Onboard lightning protection device
By introducing a deduction component in the laboratory lightning protection device, it is separated when the temperature rises, solving the problem of burning the lapelistship due to continuous over voltage, and achieved the effect of preventing integrated circuit boards and having it. Good electrical performance.
Patent Information
- Application Number
- CN202411699103.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-01-21
AI Technical Summary
Existing on-board lightning protectors are prone to burning and ignition in the case of persistent overvoltage, causing the entire integrated circuit board to burn.
Design a laying lightning -proof, using TVS chip, first electrode, second electrode, insulation packaging parts, deducting electrodes, and deduction components. The deduction component is separated by the increased temperature to avoid burning due to high temperature.
Effectively avoid the burning of the lapeller's lapelomy due to the high temperature, thereby preventing the entire integrated circuit board from burning, and at the same time, it has the characteristics of small volume, low residual pressure, and large streaming.
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Figure CN119340945A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of board-mounted surge protection, and in particular to a board-mounted lightning arrester. Background Art
[0002] The onboard lightning arrester is an electronic device that provides safety protection for other electronic components in the integrated circuit board. When an overvoltage suddenly occurs in the integrated circuit board due to external interference, the onboard lightning arrester can conduct and shunt in a very short time, thereby preventing the surge from damaging other electronic components.
[0003] However, in the case of continuous overvoltage, the on-board lightning arrester is prone to burn and catch fire, which in turn causes the entire integrated circuit board to burn out. Summary of the invention
[0004] In order to solve the problems existing in the prior art, an object of the present invention is to provide a board-mounted lightning arrester.
[0005] The present invention provides the following technical solutions:
[0006] A board-mounted lightning arrester comprises a TVS chip, a first electrode, a second electrode, an insulating package, a tripping electrode and a tripping assembly;
[0007] The first electrode and the second electrode are electrically connected to the TVS chip respectively, the insulating package covers the TVS chip, the first electrode and the second electrode, and the first electrode is provided with a first pin exposed on the surface of the insulating package, and the second electrode is provided with a first release portion exposed on the surface of the insulating package;
[0008] The tripping electrode is provided with a second pin and a second tripping part, the second tripping part is welded to the first tripping part by solder, and the tripping assembly separates the second tripping part from the first tripping part when the temperature rises to melt the solder.
[0009] As a further optional solution for the onboard lightning arrester, the first electrode is provided with a first step portion, and an end of the first step portion away from the TVS chip is connected to the first pin; and / or
[0010] The second electrode is provided with a second step portion, and one end of the second step portion away from the TVS chip is connected to the first tripping portion.
[0011] As a further optional solution for the onboard lightning arrester, the first electrode is provided with a first positioning portion, the first positioning portion is connected to the first pin, and the first positioning portion has an unbent state and a bent state;
[0012] When the first positioning portion is in the unbent state, the first positioning portion is located outside the insulating encapsulation component and is used to position the first electrode when forming the insulating encapsulation component;
[0013] When the first positioning portion is in the bent state, the first positioning portion is attached to the surface of the insulating package.
[0014] As a further optional solution for the onboard lightning arrester, the second electrode is provided with a third pin exposed on the surface of the insulating enclosure.
[0015] As a further optional solution for the onboard lightning arrester, the second tripping portion is provided with a first through hole through which solder can pass.
[0016] As a further optional solution for the onboard lightning arrester, the trip assembly includes a sliding member and an elastic member, and the elastic member drives the sliding member to slide between the second tripping part and the first tripping part when the temperature rises to melt the solder, so as to separate the second tripping part from the first tripping part.
[0017] As a further optional solution for the onboard lightning arrester, the tripping electrode is provided with a resisting portion, the sliding member resists the resisting portion when the temperature is not increased to melt the solder, and the contact surface between the sliding member and the resisting portion obliquely intersects with the sliding direction of the sliding member;
[0018] Wherein, a second through hole is provided on the supporting portion.
[0019] As a further optional solution for the onboard lightning arrester, a guide groove is provided on the sliding member, the guide groove extends along the sliding direction of the sliding member, and the elastic member is accommodated in the guide groove; and / or
[0020] The tripping electrode is provided with a guide portion, the guide portion is extended along the sliding direction of the sliding member, and the guide portion is inserted into the elastic member.
