Silicon wafer surface treatment equipment

Abstract

The invention belongs to the technical field of silicon wafer polishing, and discloses silicon wafer surface treatment equipment which comprises a base, a supporting disc and a collecting assembly and further comprises a grinding mechanism, a cutting fluid pipe, a gear ring and a grinding wheel, the inner side of the gear ring is meshed with a gear, the upper end face of the gear is connected with a driving assembly, and the lower end face of the gear is rotationally connected with a second connecting rod; the lower end face of the second connecting rod is rotatably provided with a sliding block, and the outer wall of the sliding block is slidably provided with a fixing frame. The protection mechanism comprises an extrusion assembly, a cooling assembly and a protection ring, a baffle ring is fixedly installed on the outer wall of the protection ring, a plurality of tension springs are evenly installed on the outer wall of the baffle ring along the circumference, and rotating blocks are installed on the sides, away from the baffle ring, of the tension springs; and the extrusion assembly comprises extrusion blocks symmetrically installed on the outer wall of the sliding block and springs symmetrically installed on the inner wall of the fixing frame, sliding rods are installed on the lower end faces of the springs, and conical wheels are rotationally installed on the lower end faces of the sliding rods. The problem that when an existing device polishes a silicon wafer, edge breakage is likely to happen is solved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer polishing, in particular to silicon wafer surface treatment equipment. Background Art

[0002] Silicon wafers, also known as wafers, are the core raw materials for manufacturing chips and various semiconductor devices. In semiconductor manufacturing, silicon wafer surface treatment is one of the key process steps, aiming to provide a high-quality foundation for subsequent lithography, doping, deposition and other processes. Among them, polishing, as an important part of silicon wafer surface treatment, is mainly used to improve the surface quality of silicon wafers, remove surface defects and roughness, and lay a solid foundation for subsequent processing technology.

[0003] The Chinese patent application number 202311214386.1, "A surface treatment device for a single crystal silicon wafer with a cross-section grinding function", relates to an improved grinding device. The device includes a housing, a surface treatment mechanism, a lifting frame and a base, wherein the housing and the lifting frame are both arranged above the base, and the lifting frame is located inside the housing.

[0004] During the grinding process, the device adjusts the motion trajectory of the grinding wheel to achieve uniform grinding of the silicon wafer. However, in actual operation, when the grinding wheel rotates on the surface of the silicon wafer, it will generate a large grinding force. Especially when the grinding wheel moves to the edge of the silicon wafer, the existing device cannot effectively protect the edge of the silicon wafer, which will increase the risk of surface defects of the silicon wafer, such as edge collapse and edge collapse, thereby affecting the quality of the final product. Therefore, in view of this situation, the device needs to be optimized to reduce the occurrence of these defects. Summary of the invention

[0005] The purpose of the present invention is to provide a silicon wafer surface treatment device, which solves the problem that the existing device is prone to edge collapse when grinding silicon wafers.

[0006] To achieve the above object, the present invention provides the following technical solution: a silicon wafer surface treatment device, comprising a base, a rotatable support plate located above the base for supporting the silicon wafer, and a collecting assembly located inside the base, and further comprising: The grinding mechanism includes a lifting component, a cutting fluid pipe, a gear ring and a grinding wheel. A gear is meshed inside the gear ring. The upper end surface of the gear is connected to a driving component. The lower end surface of the gear is rotatably connected to a second connecting rod. A slider is rotatably installed on the lower end surface of the second connecting rod. A fixed frame is slidably installed on the outer wall of the slider. When the lifting component drives the grinding wheel to abut against the silicon wafer, the cutting fluid pipe supplies cutting fluid, the driving component drives the gear to rotate in the gear ring, the gear drives the slider to reciprocate in the fixed frame, and the slider drives the grinding wheel to move on the silicon wafer to complete uniform grinding. The protection mechanism comprises an extrusion assembly, a cooling assembly and a protection ring, wherein a retaining ring is fixedly mounted on the outer wall of the protection ring, and a plurality of tension springs are evenly mounted on the outer wall of the retaining ring along its circumference, and a rotating block is mounted on the side of the tension spring away from the retaining ring; when the slider moves back and forth, the extrusion assembly squeezes the retaining ring under the grinding wheel, and the retaining ring with the protection ring abuts against the outer wall of the silicon wafer to prevent edge collapse; The extrusion assembly includes an extrusion block symmetrically installed on the outer wall of the slider and a spring symmetrically installed on the inner wall of the fixed frame. A slide rod is installed on the lower end surface of the spring, and a conical wheel is rotatably installed on the lower end surface of the slide rod. When the slider moves, the extrusion block is driven to extrude the slide rod, and the slide rod drives the conical wheel to descend, and the conical wheel extrude the retaining ring.

