Femtosecond laser vacuum in-situ valve element columnar element machining device

Abstract

The invention belongs to the technical field of precision manufacturing and machining, and aims to provide a femtosecond laser vacuum in-situ valve element columnar element machining device, method and equipment and a product. In the implementation process, position adjustment of elements such as columnar elements to be machined can be achieved by adjusting the position of the workpiece clamp, so that accurate laser machining of different positions of the surfaces of the columnar elements can be achieved, and the limitation of a traditional laser machining device when the micro-nano structures of the surfaces of the columnar elements are machined is overcome; meanwhile, the workpiece clamp and the to-be-machined element are arranged in the vacuum containing cavity to be machined, the metal oxidation effect under the aerobic environment is avoided, accurate induction of the surface function micro-nano structure can be improved, and therefore accurate preparation of the surface micro-nano structure of the to-be-machined element is achieved. According to the invention, one-step forming and high-precision in-situ processing operation of the columnar element can be realized.

Description

Technical Field

[0001] The present invention belongs to the field of precision manufacturing and processing technology, and specifically relates to a femtosecond laser vacuum in-situ valve core columnar element processing device, method, equipment and product. Background Art

[0002] With the continuous improvement of the level of industrial automation, the manufacturing industry of columnar components such as femtosecond laser vacuum in-situ valve cores has increasingly higher requirements for processing accuracy and efficiency. The preparation of micro-nano functional structures on the surface of columnar components can improve the various properties of columnar components, such as sealing performance, lubrication performance and wear resistance. Due to the problems of high processing difficulty, low processing accuracy, low processing efficiency, poor processing adaptability, difficult to ensure surface quality and environmental pollution in traditional mechanical processing methods, it cannot meet the market demand for micro-nano structure processing on the surface of columnar components. Laser processing, as a new processing technology, has the advantages of high processing accuracy, high degree of automation, wide range of application, high flexibility and no pollution, which perfectly solves the problems existing in traditional processing.

[0003] However, in the process of using the prior art, the inventors found that the prior art has at least the following problems: Existing laser processing devices are commonly used for planar processing operations in an air atmosphere, and usually can only process planar components, and cannot meet the processing needs of complex columnar components such as valve cores. At the same time, since the processing operations are carried out in an air environment, the components have metal oxidation problems, making it difficult for existing technologies to meet the in-situ surface micro-nano structure precision and one-time molding processing requirements of columnar components. Summary of the invention

[0004] The present invention aims to solve the above technical problems at least to a certain extent. The present invention provides a femtosecond laser vacuum in-situ valve core columnar element processing device, method, equipment and product.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: In a first aspect, the present invention provides a femtosecond laser vacuum in-situ valve core columnar element processing device, comprising an industrial computer, a workpiece fixture, a vacuum chamber component, a laser emission component, a laser distance measurement component and a galvanometer processing component, wherein the workpiece fixture, the vacuum chamber component, the laser emission component, the laser distance measurement component and the galvanometer processing component are all electrically connected to the industrial computer; wherein, The workpiece clamp is arranged in the accommodating chamber of the vacuum chamber assembly and is used to clamp the component to be processed according to the workpiece fixing instruction issued by the industrial computer; The vacuum chamber component is used to perform a vacuum operation on the containing chamber according to the vacuum instruction issued by the industrial computer; The laser distance measuring component is used to measure the distance information between the laser emitting end and the component to be processed in real time, and send the distance information to the industrial computer; The industrial computer is used to obtain material parameters of the component to be processed and target performance parameters matching the component to be processed, and obtain target processing parameters according to the material parameters, the target performance parameters and the distance information; The laser emitting component is used to output a laser beam according to the laser driving instruction bound with the target processing parameters issued by the industrial computer; The workpiece fixture is also used to perform position adjustment operation on the component to be processed according to the position adjustment instruction bound to the target processing parameter issued by the industrial computer; wherein the workpiece fixture and the laser emitting component act in coordination; The galvanometer processing component is arranged at the laser output end of the laser emitting component, and is used to adjust the laser beam according to the laser beam adjustment instruction bound to the target processing parameters issued by the industrial computer, so as to perform surface micro-nano structure processing operations on the component to be processed through the laser beam.

