Electronic device including multi-channel hold sensor and method for sensing change of capacitance using multi-channel

Abstract

Disclosed are an electronic device including a multi-channel grip sensor according to various embodiments of the present invention, and a method for sensing a capacitance change using the multi-channel grip sensor. An electronic device according to one embodiment includes: a first antenna; a second antenna; a first radio frequency (RF) front-end circuit connected to the first antenna; a second RF front-end circuit connected to the second antenna; a transceiver connected to the first RF front-end circuit and the second RF front-end circuit and performing wireless communication; a multi-channel grip sensor comprising two or more channels for sensing changes in capacitance in the antennas, where a first of the channels is connected to the first antenna and a second of the channels is connected to the second antenna; a first RF signal path through which a first RF signal is transmitted between the first RF front-end circuit and the first antenna; a second RF signal path through which a second RF signal is transmitted between the second RF front-end circuit and the second antenna; a first grip sensing path connecting the first antenna and a first channel of the multi-channel grip sensor; and a second grip sensing path connecting the second antenna connection and the second channel of the multi-channel grip sensor through the first RF signal path.

Description

Technical Field

[0001] Various embodiments of the present disclosure are directed to a method and apparatus for sensing capacitance using a multi-channel grip sensor. Background Art

[0002] Capacitance is determined by the distance between two insulated conductors, their areas, and the dielectric constant of the dielectric between the two conductors.In wireless communications, impedance matching of circuits used to transmit and / or receive radio frequency (RF) signals may be necessary to transmit and / or receive RF signals while reducing losses. Summary of the invention

[0003] Technical Solution

[0004] An electronic device according to an embodiment may include a first antenna; a second antenna; a first RF front-end circuit connected to the first antenna; a second RF front-end circuit connected to the second antenna; a transceiver connected to the first RF front-end circuit and the second RF front-end circuit to perform wireless communication; a multi-channel grip sensor including two or more channels for sensing changes in capacitance of the antennas, wherein, among the channels, the first channel may be connected to the first antenna and the second channel may be connected to the second antenna; a first RF signal path through which a first RF signal may be transmitted between the first RF front-end circuit and the first antenna; a second RF signal path through which a second RF signal may be transmitted between the second RF front-end circuit and the second antenna; a first grip sensing path connecting the first channel of the multi-channel grip sensor to the first antenna; and a second grip sensing path connecting the second channel of the multi-channel grip sensor to the second antenna, while including at least a portion of the first RF signal path.

[0005] An electronic device according to an embodiment may include a first antenna; a second antenna; a third antenna; a first RF front-end circuit connected to the first antenna; a second RF front-end circuit connected to the second antenna; a third RF front-end circuit connected to the third antenna; a transceiver connected to the first RF front-end circuit, the second RF front-end circuit and the third RF front-end circuit and configured to perform wireless communication; a multi-channel grip sensor including two or more channels for sensing changes in capacitance of the antenna, wherein a first channel and a second channel of the channels can be connected to the first antenna and the second antenna, respectively; a first RF signal path through which a first RF signal can be transmitted between the first RF front-end circuit and the first antenna; a second RF signal path through which a second RF signal can be transmitted between the second RF front-end circuit and the second antenna; a third RF signal path through which a third RF signal can be transmitted between the third RF front-end circuit and the third antenna; a first grip sensing path connecting the first channel of the multi-channel grip sensor to the first antenna; and a second grip sensing path connecting the second channel of the multi-channel grip sensor to the second antenna via the third RF signal path.

[0006] A method for using a multi-channel grip sensor to sense changes in capacitance may include: using a first channel of the multi-channel grip sensor connected to a first antenna of an electronic device to sense changes in capacitance of the first antenna, and using a second channel of the multi-channel grip sensor connected to the second antenna via a first RF signal path to sense changes in capacitance of the second antenna, wherein the RF signal may be transmitted via a first RF signal path between the first antenna and a first RF front-end circuit of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a block diagram illustrating electronic devices in a network environment according to various embodiments.

[0008] Figure 2 is a diagram showing a configuration of an electronic device including a multi-channel grip sensor according to a comparative embodiment.

[0009] Figure 3 is a diagram showing a configuration of an electronic device including a multi-channel grip sensor according to an embodiment.

[0010] Figure 4 is a diagram showing an exemplary arrangement of a configuration for communication within an electronic device according to an embodiment.

[0011] Figure 5 is a diagram showing a configuration of an electronic device including a multi-channel grip sensor according to an embodiment.

[0012] Figure 6is a flow chart of a method for sensing a change in capacitance using a multi-channel grip sensor according to an embodiment. DETAILED DESCRIPTION

[0013] Hereinafter, the embodiments are described in detail with reference to the accompanying drawings. When describing the embodiments with reference to the accompanying drawings, the same reference numerals denote the same components, and repeated descriptions thereof are omitted.

[0014] In a portable electronic device including an antenna for wireless communication, when a user holds the portable electronic device in his hand, the impedance of the antenna may change due to the user's hand, and the changed impedance may affect the communication performance. A grip sensor may be connected to the antenna and may detect a change in the capacitance of the antenna. When the change in capacitance is detected, the portable electronic device may perform impedance matching again to improve the communication performance. Portable electronic devices are increasingly required to be thinner and smaller in size so that they are easier for users to carry. However, due to this thinning and miniaturization, the difficulty of arranging or designing antennas and grip sensors within portable electronic devices is increasing.

