Intelligent power module and load driving circuit

Abstract

The embodiment of the invention provides an intelligent power module and a load driving circuit, the intelligent power module comprises a rectification circuit, an inversion circuit and a driving circuit, the rectification circuit is connected with an alternating current power supply connected with an inductor and a capacitor, the rectification circuit converts alternating current provided by the alternating current power supply into direct current, and the inversion circuit is connected with the driving circuit. The direct current is supplied to the inverter circuit and the driving circuit; the driving circuit is used for receiving a logic control signal and controlling the opening and closing of a power chip of the inverter circuit according to the logic control signal; and the inverter circuit is used for converting the direct current into controllable alternating current based on the logic control signal so as to control a load to work through the controllable alternating current. The intelligent power module provided by the embodiment of the invention not only integrates the driving circuit and the inverter circuit, but also integrates the rectifying circuit capable of converting the alternating current into the direct current, so that the integration level of the intelligent power module is high.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of circuit technology, and in particular to an intelligent power module and a load driving circuit. Background Art

[0002] An intelligent power module (IPM) is an intelligent power switching device. The IPM integrates both a power chip and a control chip, offering high speed and low power consumption. It combines the high current density, low saturation voltage, and high-voltage resistance of a GTR (Giant Transistor), with the high input impedance, high switching frequency, and low drive power of a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). Furthermore, the IPM offers protection features such as undervoltage, overheating, overcurrent, and short-circuit protection. Its small size, compact layout, and ease of use make it widely used in industries such as home appliances, industry, and energy.

[0003] However, current intelligent power modules all use direct current (DC). Therefore, using an intelligent power module requires converting normal AC power to standard DC power; otherwise, the intelligent power module will not function properly. This conversion is accomplished through external circuitry within the intelligent power module. This necessitates the use of a rectifier circuit and a PFC (Power Factor Correction) circuit to function properly. This results in a low level of integration for the intelligent power module and a large printed circuit board (PCB) footprint. Summary of the Invention

[0004] The purpose of the embodiments of the present invention is to provide an intelligent power module and a load driving circuit. The specific technical solutions are as follows:

[0005] In an embodiment of the present invention, an intelligent power module is provided. The intelligent power module includes a rectifier circuit, an inverter circuit, and a drive circuit. The rectifier circuit is connected to an AC power supply connected to an inductor and a capacitor, wherein:

[0006] The rectifier circuit converts the AC power provided by the AC power source into DC power, and provides the DC power to the inverter circuit and the drive circuit;

[0007] The driving circuit is configured to receive a logic control signal and control the power chip of the inverter circuit to be turned on and off according to the logic control signal;

[0008] The inverter circuit is used to convert the direct current into controllable alternating current based on the logic control signal, so as to control the operation of a load through the controllable alternating current.

[0009] Optionally, the power chips in the rectifier circuit and the inverter circuit are respectively connected to diodes.

[0010] Optionally, the inverter circuit includes a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip, and a sixth power chip; the drive circuit includes a first control chip and a second control chip; the rectifier circuit includes a seventh power chip and an eighth power chip; and the drive circuit further includes a third control chip; the collector of the first power chip is connected to the emitter of the seventh power chip through the capacitor; the collector of the eighth power chip is connected to the collectors of the first power chip, the second power chip, and the third power chip;

[0011] The microcontroller unit is connected to the input pin of the first control chip, the input pin of the second control chip, and the input pin of the third control chip;

[0012] The output pin of the first control chip is connected to the gates of the first power chip, the second power chip and the third power chip;

[0013] The output pin of the second control chip is connected to the gates of the fourth power chip, the fifth power chip and the sixth power chip;

[0014] The output pin of the third control chip is connected to the gates of the seventh power chip and the eighth power chip.

[0015] Optionally, the emitter of the first power chip and the collector of the fourth power chip are connected to the output pin of the first control chip, and then a first control pin is led out and connected to the load;

[0016] The emitter of the second power chip and the collector of the fifth power chip are connected to the output pin of the first control chip, and then a second control pin is led out and connected to the load;

[0017] The emitter of the third power chip and the collector of the sixth power chip are connected to the output pin of the first control chip, and then a third control pin is led out and connected to the load.

[0018] Optionally, emitters of the fourth power chip, the fifth power chip, and the sixth power chip are connected to resistors and then grounded.

[0019] Optionally, the collector of the seventh power chip and the emitter of the eighth power chip are connected to the AC power supply via an inductor.

[0020] Optionally, the intelligent power module further includes a lead frame, aluminum wires and gold wires.

[0021] Optionally, the intelligent power module further includes a heat sink.

[0022] Optionally, the load includes at least a motor.

[0023] Optionally, the rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are packaged in a plastic package according to a preset packaging process.

[0024] An embodiment of the present invention further discloses a load drive circuit, comprising an intelligent power module and a peripheral circuit, wherein the peripheral circuit comprises an AC power supply, a capacitor, an inductor, a resistor, and a load; the intelligent power module comprises a rectifier circuit, an inverter circuit, and a drive circuit, wherein the rectifier circuit is connected to the AC power supply connected to the inductor and the capacitor, wherein:

[0025] The rectifier circuit converts the AC power provided by the AC power source into DC power, and provides the DC power to the inverter circuit and the drive circuit;

[0026] The driving circuit is configured to receive a logic control signal and control the power chip of the inverter circuit to be turned on and off according to the logic control signal;

[0027] The inverter circuit is used to convert the direct current into controllable alternating current based on the logic control signal, so as to control the operation of a load through the controllable alternating current.