[0021] As a further optional solution for the onboard lightning arrester, a slide rail is provided on the insulating enclosure, and the slide rail is extended along the sliding direction of the sliding member, and the sliding member is slidably matched with the insulating enclosure through the slide rail.
[0022] As a further optional solution to the onboard lightning arrester, the onboard lightning arrester further includes a shell, the shell is covered on the trip assembly and connected to the insulating enclosure;
[0023] The insulating package is provided with a positioning boss, and the housing is provided with a positioning groove matched with the positioning boss;
[0024] The insulating package is provided with a card slot, and the shell is provided with a card connection portion engaged with the card slot.
[0025] The embodiments of the present invention have the following beneficial effects:
[0026] In the above-mentioned on-board lightning arrester, the first electrode, the TVS chip, the second electrode and the tripping electrode are electrically connected in sequence, and the first pin of the first electrode and the second pin of the tripping electrode are respectively connected to the integrated circuit board. Under normal operating conditions, the TVS chip is in a disconnected state. When an overvoltage suddenly occurs in the integrated circuit board due to external interference, the TVS chip conducts and discharges the current, thereby preventing the surge from damaging other electronic components. In the case of a continuous overvoltage, the TVS chip generates heat, and the temperature rises, causing the solder welding the first tripping part and the second tripping part to melt. At this time, the tripping assembly separates the second tripping part from the first tripping part, thereby preventing the above-mentioned on-board lightning arrester from burning and catching fire due to excessive temperature, thereby preventing the entire integrated circuit board from burning.
[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.
[0029] Figure 1 The overall structural diagram of a board-mounted lightning arrester provided in Embodiment 1 of the present invention is shown;
[0030] Figure 2 A schematic diagram of the overall structure of a board-mounted lightning arrester provided in Embodiment 1 of the present invention from another perspective is shown;
[0031] Figure 3 A schematic diagram showing the connection relationship between a first electrode, a TVS chip and a second electrode in a board-mounted lightning arrester provided in Embodiment 1 of the present invention is shown;
[0032] Figure 4 A schematic structural diagram of an insulating package in a board-mounted lightning arrester provided in Embodiment 1 of the present invention is shown;
[0033] Figure 5 A schematic structural diagram of an insulating package in a board-mounted lightning arrester provided in Embodiment 1 of the present invention from another perspective is shown;
[0034] Figure 6 A schematic structural diagram of a third electrode in a board-mounted lightning arrester provided in Embodiment 1 of the present invention is shown;
[0035] Figure 7 A schematic diagram showing the matching relationship between a tripping electrode and a tripping assembly in a board-mounted lightning arrester provided in Embodiment 1 of the present invention is shown;
[0036] Figure 8 A schematic diagram of the internal structure of a board-mounted lightning arrester provided in Example 2 of the present invention is shown.
[0037] Description of main component symbols:
[0038] 100-TVS chip; 200-first electrode; 210-first pin; 220-first step; 230-first positioning portion; 300-second electrode; 310-first release portion; 320-second step; 330-third pin; 340-second positioning portion; 400-insulating package; 410-first avoidance groove; 420-second avoidance groove; 430-third avoidance groove; 440-fourth avoidance groove; 450-slide rail; 460-positioning boss; 470-card slot; 500-tripping electrode; 500a-first body; 500b-second body; 510-second pin; 520-second tripping portion; 521-first through hole; 530-holding portion; 531-second through hole; 540-guide portion; 600-tripping assembly; 610-sliding member; 611-guide slot; 620-elastic member; 700-third electrode; 710-fourth pin; 720-third positioning portion; 800-housing; 810-positioning slot; 820-clamping portion. DETAILED DESCRIPTION
[0039] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0040] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may also be a centered element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a centered element at the same time. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0041] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0042] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of the template are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0044] Example 1
[0045] See also Figure 1 , Figure 2 and Figure 3 This embodiment provides a board-mounted lightning arrester, including a TVS (Transient Voltage Suppressor) chip 100, a first electrode 200, a second electrode 300, an insulating package 400, a tripping electrode 500 and a tripping assembly 600.
[0046] The first electrode 200 and the second electrode 300 are respectively electrically connected to the TVS chip 100. The insulating package 400 covers the TVS chip 100, the first electrode 200 and the second electrode 300, and the first electrode 200 is provided with a first pin 210 exposed on the surface of the insulating package 400, and the second electrode 300 is provided with a first release portion 310 exposed on the surface of the insulating package 400.
