Universal material tray, patch equipment, control method and device

Abstract

The present application proposes a universal material tray, patch equipment, control method and device. The universal material tray of the present invention includes a tray body and a fixing mechanism; the tray body is provided with a fixing groove that can simultaneously adapt to a tray or a wafer tray, and the fixing mechanism is used to fix the tray or the wafer tray on the fixing groove; the shape of the tray body can simultaneously adapt to the feed box and the mounting pressure ring assembly of the same patch equipment so that the tray body can be accommodated on the feed box or the mounting pressure ring assembly. The universal material tray is externally compatible with the feed box and the mounting pressure ring assembly on the mounting station. This universal material tray solves the compatibility problem caused by different types of trays corresponding to different materials to be mounted, and lays a hardware foundation for the automatic grasping, automatic resetting and automatic replacement of mounting materials without human intervention and fully automated.

Description

Technical Field

[0001] The present invention relates to a universal tray, a chip mounter, a control method and a device, belonging to the technical field of chip mounter equipment. Background Art

[0002] When a chip mounter mounts various components, it usually fixes components of the same type in the same tray. In a mounting program, the chip mounter sucks the same kind of material from one tray and sequentially mounts it on multiple PCB boards. When mounting the next material, the tray is replaced and the same kind of material is sucked from the tray again and sequentially mounted on multiple PCB boards until all components are mounted.

[0003] Since only one tray can be placed at the mounting position of the tray each time, the tray is usually replaced manually when changing materials, and the type of the top needle of the film expanding mechanism corresponding to the tray is adjusted (if it is a Tray tray, film expansion is not required). Therefore, fully automated production has not been achieved when replacing the tray, and these manual operations will inevitably lead to increased costs and sub - optimal production efficiency. Summary of the Invention

[0004] Aiming at the deficiencies of the above - mentioned prior art, the purpose of the present invention is to provide a universal tray, a chip mounter, a control method and a device that do not require manual participation and are fully automated.

[0005] According to an embodiment of the present invention, the first solution is provided as: a universal tray, including a carrier body and a fixing mechanism;

[0006] The carrier body is provided with fixing grooves that can be simultaneously adapted to a Tray tray or a wafer tray, and the fixing mechanism is used to fix the Tray tray or the wafer tray on the fixing grooves;

[0007] The outer shape of the carrier body can be simultaneously adapted to the feeding box and the mounting pressing ring assembly of the same chip mounter so that the carrier body can be placed in the feeding box or the mounting pressing ring assembly.

[0008] Further, the outer shape of the carrier body is adapted to the multi - layer slots of the feeding box so that the carrier body can be inserted into or withdrawn from the feeding box;

[0009] The outer shape of the carrier body is adapted to the mounting groove of the lower pressing ring of the mounting pressing ring assembly so that the carrier body can fall into or be taken out of the lower pressing ring.

[0010] Further, the fixing mechanism includes at least 2 groups of rotary pressing components, and each rotary pressing component includes a driving motor and a rotary pressing piece, and the driving motor controls the rotary pressing piece to press the edge of the Tray tray or the wafer tray tightly in the fixing groove of the carrier body.

[0011] Further, the mounting pressing ring includes a lower pressing ring and at least two upper pressing rings. The upper pressing rings are controlled by a pressing ring control member to lift or lower. In the lifted state, the carrier body can be taken out from the lower pressing ring. In the lowered state, the pressing ring control member fixes the carrier body in the mounting groove of the lower pressing ring.

[0012] Further, an identifier is provided on the carrier body. The identifier is used to identify the type of the tray and the material information fixed in the fixing groove. The identifier has at least an upper identified surface and a side identified surface. The upper identified surface of the identifier can be identified by the optical identification system of the mounting device to obtain the current tray type stored in the identifier. The side identified surface of the identifier can be identified by the optical identification system of the mounting device to obtain the current material information of the tray stored in the identifier.

[0013] Further, the identifier has a plug-in structure adapted to the carrier body, and the identifier is detachably plugged into the identification groove of the tray body through the plug-in structure.

[0014] Further, at least two side identification components that can be identified by the optical identification system of the mounting device are provided on the side identified surface of the identifier. The type of the tray and the sub-type of the tray are identified by identifying the side identification components.

[0015] Further, at least three upper identification components that can be identified by the optical identification system of the mounting device are provided on the upper identification surface of the identifier. The type information, quantity information, and initial orientation information of the materials in the tray are identified by identifying the upper identification components.