[0007] Preferably, the collecting assembly comprises a cutting fluid chamber opened on the base, and a filter plate is slidably mounted on the inner wall of the cutting fluid chamber.

[0008] Preferably, the lifting assembly comprises a support plate, the support plate is fixedly mounted on the outer wall of the base, an electric telescopic rod is mounted on the lower end surface of the support plate, and a support frame is mounted on the lower end surface of the electric telescopic rod.

[0009] Preferably, the driving assembly includes a second servo motor, the upper end surface of the second servo motor is mounted on a support frame, the output shaft of the second servo motor is fixedly mounted with a first connecting rod, and the first connecting rod is rotatably mounted on a gear at one end away from the second servo motor.

[0010] Preferably, the fixing frame is fixedly connected to the supporting frame, a fixing ring is fixedly mounted on the lower end surface of the supporting frame, and the lower end surface of the fixing ring is fixedly connected to the gear ring.

[0011] Preferably, a sliding groove is provided on the outer wall of the fixing frame corresponding to the sliding rod, and the inner wall of the sliding groove is slidably connected to the sliding rod.

[0012] Preferably, a first servo motor is fixedly mounted on the lower end surface of the slider, and an output shaft of the first servo motor is fixedly connected to the grinding wheel.

[0013] Preferably, the cooling component includes a water channel opened on the outer wall of the protective ring, a block is installed on the inner wall of the water channel, an inlet pipe and an outlet pipe are respectively installed on one side of the water channel passing through the baffle ring, and the inlet pipe and the outlet pipe are located on both sides of the block, a water tank is installed on the side of the inlet pipe and the outlet pipe away from the water channel, and the water tank is installed on the lower end surface of the support plate.

[0014] Preferably, a third servo motor is mounted on the upper end surface of the base, and an output shaft of the third servo motor is fixedly connected to the support plate.

[0015] Preferably, the outer wall of the support plate is provided with a plurality of through holes, the lower end surface of the support plate is abutted with an annular groove corresponding to the through holes, the lower end surface of the annular groove is evenly connected with a plurality of pipes along its circumference, and the lower end surface of the pipe passes through the base and is connected with the cutting fluid tank.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The present invention is provided with a grinding mechanism. When the grinding wheel contacts the silicon wafer, the first servo motor drives the grinding wheel to rotate to grind the silicon wafer, the second servo motor drives the first connecting rod to rotate, the first connecting rod drives the gear to rotate on the gear ring, and the gear drives the slider to reciprocate in the fixed frame through the second connecting rod, so that the slider can drive the grinding wheel to reciprocate on the silicon wafer to perform uniform grinding. The present invention is provided with a protective mechanism. When the slider reciprocates in the fixed frame, the extrusion block on the slider will first squeeze the sliding rod, and the sliding rod will slide in the sliding groove, driving the conical wheel to descend and stretch the spring. At this time, the conical wheel will squeeze the retaining ring, and the retaining ring will drive the protective ring to abut against the outer wall of the silicon wafer. As the slider continues to drive the extrusion block to move, the slider drives the grinding wheel to grind the edge of the silicon wafer. The protective ring will protect the edge of the silicon wafer, and the protective ring will cool the edge of the silicon wafer at the grinding location to reduce the occurrence of fractures or edge collapse. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the grinding mechanism of the present invention; Figure 3 for Figure 2 The enlarged schematic diagram of point A in the middle; Figure 4 for Figure 2 Sectional view; Figure 5 It is a schematic diagram of the protection mechanism of the present invention; Figure 6 for Figure 5 Schematic diagram without silicon wafer and retaining ring; Figure 7 for Figure 6 Schematic diagram from another perspective; Figure 8 This is a schematic diagram of the interior of the cutting fluid tank of the present invention.

