Automatic adjusting system for electron beam exposure equipment

Abstract

According to the automatic adjusting system for the electron beam exposure equipment provided by the invention, when the upper computer works, the external camera can be called to image a real image amplified by the objective lens, and after an imaged light microscope picture is analyzed, the real image is obtained; and according to the analysis result, driving an adjusting assembly or an operating robot to adjust a sample holder on the light microscope objective table, a sample table on the sample holder and the optical microscope, and controlling the operating robot to carry out zeroing operation on the X axis, the Y axis and the Z axis of the electron beam exposure equipment so as to adjust a sample on the sample table. The automatic calibration and adjustment operation can be realized through the upper computer without manual operation in the process, so that the equipment operation time is effectively saved, the operation accuracy is improved, the exposure of the electron beam at different positions can be accurately controlled, and the external camera is used for replacing the original camera in the electron beam exposure equipment, so that the cost is reduced. And the picture transmission efficiency and the automatic adjustment efficiency are effectively improved.

Description

Technical Field

[0001] The present application relates to the field of automatic control technology, and in particular to an automatic adjustment system for electron beam exposure equipment. Background Art

[0002] Electron beam exposure equipment is a large-scale instrument for high-precision micro-nano processing. Its parts can only be imported from the original manufacturer. Once damaged, it will affect the use of the equipment for a long time, delaying the progress of scientific research. In addition, the parts are expensive and the maintenance cost is high. Therefore, scientific research units with this equipment usually train professional talents to use it.

[0003] At present, electron beam exposure equipment requires a clear reference position to ensure the accuracy and repeatability of each operation when it is working. For example, zeroing the XYZ axis of the equipment is to establish such a fixed reference point. When the equipment completes the zeroing operation, all subsequent movements and operations can be measured and located relative to this origin, so that the operator can accurately know the current position of the equipment and can accurately control the exposure of the electron beam at different positions.

[0004] However, due to the high operating requirements of the equipment, operators need a long period of training before they are allowed to use the machine. If the operator is not familiar with the equipment's zeroing operation process, not only will subsequent experimenters be unable to conduct experiments normally due to operating errors or excessive operation time, but the accuracy of subsequent electron beam exposure operations will also be out of control. In addition, the camera installed under the microscope of the equipment has excessive image delay due to performance reasons, which further prolongs the operation time and increases the management and maintenance costs of the laboratory. Summary of the invention

[0005] The purpose of the present application is to solve at least one of the above-mentioned technical defects, especially the technical defect that manual operation is used in the prior art to perform relevant experimental operations on the electron beam exposure equipment, which not only makes it impossible for subsequent experimenters to conduct experiments normally due to operating errors or too long operation time, but also leads to the technical defect that the accuracy of subsequent electron beam exposure operations cannot be controlled.

[0006] The present application provides an automatic adjustment system for an electron beam exposure device, the system comprising a host computer, an external camera, a light microscope stage, an adjustment component arranged on the light microscope stage, and an operating robot arranged on one side of the light microscope stage;

[0007] The optical microscope and the optical microscope stage of the electron beam exposure device are arranged on the optical microscope stage, the optical microscope stage is used to load a sample rack with a sample fixed thereon, the adjustment component and the operating robot are arranged around the optical microscope, the lens of the external camera is docked with the objective lens of the optical microscope, and the input and output ends of the host computer are respectively connected to the external camera, the adjustment component and the operating robot;

[0008] When the host computer is working, the external camera is called to image the real image magnified by the objective lens, and after analyzing the imaged light microscope picture, the adjustment component or the operating robot is driven according to the analysis result to adjust the sample rack on the light microscope stage, the sample stage on the sample rack, and the optical microscope, and the operating robot is controlled to perform a zeroing operation on the XYZ axis of the electron beam exposure equipment to adjust the sample on the sample stage.