[0016] According to the embodiment of the present invention, using the universal tray in the first solution provided by the present invention, the second solution is provided as follows:

[0017] A chip mounting device includes a universal tray as described in any one of the above.

[0018] According to the embodiment of the present invention, using the universal tray in the first solution provided by the present invention, the third solution is provided as follows:

[0019] A control method for a universal tray includes the following steps:

[0020] Obtain the material information to be mounted;

[0021] Identify a matching tray body from the self-feeding material box according to the material information to be mounted and move the tray body to the mounting groove of the lower pressing ring at the mounting station, and control the upper pressing ring to fix the tray body.

[0022] Identify the tray type and material information of the tray body and retrieve the placement program, which is used to control the placement head to pick up the material on the tray body and place it at the target position on the target PCB board;

[0023] Based on the identified tray type and material information of the tray body, confirm whether to call the film expanding mechanism. If the film expanding mechanism is called, call the ejector pin according to the tray type. The called ejector pin is adapted to the wafer tray of the UV film or blue film corresponding to the tray type, and control the ejector pin to move and lift the wafer tray at the position to be picked up;

[0024] Execute the placement program and complete the material placement.

[0025] Furthermore, if the film expanding mechanism is not called, directly execute the placement program and complete the material placement.

[0026] Furthermore, the step of the called ejector pin being adapted to the wafer tray of the UV film or blue film corresponding to the tray type and controlling the ejector pin to move and lift the wafer tray at the position to be picked up includes:

[0027] Obtain the target ejector pin according to the film type and wafer size of the wafer tray corresponding to the tray type. The target ejector pin and non-target ejector pins are respectively installed in different ejector pin slots of the ejector pin mounting base;

[0028] Move the ejector pin mounting base so that the target ejector pin is located at the first target position, lift the target ejector pin to the second target position. The target ejector pin at the second target position is higher than the non-target ejector pins, and lift the ejector pin mounting base so that the target ejector pin moves and lifts the wafer tray at the position to be picked up.

[0029] According to the implementation scheme of the present invention, using the control method of the universal tray provided in the third scheme of the present invention, the fourth scheme is provided as:

[0030] A control device for a universal tray, comprising:

[0031] A placement target module, used to obtain the information of the material to be placed;

[0032] A tray picking module, used to identify the matching tray body from the self-feeding bin according to the information of the material to be placed and move the tray body to the installation slot of the lower pressing ring piece at the placement station, and control the upper pressing ring piece to fix the tray body;

[0033] A program calling module, used to identify the tray type and material information of the tray body and retrieve the placement program, which is used to control the placement head to pick up the material on the tray body and place it at the target position on the target PCB board;

[0034] The ejector pin calling module is used to confirm whether to call the film expanding mechanism according to the identified tray type and material information of the tray body. If the film expanding mechanism is called, the ejector pin is called according to the tray type, and the called ejector pin is adapted to the wafer disk of the UV film or blue film corresponding to the tray type, and controls the movement of the ejector pin to lift the wafer disk at the position to be sucked;

[0035] The mounting execution module is used to execute the mounting program and complete the material mounting.

[0036] A computer device includes a memory and a processor. The memory stores a computer program. When the computer program is executed by the processor, the processor performs the following steps:

[0037] Obtain the material information to be mounted;

[0038] Identify the matching tray body from the self-feeding bin according to the material information to be mounted, move the tray body to the installation slot of the lower pressing ring piece at the mounting station, and control the upper pressing ring piece to fix the tray body;

[0039] Identify the tray type and material information of the tray body and retrieve the mounting program. The mounting program is used to control the mounting head to suck and mount the material on the tray body to the target position on the target PCB board;

[0040] Confirm whether to call the film expanding mechanism according to the identified tray type and material information of the tray body. If the film expanding mechanism is called, the ejector pin is called according to the tray type, and the called ejector pin is adapted to the wafer disk of the UV film or blue film corresponding to the tray type, and controls the movement of the ejector pin to lift the wafer disk at the position to be sucked;

[0041] Execute the mounting program and complete the material mounting.

[0042] A computer-readable storage medium stores a computer program. When the computer program is executed by a processor, the processor performs the following steps:

[0043] Obtain the material information to be mounted;

[0044] Identify the matching tray body from the self-feeding bin according to the material information to be mounted, move the tray body to the installation slot of the lower pressing ring piece at the mounting station, and control the upper pressing ring piece to fix the tray body;

[0045] Identify the tray type and material information of the tray body and retrieve the mounting program. The mounting program is used to control the mounting head to suck and mount the material on the tray body to the target position on the target PCB board;

[0046] Based on the tray type and material information obtained by recognition, confirm whether to call the film expanding mechanism. If the film expanding mechanism is called, call the top needle according to the tray type. The called top needle is adapted to the wafer tray of the UV film or blue film corresponding to the tray type, and control the movement of the top needle to lift the wafer tray at the position to be picked up.