[0006] In a possible design, the workpiece clamp is configured as a claw type and moves and rotates the component to be processed in three directions.

[0007] In a possible design, the material parameters of the component to be processed include hardness and Poisson's ratio; the target performance parameters include the three-dimensional size, surface roughness and surface contact angle of the specified surface micro-nano structure matching the component to be processed; the target processing parameters include laser power, scanning speed, repetition frequency and spot overlap rate scanning times.

[0008] In a possible design, the femtosecond laser vacuum in-situ valve core columnar element processing device also includes an optical path component, which is arranged between the laser output end of the laser emitting component and the galvanometer processing component. The optical path component includes a polarizer, an analyzer, a beam expander and a reflection component which are arranged in sequence along the laser emitting direction of the laser emitting component.

[0009] In a possible design, the femtosecond laser vacuum in-situ valve core columnar element processing device further includes a camera assembly, and the camera assembly is electrically connected to the industrial control machine; wherein, The camera assembly is used to capture the surface micro-nano structure processing operation process of the component to be processed according to the camera instruction issued by the industrial control computer.

[0010] In a second aspect, the present invention provides a femtosecond laser vacuum in-situ valve core columnar component processing method, which is executed by an industrial computer in a femtosecond laser vacuum in-situ valve core columnar component processing device as described in any one of the above; the method comprises: Driving the workpiece fixture to clamp the component to be processed; Driving the vacuum chamber assembly to perform a vacuum operation on the containing chamber; Driving the laser distance measuring component to measure the distance information between the laser emitting end and the to-be-processed element in real time, and receiving the distance information; Acquire material parameters of the component to be processed and target performance parameters matching the component to be processed, and obtain target processing parameters according to the material parameters, the target performance parameters and the distance information; According to the target processing parameters, driving the laser emitting component to output a laser beam; According to the target processing parameters, the workpiece fixture is driven to perform a position adjustment operation on the component to be processed; wherein the workpiece fixture and the laser emitting assembly act in coordination; According to the target processing parameters, the galvanometer processing assembly is driven to adjust the laser beam so as to perform surface micro-nano structure processing operations on the component to be processed through the laser beam.

[0011] In a possible design, the component to be processed is a workpiece after surface cleaning and drying.

[0012] In a possible design, the femtosecond laser vacuum in-situ valve core columnar element processing device further includes a camera assembly, and the camera assembly is electrically connected to the industrial control machine; correspondingly, the method further includes: The camera assembly is driven to capture the surface micro-nano structure processing operation process of the component to be processed.

[0013] In a third aspect, the present invention provides an electronic device, comprising: a memory for storing computer program instructions; and, A processor is used to execute the computer program instructions to complete the operation of the femtosecond laser vacuum in-situ valve core columnar element processing method as described in any one of the above.

[0014] In a fourth aspect, the present invention provides a computer program product, comprising a computer program or instructions, which, when executed by a computer, implements a femtosecond laser vacuum in-situ valve core columnar element processing method as described in any one of the above.

[0015] The beneficial effects of the present invention are: The present invention discloses a femtosecond laser vacuum in-situ valve core columnar element processing device, method, equipment and product, which can realize one-time forming and high-precision in-situ processing of columnar elements. In the implementation process of the present invention, the position of the columnar element waiting for processing can be adjusted by adjusting the position of the workpiece fixture, so as to realize accurate laser processing of different positions on the surface of the columnar element, overcoming the limitations of the traditional laser processing device in processing the micro-nano structure on the surface of the columnar element; at the same time, in the present invention, the workpiece fixture and the element to be processed are placed in a vacuum containing chamber for processing, avoiding the metal oxidation in an aerobic environment, which is conducive to improving the precise induction of the surface functional micro-nano structure, thereby realizing the precise preparation of the surface micro-nano structure of the element to be processed. Therefore, compared with the traditional laser processing device, the present invention can realize one-time forming processing of the surface functional micro-nano structure of columnar elements such as valve cores, and can be widely used in the precision manufacturing and processing industry of micro-nano structure on the surface of columnar elements, and has the advantages of no heat-affected oxidation, high processing accuracy, strong adaptability and high in-situ processing efficiency.

