Semiconductor circuit module and manufacturing method thereof

Abstract

The invention is suitable for the technical field of semiconductors, and particularly relates to a semiconductor circuit module and a manufacturing method thereof. Compared with the prior art, the control circuit is used for controlling the magnetic attraction column above the electric control board to perform the magnetic attraction action, so that the semiconductor circuit is connected with the electric control board according to the working condition of the semiconductor circuit; therefore, when the electric control board breaks down, the semiconductor circuit can be disconnected from the electric control board by controlling the magnetic attraction column to act, and the self-protection effect is achieved. Stress-free packaging is realized, the problem of layering of an insulating layer of a semiconductor circuit in the industry is solved, and the reliability of the semiconductor circuit is improved; the stress problem is solved, and meanwhile, the glue overflowing problem of the lead frame and the substrate is solved; seamless switching between a semi-encapsulation structure and a full-encapsulation structure can be realized on the premise that a mold carrier is not changed, so that the cost is reduced, the efficiency is improved, and the flexibility of a product is greatly improved; the pin does not need to be subjected to rib cutting forming, the production cost is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention is applicable to the field of semiconductor technology, and in particular relates to a semiconductor circuit module and a manufacturing method thereof. Background Art

[0002] The semiconductor circuit, namely the modular intelligent power system MIPS (Module Intelligent Power System), not only integrates the power switch device and the drive circuit, but also has built-in fault detection circuits such as overvoltage, overcurrent and overheating, and can send the detection signal to the CPU or DSP for interrupt processing. It is composed of high-speed and low-power consumption tube cores, optimized gate-level drive circuits and fast protection circuits. Even if a load accident or improper use occurs, the MIPS itself can be kept from being damaged. MIPS generally uses IGBT as the power switch element, and has an integrated structure of built-in current sensor and drive circuit.

[0003] The existing MIPS modular intelligent power system IC drive control circuit, MIPS sampling amplifier circuit, PFC current protection circuit and other low-voltage control circuits and the inverter circuit composed of high-voltage semiconductor circuit modules are arranged on the same board. At the same time, the existing MIPS modular intelligent power system only integrates a single MIPS module, and the integration of multiple MIPS modular intelligent power systems has not yet been realized. In the face of market miniaturization and low-cost competition, higher requirements are placed on the high integration and high heat dissipation technology of the MIPS modular intelligent power system.

[0004] Therefore, there is an urgent need for a new semiconductor circuit module and a manufacturing method thereof to solve the above problems. Summary of the invention

[0005] The present invention proposes a semiconductor circuit module and a manufacturing method thereof, aiming to solve the problem of insulating layer delamination in existing semiconductor circuits and improve the reliability of semiconductor circuits. At the same time, the module can be installed and replaced at any time according to different pin schemes inside the semiconductor circuit, thereby improving product design flexibility and reducing development costs.

[0006] In a first aspect, the present invention provides a semiconductor circuit module, the semiconductor circuit module comprising a metal substrate; a plurality of circuit components arranged at preset positions of the metal substrate; a binding metal wire for realizing electrical connection between the plurality of circuit components; a package body coated on the metal substrate;

[0007] The metal substrate is provided with a plurality of internal input / output pin connection positions and a plurality of external input / output pin connection positions, the package body is provided with through holes at corresponding positions above the internal input / output pin connection positions and the external input / output pin connection positions, and a plurality of elastic pin connectors are fixed on the internal input / output pin connection positions and the external input / output pin connection positions;

[0008] The semiconductor circuit module also includes an electric control board, on which a conductive magnetic attraction device is fixed, and the package body is fixedly connected to the electric control board via the conductive magnetic attraction device. When the conductive magnetic attraction device is charged, the elastic pin connector is magnetically attracted, and the elastic pin connector is stretched and connected to the conductive magnetic attraction device to achieve electrical connection between the metal substrate and the electric control board. The electrical connection between the metal substrate and the electric control board is controlled by charging and powering off the conductive magnetic attraction device.

[0009] Preferably, the elastic pin connector includes an elastic sheet and two connecting parts fixed at both ends of the elastic sheet, and the connecting part at one end away from the electric control board is fixedly connected to the internal input / output pin connection position or the external input / output pin connection position.