[0047] Execute the mounting program and complete the material mounting.

[0048] Compared with the prior art, the beneficial effects of the independent claim of the technical solution provided by this application are as follows: The general-purpose tray provided by this solution can be externally compatible with the feeding box and the mounting pressing ring piece assembly on the mounting station. That is, the general-purpose tray can be stored in the feeding box or moved to the mounting pressing ring piece assembly on the mounting station to complete subsequent mounting. Internally, the general-purpose tray can be compatible with various Tray trays or wafer trays, especially can be compatible with wafers of different sizes, because wafers of 6 inches, 8 inches, 12 inches or other sizes can be fixed on the wafer tray. This general-purpose tray solves the compatibility problem caused by different tray types corresponding to different materials to be mounted, and lays a hardware foundation for the realization of automatic grasping, automatic resetting, and automatic replacement of mounting materials without manual participation and full automation. This general-purpose tray has the advantage of being generally adaptable to various common material trays in the existing technology. Description of the Drawings

[0049] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0050] Among them:

[0051] Figure 1 It is a schematic diagram of the cooperation between the first general-purpose tray, the feeding box and the mounting pressing ring piece assembly in an embodiment;

[0052] Figure 2 It is a schematic diagram of the cooperation between the second general-purpose tray, the feeding box and the mounting pressing ring piece assembly in an embodiment;

[0053] Figure 3 It is a schematic diagram of different-sized wafer trays corresponding to the general-purpose tray in an embodiment;

[0054] Figure 4 It is a schematic diagram of the structure of the identifier in an embodiment;

[0055] Figure 5 It is a schematic diagram of the structure of the top needle and the top needle table in an embodiment;

[0056] Figure 6 Flow chart of the control method for the general-purpose tray in one embodiment

[0057] Figure 7 Structural block diagram of the control device for the general-purpose tray in one embodiment

[0058] Figure 8 Structural block diagram of a computer device in one embodiment

[0059] Reference numerals:

[0060] 10 - Carrier tray body; 11 - Fixed slot; 12 - Identification slot; 21 - Wafer tray; 22 - Tray; 30 - Feeding hopper; 41 - Upper pressing ring; 411 - Identification window; 42 - Lower pressing ring; 421 - Installation slot; 50 - Identifier; 51 - Upper identified surface; 52 - Upper identification component; 53 - Plug-in structure; 54 - Side identified surface; 55 - Side identification component; 60 - Top needle; 61 - Top needle mounting base; 62 - Top needle slot Detailed implementation manners

[0061] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of this application

[0062] Embodiment 1

[0063] This embodiment relates to a general-purpose tray for a chip mounter. A chip mounter is also called a chip placer or a surface mount system (Surface Mount System). A chip mounter is the most core device in an SMT (Surface Mount Technology) production line and is one of the key devices indispensable in the modern manufacturing field. The structure of a chip mounter includes: a frame, a PCB transfer mechanism, a servo positioning system, an optical recognition system, a placement head, a feeder, a sensor system, an electrical control system, and a software control system. Among them, the feeder mainly includes a tape feeder and a tray feeder (tray feeder). This solution mainly relates to the tray feeder. The tray feeder mainly includes a wafer tray 21 and a Tray 22. The structure of the wafer tray 21 includes a support iron frame and a wafer chip fixed on a film. The structure of the Tray 22 includes a tray body and a material grid for accommodating various components arranged on the tray body, and is usually used for mounting QFP, BGA, etc

[0064] When the pick-and-place machine mounts various components, it usually fixes components of the same type in the same tray. In a pick-and-place program, the pick-and-place machine sucks the same kind of material from one tray and sequentially mounts it on multiple PCB boards. When mounting the next material, the tray is replaced, and the same kind of material is sucked from the tray again and sequentially mounted on multiple PCB boards until all components are mounted.

[0065] Since only one tray can be placed at the pick-and-place position of the tray each time, the tray is usually replaced manually when changing materials, and the type of the top needle of the film expanding mechanism corresponding to the tray is adjusted (if it is a Tray tray 22, film expansion is not required). Therefore, fully automated production has not been achieved during tray replacement, and these manual operations will inevitably lead to increased costs and sub-optimal production efficiency.