[0016] Other beneficial effects of the present invention will be further described in the specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 2 is a schematic structural diagram of a femtosecond laser vacuum in-situ valve core columnar element processing device in an embodiment; Figure 2 It is a flow chart of a femtosecond laser vacuum in-situ valve core columnar element processing method in an embodiment. DETAILED DESCRIPTION

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the present invention will be briefly introduced below in combination with the drawings and the description of the embodiments or the prior art. Obviously, the following description of the structure of the drawings is only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention.

[0019] Embodiment 1: This embodiment discloses a femtosecond laser vacuum in-situ valve core columnar element processing device, such as Figure 1As shown, it includes an industrial computer 1, a workpiece fixture, a vacuum chamber component 2, a laser emitting component 3, a laser ranging component 4 and a galvanometer processing component 5. The workpiece fixture, the vacuum chamber component 2, the laser emitting component 3, the laser ranging component 4 and the galvanometer processing component 5 are all electrically connected to the industrial computer 1. Specifically, the industrial computer 1 can be, but is not limited to, a computer device or a virtual machine with certain computing resources, such as a personal computer, a smart phone or a personal digital assistant or other electronic devices; wherein, The workpiece clamp is arranged in the accommodating cavity of the vacuum chamber assembly 2 and is used to clamp the component to be processed according to the workpiece fixing instruction issued by the industrial computer 1; The vacuum chamber component 2 is used to evacuate the containing chamber according to the vacuuming instruction issued by the industrial computer 1; it should be noted that in this embodiment, the vacuum chamber component 2 can provide a vacuum environment for the laser processing of the component to be processed, so as to reduce the influence of air interference and impurities on the laser processing process and ensure the processing accuracy. It should be understood that a sensor for detecting the gas content in the vacuum chamber is also provided in the vacuum chamber component 2, so as to confirm whether the vacuum chamber has reached a vacuum state during the vacuuming operation of the containing chamber.

[0020] The laser ranging component 4 is used to measure the distance information between the laser emitting end and the component to be processed in real time, and send the distance information to the industrial computer 1; it should be noted that the laser ranging component 4 is responsible for measuring the distance between the laser and the surface of the component to be processed to ensure that the laser emitted by the laser emitting component 3 is always focused on the correct position.

[0021] The industrial computer 1 is used to obtain the material parameters of the component to be processed and the target performance parameters matching the component to be processed, and obtain the target processing parameters according to the material parameters, the target performance parameters and the distance information; it should be noted that, in the present embodiment, the material parameters of the component to be processed include hardness and Poisson's ratio, etc., which are not limited here; the target performance parameters are the performance parameters of the functional micro-nano structure obtained by simulation design and optimization of the industrial computer 1, which can improve the sealing, lubrication and wear resistance of columnar components such as valve cores, and the target performance parameters include the three-dimensional size, surface roughness and surface contact angle of the specified surface micro-nano structure matching the component to be processed, which are not limited here; the target processing parameters include the laser parameters corresponding to the material parameters and the target performance parameters extracted from a preset laser parameter database, such as laser power, scanning speed, repetition frequency and spot overlap rate scanning times, which are also not limited here.

[0022] The laser emitting component 3 is used to output a laser beam according to the laser driving instruction bound to the target processing parameters issued by the industrial computer 1; specifically, in this embodiment, the laser emitting component 3 can emit a femtosecond laser to achieve the surface micro-nano structure processing operation of the component to be processed. It should be understood that a femtosecond laser is an ultra-short pulse laser with concentrated energy and very little thermal effect on the material, and is suitable for high-precision micro-nano processing.

