Bisphenol A epoxy resin with high tracking resistance and preparation process thereof

Abstract

The invention provides bisphenol A epoxy resin with high tracking resistance and a preparation process thereof. The bisphenol A epoxy resin is prepared from the following components: bisphenol A epoxy resin, a curing agent, a piezoelectric material, an interface enhancer, a silane coupling agent, a dopamine interface enhancer and a nitrogen heterocyclic compound, the preparation process comprises the following steps: step 1, performing surface treatment on the piezoelectric material; 2, blending the matrix resin and the functional filler; step 3, molding and curing; wherein the piezoelectric material is subjected to surface modification through a silane coupling agent and dopamine, and the modification process comprises the following steps: diluting the silane coupling agent with ethanol until the mass concentration is 5%, and adjusting the pH value of the solution to 4.5-5.5; then respectively placing barium titanate and lead zirconate titanate in a silane coupling agent ethanol solution with the mass concentration of 5%, stirring for 30 minutes, standing for 24 hours, drying, and baking at 120 DEG C for 2 hours to obtain a surface modified filler; and in an alkaline environment, under the condition that the pH is 8.5-9.5, blending the surface modified filler with a dopamine solution, stirring for 12 hours, and then carrying out centrifugal separation and drying treatment to obtain the modified piezoelectric material.

Description

Technical Field

[0001] The invention relates to the technical field of polymer materials and preparation thereof, and in particular to a bisphenol A epoxy resin with high electrical tracking resistance and a preparation process thereof. Background Art

[0002] Bisphenol A epoxy resin is widely used in the fields of electronics, electrical engineering and construction due to its excellent mechanical properties, bonding properties and electrical insulation properties. However, with the trend of electrical equipment towards miniaturization and high power, traditional bisphenol A epoxy resin is prone to tracking degradation under high voltage environment, resulting in reduced insulation performance, which in turn affects the reliability of the equipment. Existing modification methods, such as adding inorganic fillers or fluorides to improve tracking resistance, but these methods have the problems of complex processing, high cost and great impact on the performance of the resin itself. Therefore, the development of a bisphenol A epoxy resin with high tracking resistance without compromising other properties has become a technical problem that needs to be solved urgently. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a bisphenol A epoxy resin with high anti-tracking performance and a preparation process thereof.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions: A bisphenol A epoxy resin with high anti-tracking performance comprises the following components: Bisphenol A epoxy resin: 100 parts by weight; Curing agent: 25 parts by weight; Piezoelectric material: 10-15 parts by weight of barium titanate, 5-10 parts by weight of lead zirconate titanate; Interface enhancer: 1-3 parts by weight of silane coupling agent, 1 part by weight of dopamine interface enhancer; The piezoelectric material is surface-modified by a silane coupling agent and dopamine, and the modification process comprises: diluting the silane coupling agent with ethanol to a mass concentration of 5%, and adjusting the solution pH to 4.5-5.5; then placing barium titanate and lead zirconate titanate in a silane coupling agent ethanol solution with a mass concentration of 5%, respectively, stirring for 30 minutes, standing for 24 hours and then drying, and baking at 120°C for 2 hours to obtain a surface-modified filler; in an alkaline environment: pH=8.5-9.5, the surface-modified filler is blended with a dopamine solution, stirred for 12 hours, centrifuged, and dried to obtain a modified piezoelectric material.

[0005] Furthermore, the particle size of the barium titanate is 200-500 nm, and the particle size of the lead zirconate titanate is 300-800 nm.

[0006] Furthermore, the silane coupling agent is KH550.

[0007] Furthermore, it also includes 5-10 parts by weight of a nitrogen-containing heterocyclic compound, wherein the nitrogen-containing heterocyclic compound is selected from one or more of the following: Benzimidazole compounds; Triazine compounds.

[0008] Furthermore, the nitrogen-containing heterocyclic compound is polybenzimidazole or melamine formaldehyde resin.