[0028] Optionally, the power chips in the rectifier circuit and the inverter circuit are respectively connected to diodes.

[0029] Optionally, the inverter circuit includes a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip, and a sixth power chip; the drive circuit includes a first control chip and a second control chip; the rectifier circuit includes a seventh power chip and an eighth power chip; and the drive circuit further includes a third control chip; the collector of the first power chip is connected to the emitter of the seventh power chip through the capacitor; the collector of the eighth power chip is connected to the collectors of the first power chip, the second power chip, and the third power chip;

[0030] The microcontroller unit is connected to the input pin of the first control chip, the input pin of the second control chip, and the input pin of the third control chip;

[0031] The output pin of the first control chip is connected to the gates of the first power chip, the second power chip and the third power chip;

[0032] The output pin of the second control chip is connected to the gates of the fourth power chip, the fifth power chip and the sixth power chip;

[0033] The output pin of the third control chip is connected to the gates of the seventh power chip and the eighth power chip.

[0034] Optionally, the emitter of the first power chip and the collector of the fourth power chip are connected to the output pin of the first control chip, and then a first control pin is led out and connected to the load;

[0035] The emitter of the second power chip and the collector of the fifth power chip are connected to the output pin of the first control chip, and then a second control pin is led out and connected to the load;

[0036] The emitter of the third power chip and the collector of the sixth power chip are connected to the output pin of the first control chip, and then a third control pin is led out and connected to the load.

[0037] Optionally, emitters of the fourth power chip, the fifth power chip, and the sixth power chip are connected to resistors and then grounded.

[0038] Optionally, the collector of the seventh power chip and the emitter of the eighth power chip are connected to the AC power supply via an inductor.

[0039] Optionally, the intelligent power module further includes a lead frame, aluminum wires and gold wires.

[0040] Optionally, the intelligent power module further includes a heat sink.

[0041] Optionally, the load includes at least a motor.

[0042] Optionally, the rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are packaged in a plastic package according to a preset packaging process.

[0043] An embodiment of the present invention further discloses an air conditioner including a load drive circuit, wherein the load drive circuit includes an intelligent power module and a peripheral circuit, wherein the peripheral circuit includes an AC power supply, a capacitor, an inductor, a resistor, and a load; the intelligent power module includes a rectifier circuit, an inverter circuit, and a drive circuit, wherein the rectifier circuit is connected to the AC power supply connected to the inductor and the capacitor, wherein:

[0044] The rectifier circuit converts the AC power provided by the AC power source into DC power, and provides the DC power to the inverter circuit and the drive circuit;

[0045] The driving circuit is configured to receive a logic control signal and control the power chip of the inverter circuit to be turned on and off according to the logic control signal;

[0046] The inverter circuit is used to convert the direct current into controllable alternating current based on the logic control signal, so as to control the operation of a load through the controllable alternating current.

[0047] Optionally, the power chips in the rectifier circuit and the inverter circuit are respectively connected to diodes.

[0048] Optionally, the inverter circuit includes a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip, and a sixth power chip; the drive circuit includes a first control chip and a second control chip; the rectifier circuit includes a seventh power chip and an eighth power chip; and the drive circuit further includes a third control chip; the collector of the first power chip is connected to the emitter of the seventh power chip through the capacitor; the collector of the eighth power chip is connected to the collectors of the first power chip, the second power chip, and the third power chip;

[0049] The microcontroller unit is connected to the input pin of the first control chip, the input pin of the second control chip, and the input pin of the third control chip;

[0050] The output pin of the first control chip is connected to the gates of the first power chip, the second power chip and the third power chip;

[0051] The output pin of the second control chip is connected to the gates of the fourth power chip, the fifth power chip and the sixth power chip;

[0052] The output pin of the third control chip is connected to the gates of the seventh power chip and the eighth power chip.

[0053] Optionally, the emitter of the first power chip and the collector of the fourth power chip are connected to the output pin of the first control chip, and then a first control pin is led out and connected to the load;

[0054] The emitter of the second power chip and the collector of the fifth power chip are connected to the output pin of the first control chip, and then a second control pin is led out and connected to the load;

[0055] The emitter of the third power chip and the collector of the sixth power chip are connected to the output pin of the first control chip, and then a third control pin is led out and connected to the load.

[0056] Optionally, emitters of the fourth power chip, the fifth power chip, and the sixth power chip are connected to resistors and then grounded.

[0057] Optionally, the collector of the seventh power chip and the emitter of the eighth power chip are connected to the AC power supply via an inductor.

[0058] Optionally, the intelligent power module further includes a lead frame, aluminum wires and gold wires.

[0059] Optionally, the intelligent power module further includes a heat sink.

[0060] Optionally, the load includes at least a motor.

[0061] Optionally, the rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are packaged in a plastic package according to a preset packaging process.

[0062] Compared with the related art, the embodiments of the present invention have at least the following advantages:

[0063] In an embodiment of the present invention, an intelligent power module includes a rectifier circuit, an inverter circuit, and a driver circuit. The rectifier circuit is connected to an AC power source connected to an inductor and a capacitor. The rectifier circuit converts AC power provided by the AC power source into DC power and provides the DC power to the inverter circuit and the driver circuit. The driver circuit receives a logic control signal and controls the on / off state of a power chip in the inverter circuit according to the logic control signal. The inverter circuit converts the DC power into controllable AC power based on the logic control signal, thereby controlling the operation of a load through the controllable AC power. The intelligent power module of the embodiment of the present invention integrates not only the driver circuit and the inverter circuit but also the rectifier circuit. Therefore, the AC power provided by the AC power source can be converted into DC power within the intelligent power module. Furthermore, the DC power can be converted into controllable AC power through the driver circuit and the inverter circuit to control the operation of the load. The intelligent power module has a high level of integration, which reduces the area of ​​the printed circuit board (PCB). Furthermore, the PCB does not require additional rectifier circuits, further reducing the area of ​​the PCB. This makes the intelligent power module more user-friendly and facilitates the layout of other circuits or components for application engineers. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for describing the embodiments or the prior art.