[0047] Exemplarily, the insulating encapsulation 400 is made of epoxy resin, and the insulating encapsulation 400 is injection molded. During the processing, the connected first electrode 200, TVS chip 100 and second electrode 300 are placed in the cavity of the injection mold, so that the first pin 210 and the first release part 310 are respectively attached to the inner wall of the cavity, and then epoxy resin is injected into the injection mold. After the epoxy resin is cured, the formed insulating encapsulation 400 wraps the TVS chip 100 and most of the first electrode 200 and the second electrode 300. Since the first pin 210 and the first release part 310 are respectively attached to the inner wall of the cavity, the first pin 210 and the first release part 310 are not completely wrapped by the insulating encapsulation 400, but are exposed on the surface of the insulating encapsulation 400.
[0048] In addition, the tripping electrode 500 is provided with a second pin 510 and a second tripping part 520, and the second tripping part 520 is soldered to the first tripping part 310 by solder. Accordingly, the tripping assembly 600 separates the second tripping part 520 from the first tripping part 310 when the temperature rises to melt the solder.
[0049] Exemplarily, the solder is tin, and the solder alloy composition meets the requirement of not softening during reflow soldering, so that the above-mentioned on-board lightning arrester can be subsequently soldered and fixed on the integrated circuit board together with other electronic components using a conventional reflow soldering process.
[0050] In the above-mentioned board-mounted lightning arrester, the first electrode 200, the TVS chip 100, the second electrode 300 and the tripping electrode 500 are electrically connected in sequence, and the first pin 210 of the first electrode 200 and the second pin 510 of the tripping electrode 500 are respectively welded on the integrated circuit board. Among them, the first pin 210 is the main current-passing pin, and the second pin 510 is the tripping electrode 500 pin.
[0051] Under normal working conditions, the TVS chip 100 is in a disconnected state. When an overvoltage suddenly occurs in the integrated circuit board due to external interference, the TVS chip 100 is turned on to discharge current, thereby preventing the surge from damaging other electronic components.
[0052] When the overvoltage persists, the TVS chip 100 generates heat, and the temperature rises, melting the solder that solders the first tripping part 310 and the second tripping part 520. At this time, the tripping assembly 600 separates the second tripping part 520 from the first tripping part 310, preventing the onboard lightning arrester from burning due to excessive temperature, thereby preventing the entire integrated circuit board from burning.
[0053] See also Figure 3 In some embodiments, the first electrode 200 is provided with a first step portion 220 , and one end of the first step portion 220 away from the TVS chip 100 is connected to the first pin 210 .
[0054] Specifically, the main body of the first electrode 200 is horizontally arranged and attached to the bottom surface of the TVS chip 100, and the edge of the main body of the first electrode 200 extends outward to form a first step portion 220 and a first pin 210. The first step portion 220 is vertically arranged, the top of the first step portion 220 is connected to the main body of the first electrode 200, and the bottom of the first step portion 220 is connected to the first pin 210. The first pin 210 is horizontally arranged and parallel to the bottom surface of the insulating encapsulation 400. During the processing, the main body of the first electrode 200, the first step portion 220 and the first pin 210 are integrally bent and formed.
[0055] At this time, a certain height difference is formed between the first pin 210 and the TVS chip 100. After the insulating encapsulation 400 is injection molded, the side of the TVS chip 100 facing the first electrode 200 is wrapped by the insulating encapsulation 400 of a certain thickness. When the first pin 210 is welded on the integrated circuit board, this part of the insulating encapsulation 400 can play a role in heat insulation, preventing the TVS chip 100 from being affected by the welding process. During long-term use, this part of the insulating encapsulation 400 can also enhance the environmental tolerance of the TVS chip 100.
[0056] In addition, when the designed thickness of the TVS chip 100 changes, it is only necessary to adjust the length of the first step portion 220 to keep the overall thickness of the first electrode 200, the TVS chip 100, and the second electrode 300 unchanged, without redesigning and manufacturing the injection mold. In other words, the same set of injection molds can be used to complete the injection molding process of multiple products, greatly saving production costs.