[0009] Optionally, the system further comprises: a tray docking assembly disposed between the optical microscope stage and the operating robot, the tray docking assembly being disposed opposite to the optical microscope stage;

[0010] Before the host computer calls the external camera to image the real image magnified by the objective lens, the following operations are performed:

[0011] Sending a sample rack transport instruction to the operating robot to drive the operating robot to transport the sample rack with samples fixed in the designated area to the tray docking assembly;

[0012] Sending a sample rack import instruction to the tray docking assembly to drive the tray docking assembly to import the sample rack into the optical microscope stage;

[0013] A sample rack locking instruction is sent to the operating robot to drive the operating robot to lock the sample rack and the optical microscope stage.

[0014] Optionally, when the host computer is working, the external camera is called to image the real image magnified by the objective lens, and after analyzing the imaged light microscope picture, the operating robot is driven to adjust the sample stage on the sample rack according to the analysis result, including:

[0015] When the host computer adjusts the sample stage on the sample rack, it calls the external camera to image the real image magnified by the objective lens, and uses the first algorithm SDK to analyze the first optical microscope image after imaging, determines the type of sample stage on the sample rack, and drives the operating robot to adjust the sample stage according to the type of the sample stage.

[0016] Optionally, the process in which the host computer drives the operating robot to adjust the sample stage according to the type of the sample stage includes:

[0017] When the host computer determines that the sample stage is of a press type, the host computer drives the operating robot to adjust the height and level of the sample stage using the press type calibration method;

[0018] When the host computer determines that the sample stage is a knob type, it drives the operating robot to adjust the height and level of the sample stage using the knob type calibration method.

[0019] Optionally, when the host computer is working, the external camera is called to image the real image magnified by the objective lens, and after analyzing the imaged light microscope picture, the operating robot is driven to adjust the sample stage on the sample rack according to the analysis result, including:

[0020] When the host computer adjusts the angle of the sample stage on the sample rack, it calls the external camera to image the real image magnified by the objective lens, and uses the second algorithm SDK to analyze the second optical microscope picture after imaging, determines the angle information of the sample on the sample stage in the second optical microscope picture after imaging, and drives the operating robot to adjust the angle of the sample stage according to the angle information.

[0021] Optionally, the process in which the host computer drives the operating robot to adjust the sample stage according to the angle information includes:

[0022] The host computer determines the rotation angle and rotation direction when the edge of the sample is orthogonal to the imaged second optical microscope image based on the angle information, and drives the operating robot to rotate the sample stage according to the rotation angle and the rotation direction.

[0023] Optionally, when the host computer is working, the external camera is called to image the real image magnified by the objective lens, and after analyzing the imaged light microscope picture, the adjustment component is driven to adjust the sample holder on the light microscope stage according to the analysis result, and the operating robot is controlled to perform zeroing operation on the XY axis of the electron beam exposure device, including:

[0024] When the host computer adjusts the plane reference coordinates of the electron beam exposure device, it calls the external camera to image the real image magnified by the objective lens, and uses the third algorithm SDK to analyze the third optical microscope picture after imaging, and then determines the position information of the Faraday cup on the sample holder in the third optical microscope picture after imaging, and drives the adjustment component to adjust the sample holder according to the position information, and then controls the operating robot to perform a zeroing operation on the XY axis of the electron beam exposure device.

[0025] Optionally, the adjustment component includes an X-axis automatic adjustment component and a Y-axis automatic adjustment component;

[0026] After the host computer drives the adjustment component to adjust the sample holder according to the position information, the process of controlling the operating robot to perform a zeroing operation on the XY axis of the electron beam exposure device includes:

[0027] The host computer determines, according to the position information, an X-axis moving distance and a Y-axis moving distance when the Faraday cup is located at the center of the scale of the third optical mirror image after imaging;

[0028] After the host computer drives the X-axis automatic adjustment component to adjust the distance of the sample holder in the X-axis direction according to the X-axis moving distance, the host computer controls the operating robot to perform a zeroing operation on the X-axis of the electron beam exposure device;

[0029] After the host computer drives the Y-axis automatic adjustment component to adjust the distance of the sample holder in the Y-axis direction according to the Y-axis moving distance, the host computer controls the operating robot to perform a zeroing operation on the Y-axis of the electron beam exposure device.