[0009] A preparation process of a bisphenol A epoxy resin with high electrical tracking resistance comprises the following steps: Step 1: Surface treatment of piezoelectric materials: Barium titanate and lead zirconate titanate were placed in a 5% mass concentration silane coupling agent ethanol solution, stirred for 30 minutes at a pH of 4.5-5.5, allowed to stand for 24 hours, dried, and baked at 120°C for 2 hours; In an alkaline environment (pH=8.5-9.5), the surface modified filler is mixed with a dopamine solution, stirred for 12 hours, centrifuged, and dried to obtain a modified piezoelectric material.

[0010] Step 2: Blending of base resin and functional filler: Mix the bisphenol A epoxy resin and the modified piezoelectric material at 80-90° C. and stir for 1 hour until they are uniform; Add curing agent to the above mixture and continue to stir evenly; Step 3: Molding and curing: The above mixture was injected into a mold and maintained at 100°C for 2 hours for preliminary curing; The temperature was kept at 150° C. for 4 hours and then cooled to room temperature for demolding to obtain an epoxy resin material with high anti-tracking performance.

[0011] Furthermore, in the step of blending the matrix resin and the functional filler, the nitrogen-containing heterocyclic compound is introduced into the matrix resin in a dissolved or ground form, and then blended with the modified piezoelectric material after being uniformly dispersed.

[0012] Furthermore, the nitrogen-containing heterocyclic compound is a polybenzimidazole monomer, which is dissolved in N,N-dimethylformamide and then blended with the base resin.

[0013] Furthermore, it also includes plasma surface treatment or spraying of anti-aging coating after the material is formed to further improve the long-term stability of the material in a high-pressure environment.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The present application provides a bisphenol A epoxy resin with high anti-tracking performance and its preparation process. Through the synergistic effect of intelligent electric field response materials and molecular interface design, it not only improves the anti-tracking performance of epoxy resin, but also optimizes other key properties, filling the technical gap in the application of piezoelectric materials in anti-tracking. The material is suitable for high-voltage insulation materials, electrical equipment housings, electronic packaging and other fields, providing a new solution for high-performance electrical materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 The figure is a schematic diagram of the preparation process of the bisphenol A epoxy resin with high electrical tracking resistance of the present invention. DETAILED DESCRIPTION

[0017] The present invention is further described in detail below with reference to the accompanying drawings.

[0018] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be used for other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0019] The present invention provides a bisphenol A epoxy resin with high electrical tracking resistance, comprising the following components: Base resin: bisphenol A epoxy resin: 100 parts by weight; Curing agent: 25 parts by weight; Piezoelectric material: 10-15 parts by weight of barium titanate, 5-10 parts by weight of lead zirconate titanate; Interface enhancer: 1-3 parts by weight of silane coupling agent, 1 part by weight of dopamine interface enhancer; Nitrogen heterocyclic compound: 5-10 parts by weight.

[0020] The piezoelectric material is surface-modified by a silane coupling agent and dopamine, and the modification process comprises: diluting the silane coupling agent with ethanol to a mass concentration of 5%, and adjusting the solution pH to 4.5-5.5; then placing barium titanate and lead zirconate titanate in a silane coupling agent ethanol solution with a mass concentration of 5%, respectively, stirring for 30 minutes, standing for 24 hours and then drying, and baking at 120°C for 2 hours to obtain a surface-modified filler; in an alkaline environment: pH=8.5-9.5, the surface-modified filler is blended with a dopamine solution, stirred for 12 hours, centrifuged, and dried to obtain a modified piezoelectric material.

[0021] Among them, the curing agent is an aromatic amine curing agent (such as 4,4'-diaminodiphenylmethane, referred to as DDM).

[0022] The particle size of barium titanate is 200-500nm, and the particle size of lead zirconate titanate is 300-800nm.

[0023] Wherein, the silane coupling agent is KH550.

[0024] The nitrogen-containing heterocyclic compound is selected from one or more of the following: benzimidazole compounds (such as polybenzimidazole PBI, or its monomer 4,5-diaminobenzimidazole), triazine compounds (such as melamine or its derivatives, modified melamine formaldehyde resin).

