Dynamic adjusting method and device for high-speed drawing force of fine wire

Abstract

The invention relates to the technical field of fine wire drawing, in particular to a fine wire high-speed drawing force dynamic adjusting method and device which are applied to a fine wire high-speed drawing force dynamic adjusting system, and drawing resistance generated by a drawing unit in the wire reducing process is measured in real time based on a pressure sensor. The reverse tension of the silk thread in the transmission process is measured in real time based on a force sensor; dynamically adjusting the currently measured reverse tension according to the established reverse tension regulation and control strategy; wherein the reverse tension regulation and control strategy comprises a first relational expression used for limiting the reverse tension utilization rate and a second relational expression used for representing the mapping relation between the drawing force and the breaking force of the silk yarn subjected to diameter reduction through the drawing unit. Therefore, in the high-speed drawing process, the drawing force of the wire is always kept in a stable state, the problems of wire breakage, surface quality defects, mold abrasion and the like are effectively reduced, the production efficiency and the finished product quality of the fine wire are improved, and the service life of the mold is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of micro-filament drawing, and in particular to a method and device for dynamically adjusting the high-speed drawing force of a micro-filament. Background Art

[0002] With the advancement of science and technology and the growth of industrial demand, fine metal wires are widely used in aerospace, precision instrument manufacturing, electronic communications and other fields due to their excellent performance. In the production process of fine wires, high-speed drawing is a challenging process. The drawing force needs to be strictly controlled during the drawing process of fine wires to ensure the mechanical properties, surface quality and processing accuracy of the wire. High-speed drawing can not only improve production efficiency, but also bring a series of problems such as tension fluctuations, wire breakage, and mold wear. Therefore, it is particularly important to measure and adjust the pulling force in real time during the drawing process to ensure the stability of production and the quality of the finished product.

[0003] Most of the current micro-wire drawing equipment relies on fixed tension settings and manual adjustment methods, which are difficult to adapt to the real-time changes in tension during high-speed drawing, resulting in unstable wire tension during the drawing process, prone to wire breakage or uneven tension, and difficult to achieve continuous high-speed production. Summary of the invention

[0004] In order to overcome the deficiencies in the prior art, the present application provides a method and device for dynamically adjusting the high-speed pulling force of micro-filaments, which can realize real-time dynamic measurement and adjustment of the pulling force and improve the stability of the micro-filaments during high-speed pulling.

[0005] In the first aspect, the present application provides a method for dynamically adjusting the high-speed pulling force of a microfilament, which is applied to a dynamic adjustment system for the high-speed pulling force of a microfilament, wherein the dynamic adjustment system comprises a pulling unit, a traction unit and a tension unit, wherein the wire passes through the pulling unit and is first wound on the traction unit, and then passes through the tension unit and is passed through the next pulling unit for multi-stage diameter change, and the pulling unit is provided with a pressure sensor, and the tension unit is provided with a force sensor; the dynamic adjustment method comprises the following steps:

[0006] Driving the pulling unit to generate a pulling force, so that the wire is pulled out of the pulling unit under the action of the pulling force to reduce the wire diameter;

[0007] Based on the pressure sensor, the drawing resistance generated by the drawing unit in the process of reducing the diameter of the wire is measured in real time, and based on the force sensor, the back tension of the wire in the transmission process is measured in real time;

[0008] The currently measured back tension is dynamically adjusted according to the established back tension control strategy; wherein the back tension control strategy includes a first relationship for limiting the back tension utilization rate, and a second relationship for representing the mapping relationship between the drawing force and the breaking force of the wire after the wire is reduced in diameter by the drawing unit.

[0009] In a possible implementation manner, the first relational expression and the second relational expression are as follows:

[0010]

[0011] F=M q +q≤βF σ

[0012] Wherein, γ represents the utilization rate of the back tension; M0 represents the pulling resistance generated by the pulling unit when the back tension is zero; M q represents the pulling resistance generated by the pulling unit when the back tension is q; q represents the back tension; a and b represent the lower limit and upper limit of the back tension utilization rate respectively; F represents the pulling force; β represents the safety factor in the pulling process; F σ It indicates the breaking force of the wire after the wire is reduced in diameter by the drawing unit.

[0013] In a possible implementation, adjusting the currently measured back tension according to the established back tension control strategy includes the following steps:

[0014] Calculate the back tension utilization rate and the pulling force according to the currently measured pulling resistance and back tension;

[0015] If the calculated back tension utilization rate is less than the set back tension utilization rate lower limit, or the calculated pull-out force is greater than the safety factor β and the wire breaking force F after the wire is reduced in diameter σ The product of , controls the tension unit to reduce the back tension; if the calculated back tension utilization rate is greater than or equal to the set back tension utilization rate upper limit, controls the tension unit to increase the back tension.