[0066] To solve the above technical problems, this embodiment provides a universal tray, including a tray body 10 and a fixing mechanism;

[0067] A fixing groove 11 that can be simultaneously adapted to a Tray tray 22 or a wafer tray 21 is provided on the tray body 10, and the fixing mechanism is used to fix the Tray tray 22 or the wafer tray 21 on the fixing groove 11;

[0068] As Figure 1 、 Figure 2 shown, the outer shape of the tray body 10 can be simultaneously adapted to the feeding bin 30 of the same pick-and-place device and the pick-and-place pressing ring component so that the tray body 10 can be placed in the feeding bin 30 or on the pick-and-place pressing ring component.

[0069] The universal tray provided by this solution can be externally compatible with the feeding bin 30 and the pick-and-place pressing ring component at the pick-and-place station, that is, the universal tray can be stored in the feeding bin 30 or moved to the pick-and-place pressing ring component at the pick-and-place station to complete subsequent pick-and-place. Internally, the universal tray can be compatible with various Tray trays 22 or wafer trays 21, especially can be compatible with wafers of different sizes, because wafers of 6 inches, 8 inches, 12 inches or other sizes can be fixed on the wafer tray 21. As Figure 3 shown, this universal tray solves the compatibility problem caused by different tray types corresponding to different materials to be pick-and-placed, and lays a hardware foundation for the realization of automatic grasping, automatic reset, and automatic replacement of pick-and-place materials without manual participation. This universal tray has the advantage of being generally adaptable to various common material trays existing at present.

[0070] Embodiment Two

[0071] This embodiment specifically provides a preferred universal tray, including a tray body 10 and a fixing mechanism;

[0072] The carrier plate body 10 is provided with a fixing groove 11 that can simultaneously adapt to the Tray plate 22 or the wafer plate 21, and the fixing mechanism is used to fix the Tray plate 22 or the wafer plate 21 on the fixing groove 11; the outer shape of the carrier plate body 10 can simultaneously adapt to the feeding bin 30 of the same chip mounter and the mounting pressing ring plate assembly so that the carrier plate body 10 can be placed in the feeding bin 30 or the mounting pressing ring plate assembly.

[0073] The carrier plate body 10 is one circle larger in volume than the traditional Tray plate 22 or wafer plate 21, or maintains the original volume and reduces the size of the Tray plate 22 or wafer plate 21. Since the size of the traditional Tray plate 22 or wafer plate 21 includes the surrounding support space, it is sufficient to support the reduction of the size.

[0074] By providing the carrier plate body 10, the Tray plate 22 and the wafer plate 21 can be uniformly loaded through a general device, and can simultaneously adapt to new or existing feeding bins 30 and chip mounters.

[0075] Specifically, the outer shape of the carrier plate body 10 is adapted to the multi-layer slots of the feeding bin 30 so that the carrier plate body 10 can be inserted into or withdrawn from the feeding bin 30; the outer shape of the carrier plate body 10 is adapted to the installation groove 421 of the lower pressing ring plate 42 of the mounting pressing ring plate assembly so that the carrier plate body 10 can fall into or be taken out of the lower pressing ring plate 42.

[0076] Specifically, the fixing mechanism includes at least 2 sets of rotary pressing components. The rotary pressing component includes a driving motor and a rotary pressing piece. The driving motor controls the rotary pressing piece to press the edge of the Tray plate 22 or the wafer plate 21 into the fixing groove 11 of the carrier plate body 10. The existing fixing mechanism usually uses a clamping pressing piece to clamp and fix the edge of the wafer plate 21 through a plurality of pressing piece spring structures.

[0077] The core technical problem solved by the universal tray provided in this solution is to realize the technical problem of automatically replacing the disk-shaped feeder of the chip mounter by transforming the traditional tray and the methods of tray identification, movement, and fixation. Therefore, the new structures of the universal tray are all based on the solution idea of solving the non-manual full process. Therefore, the fixing mechanism of the carrier plate body 10 adopts at least 2 sets of rotary pressing components, and the fixing or release of the carrier plate body 10 is realized through the control of the driving motor.

[0078] Furthermore, since the rotary pressing component can control the rotation angle of the rotary pressing piece through the driving motor, the rotary pressing component can adjust the pressing degree of the universal tray, that is, along the rotation direction, the larger the rotation angle, the higher the pressing degree. This rotary pressing method can also adapt to wafer plates 21 or Tray plates 22 with different thicknesses, that is, the thicker the plate body, the universal and automatic fixing or release of different thickness plate bodies can be achieved by adjusting the rotation angle.

