Rapid trimming method based on lead bonding and trimming probe thereof

Abstract

The invention discloses a rapid trimming method based on lead bonding and a trimming probe thereof, and relates to the technical field of semiconductor devices.The rapid trimming method comprises the following steps that firstly, a chuck is moved, a device to be trimmed is placed on the chuck, the chuck drives the device to be trimmed to move to the position below a trimming probe body, and the device to be trimmed is trimmed; the method comprises the following steps: 1, adjusting a probe seat, 2, manually adjusting an X-Y-Z-axis knob of the probe seat to enable a hook-shaped structure at the tail end of a trimming probe body to hook a lead to be trimmed, and 3, correspondingly adjusting the X-Y-Z-axis knob of the probe seat to be matched with the trimming probe body to pull a specific lead open, and subsequently carrying out re-bonding according to needs. According to the invention, a single lead can be accurately trimmed in a large number of leads, the success rate of lead bonding is improved, and the device testing efficiency is accelerated.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and in particular to a rapid trimming method based on wire bonding and a trimming probe thereof. Background Art

[0002] Wire bonding is a method of connection using metal wires. It is the main bonding type used in the semiconductor device industry. In the research and development process of semiconductor devices, it is necessary to connect the wafer Die with the external PCB circuit board through wire bonding to conduct complete performance testing of the product.

[0003] In the product design stage, small-batch production is mainly carried out through manual wire bonding or semi-automatic wire bonding. However, during bonding, unoptimized bonding parameters will cause mutual interference between adjacent leads or even short circuits or open circuits, resulting in failure of wire bonding of the entire PCB. In order to quickly adjust one or more problematic leads after wire bonding fails, a large number of leads are generally manually unplugged for re-bonding. This operation method has a high error rate and may even damage the wafer Die. It also takes longer time and is not conducive to the rapid implementation of device testing. Summary of the invention

[0004] The purpose of the present invention is to solve the problems existing in the prior art:

[0005] When problems arise with wire bonding during the development of semiconductor devices, wire adjustment is usually performed by manually pulling out a large number of wires for re-bonding. This operation method has a high error rate and may even damage the wafer Die. It is also time-consuming and not conducive to the rapid implementation of device testing.

[0006] A fast trimming method based on wire bonding and its trimming probe are proposed.

[0007] In order to achieve the above object, the present invention adopts the following technical solutions:

[0008] A rapid trimming method based on wire bonding comprises the following steps:

[0009] Step 1: Move the chuck plate, place the device to be adjusted on the chuck plate, and move the chuck plate with the device to be adjusted to the bottom of the adjustment probe body;

[0010] Step 2: Manually adjust the XYZ axis knob of the probe holder to cause the hook-shaped structure at the end of the trimming probe body to hook the lead wire that needs to be trimmed;

[0011] Step 3: Adjust the XYZ-axis knobs of the probe holder accordingly and adjust the probe body to pull apart specific leads, and then re-bond as needed.

[0012] As a further technical solution of the present invention, in step one, in the initial state, the end of the movable column is inserted into the insertion groove, thereby cooperating with the limiting baffle to limit and fix the bottom movable platform.

[0013] As a further technical solution of the present invention, in step one, the bottom movable platform is pulled horizontally and vertically by the handle, thereby driving the middle movable platform, the upper movable platform, the lifting platform and the chuck plate to move, so as to move the chuck plate away from the U-shaped needle seat platform.

[0014] As a further technical solution of the present invention, in step one, when it is necessary to pull the bottom moving platform outward, the user can insert his fingers into the handle (in the area between the pull rope and the side wall of the bottom moving platform), and then move his fingers away from the bottom moving platform.

[0015] As a further technical solution of the present invention, in step one, the finger will resist and squeeze the pull rope during the movement, and the pull rope will be displaced under the guidance of pulley two and pulley one, thereby pulling the moving column to be displaced, causing the end of the moving column to move out of the insertion groove, thereby releasing the limiting fixation of the bottom moving platform, thereby pulling the bottom moving platform to move.

[0016] As a further technical solution of the present invention, in step one, after the device to be adjusted is placed on the chuck plate, the bottom moving platform is prompted to bring the middle moving platform, the upper moving platform, the lifting platform and the chuck plate back to the initial position.