[0016] In a possible implementation, the tension unit is controlled to reduce or increase the back tension according to a set first shift; the first shift is 0.1% to 0.5% q0 / s, where q0 represents the set initial back tension.

[0017] In a possible implementation manner, the step of adjusting the currently measured back tension according to the established back tension control strategy further includes the following steps:

[0018] Calculate the pull-out force fluctuation range based on the pull-out force before and after the back tension adjustment;

[0019] If the calculated pulling force fluctuation range is greater than the set fluctuation range threshold, the pulling unit is controlled to reduce the pulling speed until the pulling force fluctuation range is less than or equal to the set fluctuation range threshold.

[0020] In a possible implementation manner, the traction unit is controlled to reduce the drawing speed according to a set second step; the second step is 1% to 3% V0 / s, and V0 represents the set initial drawing speed.

[0021] In a possible implementation, the breaking force of the wire after the diameter reduction is measured in the following manner, comprising the following steps:

[0022] Fix the reduced wire in the fixture of the tensile testing machine according to the set gauge length;

[0023] Applying tension to the wire based on the tensile testing machine according to a set tensile speed;

[0024] The tensile force value when the wire breaks is recorded and used as the measured breaking force.

[0025] In the second aspect, the present application provides a dynamic adjustment device for high-speed pulling force of micro-filaments, which is applied to a dynamic adjustment system for high-speed pulling force of micro-filaments, wherein the dynamic adjustment system comprises a pulling unit, a traction unit and a tension unit, wherein the wire passes through the pulling unit and is first wound on the traction unit, and then passes through the tension unit and is passed through the next pulling unit for multi-stage diameter change, and the pulling unit is provided with a pressure sensor, and the tension unit is provided with a force sensor; the device comprises:

[0026] A driving module, used for driving the pulling unit to generate a pulling force, so that the wire is pulled out of the pulling unit under the action of the pulling force to reduce the wire diameter;

[0027] A measuring module, configured to measure in real time based on the pressure sensor the pulling resistance generated by the pulling unit in the process of reducing the diameter of the wire, and to measure in real time based on the force sensor the back tension of the wire in the transmission process;

[0028] An adjustment module is used to dynamically adjust the currently measured back tension according to an established back tension control strategy; wherein the back tension control strategy includes a first relationship for limiting the back tension utilization rate, and a second relationship for representing the mapping relationship between the drawing force and the breaking force of the wire after the wire is reduced in diameter by the drawing unit.

[0029] In a third aspect, the present application provides an electronic device comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate through the bus, and when the machine-readable instructions are executed by the processor, the steps of the method for dynamically adjusting the high-speed pulling force of a micro-filament as described in any one of the first aspects are performed.

[0030] In a fourth aspect, the present application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, executes the steps of the method for dynamically adjusting the high-speed pulling force of a micro-filament as described in any one of the first aspects.

[0031] The present embodiment provides a method and device for dynamically adjusting the high-speed pulling force of a micro-filament, which are applied to a dynamic adjustment system for the high-speed pulling force of a micro-filament, wherein the dynamic adjustment system includes a pulling unit, a traction unit and a tension unit, wherein the traction unit is driven to generate a pulling force, so as to pull the wire from the pulling unit under the action of the pulling force to reduce the diameter; based on the pressure sensor, the pulling resistance generated by the pulling unit in the process of reducing the diameter of the wire is measured in real time, and based on the force sensor, the back tension of the wire in the transmission process is measured in real time; the currently measured back tension is adjusted according to an established back tension control strategy; wherein the back tension control strategy includes a first relationship for limiting the back tension utilization rate, and a second relationship for representing the mapping relationship between the pulling force and the breaking force of the wire after the wire is reduced in diameter by the pulling unit. By simultaneously limiting the back-tension utilization rate and the pulling force, it is possible to ensure that the back-tension is always within the optimal range, thereby ensuring that during high-speed drawing, the pulling force of the wire is always maintained in a stable state, effectively reducing problems such as wire breakage, surface quality defects and mold wear, improving production efficiency and the quality of micro-filament products, and extending the service life of the mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 A flow chart showing a method for dynamically adjusting the high-speed pulling force of a microfilament according to an embodiment of the present application is shown;

[0034] Figure 2 A schematic diagram of the structure of a dynamic adjustment system for high-speed microfilament pulling force according to an embodiment of the present application is shown;

[0035] Figure 3 A schematic diagram of the structure of a dynamic adjustment device for high-speed microfilament pulling force according to an embodiment of the present application is shown;

[0036] Figure 4 A structural block diagram of an electronic device described in an embodiment of the present application is shown.