[0015] The electronic device including the multi-channel grip sensor and the method for sensing the change of capacitance using the multi-channel grip sensor according to the embodiment can improve the performance degradation of the multi-channel grip sensor in the limited installation space of the portable electronic device. Hereinafter, the electronic device and the method for sensing the change of capacitance are described in detail.

[0016] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one component (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) may be integrated into a single component (eg, display module 160 ).

[0017] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least a part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that may operate independently of the main processor 121 or in conjunction with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adjusted to consume less power than the main processor 121 or be specific to a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0018] The auxiliary processor 123 may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) instead of the main processor 121 when the main processor 121 is in an inactive (e.g., sleep) state, or control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121 when the main processor 121 is in an active state (e.g., running an application). According to an embodiment, the auxiliary processor 123 (e.g., ISP or CP) may be implemented as a part of another component (e.g., camera module 180 or communication module 190) related to the function of the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., NPU) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. Such learning may be performed, for example, by the electronic device 101 in which the artificial intelligence model is running, or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may include, for example, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recursive deep neural network (BRDNN), a deep Q network, or a combination of two or more thereof, but is not limited thereto. The artificial intelligence model may additionally or alternatively include a software structure in addition to a hardware structure.

[0019] The memory 130 may store various pieces of data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various pieces of data may include, for example, input data or output data of software (e.g., the program 140) and commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0020] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0021] The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0022] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing recordings. The receiver may be used to receive incoming calls. Depending on the embodiment, the receiver may be implemented separately from the speaker, or as part of the speaker.

[0023] The display module 160 can visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling one of the corresponding display, hologram device, and projector. According to an embodiment, the display module 160 may include a touch sensor adjusted to sense a touch, or a pressure sensor adjusted to measure the strength of a force caused by a touch.

[0024] The audio module 170 may convert sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150 or output sound via the sound output module 155 or an external electronic device (e.g., electronic device 102 such as a speaker or earphone) directly or wirelessly connected to the electronic device 101.

[0025] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and may generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0026] The interface 177 may support one or more designated protocols to be used for the electronic device 101 to be directly (e.g., by wire) or wirelessly coupled to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0027] The connection terminal 178 may include a connector, and the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0028] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or movement) or electrical stimulation, which may be recognized by the user via their tactile sense or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0029] The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, ISPs, or flashes.

[0030] The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0031] The battery 189 may provide power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0032] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more CPs that may operate independently of the processor 120 (e.g., AP) and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 198 (e.g., a short-range communication network such as Bluetooth TM The wireless communication module 192 may communicate with the external electronic device 104 through a wireless communication network 198 (e.g., a wireless fidelity (WiFi) direct connection, or an infrared data association (IrDA)) or a second network 199 (e.g., a long-distance communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as a plurality of components (e.g., a plurality of chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as a first network 198 or a second network 199) using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the SIM 196.

[0033] The wireless communication module 192 can support 5G networks after 4G networks, as well as next-generation communication technologies, such as new radio (NR) access technologies. NR access technologies can support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input and multiple-output (MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., an electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or user plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0034] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element including a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network such as the first network 198 or the second network 199 may be selected from the plurality of antennas by, for example, the communication module 190. A signal or power may be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to one embodiment, another component other than the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197.

[0035] According to an embodiment, the antenna module 197 may form a millimeter wave antenna module. According to an example embodiment, the millimeter wave antenna module may include a PCB, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the PCB and capable of supporting a specified high frequency band (e.g., millimeter wave frequency band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the PCB and capable of transmitting or receiving a signal in the specified high frequency band.

[0036] At least some of the above components may be coupled to each other and transmit signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)).

[0037] According to an example embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via a server 108 coupled to the second network 199. Each of the external electronic devices 102 or 104 may be a device of the same type or a different type as the electronic device 101. According to an embodiment, all or some operations to be executed by the electronic device 101 may be executed by one or more external electronic devices (e.g., the external electronic device 102 or 104 or the server 108). For example, if the electronic device 101 needs to automatically execute a function or service, or in response to a request from a user or another device, the electronic device 101 may request one or more external electronic devices to execute at least a portion of the function or service instead of or in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least a portion of the requested function or service, or an additional function or additional service related to the request, and may transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a part of the reply to the request with or without further processing the result. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may use, for example, distributed computing or MEC to provide ultra-low latency services. In an embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or a neural network. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0038] Figure 2is a diagram showing a configuration of an electronic device including a multi-channel grip sensor according to a comparative embodiment.