[0010] Preferably, the conductive magnetic attraction device includes a fixing member and a magnetic attraction column accommodated in the fixing member, one end of the fixing member is fixedly connected to the electric control board, the other end of the fixing member is fixedly connected to the packaging body, one end of the magnetic attraction column is electrically connected to the electric control board, and the other end of the magnetic attraction column passes through the through hole.

[0011] Preferably, the metal substrate includes a metal base material, an insulating layer, a copper foil layer and a protective layer, the insulating layer is attached to one side of the metal base material, the copper foil layer is pressed onto the side of the insulating layer away from the metal base material, and the protective layer is attached to the side of the copper foil layer away from the insulating layer.

[0012] Preferably, the circuit wiring layer is produced by etching the copper foil layer.

[0013] Preferably, the circuit components include chip capacitors, chip resistors and components, and the chip capacitors, chip resistors and components are respectively mounted on the metal substrate.

[0014] Preferably, the package body is made of epoxy resin, phenolic resin and silicon powder.

[0015] In a second aspect, the present invention further provides a method for manufacturing a semiconductor circuit module as described in the above embodiment, the manufacturing method comprising the following steps:

[0016] S1. Place the metal substrate on a special carrier by automated equipment or manually;

[0017] S2, mounting the semiconductor inverter circuit chip on the component mounting position reserved on the copper foil layer of the metal substrate by applying solder paste or applying silver glue through an automatic die bonding device;

[0018] S3, mounting the high-voltage power device on the silver-plated copper heat sink through a soft solder die-bonding machine to form a semi-finished component;

[0019] S4, using automatic SMT equipment to reduce resistance and capacity, and mount the semi-finished components on the component installation position;

[0020] S5. Place the lead frame on the corresponding welding position of the metal substrate by a robot or manually, pass the metal substrate including the special carrier through a reflow furnace, and weld all the circuit components to the corresponding mounting positions;

[0021] S6, inspecting the welding quality of the circuit components by visual inspection AOI equipment, and removing the flux and aluminum chips remaining on the metal substrate by spraying and ultrasound;

[0022] S7, electrically connecting the circuit components and the circuit wiring layer through the binding metal wires;

[0023] S8, plastic-sealing the metal substrate circuit in a specific mold by a packaging device, and then marking it by laser marking;

[0024] S9, performing post-curing stress relief treatment in a high-temperature oven and performing electrical parameter testing to obtain a semiconductor circuit module;

[0025] Compared with the prior art, the present invention controls the magnetic suction column above the electric control board through the control circuit to perform a magnetic suction action to achieve connection with the electric control board according to the working condition of the semiconductor circuit. In this way, when the electric control board fails, the semiconductor circuit can achieve self-protection by controlling the action of the magnetic suction column to disconnect from the electric control board; it realizes stress-free packaging, solves the problem of insulation layer stratification in semiconductor circuits in the industry, and improves the reliability of semiconductor circuits; it solves the problem of lead frame and substrate overflow while solving the stress problem; it can achieve seamless switching between semi-encapsulated structure and fully encapsulated structure without changing the mold carrier, which not only reduces costs and improves efficiency, but also greatly improves the flexibility of the product; there is no need to cut and form the pins, which reduces production costs and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be described in detail below in conjunction with the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings. In the accompanying drawings:

[0027] Figure 1 is a structural schematic diagram of a metal substrate of a semiconductor circuit module provided by an embodiment of the present invention;

[0028] Figure 2 is a schematic structural diagram of an elastic pin connector of a semiconductor circuit module provided by an embodiment of the present invention;

[0029] Figure 3 It is a schematic structural diagram of a metal substrate covered by a package of a semiconductor circuit module provided by an embodiment of the present invention;

[0030] Figure 4 is a schematic structural diagram of a semiconductor circuit module provided by an embodiment of the present invention;

