Display module and display device

Abstract

The invention discloses a display module and a display device. The display module comprises a display panel and a backlight module which are oppositely arranged, a printed circuit board is arranged on the side, away from the display panel, of the backlight module. The printed circuit board is bound to the first edge of the first surface, far away from the backlight module, of the display panel through the flexible circuit board; the second surface, close to the backlight module, of the printed circuit board is provided with at least one copper exposing area. The copper exposing area is in contact with a frame of the backlight module through the conductive connecting layer; the frame is made of metal materials. At least one cushion block structure is arranged between the printed circuit board and the frame. In the direction perpendicular to the printed circuit board, the cushion block structure is not overlapped with the copper exposing area. According to the technical scheme provided by the invention, the white group problem of the backlight source can be solved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] During the assembly process of the display module, one side of the display panel is connected to the printed circuit board (PCB) through a flexible printed circuit (FPC). The display panel and the backlight source need to be buckled together, the flexible printed circuit board of the display panel is folded to the back of the display panel, and the PCB board is fixed to the frame of the backlight source.

[0003] To prevent electrostatic damage, a copper exposed area is set on the side of the PCB board close to the display panel to ensure that the PCB board and the frame are grounded. However, because the PCB board is made of metal, the copper exposed area is prone to deformation during the production process, with concave or convex positions, and the deformation position is easily transmitted to the backlight through the frame, causing backlight bulging and other problems. Summary of the invention

[0004] The embodiments of the present invention provide a display module and a display device to solve the white mass problem of a backlight source.

[0005] In a first aspect, an embodiment of the present invention provides a display module, comprising: a display panel and a backlight module arranged opposite to each other;

[0006] A printed circuit board is disposed on a side of the backlight module away from the display panel; the printed circuit board is bound to a first edge of a first surface of the display panel away from the backlight module through a flexible circuit board;

[0007] The second surface of the printed circuit board close to the backlight module is provided with at least one copper-exposed area; the copper-exposed area is in contact with the frame of the backlight module through a conductive connection layer; the frame is made of metal material;

[0008] Wherein, at least one pad structure is further arranged between the printed circuit board and the frame; in a direction perpendicular to the printed circuit board, the pad structure does not overlap with the copper exposed area.

[0009] In a second aspect, an embodiment of the present invention further provides a display device, wherein the display device comprises the display module provided by any embodiment of the present invention.

[0010] In the present invention, the display module includes a display panel and a backlight module that are arranged relatively, wherein the flexible circuit board bound to the first edge of the display panel is bent to the side of the backlight module away from the display panel to connect the printed circuit board. The printed circuit board includes a second surface close to the backlight module, and the second surface is formed with at least one copper-exposed area, and the copper-exposed area can be in contact with the metal frame of the backlight module through a conductive connection layer, so as to achieve the purpose of grounding, and at least one pad structure is arranged between the printed circuit board and the frame in the non-copper-exposed area, and the pad structure does not overlap with the copper-exposed area, so as to increase the contact area between the printed circuit board and the frame, avoid the deformation of the printed circuit board and the backlight module, thereby avoiding the problem of white backlight due to the backlight module being squeezed, improving the backlight luminous quality, and further improving the display effect of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the cross-sectional structure of a display module in the prior art;

[0012] Figure 2 A schematic cross-sectional structure diagram of a display module provided by an embodiment of the present invention;

[0013] Figure 3 A schematic diagram of a planar structure of a display module provided by an embodiment of the present invention;

[0014] Figure 4 for Figure 2 A schematic diagram of the enlarged structure of the local area A1;

[0015] Figure 5 A schematic cross-sectional structure diagram of a printed circuit board provided in an embodiment of the present invention;

[0016] Figure 6 A schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0017] Figure 7 for Figure 6 Schematic diagram of the structure of the printed circuit board;

[0018] Figure 8 A cross-sectional schematic diagram of a printed circuit board provided by an embodiment of the present invention;

[0019] Fig. 9 A schematic cross-sectional structure diagram of another printed circuit board provided by an embodiment of the present invention;

[0020] Fig.10 A schematic cross-sectional structure diagram of another printed circuit board provided by an embodiment of the present invention;