[0017] As a further technical solution of the present invention, in step one, the CCD camera cooperates with the computer to control the motor one to drive the screw one to rotate, and the screw one drives the middle mobile platform to move horizontally, thereby driving the upper mobile platform, the lifting platform, the chuck plate and the device to be processed to move, and fine-tune the position of the device to be processed.

[0018] As a further technical solution of the present invention, in step one, the CCD camera cooperates with the computer to control the motor two to drive the screw two to rotate, and the screw two will drive the upper mobile platform to move horizontally and vertically, thereby driving the lifting platform, chuck plate and the device to be processed to move, and fine-tune the position of the device to be processed.

[0019] As a further technical solution of the present invention, in step one, the CCD camera cooperates with the computer to control motor three to drive screw three to rotate, and screw three drives the lifting platform to move up and down, thereby moving the chuck plate and the device to be processed, and fine-tuning the position of the device to be processed.

[0020] A trimming probe based on wire bonding comprises a trimming probe body arranged on a probe seat through a probe fixture, wherein the working end of the trimming probe body is in a hook shape.

[0021] Beneficial effects of the present invention:

[0022] 1. When in use, place the device to be trimmed (a combination of wafer Die and PCB circuit board) on the chuck plate, and then move the chuck plate with the device to be trimmed to the bottom of the trimming probe body, and manually adjust the XYZ axis knob of the probe seat (conventional technical means) to prompt the hook-shaped structure at the end of the trimming probe body to hook the lead to be trimmed, and then adjust the XYZ axis knob of the probe seat accordingly, cooperate with the trimming probe body to pull apart a specific lead, so that the lead and the adjacent leads are independent of each other, or pull apart a specific lead for re-bonding. The whole process takes less time, has a low operating error rate, and will not damage the wafer Die. Among a large number of leads, a single lead can be accurately trimmed to improve the success rate of lead bonding and speed up device testing efficiency.

[0023] 2. In the initial state, the end of the moving column is inserted into the insertion groove, thereby cooperating with the limit baffle to limit and fix the bottom moving platform to avoid shaking of the bottom moving platform when the device is processed, which affects the use effect. When the bottom moving platform needs to be pulled outward, the user can put his fingers into the handle (in the area between the pull rope and the side wall of the bottom moving platform), and then move his fingers away from the bottom moving platform. The fingers will resist and squeeze the pull rope, and the pull rope will be displaced under the guidance of pulley two and pulley one, thereby pulling the moving column to displace, prompting the end of the moving column to move out of the insertion groove, thereby releasing the limit fixation of the bottom moving platform, so that the bottom moving platform can be pulled to move, which is convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a flow chart of the method of the present invention;

[0025] Figure 2 It is a schematic diagram of the connection between the workbench and the base in the present invention;

[0026] Figure 3 It is a schematic diagram of the connection between the probe fixture and the trimming probe body in the present invention;

[0027] Figure 4 It is a schematic diagram of the structure of the trimming probe body in the present invention;

[0028] Figure 5 It is a schematic diagram of the connection between the base and the bottom mobile platform in the present invention;

[0029] Figure 6 It is a schematic diagram of the connection between the lifting platform and the guide rod in the present invention;

[0030] Figure 7 It is a schematic diagram of the internal structure of the side groove in the present invention;

[0031] Figure 8 It is a schematic diagram of the connection between the handle and the second pulley in the present invention.

[0032] In the figure: 1. workbench; 2. base; 3. mounting frame; 4. U-shaped needle seat platform; 5. probe seat; 6. probe fixture; 7. trimming probe body; 8. CCD camera; 9. chuck plate; 10. U-shaped frame; 11. connecting seat; 12. microscope; 13. bottom moving platform; 14. middle moving platform; 15. upper moving platform; 16. lifting platform; 17. guide rail; 18. handle; 19. limit baffle; 20 1. Slide rail seat 1; 22. Mounting plate 1; 23. Screw rod 1; 24. Motor 1; 25. Slide rail seat 2; 26. Mounting plate 2; 27. Screw rod 2; 28. Motor 2; 29. ​​Mounting plate 3; 30. Guide rod; 31. Motor 3; 32. Screw rod 3; 33. Side groove; 34. Moving column; 35. Spring; 36. Wire groove; 37. Connecting groove; 38. Pulley 1; 39. Mounting through groove; 40. Pulley 2; 41. Pull rope. DETAILED DESCRIPTION

[0033] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation mode, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0034] Reference Figure 1-Figure 8 , a fast trimming method based on wire bonding, comprising the following steps:

[0035] Step 1: Move the chuck plate 9, place the device to be adjusted on the chuck plate 9, and move the chuck plate 9 with the device to be adjusted to the bottom of the adjustment probe body 7;

[0036] Step 2: manually adjust the XYZ axis knob of the probe holder 5 to cause the hook-shaped structure at the end of the trimming probe body 7 to hook the lead wire that needs to be trimmed;

[0037] Step 3: By adjusting the XYZ axis knobs of the probe holder 5 accordingly, the probe body 7 is adjusted to pull apart a specific lead, and then re-bonding is performed as needed.