[0057] Furthermore, when there is an error in the thickness of the TVS chip 100, especially when the thickness of the TVS chip 100 exceeds the design value, since the first electrode 200, the first step portion 220 and the first pin 210 are usually made of metal and have good elasticity after bending, the first step portion 220 can adaptively deform during the closing process of the injection mold to compensate for the thickness error of the TVS chip 100, avoid the TVS chip 100 being squeezed and damaged by the injection mold, and improve the product yield.
[0058] Similarly, in some embodiments, the second electrode 300 is provided with a second step portion 320 , and one end of the second step portion 320 away from the TVS chip 100 is connected to the first tripping portion 310 .
[0059] Specifically, the main body of the second electrode 300 is horizontally arranged and adhered to the top surface of the TVS chip 100, and the edge of the main body of the second electrode 300 extends outward to form a second step portion 320 and a first release portion 310. The second step portion 320 is tilted upward, the bottom end of the second step portion 320 is connected to the main body of the second electrode 300, and the top end of the second step portion 320 is connected to the first release portion 310. The first release portion 310 is horizontally arranged and parallel to the top surface of the insulating encapsulation 400. During the processing, the main body of the second electrode 300, the second step portion 320 and the first release portion 310 are integrally bent and formed.
[0060] At this time, a certain height difference is formed between the first tripping part 310 and the TVS chip 100. After the insulating encapsulation 400 is injection molded, the side of the TVS chip 100 facing the second electrode 300 is wrapped by the insulating encapsulation 400 of a certain thickness. When the first tripping part 310 and the second tripping part 520 are welded, this part of the insulating encapsulation 400 can play a role in heat insulation, preventing the TVS chip 100 from being affected by the welding process. During long-term use, this part of the insulating encapsulation 400 can also enhance the environmental tolerance of the TVS chip 100.
[0061] In addition, when the designed thickness of the TVS chip 100 changes, it is only necessary to adjust the length of the second step portion 320 to keep the overall thickness of the second electrode 300, the TVS chip 100, and the second electrode 300 unchanged, without redesigning and manufacturing the injection mold. In other words, the same set of injection molds can be used to complete the injection molding process of multiple products, greatly saving production costs.
[0062] Furthermore, when there is an error in the thickness of the TVS chip 100, especially when the thickness of the TVS chip 100 exceeds the design value, since the second electrode 300, the second step portion 320 and the first release portion 310 are usually made of metal and have good elasticity after bending, the second step portion 320 can adaptively deform during the closing process of the injection mold to compensate for the thickness error of the TVS chip 100, avoid the TVS chip 100 being squeezed and damaged by the injection mold, and improve the product yield.
[0063] In some embodiments, the first electrode 200 is provided with a first positioning portion 230. The first positioning portion 230 is connected to the first pin 210, and the first positioning portion 230 has an unbent state and a bent state.
[0064] When the first positioning portion 230 is in an unbent state, the first positioning portion 230 is located outside the insulating encapsulation member 400 and is used to position the first electrode 200 when the insulating encapsulation member 400 is formed.
[0065] Specifically, the first positioning portion 230 is connected to one end of the first pin 210 away from the first step portion 220. During the process of injection molding the insulating encapsulation 400, the first positioning portion 230 is located outside the cavity of the injection mold and cooperates with the positioning structure on the injection mold to position the first electrode 200. After the epoxy resin in the cavity is cured to form the insulating encapsulation 400, the first positioning portion 230 is located outside the insulating encapsulation 400.
[0066] When the first positioning portion 230 is in a bent state, the first positioning portion 230 is attached to the surface of the insulating package 400 .
[0067] Specifically, after the insulating package 400 is injection molded, the first positioning portion 230 is bent upward so that the first positioning portion 230 is attached to the surface of the insulating package 400, so as to observe and detect the welding condition of the first pin 210 from the side when welding the first pin 210.
[0068] Please combine Figure 4 Furthermore, a first avoidance groove 410 is provided on the surface of the insulating package 400 , and the first positioning portion 230 is bent upward and embedded in the first avoidance groove 410 .
[0069] Please refer again Figure 3 In some embodiments, the second electrode 300 is provided with a third pin 330 exposed on the surface of the insulating package 400 .