[0037] Description of main component symbols:

[0038] 1. First fixed pulley, 2. Die frame, 3. Support spring, 4. Wire drawing die, 5. Pressure sensor, 6. Second fixed pulley, 7. Drawing driven wheel, 8. Drawing driving wheel, 9. Tension frame, 10. Tension rod, 11. Tension wheel. DETAILED DESCRIPTION

[0039] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the drawings in the present application only serve the purpose of explanation and description and are not used to limit the scope of protection of the present application. In addition, it should be understood that the schematic drawings are not drawn in real proportion. The flowchart used in this application shows the operations implemented according to some embodiments of the present application. It should be understood that the operations of the flowchart can be implemented out of sequence, and the steps without logical context can be reversed in order or implemented simultaneously. In addition, those skilled in the art can add one or more other operations to the flowchart under the guidance of the content of the present application, or remove one or more operations from the flowchart.

[0040] In addition, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0041] It should be noted that the term "comprising" will be used in the embodiments of the present application to indicate the existence of the features declared thereafter, but does not exclude the addition of other features.

[0042] Most of the current micro-wire drawing equipment relies on fixed tension settings and manual adjustment methods, which are difficult to adapt to the real-time changes in tension during high-speed drawing. These technologies have the following disadvantages: 1. Insufficient tension monitoring: Existing equipment usually lacks accurate dynamic tension monitoring, and cannot obtain real-time data on the change of pulling force during high-speed drawing, resulting in unstable wire tension during the drawing process, and wire breakage or uneven tension is prone to occur; 2. Lag in adjustment response: Existing systems mostly rely on manual adjustment or tension control based on preset fixed parameters. This method has a relatively slow adjustment response and cannot adjust the pulling force in real time. Especially under high-speed drawing conditions, it is more likely to be untimely, affecting wire quality and production efficiency. 3. Shortened mold life: Due to the fluctuation of pulling force, the mold is prone to excessive wear during use, which shortens its service life and increases production costs. 4. Limited production efficiency: The lack of efficient automated adjustment means leads to reduced production efficiency when the pulling force needs to be adjusted frequently, making it difficult to achieve continuous high-speed production. In view of this, the present application provides a method and device for dynamically adjusting the high-speed pulling force of micro-filaments, which can ensure that the pulling force of the wire is always maintained in a stable state during the high-speed drawing process, effectively reduce problems such as wire breakage, surface quality defects and mold wear, improve production efficiency and the quality of micro-filament products, and extend the service life of the mold.

[0043] In one embodiment, see the attached specification Figure 1 The present application provides a method for dynamically adjusting the high-speed pulling force of a microfilament, which is applied to a dynamic adjustment system for the high-speed pulling force of a microfilament, wherein the dynamic adjustment system comprises a pulling unit, a traction unit and a tension unit, wherein the wire passes through the pulling unit and is first wound on the traction unit, and then passes through the tension unit and is passed through the next pulling unit for multi-stage diameter change, and the pulling unit is provided with a pressure sensor, and the tension unit is provided with a force sensor; the dynamic adjustment method comprises the following steps:

[0044] S1, driving the pulling unit to generate a pulling force, so that the wire is pulled out of the pulling unit under the action of the pulling force to reduce the wire diameter;

[0045] S2, measuring in real time the pulling resistance generated by the pulling unit in the process of reducing the diameter of the wire based on the pressure sensor, and measuring in real time the back tension of the wire in the transmission process based on the force sensor;

[0046] S3. Dynamically adjust the currently measured back tension according to the established back tension control strategy; wherein the back tension control strategy includes a first relationship for limiting the back tension utilization rate, and a second relationship for representing the mapping relationship between the drawing force and the breaking force of the wire after the wire is reduced in diameter by the drawing unit.