[0025] Please refer to Figure 1. The present invention provides a preparation process of bisphenol A epoxy resin with high electrical tracking resistance, comprising the following steps: Step 1: Surface treatment of piezoelectric materials: Barium titanate and lead zirconate titanate were placed in a 5% mass concentration silane coupling agent ethanol solution, stirred for 30 minutes at a pH of 4.5-5.5, allowed to stand for 24 hours, dried, and baked at 120°C for 2 hours; In an alkaline environment (pH=8.5-9.5), the surface modified filler is mixed with a dopamine solution, stirred for 12 hours, centrifuged, and dried to obtain a modified piezoelectric material.

[0026] Step 2: Blending of base resin and functional filler: Mix the bisphenol A epoxy resin and the modified piezoelectric material at 80-90° C. and stir for 1 hour until they are uniform; Add curing agent to the above mixture and continue stirring until evenly mixed.

[0027] Step 3: Molding and curing: The above mixture was injected into a mold and maintained at 100°C for 2 hours for preliminary curing; The temperature was kept at 150° C. for 4 hours and then cooled to room temperature for demolding to obtain an epoxy resin material with high anti-tracking performance.

[0028] Step 4: Post-processing: After the material is formed, plasma is used for surface treatment or anti-aging coating is sprayed to further improve the long-term stability of the material in a high-pressure environment. Example

[0029] 1. Prepare raw materials: 100 parts by weight of bisphenol A epoxy resin (epoxy value 0.48 mol / 100g), 25 parts by weight of 4,4'-diaminodiphenylmethane, 10 parts by weight of barium titanate, 10 parts by weight of lead zirconate titanate, 5 parts by weight of polybenzimidazole PBI, 1 part by weight of KH550, and 1 part by weight of dopamine.

[0030] 2. Preparation of bisphenol A epoxy resin with high electrical tracking resistance Step 1: Surface treatment of piezoelectric materials: Barium titanate and lead zirconate titanate were placed in a 5% mass concentration KH550 ethanol solution, stirred for 30 minutes at a pH of 4.5, allowed to stand for 24 hours, dried, and baked at 120°C for 2 hours to obtain a surface-modified filler. In an alkaline environment (pH=8.5), the surface modified filler was mixed with a dopamine solution, stirred for 12 hours, centrifuged and dried to obtain a modified piezoelectric material.

[0031] Step 2: Blending of base resin and functional filler: The ground form of polybenzimidazole PBI is blended with the base resin; The bisphenol A epoxy resin and the modified piezoelectric material were mixed and stirred at 80° C. for 1 hour until they were uniform; Add 4,4'-diaminodiphenylmethane to the above mixture and continue stirring until uniform.

[0032] Step 3: Molding and curing: The above mixture was injected into a mold and maintained at 100°C for 2 hours for preliminary curing; The temperature was kept at 150° C. for 4 hours and then cooled to room temperature for demolding to obtain an epoxy resin material with high anti-tracking performance.

[0033] Step 4: Post-processing: After the material is formed, the surface is sprayed with plasma. Example

[0034] 1. Prepare raw materials: 100 parts by weight of bisphenol A epoxy resin (epoxy value 0.48 mol / 100g), 25 parts by weight of 4,4'-diaminodiphenylmethane, 15 parts by weight of barium titanate, 5 parts by weight of lead zirconate titanate, 5 parts by weight of polybenzimidazole PBI, 1 part by weight of KH550, and 1 part by weight of dopamine.

[0035] 2. Preparation of bisphenol A epoxy resin with high electrical tracking resistance Step 1: Surface treatment of piezoelectric materials: Barium titanate and lead zirconate titanate were placed in a 5% mass concentration KH550 ethanol solution, stirred for 30 minutes at a pH of 4.5, allowed to stand for 24 hours, dried, and baked at 120°C for 2 hours to obtain a surface-modified filler. In an alkaline environment (pH=8.5), the surface modified filler was mixed with a dopamine solution, stirred for 12 hours, centrifuged and dried to obtain a modified piezoelectric material.