[0079] Specifically, the mounting pressing ring piece includes a lower pressing ring piece 42 and at least two upper pressing ring pieces 41. The upper pressing ring pieces 41 are controlled to lift or lower by a pressing ring control member. In the lifted state, the carrier body 10 can be taken out from the lower pressing ring piece 42. In the lowered state, the pressing ring control member fixes the carrier body 10 in the mounting groove 421 of the lower pressing ring piece 42.

[0080] Through the above solution, universal fixing and unfixing of various trays with different thicknesses and different types can be achieved, and at the same time, it is adapted to the feeding bin 30 and the mounting pressing ring piece assembly.

[0081] Embodiment III

[0082] As Figure 3 shown, in order to adapt to the optical recognition system of the existing mounter, a recognizer 50 is provided on the carrier body 10. Since the existing optical recognition system mainly recognizes in the direction from top to bottom, the upper part of the tray body stacked in the feeding tray will be blocked and cannot be directly recognized.

[0083] This embodiment provides a recognizer 50 for the carrier body 10. The recognizer 50 is used to recognize the tray type and material information fixed in the fixing groove 11. The recognizer 50 has at least an upper recognition surface 51 and a side recognition surface 54. The upper recognition surface 51 of the recognizer 50 can be recognized by the optical recognition system of the mounting device to obtain the current tray type stored in the recognizer 50. The side recognition surface 54 of the recognizer 50 can be recognized by the optical recognition system of the mounting device to obtain the material information of the current tray stored in the recognizer 50. Since there are relatively few types of existing trays, and the common types do not exceed 10, therefore, a side recognition surface 54 can be provided on the side of the recognizer 50 of the tray, and a transverse recognition subsystem is added to the existing optical recognition system. The transverse recognition subsystem is only used for recognition tasks with no more than 10 types. Therefore, the setting cost of the recognition subsystem is very low, and the accuracy can also reach 100%. The tray type is recognized by the transverse recognition subsystem, so as to call in advance the movement control parameter program and the top needle 60 adapted to the tray type, so as to improve the overall rhythm and efficiency of material mounting.

[0084] Specifically, an identifier 50 is provided on the carrier plate body 10. The identifier 50 is used to identify the type of the tray fixed in the fixing groove 11 and the material information. The identifier 50 has at least an upper surface to be identified 51 and a side surface to be identified 54. The upper surface to be identified 51 of the identifier 50 can be identified by the optical identification system of the mounting device to obtain the current tray type stored in the identifier 50. The side surface to be identified 54 of the identifier 50 can be identified by the optical identification system of the mounting device to obtain the material information of the current tray stored in the identifier 50.

[0085] Specifically, the identifier 50 has a plug-in structure 53 adapted to the carrier plate body 10. The identifier 50 is detachably plugged into the identification groove 12 of the tray body through the plug-in structure 53. At least two side identification components 55 that can be identified by the optical identification system of the mounting device are provided on the side surface to be identified 54 of the identifier 50. The tray type and the sub-type of the tray are identified by identifying the side identification components 55. At least three upper identification components 52 that can be identified by the optical identification system of the mounting device are provided on the upper identification surface of the identifier 50. The type information, quantity information and initial orientation information of the materials in the tray are identified by identifying the upper identification components 52.

[0086] When replacing materials, the identifier 50 can first identify the tray type, and then call in advance the movement control parameter program adapted to the tray type to move and fix the carrier plate body 10 and prepare in advance the top needle head 60 adapted to the tray on the carrier plate body 10, which can reduce the calling time of the top needle head 60 and improve the overall rhythm and efficiency of material mounting.

[0087] Embodiment Four

[0088] This embodiment provides another identifier 50 for the tray body 10. In order to adapt to the optical recognition system of existing pick-and-place machines, an identifier 50 is provided on the tray body 10. Since the existing optical recognition system mainly recognizes in the top-down direction, and the upper part of the tray body stacked in the feeding tray will be blocked and cannot be directly recognized. Therefore, a retractable identifier 50 can be provided on the tray body 10. The identifier 50 includes a retractable structure detachably installed in the recognition slot 12 of the tray body. An upper recognition surface of the identifier 50 is provided with features that can be recognized by the optical recognition system of the mounting device. The identifier 50 protrudes from the tray body when on the tray through the retractable structure, which is convenient for the optical recognition system to recognize. However, the identifier 50 protruding from the tray body will interfere when being accommodated in the mounting pressing ring assembly and cannot be fixedly installed. Therefore, the tray moving device provided in this embodiment sets a picking mechanism adapted to the identifier 50 of the tray body. When the tray body 10 is taken out from the feeding box 30, the picking mechanism applies a force from the side of the identifier 50 to press the identifier 50 back into the tray body 10 and fix it in the installation slot 421 of the lower pressing ring 42 of the mounting pressing ring assembly.