[0047] In order to clearly understand the technical solution of the embodiment of the present application, the dynamic adjustment system of the high-speed pulling force of the micro-filament can be explained first. In fact, during the high-speed pulling process of the micro-filament, due to the small pulling force and high speed of the micro-filament, it is difficult to accurately measure the pulling force, so the present application designs a dynamic adjustment system of the high-speed pulling force of the micro-filament, which can accurately measure the pulling force and back tension of the micro-filament during the high-speed pulling process. Figure 2 In one embodiment, the dynamic adjustment system of the high-speed drawing force of the micro-filament is mainly composed of a drawing unit, a traction unit and a tension unit. The drawing unit includes a die frame 2, a support spring 3, a wire drawing die 4 and a pressure sensor 5. The traction unit includes a drawing driven wheel 7 and a drawing driving wheel 8. The tension unit includes a tension frame 9, a tension rod 10 and a tension wheel 11. Among them, the wire drawing die 4 has a die hole of a specific shape to gradually draw the thick wire to the required diameter. In this application, the wire drawing die 4 is embedded in the die frame 2. The support springs 3 symmetrically installed on the left and right sides of the wire drawing die 4 provide symmetrical restraint forces to avoid wire drawing deviation caused by asymmetric load distribution. At the same time, the wire drawing die 4 is in contact with the pressure sensor 5. The pressure sensor 5 is arranged on the right side of the die frame 2, and a middle hole is provided in the center of the pressure sensor 5 to allow the micro-filament to pass through. The wire enters the drawing unit through the guidance of the first fixed pulley 1, and after the wire drawing die 4 is reduced in diameter, it is transmitted from the outlet of the drawing unit. Then, the silk thread passes around the second fixed pulley 6 in turn and enters the traction unit, where it is pulled by the drawing driving wheel 8 and the drawing driven wheel 7. In this embodiment, the silk thread is wound around the drawing driving wheel 8 and the driven wheel 7 for three turns to effectively pull the continuous movement of the silk thread through friction. The drawing driving wheel 8 is equipped with a speed sensor to measure the drawing speed V of the silk thread in real time. At the same time, the tension unit measures and adjusts the tension through a force sensor to ensure the stability of the tension of the silk thread during high-speed drawing. Among them, excessive tension will cause the wire drawing die 4 to bear excessive tension, affecting its service life, and on the other hand, it may cause the micro-filaments to be over-stretched and broken; while too little tension will cause the micro-filaments to lack sufficient tension during the stretching process, resulting in uneven thickness.

[0048] In step S1, driving the traction unit to generate the pulling force may be to control the rotation of the pulling driving wheel 8 by a motor to generate the pulling force, thereby pulling the wire out of the pulling unit to achieve the purpose of reducing the diameter;

[0049] In step S2, the wire is pulled out from the wire drawing die 4 under the action of the drawing force, and the drawing resistance of the wire drawing die 4 interacts with the wire drawing die 4, driving the wire drawing die 4 to generate a rightward drawing die load equal to the drawing resistance, so that the wire drawing die 4 is pressed against the pressure sensor 5. The drawing die load measured by the pressure sensor 5 is the value of the drawing resistance; at the same time, the back tension of the wire in the transmission process is measured in real time by a tension unit equipped with a force sensor;

[0050] In step S3, the back tension during the wire transmission process is adjusted in real time through the established back tension control strategy to ensure the stability of the wire tension during high-speed drawing. The back tension control strategy is established based on statistics of a large amount of wire high-speed drawing data, including a first relationship for limiting the back tension utilization rate, and a second relationship for representing the mapping relationship between the drawing force and the breaking force of the wire after the wire is reduced in diameter by the drawing unit. The first relationship and the second relationship are as follows:

[0051]

[0052] F=M q +q≤βF σ (2)

[0053] Wherein, γ represents the utilization rate of the back tension; M0 represents the pulling resistance generated by the pulling unit when the back tension is zero; M q represents the pulling resistance generated by the pulling unit when the back tension is q; q represents the back tension; a and b represent the lower limit and upper limit of the back tension utilization rate respectively; F represents the pulling force; β represents the safety factor in the pulling process; F σ In other words, the back tension control strategy established by the present application for the high-speed drawing application of micro-filaments also defines the back tension utilization rate and the relationship with the back tension (F = M q +q) pulling force to keep the back tension in the optimal range at all times, ensuring the stability of high-speed drawing of microfilaments.

[0054] Specifically, when the currently measured back tension is adjusted according to the established back tension control strategy, the back tension utilization rate γ and the pulling force F are first calculated according to the pulling resistance currently collected by the pressure sensor 5 and the back tension currently collected by the force sensor; if the calculated back tension utilization rate γ is less than the set back tension utilization rate lower limit a, or the calculated pulling force F is greater than the safety factor β and the breaking force F of the wire after the diameter reduction σ The product of indicates that the back tension is too large, which will cause the drawing force to increase rapidly, affect the quality of micro-filament drawing, and even cause wire breakage. The tension unit is controlled to reduce the back tension. If the calculated back tension utilization rate γ is greater than the set upper limit b of the back tension utilization rate, it means that the back tension value may be too small, and the optimization effect on the high-speed drawing process of the micro-filament is insufficient. The tension unit is controlled to increase the back tension.