[0038] In step 1, in the initial state, the end of the movable column 34 is inserted into the insertion groove, thereby cooperating with the limiting baffle 19 to limit and fix the bottom movable platform 13.

[0039] In step one, the bottom moving platform 13 is pulled horizontally and vertically by the handle 18 , thereby driving the middle moving platform 14 , the upper moving platform 15 , the lifting platform 16 and the chuck plate 9 to move, so as to move the chuck plate 9 away from the U-shaped needle seat platform 4 .

[0040] In step one, when the bottom moving platform 13 needs to be pulled outward, the user can insert his fingers into the area between the pull rope 41 in the handle 18 and the side wall of the bottom moving platform 13 , and then move his fingers away from the bottom moving platform 13 .

[0041] In step one, the finger will press against the pull rope 41 during the movement, and the pull rope 41 will be displaced under the guidance of pulley 2 40 and pulley 1 38, thereby pulling the movable column 34 to be displaced, causing the end of the movable column 34 to move out of the insertion groove, thereby releasing the limit fixation of the bottom movable platform 13, so that the bottom movable platform 13 can be pulled to move.

[0042] In step 1, after the device to be adjusted is placed on the chuck plate 9, the bottom moving platform 13 is urged to bring the middle moving platform 14, the upper moving platform 15, the lifting platform 16 and the chuck plate 9 back to the initial position.

[0043] In step one, the CCD camera 8 cooperates with the computer to control the motor 24 to drive the screw 23 to rotate, and the screw 23 drives the middle mobile platform 14 to move horizontally, thereby driving the upper mobile platform 15, the lifting platform 16, the chuck plate 9 and the device to be processed to move, and fine-tune the position of the device to be processed.

[0044] In step one, the CCD camera 8 cooperates with the computer to control the motor 28 to drive the screw 27 to rotate. The screw 27 will drive the upper mobile platform 15 to move horizontally and vertically, thereby driving the lifting platform 16, the chuck plate 9 and the device to be processed to move and fine-tune the position of the device to be processed.

[0045] In step 1, the CCD camera 8 cooperates with the computer to control the motor 31 to drive the screw 32 to rotate, and the screw 32 drives the lifting platform 16 to move up and down, thereby moving the chuck plate 9 and the device to be processed, and fine-tuning the position of the device to be processed.

[0046] Reference Figure 2-Figure 8The present invention also provides a wire bonding-based adjustment device, comprising a workbench 1, a base 2 is placed on the upper end surface of the workbench 1, two mounting frames 3 are symmetrically fixed on the upper end surface of the base 2, the upper end surfaces of the two mounting frames 3 are fixed with the same U-shaped needle seat platform 4, a probe seat 5 is detachably provided on the upper end surface of the U-shaped needle seat platform 4, a probe fixture 6 is movably provided on the probe seat 5, the probe seat 5 and the probe fixture 6 are prior art, an adjustment knob about the XYZ axis is provided on the probe seat 5, an adjustment probe body 7 is detachably provided at the end of the probe fixture 6, the adjustment probe body 7 has a diameter of 0.1 mm, the adjustment probe body 7 is bent when in use, and the working end of the adjustment probe body 7 is hook-shaped, a CCD camera 8 is movably provided above the U-shaped needle seat platform 4, the CCD camera 8 is electrically connected to an external computer, and a chuck plate 9 is movably provided directly below the U-shaped needle seat platform 4.

[0047] The number of the probe base 5 and the corresponding probe fixture 6 and adjustment probe body 7 provided on the U-shaped needle base platform 4 can be determined according to specific circumstances.