[0021] Fig.11 A schematic structural diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0022] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0023] Figure 1 It is a schematic diagram of the cross-sectional structure of the display module in the prior art. The display module includes a display panel 11', a backlight module 12' and a printed circuit board 13'. The printed circuit board 13' needs to be connected to the display panel 11' through a flexible circuit board. In order to prevent the entire display module, especially the printed circuit board 13' from being damaged by electrostatic shock, and to improve the speed of electrostatic dissipation, a copper-exposed area is provided under the printed circuit board 13', and the copper-exposed area can be in contact with the metal frame 15' through the conductive structure 14' to maintain a grounded state. However, in the process of realizing the present invention, the inventors found that the copper-exposed area of ​​the printed circuit board 13' is a metal film material, which is prone to deformation during the production process, and has concave or convex parts. The concave or convex parts are easily transmitted to the backlight module 12', resulting in white backlight clustering. Especially when the area of ​​the copper-exposed area is small, the backlight clustering is more obvious. For example, Figure 1 As shown, the exposed copper area of ​​the printed circuit board 13' is prone to form a protruding portion 131', which in turn causes the conductive structure 14' and the metal frame 15' to bulge and deform, and even causes each film layer in the backlight module 12' to bulge, affecting the display effect of the backlight source, forming an obvious white mass, and ultimately causing the display panel to display unevenly.

[0024] To solve the above problems, an embodiment of the present invention provides a display module, such as Figure 2 As shown, Figure 2 A schematic cross-sectional structure diagram of a display module provided by an embodiment of the present invention, the display module comprises: a display panel 11 and a backlight module 12 arranged opposite to each other;

[0025] A printed circuit board 13 is disposed on a side of the backlight module 12 away from the display panel 11 ; the printed circuit board 13 is bound to a first edge L1 of a first surface S1 of the display panel 11 away from the backlight module 12 through a flexible circuit board 14 ;

[0026] The second surface S2 of the printed circuit board 13 close to the backlight module 12 is provided with at least one copper-exposed area 131; the copper-exposed area 131 is in contact with the frame 121 of the backlight module 12 through the conductive connection layer 15; the frame 121 is made of metal material;

[0027] At least one spacer structure 16 is further disposed between the printed circuit board 13 and the frame 121 ; in a direction perpendicular to the printed circuit board 13 , the spacer structure 16 does not overlap with the copper exposed area 131 .

[0028] In an embodiment of the present invention, the display module includes a display panel and a backlight module that are arranged relatively to each other, wherein the flexible circuit board bound to the first edge of the display panel is bent to the side of the backlight module away from the display panel to connect the printed circuit board. The printed circuit board includes a second surface close to the backlight module, and the second surface is formed with at least one copper-exposed area, and the copper-exposed area can be in contact with the metal frame of the backlight module through a conductive connection layer, so as to achieve the purpose of grounding, and at least one pad structure is arranged between the printed circuit board and the frame in the non-copper-exposed area, and the pad structure does not overlap with the copper-exposed area, so as to increase the contact area between the printed circuit board and the frame, avoid the deformation of the printed circuit board and the backlight module, thereby avoiding the problem of white backlight due to the backlight module being squeezed, improving the backlight luminous quality, and further improving the display effect of the display module.

[0029] The above is the core idea of ​​the present invention. The technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] refer to Figure 2 The display module includes a display panel 11 and a backlight module 12 that are arranged opposite to each other. In this embodiment, the display panel may be a liquid crystal display panel, which generally includes a color film substrate 111 and an array substrate 112 that are arranged opposite to each other, and a liquid crystal layer ( Figure 2 and Figure 3 ). Optionally, it may also include an upper polarizer 114 located on the side of the color film substrate 111 away from the backlight module 12, and a lower polarizer 113 located on the side of the array substrate 112 close to the backlight module 12. In addition, a cover plate 21 may be provided on the side of the display panel 11 away from the backlight module 12. The cover plate 21 can protect the display panel 11, reduce external impact force, and improve the reliability of the display panel 11. The cover plate 21 can be bonded to the upper polarizer 114 of the display panel 11 through an adhesive layer 115. Exemplarily, the adhesive layer 115 may be an optically clear adhesive (OCA). The cover plate 21 may be a flexible cover plate or a glass cover plate, which is not particularly limited in this embodiment.