[0030] Optionally, when the host computer is working, the external camera is called to image the real image magnified by the objective lens, and after analyzing the imaged optical microscope picture, the adjustment component is driven to adjust the optical microscope according to the analysis result, and the Z axis of the electron beam exposure device of the operating robot is controlled to perform a zeroing operation, including:

[0031] When the host computer adjusts the Z-axis reference coordinate of the electron beam exposure device, it calls the external camera to image the real image magnified by the objective lens, and uses the fourth algorithm SDK to analyze the fourth optical microscope picture after imaging, determines the clarity of the mark on the sample holder in the fourth optical microscope picture after imaging, and drives the adjustment component to adjust the optical microscope according to the clarity, and then controls the operating robot to perform a zeroing operation on the Z-axis of the electron beam exposure device.

[0032] Optionally, the adjustment component further includes a large knob adjustment component and a small knob adjustment component;

[0033] After the host computer drives the adjustment component to adjust the optical microscope according to the clarity, the process of controlling the operating robot to perform a zeroing operation on the Z axis of the electron beam exposure device includes:

[0034] The host computer determines the focusing data when the mark reaches a preset clarity threshold according to the clarity, and drives the large knob adjustment component to adjust the coarse adjustment knob on the optical microscope according to the focusing data, and drives the small knob adjustment component to adjust the fine adjustment knob on the optical microscope to adjust the height of the sample holder, and controls the operating robot to perform zeroing operation on the Z axis of the electron beam exposure equipment.

[0035] Optionally, after the host computer controls the operating robot to perform a zeroing operation on the XYZ axes of the electron beam exposure device, it further performs the following operations:

[0036] The external camera is called to image the real image magnified by the objective lens, and the fifth algorithm SDK is used to analyze the fifth optical microscope picture after imaging, to determine the position coordinates of all the marks around the sample on the sample rack, and the position coordinates are saved.

[0037] It can be seen from the above technical solutions that the embodiments of the present application have the following advantages:

[0038] The present application provides an automatic adjustment system for electron beam exposure equipment, the system comprising a host computer, an external camera, a light microscope stage, an adjustment component arranged on the light microscope stage, and an operating robot arranged on one side of the light microscope stage; wherein, the optical microscope and the light microscope stage of the electron beam exposure equipment are arranged on the light microscope stage, the light microscope stage is used to load a sample rack with fixed samples, the adjustment component and the operating robot are arranged around the optical microscope, the lens of the external camera is docked with the objective lens of the optical microscope, and the input and output ends of the host computer are respectively connected to the external camera, the adjustment component and the operating robot; when the host computer is working, it can call the external camera to image the real image obtained by magnifying the objective lens, and after analyzing the imaged light microscope picture, drive the adjustment component or the operating robot to adjust the sample rack on the light microscope stage, the sample stage on the sample rack, and the optical microscope according to the analysis results, and control the operating robot to perform a zeroing operation on the XYZ axes of the electron beam exposure equipment to adjust the sample on the sample stage. This process does not require manual operation, and can realize automatic calibration and adjustment operations through the host computer, thereby effectively saving equipment operation time and improving operation accuracy, so as to accurately control the exposure of the electron beam at different positions. In addition, this application uses an external camera to replace the original camera in the electron beam exposure equipment, and connects to the host computer for image processing. This process will not only not affect the operation of the original host in the electron beam exposure equipment, but also effectively improve the picture transmission efficiency, thereby improving the automatic adjustment efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0040] Figure 1 An architectural diagram of an automatic adjustment system for an electron beam exposure device provided in an embodiment of the present application;

[0041] Figure 2 A schematic diagram of the positional relationship of laboratory equipment such as an optical microscope stage and an operating robot provided in an embodiment of the present application;