[0039] refer to Figure 2 , the electronic device 200 may include a processor 205, a transceiver 210 controlled by the processor 205 and configured to perform wireless communication, a radio frequency (RF) front-end circuit (e.g., a first RF front-end circuit 215 and a second RF front-end circuit 220) connected to the transceiver 210 and configured to perform pre-processing of RF transmission / reception signals, and an antenna (e.g., a first antenna 230 and a second antenna 235) connected to the RF front-end circuit and configured to transmit and receive RF signals. The RF front-end circuit may include a duplexer (e.g., a first duplexer 260 and a second duplexer 270) and an amplifier (e.g., a first amplifier 265 and a second amplifier 275). The processor 205 may be a main processor or a communication processor. The transceiver 210 may be controlled by the processor 205 or the transceiver 210 via a mobile industry processor interface (MIPI) interface (e.g., a first MIPI interface 280 and a second MIPI interface 285). The electronic device 200 may include matching components 245 and 250 for impedance matching of RF transmission and reception and insulating components 240 and 255 for reducing the influence of capacitance change sensing of the multi-channel grip sensor 225 on the RF signal.

[0040] The electronic device 200 may further include a grip sensor to detect a change in capacitance of an antenna due to a user's grip (or hand-holding) on ​​the electronic device 200. The electronic device 200 may include multiple antennas to improve communication performance, and in order to detect a change in capacitance of each antenna, the electronic device 200 may include a multi-channel grip sensor 225 that detects a change in capacitance through multiple channels (e.g., a first channel 223 and a second channel 227). The multi-channel grip sensor 225 may be controlled by the processor 205. Each channel of the multi-channel grip sensor 225 may be connected to each antenna, and the multi-channel grip sensor 225 may detect a change in capacitance of an antenna connected to each channel.

[0041] In the electronic device 200 according to the comparative embodiment, each of the channels of the multi-channel grip sensor 225 may be connected to each of the antennas of the electronic device 200. When the electronic device 200 includes a plurality of antennas, the antennas may be arranged at positions spaced apart from each other. For example, a portion of the plurality of antennas may be arranged close to the main board of the electronic device 200, and another portion may be arranged close to the sub-board of the electronic device 200. In order to connect the channels of the multi-channel grip sensor 225 to different antennas, as in the comparative embodiment, the electronic device 200 may also need to include a circuit for connecting some of the channels of the multi-channel grip sensor 225 between the main board and the sub-board. When the electronic device 200 includes an additional circuit to connect the multi-channel grip sensor 225, it may be difficult to effectively utilize the space in the electronic device 200. In addition, depending on the placement of the multi-channel grip sensor 225, when the multi-channel grip sensor 225 is arranged close to a heat source such as the processor 205, the performance of the multi-channel grip sensor 225 may be degraded due to heat.

[0042] Figure 3 is a diagram showing a configuration of an electronic device including a multi-channel grip sensor according to an embodiment.

[0043] refer to Figure 3 , the electronic device 300 (for example, Figure 1 The electronic device 101 may include a processor 305 (eg, Figure 1The processor 305 may include a processor 120 of the main processor 121, a transceiver 310 controlled by the processor 305 and configured to perform wireless communication, an RF front-end circuit (e.g., a first RF front-end circuit 315 or a second RF front-end circuit 320) connected to the transceiver 310 and configured to perform pre-processing of RF transmission / reception signals, and / or an antenna (e.g., a first antenna 350 or a second antenna 355) connected to the RF front-end circuit and configured to transmit and receive RF signals. The RF front-end circuit may include a duplexer (e.g., a first duplexer 325 or a second duplexer 335) and an amplifier (e.g., a first amplifier 330 and a second amplifier 340). The processor 305 may include an application processor (e.g., a main processor 121) or a communication processor (e.g., an auxiliary processor 123). The transceiver 310 may be controlled by, for example, the processor 305 or the transceiver 310 via a MIPI interface. The electronic device 300 may include matching components 370, 380, and 390 for impedance matching of RF transmission and reception, and insulating components 365, 375, and 385 for reducing the influence of capacitance change sensing of the multi-channel grip sensor 345 on the RF signal. For example, the electronic device 300 may include a first insulating component 365 disposed between the first channel 343 of the multi-channel grip sensor 345 on the first grip sensing path 357 and the first antenna 350, a second insulating component 375 disposed between the first RF signal path 371 and the second channel 347 on the second grip sensing path 363, and a third insulating component 385 disposed between the first RF signal path 367 and the second antenna 355 on the second grip sensing path 363. The insulating components 365, 375, and 385 may include, for example, an inductor of about 40 nH or more or a resistor of about 500 ohm or less. The term "signal path" in this specification may be replaced with, for example, "signal line".

[0044] In an embodiment, the transceiver 310, the first RF front-end circuit 315, the second RF front-end circuit 320, the matching components 370, 380 and 390, and the insulating components 365, 375 and 385 may be included in Figure 1 In the wireless communication module 192.

[0045] The electronic device 300 may further include a grip sensor to detect a change in capacitance of an antenna due to a user's grip (or hand-holding) on ​​the electronic device 300. The electronic device 300 may include a first antenna 350 or a second antenna 355 to improve communication performance, and in order to detect a change in capacitance of each of the first antenna 350 or the second antenna 355, the electronic device 300 may include a multi-channel grip sensor 345 that detects a change in capacitance through a first channel 343 or a second channel 347. The multi-channel grip sensor 345 may be controlled by the processor 305. Each channel of the multi-channel grip sensor 345 may be connected to each antenna, and the multi-channel grip sensor 345 may detect a change in capacitance of an antenna connected to each channel.