[0055] The breaking force of the reduced-diameter wire is measured in the following manner: the reduced-diameter wire is fixed in a fixture of a tensile testing machine according to a set gauge length; a tensile force is applied to the wire according to a set stretching speed based on the tensile testing machine; the tensile force value when the wire is broken is recorded, and the tensile force value is used as the measured breaking force.

[0056] Specifically, a professional tensile testing machine can be used to measure the breaking force. The measuring range is selected according to the specifications of the silk thread and the expected breaking force, and generally it can meet the test requirements. For example, for thinner silk threads, a tensile testing machine with a small range but high precision is selected; for thicker silk threads or silk threads with larger breaking force, a tensile testing machine with a larger range needs to be selected. Among them, a certain length of sample can be cut from the silk thread to be tested, and the sample can be fixed in the upper and lower clamps of the tensile testing machine according to the set gauge length, and it is ensured that the clamp clamps the silk thread, and the axis of the silk thread coincides with the center line of the clamp to ensure that the tension can be evenly applied to the silk thread. The tensile testing machine is driven to apply tension to the silk thread according to the set tensile speed, and during the test, the tension value applied to the silk thread is recorded in real time. When the silk thread is broken, the tensile testing machine stops automatically and records the maximum tension value when it is broken. This maximum tension value is the breaking force of the silk thread. The set gauge length is 100 mm, the set stretching speed is 10 mm / min, and in order to make the measurement result more accurate, multiple measurements can be taken, and the average value of the measurement results is taken as the final breaking force F of the wire after the diameter reduction. σ .

[0057] In one embodiment, the lower limit a of the back tension utilization is set to 90%, the upper limit b of the back tension utilization is set to 100%, and the value range of the safety factor β is 0.5 to 0.7. If the back tension utilization γ calculated based on the drawing resistance currently collected by the pressure sensor 5 and the back tension currently collected by the force sensor is less than 90%, or the drawing force F calculated based on the drawing resistance currently collected by the pressure sensor 5 and the back tension currently collected by the force sensor exceeds the range of formula 2, it means that the back tension is too large, which will cause the drawing force to increase rapidly, affect the wire drawing quality and even cause wire breakage. At this time, the back tension is reduced, and the back tension reduction gradient is 0.1% to 0.5%q0 / s, where q0 represents the set initial back tension; if the calculated back tension utilization γ is 100%, the back tension value may be too small, which is insufficient in reducing micro-wire surface defects and extending the life of the wire drawing die. At this time, the back tension is increased, and the back tension increase gradient is 0.1% to 0.5%q0 / s, where q0 represents the set initial back tension.

[0058] Since the stability of the pulling force is crucial to the regulation of the back tension during the high-speed drawing process of the wire, when the fluctuation range of the pulling force is too large, it may cause problems such as local stress concentration, wire breakage, surface quality degradation, and increased mold wear. Based on this, the pulling force fluctuation range is calculated according to the pulling force before and after the back tension adjustment; if the calculated pulling force fluctuation range is greater than the set fluctuation range threshold, the traction unit is controlled to reduce the pulling speed until the pulling force fluctuation range is less than or equal to the set fluctuation range threshold. In one embodiment, the fluctuation range threshold is set to ±3%. If the calculated pulling force fluctuation range is greater than ±3%, the pulling speed is reduced by reducing the rotation speed of the pulling driving wheel 8 until the pulling force fluctuation range is less than ±3%, wherein the reduction gradient of the pulling speed is 1% to 3% V0 / s, and V0 is the set initial pulling speed.

[0059] It should be noted that in the present application, the value range of the safety factor β is 0.5-0.7, the adjustment gradient of the back tension is 0.1%-0.5%q0 / s, and the adjustment gradient of the drawing speed is 1%-3%V0 / s. The optimal range is determined by experimental data. This is because if the step shift of the adjustment gradient of the back tension / the adjustment gradient of the drawing speed is smaller than this range, the response speed of the dynamic adjustment is slow, affecting the production efficiency. If the step shift is larger than this range, the optimal back tension value may be missed, and even the drawing may be instable, resulting in wire breakage or unstable equipment operation.