[0023] The workpiece fixture is also used to perform position adjustment operation on the component to be processed according to the position adjustment instruction bound to the target processing parameter issued by the industrial computer 1; wherein the workpiece fixture and the laser emitting component 3 work in coordination; in this embodiment, the position adjustment instruction includes position adjustment information such as a specified rotation speed and a specified travel speed, and the workpiece fixture adjusts the rotation speed and the travel speed, and cooperates with the laser beam output by the laser emitting component 3 to realize in-situ femtosecond laser processing of the micro-nano structure on the surface of the component to be processed. Specifically, during the implementation process, the maximum rotation speed of the workpiece fixture is 1350rpm, and the maximum travel speed is 1000mm / s. As an example, if the component to be processed is a columnar valve core component with a diameter of 5cm, and a threaded structure with a spacing of 100mm needs to be processed on the component to be processed, then the laser emitting component 3 can be controlled to focus the femtosecond laser beam with a scanning speed of 7500mm / s on the surface of the component to be processed, and the travel speed of the workpiece fixture is controlled to be 100mm / s, and the rotation speed is 60rpm.

[0024] The galvanometer processing component 5 is arranged at the laser output end of the laser emitting component 3, and is used to adjust the laser beam according to the laser beam adjustment instruction bound to the target processing parameters issued by the industrial computer 1, so as to perform surface micro-nano structure processing operations on the component to be processed through the laser beam. It should be noted that in this embodiment, the galvanometer processing component 5 can complete the adjustment of the direction, position and focus of the laser beam emitted by the laser emitting component 3 in a very short time, ensuring that the laser beam can perform high-precision micro-nano structure processing on the surface of the component to be processed according to a predetermined path, while avoiding the thermal effects in traditional processing.

[0025] Specifically, in this embodiment, the workpiece clamp is configured as a claw type, and can move and rotate the component to be processed in three directions. The workpiece clamp is configured as a claw type, which is highly flexible and can clamp workpieces of different sizes and shapes.

[0026] In this embodiment, the femtosecond laser vacuum in-situ valve core columnar element processing device also includes an optical path component, which is arranged between the laser output end of the laser emitting component 3 and the galvanometer processing component 5, and the optical path component includes a polarizer 6, an analyzer 7, a beam expander 8 and a reflector 9 arranged in sequence along the laser emitting direction of the laser emitting component 3. Specifically, the polarizer 6 in this embodiment is used to convert the laser beam output by the laser emitting component 3 into polarized light, so that the subsequent optical elements can better control and adjust the laser beam; the analyzer 7 is used to detect the polarization direction of the laser beam to determine whether the laser beam has reached the required polarization condition, and to ensure that the polarization performance of the laser beam meets the requirements, thereby improving the processing quality and efficiency; the beam expander 8 includes a plurality of beam expanders, which are used to expand or focus the laser beam to control the diameter and power density of the laser to adapt to different processing requirements and material properties.

[0027] In this embodiment, the femtosecond laser vacuum in-situ valve core columnar element processing device also includes a camera component, which is electrically connected to the industrial computer 1; wherein the camera component is used to photograph the surface micro-nano structure processing operation process of the component to be processed according to the camera instruction issued by the industrial computer 1, so as to realize the monitoring and processing record of the component to be processed during the surface micro-nano structure processing operation.

[0028] This embodiment can realize one-time forming and high-precision in-situ processing of columnar elements. During the implementation of this embodiment, the position of the columnar element waiting to be processed can be adjusted by adjusting the position of the workpiece fixture, so that the precise laser processing of different positions on the surface of the columnar element can be realized, overcoming the limitations of traditional laser processing devices in processing micro-nano structures on the surface of columnar elements; at the same time, in this embodiment, the workpiece fixture and the element to be processed are placed in a vacuum chamber for processing, avoiding metal oxidation in an aerobic environment, which is conducive to improving the precise induction of the surface functional micro-nano structure, thereby realizing the precise preparation of the surface micro-nano structure of the element to be processed. Therefore, compared with traditional laser processing devices, this embodiment can realize one-time forming processing of the surface functional micro-nano structure of columnar elements such as valve cores, and can be widely used in the precision manufacturing and processing industry of micro-nano structures on the surface of columnar elements, and has the advantages of no heat-affected oxidation, high processing accuracy, strong adaptability and high in-situ processing efficiency.