[0046] In an embodiment, the electronic device 300 may include a first RF signal path 367, a second RF signal path 369, a first grip sensing path 357, and a second grip sensing path 363, the first RF signal is transmitted between the first RF front-end circuit 315 and the first antenna 350 through the first RF signal path 367, the second RF signal is transmitted between the second RF front-end circuit 320 and the second antenna 355 through the second RF signal path 369, the first grip sensing path 357 connects the first channel 343 of the multi-channel grip sensor 345 to the first antenna 350, and the second grip sensing path 363 connects the second channel 347 of the multi-channel grip sensor 345 to the second antenna 355.

[0047] For example, the electronic device 300 may include a main board 304 and a sub-board 302, on which components of the electronic device 300 are to be mounted. The processor 305, the transceiver 310, the first RF front-end circuit 315 and the second RF front-end circuit 320 may be provided on the main board 304, and the multi-channel grip sensor 345 may be provided on the sub-board 302. By providing the multi-channel grip sensor 345 on the sub-board 302 spaced apart from the processor 305, which may be a heat source, performance degradation of the multi-channel grip sensor 345 due to the heat source may be reduced. Since the multi-channel grip sensor 345 is located on the sub-board 302, a path connecting the sub-board 302 to the main board 304 may be required to connect the second antenna 355 located close to the main board 304 to the second channel 347 of the multi-channel grip sensor 345. When a path connecting the sub-board 302 to the main board 304 is added to connect the second channel 347 to the second antenna 355, the ability to be mounted within the electronic device 300 may be degraded.

[0048] In an embodiment, the second grip sensing path 363 may connect the second channel 347 of the multi-channel grip sensor 345 to the second antenna 355 via the first RF signal path 367. In an embodiment, the first RF signal path 367 may include a coaxial cable or a flexible RF cable (FRC) to reduce signal loss. For example, the coaxial cable or the FRC may be used to transmit an RF signal with a small loss in a section 371 between the sub-board 302 and the main board 304 and included in the first RF signal path 367. In an embodiment, the electronic device 300 may save installation space by using the first RF signal path 367 without forming a separate channel for connecting the second channel 347 of the multi-channel grip sensor between the sub-board 302 and the main board 304.

[0049] Figure 4 is a diagram showing an exemplary arrangement of a configuration for communication within an electronic device according to an embodiment.

[0050] refer to Figure 4 , showing an example of the positions of a main board 304, a sub-board 302, components disposed on the main board 304, components disposed on the sub-board 302, and antennas (a first antenna 350 and a second antenna 355) in an electronic device 300.

[0051] In an embodiment, the multi-channel grip sensor 345 may be disposed on the daughter board 302 spaced apart from the heat source. When the multi-channel grip sensor 345 is disposed on the daughter board 302, the first antenna 350 located near the daughter board 302 may be connected to the first channel 343 of the multi-channel grip sensor 345 using a relatively short line. In an embodiment, the second antenna 355 located near the main board 304 may be connected to the second channel 347 of the multi-channel grip sensor 345 via the first RF signal path 367 through which the RF signal is transmitted from the first RF front-end circuit 315 to the first antenna 350.

[0052] In an embodiment, the multi-channel grip sensor 345 may be controlled by a processor 305 provided on the main board 304. The control of the multi-channel grip sensor 345 may be performed using a digital signal. Since the digital signal is relatively less affected by heat than the RF signal, which is an analog signal, the coaxial cable and the FRC cable may be omitted. The control of the multi-channel grip sensor 345 may be performed via a separate electrical signal path 349 connecting the main board 304 to the sub-board 302. For example, the electrical signal path 349 connecting the main board 304 to the sub-board 302 may include a flexible printed circuit board (FPCB).

[0053] In an embodiment, the electronic device 300 may further include a third antenna (not shown), a third RF front-end circuit (not shown) connected to the third antenna, and a third RF signal path (not shown), and a third RF signal is transmitted between the third RF front-end circuit and the third antenna through the third RF signal path. The third antenna may be provided at a position adjacent to the daughter board 302. The third RF signal path may include a coaxial cable or an FRC.

[0054] Figure 5 is a diagram showing a configuration of an electronic device including a multi-channel grip sensor according to an embodiment.

[0055] refer to Figure 5 , the electronic device 500 (for example, Figure 1 The electronic device 101 may include a processor 505 (eg, Figure 1 The processor 120 of the present invention may include a transceiver 510 controlled by the processor 505 and configured to perform wireless communication, an RF front-end circuit (e.g., a first RF front-end circuit 515, a second RF front-end circuit 520, or a third RF front-end circuit 525) connected to the transceiver 510 and configured to perform preprocessing of RF transmission / reception signals, and an antenna (e.g., a first antenna 545, a second antenna 550, or a third antenna 555) connected to the RF front-end circuit and configured to transmit and / or receive RF signals. Each of the first RF front-end circuit 515, the second RF front-end circuit 520, or the third RF front-end circuit 525 may include, for example, a duplexer and an amplifier. The processor 505 may be an application processor or a communication processor. The transceiver 510 may be controlled by the processor 505 or the transceiver 510 via a MIPI interface. The electronic device 500 may include matching components 577, 587, 593, 568 and 598 for impedance matching of RF transmission and reception, and / or insulating components 573, 563, 553 and 558 for reducing the influence of capacitance change sensing of the multi-channel grip sensor 530 on the RF signal. In an embodiment, the transceiver 510, the first RF front-end circuit 515, the second RF front-end circuit 520, the third RF front-end circuit 525, the matching components 577, 587, 593, 568 and 598 and the insulating components 573, 563, 553 and 558 may be included in Figure 1 In the wireless communication module 192.