[0018] In the figure: 1, base; 2, cutting fluid tank; 3, silicon wafer; 4, support plate; 5, cutting fluid pipe; 6, electric telescopic rod; 7, support frame; 8, fixing ring; 9, support plate; 10, control panel; 11, gear ring; 12, fixing frame; 13, slide groove; 14, spring; 15, extrusion block; 16, slide rod; 17, conical wheel; 18, gear; 19, first servo motor; 20, grinding wheel; 21, second servo motor; 22, first connecting rod; 23, second connecting rod; 24, slider; 25, water inlet pipe; 26, rotating block; 27, tension spring; 28, water outlet pipe; 29, protective ring; 30, retaining ring; 31, waterway; 32, retaining block; 33, through hole; 34, water tank; 35, annular groove; 36, pipeline; 37, third servo motor; 38, filter plate. DETAILED DESCRIPTION

[0019] See also Figures 1 to 8 The present invention provides a technical solution: a silicon wafer surface treatment device, comprising a base 1, a rotatable support plate 9 located above the base 1 for supporting a silicon wafer 3, and a collecting component located inside the base 1, and further comprising: The grinding mechanism includes a lifting assembly, a cutting fluid pipe 5, a gear ring 11 and a grinding wheel 20. A gear 18 is meshed inside the gear ring 11. The upper end face of the gear 18 is connected to a driving assembly. The lower end face of the gear 18 is rotatably connected to a second connecting rod 23. A slider 24 is rotatably installed on the lower end face of the second connecting rod 23. A fixed frame 12 is slidably installed on the outer wall of the slider 24. When the lifting assembly drives the grinding wheel 20 to abut against the silicon wafer 3, the cutting fluid pipe 5 supplies cutting fluid, the driving assembly drives the gear 18 to rotate in the gear ring 11, the gear 18 drives the slider 24 to reciprocate in the fixed frame 12, and the slider 24 drives the grinding wheel 20 to move on the silicon wafer 3 to complete uniform grinding. The protection mechanism includes an extrusion assembly, a cooling assembly and a protection ring 29. A retaining ring 30 is fixedly installed on the outer wall of the protection ring 29. A plurality of tension springs 27 are evenly installed on the outer wall of the retaining ring 30 along its circumference. A rotating block 26 is installed on the side of the tension spring 27 away from the retaining ring 30. The rotating block 26 is rotatably installed on the support plate 9. When the slider 24 reciprocates, the extrusion assembly squeezes the retaining ring 30 under the grinding wheel 20, and the retaining ring 30 with the protection ring 29 abuts against the outer wall of the silicon wafer 3 to prevent edge collapse. The extrusion assembly includes an extrusion block 15 symmetrically mounted on the outer wall of the slider 24 and a spring 14 symmetrically mounted on the inner wall of the fixed frame 12. The lower end surface of the spring 14 is mounted with a slide bar 16, and the lower end surface of the slide bar 16 is rotatably mounted with a conical wheel 17. When the slider 24 moves, the extrusion block 15 is driven to extrude the slide bar 16, and the slide bar 16 drives the conical wheel 17 to descend, and the conical wheel 17 squeezes the retaining ring 30. Further, such as Figure 1 and Figure 8As shown, the collecting assembly includes a cutting fluid chamber 2 opened on a base 1, and a filter plate 38 is slidably mounted on the inner wall of the cutting fluid chamber 2; The cutting fluid tank 2 collects the cutting fluid, and the filter plate 38 filters the cutting fluid; Further, such as Figure 1 As shown, the lifting assembly includes a support plate 4, which is fixedly mounted on the outer wall of the base 1, and an electric telescopic rod 6 is mounted on the lower end surface of the support plate 4, and a support frame 7 is mounted on the lower end surface of the electric telescopic rod 6; When the electric telescopic rod 6 is raised or lowered, it drives the support frame 7 to move up and down; Further, such as Figure 4 