[0036] Step 2: Blending of base resin and functional filler: The ground form of polybenzimidazole PBI is blended with the base resin; The bisphenol A epoxy resin and the modified piezoelectric material were mixed and stirred at 80° C. for 1 hour until they were uniform; Add 4,4'-diaminodiphenylmethane to the above mixture and continue stirring until uniform.

[0037] Step 3: Molding and curing: The above mixture was injected into a mold and maintained at 100°C for 2 hours for preliminary curing; The temperature was kept at 150° C. for 4 hours and then cooled to room temperature for demolding to obtain an epoxy resin material with high anti-tracking performance.

[0038] Step 4: Post-processing: After the material is formed, the surface is sprayed with plasma. Example

[0039] 1. Prepare raw materials: 100 parts by weight of bisphenol A epoxy resin (epoxy value 0.48 mol / 100g), 25 parts by weight of 4,4'-diaminodiphenylmethane, 10 parts by weight of barium titanate, 10 parts by weight of lead zirconate titanate, 5 parts by weight of polybenzimidazole PBI, 1 part by weight of KH550, and 1 part by weight of dopamine.

[0040] 2. Preparation of bisphenol A epoxy resin with high electrical tracking resistance Step 1: Surface treatment of piezoelectric materials: Barium titanate and lead zirconate titanate were placed in a 5% mass concentration KH550 ethanol solution, stirred for 30 minutes at a pH of 5.5, allowed to stand for 24 hours, dried, and baked at 120°C for 2 hours to obtain a surface-modified filler. In an alkaline environment (pH=9.5), the surface modified filler was mixed with a dopamine solution, stirred for 12 hours, centrifuged and dried to obtain a modified piezoelectric material.

[0041] Step 2: Blending of base resin and functional filler: The ground form of polybenzimidazole PBI is blended with the base resin; The bisphenol A epoxy resin and the modified piezoelectric material were mixed and stirred at 80° C. for 1 hour until they were uniform; Add 4,4'-diaminodiphenylmethane to the above mixture and continue stirring until uniform.

[0042] Step 3: Molding and curing: The above mixture was injected into a mold and maintained at 100°C for 2 hours for preliminary curing; The temperature was kept at 150° C. for 4 hours and then cooled to room temperature for demolding to obtain an epoxy resin material with high anti-tracking performance.

[0043] Step 4: Post-processing: After the material is formed, plasma is used for surface spraying. Example

[0044] 1. Prepare raw materials: 100 parts by weight of bisphenol A epoxy resin (epoxy value 0.54 mol / 100g), 25 parts by weight of 4,4'-diaminodiphenylmethane, 10 parts by weight of barium titanate, 5 parts by weight of lead zirconate titanate, 5 parts by weight of polybenzimidazole PBI, 1 part by weight of KH550, and 1 part by weight of dopamine.

[0045] 2. Preparation of bisphenol A epoxy resin with high electrical tracking resistance Step 1: Surface treatment of piezoelectric materials: Barium titanate and lead zirconate titanate were placed in a 5% mass concentration KH550 ethanol solution, stirred for 30 minutes at a pH of 4.5, allowed to stand for 24 hours, dried, and baked at 120°C for 2 hours to obtain a surface-modified filler. In an alkaline environment (pH=8.5), the surface modified filler was mixed with a dopamine solution, stirred for 12 hours, centrifuged and dried to obtain a modified piezoelectric material.

[0046] Step 2: Blending of base resin and functional filler: The ground form of polybenzimidazole PBI is blended with the base resin; The bisphenol A epoxy resin and the modified piezoelectric material were mixed and stirred at 80° C. for 1 hour until they were uniform; Add 4,4'-diaminodiphenylmethane to the above mixture and continue stirring until uniform.