[0056] In an embodiment, the electronic device 500 may further include a grip sensor to detect a change in capacitance of an antenna due to a user's grip (or hand-holding) on ​​the electronic device 500. For example, the electronic device 500 may include a first antenna 545, a second antenna 550, or a third antenna 555 to improve communication performance, and in order to detect a change in capacitance of the first antenna 545, the second antenna 550, or the third antenna 555, the electronic device 500 may include a multi-channel grip sensor 530 that detects a change in capacitance through a first channel 533 or a second channel 527. The multi-channel grip sensor 530 may be controlled by the processor 505. Each channel (e.g., the first channel 533 or the second channel 527) of the multi-channel grip sensor 530 may be connected to an antenna (e.g., the first antenna 545, the second antenna 550, or the third antenna 555), and the multi-channel grip sensor 530 may detect a change in capacitance of an antenna connected to each channel.

[0057] In an embodiment, the electronic device 500 may include a first RF signal path 560, a second RF signal path 565, a third RF signal path 570, a first grip sensing path 535, and a second grip sensing path 540, wherein the first RF signal is transmitted between the first RF front-end circuit 515 and the first antenna 545 through the first RF signal path 560, the second RF signal is transmitted between the second RF front-end circuit 520 and the second antenna 550 through the second RF signal path 565, the third RF signal is transmitted between the third RF front-end circuit 525 and the third antenna 555 through the third RF signal path 570, the first grip sensing path 535 connects the first channel 533 of the multi-channel grip sensor 530 to the first antenna 545, and the second grip sensing path 540 connects the second channel 527 of the multi-channel grip sensor 530 to the second antenna 550.

[0058] For example, the electronic device 500 may include a main board 504 and a sub-board 502, and the components of the electronic device 500 are to be arranged on the main board 504 and the sub-board 502. For example, the processor 505, the transceiver 510, the first RF front-end circuit 515, the second RF front-end circuit 520, and the third RF front-end circuit 525 may be arranged on the main board 504, and the multi-channel grip sensor 530 may be arranged on the sub-board 502. By arranging the multi-channel grip sensor 530 on the sub-board 502 spaced apart from the processor 505, which may be a heat source, the performance degradation of the multi-channel grip sensor 530 due to the heat source may be reduced. Since the multi-channel grip sensor 530 is located on the sub-board 502, a path connecting the sub-board 502 to the main board 504 may be included to connect the second antenna 550 located close to the main board 504 to the second channel 527 of the multi-channel grip sensor 530. When a path connecting the sub-board 502 to the main board 504 is added to connect the second channel 527 to the second antenna 550 , the ability to be mounted within the electronic device 300 may be deteriorated.

[0059] In an embodiment, the second grip sensing path 540 may connect the second channel 527 of the multi-channel grip sensor 530 to the second antenna 550 while including at least a portion of the third RF signal path 570. In an embodiment, the third RF signal path 570 may include a coaxial cable or an FRC to reduce signal loss. The coaxial cable or the FRC may be used to transmit the RF signal with a small loss in a section 575 between the sub-board 502 and the main board 504 and included in the third RF signal path 570. The electronic device 500 may save installation space by using the third RF signal path 570 without forming a separate channel for connecting the second channel 527 of the multi-channel grip sensor 530 between the sub-board 502 and the main board 504.

[0060] In one embodiment, the multi-channel grip sensor 530 may be controlled by a processor 505 disposed on the main board 504. The control of the multi-channel grip sensor 530 may be performed using a digital signal. Since the digital signal is relatively less affected by heat than the RF signal, which is an analog signal, the coaxial cable and the FRC cable may be omitted. The control of the multi-channel grip sensor 530 may be performed via a separate electrical signal path 580 connecting the main board 504 to the daughter board 502. For example, the electrical signal path 580 connecting the main board 504 and the daughter board 502 may include an FPCB.

[0061] Figure 6 is a flow chart of a method for sensing capacitance changes using a multi-channel grip sensor according to an embodiment.

[0062] refer to Figure 6, in operation 605 , the electronic device 300 may sense a change in capacitance of the first antenna 350 by using the first channel 343 of the multi-channel grip sensor 345 connected to the first antenna 350 of the electronic device 300 .

[0063] The electronic device 300 may perform impedance matching of the first antenna 350 based on the sensed change in capacitance of the first antenna 350. In an embodiment, the first antenna 350 may be an antenna disposed at a position adjacent to the sub-board 302 of the electronic device 300 in the electronic device 300.

