Defect positioning method based on plane X-ray detection and computer equipment

Abstract

The invention discloses a defect positioning method based on plane X-ray detection and computer equipment, and the method comprises the following steps: a to-be-detected device is fixed on the plane X-ray detection equipment, the length, the width and the height of the to-be-detected device respectively correspond to the X axis, the Y axis and the Z axis of a coordinate system, the to-be-detected device is subjected to primary detection imaging by using plane X-rays, and the to-be-detected device is subjected to secondary detection imaging; acquiring primary position coordinates of the defect in the X-axis direction and the Y-axis direction; tilting one side of the long edge of the device by a certain angle, performing secondary detection imaging on the to-be-detected device by utilizing plane X-rays, and obtaining secondary position coordinates of the defect in the X-axis direction and the Y-axis direction; and according to the primary position coordinates and the secondary position coordinates in the Y-axis direction and the tilting angle of the device, calculating the coordinates of the defect in the Z-axis direction. According to the invention, the internal defect of the to-be-tested device can be accurately positioned in a three-dimensional manner by adopting plane X-ray detection, and three-dimensional defect positioning with higher test speed and lower economic cost can be realized.

Description

Technical Field

[0001] The present invention belongs to the technical field of three-dimensional defect positioning, and in particular relates to a defect positioning method and computer equipment based on planar X-ray detection. Background Art

[0002] As the functions and performance of electronic components continue to improve, the design structure of electronic components has become increasingly complex and the packaging density has continued to increase, posing huge challenges to the detection and location of internal defects.

[0003] At present, the use of planar X-rays to detect internal defects in electronic components can only locate defects in the X and Y plane directions of the device. For flat packaging structure devices such as integrated circuits, the specific location of the defect cannot be obtained in the Z direction. Three-dimensional X-ray defect detection technology has the advantages of high precision and simultaneous positioning in the X / Y / Z directions, but its equipment is expensive and the technical operation is difficult, resulting in a long single test time and high economic cost. Therefore, this technology is difficult to be widely popularized in the market. Therefore, the industry urgently needs a three-dimensional defect positioning technology with faster testing speed and lower economic cost to meet the needs of rapid detection of internal defects in electronic components. Summary of the invention

[0004] The purpose of the present invention is to provide a defect location method, computer equipment, computer readable storage medium and computer program product based on planar X-ray detection, which can accurately locate the internal defects of the device under test in three dimensions by using planar X-ray detection, and can achieve three-dimensional defect location with faster testing speed and lower economic cost.

[0005] In order to achieve the above object, one aspect of the present invention provides a defect location method based on planar X-ray detection, comprising: Step S1, fix the device under test on a plane X-ray detection device, the length, width and height of the device under test correspond to the X, Y and Z axes of the coordinate system respectively, use plane X-rays to perform a detection imaging on the device under test, and obtain the primary position coordinates (X0, Y0) of the defect in the X and Y axis directions; Step S2, tilting one side of the long side of the device by a certain angle α, performing secondary detection imaging on the device to be tested using plane X-rays, and obtaining secondary position coordinates (X0, Y1) of the defect in the X and Y axis directions; Step S3, according to the primary position coordinate Y0 and the secondary position coordinate Y1 in the Y-axis direction and the device tilting angle α, the coordinate Z0 of the defect in the Z-axis direction is calculated: Z0=Y0 / tanα-Y1 / sinα.

[0006] Preferably, the device under test is a flat package structure device.

[0007] Preferably, the device under test is an integrated circuit.

[0008] Another aspect of the present invention provides a computer device, including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the steps of the above method.

[0009] Another aspect of the present invention provides a computer-readable storage medium having a computer program stored thereon, which implements the steps of the above method when executed by a processor.

[0010] Another aspect of the present invention provides a computer program product, comprising a computer program, which implements the steps of the above method when executed by a processor.

[0011] According to the defect localization method based on planar X-ray detection, computer equipment, computer-readable storage medium and computer program product of the above aspects of the present invention, planar X-ray detection can be used to accurately locate the internal defects of the device under test in three dimensions, thereby achieving three-dimensional defect localization with faster testing speed and lower economic cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings used in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work: Figure 1 is a flow chart of a defect location method based on planar X-ray detection according to an embodiment of the present invention; Figure 2 is a schematic diagram of a first planar X-ray detection process of an embodiment of the present invention; Figure 3 is a schematic diagram of the first planar X-ray detection imaging of an embodiment of the present invention; Figure 4 is a schematic diagram of a secondary planar X-ray detection process according to an embodiment of the present invention; Figure 5 is a schematic diagram of secondary planar X-ray detection imaging according to an embodiment of the present invention; Figure 6 is a schematic diagram of calculation of defect Z-direction positioning according to an embodiment of the present invention; Figure 7 It is a structural diagram of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0013] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0014] An embodiment of the present invention provides a defect location method based on planar X-ray detection, which is used to locate defects in flat packaging structure devices such as integrated circuits. Figure 1 As shown, the defect location method based on planar X-ray detection in the embodiment of the present invention includes steps S1 to S3.

[0015] In step S1, a plane X-ray is used to perform a detection imaging on the device to be tested to locate the defect in the X and Y directions.

[0016] Specifically, the device to be tested is fixed in the sample placement area of ​​the test platform of the planar X-ray detection equipment, and the device is detected and imaged from top to bottom using planar X-rays, such as Figure 2 The device under test is a rectangular device, with length, width and height denoted as L0, D0 and H0 respectively, which are Figure 2 The X, Y, and Z axes of the coordinate system shown correspond.

[0017] like Figure 2 As shown, plane X-rays are used for defect detection, and the acquired X-ray images are as follows Figure 3 As shown, the (X0, Y0) coordinates of the defect can be obtained.