[0047] Step 3: Molding and curing: The above mixture was injected into a mold and maintained at 100°C for 2 hours for preliminary curing; The temperature was kept at 150° C. for 4 hours and then cooled to room temperature for demolding to obtain an epoxy resin material with high anti-tracking performance.

[0048] Step 4: Post-processing: After the material is formed, the surface is sprayed with plasma. Example

[0049] 1. Prepare raw materials: 100 parts by weight of bisphenol A epoxy resin (epoxy value 0.48 mol / 100g), 25 parts by weight of 4,4'-diaminodiphenylmethane, 10 parts by weight of barium titanate, 5 parts by weight of lead zirconate titanate, 5 parts by weight of polybenzimidazole PBI, 1 part by weight of KH550, and 1 part by weight of dopamine.

[0050] 2. Preparation of bisphenol A epoxy resin with high electrical tracking resistance Step 1: Surface treatment of piezoelectric materials: Barium titanate and lead zirconate titanate were placed in a 5% mass concentration KH550 ethanol solution, stirred for 30 minutes at a pH of 4.5, allowed to stand for 24 hours, dried, and baked at 120°C for 2 hours to obtain a surface-modified filler. In an alkaline environment (pH=8.5), the surface modified filler was mixed with a dopamine solution, stirred for 12 hours, centrifuged and dried to obtain a modified piezoelectric material.

[0051] Step 2: Blending of base resin and functional filler: The ground form of polybenzimidazole PBI is blended with the base resin; The bisphenol A epoxy resin and the modified piezoelectric material were mixed and stirred at 80° C. for 1 hour until they were uniform; Add 4,4'-diaminodiphenylmethane to the above mixture and continue stirring until uniform.

[0052] Step 3: Molding and curing: The above mixture was injected into a mold and maintained at 100°C for 2 hours for preliminary curing; The temperature was kept at 150° C. for 4 hours and then cooled to room temperature for demolding to obtain an epoxy resin material with high anti-tracking performance.

[0053] Step 4: Post-processing: After the material is formed, the surface is sprayed with plasma. Example

[0054] 1. Prepare raw materials: 100 parts by weight of bisphenol A epoxy resin (epoxy value 0.48 mol / 100g), 25 parts by weight of 4,4'-diaminodiphenylmethane, 10 parts by weight of barium titanate, 5 parts by weight of lead zirconate titanate, 5 parts by weight of polybenzimidazole PBI, 1 part by weight of KH550, and 1 part by weight of dopamine.

[0055] 2. Preparation of bisphenol A epoxy resin with high electrical tracking resistance Step 1: Surface treatment of piezoelectric materials: Barium titanate and lead zirconate titanate were placed in a 5% mass concentration KH550 ethanol solution, stirred for 30 minutes at a pH of 4.5, allowed to stand for 24 hours, dried, and baked at 120°C for 2 hours to obtain a surface-modified filler. In an alkaline environment (pH=8.5), the surface modified filler was mixed with a dopamine solution, stirred for 12 hours, centrifuged and dried to obtain a modified piezoelectric material.

[0056] Step 2: Blending of base resin and functional filler: The polybenzimidazole PBI dissolved form is blended with the base resin; The bisphenol A epoxy resin and the modified piezoelectric material were mixed and stirred at 80° C. for 1 hour until they were uniform; Add 4,4'-diaminodiphenylmethane to the above mixture and continue stirring until uniform.

[0057] Step 3: Molding and curing: The above mixture was injected into a mold and maintained at 100°C for 2 hours for preliminary curing; The temperature was kept at 150° C. for 4 hours and then cooled to room temperature for demolding to obtain an epoxy resin material with high anti-tracking performance.

[0058] Step 4: Post-processing: After the material is formed, the surface is sprayed with plasma. Example

[0059] 1. Prepare raw materials: 100 parts by weight of bisphenol A epoxy resin (epoxy value 0.48 mol / 100g), 25 parts by weight of 4,4'-diaminodiphenylmethane, 10 parts by weight of barium titanate, 5 parts by weight of lead zirconate titanate, 5 parts by weight of polybenzimidazole PBI, 3 parts by weight of KH550, and 1 part by weight of dopamine.