[0031] The backlight module 12 may include an optical film layer 122, a light guide plate 123, a reflective layer 124, and a frame 121 that are sequentially away from the display panel 11. The frame 121 may surround the sides of the reflective layer 124, the light guide plate 123, and the optical film layer 122 to protect the film layers surrounded by them. The frame 121 is made of metal material, and exemplarily, the frame 121 may be an aluminum frame. The light guide plate 123 can evenly disperse the light emitted by the backlight source, and the reflective layer 124 is used to reflect the light emitted from the light guide plate 123 to enhance the luminous intensity of the light emitting surface of the light guide plate 123. The optical film layer 122 may include a diffusion film 1221, a prism film 1222, and a reflective brightness enhancement film 1223 stacked on the light guide plate 123 to ensure sufficient and evenly distributed brightness of the backlight.

[0032] Figure 3 A schematic diagram of a planar structure of a display module provided by an embodiment of the present invention, referring to Figure 2 and Figure 3 The display module also includes a printed circuit board 13, which can be electrically connected to the display panel 11 through a flexible circuit board 14, and can be used to send control signals and clock signals to the display panel 11 to drive the backlight module 12 to emit backlight, and drive the drive circuit of the array substrate 112 of the display panel 11 to realize the backlight passing through the liquid crystal layer to realize the picture display. For the convenience of illustration, Figure 3 A schematic diagram of the planar structure of the first surface S1 of the display panel 11 is shown, and the printed circuit board 13, the display panel 11 and the flexible circuit board 14 are fully unfolded. It should be noted that in the actual display module, the display module needs to be bent by the flexible circuit board 14 to be arranged close to the backlight module 12. In a plane parallel to the display panel 11, the display panel may include a display area AA and a non-display area NA arranged around the display area AA. A binding area B1 is formed in the non-display area NA near the first edge L1. The flexible circuit board 14 is bound to the binding area B1. That is, a binding area B1 may be provided near the first edge L1 of the first surface S1 of the display panel 11 away from the backlight module 12, for binding the flexible circuit board 14. Optionally, a driving chip 116 may also be provided near the first edge L1, and the driving chip 116 is electrically connected to the flexible circuit board 14 for driving the driving circuit of the array substrate 112 of the display panel 11. Reference Figure 2 The flexible circuit board 14 is specifically bound to a side of the array substrate 112 away from the backlight module 12 .

[0033] Figure 4 for Figure 2 The enlarged structural diagram of the local area A1 in the figure is shown in Figure 1. Figure 4, at least one copper-exposed area 131 is provided on the second surface S2 of the printed circuit board 13 close to the backlight module 12, which is used to achieve a grounding state with the frame 121 through the conductive connection layer 15 to release static electricity and improve the antistatic performance of the printed circuit board 13. Optionally, the conductive connection layer 15 can be a conductive double-sided tape, a conductive foam or a conductive cloth. In a plane parallel to the printed circuit board 13, the conductive connection layer 15 and the copper-exposed area 131 at least partially overlap, and optionally, the conductive connection layer 15 can be arranged corresponding to the copper-exposed area 131, and the conductive connection layer 15 and the corresponding copper-exposed area 131 can completely overlap to increase the electrostatic transmission channel between the copper-exposed area 131 and the frame 121, thereby improving the electrostatic transmission performance between the copper-exposed area 131 and the frame 121. At least one pad structure 16 is also arranged between the printed circuit board 13 and the frame 121. In a plane parallel to the printed circuit board 13, that is, in a direction perpendicular to the printed circuit board 13, the pad structure 16 does not overlap with the copper exposed area 131. When the copper exposed area 131 is deformed, the pad structure 16 can effectively fill the gap between the printed circuit board 13 and the frame 121, and increase the contact area (indirect contact area) between the printed circuit board 13 and the frame 121, so that the printed circuit board 13 and the frame 121 can disperse the stress that causes the copper exposed area 131 to deform, thereby avoiding squeezing the backlight module, avoiding the problem of white backlight due to squeezing, improving the backlight luminous quality, and thus improving the display effect of the display module.