[0064] In operation 610, the electronic device 300 can sense a change in the capacitance of the second antenna 355 by using the second channel 347 of the multi-channel grip sensor 345, which is connected to the second antenna 355 through at least a portion of the first RF signal path 371, and the RF signal is transmitted between the first antenna 350 and the first RF front-end circuit 315 of the electronic device 300 through the first RF signal path 371.

[0065] The electronic device 300 may perform impedance matching of the second antenna 355 based on the sensed change in capacitance of the second antenna 355. In an embodiment, the second antenna 355 may be an antenna disposed in the electronic device 300 at a position adjacent to the main board 304 of the electronic device 300. The multi-channel grip sensor 345 may be disposed on the sub-board 302.

[0066] In an embodiment, the electronic device 500 may sense changes in capacitance of the first antenna 545 using a first channel 533 of a multi-channel grip sensor 530 connected to a first antenna 545 of the electronic device 500, and may sense changes in capacitance of the second antenna 550 using a second channel 527 of the multi-channel grip sensor 530 connected to the second antenna 550 through at least a portion of a third RF signal path 570, wherein an RF signal is transmitted between a third antenna 555 and a third RF front-end circuit 525 of the electronic device 500 through at least a portion of the third RF signal path 570.

[0067] The electronic device 500 may perform impedance matching of the first antenna 545 based on the sensed change in capacitance of the first antenna 545 , and may perform impedance matching of the second antenna 550 based on the sensed change in capacitance of the second antenna 550 .

[0068] The first antenna 545 may be an antenna disposed in the electronic device 500 at a position adjacent to the sub-board 502 of the electronic device 500. The second antenna 550 may be an antenna disposed in the electronic device 500 at a position adjacent to the main board 504 of the electronic device 500. The third antenna 555 may be an antenna disposed in the electronic device 500 at a position adjacent to the sub-board 502 of the electronic device 500. The multi-channel grip sensor 530 may be disposed on the sub-board 502.

[0069] The electronic device 300 according to the embodiment may include a first antenna 350; a second antenna 355; a first RF front-end circuit 315 connected to the first antenna 350; a second RF front-end circuit 320 connected to the second antenna 355; a transceiver 310 connected to the first RF front-end circuit 315 and the second RF front-end circuit 320 and configured to perform wireless communication; a multi-channel grip sensor 345 including two or more channels for sensing a change in capacitance of an antenna, wherein, among the channels, a first channel 343 is connected to the first antenna 350 and a second channel 347 is connected to the second antenna 355; a first RF signal path A path 367, through which the first RF signal is transmitted between the first RF front-end circuit 315 and the first antenna 350; a second RF signal path 369, through which the second RF signal is transmitted between the second RF front-end circuit 320 and the second antenna 355; a first grip sensing path 357, which connects the first channel 343 of the multi-channel grip sensor 345 to the first antenna 350; and a second grip sensing path 363, which connects the second channel 347 of the multi-channel grip sensor 345 to the second antenna 355, and includes at least a portion of the first RF signal path 367.

[0070] The first RF signal path 367 may include a coaxial cable or an FRC.

[0071] The electronic device 300 may further include a processor 305 configured to control the transceiver 310, and an electrical signal path 349 connecting the multi-channel grip sensor 345 to the processor 305, wherein the electrical signal path 349 may include a FPCB.

[0072] The first RF front-end circuit 315 , the second RF front-end circuit 320 , and the transceiver 310 may be disposed on the main board 304 of the electronic device 300 , and the multi-channel grip sensor 345 may be disposed on the sub-board 302 of the electronic device 300 .

[0073] The first antenna 350 may be disposed at a position adjacent to the sub-board 302 , and the second antenna 355 may be disposed at a position adjacent to the main board 304 .

[0074] It may also include a first insulating component 365 arranged between the first channel 343 of the multi-channel grip sensor 345 and the first antenna 350 on the first grip sensing path 357, a second insulating component 375 arranged between the second channel 347 and the first RF signal path 367 on the second grip sensing path 363, and a third insulating component 385 arranged between the first RF signal path 367 and the second antenna 355 on the second grip sensing path 363.

[0075] Each of the first insulating member 365 , the second insulating member 375 , and the third insulating member 385 may include an inductor of 40 nH or more or a resistor of 500 ohm or less.

[0076] The electronic device 300 may further include a matching component disposed on the first RF signal path 367 and the second RF signal path 369 and configured to perform impedance matching.

[0077] The electronic device 300 may further include a third antenna, a third RF front-end circuit connected to the third antenna, and a third RF signal path through which a third RF signal is transmitted between the third RF front-end circuit and the third antenna.

[0078] The third RF signal path may be formed using coaxial cable or FRC.