[0060] It can be seen that the present application provides a dynamic adjustment method for high-speed drawing force of micro-filaments, which dynamically adjusts the back tension and drawing speed in the drawing process by real-time monitoring the drawing force changes of the filaments during high-speed drawing, combined with the preset drawing force range, so that the drawing force and drawing speed are always kept within the set optimal range. It can effectively avoid common problems in the drawing process caused by tension fluctuations, such as wire breakage, surface defects and uneven size; and can quickly adjust the drawing force according to the different requirements of the micro-filament material, diameter and drawing speed to ensure the stability and consistency of the high-speed drawing process, reduce the wire breakage rate by 30%, and significantly improve the surface quality and straightness; due to the optimization of the back tension, the friction between the wire drawing die and the wire during the drawing process is reduced, and the drawing force can be kept within a stable range. The wire drawing die will not be excessively worn due to tension fluctuations during the drawing process, so that the service life of the wire drawing die is extended by 20%, and the maintenance and replacement costs are reduced; in addition, the automatic adjustment function reduces the dependence on manual intervention and greatly improves production efficiency.

[0061] Based on the same inventive concept, an embodiment of the present application also provides a dynamic adjustment device for the high-speed pulling force of a micro-filament. Since the principle of solving the problem by the device in the embodiment of the present application is similar to the above-mentioned method for dynamically adjusting the high-speed pulling force of a micro-filament in the embodiment of the present application, the implementation of the device can refer to the implementation of the method, and the repeated parts will not be repeated.

[0062] As the instruction manual Figure 3 As shown, a dynamic adjustment device for high-speed drawing force of a micro-filament provided in an embodiment of the present application is applied to a dynamic adjustment system for high-speed drawing force of a micro-filament, wherein the dynamic adjustment system comprises a drawing unit, a traction unit and a tension unit, wherein the wire passes through the drawing unit and is firstly wound on the traction unit, and then passes through the tension unit and is passed through the next drawing unit for multi-stage diameter change, and the drawing unit is provided with a pressure sensor, and the tension unit is provided with a force sensor; the device comprises:

[0063] A driving module 301 is used to drive the pulling unit to generate a pulling force, so that the wire is pulled out of the pulling unit under the action of the pulling force to reduce the wire diameter;

[0064] A measuring module 302, configured to measure in real time the pulling resistance generated by the pulling unit in the process of reducing the diameter of the wire based on the pressure sensor, and to measure in real time the back tension of the wire in the transmission process based on the force sensor;

[0065] The adjustment module 303 is used to dynamically adjust the currently measured back tension according to the established back tension control strategy; wherein the back tension control strategy includes a first relationship for limiting the back tension utilization rate, and a second relationship for representing the mapping relationship between the pulling force and the breaking force of the wire after the wire is reduced in diameter by the drawing unit.

[0066] In one embodiment, the first relational expression and the second relational expression are as follows:

[0067]

[0068] F=M q +q≤βF σ

[0069] Wherein, γ represents the utilization rate of the back tension; M0 represents the pulling resistance generated by the pulling unit when the back tension is zero; M q represents the pulling resistance generated by the pulling unit when the back tension is q; q represents the back tension; a and b represent the lower limit and upper limit of the back tension utilization rate respectively; F represents the pulling force; β represents the safety factor in the pulling process, and the value range is 0.5 to 0.7; F σ It indicates the breaking force of the wire after the wire is reduced in diameter by the drawing unit.

[0070] In one embodiment, the adjustment module 303 adjusts the currently measured back tension according to the established back tension control strategy, including: calculating the back tension utilization rate and the pulling force according to the currently measured pulling resistance and back tension; if the calculated back tension utilization rate is less than the set back tension utilization rate lower limit, or the calculated pulling force is greater than the safety factor β and the breaking force F of the wire after the diameter reduction σ The product of is controlled to control the tension unit to reduce the back tension; if the calculated back tension utilization rate is greater than the set upper limit of the back tension utilization rate, the tension unit is controlled to increase the back tension; wherein, the tension unit is controlled to reduce the back tension or increase the back tension according to the set first step; the first step is 0.1% to 0.5% q0 / s, and q0 represents the set initial back tension.

[0071] In one embodiment, the adjustment module 303 adjusts the currently measured back tension according to the established back tension control strategy, and also includes: calculating the pulling force fluctuation range according to the pulling force before and after the back tension adjustment; if the calculated pulling force fluctuation range is greater than the set fluctuation range threshold, controlling the traction unit to reduce the pulling speed until the pulling force fluctuation range is less than or equal to the set fluctuation range threshold; wherein, the traction unit is controlled to reduce the pulling speed according to the set second step; the second step is 1% to %V0 / s, and V0 represents the set initial pulling speed.