[0034] Continue to refer Figures 2 to 4 Optionally, the display module may further include: a fixing tape 17; the fixing tape 17 is attached along the edge of the first surface S1 of the display panel 11; the fixing tape 17 is also used to extend along the first edge L1 to a side of the printed circuit board 13 away from the display panel 11; in a direction perpendicular to the printed circuit board 13, the fixing tape 17 covers the printed circuit board 13.

[0035] Small-sized display modules usually use a fixing tape 17 (Cell tape) to fix the backlight module 12 and the display panel 11 together. When assembling the backlight module 12 and the display panel 11, first, buckle the backlight module 12 and the display panel 11 together, then fold the flexible circuit board 14 on the backlight module 12 and the display panel 11 to the back of the display panel 11 and fix it on the frame 121 of the backlight module 12; then, use the fixing tape 17 to attach along the four sides of the first surface S1 of the display panel 11 (specifically, the surface of the color film substrate 111 away from the backlight module 12), fold it to the back of the backlight module 12 to overlap with the printed circuit board 13, and attach it to the printed circuit board 13. The fixing tape 17 can not only fix the backlight module 12 and the display panel 11, but also protect the components 136 of the printed circuit board 13.

[0036] Due to differences in attachment accuracy, size, tolerance and material properties, the fixing tape 17 and the printed circuit board 13 may not overlap well during the folding process. If the fixing tape 17 is attached too tightly, the fixing tape 17 will apply a pulling force parallel to the printed circuit board 13 to the printed circuit board 13 and the backlight module 12, thereby causing the backlight module 12 to be squeezed. In this embodiment, by providing a pad structure 16 between the printed circuit board 13 and the frame 121, the pulling force can be effectively dispersed by increasing the contact area between the printed circuit board 13 and the frame 121, thereby preventing the backlight module 12 from being squeezed and deformed. That is, whether it is the deformation stress of the printed circuit board 13 during the production process or the attachment stress of the fixing tape 17, both can be dispersed by the pad structure 16, thereby solving the problem of white backlight of the backlight module 12.

[0037] Figure 5 A schematic diagram of the cross-sectional structure of a printed circuit board provided by an embodiment of the present invention. Based on the above embodiments, the inventors further discovered that because the printed circuit board 13 is a multi-layer wiring arrangement, as more control functions are developed, the wiring will occupy a large amount of plane space, and the area of ​​the exposed copper area 131 will be reduced, forming a single copper exposed area 131 with a smaller area and an increased number of arrangements, such as Figure 5 As shown, a corresponding conductive connection layer 15 can be provided for each copper exposed area 131. In a plane parallel to the printed circuit board 13, the area of ​​the conductive connection layer 15 can be substantially the same as the area of ​​the corresponding copper exposed area 131. In this embodiment, the area of ​​the conductive connection layer 15 is relatively small, and a pad structure 16 with a larger area can be provided between the printed circuit board 13 and the frame. Figure 5 , the pad structure 16 can be set in multiple numbers, and each pad structure 16 has a small area. It should be noted that the pad structure 16 is a non-conductive material. This embodiment can not only adapt to the design of multi-layer routing of the printed circuit board, but also increase the overall setting area of ​​the pad structure 16 on the printed circuit board 13, further increase the contact area between the printed circuit board 13 and the frame 121, avoid deformation of the printed circuit board 13 or the stress of the fixing tape 17 on the backlight module 12, avoid white spots on the backlight, and improve the uniformity of the backlight.

[0038] Continue to refer Figure 5 Optionally, the thickness d1 of the pad structure 16 can be substantially the same as the thickness d2 of the conductive connection layer 15, so that the printed circuit board 13 and the frame 121 can support each other through the pad structure 16, and the deformation force of the printed circuit board 13 and the attachment stress of the fixing tape 17 can be evenly dispersed, so that the frame 121 does not have bulges or depressions, thereby ensuring that other film layers of the backlight module 12 do not have bulges or depressions, making the backlight output by the backlight module 12 more uniform, and avoiding the problem of white spots in the backlight at the deformation position of the backlight module 12.