[0042] Figure 3 A schematic diagram of the structure of the operating robot provided in an embodiment of the present application;

[0043] Figure 4 A schematic diagram of the structure of various grippers of the operating robot provided in the embodiments of the present application;

[0044] Figure 5A schematic diagram of the structure of a press-type sample stage provided in an embodiment of the present application;

[0045] Figure 6 A schematic diagram of the structure of a knob-type sample stage provided in an embodiment of the present application;

[0046] Figure 7 A schematic diagram of a second optical mirror image after the external camera provided in an embodiment of the present application forms an image of a real image magnified by an objective lens;

[0047] Figure 8 A schematic diagram of a process of focusing a picture using an image clarity recognition algorithm provided in an embodiment of the present application;

[0048] Fig. 9 A schematic diagram of a process of calling a contour recognition algorithm to perform contour recognition on a Faraday cup provided in an embodiment of the present application;

[0049] Fig.10 A schematic diagram of the positional relationship between various adjustment components and the optical microscope and the optical microscope stage provided in the embodiment of the present application;

[0050] Fig.11 A schematic diagram of the positional relationship between the X-axis automatic adjustment assembly and other devices on the optical microscope stage provided in an embodiment of the present application;

[0051] Fig.12 A schematic diagram of the positional relationship between the Y-axis automatic adjustment component and other devices on the optical microscope stage provided in an embodiment of the present application;

[0052] Fig.13 This is a schematic diagram of the structure of the size knob adjustment assembly provided in an embodiment of the present application. DETAILED DESCRIPTION

[0053] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0054] In one embodiment, the present application provides an automatic adjustment system for electron beam exposure equipment, the system comprising a host computer, an external camera, a light microscope stage, an adjustment component arranged on the light microscope stage, and an operating robot arranged on one side of the light microscope stage.

[0055] The optical microscope and the optical microscope stage of the electron beam exposure equipment are arranged on the optical microscope stage, the optical microscope stage is used to load a sample rack with fixed samples, the adjustment component and the operating robot are arranged around the optical microscope, the lens of the external camera is docked with the objective lens of the optical microscope, and the input and output ends of the host computer are respectively connected to the external camera, the adjustment component and the operating robot.

[0056] When the host computer is working, the external camera is called to image the real image magnified by the objective lens, and after analyzing the imaged light microscope picture, the adjustment component or the operating robot is driven according to the analysis result to adjust the sample holder on the light microscope stage, the sample stage on the sample holder, and the optical microscope, and the operating robot is controlled to perform a zeroing operation on the XYZ axis of the electron beam exposure equipment to adjust the sample on the sample stage.

[0057] In this embodiment, Figure 1 , 2 As shown, Figure 1 This is a diagram of the architecture of an automatic adjustment system for an electron beam exposure device provided in an embodiment of the present application. Figure 2 Schematic diagram of the positional relationship of laboratory equipment such as the optical microscope stage and the operating robot provided in the embodiment of the present application; Figure 2 It can be seen that the present application is provided with a plurality of adjustment components on the optical microscope stage, an operating robot is provided on one side of the optical microscope stage, and the optical microscope and the optical microscope stage of the electron beam exposure equipment (EBL equipment) are both provided on the optical microscope stage, and various adjustment components and operating robots are provided around them so as to adjust the optical microscope and the sample rack on which the sample is fixed and loaded on the optical microscope stage. In addition, the microscope of the EBL equipment was originally equipped with a camera for shooting the picture under the objective lens of the optical microscope, but due to performance reasons, the picture delay is too large. Therefore, the present application can select and replace it, dock it with the objective lens through an external camera, and connect it to an external host, that is, a host computer for processing, without affecting the operation of the original equipment host.

[0058] Among them, the above-mentioned optical microscope and light microscope stage are the microscope and stage that come with the electron beam exposure equipment. When the coarse adjustment rotation or fine adjustment knob of the optical microscope is adjusted, the light microscope stage can be driven to rise or fall, and then the sample rack loaded on the light microscope stage can be driven to rise or fall. This process adjusts the distance between the objective lens and the sample by raising or lowering the light microscope stage, thereby achieving the purpose of focusing, etc.