[0065] Figure 1 This is a structural block diagram of an intelligent power module provided in an embodiment of the present invention;

[0066] Figure 2 A schematic diagram of the circuit structure of an intelligent power module provided in an embodiment of the present invention;

[0067] Figure 3 A schematic diagram of the circuit structure of a traditional intelligent power module;

[0068] Figure 4 A schematic diagram of the appearance of an intelligent power module provided in an embodiment of the present invention;

[0069] Figure 5 A schematic diagram of the internal structure of an intelligent power module provided in an embodiment of the present invention;

[0070] Figure 6 A front view of the internal structure of an intelligent power module provided in an embodiment of the present invention;

[0071] Figure 7 A schematic diagram of a power chip patch provided in an embodiment of the present invention;

[0072] Figure 8 A schematic diagram of gold wire bonding provided in an embodiment of the present invention;

[0073] Figure 9 A schematic diagram of a frame assembly provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0074] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, each embodiment of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be understood by those skilled in the art that in each embodiment of the present invention, many technical details are provided to help readers better understand the present invention. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in the present invention can be implemented. The division of the following embodiments is for convenience of description and should not constitute a specific implementation of the present invention.

[0075] In practice, the intelligent power module (IPM) primarily consists of six power chips (power devices) and a driver circuit. The driver circuit may include a driver IC (Integrated Circuit / Driver Circuit). The power chips primarily control the switching of the U, V, W, NU, NV, and NW phases. The driver IC primarily controls the operation of the power chips and also provides various protection functions to prevent damage. The IPM circuit primarily consists of an inverter circuit. The driver circuit controls the on / off switching of the power chips within the inverter circuit, converting DC power into controllable AC power. In practical applications, the parameters of the driver circuit can be adjusted to control parameters such as the AC frequency, current, and conversion efficiency, thereby achieving precise control and optimization of power conversion.

[0076] Current intelligent power modules (IPMs) all use direct current (DC). Using an IPM requires converting normal AC power to standard DC; otherwise, the IPM will not function properly. This conversion is accomplished through the IPM's external circuitry. Consequently, the IPM requires a rectifier circuit (rectifier bridge) and a PFC (Power Factor Correction) circuit to function properly. This limits the application of IPMs. Furthermore, the external circuitry occupies a larger area on the PCB (Printed Circuit Board), affecting the layout of the IPM's power chips. This also increases system costs.

[0077] To address the above-mentioned issues, one of the core concepts of the embodiments of the present invention is to propose a multifunctional intelligent power module. This intelligent power module internally incorporates an inverter circuit and protection functions, and also includes a rectifier circuit for converting AC power to DC power. Therefore, the intelligent power module can perform conversion without external circuitry. The intelligent power module also features a compact design, convenient layout, and low cost. Furthermore, whereas traditional rectifier circuits are routed to the intelligent power module via printed circuit boards, resulting in longer circuits, the intelligent power module of the embodiments of the present invention has shorter internal circuitry than conventional intelligent power module systems, ensuring more stable operation and lower stray inductance.

[0078] Reference Figure 1 , is a structural block diagram of an intelligent power module provided in an embodiment of the present invention, such as Figure 1 As shown, the intelligent power module may include a rectifier circuit, an inverter circuit, and a drive circuit. The rectifier circuit is connected to an AC power supply connected to an inductor and a capacitor, wherein:

[0079] The rectifier circuit converts the AC power provided by the AC power source into DC power, and provides the DC power to the inverter circuit and the drive circuit;

[0080] The driving circuit is configured to receive a logic control signal and control the power chip of the inverter circuit to be turned on and off according to the logic control signal;

[0081] The inverter circuit is used to convert the direct current into controllable alternating current based on the logic control signal, so as to control the operation of a load through the controllable alternating current.

[0082] In an embodiment of the present invention, an intelligent power module includes a rectifier circuit, an inverter circuit, and a driver circuit. The rectifier circuit is connected to an AC power source connected to an inductor and a capacitor. The rectifier circuit converts AC power provided by the AC power source into DC power and provides the DC power to the inverter circuit and the driver circuit. The driver circuit receives a logic control signal and controls the on / off state of a power chip in the inverter circuit according to the logic control signal. The inverter circuit converts the DC power into controllable AC power based on the logic control signal, thereby controlling the operation of a load through the controllable AC power. The intelligent power module of the embodiment of the present invention integrates not only the driver circuit and the inverter circuit but also the rectifier circuit. Therefore, the AC power provided by the AC power source can be converted into DC power within the intelligent power module. Furthermore, the DC power can be converted into controllable AC power through the driver circuit and the inverter circuit to control the operation of the load. The intelligent power module has a high level of integration, which reduces the area of ​​the printed circuit board (PCB). Furthermore, the PCB does not require additional rectifier circuits, further reducing the area of ​​the PCB. This makes the intelligent power module more user-friendly and facilitates the layout of other circuits or components for application engineers.