[0070] It can be understood that the third pin 330 is a sampling or tripping signal output pin. When the first tripping unit 310 is connected to the second tripping unit 520, the third pin 330 is connected to the second pin 510. When the first tripping unit 310 is separated from the second tripping unit 520, the third pin 330 is disconnected from the second pin 510. Therefore, by monitoring whether the third pin 330 is connected to the second pin 510 through the voltage monitoring circuit, it can be confirmed whether the above-mentioned onboard lightning arrester is tripped.
[0071] Similarly, the second electrode 300 is further provided with a second positioning portion 340. The second positioning portion 340 is connected to the third pin 330, and the second positioning portion 340 has an unbent state and a bent state.
[0072] When the second positioning portion 340 is in an unbent state, the second positioning portion 340 is located outside the insulating encapsulation member 400 and is used to position the second electrode 300 when the insulating encapsulation member 400 is molded.
[0073] When the second positioning portion 340 is in a bent state, the second positioning portion 340 is attached to the surface of the insulating package 400 , so that the welding condition of the third pin 330 can be observed and detected from the side when the third pin 330 is welded.
[0074] Please combine Figure 5 Furthermore, a second avoidance groove 420 is provided on the surface of the insulating package 400 , and the second positioning portion 340 is bent upward and embedded in the second avoidance groove 420 .
[0075] See also Figure 6 Furthermore, the above-mentioned onboard lightning arrester also includes a third electrode 700. The third electrode 700 is a hollow electrode, which is covered by the insulating package 400. The third electrode 700 is provided with a fourth pin 710 exposed on the surface of the insulating package 400, and a third positioning portion 720 connected to the fourth pin 710.
[0076] The fourth pin 710 is a blank pin, which is soldered on the integrated circuit board together with the first pin 210 , the second pin 510 , and the third pin 330 to strengthen the fixation.
[0077] In addition, the third positioning portion 720 is located outside the insulating encapsulation member 400 when it is in an unbent state, and positions the third electrode 700 during the process of injection molding the insulating encapsulation member 400. The third positioning portion 720 is attached to the surface of the insulating encapsulation member 400 when it is in a bent state, so that the welding condition of the fourth pin 710 can be observed and detected from the side when the fourth pin 710 is welded.
[0078] Please combine Figure 5 Correspondingly, a third avoidance groove 430 is provided on the surface of the insulating package 400 , and the third positioning portion 720 is bent upward and embedded in the third avoidance groove 430 .
[0079] See also Figure 7 In some embodiments, one end of the trip electrode 500 is located above the insulating package 400 and is provided with a second trip portion 520. The main body of the trip electrode 500 extends downward along the side of the insulating package 400 and is provided with a second pin 510. The second pin 510 is located on the bottom surface of the insulating package 400 and is coplanar with the first pin 210, the third pin 330, and the fourth pin 710 to facilitate patch welding.
[0080] Please combine Figure 5 Correspondingly, a fourth avoidance groove 440 for the second pin 510 to be embedded is provided on the bottom surface of the insulating package 400.
[0081] Please refer again Figure 7 Furthermore, the second release portion 520 is provided with a first through hole 521 through which solder can pass.
[0082] When the second release part 520 is welded to the first release part 310 , the molten solder can flow to the surface of the first release part 310 through the first through hole 521 to better combine with the first release part 310 , thereby ensuring a stable connection between the second release part 520 and the first release part 310 .
[0083] In some embodiments, the trip assembly 600 includes a sliding member 610 and an elastic member 620. The elastic member 620 drives the sliding member 610 to slide between the second tripping portion 520 and the first tripping portion 310 when the temperature rises to melt the solder, so as to separate the second tripping portion 520 from the first tripping portion 310.
[0084] Specifically, the sliding member 610 slides in a direction parallel to the top surface of the insulation enclosure 400 .
[0085] When the overvoltage persists, the TVS chip 100 generates heat, and the temperature rises, so that the solder for soldering the first release part 310 and the second release part 520 melts. At this time, the solder no longer fixes the second release part 520, and the second release part 520 is in an active state. On this basis, the elastic member 620 drives the sliding member 610 to slide between the second release part 520 and the first release part 310, so as to separate the second release part 520 from the first release part 310, ensure that the second release part 520 is disconnected from the first release part 310, and completely cut off the arc, tin wire, etc. during the operation.
[0086] Exemplarily, the elastic member 620 is a compression spring, and the elastic members 620 are arranged in pairs so that the sliding member 610 is evenly stressed.