[0039] Continue to refer Figure 2 and Figure 4 Optionally, the pad structure 16 can be a first protrusion 1211 formed by integrally stamping the frame 121. When the mold of the frame 121 is opened, the first protrusion 1211 can be preset at a specific position, and then the frame 121 with the first protrusion 1211 is manufactured through a stamping process. Then, this embodiment does not need to prepare an additional layer of other film layers, which saves the preparation process of the display module and improves the manufacturing efficiency of the display module. Optionally, the material of the first protrusion 1211 can include at least one of the following: aluminum, iron and stainless steel. That is, the frame 121 made of metal material can be made of materials such as aluminum, iron and stainless steel. The first protrusion 1211 made of metal material can effectively play a supporting role between the frame 121 and the printed circuit board 13, effectively disperse the deformation force of the printed circuit board 13 and the attachment stress of the fixing tape 17, and improve the uniformity of the backlight emission.

[0040] Figure 6 A schematic diagram of the cross-sectional structure of another display module provided in an embodiment of the present invention, optionally, the pad structure 16 can be a second protrusion 132 formed by integrally forming the printed circuit board 13. The pad structure 16 can be integrally formed with the printed circuit board 13. Specifically, the printed circuit board 13 is a structure formed by stacking multiple film layers. During the preparation of the printed circuit board 13, the second protrusion 132 is set in the non-copper exposed area. The second protrusion 132 can be formed by increasing the film thickness of at least one layer in the multi-layer film layer stacking structure. Compared with the solution of adding other film layers between the frame 121 and the printed circuit board 13 to form the pad structure 16, this embodiment effectively saves the preparation process of the display module and improves the production efficiency of the display module. Figure 7 for Figure 6 In the structural diagram of the printed circuit board, optionally, the thickness of the second protrusion 132 is the same as the film thickness of the conductive connection layer 15 or the difference is less than the set threshold range. It is convenient to realize that the printed circuit board 13 and the frame 121 support each other through the second protrusion 132, realize the uniform dispersion of the deformation force of the printed circuit board 13 and the attachment stress of the fixing tape 17, realize that the frame 121 does not have protrusions or depressions, and then ensure that other film layers of the backlight module 12 do not have protrusions or depressions, so that the backlight output by the backlight module 12 is more uniform.

[0041] Figure 8 A cross-sectional schematic diagram of a printed circuit board provided by an embodiment of the present invention, in one example, optionally, the printed circuit board 13 may include a core board 133 and a prepreg 134 arranged alternately; the printed circuit board 13 may also include: a first solder resist ink layer 135; the first solder resist ink layer 135 is in contact with the frame 121; and the second protrusion 132 is formed integrally with the first solder resist ink layer 135. Reference Figure 8 In this embodiment, a printed circuit board 13 in which a core board 133 is arranged between two prepregs 134 is used as an example for illustration. The core board 133 includes a solid material 1332 composed of solid resin and glass fiber, and copper foils 1331 on both sides of the solid material. The prepregs 134 on both sides of the core board 133 are pressed together with the core board 133. The prepreg 134 is a dielectric material, sandwiched between the core board 133 and the copper foil 1331, or between two adjacent core boards 133. The prepreg 134 is composed of semi-solid resin and glass fiber, and plays a filling role in the printed circuit board 13. In addition, a first solder resist ink layer 135 needs to be arranged on the outermost side of the printed circuit board 13. The first solder resist ink layer 135 can be a green ink layer, the main components of which include epoxy modified resin, thermosetting epoxy resin, photoinitiator, body pigment, coloring pigment, additive and solvent, etc. The epoxy modified resin and thermosetting epoxy resin are the materials constituting the basic skeleton thereof, which provide the adhesion and chemical resistance of the ink. Photoinitiators are key components in the photocuring process, which can initiate polymerization reactions under the action of ultraviolet light. Extender pigments and coloring pigments are responsible for providing the color and hiding power of the ink, while additives and solvents are used to adjust the ink's viscosity, drying speed and other properties to meet different application requirements.