[0089] An identification window 411 matching the identifier 50 is provided on the upper pressing ring to avoid the interference of the upper pressing ring on the identifier 50 or to provide an observation optical path for the identifier 50 in some special cases.

[0090] This embodiment also provides an identifier 50 for the tray body 10. The identifier 50 further includes a third active recognition surface. An image recognition camera and a wireless transceiver are provided on the third active recognition surface. The material information on the tray body 10 is recognized by the image recognition camera, and the tray type and material information are deduced from the material information and stored in the storage module of the identifier 50. The tray type in the storage module is expressed by the side identification component 55 on the side recognition surface 54, and the material information in the storage module is expressed by the upper identification component 52 on the upper recognition surface 51.

[0091] Embodiment Five

[0092] This embodiment provides a pick-and-place machine, which includes the general-purpose tray of any of the above. The technical problem solved by this tray is that since only one tray can be placed at the mounting position of the tray each time, when changing materials, the tray is usually replaced manually, and the type of the top needle of the corresponding film expanding mechanism of the tray is adjusted (if it is a Tray tray 22, film expansion is not required). Therefore, full-automatic production has not been achieved during tray replacement, and these manual participation processes will inevitably lead to increased costs and sub-optimal production efficiency.

[0093] The pick-and-place machine equipped with a universal tray can be externally compatible with the feeding bin 30 and the mounting pressing ring plate assembly at the mounting station. That is, the universal tray can be stored in the feeding bin 30 or moved to the mounting pressing ring plate assembly at the mounting station to complete subsequent mounting. Internally, the universal tray can be compatible with various Tray trays 22 or wafer trays 21, and in particular, it can be compatible with wafers of different sizes because wafers of 6 inches, 8 inches, 12 inches or other sizes can be fixed on the wafer tray 21. For example, Figure 3 As shown, this universal tray solves the compatibility problem caused by different tray types corresponding to different materials to be mounted, laying a hardware foundation for the realization of automatic grasping, automatic resetting, and automatic replacement of mounting materials without manual participation and full automation. This universal tray has the advantage of being generally adaptable to various common material trays existing at present.

[0094] Embodiment Six

[0095] The technical problem solved in this embodiment is that the existing pick-and-place machine can only place one tray at the mounting position of the tray each time. Therefore, when replacing materials, the tray is usually replaced manually, and the type of the top needle of the film expanding mechanism corresponding to the tray is adjusted (if it is a Tray tray 22, no film expansion is required). Therefore, full-automatic production has not been realized during tray replacement, and these manual participation processes will inevitably lead to increased costs and sub-optimal production efficiency.

[0096] To solve this technical problem, this embodiment provides a control method for a universal tray, as Figure 6 shown, including the following steps:

[0097] S101: Obtain the information of the material to be mounted;

[0098] S102: Identify the matching tray body from the feeding bin 30 according to the information of the material to be mounted, move the tray body to the installation groove 421 of the lower pressing ring 42 at the mounting station, and control the upper pressing ring 41 to fix the tray body;

[0099] S103: Identify the tray type and material information of the tray body and retrieve the mounting program, and the mounting program is used to control the mounting head to suck and mount the material on the tray body to the target position on the target PCB board;

[0100] S104: Confirm whether to call the film expanding mechanism according to the identified tray type and material information of the tray body. If the film expanding mechanism is called, call the top needle 60 according to the tray type. The called top needle 60 is adapted to the wafer tray 21 of the UV film or blue film corresponding to the tray type, and control the top needle 60 to move and lift the sucking position of the wafer tray 21;

[0101] S105: Execute the mounting program and complete the material mounting.

[0102] S106: If the film expanding mechanism is not called, directly execute the mounting program and complete the material mounting.

[0103] The mounter equipped with a universal tray can be externally compatible with the feeding bin 30 and the mounting pressing ring component on the mounting station. That is, the universal tray can be stored in the feeding bin 30 or moved to the mounting pressing ring component on the mounting station to complete subsequent mounting. Internally, the universal tray can be compatible with various Tray trays 22 or wafer trays 21. In particular, it can be compatible with wafers of different sizes because the wafer tray 21 can fix wafers of 6 inches, 8 inches, 12 inches or other sizes. For example, Figure 3 As shown, this universal tray solves the compatibility problem caused by different tray types corresponding to different materials to be mounted, laying a hardware foundation for the realization of automatic grasping, automatic resetting, and automatic replacement of mounting materials without manual participation and full automation. This universal tray has the advantage of being generally adaptable to various common material trays existing at present.