[0059] The above-mentioned samples refer to silicon wafers, wafers or mask plates pre-fixed on the sample holder. The samples used for loading and unloading the EBL equipment of this application include but are not limited to 1cm silicon wafers, 2cm silicon wafers, 4-inch wafers, 6-inch wafers, 8-inch wafers, 150mmx150mm mask plates, etc. When this application selects different samples for photolithography, different sample holders can be used for fixing. The specific settings can be made according to the actual situation and are not limited here.

[0060] The above-mentioned adjustment components include but are not limited to X-axis automatic adjustment components, Y-axis automatic adjustment components, large knob adjustment components and small knob adjustment components, etc. Each adjustment component can be set according to its function to meet different requirements when performing zeroing operations on the XYZ axes of the electron beam exposure equipment.

[0061] The above-mentioned operating robot refers to a robot that adjusts the sample rack on the optical microscope stage and the sample stage in the sample rack in terms of level, height, angle, etc. The robot can be composed of a 10 kg robot, a handling gripper, a camera, and a robot base. Schematically, as shown in FIG. Figure 3 As shown, Figure 3 A schematic diagram of the structure of the operating robot provided in an embodiment of the present application; Figure 3 The bottom of the operating robot in the figure is a base, on which a 10kg robot is arranged, and the end of the 10kg robot is equipped with a camera and a handling gripper, so that when the operating robot is working, the handling operation can be performed through the cooperation between the camera and the handling gripper. Figure 4 As shown, Figure 4 A schematic diagram of the structure of various grippers of the operating robot provided in the embodiment of the present application; Figure 2 It can be seen that the present application can be provided with a quick-change mechanism on one side of the operating robot, in which various types of grippers are provided, such as 1cm and 2cm silicon wafer height adjustment grippers, tray locking grippers, 1cm and 2cm silicon wafer angle adjustment grippers, tray grippers and tray pull-out grippers. When the operating robot performs different types of operations, the quick-change mechanism can be used to meet the process operations of the optical microscope table, thereby effectively improving the operating efficiency.

[0062] The external camera mentioned above refers to a camera that is connected to the objective lens in the optical microscope of the EBL device. The external camera can image the real image magnified by the objective lens, and compared with the original camera, the external camera of the present application has a smaller image delay, so it can be connected to the host computer to achieve rapid adjustment. Figure 1As shown, the external camera of the present application can be an optical microscope CCD, which can be connected to the objective lens in the optical microscope of the EBL device through a corresponding interface, and then obtain the real image magnified by the objective lens, and send it to the host computer after imaging, so that the host computer can call a specific algorithm SDK for analysis, and send corresponding motion instructions to the robot according to the obtained result feedback. The robot here includes the adjustment component and the operating robot of the present application, and then the robot adjusts the EBL device. This process is continuously corrected and iterated to finally achieve the required business results.

[0063] In a specific implementation, the host computer of the present application can be integrated on the optical microscope stage, or it can be set in other convenient operating environments, and the input and output ends of the host computer are respectively connected to the external camera, the adjustment component and the operating robot. When the host computer is working, the external camera can be called to image the real image obtained by magnifying the objective lens of the optical microscope, and after analyzing the imaged optical microscope picture, the adjustment component or the operating robot is driven according to the analysis result to adjust the sample rack on the optical microscope stage, the sample stage on the sample rack, and the optical microscope, and after the adjustment is completed, the operating robot is controlled to perform a zeroing operation on the XYZ axis of the electron beam exposure device. In this way, the coordinate system of the electron beam exposure device can be unified with the coordinate system required by the design or process, and then when performing complex graphic exposure or multi-layer exposure, the positional relationship between different levels can be more accurately corresponded to avoid position deviation caused by inconsistent coordinate systems; the XYZ axis can be zeroed to eliminate the error accumulation of the equipment, ensuring that the equipment always remains in a high-precision working state; in addition, before performing the exposure task, the zeroing operation can be performed first to allow the operator or the exposure robot to clearly know the initial state of the equipment, so that it is easier to plan and execute the exposure path.

