Quantitative surface treatment method for high-hardness metal

Abstract

The embodiment of the invention relates to the technical field of high-hardness metal polishing, in particular to a high-hardness metal quantitative surface treatment method. At present, most of the polishing processes are used for researching and testing aluminum, nickel-based alloys and the like with the hardness smaller than 100 HB (Brinell hardness), a small amount of research on polishing of industrial stainless steel exists, but research on polishing of high-temperature-resistant high-hardness metal components such as tungsten, molybdenum, tantalum and the like applied to spaceflight, aviation and deep sea at present is little. In order to solve the requirements and the blank, the quantitative surface treatment method for the high-hardness metal is provided by quantitatively polishing the tungsten, molybdenum and tantalum high-hardness metal by 5nm, 50nm and 100nm, and the quantitative surface treatment method for the high-hardness metal comprises the steps of rough grinding, fine grinding, polishing and cleaning treatment. Through reasonable design, selection and optimization of a specific grinding / polishing solution, a grinding / polishing disc, the rotating speed, the pressure and the grinding / polishing time, specific high-hardness metal quantitative surface treatment is finally achieved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of high-hardness metal polishing, and specifically to a quantitative surface treatment method for high-hardness metals. Background Art

[0002] Most of the current polishing processes are aimed at research and testing of aluminum and nickel-based alloys with a hardness less than 100HB (Brinell hardness). There are also a small number of studies on the polishing of stainless steel for industrial use. There is little research on the polishing of high-temperature resistant and high-hardness metal components such as tungsten, molybdenum, and tantalum for current aerospace, aviation, and deep-sea applications. High-temperature resistant and high-hardness metals such as tungsten, molybdenum, and tantalum are rare high-temperature resistant non-ferrous metals with a melting point of more than 3000℃ (degrees Celsius), low expansion coefficient, stable chemical properties, and are not easily deformed at high temperatures. They also have high thermal conductivity and exhibit excellent properties in long-term thermal environments. They have great application potential in the fields of structural and thermophotoelectric technology research. Their surface condition has a great influence on the application effect, and there is very little research on their quantitative surface treatment processes. Summary of the invention

[0003] The content of this application is used to introduce concepts in a brief form, which will be described in detail in the detailed implementation section below. The content of this application is not intended to identify the key features or essential features of the technical solution claimed for protection, nor is it intended to limit the scope of the technical solution claimed for protection.

[0004] Some embodiments of the present application propose a quantitative surface treatment method for high-hardness metals to solve one or more of the technical problems mentioned in the above background technology section.

[0005] Some embodiments of the present application provide a quantitative surface treatment method for high-hardness metals, the method comprising: configuring at least one grinding liquid; using a diamond pressing disk to correct the flatness of the grinding disk, wherein all materials are cleaned before each replacement of the grinding liquid in the grinding disk; based on the corrected grinding disk and the configured at least one grinding liquid, using a first diamond-solidified abrasive grinding pad to roughly grind the high-hardness metal, wherein the abrasive particle size of the above-mentioned first diamond-solidified abrasive grinding pad is 20-50μm; according to a preset polishing disk sequence, using a second diamond-solidified abrasive grinding pad to fine-grind the high-hardness metal after rough grinding, wherein the abrasive particle size of the above-mentioned second diamond-solidified abrasive grinding pad is 5-20μm.