[0104] Embodiment Seven

[0105] This embodiment provides a preferred control method for the universal tray, further including:

[0106] The top needle 60 called is adapted to the wafer tray 21 of the UV film or blue film corresponding to the tray type. The steps of controlling the movement of the top needle 60 to lift the wafer tray 21 at the position to be sucked include:

[0107] Obtain the target top needle according to the film type and wafer size of the wafer tray 21 corresponding to the tray type. The target top needle and non-target top needles are respectively installed in different top needle slots 62 of the top needle mounting seat 61; move the top needle mounting seat 61 to make the target top needle located at the first target position, lift the target top needle to the second target position. The target top needle at the second target position is higher than the non-target top needles, and lift the top needle mounting seat 61 to make the target top needle move and lift the wafer tray 21 at the position to be sucked.

[0108] For example, Figure 5 As shown, there are 3 top needle slots 62 on the top needle mounting seat 61 for installing 3 commonly used top needles 60. The bottom of each top needle 60 is provided with a top needle lifting mechanism for controlling the height position of each top needle in the top needle slot 62. The whole top needle mounting seat 61 is connected to the top needle lateral control mechanism and controls the target top needle of the top needle mounting seat 61 to be located at the concentric position at the bottom of the wafer tray 21. The top needle lifting mechanism raises the target top needle and avoids other top needles from affecting the film structure.

[0109] Embodiment Eight

[0110] This embodiment provides a control device for the universal tray. As Figure 7 shown, it includes:

[0111] The mounting target module 100 is used to obtain the information of the material to be mounted;

[0112] The tray picking module 200 is used to identify the matching tray body from the feeding bin 30 according to the information of the material to be mounted, move the tray body to the installation groove 421 of the pressing ring piece 42 at the mounting station, and control the upper pressing ring piece 41 to fix the tray body;

[0113] The program calling module 300 is used to identify the tray type and material information of the tray body and call the mounting program, and the mounting program is used to control the mounting head to suck and mount the material on the tray body to the target position of the target PCB board;

[0114] The ejector pin calling module 400 is used to confirm whether to call the film expanding mechanism according to the identified tray type and material information of the tray body. If the film expanding mechanism is called, the ejector pin head 60 called according to the tray type is used. The called ejector pin head 60 is adapted to the wafer disk 21 of the UV film or blue film corresponding to the tray type, and control the ejector pin head 60 to move and lift the wafer disk 21 to the position to be sucked;

[0115] The mounting execution module 500 is used to execute the mounting program and complete the material mounting.

[0116] The control device of the universal tray provided by this solution can be externally compatible with the feeding bin 30 and the mounting pressing ring piece assembly at the mounting station. That is, the universal tray can be stored in the feeding bin 30 or moved to the mounting pressing ring piece assembly at the mounting station to complete the subsequent mounting. Internally, the universal tray can be compatible with various Tray trays 22 or wafer disks 21, and particularly can be compatible with wafers of different sizes. Because 6-inch, 8-inch, 12-inch or other size wafers can be fixed on the wafer disk 21, this universal tray solves the compatibility problem caused by different tray types corresponding to different materials to be mounted, and lays a hardware foundation for the realization of automatic grasping, automatic resetting, and automatic replacement of mounting materials without manual participation and full automation. This universal tray has the advantage of being generally adaptable to various common material trays existing at present.

[0117] Embodiment Nine

[0118] Figure 8 The internal structure diagram of a computer device in an embodiment is shown. This computer device can specifically be a terminal or a server. As Figure 8As shown in the figure, the computer device includes a processor, a memory, and a network interface connected through a system bus. Among them, the memory includes a non-volatile storage medium and an internal memory. The non-volatile storage medium of the computer device stores an operating system and can also store a computer program. When the computer program is executed by the processor, the processor can implement the control method of the general-purpose tray. The memory can also store a computer program. When the computer program is executed by the processor, the processor can execute the age recognition method. Those skilled in the art can understand that Figure 8 The structure shown in the figure is only a block diagram of some structures related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine some components, or have different component arrangements.