[0029] Embodiment 2: This embodiment discloses a femtosecond laser vacuum in-situ valve core columnar component processing method, which is executed by the industrial computer 1 in the femtosecond laser vacuum in-situ valve core columnar component processing device in Example 1; Figure 2 As shown, the method includes: S1. Drive the workpiece fixture to clamp the component to be processed; specifically, in this embodiment, the component to be processed is a workpiece that has been subjected to surface cleaning and drying treatment. Specifically, in this embodiment, before the industrial computer 1 drives the workpiece fixture to clamp the component to be processed, the component to be processed is first placed in an ultrasonic cleaning machine for ultrasonic cleaning, then taken out, the surface of the valve core is cleaned with an ethyl acetate solution, and then placed for drying treatment to ensure that the surface of the component to be processed is free of impurities.

[0030] S2. driving the vacuum chamber assembly 2 to evacuate the accommodating chamber; S3. driving the laser ranging component 4 to measure the distance information between the laser emitting end and the element to be processed in real time, and receiving the distance information; S4. Obtaining material parameters of the component to be processed and target performance parameters matching the component to be processed, and obtaining target processing parameters according to the material parameters, the target performance parameters and the distance information; S5. According to the target processing parameters, driving the laser emitting assembly 3 to output a laser beam; S6. According to the target processing parameters, drive the workpiece fixture to perform position adjustment operation on the component to be processed; wherein the workpiece fixture and the laser emitting assembly 3 act in coordination; S7. According to the target processing parameters, the galvanometer processing assembly 5 is driven to adjust the laser beam so as to perform surface micro-nano structure processing operations on the component to be processed through the laser beam.

[0031] The femtosecond laser vacuum in-situ valve core columnar element processing device further includes a camera assembly, and the camera assembly is electrically connected to the industrial control machine; correspondingly, the method further includes: The camera assembly is driven to capture the surface micro-nano structure processing operation process of the component to be processed.

[0032] It should be noted that the working process, working details and technical effects of the femtosecond laser vacuum in-situ valve core columnar element processing method provided in this embodiment 2 can be found in embodiment 1 and will not be repeated here.

[0033] Embodiment 3: Based on Example 2, this embodiment discloses an electronic device, which may be a smart phone, a tablet computer, a laptop computer, or a desktop computer, etc. The electronic device may be called a user terminal, a portable terminal, a desktop terminal, etc. The electronic device includes: a memory for storing computer program instructions; and, A processor is used to execute the computer program instructions to complete the operation of the femtosecond laser vacuum in-situ valve core columnar element processing method as described in any one of Example 2.

[0034] Embodiment 4: Based on any one of Embodiments 2 to 3, this embodiment discloses a computer program product, including a computer program or an instruction, which, when executed by a computer, implements the femtosecond laser vacuum in-situ valve core columnar element processing method as described in any one of Embodiments 2. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices.

[0035] Obviously, those skilled in the art should understand that the above modules or steps of the present invention can be implemented by a general computing device, they can be concentrated on a single computing device, or distributed on a network composed of multiple computing devices, and optionally, they can be implemented by a program code executable by a computing device, so that they can be stored in a storage device and executed by the computing device, or they can be made into individual integrated circuit modules, or multiple modules or steps therein can be made into a single integrated circuit module for implementation. Thus, the present invention is not limited to any specific combination of hardware and software.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A femtosecond laser vacuum in-situ valve core columnar element processing device, characterized in that: It includes an industrial computer, a workpiece fixture, a vacuum chamber component, a laser emission component, a laser distance measurement component and a galvanometer processing component, wherein the workpiece fixture, the vacuum chamber component, the laser emission component, the laser distance measurement component and the galvanometer processing component are all electrically connected to the industrial computer; wherein, The workpiece clamp is arranged in the accommodating chamber of the vacuum chamber assembly and is used to clamp the component to be processed according to the workpiece fixing instruction issued by the industrial computer; The vacuum chamber component is used to perform a vacuum operation on the containing chamber according to the vacuum instruction issued by the industrial computer; The laser distance measuring component is used to measure the distance information between the laser emitting end and the component to be processed in real time, and send the distance information to the industrial computer; The industrial computer is used to obtain material parameters of the component to be processed and target performance parameters matching the component to be processed, and obtain target processing parameters according to the material parameters, the target performance parameters and the distance information; The laser emitting component is used to output a laser beam according to the laser driving instruction bound with the target processing parameters issued by the industrial computer; The workpiece fixture is also used to perform position adjustment operation on the component to be processed according to the position adjustment instruction bound to the target processing parameter issued by the industrial computer; wherein the workpiece fixture and the laser emitting component act in coordination; The galvanometer processing component is arranged at the laser output end of the laser emitting component, and is used to adjust the laser beam according to the laser beam adjustment instruction bound to the target processing parameters issued by the industrial computer, so as to perform surface micro-nano structure processing operations on the component to be processed through the laser beam.