[0006] The above-mentioned embodiments of the present application have the following beneficial effects: through the quantitative surface treatment method of high-hardness metal in some embodiments of the present application, the quantitative problem of substrate surface in various studies can be effectively solved. Specifically, the reason why it is difficult to solve the quantitative problem of substrate surface in various studies is that high-temperature resistant and high-hardness metals such as tungsten, molybdenum, and tantalum are rare non-ferrous metals that are resistant to high temperatures, with a melting point of more than 3000°C (degrees Celsius), a low expansion coefficient, stable chemical properties, and dimensions that are not easily deformed at high temperatures. They also have high thermal conductivity and exhibit excellent properties in long-term thermal environments. They have great application potential in the fields of structural and thermophotoelectric technology research. Their surface conditions have a great influence on the application effect, and there are very few process studies on their quantitative surface treatment. Based on this, the quantitative surface treatment method of high-hardness metal in some embodiments of the present application, first, configure at least one grinding liquid. Secondly, a diamond pressing disc is used to correct the flatness of the grinding disc, wherein all materials are cleaned before each replacement of the grinding liquid in the grinding disc. Then, according to the corrected grinding disc and at least one configured grinding liquid, the first diamond-bonded abrasive grinding pad is used to roughly grind the high-hardness metal, wherein the abrasive particle size of the first diamond-bonded abrasive grinding pad is 20-50 μm. Finally, according to the preset polishing disc sequence, the second diamond-bonded abrasive grinding pad is used to finely grind the high-hardness metal after rough grinding, wherein the abrasive particle size of the second diamond-bonded abrasive grinding pad is 5-20 μm. Therefore, the beneficial effect of the present invention is: through the principle of mechanical polishing, when realizing the quantitative processing of high-hardness metals such as tungsten, molybdenum, tantalum and other materials with a surface roughness of 5nm (nanometer)-100nm, the surface material changes caused by chemical polishing methods can be avoided, and the quantitative problem of substrate surface in various studies can be effectively solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The above and other features, advantages and aspects of the embodiments of the present application will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. Throughout the accompanying drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and that components and elements are not necessarily drawn to scale.

[0008] Figure 1 is a flow chart of some embodiments of the quantitative surface treatment method of high hardness metal according to the present application; Figure 2 It is a schematic diagram of some embodiments of the quantitative surface treatment method of high hardness metal according to the present application. DETAILED DESCRIPTION

[0009] Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided to provide a more thorough and complete understanding of the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not intended to limit the scope of protection of the present application.

[0010] It should also be noted that, for ease of description, only the parts related to the invention are shown in the drawings. In the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other.

[0011] It should be noted that the concepts such as "first" and "second" mentioned in this application are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0012] It should be noted that the modifications of "one" and "plurality" mentioned in the present application are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0013] The names of the messages or information exchanged between multiple devices in the embodiments of the present application are only used for illustrative purposes and are not used to limit the scope of these messages or information.

[0014] The present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0015] Figure 1 The process 100 of some embodiments of the high hardness metal quantitative surface treatment method according to the present application is shown. The high hardness metal quantitative surface treatment method comprises the following steps: Step 101, preparing at least one polishing liquid.

[0016] In some embodiments, the execution body of the high-hardness metal quantitative surface treatment method can be configured with at least one grinding liquid, wherein a grinding liquid with a preset particle size number can be determined as one of the at least one grinding liquid.

[0017] As an example, the preset granularity number may be, but is not limited to, at least one of the following: W240, W100, W40, W20, W10, W7 or W5.

[0018] Step 102, using a diamond pressing disc to correct the flatness of the grinding disc.

[0019] In some embodiments, the execution subject may use a diamond pressing disc to correct the flatness of the grinding disc. Before each replacement of the grinding fluid in the grinding disc, all materials are cleaned.

[0020] In some optional implementations of some embodiments, the execution body cleans all materials by using acetone and ultrapure water, and the drying temperature after cleaning is 80±5°C (degrees Celsius) and the drying time is 60±10 minutes (minutes). The ratio of acetone to ultrapure water can be one to one.

[0021] Step 103 , using the first diamond bonded abrasive grinding pad to roughly grind the high hardness metal according to the corrected grinding disc and at least one configured grinding liquid.

[0022] In some embodiments, the execution subject can use the first diamond-bonded abrasive grinding pad to roughly grind the high-hardness metal according to the corrected grinding disc and the configured at least one grinding liquid. The abrasive particle size of the first diamond-bonded abrasive grinding pad is 20-50 μm (micrometer). The at least one grinding liquid can be placed in the corrected grinding disc in order of particle size from large to small according to the preset flow value, and the first diamond-bonded abrasive grinding pad can be used to roughly grind the high-hardness metal. The preset flow value can be 6-12 ml / min (milliliters per minute).

