes an electronic control board, on which a metal pin bracket is fixed. The package is fixedly connected to the electronic control board through the metal pin bracket. The metal pin bracket has multiple pin mounting holes, and multiple metal pin posts are inserted into the pin mounting holes. One end of the metal pin post passes through the through hole and is inserted into the internal input / output pin connection position or the external input / output pin connection position. The other end of the metal pin post is electrically connected to the electronic control board.

[0009] Preferably, the metal pin post is made of C194 (-1 / 2H) copper alloy or KFC (-1 / 2H) copper alloy.

[0010] Preferably, the metal pin post is formed by stamping a 0.5mm copper plate through machining to form a pin welding part semi-finished product, and then the surface of the pin welding part semi-finished product is successively plated with nickel with a thickness of 0.1-0.5um and tin with a thickness of 2-5um.

[0011] Preferably, the metal pin post includes a first connecting part, a fixing part, and a second connecting part. One end of the first connecting part is connected to the internal input / output pin connection position or the external input / output pin connection position. The other end of the first connecting part is connected to the fixing part. The end of the fixing part away from the first connecting part is connected to the second connecting part. The end of the second connecting part away from the fixing part is connected to the electronic control board. The fixing part is used to fix the pin mounting hole.

[0012] Preferably, the metal lead bracket includes a first metal lead bracket and a second metal lead bracket, which are respectively fixed to opposite sides of the package.

[0013] Preferably, the metal substrate includes a metal substrate, an insulating layer, a copper foil layer, and a protective layer. The insulating layer is attached to one side of the metal substrate, the copper foil layer is pressed onto the side of the insulating layer away from the metal substrate, and the protective layer is attached to the side of the copper foil layer away from the insulating layer.

[0014] Preferably, the circuit wiring layer is formed by etching the copper foil layer.

[0015] Preferably, the circuit components include surface mount capacitors, surface mount resistors, and other components, which are respectively mounted on the metal substrate.

[0016] Secondly, the present invention also provides a method for manufacturing a semiconductor circuit module as described in the above embodiments, the method comprising the following steps:

[0017] S1. The metal substrate is placed on a special carrier by automated equipment or manual labor.

[0018] S2. The semiconductor inverter circuit chip is mounted onto the component mounting position reserved in the copper foil layer of the metal substrate by applying solder paste or applying silver glue through an automatic die bonding device.

[0019] S3. High-voltage power devices are mounted onto silver-plated copper heat sinks using a soft solder die bonder to form semi-finished components.

[0020] S4. Using an automated surface mount technology (SMT) device to reduce resistance and capacitance, the semi-finished components are mounted onto the component mounting positions.

[0021] S5. The lead frame is placed on the corresponding welding position of the metal substrate by a robot or manually, the metal substrate including the special carrier is passed through the reflow oven, and all the circuit components are welded to the corresponding mounting positions.

[0022] S6. The soldering quality of the circuit components is inspected by visual inspection AOI equipment, and flux and aluminum shavings remaining on the metal substrate are removed by spraying and ultrasonication.

[0023] S7. The circuit components and the circuit wiring layer are electrically connected through the bonding metal wire;

[0024] S8. The metal substrate circuit is encapsulated in a specific mold using packaging equipment, and then marked by laser marking.

[0025] S9. Post-curing stress relief treatment is carried out in a high-temperature oven, and electrical parameters are tested.

[0026] S10. Install the metal pin bracket on the electronic control board. According to the semiconductor circuit pin scheme, place and fix the metal pin post on the corresponding pin mounting hole of the metal pin bracket, so that one end of the metal pin post is connected to the electronic control board and the other end is connected to the metal substrate, thereby realizing the installation and manufacturing of the semiconductor circuit module.

[0027] Compared with existing technologies, this invention uses a metal lead frame as the fixing method for the leads, and multiple lead mounting holes are set on the metal lead frame according to semiconductor circuit safety regulations. This allows for easy installation and replacement of leads according to different internal semiconductor circuit configurations, improving product design flexibility and reducing development costs. It achieves stress-free packaging, solving the insulation layer delamination problem common in the semiconductor industry and improving the reliability of semiconductor circuits. While addressing stress issues, it also solves the problems of lead frame and substrate adhesive overflow. Furthermore, it allows for seamless switching between semi-encapsulated and fully encapsulated structures without changing the mold carrier, not only reducing costs and increasing efficiency but also significantly enhancing product flexibility. The semiconductor circuit module of this invention is designed as a hidden, pinless structure, and the input / output positions are not encapsulated. External contact with the input / output positions is achieved through conductive metal materials. This reduces wear on the test socket during the testing process and simplifies its design (existing solutions require complex clamping devices to clamp and fix the pins, increasing the contact force and leading to wear and tear, resulting in a short lifespan and increased costs). Furthermore, the hidden, pinless semiconductor circuit structure of this invention effectively prevents failures caused by external static electricity. Attached Figure Description