[0031] Figure 5 It is a schematic structural diagram of the metal substrate of the semiconductor circuit module provided by an embodiment of the present invention from another perspective. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0033] Please refer to Figure 1-Figure 5 In a first aspect, the present invention provides a semiconductor circuit module, the semiconductor circuit module comprising a metal substrate 1; a plurality of circuit components arranged at preset positions of the metal substrate 1; a binding metal wire 12 for realizing electrical connection between the plurality of circuit components; a package body 11 coated on the metal substrate 1;

[0034] The metal substrate 1 is provided with a plurality of internal input / output pin connection positions 003 and a plurality of external input / output pin connection positions 004, the package body 11 is provided with through holes at corresponding positions above the internal input / output pin connection positions 003 and the external input / output pin connection positions 004, and a plurality of elastic pin connectors 10 are fixed on the internal input / output pin connection positions 003 and the external input / output pin connection positions 004;

[0035] The semiconductor circuit module also includes an electric control board 14, on which a conductive magnetic attraction device 13 is fixed, and the package body 11 is fixedly connected to the electric control board 14 through the conductive magnetic attraction device 13. When the conductive magnetic attraction device 13 is charged, the elastic pin connector 10 is magnetically attracted, and the elastic pin connector 10 is stretched and connected to the conductive magnetic attraction device 13 to achieve electrical connection between the metal substrate 1 and the electric control board 14. The electrical connection between the metal substrate 1 and the electric control board 14 is controlled by charging and powering off the conductive magnetic attraction device 13.

[0036] Specifically, by using the elastic pin connector 10 as an input and output pin, the conductive magnetic attraction device 13 on the electric control board 14 is controlled to perform magnetic attraction through the internal chip control circuit of the semiconductor circuit, and the elastic pin connector 10 is adsorbed to achieve the connection between the metal substrate 1 and the electric control board 14. In this way, when the electric control board 14 fails, the self-protection effect can be achieved by controlling the disconnection of the conductive magnetic device from the electric control board 14. At the same time, the conductive magnetic attraction device 13 can prevent the components and condensed water above the electric control board 14 from directly contacting the metal substrate 1 (semiconductor circuit) to play an isolation and suspension role, and can also achieve the magnetic attraction function under the control of the semiconductor circuit.

[0037] In the embodiment of the present invention, the elastic pin connector 10 includes an elastic sheet 002 and two connecting parts 001 fixed at both ends of the elastic sheet 002. The connecting part 001 at one end away from the electric control board 14 is fixedly connected to the internal input-output pin connection position 003 or the external input-output pin connection position 004. The elastic sheet 002 is mainly used to cooperate with the conductive magnetic attraction device 13 to realize the electrical connection between the metal substrate 1 and the electric control board 14. When the electric control board 14 is powered on, the conductive magnetic attraction device 13 generates a magnetic force to attract the connecting part 001 to contact the conductive magnetic attraction device 13. At this time, the reset elastic sheet 002 is stretched. When the power is turned off, the magnetic force disappears, and the reset elastic sheet 002 returns to its original shape to achieve disconnection.

[0038] In the embodiment of the present invention, the conductive magnetic attraction device 13 includes a fixing member 131 and a magnetic attraction column 132 accommodated in the fixing member 131, one end of the fixing member 131 is fixedly connected to the electric control board 14, the other end of the fixing member 131 is fixedly connected to the packaging body, one end of the magnetic attraction column 132 is electrically connected to the electric control board 14, and the other end of the magnetic attraction column 132 passes through the through hole.

[0039] In the embodiment of the present invention, the metal substrate 1 includes a metal substrate 01, an insulating layer 02, a copper foil layer 03 and a protective layer 04, wherein the insulating layer 02 is attached to one side of the metal substrate 01, the copper foil layer 03 is pressed on the side of the insulating layer 02 away from the metal substrate 01, and the protective layer 04 is attached to the side of the copper foil layer 03 away from the insulating layer 02. Among them, the metal substrate 01 serves as a carrier of the entire internal circuit of the semiconductor circuit and plays a heat dissipation role for the entire semiconductor circuit; the insulating layer 02 prevents the circuit wiring layer from being energized with the metal substrate, resulting in the risk of short circuit and leakage of the internal circuit; the copper foil layer 03 is formed by etching the copper foil layer to form the required circuit to form the circuit wiring layer; the protective layer 04, also known as the green oil layer, prevents tinning where it should not be tinned, increases the withstand voltage between the circuits, prevents short circuits caused by oxidation or contamination of the circuits, and protects the circuits.