[0119] In one embodiment, a computer device is proposed, including a memory and a processor. The memory stores a computer program. When the computer program is executed by the processor, the processor performs the following steps:

[0120] Obtain the information of the material to be mounted;

[0121] Identify the matching tray body from the self-feeding bin 30 according to the information of the material to be mounted, and move the tray body to the installation slot 421 of the pressing ring piece 42 at the mounting station, and control the upper pressing ring piece 41 to fix the tray body;

[0122] Identify the tray type and material information of the tray body and retrieve the mounting program. The mounting program is used to control the mounting head to suck and mount the material on the tray body to the target position on the target PCB board;

[0123] Confirm whether to call the film expanding mechanism according to the identified tray type and material information of the tray body. If the film expanding mechanism is called, the top needle 60 is called according to the tray type. The called top needle 60 is adapted to the wafer disk 21 of the UV film or blue film corresponding to the tray type, and control the top needle 60 to move and lift the sucking position of the wafer disk 21;

[0124] Execute the mounting program and complete the material mounting.

[0125] In one embodiment, a computer-readable storage medium is proposed, storing a computer program. When the computer program is executed by the processor, the processor performs the following steps:

[0126] Obtain the information of the material to be mounted;

[0127] Identify a matching tray body from the self-feeding bin 30 according to the information of the material to be mounted, and move the tray body to the installation groove 421 of the pressing ring piece 42 at the mounting station, and control the upper pressing ring piece 41 to fix the tray body;

[0128] Identify the tray type and material information of the tray body and retrieve the mounting program, where the mounting program is used to control the mounting head to suck and mount the material on the tray body to the target position on the target PCB board;

[0129] Confirm whether to call the film expanding mechanism according to the identified tray type and material information of the tray body. If the film expanding mechanism is called, call the top needle 60 according to the tray type. The called top needle 60 is adapted to the wafer tray 21 of the UV film or blue film corresponding to the tray type, and control the top needle 60 to move and lift the wafer tray 21 to the position to be sucked;

[0130] Execute the mounting program and complete the material mounting.

[0131] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The program can be stored in a non-volatile computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database or other medium used in the various embodiments provided in the present application can include non-volatile and / or volatile memories. Non-volatile memories can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memories can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0132] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification. The above-described embodiments merely represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the patent scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can be made, and these all belong to the protection scope of the present application.

[0133] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another component, it can be directly on the other component or indirectly disposed on the other component; when a component is referred to as being "connected to" another component, it can be directly connected to the other component or indirectly connected to the other component. It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present application.

[0134] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality of" and "several" is two or more, unless otherwise specifically defined.

[0135] It should be noted that the structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those who are familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present application. Therefore, they do not have technical essence. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the efficacy that the present application can produce and the purpose that can be achieved, should still fall within the scope that the technical content disclosed in the present application can cover.

Claims

1. A universal tray, characterized in that: It includes a carrier body and a fixing mechanism; The carrier body is provided with a fixing groove which can be adapted to the tray or the wafer at the same time, and the fixing mechanism is used to fix the tray or the wafer on the fixing groove; The shape of the carrier body can be adapted to the material supply box and the mounting pressure ring assembly of the same mounting equipment at the same time so that the carrier body can be accommodated on the material supply box or the mounting pressure ring assembly; An identifier is provided on the carrier body, and the identifier is used to identify the type and material information of the tray fixed in the fixed groove. The identifier has at least an upper identification surface and a side identification surface. The upper identification surface of the identifier can be identified by the optical identification system of the mounting equipment and the current tray type stored in the identifier can be obtained. The side identification surface of the identifier can be identified by the optical identification system of the mounting equipment and the material information of the current tray stored in the identifier can be obtained.

2. The universal material tray according to claim 1, characterized in that: The shape of the carrier body is adapted to the multi-layer slot of the feed box so that the carrier body can be inserted into or withdrawn from the feed box; The outer shape of the carrier body is matched with the mounting groove of the lower pressure ring of the mounting pressure ring assembly so that the carrier body can be dropped into or taken out of the lower pressure ring.

3. The universal tray according to claim 1, characterized in that: The fixing mechanism includes at least two groups of rotating pressing components, and the rotating pressing components include a driving motor and a rotating pressing plate. The driving motor controls the rotating pressing plate to press the edge of the tray or the wafer into the fixing groove of the carrier body.

4. The universal material tray according to claim 1, characterized in that: The mounting pressure ring assembly includes a lower pressure ring and at least two upper pressure rings. The upper pressure ring is controlled to be lifted or lowered by a pressure ring control component. In the lifted state, the carrier body can be taken out of the lower pressure ring. In the lowered state, the pressure ring control component fixes the carrier body in the installation groove of the lower pressure ring.

5. A patch device, characterized in that: It comprises a universal material tray as described in any one of claims 1 to 4.

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