[0083] In one embodiment of the present invention, the power chips in the rectifier circuit and the inverter circuit are respectively connected to diodes. The diodes may be FRDs (Fast Recovery Diodes). In a specific implementation, the power chip may be, for example, an IGBT, a MOSFET, etc., which may be connected to a fast recovery diode to achieve specific circuit functions and improve system performance. For example, the main function of the inverter circuit is to convert direct current into alternating current. The fast recovery diode may be in the inverter circuit. When the power device is turned off, the inductance in the load generates a reverse electromotive force, causing the current to continue to flow. At this time, the fast recovery diode provides a low-impedance path, allowing the current to continue to flow, thereby preventing voltage spikes and electromagnetic interference (EMI).

[0084] Reference Figure 2, is a schematic diagram of the circuit structure of an intelligent power module provided by an embodiment of the present invention. In one embodiment of the present invention, the inverter circuit may include a first power chip IGBT1, a second power chip IGBT2, a third power chip IGBT3, a fourth power chip IGBT4, a fifth power chip IGBT5, and a sixth power chip IGBT6. The drive circuit may include a first control chip HVIC1 and a second control chip LVIC; the rectifier circuit may include a seventh power chip IGBT7 and an eighth power chip IGBT8. The drive circuit may further include a third control chip HVIC2; the collector of the first power chip IGBT1 is connected to the emitter of the seventh power chip IGBT7 through the capacitor; the collector of the eighth power chip IGBT8 is connected to the collectors of the first power chip IGBT1, the second power chip IGBT2, and the third power chip IGBT3;

[0085] The microcontroller unit (MC control) is connected to the input pins of the first control chip HVIC1, the input pins of the second control chip LVIC and the input pins of the third control chip HVIC; wherein the input pins of HVIC1 may include pins such as VCCH.

[0086] The output pin of the first control chip HVIC1 is connected to the gates of the first power chip IGBT1, the second power chip IGBT2 and the third power chip IGBT3;

[0087] The output pin of the second control chip LVIC is connected to the gates of the fourth power chip IGBT4, the fifth power chip IGBT5 and the sixth power chip IGBT6;

[0088] The output pin of the third control chip HVIC2 is connected to the gates of the seventh power chip IGBT7 and the eighth power chip IGBT8.

[0089] Reference Figure 2 In one embodiment of the present invention, the emitter of the first power chip IGBT1 and the collector of the fourth power chip IGBT4 are connected to the output pin of the first control chip HVIC, and then a first control pin U is led out and connected to the load; the emitter of the second power chip IGBT2 and the collector of the fifth power chip IGBT5 are connected to the output pin of the first control chip HVIC, and then a second control pin V is led out and connected to the load; the emitter of the third power chip IGBT3 and the collector of the sixth power chip IGBT6 are connected to the output pin of the first control chip HVIC, and then a third control pin W is led out and connected to the load.

[0090] Reference Figure 2 In one embodiment of the present invention, the emitters of the fourth power chip IGBT4, the fifth power chip IGBT5, and the sixth power chip IGBT6 are connected to a resistor and then grounded. The collector of the seventh power chip IGBT7 and the emitter of the eighth power chip IGBT8 are connected to the AC power supply via an inductor. In this embodiment of the present invention, HVIC1 is connected to a bootstrap diode. By connecting the power supply of VCC to VB, the IGBT switch can be driven by the power energy of VB. When the AC power is in the negative half cycle and IGBT7 is turned on, the continuous on-state of IGBT7 requires HVIC1 to enter a bootstrap state. The bootstrap diode can prevent high voltage from being connected in series with the VCC voltage, thereby protecting components such as IGBTs in the circuit.

[0091] Reference Figure 3 , is a schematic diagram of the circuit structure of a traditional intelligent power module. When the traditional intelligent power module is working, the 220V AC input is rectified by the rectifier bridge (rectifier circuit) to 310V DC, and then adjusted by the PFC circuit to input into the inverter circuit of the intelligent power module, providing working power for the intelligent power module, thereby driving the motor or other load. Among them, the PFC circuit will automatically adjust the conversion efficiency according to the mains power grid and load fluctuations, improve the power factor of the power system, and enhance energy utilization efficiency.

[0092] When the intelligent power module of the embodiment of the present invention is in operation, an AC 220V input is connected, and a series inductor is connected to the intelligent power module to provide power for the intelligent power module. The intelligent power module converts the AC power into DC power through the IGBT and diode (FRD) switch inside the intelligent power module. The DC power is transmitted internally to the inverter circuit of the intelligent power module to drive the motor or other load to work.

[0093] It can be seen that traditional intelligent power modules require access to a DC module (rectifier bridge + PFC circuit) to operate, while the intelligent power module of the embodiment of the present invention can directly connect the mains (220V AC) in series with an inductor to enable the module to operate. The intelligent power module integrates a rectifier circuit for converting AC to DC. Comparison shows that the embodiment of the present invention and the traditional intelligent power module implement AC to DC conversion differently. Traditional intelligent power modules use a rectifier bridge + PFC circuit for conversion. The intelligent power module of the embodiment of the present invention uses two sets of IGBTs + FRDs for conversion, which can be achieved through a set of logic to control the IGBT switches.

[0094] Reference Figure 4, is a schematic diagram of the appearance of an intelligent power module provided in an embodiment of the present invention. In one embodiment of the present invention, the intelligent power module further includes a heat sink, and the rectifier circuit, the inverter circuit, and the drive circuit in the intelligent power module are packaged in a plastic package according to a preset packaging process.

[0095] Specifically, the appearance of the intelligent power module can be composed of a plastic package, pins, and a heat sink; the plastic package is mainly used to protect the internal circuit and power chip of the intelligent power module, and improve the reliability and strength of the intelligent power module; the function of the pins of the intelligent power module is to enable the internal circuit of the intelligent power module to be electrically connected with the peripheral circuit, so as to play the role of the intelligent power module; the heat sink is used to conduct the heat generated by the intelligent power module during operation, thereby ensuring the stability and reliability of the intelligent power module during operation.