[0028] The present invention will now be described in detail with reference to the accompanying drawings. The above and other aspects of the present invention will become clearer and more readily understood through the detailed description following the accompanying drawings. In the drawings:

[0029] Figure 1 This is a schematic diagram of the metal pin post structure of the semiconductor circuit module provided in an embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram of the metal substrate structure of the semiconductor circuit module provided in an embodiment of the present invention;

[0031] Figure 3 This is a three-dimensional structural diagram of the package of the semiconductor circuit module provided in an embodiment of the present invention;

[0032] Figure 4 This is a schematic diagram of the metal substrate of the semiconductor circuit module provided in an embodiment of the present invention from another perspective;

[0033] Figure 5 This is a three-dimensional structural diagram of the metal substrate of the semiconductor circuit module provided in an embodiment of the present invention;

[0034] Figure 6 This is a schematic diagram of the placement structure of the metal substrate of the semiconductor circuit module provided in an embodiment of the present invention.

[0035] Figure 7 This is a schematic diagram of the metal pin support mounting structure of the semiconductor circuit module provided in an embodiment of the present invention. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0037] Please refer to Figures 1-7 In a first aspect, the present invention provides a semiconductor circuit module, the semiconductor circuit module comprising a metal substrate 1; a plurality of circuit components (not shown in the figure) disposed at a predetermined position on the metal substrate 1; bonding metal wires 12 for realizing electrical connection between the plurality of circuit components; and a package 11 covering the metal substrate 1.

[0038] The metal substrate 1 is configured with multiple internal input / output pin connection points 001 and multiple external input / output pin connection points 002. The package 11 has through holes 16 at corresponding positions above the internal input / output pin connection points 001 and the external input / output pin connection points 002.

[0039] The semiconductor circuit module also includes an electronic control board 15, on which a metal pin bracket 13 is fixed. The package 11 is fixedly connected to the electronic control board 15 via the metal pin bracket 13. The metal pin bracket 13 has multiple pin mounting holes, and multiple metal pin posts 10 are inserted into the pin mounting holes. One end of each metal pin post 10 passes through the through hole 16 and is inserted into the internal input / output pin connection position 001 or the external input / output pin connection position 002. The other end of the metal pin post 10 is electrically connected to the electronic control board 15. The electronic control board 15 is the control center of the entire terminal electrical appliance.

[0040] In this embodiment of the invention, the metal lead post 10 is made of C194(-1 / 2H) copper alloy or KFC(-1 / 2H) copper alloy. Specifically, the material is C194(-1 / 2H) (chemical composition: Cu(≧97.0)Fe:2.4P:0.03Zn:0.12) or KFC(-1 / 2H) (chemical composition: Cu(≧99.6)Fe:0.1(0.05~0.15)P:0.03(0.025~0.04)). The metal lead post 10 is formed by stamping a 0.5mm copper plate to form a lead welding part semi-finished product. Then, the surface of the lead welding part semi-finished product is successively plated with nickel with a thickness of 0.1-0.5um and tin with a thickness of 2-5um.

[0041] In this embodiment of the invention, the metal pin post 10 includes a first connecting portion 101, a fixing portion 102, and a second connecting portion 103. One end of the first connecting portion 101 is connected to the internal input / output pin connection position 001 or the external input / output pin connection position 002. The other end of the first connecting portion 101 is connected to the fixing portion 102. The end of the fixing portion 102 away from the first connecting portion 101 is connected to the second connecting portion 103. The end of the second connecting portion 103 away from the fixing portion 102 is connected to the electronic control board 15. The fixing portion 102 is used to fix and connect with the pin mounting hole to achieve an interference fit with the pin mounting hole, thereby fixing the metal pin post 10.

[0042] In this embodiment of the invention, the metal pin support 13 includes a first metal pin support 131 and a second metal pin support 132. The first metal pin support 131 and the second metal pin support 132 are respectively fixed on opposite sides of the package body 11, and both the first metal pin support 131 and the second metal pin support 132 are provided with pin mounting holes. This not only better supports the semiconductor circuit, but also meets the pin output scheme on both sides of the semiconductor circuit.

[0043] In this embodiment of the invention, the metal substrate 1 includes a metal substrate 01, an insulating layer 02, a copper foil layer 03, and a protective layer 04. The insulating layer 02 is attached to one side of the metal substrate 01, the copper foil layer 03 is pressed onto the side of the insulating layer 02 away from the metal substrate 01, and the protective layer 04 is attached to the side of the copper foil layer 03 away from the insulating layer 02. The metal substrate 01 serves as the carrier of the entire internal circuit of the semiconductor circuit and also provides heat dissipation for the entire semiconductor circuit. The insulating layer 02 prevents short circuits and leakage risks caused by electrical contact between the circuit wiring layer and the metal substrate. The copper foil layer 03 is formed by etching the copper foil layer to create the desired circuit, thus forming the circuit wiring layer. The protective layer 04, also known as a solder mask, prevents soldering in inappropriate areas, increases the withstand voltage between circuits, prevents short circuits caused by circuit oxidation or contamination, and protects the circuit.