[0048] Reference Figure 2-Figure 4 When in use, the device to be adjusted (a combination of wafer Die and PCB circuit board) is placed on the chuck plate 9, and then the chuck plate 9 is moved with the device to be adjusted to the bottom of the adjustment probe body 7, and the XYZ axis knob of the probe seat 5 is manually adjusted (conventional technical means) to prompt the hook-shaped structure at the end of the adjustment probe body 7 to hook the lead to be adjusted, and then the XYZ axis knob of the probe seat 5 is adjusted accordingly, and the adjustment probe body 7 is cooperated to pull apart a specific lead, so that the lead and the adjacent leads are independent of each other, or a specific lead is pulled apart for re-bonding. The whole process is time-consuming, with a low operating error rate, and will not damage the wafer Die. Among a large number of leads, a single lead can be accurately adjusted, thereby improving the success rate of lead bonding and accelerating device testing efficiency.

[0049] Reference Figure 1 A U-shaped frame 10 is fixed to the upper end surface of the base 2, a connecting seat 11 is provided on the upper end surface of the U-shaped frame 10, a microscope 12 is provided on the connecting seat 11, and a CCD camera 8 is provided on the connecting seat 11. This part of the structure is all prior art. The CCD camera 8 is provided in conjunction with a computer to control the chuck disk 9 to rotate the XYZ axis knob.

[0050] Reference Figure 2 , Figure 5 and Figure 6A bottom movable platform 13 is movably provided on the upper end surface of the base 2, a middle movable platform 14 is movably provided on the upper end surface of the bottom movable platform 13, an upper movable platform 15 is movably provided on the upper end surface of the middle movable platform 14, a lifting platform 16 is movably provided on the upper end surface of the upper movable platform 15, and the chuck plate 9 is arranged on the upper end surface of the lifting platform 16.

[0051] Reference Figure 5 and Figure 6 Two guide rails 17 are symmetrically fixed on the upper end surface of the base 2, and two sliding grooves used to cooperate with the guide rails 17 are symmetrically opened on one side of the bottom moving platform 13. The guide rails 17 and the sliding grooves are slidably connected. A handle 18 is fixed on one side of the bottom moving platform 13, and two limit baffles 19 used to cooperate with the bottom moving platform 13 are symmetrically fixed on the upper end surface of the base 2.

[0052] Reference Figure 2 , Figure 5 and Figure 6 When in use, the bottom mobile platform 13 is pulled horizontally and vertically by the handle 18, thereby driving the middle mobile platform 14, the upper mobile platform 15, the lifting platform 16 and the chuck plate 9 to move, making it convenient for users to place the devices to be processed on the chuck plate 9.

[0053] Reference Figure 2 , Figure 5 and Figure 6 Two slide rail seats 20 are symmetrically fixed on the upper end surface of the bottom moving platform 13, and the middle moving platform 14 is movably arranged between the two slide rail seats 20. Two mounting plates 22 are symmetrically fixed on the upper end surface of the bottom moving platform 13, and a screw rod 23 is rotatably arranged between the two mounting plates 22. The screw rod 23 threads through the middle moving platform 14, and a motor 24 used in conjunction with the screw rod 23 is fixedly arranged on the side wall of one of the mounting plates 22.

[0054] Reference Figure 2 , Figure 5 and Figure 6 When the motor 24 drives the screw rod 23 to rotate, the screw rod 23 will drive the middle mobile platform 14 to move horizontally, thereby driving the upper mobile platform 15, the lifting platform 16, the chuck plate 9 and the device to be processed to move, and fine-tune the position of the device to be processed.

[0055] Reference Figure 2 , Figure 5 and Figure 6Two slide rail seats 25 are symmetrically fixed on the upper end surface of the middle moving platform 14, and the upper moving platform 15 is movably arranged between the two slide rail seats 25. Two mounting plates 26 are symmetrically fixed on the upper end surface of the middle moving platform 14, and a screw rod 27 is rotatably arranged between the two mounting plates 26. The screw rod 27 threads through the upper moving platform 15, and a motor 28 used in conjunction with the screw rod 27 is fixedly arranged on the side wall of one of the mounting plates 26.

[0056] Reference Figure 2 , Figure 5 and Figure 6 When the motor 28 drives the screw rod 27 to rotate, the screw rod 27 will drive the upper mobile platform 15 to move horizontally and vertically, thereby driving the lifting platform 16, the chuck plate 9 and the device to be processed to move, and fine-tune the position of the device to be processed.