[0096] Reference Figure 5 , is a schematic diagram of the internal structure of an intelligent power module provided in an embodiment of the present invention. In one embodiment of the present invention, the intelligent power module may further include a lead frame, aluminum wire and gold wire.

[0097] Specifically, the intelligent power module is composed of a driving circuit (including a driving IC, i.e., HVIC, LVIC and other control chips), a lead frame, a power chip (IGBT), aluminum wire, gold wire, etc. Among them, the main function of the driving IC is to control the switching and protection of the power chip; the main function of the lead frame is to realize the internal circuit connection of the intelligent power module, the fixation of the internal chip and the internal support of the intelligent power module; the function of the power chip is to convert AC power into DC power, and then convert AC power into controllable AC power.

[0098] Reference Figure 6 , is a front view of the internal structure of an intelligent power module provided in an embodiment of the present invention. Specifically, the intelligent power module may mainly include three circuit parts, namely: ① drive circuit, which controls the switching action of the power chip and the IPM module protection function; ② inverter circuit, which mainly converts direct current into controllable alternating current; ③ rectifier circuit, which converts the AC power of the mains into the required direct current.

[0099] In one embodiment of the present invention, the rectifier circuit, the inverter circuit, and the drive circuit in the intelligent power module are packaged in a plastic package according to a preset packaging process. In a specific example of the present invention, the packaging process of the intelligent power module (product) can specifically be the following steps:

[0100] 1) Slicing

[0101] The individual dies on the wafer processed in the previous process are cut and separated. If chip cutting is to be performed, the wafer must be bonded first and then sent to the chip cutting machine for cutting. After cutting, the dies are arranged in an orderly manner on the blue film.

[0102] 2)Solder paste printing

[0103] The DBC is placed in a fixture and then transferred to the equipment. The equipment steel mesh is pressed on the fixed position of the DBC (Direct Bonded Copper), and the scraper prints the solder paste on the fixed position on the DBC.

[0104] 3) Power chip patch

[0105] Reference Figure 7 , which is a schematic diagram of a power chip patch provided in an embodiment of the present invention. The printed DBC is transported to the patch device by the device. The device grabs the chip from the blue film and places it on the DBC. This process needs to be repeated to complete the patch work of multiple power chips.

[0106] 4) Frame assembly

[0107] The DBC after patching is placed in the fixture, and then the lead frame is placed in the same fixture at the same time. The DBC, lead frame and fixture are transported to the reflow equipment. After the reflow equipment, the lead frame and DBC are assembled.

[0108] 5) Cleaning process

[0109] After reflow soldering, the product is sent to the equipment, and the solder paste volatiles and other foreign matter in the product are cleaned with chemicals;

[0110] 6) Driver chip patch

[0111] After the lead frame is transferred to the dispensing station of the patch equipment, the equipment will apply silver glue to the position of the frame; then it is transferred to the patch station, where the equipment will grab the chip from the blue film and place it on the fixed position of the frame. After completion, the frame is sent to the high-temperature box for curing;

[0112] 7) Aluminum wire bonding;

[0113] The lead frame is fixed on the device by the equipment, and the aluminum wire bonding equipment completes the electrical connection between the chip and the lead frame through aluminum wire bonding;

[0114] 8) Gold wire bonding:

[0115] Reference Figure 8 , is a schematic diagram of a gold wire bonding provided in an embodiment of the present invention, wherein the lead frame is fixed to the device by a device, and the gold wire bonding device completes the electrical connection between the chip, the lead frame, and the power chip through gold wire bonding;

[0116] 9) Plastic sealing:

[0117] After the product is assembled, the frame is transferred to the mold cavity of the laminating machine. The mold is closed and the machine is evacuated. Once the set vacuum value is reached, melted plastic compound is introduced into the mold cavity to fill the gaps. After the plastic compound has pre-cured, the mold is opened and the product is removed.

[0118] 10) PMC (Post-Mold Cure)

[0119] The pre-cured product is sent into the oven at 125°C, and the plastic package is completely cured after 6 hours.

[0120] 11) Cutting and forming:

[0121] The solidified frame is sent into the mold of the rib cutting equipment. After the mold is stamped, the ribs of the frame are cut off, and then it is sent into the forming mold to complete the bending of the functional legs of the product.

[0122] 12) Printing

[0123] The product is sent to the laser printing device to complete the labeling of product-related information.

[0124] 13) FT (Final Test) test

[0125] After the product is printed, it undergoes the final electrical performance test to meet the requirements for shipment.

[0126] 14) Packing and shipping

[0127] After the product is tested and packaged into the specified form, it will be arranged for shipment.

[0128] In another specific example of the present invention, the packaging process of the intelligent power module (product) may include the following steps:

[0129] 1) Slicing

[0130] The individual dies on the wafer processed in the previous process are cut and separated. If chip cutting is to be performed, the wafer must be bonded first and then sent to the chip cutting machine for cutting. After cutting, the dies are arranged in an orderly manner on the blue film.

[0131] 2)Solder paste printing

[0132] The DBC is placed in a fixture and then transferred to the equipment. The equipment steel mesh is pressed on a fixed position of the DBC, and the scraper prints the solder paste on a fixed position on the DBC.