[0044] In this embodiment of the invention, the circuit wiring layer is formed by etching the copper foil layer 03.

[0045] In this embodiment of the invention, the circuit components include a surface-mount capacitor 05, a surface-mount resistor 06, and a component 07, which are respectively mounted on the metal substrate 1. The surface-mount resistor 06 is connected at the gate of the IGBT chip in the semiconductor circuit, limiting the IGBT switching speed through current limiting. The surface-mount capacitor 05 serves as a filter, coupler, and bootstrap in the semiconductor circuit. Component 07 is a chip required to form the internal functional circuit of the semiconductor circuit. Component semi-finished product 08 consists of high-voltage power components with high heat dissipation requirements mounted on a heat sink 09. The heat sink 09 uses a copper surface silver plating process to achieve better adhesion between the surface components and the heat sink, improving heat dissipation capacity.

[0046] In this embodiment of the invention, the encapsulation body 11 is a powdered molding compound made of epoxy resin as the base resin, high-performance phenolic resin as the curing agent, silicon micro powder and other fillers, and various additives. It is extruded into the mold cavity by heat transfer molding and embeds the semiconductor chip therein. At the same time, it is cross-linked and cured to form a device with a certain external structure. The binding metal wire 12 (the metal wire is generally made of gold, aluminum, copper and other materials) is used to realize the electrical connection between the components in the circuit.

[0047] Compared with existing technologies, this invention uses a metal lead frame as the fixing method for the leads, and multiple lead mounting holes are set on the metal lead frame according to semiconductor circuit safety regulations. This allows for easy installation and replacement of leads according to different internal semiconductor circuit configurations, improving product design flexibility and reducing development costs. It achieves stress-free packaging, solving the insulation layer delamination problem common in the semiconductor industry and improving the reliability of semiconductor circuits. While addressing stress issues, it also solves the problems of lead frame and substrate adhesive overflow. Furthermore, it allows for seamless switching between semi-encapsulated and fully encapsulated structures without changing the mold carrier, not only reducing costs and increasing efficiency but also significantly enhancing product flexibility. The semiconductor circuit module of this invention is designed as a hidden, pinless structure, and the input / output positions are not encapsulated. External contact with the input / output positions is achieved through conductive metal materials. This reduces wear on the test socket during the testing process and simplifies its design (existing solutions require complex clamping devices to clamp and fix the pins, increasing the contact force and leading to wear and tear, resulting in a short lifespan and increased costs). Furthermore, the hidden, pinless semiconductor circuit structure of this invention effectively prevents failures caused by external static electricity.

[0048] Secondly, the present invention also provides a method for manufacturing a semiconductor circuit module as described in the above embodiments, the method comprising the following steps:

[0049] S1. The metal substrate is placed on a special carrier by automated equipment or manual labor.

[0050] S2. The semiconductor inverter circuit chip is mounted onto the component mounting position reserved in the copper foil layer of the metal substrate by applying solder paste or applying silver glue through an automatic die bonding device.

[0051] S3. High-voltage power devices are mounted onto silver-plated copper heat sinks using a soft solder die bonder to form semi-finished components.

[0052] S4. Using an automated surface mount technology (SMT) device to reduce resistance and capacitance, the semi-finished components are mounted onto the component mounting positions.

[0053] S5. The lead frame is placed on the corresponding welding position of the metal substrate by a robot or manually, the metal substrate including the special carrier is passed through the reflow oven, and all the circuit components are welded to the corresponding mounting positions.

[0054] S6. The soldering quality of the circuit components is inspected by visual inspection AOI equipment, and flux and aluminum shavings remaining on the metal substrate are removed by spraying and ultrasonication.

[0055] S7. The circuit components and the circuit wiring layer are electrically connected through the bonding metal wire;

[0056] S8. The metal substrate circuit is encapsulated in a specific mold using packaging equipment, and then marked by laser marking.

[0057] S9. Post-curing stress relief treatment is carried out in a high-temperature oven, and electrical parameters are tested.

[0058] S10. Install the metal pin bracket on the electronic control board. According to the semiconductor circuit pin scheme, place and fix the metal pin post on the corresponding pin mounting hole of the metal pin bracket, so that one end of the metal pin post is connected to the electronic control board and the other end is connected to the metal substrate, thereby realizing the installation and manufacturing of the semiconductor circuit module.