[0087] Furthermore, the tripping electrode 500 is provided with a resisting portion 530 . The sliding member 610 resists the resisting portion 530 when the temperature is not increased to melt the solder, and the contact surface between the sliding member 610 and the resisting portion 530 intersects obliquely with the sliding direction of the sliding member 610 .
[0088] Since the contact surface between the sliding member 610 and the supporting portion 530 is obliquely intersected with the sliding direction of the sliding member 610, the sliding member 610 applies an oblique upward force to the supporting portion 530 driven by the elastic member 620, so that the second release portion 520 can be separated from the first release portion 310 more smoothly after the solder melts.
[0089] In addition, a second through hole 531 is disposed on the resisting portion 530 .
[0090] The second through hole 531 can reduce the contact area between the abutting portion 530 and the sliding member 610 , thereby reducing the heat transferred to the sliding member 610 through the abutting portion 530 when welding the second release portion 520 and the first release portion 310 , so that the sliding member 610 is not easily melted.
[0091] Exemplarily, the sliding member 610 is made of high temperature resistant LCP (Liquid Crystal Polymer) material.
[0092] Furthermore, a guide groove 611 is provided on the sliding member 610 . The guide groove 611 is extended along the sliding direction of the sliding member 610 , and the elastic member 620 is accommodated in the guide groove 611 .
[0093] When in use, the guide groove 611 can limit and guide the elastic member 620, which is beneficial for the elastic member 620 to deform along the sliding direction of the sliding member 610, thereby smoothly pushing the sliding member 610 to slide.
[0094] Similarly, the tripping electrode 500 is provided with a guide portion 540 . The guide portion 540 is extended along the sliding direction of the sliding member 610 , and the guide portion 540 is inserted into the elastic member 620 .
[0095] When in use, the guide portion 540 can limit and guide the elastic member 620, which is beneficial for the elastic member 620 to deform along the sliding direction of the sliding member 610, thereby smoothly pushing the sliding member 610 to slide.
[0096] Furthermore, a slide rail 450 is provided on the insulating encapsulation member 400 . The slide rail 450 is extended along the sliding direction of the sliding member 610 , and the sliding member 610 is slidably matched with the insulating encapsulation member 400 through the slide rail 450 .
[0097] It can be understood that the slide rail 450 is integrally injection molded with the main body of the insulating package 400. When in use, the slide rail 450 limits and guides the sliding member 610, so that the sliding member 610 slides smoothly.
[0098] Please refer again Figure 1 and Figure 2 In some embodiments, the above-mentioned onboard lightning arrester further includes a housing 800 . The housing 800 is disposed on the trip assembly 600 and connected to the insulating enclosure 400 .
[0099] When in use, the housing 800 and the insulating enclosure 400 are combined to form an internal space, covering the trip assembly 600 and most of the trip electrodes 500, and playing the role of dust and moisture isolation and photoelectric shielding.
[0100] The insulating package 400 is provided with a positioning boss 460 , and the housing 800 is provided with a positioning groove 810 matched with the positioning boss 460 .
[0101] It can be understood that when the housing 800 is connected to the insulating package 400 , the positioning boss 460 is embedded in the positioning groove 810 to position the housing 800 .
[0102] In addition, the insulating package 400 is provided with a slot 470 , and the housing 800 is provided with a snap-fit portion 820 that is snap-fitted with the slot 470 .
[0103] During assembly, the outer shell 800 is covered on the insulating package 400 until the engaging portion 820 is engaged with the engaging groove 470 , thereby fixing the outer shell 800 and the insulating package 400 .
[0104] In short, the above-mentioned on-board lightning arrester can achieve mechanical tripping in the case of continuous overvoltage by setting the tripping component 600, thereby avoiding combustion and fire due to excessive temperature, and further avoiding the burning of the entire integrated circuit board. In addition, the above-mentioned on-board lightning arrester adopts the TVS chip 100, which has the characteristics of small size, low residual pressure and large flow. Furthermore, the first pin 210, the second pin 510, the third pin 330 and the fourth pin 710 of the above-mentioned on-board lightning arrester adopt the output mode of patch electrodes, which can reduce a large amount of plug-in and patch work and reduce the user's board layout space. It is suitable for large-scale integrated and highly automated welding scenes, and can be welded together with other electronic components using conventional reflow soldering processes.