[0057] Reference Figure 2 , Figure 5 and Figure 6 Two mounting plates 3 29 are symmetrically fixed to the upper end surface of the upper moving platform 15, and a plurality of guide rods 30 are symmetrically fixed to the lower end surface of the lifting platform 16. Each guide rod 30 is movable and penetrates into the corresponding mounting plate 3 29. A motor 31 is fixed to the upper end surface of the upper moving platform 15, and a screw rod 32 is fixed to the end of the driving shaft of the motor 31. The upper end of the screw rod 32 is threaded and penetrates into the lifting platform 16.

[0058] Reference Figure 2 , Figure 5 and Figure 6 When the motor three 31 drives the screw rod three 32 to rotate, the screw rod three 32 will drive the lifting platform 16 to move up and down, thereby moving the chuck plate 9 and the device to be processed, and fine-tuning the position of the device to be processed.

[0059] Reference Figure 5 , Figure 7 and Figure 8 A side groove 33 is provided on one side of the bottom moving platform 13 close to one of the limit baffles 19, and a moving column 34 is movably arranged in the side groove 33. A spring 35 is fixedly arranged between the inner wall of the side groove 33 and the moving column 34. An insertion groove for cooperating with the moving column 34 is provided on the side wall of the corresponding limit baffle 19, and a driving component for cooperating with the moving column 34 is provided on the bottom moving platform 13.

[0060] Reference Figure 5 , Figure 7 and Figure 8The driving assembly includes a wire groove 36 opened on the inner wall of the side groove 33, a connecting groove 37 is opened on one side of the bottom moving platform 13 where the handle 18 is provided, the wire groove 36 penetrates into the connecting groove 37, a pulley 1 38 is rotatably provided on the inner wall of the connecting groove 37, a mounting groove 39 is opened on one side of the handle 18, two pulleys 40 are symmetrically rotatably provided on the inner wall of the mounting groove 39, a pull rope 41 is fixed to one end of the moving column 34, one end of the pull rope 41 passes through the wire groove 36, the connecting groove 37 and the mounting groove 39 in sequence, one end of the pull rope 41 is fixedly connected to the inner wall of the handle 18, and the pull rope 41 is in contact with the surfaces of the pulley 1 38 and the pulley 2 40, and the movement of the pull rope 41 is guided by the provided pulley 1 38 and the pulley 2 40.

[0061] Reference Figure 5 , Figure 7 and Figure 8 In the initial state, the end of the movable column 34 is inserted into the insertion groove, thereby cooperating with the limit baffle 19 to limit and fix the bottom movable platform 13, so as to avoid the bottom movable platform 13 from shaking when the device is processed, thereby affecting the use effect. When it is necessary to pull the bottom movable platform 13 outward, the user can put his finger into the handle 18 (in the area between the pull rope 41 and the side wall of the bottom movable platform 13), and then move the finger away from the bottom movable platform 13. The finger will resist and squeeze the pull rope 41, and the pull rope 41 will be displaced under the guidance of the pulley 2 40 and the pulley 1 38, thereby pulling the movable column 34 to be displaced, prompting the end of the movable column 34 to move out of the insertion groove, thereby releasing the limit fixation of the bottom movable platform 13, so that the bottom movable platform 13 can be pulled to move, which is convenient to use.

[0062] When the present invention is used, refer to Figure 2-Figure 4 , place the device to be adjusted (a combination of wafer Die and PCB circuit board) on the chuck plate 9, and then move the chuck plate 9 with the device to be adjusted to the bottom of the adjustment probe body 7, and manually adjust the XYZ axis knob of the probe seat 5 (conventional technical means) to prompt the hook-shaped structure at the end of the adjustment probe body 7 to hook the lead to be adjusted, and then adjust the XYZ axis knob of the probe seat 5 accordingly, cooperate with the adjustment probe body 7 to pull apart a specific lead, so that the lead and the adjacent lead are independent of each other, or pull apart a specific lead for re-bonding. The whole process is less time-consuming, has a low operating error rate, and will not damage the wafer Die. Among a large number of leads, a single lead can be accurately adjusted to improve the success rate of lead bonding and speed up device testing efficiency;