[0040] In the embodiment of the present invention, the circuit wiring layer is manufactured by etching the copper foil layer 03 .

[0041] In the embodiment of the present invention, the circuit components include chip capacitor 05, chip resistor 06 and component 07, and the chip capacitor 05, the chip resistor 06 and the component 07 are respectively mounted on the metal substrate 1. Among them, the chip resistor 05 is connected to the gate of the IGBT chip in the semiconductor circuit, and the switching speed of the IGBT is limited by current limiting; the chip capacitor 06 plays a role of filtering, coupling and bootstrapping in the semiconductor circuit; the component 07 constitutes the chip required for the internal functional circuit of the semiconductor circuit; the semi-finished component 08 is formed by mounting high-voltage power components with high heat dissipation requirements on the heat sink 09 to form a semi-finished component; the heat sink 09 adopts the copper surface silver plating process to achieve better bonding between the surface components and the heat sink, thereby improving the heat dissipation capacity.

[0042] In the embodiment of the present invention, the package body 11 is a powdered molding compound made of epoxy resin as a base resin, high-performance phenolic resin as a curing agent, silicon micropowder and the like as a filler, and a variety of additives. It is extruded into the mold cavity by a heat transfer molding method and the semiconductor chip therein is embedded, and cross-linked and cured to form a device with a certain external structure; the metal wire 12 (the metal wire is generally made of gold, aluminum, copper, etc.) is bound, and the metal wire is used to realize the electrical connection between the components in the circuit.

[0043] Compared with the prior art, the present invention controls the magnetic suction column above the electric control board through the control circuit to perform a magnetic suction action to achieve connection with the electric control board according to the working condition of the semiconductor circuit. In this way, when the electric control board fails, the semiconductor circuit can achieve self-protection by controlling the action of the magnetic suction column to disconnect from the electric control board; it realizes stress-free packaging, solves the problem of insulation layer stratification in semiconductor circuits in the industry, and improves the reliability of semiconductor circuits; it solves the problem of lead frame and substrate overflow while solving the stress problem; it can achieve seamless switching between semi-encapsulated structure and fully encapsulated structure without changing the mold carrier, which not only reduces costs and improves efficiency, but also greatly improves the flexibility of the product; there is no need to cut and form the pins, which reduces production costs and improves production efficiency.

[0044] In a second aspect, the present invention further provides a method for manufacturing a semiconductor circuit module as described in the above embodiment, the manufacturing method comprising the following steps:

[0045] S1. Place the metal substrate on a special carrier by automated equipment or manually;

[0046] S2, mounting the semiconductor inverter circuit chip on the component mounting position reserved on the copper foil layer of the metal substrate by applying solder paste or applying silver glue through an automatic die bonding device;

[0047] S3, mounting the high-voltage power device on the silver-plated copper heat sink through a soft solder die-bonding machine to form a semi-finished component;

[0048] S4, using automatic SMT equipment to reduce resistance and capacity, and mount the semi-finished components on the component installation position;

[0049] S5, placing the lead frame to the corresponding welding position of the metal substrate by a robot or manually, passing the metal substrate including the special carrier through a reflow furnace, and welding all the circuit components to the corresponding mounting positions;

[0050] S6, inspecting the welding quality of the circuit components by visual inspection AOI equipment, and removing the flux and aluminum chips remaining on the metal substrate by spraying and ultrasound;

[0051] S7, electrically connecting the circuit components and the circuit wiring layer through the binding metal wires;

[0052] S8, plastic-sealing the metal substrate circuit in a specific mold by a packaging device, and then marking it by laser marking;

[0053] S9. Perform post-curing stress relief treatment in a high-temperature oven and conduct electrical parameter testing to obtain a semiconductor circuit module.

[0054] The semiconductor circuit module manufactured by the semiconductor circuit module manufacturing method can achieve the technical effects achieved by the semiconductor circuit module described in the above embodiments, and will not be described in detail here.