[0105] Example 2
[0106] See also Figure 8 This embodiment provides a board-mounted lightning arrester. The difference from the embodiment 1 is that in this embodiment, only the first pin 210 and the second pin 510 are provided, the pins are packaged in a SMEJ standard package output mode using patch electrodes, and the package is packaged in a two-pin patch output mode.
[0107] In addition, the tripping electrode 500 is composed of a first body 500a and a second body 500b. The first body 500a is wrapped by the insulating encapsulation 400, and a second pin 510 is provided at one end of the first body 500a. The other end of the first body 500a is exposed on the top surface of the insulating encapsulation 400 and is welded to one end of the second body 500b. The second body 500b is located outside the insulating encapsulation 400, and a second tripping portion 520 is provided at one end of the second body away from the first body 500a.
[0108] In all examples shown and described herein, any specific values should be interpreted as merely exemplary and not as limiting, and thus other examples of the exemplary embodiments may have different values.
[0109] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0110] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.
Claims
1. A board-mounted lightning arrester, characterized in that: It includes a TVS chip, a first electrode, a second electrode, an insulating package, a tripping electrode and a tripping assembly; The first electrode and the second electrode are electrically connected to the TVS chip respectively, the insulating package covers the TVS chip, the first electrode and the second electrode, and the first electrode is provided with a first pin exposed on the surface of the insulating package, and the second electrode is provided with a first release portion exposed on the surface of the insulating package; The tripping electrode is provided with a second pin and a second tripping part, the second tripping part is welded to the first tripping part by solder, and the tripping assembly separates the second tripping part from the first tripping part when the temperature rises to melt the solder.
2. The board-mounted lightning arrester according to claim 1, characterized in that: The first electrode is provided with a first step portion, and one end of the first step portion away from the TVS chip is connected to the first pin; and / or The second electrode is provided with a second step portion, and one end of the second step portion away from the TVS chip is connected to the first tripping portion.
3. The board-mounted lightning arrester according to claim 1, characterized in that: The first electrode is provided with a first positioning portion, the first positioning portion is connected to the first pin, and the first positioning portion has an unbent state and a bent state; When the first positioning portion is in the unbent state, the first positioning portion is located outside the insulating encapsulation component and is used to position the first electrode when forming the insulating encapsulation component; When the first positioning portion is in the bent state, the first positioning portion is attached to the surface of the insulating package.
4. The board-mounted lightning arrester according to claim 1, characterized in that: The second electrode is provided with a third pin exposed on the surface of the insulating package.
5. The board-mounted lightning arrester according to claim 1, characterized in that: The second release portion is provided with a first through hole through which solder can pass.
6. The onboard lightning arrester according to any one of claims 1 to 5, characterized in that: The release assembly includes a sliding member and an elastic member. The elastic member drives the sliding member to slide between the second release portion and the first release portion when the temperature rises to melt the solder, so as to separate the second release portion from the first release portion.
7. The board-mounted lightning arrester according to claim 6, characterized in that: The tripping electrode is provided with a resisting portion, the sliding member resists the resisting portion when the temperature is not increased to melt the solder, and the contact surface between the sliding member and the resisting portion is obliquely intersected with the sliding direction of the sliding member; Wherein, a second through hole is provided on the supporting portion.
8. The board-mounted lightning arrester according to claim 6, characterized in that: The sliding member is provided with a guide groove, the guide groove is extended along the sliding direction of the sliding member, and the elastic member is accommodated in the guide groove; and / or The tripping electrode is provided with a guide portion, the guide portion is extended along the sliding direction of the sliding member, and the guide portion is inserted into the elastic member.
9. The board-mounted lightning arrester according to claim 6, characterized in that: The insulating encapsulation member is provided with a slide rail, the slide rail is extended along the sliding direction of the sliding member, and the sliding member is slidably matched with the insulating encapsulation member through the slide rail.
10. The onboard lightning arrester according to any one of claims 1 to 5, characterized in that: The onboard lightning arrester further comprises a housing, which is disposed on the trip assembly and connected to the insulating enclosure; The insulating package is provided with a positioning boss, and the housing is provided with a positioning groove matched with the positioning boss; The insulating package is provided with a card slot, and the shell is provided with a card connection portion engaged with the card slot.