[0023] Specifically, the time for rough grinding can be: 20-40min (minutes). The surface after rough polishing, milling, grinding and other processes can be 50-110rmp (Revolutions Per Minute), the speed of the grinding disc is 60-120rmp, and the pressure is 40-80kpa (kilopascals). Here, polishing can be performed by adding a counterweight disc or weight.

[0024] Step 104 , according to a preset polishing disc sequence, use a second diamond-bonded abrasive grinding pad to fine-grind the rough-ground high-hardness metal.

[0025] In some embodiments, the execution body can use a diamond-bonded abrasive pad to fine-grind the high-hardness metal after rough grinding according to a preset polishing disk sequence. Wherein, the abrasive grain size of the second diamond-bonded abrasive pad is 5-20 μm.

[0026] Optionally, before the second diamond bonded abrasive grinding pad is used to fine-grind the high-hardness metal after rough grinding according to the preset polishing disk sequence, the above-mentioned execution body can also use a repairing disk to correct the flatness of each polishing disk according to the preset polishing disk sequence. Wherein, all materials are cleaned before each replacement of the polishing disk. The above-mentioned preset polishing disk sequence can be the order of the mesh numbers of each polishing disk from small to large. The above-mentioned repairing disk is a diamond with a surface roughness of 5nm as a mirror. The fine grinding time can be 40-60min, and the other parameters are the same as the rough grinding.

[0027] Specifically, starting from the fine grinding step, it is necessary to be carried out in a clean environment to avoid the influence of dust, smoke, grease, etc. on the surface quantitative treatment.

[0028] As an example, the mesh size of the polishing disc may be, but is not limited to, at least one of the following: 1000 mesh, 2000 mesh, 3000 mesh or 5000 mesh.

[0029] Optionally, the execution body may also be configured with polishing liquid, polishing paste, polishing leather, and polishing flannel to perform quantitative polishing on high-hardness metals. The polishing liquid uses sodium hydroxide solution and organic acid to adjust the pH (acidity and alkalinity) value of the solution so that the pH value of the polishing liquid is less than 12, and the specific pH value may be 2-5. Thus, the crystallization of abrasive particles in the polishing liquid can be suppressed, thereby effectively improving the mechanical removal of materials. The polishing paste may include at least one diamond grinding paste. The particle size of the diamond grinding paste in the at least one diamond grinding paste may be, but is not limited to, at least one of the following: W40, W28, W20, W18, W15, W13, W10, W7, W5, W3.5, W3, W2.5, W2, W1.5, W1, W0.5, and W0.1. In order to obtain a stable surface treatment effect, the selected polishing material is a material that is not easy to heat up, such as flannel.

[0030] Specifically, during the quantitative polishing process, the surface quality changes of the target sample are monitored every half an hour, and the surface condition is determined by a surface roughness comparison sample or a non-contact surface roughness measuring instrument. After the process is stabilized, quantitative polishing can also be achieved by fixing the parameters. The target sample can be a sample of a high-hardness metal.

[0031] Specifically, the flow rate of the polishing liquid can be 4-6 ml / min. Silica abrasive particles are used as abrasives, and the abrasive particle size can be 65-80 nm. The fine grinding and polishing time can be 90-150 min, the workpiece speed can be 40-70 rpm, the grinding disc speed can be 50-80 rpm, and the pressure can be 20-40 kPa. Among them, polishing can be performed by adding a counterweight plate or weights.

[0032] As an example, the polishing pad may be an IC 1000 / Suba IV polishing pad.

[0033] Therefore, the Ra (roughness) value of the above-mentioned high-hardness metal after initial quantitative surface treatment can reach 5nm-100nm.