[0060] 2. Preparation of bisphenol A epoxy resin with high electrical tracking resistance Step 1: Surface treatment of piezoelectric materials: Barium titanate and lead zirconate titanate were placed in a 5% mass concentration KH550 ethanol solution, stirred for 30 minutes at a pH of 4.5, allowed to stand for 24 hours, dried, and baked at 120°C for 2 hours to obtain a surface-modified filler. In an alkaline environment (pH=8.5), the surface modified filler was mixed with a dopamine solution, stirred for 12 hours, centrifuged and dried to obtain a modified piezoelectric material.

[0061] Step 2: Blending of base resin and functional filler: The polybenzimidazole PBI dissolved form is blended with the base resin; The bisphenol A epoxy resin and the modified piezoelectric material were mixed and stirred at 80° C. for 1 hour until they were uniform; Add 4,4'-diaminodiphenylmethane to the above mixture and continue stirring until uniform.

[0062] Step 3: Molding and curing: The above mixture was injected into a mold and maintained at 100°C for 2 hours for preliminary curing; The temperature was kept at 150° C. for 4 hours and then cooled to room temperature for demolding to obtain an epoxy resin material with high anti-tracking performance.

[0063] Step 4: Post-processing: After the material is formed, the surface is sprayed with plasma. Example

[0064] 1. Prepare raw materials: 100 parts by weight of bisphenol A epoxy resin (epoxy value 0.48 mol / 100g), 25 parts by weight of 4,4'-diaminodiphenylmethane, 10 parts by weight of barium titanate, 5 parts by weight of lead zirconate titanate, 5 parts by weight of polybenzimidazole PBI, 3 parts by weight of KH550, and 1 part by weight of dopamine.

[0065] 2. Preparation of bisphenol A epoxy resin with high electrical tracking resistance Step 1: Surface treatment of piezoelectric materials: Barium titanate and lead zirconate titanate were placed in a 5% mass concentration KH550 ethanol solution, stirred for 30 minutes at a pH of 4.5, allowed to stand for 24 hours, dried, and baked at 120°C for 2 hours to obtain a surface-modified filler. In an alkaline environment (pH=8.5), the surface modified filler was mixed with a dopamine solution, stirred for 12 hours, centrifuged and dried to obtain a modified piezoelectric material.

[0066] Step 2: Blending of base resin and functional filler: The bisphenol A epoxy resin and the modified piezoelectric material were mixed and stirred at 80° C. for 1 hour until they were uniform; Add 4,4'-diaminodiphenylmethane to the above mixture and continue stirring until uniform.

[0067] Step 3: Molding and curing: The above mixture was injected into a mold and maintained at 100°C for 2 hours for preliminary curing; The temperature was kept at 150° C. for 4 hours and then cooled to room temperature for demolding to obtain an epoxy resin material with high anti-tracking performance.

[0068] Step 4: Post-processing: After the material is formed, the surface is sprayed with plasma.

[0069] In the implementation of this application, Examples 1 and 2 used different proportions of barium titanate and lead zirconate titanate as piezoelectric materials, and conducted a tracking resistance test on the bisphenol A epoxy resin with high tracking resistance. The piezoelectric material will be polarized due to mechanical stress under high voltage conditions, and the external electric field strength will be weakened through the response of the internal electric field, thereby slowing down the formation of tracks; the piezoelectric filler can absorb part of the discharge energy through stress charge conversion, reduce local heat accumulation, and avoid the arc effect to aggravate the development of tracks. In the implementation of the present application, Example 1 and Example 3 adopted surface treatment conditions of piezoelectric materials with different pH values. The pH value will affect the reverse rate in the preparation process, the observation of the reaction process and the analysis of the by-products. The faster the reaction speed and the less the by-products, the pH value of the present application has a better effect.