[0079] The electronic device 500 according to the embodiment may include a first antenna 545; a second antenna 550; a third antenna 555; a first RF front-end circuit 515 connected to the first antenna 545; a second RF front-end circuit 520 connected to the second antenna 550; a third RF front-end circuit 525 connected to the third antenna 555; a transceiver 510 connected to the first RF front-end circuit 515, the second RF front-end circuit 520 and the third RF front-end circuit 525 and configured to perform wireless communication; a multi-channel grip sensor 530 including two or more channels for sensing changes in capacitance of the antennas, wherein, among the channels, a first channel 533 and a second channel 527 are connected to the first antenna 545 and the second antenna 550, respectively; a first RF signal path 5 60, a first RF signal is transmitted between the first RF front-end circuit 515 and the first antenna 545 through the first RF signal path 560; a second RF signal path 565, a second RF signal is transmitted between the second RF front-end circuit 520 and the second antenna 550 through the second RF signal path 565; a third RF signal path 570, a third RF signal is transmitted between the third RF front-end circuit 525 and the third antenna 555 through the third RF signal path 570; a first grip sensing path 535, which connects the first channel 533 of the multi-channel grip sensor 530 to the first antenna 545; and a second grip sensing path 540, which connects the second channel 527 of the multi-channel grip sensor 530 to the second antenna 550 through the third RF signal path 570.

[0080] The third RF signal path 570 may include a coaxial cable or an FRC.

[0081] The electronic device 500 may further include a communication processor 505 configured to control the transceiver 510 , and an electrical signal path 580 connecting the multi-channel grip sensor 530 to the communication processor 505 , wherein the electrical signal path 580 may include a FPCB.

[0082] The first RF front-end circuit 515 , the second RF front-end circuit 520 , the third RF front-end circuit 525 and the transceiver 510 may be disposed on a main board 504 of the electronic device 500 , and the multi-channel grip sensor 530 may be disposed on a sub-board 502 of the electronic device 500 .

[0083] The first antenna 545 and the third antenna 555 may be disposed at positions adjacent to the sub-board 502 , and the second antenna 550 may be disposed at a position adjacent to the main board 504 .

[0084] The electronic device 500 may also include a first insulating component 573 arranged between the first channel 533 and the first antenna 545 of the multi-channel grip sensor 530 on the first grip sensing path 535, a second insulating component 553 arranged between the second channel 527 and the third RF signal path 570 on the second grip sensing path 540, and a third insulating component 558 arranged between the third RF signal path 570 on the second grip sensing path 540 and the second antenna 550.

[0085] According to an electronic device including a multi-channel grip sensor according to various embodiments disclosed in this document and a method of sensing capacitance changes using the multi-channel grip sensor, performance degradation of the multi-channel grip sensor caused by limited installation space can be reduced by using an RF signal path for RF signal transmission in the electronic device to sense capacitance changes.

[0086] The electronic device according to various embodiments disclosed herein may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to the above-mentioned devices.

[0087] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, and include various changes, equivalents or replacements of the corresponding embodiments. With respect to the description of the drawings, similar reference numerals may be used to refer to similar or related components. It should be understood that, unless otherwise clearly stated in the relevant context, the singular form of the noun corresponding to an item may include one or more of the item. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any one of the items listed together in a corresponding phrase, or all possible combinations thereof. Terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from other components, and do not limit the component in other aspects (e.g., importance or order). It should be understood that if an element (e.g., a first element) is referred to as being “coupled”, “coupled” to, “connected” to, or “connected” to another element (e.g., the second element), with or without the term “operably” or “communicatively”, it means that the element can be coupled to the other element directly (e.g., by wire), wirelessly, or via a third element.

[0088] As used in conjunction with the embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "component," or "circuit"). A module may be a single integrated component or minimum unit or a portion thereof that is adapted to perform one or more functions. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0089] Various embodiments as set forth herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of a machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute it. This allows the machine to be operated to execute at least one function according to at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between where data is semi-permanently stored in the storage medium and where data is temporarily stored in the storage medium.

[0090] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or via an application store (e.g., PlayStore). TM ) online distribution (e.g. download or upload), or directly between two user devices (e.g. smartphones). If distributed online, at least a part of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium, such as a memory of a manufacturer's server, a server of an application store, or a relay server.

[0091] According to various embodiments, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately arranged in different components. According to various embodiments, one or more of the above-mentioned components or operations may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as performed by a corresponding one of the multiple components before integration. According to various embodiments, the operations performed by a module, a program, or another component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be performed or omitted in a different order, or one or more other operations may be added.

Claims

1. A first antenna 350; A second antenna 355; a first radio frequency (RF) front end circuit 315 connected to a first antenna 350; A second RF front end circuit 320 connected to a second antenna 355; A transceiver 310 connected to the first RF front-end circuit 315 and the second RF front-end circuit 320 and configured to perform wireless communication; a multi-channel grip sensor 345 comprising two or more channels for sensing changes in capacitance of an antenna, wherein, among the channels, a first channel 343 is connected to a first antenna 350 and a second channel 347 is connected to a second antenna 355; a first RF signal path 367 through which the first RF signal is transmitted between the first RF front-end circuit 315 and the first antenna 350; a second RF signal path 369 through which the second RF signal is transmitted between the second RF front-end circuit 320 and the second antenna 355; A first grip sensing path 357 connecting the first channel 343 of the multi-channel grip sensor 345 to the first antenna 350; and The second grip sensing path 363 connects the second channel 347 of the multi-channel grip sensor 345 to the second antenna 355 while including at least a portion of the first RF signal path 367 .

2. The electronic device 300 according to claim 1, wherein: The first RF signal path 367 includes: Coaxial cable or Flexible RF Cable (FRC).