As shown, the driving assembly includes a second servo motor 21, the upper end surface of the second servo motor 21 is mounted on the support frame 7, the output shaft of the second servo motor 21 is fixedly mounted with a first connecting rod 22, and the first connecting rod 22 is rotatably mounted on the gear 18 at one end away from the second servo motor 21; When the second servo motor 21 rotates, it drives the first connecting rod 22 to rotate, and the first connecting rod 22 drives the gear 18 to rotate on the gear ring 11; Further, such as Figure 4 As shown, the fixing frame 12 is fixedly connected to the support frame 7, a fixing ring 8 is fixedly installed on the lower end surface of the support frame 7, and the lower end surface of the fixing ring 8 is fixedly connected to the gear ring 11; When the support frame 7 rises or falls, it drives the fixed frame 12 and the fixed ring 8 to move, and the fixed ring 8 drives the gear ring 11 to move; Further, as shown in the figure, a slide groove 13 is provided on the outer wall of the fixed frame 12 corresponding to the slide rod 16, and the inner wall of the slide groove 13 is slidably connected to the slide rod 16; The slide bar 16 rises or falls in the slide slot 13; Further, such as Figure 3 As shown, a first servo motor 19 is fixedly mounted on the lower end surface of the slider 24, and an output shaft of the first servo motor 19 is fixedly connected to the grinding wheel 20; The first servo motor 19 rotates to drive the grinding wheel 20 to rotate; Further, such as Figure 6 and Figure 7 As shown, the cooling assembly includes a water channel 31 opened on the outer wall of the protective ring 29, a block 32 is installed on the inner wall of the water channel 31, and a water inlet pipe 25 and a water outlet pipe 28 are respectively installed on one side of the water channel 31 through the block ring 30, and the water inlet pipe 25 and the water outlet pipe 28 are located on both sides of the block 32, and a water tank 34 is installed on the side of the water inlet pipe 25 and the water outlet pipe 28 away from the water channel 31, and the water tank 34 is installed on the lower end surface of the support plate 9, and a water pump (not shown in the figure) is installed inside the water tank 34; When the water pump is working, the water in the water tank 34 flows into the water channel 31 from the water inlet pipe 25. Since the water channel 31 is blocked by the block 32, the water in the water channel 31 flows around the water channel 31 and finally flows into the water tank 34 again from the water outlet pipe 28. The flow of water can accelerate the heat dissipation of the protective ring 29. Further, such as Figure 7 As shown, a third servo motor 37 is installed on the upper end surface of the base 1, and the output shaft of the third servo motor 37 is fixedly connected to the support plate 9; The third servo motor 37 drives the silicon wafer 3 on the supporting plate 9 to rotate slowly; Further, such as Figure 6 and Figure 7 As shown, the outer wall of the support plate 9 is provided with a plurality of through holes 33, and the lower end surface of the support plate 9 is abutted with an annular groove 35 corresponding to the through holes 33, and the lower end surface of the annular groove 35 is evenly connected with a plurality of pipes 36 along its circumference, and the lower end surface of the pipe 36 passes through the base 1 and is connected with the cutting fluid chamber 2; The cutting fluid on the silicon wafer 3 drops into the annular groove 35 through the through hole 33, and then enters the cutting fluid chamber 2 through the pipeline 36; Further, such as Figure 6 As shown, a suction cup is provided at the center of the support plate 9; Used to absorb the silicon wafer 3 to prevent it from moving; Further, such as Figure 1 As shown, a control panel 10 is installed on the outer wall of the base 1; Used to set relevant parameters of the device and control the operation of the device.