[0070] In the embodiments of the present application, Embodiment 1 and Embodiment 4 use bisphenol A epoxy resin with different epoxy values ​​as the base resin, which has the advantages of fast curing speed and high crosslinking density after curing, and will not have high viscosity and poor processing performance.

[0071] In the embodiments of the present application, Embodiment 1 and Embodiment 5 adopt different temperatures for the filler blending reaction. The reaction temperature has a good reaction effect, will not increase the viscosity of the bisphenol A epoxy resin, and will not affect the thermal stability of the modified piezoelectric material.

[0072] In the embodiments of the present application, Embodiment 1 and Embodiment 6 adopt different methods to mix nitrogen heterocyclic compounds into bisphenol A epoxy resin. The nitrogen heterocyclic compounds, by utilizing the stability of their molecular structure, high polarity and high voltage resistance, form a synergistic effect with the piezoelectric material to jointly improve the electrical tracking resistance of the bisphenol A epoxy resin. The above-mentioned mixing methods all achieve good mixing effects, allowing the nitrogen heterocyclic compounds to play their due effects.

[0073] In the examples of the present application, Example 1 and Example 7 use different contents of silane coupling agent, and the silane coupling agent at this content can achieve a rapid hydrolysis reaction without affecting the tensile shear strength of the bisphenol A epoxy resin.

[0074] In the embodiments of the present application, Embodiment 1 and Embodiment 8 adopt the choice of whether to add nitrogen-containing heterocyclic compounds, preferably adding nitrogen-containing heterocyclic compounds, utilizing the stability of their molecular structure, high polarity and high-voltage resistance to form a synergistic effect with piezoelectric materials, and jointly improving the electrical tracking resistance of bisphenol A epoxy resin.

[0075] In this application, the bisphenol A epoxy resin with high tracking resistance prepared by the above-mentioned Examples 1 to 8 was tested for its performance: 1. Tracking resistance test: The IEC60587 standard is used to test the tracking initiation voltage and tracking extension length.

[0076] Target: Increase the starting voltage by more than 30% and reduce the trace extension length by more than 40%.

[0077] 2. Mechanical properties test: Tensile strength, impact toughness, etc. are tested according to GB / T2567.

[0078] Target: Keep the original performance fluctuation within ±5%.

[0079] 3. Thermal stability test: Thermogravimetric analysis (TGA) was used to evaluate the thermal decomposition temperature of the materials.

[0080] Target: Increase the decomposition temperature by more than 10°C.

[0081] Further analysis of the cooperative mechanism of the bisphenol A epoxy resin prepared in this application with high electrical tracking resistance Electric field distribution optimization and energy absorption effect: Function of piezoelectric materials: Under high voltage conditions, piezoelectric materials produce polarization response through mechanical stress, weakening the intensity of the external electric field.

[0082] High polarity characteristics of nitrogen-containing heterocyclic compounds: The high dielectric constant and polar molecular structure of nitrogen-containing heterocyclic compounds can improve the uniform distribution of charge and reduce the risk of partial discharge.

[0083] Synergistic effect: The two work together to significantly improve the stability of the material under strong electric fields.

[0084] Enhanced thermal stability: The molecular structure of nitrogen-containing heterocyclic compounds (such as benzimidazole) has a high decomposition temperature (>400°C), and can stably exist in the local high temperature environment caused by discharge, inhibiting the thermal decomposition of the material.

[0085] The mechanical stress energy absorption effect of the piezoelectric material further reduces local heat accumulation.

[0086] Interface enhancements: The molecular structure of dopamine and nitrogen-containing heterocyclic compounds further strengthens the interfacial bonding between the filler and the epoxy matrix through hydrogen bonding or π-π interaction, thereby improving the mechanical and electrical properties of the overall composite material.

[0087] Other performance optimizations Mechanical wear resistance: The hardness and toughness of nitrogen-containing heterocyclic compounds complement those of epoxy resins, improving wear resistance.