2. The femtosecond laser vacuum in-situ valve core columnar element processing device according to claim 1, characterized in that: The workpiece clamp is configured as a claw type and moves and rotates the component to be processed in three directions.

3. The femtosecond laser vacuum in-situ valve core columnar element processing device according to claim 1, characterized in that: The material parameters of the component to be processed include hardness and Poisson's ratio; the target performance parameters include the three-dimensional size, surface roughness and surface contact angle of the specified surface micro-nano structure matching the component to be processed; the target processing parameters include laser power, scanning speed, repetition frequency and number of scanning times of spot overlap rate.

4. The femtosecond laser vacuum in-situ valve core columnar element processing device according to claim 1, characterized in that: The femtosecond laser vacuum in-situ valve core columnar element processing device also includes an optical path component, which is arranged between the laser output end of the laser emitting component and the galvanometer processing component. The optical path component includes a polarizer, an analyzer, a beam expander and a reflection component which are arranged in sequence along the laser emitting direction of the laser emitting component.

5. The femtosecond laser vacuum in-situ valve core columnar element processing device according to claim 1, characterized in that: The femtosecond laser vacuum in-situ valve core columnar element processing device also includes a camera assembly, and the camera assembly is electrically connected to the industrial control machine; wherein, The camera assembly is used to capture the surface micro-nano structure processing operation process of the component to be processed according to the camera instruction issued by the industrial control computer.

6. A femtosecond laser vacuum in-situ valve core columnar component processing method, characterized in that: The method is performed by an industrial computer in the femtosecond laser vacuum in-situ valve core columnar element processing device according to any one of claims 1 to 5; the method comprises: Driving the workpiece fixture to clamp the component to be processed; Driving the vacuum chamber assembly to perform a vacuum operation on the containing chamber; Driving the laser distance measuring component to measure the distance information between the laser emitting end and the to-be-processed element in real time, and receiving the distance information; Acquire material parameters of the component to be processed and target performance parameters matching the component to be processed, and obtain target processing parameters according to the material parameters, the target performance parameters and the distance information; According to the target processing parameters, driving the laser emitting component to output a laser beam; According to the target processing parameters, the workpiece fixture is driven to perform a position adjustment operation on the component to be processed; wherein the workpiece fixture and the laser emitting assembly act in coordination; According to the target processing parameters, the galvanometer processing assembly is driven to adjust the laser beam so as to perform surface micro-nano structure processing operations on the component to be processed through the laser beam.

7. The femtosecond laser vacuum in-situ valve core columnar element processing method according to claim 6, characterized in that: The component to be processed is a workpiece after surface cleaning and drying.

8. The femtosecond laser vacuum in-situ valve core columnar component processing method according to claim 6, characterized in that: The femtosecond laser vacuum in-situ valve core columnar element processing device further includes a camera assembly, and the camera assembly is electrically connected to the industrial control machine; correspondingly, the method further includes: The camera assembly is driven to capture the surface micro-nano structure processing operation process of the component to be processed.

9. An electronic device, characterized in that: include: a memory for storing computer program instructions; as well as, A processor is used to execute the computer program instructions to complete the operation of the femtosecond laser vacuum in-situ valve core columnar element processing method as described in any one of claims 6 to 8.

10. A computer program product comprising a computer program or instructions, characterized in that When the computer program or the instruction is executed by a computer, the femtosecond laser vacuum in-situ valve core columnar element processing method as described in any one of claims 6 to 8 is implemented.

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