[0020] Working principle: Step 1: Place the center of the silicon wafer 3 on the suction cup of the support plate 9, and then connect an external power supply. At this time, the electric telescopic rod 6 is controlled to descend and the third servo motor 37 is controlled to rotate. The electric telescopic rod 6 drives the support frame 7 to descend, and the support frame 7 drives the fixed ring 8 and the fixed frame 12 to descend. At this time, the fixed frame 12 drives the grinding wheel 20 to descend through the slider 24 and the first servo motor 19 and abuts against the silicon wafer 3. At the same time, the cutting fluid pipe 5 drips the cutting fluid, and the third servo motor 37 drives the silicon wafer 3 on the support plate 9 to rotate, so that the cutting fluid drips evenly on the silicon wafer 3. After descending to the specified position, the electric telescopic rod 6 stops descending; Step 2: When the grinding wheel 20 contacts the silicon wafer 3, the first servo motor 19 and the second servo motor 21 are controlled to rotate. The first servo motor 19 drives the grinding wheel 20 to rotate to grind the silicon wafer 3. The second servo motor 21 drives the first connecting rod 22 to rotate. The first connecting rod 22 drives the gear 18 to rotate on the gear ring 11. The gear 18 drives the slider 24 to reciprocate in the fixed frame 12 through the second connecting rod 23, so that the slider 24 can drive the grinding wheel 20 to reciprocate on the silicon wafer 3 to grind evenly. Step 3: When the slider 24 moves back and forth in the fixed frame 12, Figure 1 and Figure 3 For example, the extrusion block 15 on the slider 24 will first squeeze the slide bar 16, and the slide bar 16 will slide in the slide groove 13, driving the conical wheel 17 to descend and stretch the spring 14. At this time, the conical wheel 17 will squeeze the retaining ring 30, and the retaining ring 30 will drive the protective ring 29 to abut against the outer wall of the silicon wafer 3. At this time, the retaining ring 30 will squeeze the tension spring 27 close to the side of the grinding wheel 20, and the remaining tension springs 27 will be stretched. The stretched tension spring 27 drives the rotating block 26 to rotate on the supporting plate 9 to adjust the direction. As the slider 24 continues to drive the extrusion block 15 to move, the slider 24 drives the grinding wheel 20 to grind the edge of the silicon wafer 3. The protective ring 29 will protect the edge of the silicon wafer 3 to prevent edge collapse; When the slider 24 drives the extrusion block 15 away from the slide bar 16, the spring 14 contracts, driving the slide bar 16 to slide upward in the slide groove 13, and the slide bar 16 drives the conical wheel 17 away from the retaining ring 30. At the same time, the outer wall of the retaining ring 30 is squeezed and stretched by the tension spring 27 to stretch or contract, so that the retaining ring 30 drives the protective ring 29 to move away from the silicon wafer 3. At this time, the grinding debris and cutting fluid will fall into the annular groove 35 through the through hole 33, and then flow into the cutting fluid chamber 2 through the pipe 36 and be filtered by the filter plate 38; Step 4: When the grinding wheel 20 grinds the silicon wafer 3, the water pump in the water tank 34 starts working, so that the water in the water tank 34 flows into the water channel 31 through the water inlet pipe 25, and then flows into the inside of the water tank 34 from the water outlet pipe 28, which can prevent the temperature of the protective ring 29 from being too high. When the grinding wheel 20 grinds the edge of the silicon wafer 3, the high temperature will increase its brittleness, making it prone to breakage or edge collapse. At this time, the protective ring 29 abuts against the edge of the silicon wafer 3 to protect it and can also cool down the silicon wafer 3 to reduce the occurrence of breakage or edge collapse.

[0021] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer surface treatment device, comprising a base (1), a rotatable support plate (9) located above the base (1) for supporting a silicon wafer (3), and a collecting assembly located inside the base (1), characterized in that: Also includes: A grinding mechanism comprises a lifting component, a cutting fluid pipe (5), a gear ring (11) and a grinding wheel (20); a gear (18) is meshed on the inner side of the gear ring (11); the upper end surface of the gear (18) is connected to a driving component; the lower end surface of the gear (18) is rotatably connected to a second connecting rod (23); a slider (24) is rotatably mounted on the lower end surface of the second connecting rod (23); a fixed frame (12) is slidably mounted on the outer wall of the slider (24); when the lifting component drives the grinding wheel (20) to abut against the silicon wafer (3), the cutting fluid pipe (5) supplies cutting fluid, the driving component drives the gear (18) to rotate in the gear ring (11), the gear (18) drives the slider (24) to reciprocate in the fixed frame (12), and the slider (24) drives the grinding wheel (20) to move on the silicon wafer (3), thereby completing uniform grinding; The protection mechanism comprises an extrusion assembly, a cooling assembly and a protection ring (29); a retaining ring (30) is fixedly mounted on the outer wall of the protection ring (29); a plurality of tension springs (27) are evenly mounted on the outer wall of the retaining ring (30) along its circumference; a rotating block (26) is mounted on the side of the tension spring (27) away from the retaining ring (30); when the slider (24) reciprocates, the extrusion assembly squeezes the retaining ring (30) below the grinding wheel (20), and the retaining ring (30) with the protection ring (29) abuts against the outer wall of the silicon wafer (3) to prevent edge collapse; The extrusion assembly comprises an extrusion block (15) symmetrically mounted on the outer wall of a slider (24) and a spring (14) symmetrically mounted on the inner wall of a fixed frame (12); a slide bar (16) is mounted on the lower end surface of the spring (14); a conical wheel (17) is rotatably mounted on the lower end surface of the slide bar (16); when the slider (24) moves, the extrusion block (15) is driven to extrude the slide bar (16); the slide bar (16) drives the conical wheel (17) to descend; and the conical wheel (17) extrude a retaining ring (30).