[0072] In one embodiment, the measurement module 302 is also used to measure the breaking force of the wire after diameter reduction, including: fixing the reduced wire in the clamp of the tensile testing machine according to the set gauge length; applying tension to the wire according to the set stretching speed based on the tensile testing machine; recording the tension value when the wire breaks, and using the tension value as the measured breaking force.

[0073] The present application provides a dynamic adjustment device for high-speed drawing force of micro-filaments, which is applied to a dynamic adjustment system for high-speed drawing force of micro-filaments, wherein the dynamic adjustment system includes a drawing unit, a traction unit and a tension unit, wherein the traction unit is driven by a driving module to generate a drawing force, so that the wire is pulled out of the drawing unit under the action of the drawing force to reduce the diameter; the drawing resistance generated by the drawing unit in the process of reducing the diameter of the wire is measured in real time based on the pressure sensor by the measuring module, and the back tension of the wire in the transmission process is measured in real time based on the force sensor; the back tension currently measured is adjusted by the adjustment module according to the established back tension control strategy; wherein the back tension control strategy includes a first relational expression for limiting the back tension utilization rate, and a second relational expression for representing the mapping relationship between the drawing force and the breaking force of the wire after the wire is reduced by the drawing unit. Thus, it is ensured that the drawing force of the wire is always maintained in a stable state during the high-speed drawing process, effectively reducing problems such as wire breakage, surface quality defects and mold wear, improving production efficiency and the finished product quality of micro-filaments, and extending the service life of the mold.

[0074] Based on the same concept of the present invention, the specification is attached Figure 4 As shown, the structure of an electronic device 400 provided in an embodiment of the present application includes: at least one processor 401, at least one network interface 404 or other user interface 403, a memory 405, and at least one communication bus 402. The communication bus 402 is used to realize the connection and communication between these components. The electronic device 400 optionally includes a user interface 403, including a display (for example, a touch screen, LCD, CRT, holographic imaging (Holographic) or projection (Projector), etc.), a keyboard or a pointing device (for example, a mouse, a trackball (trackball), a touch pad or a touch screen, etc.).

[0075] The memory 405 may include a read-only memory and a random access memory, and provides instructions and data to the processor 401. A portion of the memory 405 may also include a non-volatile random access memory (NVRAM).

[0076] In some implementations, the memory 405 stores the following elements, executable modules or data structures, or a subset thereof, or an extended set thereof:

[0077] Operating system 4051, including various system programs for implementing various basic services and processing hardware-based tasks;

[0078] The application module 4052 includes various application programs, such as a launcher, a media player, a browser, etc., which are used to implement various application services.

[0079] In an embodiment of the present application, by calling the program or instructions stored in the memory 405, the processor 401 is used to execute steps in a method for dynamically adjusting the high-speed pulling force of a micro-filament, thereby realizing real-time dynamic measurement and adjustment of the pulling force and improving the stability of the micro-filament during high-speed pulling.

[0080] The present application also provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps in the method for dynamically adjusting the high-speed pulling force of a micro-filament are executed.

[0081] Specifically, the storage medium can be a general storage medium, such as a mobile disk, a hard disk, etc. When the computer program on the storage medium is run, the above-mentioned dynamic adjustment method of the high-speed pulling force of the micro-filament can be executed.

[0082] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0083] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0084] In addition, each functional unit in the embodiments provided in the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0085] If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, and other media that can store program codes.

[0086] Finally, it should be noted that the above embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the aforementioned embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the aforementioned embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application. They should all be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A method for dynamically adjusting the high-speed pulling force of a microfilament, characterized in that: A dynamic adjustment system for high-speed drawing force of microfilaments is provided, wherein the dynamic adjustment system comprises a drawing unit, a traction unit and a tension unit, wherein the wire passes through the drawing unit and is firstly wound on the traction unit, and then passes through the tension unit and is passed through the next drawing unit for multi-stage diameter change, and the drawing unit is provided with a pressure sensor, and the tension unit is provided with a force sensor; the dynamic adjustment method comprises the following steps: Driving the pulling unit to generate a pulling force, so that the wire is pulled out of the pulling unit under the action of the pulling force to reduce the wire diameter; Based on the pressure sensor, the pulling resistance generated by the pulling unit in the process of reducing the diameter of the wire is measured in real time, and based on the force sensor, the back tension of the wire in the transmission process is measured in real time; The currently measured back tension is dynamically adjusted according to the established back tension control strategy; wherein the back tension control strategy includes a first relationship for limiting the back tension utilization rate, and a second relationship for representing the mapping relationship between the drawing force and the breaking force of the wire after the wire is reduced in diameter by the drawing unit.