[0018] In step S2, the device is lifted up on one side to a certain angle, and a secondary detection is performed using a plane X-ray.

[0019] The device under test is raised on one side to a certain angle, and a secondary plane X-ray detection is performed, such as Figure 4 Here, one side of the long side L0 of the device to be tested is raised, and the other long side remains in the original position in contact with the test platform. The angle of the lift is recorded as α. α does not exceed 90°.

[0020] like Figure 4 The secondary plane X-ray detection is performed as shown, and the secondary X-ray imaging obtained is as follows Figure 5 shown.

[0021] During the test, the long side L0 of the device to be tested is raised. Figure 4 and Figure 3In comparison, the length of the device imaging remains unchanged at L0, the width changes from D0 to cosαD0, the coordinate of the defect imaging in the X-axis direction remains unchanged at X0, and the coordinate in the Y-axis direction changes from Y0 to Y1 (Y1<Y0).

[0022] In step S3, the two detection images are compared, the Z0 coordinate of the defect is analyzed and calculated, and the Z direction positioning is performed.

[0023] By comparing the offset of the X and Y positions of the defects in the two detection images and the device tilt angle data, the Z direction position of the internal defects of the device can be calculated and located. The specific derivation process is as follows: It is known that the first plane X-ray detection was used to obtain the defect (X0, Y0) coordinates; it is known that the second plane X-ray detection was used to obtain the defect (X0, Y1) coordinates; it is known that the angle of the device tilting during the first and second detection processes is recorded as α. Then the plane example calculation for Z-direction positioning is as follows Figure 6 shown.

[0024] from Figure 6 As can be seen in the figure, AC and EB are auxiliary lines perpendicular to the X-axis and the bottom of the device, respectively, and OD=Y0, OA=Y1 can be obtained.

[0025] According to the trigonometric relationship: Find OC=OA / cosα=Y1 / cosα, CD=OD-OC=Y0-Y1 / cosα, Z0=ED=CD / tanα=(Y0-Y1 / cosα) / tanα=Y0 / tanα-Y1 / sinα.

[0026] Taking the internal defect detection of a flat package structure device as an example, the overall size of the device is length L0=4cm, width D0=3cm, height H0=0.25cm. Defect detection is performed according to the method of the embodiment of the present invention: The first planar X-ray detection obtains the defect position (X0, Y0), where X0=2, Y0=1.

[0027] One side of the long side L0 of the device to be tested is raised, and the other long side remains in the original position in contact with the test platform. The angle of the lift is recorded as 30°.

[0028] The second planar X-ray detection obtains the defect position (X0, Y1), where X0=2, Y1=0.2.

[0029] Substituting the relevant parameters, we can calculate that: Z0=Y0 / tanα-Y1 / sinα≈1.33cm, so the internal defect position is (X0=2cm, Y0=1cm, Z0=0.132cm).

[0030] According to the defect positioning method based on planar X-ray detection in the embodiment of the present invention, planar X-rays are used to perform the first detection on the device to be tested in a fixed position to realize the positioning of the internal defects of the device in the X and Y directions, and then the device is lifted up to a certain angle on one side, and then the device to be tested is secondary detected by planar X-rays. The position of the internal defect in the device in the Z direction is located by combining the offset of the X and Y positions of the defects in the detection image and the device tilting angle data, which can solve the problems that traditional planar X-ray detection is difficult to achieve three-dimensional positioning of internal defects of electronic components, or the three-dimensional X-ray defect detection technology has a long testing time and high economic cost. The method of the embodiment of the present invention combines testing and algorithms with each other, and the internal defects of the device to be tested can be accurately located in three dimensions by planar X-ray detection, providing the industry with a three-dimensional defect positioning solution with faster testing speed and lower economic cost. Therefore, the present invention will have good engineering application value and huge economic and social benefits.

[0031] An embodiment of the present invention further provides a computer device, which may be a server, and its internal structure diagram may be as shown in FIG. Figure 7 As shown. The computer device includes a processor, a memory and a network interface connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store operating parameter data of each framework. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, the steps of the method of the embodiment of the present invention are implemented.

[0032] Those skilled in the art will understand that Figure 7 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0033] An embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the method of the embodiment of the present invention are implemented.

[0034] An embodiment of the present invention further provides a computer program product, including a computer program, which implements the steps of the method of the embodiment of the present invention when executed by a processor.

[0035] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A defect location method based on planar X-ray detection, characterized in that: include: Step S1, fix the device under test on a plane X-ray detection device, the length, width and height of the device under test correspond to the X, Y and Z axes of the coordinate system respectively, use plane X-rays to perform a detection imaging on the device under test, and obtain the primary position coordinates (X0, Y0) of the defect in the X and Y axis directions; Step S2, tilting one side of the long side of the device by a certain angle α, performing secondary detection imaging on the device to be tested using plane X-rays, and obtaining secondary position coordinates (X0, Y1) of the defect in the X and Y axis directions; Step S3, according to the primary position coordinate Y0 and the secondary position coordinate Y1 in the Y-axis direction and the device tilting angle α, the coordinate Z0 of the defect in the Z-axis direction is calculated: Z0=Y0 / tanα-Y1 / sinα.

2. The method according to claim 1, characterized in that The device under test is a flat package structure device.

3. The method according to claim 2, characterized in that The device under test is an integrated circuit.

4. A computer device comprising a memory, a processor and a computer program stored in the memory, characterized in that: The processor executes the computer program to implement the steps of the method according to any one of claims 1 to 3.

5. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 3 are implemented.

6. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 3 are implemented.

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