2. The silicon wafer surface treatment equipment according to claim 1, characterized in that: The collecting assembly comprises a cutting fluid chamber (2) opened on a base (1), a filter plate (38) being slidably mounted on the inner wall of the cutting fluid chamber (2).

3. The silicon wafer surface treatment equipment according to claim 1, characterized in that: The lifting assembly comprises a support plate (4), the support plate (4) being fixedly mounted on the outer wall of the base (1), an electric telescopic rod (6) being mounted on the lower end surface of the support plate (4), and a support frame (7) being mounted on the lower end surface of the electric telescopic rod (6).

4. The silicon wafer surface treatment equipment according to claim 3, characterized in that: The driving assembly comprises a second servo motor (21), the upper end surface of the second servo motor (21) is mounted on a support frame (7), a first connecting rod (22) is fixedly mounted on an output shaft of the second servo motor (21), and an end of the first connecting rod (22) away from the second servo motor (21) is rotatably mounted on a gear (18).

5. The silicon wafer surface treatment equipment according to claim 3, characterized in that: The fixing frame (12) is fixedly connected to the support frame (7); a fixing ring (8) is fixedly mounted on the lower end surface of the support frame (7); and the lower end surface of the fixing ring (8) is fixedly connected to the gear ring (11).

6. The silicon wafer surface treatment equipment according to claim 1, characterized in that: A sliding groove (13) is provided on the outer wall of the fixed frame (12) corresponding to the sliding rod (16), and the inner wall of the sliding groove (13) is slidably connected to the sliding rod (16).

7. The silicon wafer surface treatment equipment according to claim 1, characterized in that: A first servo motor (19) is fixedly mounted on the lower end surface of the slider (24), and an output shaft of the first servo motor (19) is fixedly connected to the grinding wheel (20).

8. The silicon wafer surface treatment equipment according to claim 1, characterized in that: The cooling assembly comprises a water channel (31) opened on the outer wall of the protective ring (29), a block (32) being installed on the inner wall of the water channel (31), a water inlet pipe (25) and a water outlet pipe (28) being installed respectively on one side of the water channel (31) penetrating the block ring (30), and the water inlet pipe (25) and the water outlet pipe (28) being located on both sides of the block (32), a water tank (34) being installed on the side of the water inlet pipe (25) and the water outlet pipe (28) away from the water channel (31), and the water tank (34) being installed on the lower end surface of the support plate (9).

9. The silicon wafer surface treatment equipment according to claim 1, characterized in that: A third servo motor (37) is mounted on the upper end surface of the base (1), and an output shaft of the third servo motor (37) is fixedly connected to the support plate (9).

10. The silicon wafer surface treatment equipment according to claim 2, characterized in that: The outer wall of the support plate (9) is provided with a plurality of through holes (33); the lower end surface of the support plate (9) is abutted against an annular groove (35) corresponding to the through holes (33); the lower end surface of the annular groove (35) is evenly connected to a plurality of pipes (36) along its circumference; the lower end surface of the pipe (36) passes through the base (1) and is connected to the cutting fluid chamber (2).

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