[0088] Long-term stability: The molecular stability of nitrogen-containing heterocyclic compounds can maintain the high performance of the material under long-term electric field exposure.

[0089] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A bisphenol A epoxy resin with high electrical tracking resistance, characterized in that: Includes the following components: Bisphenol A epoxy resin: 100 parts by weight; Curing agent: 25 parts by weight; Piezoelectric material: 10-15 parts by weight of barium titanate, 5-10 parts by weight of lead zirconate titanate; Interface enhancer: 1-3 parts by weight of silane coupling agent, 1 part by weight of dopamine interface enhancer; The piezoelectric material is surface-modified by a silane coupling agent and dopamine, and the modification process comprises: diluting the silane coupling agent with ethanol to a mass concentration of 5%, and adjusting the solution pH to 4.5-5.5; then placing barium titanate and lead zirconate titanate in a silane coupling agent ethanol solution with a mass concentration of 5%, respectively, stirring for 30 minutes, standing for 24 hours and then drying, and baking at 120°C for 2 hours to obtain a surface-modified filler; in an alkaline environment: pH=8.5-9.5, the surface-modified filler is blended with a dopamine solution, stirred for 12 hours, centrifuged, and dried to obtain a modified piezoelectric material.

2. A bisphenol A epoxy resin with high tracking resistance according to claim 1, characterized in that: The particle size of the barium titanate is 200-500nm, and the particle size of the lead zirconate titanate is 300-800nm.

3. A bisphenol A epoxy resin with high tracking resistance according to claim 1, characterized in that: The silane coupling agent is KH550.

4. A bisphenol A epoxy resin with high electrical tracking resistance according to claim 1, characterized in that: It also includes 5-10 parts by weight of a nitrogen-containing heterocyclic compound, wherein the nitrogen-containing heterocyclic compound is selected from one or more of the following: Benzimidazole compounds; Triazine compounds.

5. A bisphenol A epoxy resin with high tracking resistance according to claim 4, characterized in that: The nitrogen-containing heterocyclic compound is polybenzimidazole or melamine formaldehyde resin.

6. A process for preparing the bisphenol A epoxy resin with high electrical tracking resistance according to claim 1, characterized in that: The following steps are involved: Step 1: Surface treatment of piezoelectric materials: Barium titanate and lead zirconate titanate were placed in a 5% mass concentration silane coupling agent ethanol solution, stirred for 30 minutes at a pH of 4.5-5.5, allowed to stand for 24 hours, dried, and baked at 120°C for 2 hours; In an alkaline environment (pH=8.5-9.5), the surface modified filler is mixed with a dopamine solution, stirred for 12 hours, centrifuged, and dried to obtain a modified piezoelectric material; Step 2: Blending of base resin and functional filler: Mix the bisphenol A epoxy resin and the modified piezoelectric material at 80-90° C. and stir for 1 hour until they are uniform; Add curing agent to the above mixture and continue to stir evenly; Step 3: Molding and curing: The above mixture was injected into a mold and maintained at 100°C for 2 hours for preliminary curing; The temperature was kept at 150° C. for 4 hours and then cooled to room temperature for demolding to obtain an epoxy resin material with high anti-tracking performance.

7. The process for preparing a bisphenol A epoxy resin with high electrical tracking resistance according to claim 6, characterized in that: In the step of blending the matrix resin and the functional filler, the nitrogen-containing heterocyclic compound is introduced into the matrix resin in a dissolved or ground form, and then blended with the modified piezoelectric material after being uniformly dispersed.

8. The process for preparing a bisphenol A epoxy resin with high tracking resistance according to claim 7, characterized in that: The nitrogen-containing heterocyclic compound is a polybenzimidazole monomer, which is dissolved in N,N-dimethylformamide and then blended with the base resin.

9. The process for preparing a bisphenol A epoxy resin with high tracking resistance according to claim 8, characterized in that: It also includes plasma surface treatment or spraying of anti-aging coating after the material is formed to further improve the long-term stability of the material in a high-pressure environment.

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