[0133] 3) Frame assembly

[0134] Reference Figure 9 , is a schematic diagram of a frame assembly provided in an embodiment of the present invention, wherein the DBC after patching is placed in a fixture, and then the lead frame is placed in the same fixture at the same time. The DBC, lead frame, and fixture are then transferred to a reflow soldering machine. After passing through the reflow soldering machine, the lead frame and DBC are assembled;

[0135] 4)Solder paste printing

[0136] The DBC is placed in a fixture and then transferred to the equipment. The equipment steel mesh is pressed on a fixed position of the DBC, and the scraper prints the solder paste on a fixed position on the DBC.

[0137] 5) Power chip patch

[0138] The printed DBC and frame are transferred to the patch equipment by the equipment. The equipment grabs the chip from the blue film and places it on the DBC. This process needs to be repeated to complete the patch work of various power chips.

[0139] 6) Vacuum reflow

[0140] After the patch is completed, the lead frame is sent to the vacuum reflow equipment. After passing through the equipment, the power chip and the lead frame are combined;

[0141] 7) Cleaning process

[0142] After reflow soldering, the product is sent to the equipment, and the solder paste volatiles and other foreign matter in the product are cleaned with chemicals;

[0143] 8) Driver chip patch

[0144] After the lead frame is transferred to the dispensing station of the patch equipment, the equipment will apply silver glue to the position of the frame; then it is transferred to the patch station, where the equipment will grab the chip from the blue film and place it on the fixed position of the frame. After completion, the frame is sent to the high-temperature box for curing;

[0145] 9) Aluminum wire bonding;

[0146] The lead frame is fixed on the device by the equipment, and the aluminum wire bonding equipment completes the electrical connection between the chip and the lead frame through aluminum wire bonding;

[0147] 10) Gold wire bonding:

[0148] The lead frame is fixed on the device by the equipment, and the gold wire bonding equipment completes the electrical connection between the chip, the lead frame and the power chip through gold wire bonding;

[0149] 11) Plastic sealing:

[0150] After the product is assembled, the frame is transferred to the mold cavity of the laminating machine. The mold is closed and the machine is evacuated. Once the set vacuum value is reached, melted plastic compound is introduced into the mold cavity to fill the gaps. After the plastic compound has pre-cured, the mold is opened and the product is removed.

[0151] 12)PMC

[0152] The pre-cured product is sent into the oven at 125°C, and the plastic package is completely cured after 6 hours.

[0153] 13) Cutting and forming:

[0154] The solidified frame is sent into the mold of the rib cutting equipment. After the mold is stamped, the ribs of the frame are cut off, and then it is sent into the forming mold to complete the bending of the functional legs of the product.

[0155] 14) Printing

[0156] The product is sent to the laser printing device to complete the labeling of product-related information.

[0157] 15) FT test

[0158] After the product is printed, it undergoes the final electrical performance test to meet the requirements for shipment.

[0159] 16) Packing and shipping

[0160] After the product is tested and packaged into the specified form, it will be arranged for shipment.

[0161] In summary, the embodiment of the present invention provides a multifunctional intelligent power module, which is very different from the traditional intelligent power module. Specifically: (1) The traditional intelligent power module only contains a driver IC and an inverter circuit, and its functions are relatively simple. Its main function is to convert DC power into controllable AC power to achieve more efficient conversion. At the same time, it integrates detection and protection functions. The traditional intelligent power module cannot complete other tasks. (2) The embodiment of the present invention provides a multifunctional intelligent power module, which integrates the function of converting AC power to DC power (rectifier circuit) inside, allowing the intelligent power module to achieve the function of AC power (AC power) → DC power → AC power (controllable). At the same time, it includes many detection and protection functions to ensure the stable and safe operation of the intelligent power module. ① Compared with the traditional intelligent power module, the DC power needs to be connected to the fixed pin through the PCB to work properly, and the circuit wiring is long; the intelligent power module of the embodiment of the present invention is connected through the internal connection of the intelligent power module, and the circuit line is short, which can reduce the stray inductance of the intelligent power module system and improve the stability and safety of the intelligent power module during operation. ② With the increased integration of the intelligent power module, the area of ​​the printed circuit board (PCB) it occupies is smaller, and there is no need to layout the rectification function on the printed circuit board (PCB). ③ The intelligent power module of the embodiment of the present invention has one less rectifier bridge than the traditional intelligent power module, which can reduce the BOM (Bill of Materials) cost. ④ The intelligent power module of the embodiment of the present invention has a small size and complete functions, is more friendly to application engineers, and is more convenient to layout. ⑤ The intelligent power module of the embodiment of the present invention has a higher power conversion efficiency and is more energy-saving and environmentally friendly.

[0162] Based on the above-mentioned intelligent power module, an embodiment of the present invention further discloses a load driving circuit, which includes an intelligent power module and a peripheral circuit. The peripheral circuit may include an AC power supply, a capacitor, an inductor, a resistor and a load.

[0163] The intelligent power module includes a rectifier circuit, an inverter circuit, and a drive circuit. The rectifier circuit is connected to an AC power supply connected to an inductor and a capacitor, wherein:

[0164] The rectifier circuit converts the AC power provided by the AC power source into DC power, and provides the DC power to the inverter circuit and the drive circuit;

[0165] The driving circuit is configured to receive a logic control signal and control the power chip of the inverter circuit to be turned on and off according to the logic control signal;

[0166] The inverter circuit is used to convert the direct current into controllable alternating current based on the logic control signal, so as to control the operation of a load through the controllable alternating current.

[0167] In one embodiment of the present invention, the power chips in the rectifier circuit and the inverter circuit are respectively connected to diodes.