[0063] Reference Figure 5 , Figure 7 and Figure 8In the initial state, the end of the movable column 34 is inserted into the insertion groove, thereby cooperating with the limit baffle 19 to limit and fix the bottom movable platform 13, so as to avoid the bottom movable platform 13 from shaking when the device is processed, thereby affecting the use effect. When it is necessary to pull the bottom movable platform 13 outward, the user can put his finger into the handle 18 (in the area between the pull rope 41 and the side wall of the bottom movable platform 13), and then move the finger away from the bottom movable platform 13. The finger will resist and squeeze the pull rope 41, and the pull rope 41 will be displaced under the guidance of the pulley 2 40 and the pulley 1 38, thereby pulling the movable column 34 to be displaced, prompting the end of the movable column 34 to move out of the insertion groove, thereby releasing the limit fixation of the bottom movable platform 13, so that the bottom movable platform 13 can be pulled to move, which is convenient to use.

[0064] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A rapid trimming method based on wire bonding, characterized in that: The following steps are involved: Step 1: Move the chuck plate (9), place the device to be adjusted on the chuck plate (9), and move the chuck plate (9) with the device to be adjusted to the bottom of the adjustment probe body (7); Step 2: manually adjust the XYZ axis knob of the probe holder (5) to cause the hook-shaped structure at the end of the trimming probe body (7) to hook the lead wire that needs to be trimmed; Step 3: By adjusting the XYZ axis knobs of the probe holder (5) accordingly, the probe body (7) is adjusted to pull apart a specific lead, and then re-bonding is performed as needed.

2. The rapid adjustment method based on wire bonding according to claim 1, characterized in that: In step one, in the initial state, the end of the movable column (34) is inserted into the insertion groove, thereby cooperating with the limiting baffle (19) to limit and fix the bottom movable platform (13).

3. The rapid trimming method based on wire bonding according to claim 1, characterized in that: In step one, the bottom movable platform (13) is pulled horizontally and vertically by the handle (18), thereby driving the middle movable platform (14), the upper movable platform (15), the lifting platform (16) and the chuck plate (9) to move, thereby causing the chuck plate (9) to move away from the U-shaped needle seat platform (4).

4. The rapid trimming method based on wire bonding according to claim 3, characterized in that: In step one, when it is necessary to pull the bottom moving platform (13) outward, the user can insert a finger into the handle (18) and then move the finger in a direction away from the bottom moving platform (13).

5. The rapid trimming method based on wire bonding according to claim 4, characterized in that: In step one, the finger will contact and squeeze the pull rope (41) during the movement, and the pull rope (41) will be displaced under the guidance of the second pulley (40) and the first pulley (38), thereby pulling the movable column (34) to be displaced, causing the end of the movable column (34) to move out of the insertion groove, thereby releasing the limit fixation of the bottom movable platform (13), so that the bottom movable platform (13) can be pulled to move.

6. The rapid trimming method based on wire bonding according to claim 1, characterized in that: In step one, after the device to be adjusted is placed on the chuck plate (9), the bottom moving platform (13) is urged to bring the middle moving platform (14), the upper moving platform (15), the lifting platform (16) and the chuck plate (9) back to the initial position.

7. The rapid trimming method based on wire bonding according to claim 6, characterized in that: In step 1, the CCD camera (8) cooperates with the computer to control the motor 1 (24) to drive the screw 1 (23) to rotate, and the screw 1 (23) drives the middle moving platform (14) to move horizontally, thereby driving the upper moving platform (15), the lifting platform (16), the chuck plate (9) and the device to be processed to move, and fine-tune the position of the device to be processed.

8. The rapid trimming method based on wire bonding according to claim 6, characterized in that: In step 1, the CCD camera (8) cooperates with the computer to control the motor 2 (28) to drive the screw 2 (27) to rotate, and the screw 2 (27) drives the upper moving platform (15) to move horizontally and vertically, thereby driving the lifting platform (16), the chuck plate (9) and the device to be processed to move, and fine-tune the position of the device to be processed.

9. According to the rapid adjustment method based on wire bonding and its adjustment probe as described in claim 6, in step 1, the CCD camera (8) cooperates with the computer to control the motor three (31) to drive the screw three (32) to rotate, and the screw three (32) drives the lifting platform (16) to move up and down, thereby moving the chuck plate (9) and the device to be processed, and fine-tuning the position of the device to be processed.

10. A trimming probe based on wire bonding, comprising a trimming probe body (7) arranged on a probe seat (5) through a probe fixture (6), characterized in that: The working end of the trimming probe body (7) is in the shape of a hook.

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