[0059] The semiconductor circuit module manufactured by the method described above can achieve the technical effects of the semiconductor circuit module as described in the above embodiments, and will not be elaborated further here.

[0060] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0061] The embodiments of the present invention have been described above with reference to the accompanying drawings. The disclosed embodiments are merely preferred embodiments of the present invention. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many equivalent changes in form without departing from the spirit and scope of the claims of the present invention, and all such changes are within the protection scope of the present invention.

Claims

1. A semiconductor circuit module, characterized in that, The semiconductor circuit module includes a metal substrate; a plurality of circuit components disposed at a predetermined position on the metal substrate; bonding metal wires for realizing electrical connection between the plurality of circuit components; and a package covering the metal substrate. The metal substrate is configured with multiple internal input / output pin connection points and multiple external input / output pin connection points. The package body has through holes at corresponding positions above the internal input / output pin connection points and the external input / output pin connection points. The semiconductor circuit module also includes an electronic control board, on which a metal pin bracket is fixed. The package is fixedly connected to the electronic control board through the metal pin bracket. The metal pin bracket has multiple pin mounting holes, and multiple metal pin posts are inserted into the pin mounting holes. One end of the metal pin post passes through the through hole and is inserted into the internal input / output pin connection position or the external input / output pin connection position. The other end of the metal pin post is electrically connected to the electronic control board. The metal lead bracket includes a first metal lead bracket and a second metal lead bracket, which are respectively fixed to opposite sides of the package.

2. The semiconductor circuit module as described in claim 1, characterized in that, The metal pins are made of C194 (-1 / 2H) copper alloy or KFC (-1 / 2H) copper alloy.

3. The semiconductor circuit module as described in claim 2, characterized in that, The metal pin post is formed by stamping a 0.5mm copper plate through machining to form a pin welding part semi-finished product. Then, the surface of the pin welding part semi-finished product is successively plated with nickel with a thickness of 0.1-0.5um and tin with a thickness of 2-5um.

4. The semiconductor circuit module as described in claim 1, characterized in that, The metal pin post includes a first connecting part, a fixing part, and a second connecting part. One end of the first connecting part is connected to the internal input / output pin connection position or the external input / output pin connection position. The other end of the first connecting part is connected to the fixing part. The end of the fixing part away from the first connecting part is connected to the second connecting part. The end of the second connecting part away from the fixing part is connected to the electronic control board. The fixing part is used to fix the pin mounting hole.

5. The semiconductor circuit module as described in claim 1, characterized in that, The metal substrate includes a metal substrate, an insulating layer, a copper foil layer, and a protective layer. The insulating layer is attached to one side of the metal substrate, the copper foil layer is pressed onto the side of the insulating layer away from the metal substrate, and the protective layer is attached to the side of the copper foil layer away from the insulating layer.

6. The semiconductor circuit module as described in claim 5, characterized in that, The circuit wiring layer is formed by etching the copper foil layer.

7. The semiconductor circuit module as described in claim 1, characterized in that, The circuit components include surface mount capacitors, surface mount resistors, and other components, which are respectively mounted on the metal substrate.

8. A method for manufacturing a semiconductor circuit module, used to manufacture the semiconductor circuit module as described in any one of claims 1-7, characterized in that, The manufacturing method includes the following steps: S1. The metal substrate is placed on a special carrier by automated equipment or manual labor. S2. The semiconductor inverter circuit chip is mounted onto the component mounting position reserved in the copper foil layer of the metal substrate by applying solder paste or applying silver glue through an automatic die bonding device. S3. High-voltage power devices are mounted onto silver-plated copper heat sinks using a soft solder die bonder to form semi-finished components. S4. Using an automated surface mount technology (SMT) device to reduce resistance and capacitance, the semi-finished components are mounted onto the component mounting positions. S5. The lead frame is placed on the corresponding welding position of the metal substrate by a robot or manually, the metal substrate including the special carrier is passed through the reflow oven, and all the circuit components are welded to the corresponding mounting positions. S6. The soldering quality of the circuit components is inspected by visual inspection AOI equipment, and flux and aluminum shavings remaining on the metal substrate are removed by spraying and ultrasonication. S7. The circuit components and the circuit wiring layer are electrically connected through the bonding metal wire; S8. The metal substrate circuit is encapsulated in a specific mold using packaging equipment, and then marked by laser marking. S9. Post-curing stress relief treatment is carried out in a high-temperature oven, and electrical parameters are tested. S10. Install the metal pin bracket on the electronic control board. According to the semiconductor circuit pin scheme, place and fix the metal pin post on the corresponding pin mounting hole of the metal pin bracket, so that one end of the metal pin post is connected to the electronic control board and the other end is connected to the metal substrate, thereby realizing the installation and manufacturing of the semiconductor circuit module.

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