[0168] In one embodiment of the present invention, the inverter circuit includes a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip, and a sixth power chip; the drive circuit includes a first control chip and a second control chip; the rectifier circuit includes a seventh power chip and an eighth power chip; the drive circuit further includes a third control chip; the collector of the first power chip is connected to the emitter of the seventh power chip through the capacitor; the collector of the eighth power chip is connected to the collectors of the first power chip, the second power chip, and the third power chip;

[0169] The microcontroller unit is connected to the input pin of the first control chip, the input pin of the second control chip, and the input pin of the third control chip;

[0170] The output pin of the first control chip is connected to the gates of the first power chip, the second power chip and the third power chip;

[0171] The output pin of the second control chip is connected to the gates of the fourth power chip, the fifth power chip and the sixth power chip;

[0172] The output pin of the third control chip is connected to the gates of the seventh power chip and the eighth power chip.

[0173] In one embodiment of the present invention, the emitter of the first power chip and the collector of the fourth power chip are connected to the output pin of the first control chip, and then the first control pin is led out and connected to the load;

[0174] The emitter of the second power chip and the collector of the fifth power chip are connected to the output pin of the first control chip, and then a second control pin is led out and connected to the load;

[0175] The emitter of the third power chip and the collector of the sixth power chip are connected to the output pin of the first control chip, and then a third control pin is led out and connected to the load.

[0176] In an embodiment of the present invention, emitters of the fourth power chip, the fifth power chip, and the sixth power chip are connected to resistors and then grounded.

[0177] In one embodiment of the present invention, the collector of the seventh power chip and the emitter of the eighth power chip are connected to the AC power supply via an inductor.

[0178] In one embodiment of the present invention, the intelligent power module further includes a lead frame, aluminum wires, and gold wires.

[0179] In one embodiment of the present invention, the intelligent power module further includes a heat sink.

[0180] In one embodiment of the present invention, the load includes at least a motor.

[0181] In an embodiment of the present invention, the rectifier circuit, the inverter circuit, and the drive circuit in the intelligent power module are packaged in a plastic package according to a preset packaging process.

[0182] In an embodiment of the present invention, the load driving circuit includes an intelligent power module, which includes a rectifier circuit, an inverter circuit and a drive circuit. The rectifier circuit is connected to an AC power supply connected to an inductor and a capacitor, wherein the rectifier circuit converts the AC power provided by the AC power supply into DC power and provides the DC power to the inverter circuit and the drive circuit. The drive circuit is used to receive a logic control signal and control the opening and closing of the power chip of the inverter circuit according to the logic control signal. The inverter circuit is used to convert the DC power into controllable AC power based on the logic control signal, so as to control the operation of the load through the controllable AC power. The intelligent power module of the embodiment of the present invention integrates not only a drive circuit and an inverter circuit, but also a rectifier circuit. Therefore, the AC power provided by the AC power supply can be converted into DC power within the intelligent power module. The DC power can then be converted into controllable AC power through the drive circuit and the inverter circuit to control the load for operation. The intelligent power module has a high degree of integration, and thus requires a smaller printed circuit board area. At the same time, the printed circuit board does not need to be equipped with additional rectifier circuits, further reducing the area required for the printed circuit board. This makes it more user-friendly for application engineers and makes it easier for application engineers to layout other circuits or components.

[0183] As for the above embodiment, since it is basically similar to the intelligent power module embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the intelligent power module embodiment.

[0184] Based on the above-mentioned load driving circuit, an embodiment of the present invention further discloses an air conditioner, which includes a load driving circuit. The load driving circuit includes an intelligent power module and a peripheral circuit. The peripheral circuit may include an AC power supply, a capacitor, an inductor, a resistor and a load.

[0185] The intelligent power module includes a rectifier circuit, an inverter circuit, and a drive circuit. The rectifier circuit is connected to an AC power supply connected to an inductor and a capacitor, wherein:

[0186] The rectifier circuit converts the AC power provided by the AC power source into DC power, and provides the DC power to the inverter circuit and the drive circuit;

[0187] The driving circuit is configured to receive a logic control signal and control the power chip of the inverter circuit to be turned on and off according to the logic control signal;

[0188] The inverter circuit is used to convert the direct current into controllable alternating current based on the logic control signal, so as to control the operation of a load through the controllable alternating current.

[0189] In one embodiment of the present invention, the power chips in the rectifier circuit and the inverter circuit are respectively connected to diodes.

[0190] In one embodiment of the present invention, the inverter circuit includes a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip, and a sixth power chip; the drive circuit includes a first control chip and a second control chip; the rectifier circuit includes a seventh power chip and an eighth power chip; the drive circuit further includes a third control chip; the collector of the first power chip is connected to the emitter of the seventh power chip through the capacitor; the collector of the eighth power chip is connected to the collectors of the first power chip, the second power chip, and the third power chip;

[0191] The microcontroller unit is connected to the input pin of the first control chip, the input pin of the second control chip, and the input pin of the third control chip;

[0192] The output pin of the first control chip is connected to the gates of the first power chip, the second power chip and the third power chip;

[0193] The output pin of the second control chip is connected to the gates of the fourth power chip, the fifth power chip and the sixth power chip;

[0194] The output pin of the third control chip is connected to the gates of the seventh power chip and the eighth power chip.

[0195] In one embodiment of the present invention, the emitter of the first power chip and the collector of the fourth power chip are connected to the output pin of the first control chip, and then the first control pin is led out and connected to the load;

[0196] The emitter of the second power chip and the collector of the fifth power chip are connected to the output pin of the first control chip, and then a second control pin is led out and connected to the load;

[0197] The emitter of the third power chip and the collector of the sixth power chip are connected to the output pin of the first control chip, and then a third control pin is led out and connected to the load.