[0042] The first solder resist ink layer 135 is mainly used as a protective layer, coated on the circuits and substrates of the printed circuit board 13 that do not need to be soldered, or used as a solder resist to protect the formed circuit pattern for a long time. Green oil can cover conductors other than pads, etc., to avoid welding short circuits and extend the service life of the PCB. This first solder resist ink layer 135 is covered on the copper foil 1331 and is made by a screen printing plate. A layer of solder resist material is applied to the places where soldering is not required to prevent the fluidity of solder at high temperatures during welding. There are many colors of green oil, such as green, black, red, blue, yellow, white, etc., among which most PCBs use a green solder resist ink layer. In this embodiment, the pad structure 16 can be a second protrusion 132 formed by integrally forming the first solder resist ink layer 135, which effectively saves the preparation process of the display module and improves the production efficiency of the display module. And ensure that other film layers of the backlight module 12 do not have protrusions or depressions, so that the backlight output by the backlight module 12 is more uniform. When the pad structure 16 is integrally formed with the first solder resist ink layer 135, the material of the second protrusion 132 is optionally the same as that of the first solder resist ink layer 135, and may include at least one of the following: epoxy modified resin and thermosetting epoxy resin. In addition, a small amount of photoinitiator, body pigment, coloring pigment, additive and solvent may also be included, which is not specifically limited in this embodiment.

[0043] Based on the above embodiments, the pad structure 16 can be integrally formed with the frame 121, or integrally formed with the printed circuit board 13. In addition, the pad structure 16 can also be a separately provided film layer structure. Fig. 9 As shown, Fig. 9 A schematic diagram of the cross-sectional structure of another printed circuit board provided in an embodiment of the present invention. Optionally, the pad structure 16 can be attached to the second surface S2 of the printed circuit board 13 close to the backlight module 12. After the printed circuit board 13 is prepared, the pad structure 16 is attached to the second surface S2 of the printed circuit board 13. In this embodiment, the pad structure 16 can be attached when the conductive connection layer 15 is attached to the printed circuit board 13, and the thickness of the pad structure 16 is the same or approximately the same as the thickness of the conductive connection layer 15 to prevent the backlight module from being deformed and improve the uniformity of the backlight.

[0044] Optionally, the pad structure 16 can be a PI pad, a PP pad, a PET pad or an insulating pad. PI is a polyimide film with excellent high temperature resistance and chemical corrosion resistance. PET is a polyester film with good mechanical strength and flexibility. PP is a polypropylene film with high flame retardancy and chemical resistance. The insulating pad can effectively prevent the heat of the components of the printed circuit board 13 from being transferred to the frame 121, avoid deformation of the backlight module, and reduce the problem of white masses in the backlight. In this embodiment, the pad structure 16 can include the above materials at the same time, so as to have the advantages of high temperature resistance, high strength and corrosion resistance, further prevent the deformation of the backlight module, and improve the uniformity of the backlight.

[0045] Fig.10 A schematic diagram of the cross-sectional structure of another printed circuit board provided in an embodiment of the present invention. Optionally, the pad structure 16 may include: a heat-conducting layer 161 and a heat-insulating layer 162; the heat-conducting layer 161 is attached to the second surface S2; a groove structure 1611 is formed on the side of the heat-conducting layer 161 away from the second surface S2; and the heat-insulating layer 162 is filled in the groove structure 1611. In this embodiment, a pad structure 16 with a smaller area and a larger number is used as an example for illustration. The pad structure 16 of this embodiment may include a heat-conducting layer 161 and a heat-insulating layer 162, and the heat-conducting layer 161 is attached to the second surface S2, which can promptly conduct the heat emitted by the printed circuit board 13, accelerate the heat dissipation of the printed circuit board 13, and avoid overheating of the printed circuit board 13. In addition, a groove structure 1611 is formed on the side of the heat conductive layer 161 away from the second surface S2, and the groove structure 1611 is filled with a heat insulating layer 162 to prevent the large amount of heat from the component 136 with serious heat generation from being vertically transmitted to the frame 121 through the pad structure 16, thereby effectively preventing the backlight module from being deformed and avoiding the problem of white spots on the backlight.