[0034] The above-mentioned embodiments of the present application have the following beneficial effects: through the quantitative surface treatment method of high-hardness metal in some embodiments of the present application, the quantitative problem of substrate surface in various studies can be effectively solved. Specifically, the reason why it is difficult to solve the quantitative problem of substrate surface in various studies is that high-temperature resistant and high-hardness metals such as tungsten, molybdenum, and tantalum are rare non-ferrous metals that are resistant to high temperatures, with a melting point of more than 3000°C (degrees Celsius), a low expansion coefficient, stable chemical properties, and dimensions that are not easily deformed at high temperatures. They also have high thermal conductivity and exhibit excellent properties in long-term thermal environments. They have great application potential in the fields of structural and thermophotoelectric technology research. Their surface conditions have a great influence on the application effect, and there are very few process studies on their quantitative surface treatment. Based on this, the quantitative surface treatment method of high-hardness metal in some embodiments of the present application, first, configure at least one grinding liquid. Secondly, a diamond pressing disc is used to correct the flatness of the grinding disc, wherein all materials are cleaned before each replacement of the grinding liquid in the grinding disc. Then, according to the corrected grinding disc and at least one configured grinding liquid, the first diamond-bonded abrasive grinding pad is used to roughly grind the high-hardness metal, wherein the abrasive particle size of the first diamond-bonded abrasive grinding pad is 20-50 μm. Finally, according to the preset polishing disc sequence, the second diamond-bonded abrasive grinding pad is used to finely grind the high-hardness metal after rough grinding, wherein the abrasive particle size of the second diamond-bonded abrasive grinding pad is 5-20 μm. Therefore, the beneficial effect of the present invention is: through the principle of mechanical polishing, when realizing the quantitative processing of the surface roughness of 5nm-100nm of high-hardness metals such as tungsten, molybdenum, tantalum and other materials, the surface material changes caused by chemical polishing methods can be avoided, and the quantitative problem of the substrate surface in various studies can be effectively solved. Figure 2 Schematic diagrams of some embodiments of the quantitative surface treatment method for high hardness metal according to the present application are shown. Figure 2 As shown, the quantitative surface treatment method for high-hardness metal can firstly grind the high-hardness metal surface according to the grinding disc, the grinding liquid, the configured workpiece speed value, the configured disc speed value, the configured pressure value and the configured time value. Then, the high-hardness metal surface can be finely ground according to the polishing disc, the polishing liquid, the configured workpiece speed value, the configured disc speed value, the configured pressure value and the configured time value. Then, the high-hardness metal surface is quantitatively polished. Finally, the high-hardness metal is finally cleaned. The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the protection scope of the technical solutions of the embodiments of the present application.

Claims

1. A quantitative surface treatment method for high hardness metal, comprising: Prepare at least one grinding liquid; A diamond pressing disc is used to correct the flatness of the grinding disc, wherein all materials are cleaned before each replacement of the grinding fluid in the grinding disc; According to the corrected grinding disc and at least one configured grinding liquid, a first diamond-bonded abrasive grinding pad is used to roughly grind the high-hardness metal, wherein the abrasive grain size of the first diamond-bonded abrasive grinding pad is 20-50 μm; According to the preset polishing disc sequence, the high-hardness metal after rough grinding is finely ground using a second diamond-bonded abrasive grinding pad, wherein the abrasive grain size of the second diamond-bonded abrasive grinding pad is 5-20 μm; Prepare polishing liquid, polishing paste, polishing leather and polishing flannel to quantitatively polish high-hardness metals; During the quantitative polishing process, pay attention to the surface quality changes of the target sample every half an hour, and judge the surface condition through surface roughness comparison blocks or non-contact surface roughness measuring instruments.

2. The method for quantitative surface treatment of high hardness metal according to claim 1, characterized in that: The cleaning of all materials comprises: Acetone and ultrapure water are used for cleaning. After cleaning, the drying temperature is 80±5℃ and the drying time is 60±10min.

3. The method for quantitative surface treatment of high hardness metal according to claim 1, characterized in that: Before fine grinding the rough-ground high-hardness metal using the second diamond-bonded abrasive grinding pad according to the preset polishing disk sequence, the method further comprises: According to the preset polishing disc sequence, the flatness of each polishing disc is corrected by using a repairing disc, wherein all materials are cleaned before each polishing disc is replaced.

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