[0198] In an embodiment of the present invention, emitters of the fourth power chip, the fifth power chip, and the sixth power chip are connected to resistors and then grounded.

[0199] In one embodiment of the present invention, the collector of the seventh power chip and the emitter of the eighth power chip are connected to the AC power supply via an inductor.

[0200] In one embodiment of the present invention, the intelligent power module further includes a lead frame, aluminum wires, and gold wires.

[0201] In one embodiment of the present invention, the intelligent power module further includes a heat sink.

[0202] In one embodiment of the present invention, the load includes at least a motor.

[0203] In an embodiment of the present invention, the rectifier circuit, the inverter circuit, and the drive circuit in the intelligent power module are packaged in a plastic package according to a preset packaging process.

[0204] In an embodiment of the present invention, an air conditioner may include a load driving circuit, the load driving circuit includes an intelligent power module, the intelligent power module includes a rectifier circuit, an inverter circuit and a drive circuit, the rectifier circuit is connected to an AC power supply connected to an inductor and a capacitor, wherein the rectifier circuit converts the AC power provided by the AC power supply into DC power and provides the DC power to the inverter circuit and the drive circuit, the drive circuit is used to receive a logic control signal and control the opening and closing of the power chip of the inverter circuit according to the logic control signal, and the inverter circuit is used to convert the DC power into controllable AC power based on the logic control signal to control the load operation through the controllable AC power. The intelligent power module of the embodiment of the present invention integrates not only a drive circuit and an inverter circuit, but also a rectifier circuit. Therefore, the AC power provided by the AC power supply can be converted into DC power within the intelligent power module. The DC power can then be converted into controllable AC power through the drive circuit and the inverter circuit to control the load for operation. The intelligent power module has a high degree of integration, and thus requires a smaller printed circuit board area. At the same time, the printed circuit board does not need to be equipped with additional rectifier circuits, further reducing the area required for the printed circuit board. This makes it more user-friendly for application engineers and makes it easier for application engineers to layout other circuits or components.

[0205] As for the above embodiment, since it is basically similar to the intelligent power module embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the intelligent power module embodiment.

[0206] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0207] Each embodiment in this specification is described in a related manner. Similar parts between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences between the other embodiments. In particular, the system embodiment is generally similar to the method embodiment, so the description is relatively simple. For related parts, refer to the description of the method embodiment.

[0208] The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention are included in the scope of protection of the present invention.

Claims

1. An intelligent power module, characterized in that: The intelligent power module includes a rectifier circuit, an inverter circuit and a drive circuit, wherein the rectifier circuit is connected to an AC power supply connected to an inductor and a capacitor, wherein: The rectifier circuit converts the AC power provided by the AC power source into DC power, and provides the DC power to the inverter circuit and the drive circuit; The driving circuit is used to receive a logic control signal and control the opening and closing of the power chip of the inverter circuit according to the logic control signal; The inverter circuit is used to convert the direct current into controllable alternating current based on the logic control signal, so as to control the operation of the load through the controllable alternating current.

2. The intelligent power module according to claim 1, characterized in that: The power chips in the rectifier circuit and the inverter circuit are connected to diodes respectively.

3. The intelligent power module according to claim 2, characterized in that: The inverter circuit includes a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip, and a sixth power chip, and the drive circuit includes a first control chip and a second control chip; the rectifier circuit includes a seventh power chip and an eighth power chip, and the drive circuit also includes a third control chip; the collector of the first power chip is connected to the emitter of the seventh power chip through the capacitor; the collector of the eighth power chip is connected to the collectors of the first power chip, the second power chip, and the third power chip; The microcontroller unit is connected to the input pin of the first control chip, the input pin of the second control chip and the input pin of the third control chip; The output pin of the first control chip is connected to the gates of the first power chip, the second power chip and the third power chip; The output pin of the second control chip is connected to the gates of the fourth power chip, the fifth power chip and the sixth power chip; The output pin of the third control chip is connected to the gates of the seventh power chip and the eighth power chip.

4. The intelligent power module according to claim 3, characterized in that: The emitter of the first power chip and the collector of the fourth power chip are connected to the output pin of the first control chip, and then the first control pin is led out and connected to the load; The emitter of the second power chip and the collector of the fifth power chip are connected to the output pin of the first control chip, and then a second control pin is led out and connected to the load; The emitter of the third power chip and the collector of the sixth power chip are connected to the output pin of the first control chip, and then a third control pin is led out and connected to the load.

5. The intelligent power module according to claim 4, characterized in that: The emitters of the fourth power chip, the fifth power chip and the sixth power chip are connected to resistors and then grounded.

6. The intelligent power module according to claim 4, characterized in that: The collector of the seventh power chip and the emitter of the eighth power chip are connected to the AC power source through inductance.

7. The intelligent power module according to claim 1, characterized in that: The intelligent power module also includes a lead frame, aluminum wires and gold wires.

8. The intelligent power module according to claim 1, characterized in that: The intelligent power module also includes a heat sink.

9. The intelligent power module according to claim 1, characterized in that: The load at least includes a motor.

10. The intelligent power module according to claim 1, characterized in that: The rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are packaged in a plastic package according to a preset packaging process.

11. A load driving circuit, characterized in that: The load driving circuit comprises the intelligent power module according to any one of claims 1 to 10 and a peripheral circuit, wherein the peripheral circuit comprises an AC power supply, a capacitor, an inductor, a resistor and a load.

12. An air conditioner, characterized in that: The air conditioner includes the load driving circuit according to claim 11.

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