3. The electronic device 300 according to claim 1 or 2, wherein: The electronic device 300 further includes: a communication processor 305 configured to control a transceiver 310; and an electrical signal path 349 connecting the multi-channel grip sensor 345 to the communication processor 350, The electrical signal path 349 includes: Flexible Printed Circuit Board (FPCB).

4. The electronic device 300 according to one of claims 1 to 3, wherein: The first RF front-end circuit 315, the second RF front-end circuit 320 and the transceiver 310 are arranged on the main board 304 of the electronic device 300, and The multi-channel grip sensor 345 is disposed on the daughter board 302 of the electronic device 300 .

5. The electronic device 300 according to claim 4, wherein: The first antenna 350 is disposed adjacent to the daughter board 302, and The second antenna 355 is disposed at a position adjacent to the main board 304 .

6. The electronic device 300 according to any one of claims 1 to 5, further comprising: A first insulating component 365 disposed between the first channel 343 of the multi-channel grip sensor 345 and the first antenna 350 on the first grip sensing path 357; A second insulating component 375 disposed between the second channel 347 and the first RF signal path 367 on the second grip sensing path 363; and The third insulating component 385 is disposed between the first RF signal path 367 and the second antenna 355 on the second grip sensing path 363 .

7. The electronic device 300 according to claim 6, wherein: Each of the first insulating member 365 , the second insulating member 375 , and the third insulating member 385 includes an inductor of 40 nH or more or a resistor of 500 ohm or less.

8. The electronic device 300 according to any one of claims 1 to 7, further comprising: A matching component is provided on the first RF signal path 367 and the second RF signal path 369 and is configured to perform impedance matching.

9. The electronic device 300 according to any one of claims 1 to 8, further comprising: The third antenna; a third RF front-end circuit connected to a third antenna; as well as A third RF signal path, through which a third RF signal is transmitted between a third RF front-end circuit and a third antenna.

10. The electronic device 300 according to claim 9, wherein: The third RF signal path includes: Coaxial cable or FRC.

11. An electronic device 500, comprising: A first antenna 545; A second antenna 550; A third antenna 555; a first radio frequency (RF) front end circuit 515 connected to a first antenna 545; A second RF front-end circuit 520 connected to a second antenna 550; A third RF front-end circuit 525 connected to a third antenna 555; a transceiver 510 connected to the first RF front-end circuit 515, the second RF front-end circuit 520, and the third RF front-end circuit 525, and configured to perform wireless communication; A multi-channel grip sensor 530, which includes two or more channels for sensing changes in capacitance of an antenna, wherein a first channel 533 and a second channel 527 of the channels are connected to a first antenna 545 and a second antenna 550, respectively; a first RF signal path 560 through which the first RF signal is transmitted between the first RF front-end circuit 515 and the first antenna 545; a second RF signal path 565 through which the second RF signal is transmitted between the second RF front-end circuit 520 and the second antenna 550; a third RF signal path 570 through which the third RF signal is transmitted between the third RF front-end circuit 525 and the third antenna 555; A first grip sensing path 535 connecting the first channel 533 of the multi-channel grip sensor 530 to the first antenna 545; and The second grip sensing path 540 connects the second channel 527 of the multi-channel grip sensor 530 to the second antenna 550 via the third RF signal path 570 .

12. The electronic device according to claim 11, wherein: The first RF front-end circuit 515, the second RF front-end circuit 520, the third RF front-end circuit 530 and the transceiver 510 are arranged on the main board 504 of the electronic device 500. The multi-channel grip sensor 530 is disposed on the sub-board 502 of the electronic device 500. The first antenna 545 and the third antenna 555 are disposed at positions adjacent to the daughter board 502, and The second antenna 550 is disposed at a position adjacent to the main board 504 .

13. The electronic device according to claim 11, further comprising: A first insulating component 573 disposed between the first channel 533 of the multi-channel grip sensor 530 and the first antenna 545 on the first grip sensing path 535; A second insulating component 553 disposed between the second channel 527 and the third RF signal path 570 on the second grip sensing path 540; as well as The third insulating component 558 is disposed between the third RF signal path 570 on the second grip sensing path 540 and the second antenna 550 .

14. An electronic device 300; 500 configured to perform wireless communication using a multi-channel grip sensor 345; 530 A method for sensing capacitance, the method comprising: sensing a change in capacitance of the first antenna 350; 545 using a first channel 343; 533 of a multi-channel grip sensor 345; 530 connected to a first antenna 350; 545 of the electronic device 300; 500; and A change in capacitance of the second antenna 355; 550 is sensed using a second channel 347; 527 of a multi-channel grip sensor 345; 530 connected to the second antenna 355; 550 via a first radio frequency (RF) signal path 371; 560, wherein the RF signal is transmitted via a first RF signal path 371; 560 between the first antenna 350; 545 of the electronic device 300; 500 and the first RF front-end circuit 315; 515.

15. The method according to claim 14, further comprising: A first sensing-based antenna 350; The change in capacitance of 545 executes the first antenna 350; Impedance matching of 545; as well as Impedance matching of the second antenna 355 ; 550 is performed based on the sensed change in capacitance of the second antenna 355 ; 550 .

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