[0055] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0056] The embodiments of the present invention are described above in conjunction with the accompanying drawings. What is disclosed is only the preferred embodiment of the present invention. However, the present invention is not limited to the above-mentioned specific implementation manner. The above-mentioned specific implementation manner is only illustrative rather than restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms and equivalent changes without departing from the scope of protection of the purpose of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A semiconductor circuit module, characterized in that: The semiconductor circuit module comprises a metal substrate; a plurality of circuit components arranged at preset positions of the metal substrate; a binding metal wire for realizing electrical connection between the plurality of circuit components; and a package body coated on the metal substrate; The metal substrate is provided with a plurality of internal input / output pin connection positions and a plurality of external input / output pin connection positions, the package body is provided with through holes at corresponding positions above the internal input / output pin connection positions and the external input / output pin connection positions, and a plurality of elastic pin connectors are fixed on the internal input / output pin connection positions and the external input / output pin connection positions; The semiconductor circuit module also includes an electric control board, on which a conductive magnetic attraction device is fixed, and the package body is fixedly connected to the electric control board via the conductive magnetic attraction device. When the conductive magnetic attraction device is charged, the elastic pin connector is magnetically attracted, and the elastic pin connector is stretched and connected to the conductive magnetic attraction device to achieve electrical connection between the metal substrate and the electric control board. The electrical connection between the metal substrate and the electric control board is controlled by charging and powering off the conductive magnetic attraction device.

2. The semiconductor circuit module according to claim 1, wherein: The elastic pin connector includes an elastic sheet and two connecting parts fixed at both ends of the elastic sheet, and the connecting part at one end away from the electric control board is fixedly connected to the internal input / output pin connection position or the external input / output pin connection position.

3. The semiconductor circuit module according to claim 2, wherein: The conductive magnetic attraction device includes a fixing member and a magnetic attraction column accommodated in the fixing member, one end of the fixing member is fixedly connected to the electric control board, the other end of the fixing member is fixedly connected to the packaging body, one end of the magnetic attraction column is electrically connected to the electric control board, and the other end of the magnetic attraction column passes through the through hole.

4. The semiconductor circuit module according to claim 1, wherein: The metal substrate includes a metal base material, an insulating layer, a copper foil layer and a protective layer. The insulating layer is attached to one side of the metal base material, the copper foil layer is pressed to the side of the insulating layer away from the metal base material, and the protective layer is attached to the side of the copper foil layer away from the insulating layer.

5. The semiconductor circuit module according to claim 4, wherein: A circuit wiring layer is produced by etching the copper foil layer.

6. The semiconductor circuit module according to claim 1, wherein: The circuit components include chip capacitors, chip resistors and components, and the chip capacitors, chip resistors and components are respectively mounted on the metal substrate.

7. The semiconductor circuit module according to claim 1, wherein: The packaging body is made of epoxy resin, phenolic resin and silicon powder.

8. A method for manufacturing a semiconductor circuit module, used for manufacturing the semiconductor circuit module according to any one of claims 1 to 7, characterized in that: The manufacturing method comprises the following steps: S1. Place the metal substrate on a special carrier by automated equipment or manually; S2, mounting the semiconductor inverter circuit chip on the component mounting position reserved on the copper foil layer of the metal substrate by applying solder paste or applying silver glue through an automatic die bonding device; S3, mounting the high-voltage power device on the silver-plated copper heat sink through a soft solder die-bonding machine to form a semi-finished component; S4, using automatic SMT equipment to reduce resistance and capacity, and mount the semi-finished components on the component installation position; S5. Place the lead frame on the corresponding welding position of the metal substrate by a robot or manually, pass the metal substrate including the special carrier through a reflow furnace, and weld all the circuit components to the corresponding mounting positions; S6, inspecting the welding quality of the circuit components by visual inspection AOI equipment, and removing the flux and aluminum chips remaining on the metal substrate by spraying and ultrasound; S7, electrically connecting the circuit components and the circuit wiring layer through the binding metal wires; S8, plastic-sealing the metal substrate circuit in a specific mold by a packaging device, and then marking it by laser marking; S9. Perform post-curing stress relief treatment in a high-temperature oven and conduct electrical parameter testing to obtain a semiconductor circuit module.

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