2. According to claim 1, a method for dynamically adjusting the high-speed pulling force of a micro-filament is characterized in that: The first relational expression and the second relational expression are as follows: F=M q +q≤βF σ Wherein, γ represents the utilization rate of the back tension; M0 represents the pulling resistance generated by the pulling unit when the back tension is zero; M q represents the pulling resistance generated by the pulling unit when the back tension is q; q represents the back tension; a and b represent the lower limit and upper limit of the back tension utilization rate respectively; F represents the pulling force; β represents the safety factor in the pulling process; F σ It indicates the breaking force of the wire after the wire is reduced in diameter by the drawing unit.

3. The method for dynamically adjusting the high-speed pulling force of a microfilament according to claim 2, characterized in that: The step of adjusting the currently measured back tension according to the established back tension control strategy comprises the following steps: Calculate the back tension utilization rate and the pulling force according to the currently measured pulling resistance and back tension; If the calculated back tension utilization rate is less than the set back tension utilization rate lower limit, or the calculated pull-out force is greater than the safety factor β and the wire breaking force F after the wire is reduced in diameter σ The product of , controls the tension unit to reduce the back tension; if the calculated back tension utilization rate is greater than or equal to the set back tension utilization rate upper limit, controls the tension unit to increase the back tension.

4. The method for dynamically adjusting the high-speed pulling force of a microfilament according to claim 3, characterized in that: in, The tension unit is controlled to reduce or increase the back tension according to the set first step; the first step is 0.1% to 0.5% q0 / s, q0 represents the set initial back tension.

5. The method for dynamically adjusting the high-speed pulling force of a microfilament according to claim 3, characterized in that: The method of adjusting the currently measured back tension according to the established back tension control strategy also includes the following steps: Calculate the pull-out force fluctuation range based on the pull-out force before and after the back tension adjustment; If the calculated pulling force fluctuation range is greater than the set fluctuation range threshold, the pulling unit is controlled to reduce the pulling speed until the pulling force fluctuation range is less than or equal to the set fluctuation range threshold.

6. A method for dynamically adjusting the high-speed pulling force of a microfilament according to claim 5, characterized in that: in, The pulling unit is controlled to reduce the drawing speed according to a set second step shift; the second step shift is 1% to 3% V0 / s, and V0 represents the set initial drawing speed.

7. A method for dynamically adjusting the high-speed pulling force of a microfilament according to claim 3, characterized in that: The breaking force of the wire after the reduction is measured in the following manner, comprising the following steps: Fix the reduced wire in the fixture of the tensile testing machine according to the set gauge length; Applying tension to the wire based on the tensile testing machine according to a set tensile speed; The tensile force value when the wire breaks is recorded and used as the measured breaking force.

8. A dynamic adjustment device for high-speed microfilament pulling force, characterized in that: A dynamic adjustment system for high-speed drawing force of micro-filaments, the dynamic adjustment system comprises a drawing unit, a traction unit and a tension unit, wherein the wire passes through the drawing unit and is first wound on the traction unit, and then passes through the tension unit and is passed through the next drawing unit for multi-stage diameter change, and the drawing unit is provided with a pressure sensor, and the tension unit is provided with a force sensor; the device comprises: A driving module, used for driving the pulling unit to generate a pulling force, so that the wire is pulled out of the pulling unit under the action of the pulling force to reduce the wire diameter; A measuring module, configured to measure in real time based on the pressure sensor the pulling resistance generated by the pulling unit in the process of reducing the diameter of the wire, and to measure in real time based on the force sensor the back tension of the wire in the transmission process; An adjustment module is used to dynamically adjust the currently measured back tension according to an established back tension control strategy; wherein the back tension control strategy includes a first relationship for limiting the back tension utilization rate, and a second relationship for representing the mapping relationship between the drawing force and the breaking force of the wire after the wire is reduced in diameter by the drawing unit.

9. An electronic device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor. When the electronic device is running, the processor and the memory communicate via the bus. When the machine-readable instructions are executed by the processor, the steps of the method for dynamically adjusting the high-speed pulling force of a micro-filament are performed as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the method for dynamically adjusting the high-speed pulling force of a micro-filament as claimed in any one of claims 1 to 7 are executed.

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