[0046] Continue to refer Fig.10 Optionally, the printed circuit board 13 is provided with at least one component 136 on the third surface S3 away from the backlight module 12; in a direction perpendicular to the printed circuit board 13, the pad structure 16 at least partially overlaps with the corresponding component 136. Fig.10In the combined structure shown, the position of the pad structure 16 can be set in an area with a strong heat dissipation demand. For example, the area where the printed circuit board 13 is provided with components 136 has a heat dissipation demand, and the pad structure 16 can be correspondingly set on the second surface S2 opposite thereto. That is, in the direction perpendicular to the printed circuit board 13, the pad structure 16 and the corresponding component 136 at least partially overlap, so as to facilitate rapid heat dissipation of the component 136, avoid overheating of the component 136, avoid damage caused by overheating of the component 136, and improve the reliability of the printed circuit board 13. Optionally, because the components 136 provided on the printed circuit board 13 have different power sizes and different heat generation degrees, in this embodiment, a pad structure 16 with a larger area can be set corresponding to the component 136 with a larger power, and a printed circuit board 13 with a smaller area can be set on the second surface S2 of the printed circuit board 13 corresponding to the area with a smaller power or where no component 136 is provided.

[0047] An embodiment of the present invention further provides a display device. Fig.11 A schematic diagram of a display device according to an embodiment of the present invention is shown in FIG. Fig.11 As shown, the electronic device provided by the embodiment of the present invention includes the display module 200 described in any embodiment of the present invention. The display device can be as follows Fig.11 The mobile phone shown in the figure may also be a computer, a television, a smart wearable device, etc., and this embodiment does not specifically limit this.

[0048] The display device in this embodiment includes the technical features of the display module provided in any embodiment of the present invention, and has the beneficial effects of the corresponding technical features.

[0049] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display module, characterized in that: include: A display panel and a backlight module arranged opposite to each other; A printed circuit board is arranged on a side of the backlight module away from the display panel; The printed circuit board is bound to a first edge of a first surface of the display panel away from the backlight module through a flexible circuit board; The second surface of the printed circuit board close to the backlight module is provided with at least one copper-exposed area; the copper-exposed area is in contact with the frame of the backlight module through a conductive connection layer; the frame is made of metal material; Wherein, at least one pad structure is further arranged between the printed circuit board and the frame; in a direction perpendicular to the printed circuit board, the pad structure does not overlap with the copper exposed area.

2. The display module according to claim 1, characterized in that: Also includes: Fixing tape; The fixing tape is attached along the edge of the first surface of the display panel; the fixing tape is also used to extend along the first edge to a side of the printed circuit board away from the display panel; The fixing tape covers the printed circuit board in a direction perpendicular to the printed circuit board.

3. The display module according to claim 1, characterized in that: The conductive connection layer is conductive double-sided adhesive, conductive foam or conductive cloth.

4. The display module according to claim 1, characterized in that: The thickness of the spacer structure is substantially the same as the thickness of the conductive connection layer.

5. The display module according to claim 1, characterized in that: The cushion block structure is a first protrusion formed by integrally stamping the frame.

6. The display module according to claim 5, characterized in that: The material of the first protrusion includes at least one of the following: aluminum, iron and stainless steel.

7. The display module according to claim 1, characterized in that: The pad structure is a second protrusion formed by integrally molding the printed circuit board.

8. The display module according to claim 7, characterized in that: The printed circuit board comprises a core board and a prepreg sheet arranged alternately; The printed circuit board further includes: a first solder resist ink layer; the first solder resist ink layer is in contact with the frame; and the second protrusion is formed by integrally molding the first solder resist ink layer.

9. The display module according to claim 8, characterized in that: The material of the second protrusion includes at least one of the following: epoxy modified resin and thermal curing epoxy resin.

10. The display module according to claim 1, characterized in that: The pad structure is attached to the second surface of the printed circuit board.

11. The display module according to claim 10, characterized in that: The pad block structure is a PI pad block, a PP pad block, a PET pad block or a heat insulation pad block.

12. The display module according to claim 10, characterized in that: The pad structure comprises: a heat conducting layer and a heat insulating layer; The heat-conducting layer is attached to the second surface; a groove structure is formed on a side of the heat-conducting layer away from the second surface; and the heat-insulating layer is filled in the groove structure.

13. The display module according to claim 12, characterized in that: At least one component is disposed on a third surface of the printed circuit board away from the backlight module; In a direction perpendicular to the printed circuit board, the pad structure at least partially overlaps with the corresponding component.

14. A display device, characterized in that: A display module comprising any one of claims 1 to 13.

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