[0064] Among them, in this application, the host computer can drive different robots to perform operations when performing different process operations. For example, when the host computer adjusts the sample stage on the sample rack, it can drive the operating robot to adjust the sample stage; when the angle of the sample stage on the sample rack is adjusted, it can also drive the operating robot to adjust the angle of the sample stage; and when adjusting the Z-axis reference coordinate of the electron beam exposure device, it can drive the adjustment component to adjust the optical microscope, and then control the operating robot to return the Z-axis of the electron beam exposure device to zero. The specific drive object and motion instruction can be set according to the actual operation type, and there is no restriction here.

[0065] In the above embodiment, the system includes a host computer, an external camera, a light microscope stage, an adjustment component arranged on the light microscope stage, and an operating robot arranged on one side of the light microscope stage; wherein, the optical microscope and the light microscope stage of the electron beam exposure equipment are arranged on the light microscope stage, the light microscope stage is used to load a sample rack with a sample fixed thereon, the adjustment component and the operating robot are arranged around the optical microscope, the lens of the external camera is docked with the objective lens of the optical microscope, and the input and output ends of the host computer are respectively connected to the external camera, the adjustment component and the operating robot; when the host computer is working, it can call the external camera to image the real image obtained by magnifying the objective lens, and after analyzing the imaged light microscope picture, drive the adjustment component or the operating robot to adjust the sample rack on the light microscope stage, the sample stage on the sample rack, and the optical microscope according to the analysis results, and control the operating robot to perform a zeroing operation on the XYZ axes of the electron beam exposure equipment to adjust the sample on the sample stage. This process does not require manual operation, and can realize automatic calibration and adjustment operations through the host computer, thereby effectively saving equipment operation time and improving operation accuracy, so as to accurately control the exposure of the electron beam at different positions. In addition, this application uses an external camera to replace the original camera in the electron beam exposure equipment, and connects to the host computer for image processing. This process will not only not affect the operation of the original host in the electron beam exposure equipment, but also effectively improve the picture transmission efficiency, thereby improving the automatic adjustment efficiency.

[0066] In one embodiment, the system further comprises: a tray docking assembly disposed between the optical microscope stage and the operating robot, wherein the tray docking assembly is disposed opposite to the optical microscope stage.

[0067] Before the host computer calls the external camera to image the real image magnified by the objective lens, the following operations may also be performed:

[0068] A sample rack transport instruction is sent to the operating robot to drive the operating robot to transport the sample rack with samples fixed in the designated area to the tray docking assembly.

[0069] A sample rack import instruction is sent to the tray docking assembly to drive the tray docking assembly to import the sample rack into the optical microscope stage.

[0070] A sample rack locking instruction is sent to the operating robot to drive the operating robot to lock the sample rack and the optical microscope stage.

[0071] In this embodiment, Figure 2As shown, the system may also include a tray docking assembly disposed between the optical microscope stage and the operating robot. The tray docking assembly is disposed opposite to the optical microscope stage and is connected to the host computer, and then the sample rack is introduced onto the optical microscope stage according to the motion instructions sent by the host computer.

[0072] Specifically, in the present application, before the host computer calls the external camera to image the real image magnified by the objective lens, it can first introduce the sample rack with the sample fixed on it into the optical microscope stage by operating the robot and the tray docking assembly, and then observe the sample on the optical microscope stage through the objective lens on the optical microscope. Among them, when the present application imports the sample rack with fixed samples into the optical microscope stage through the operation robot and the tray docking assembly, the host computer can first send a sample rack transportation instruction to the operation robot. After receiving the instruction, the operation robot can transport the sample rack with fixed samples in the specified area to the tray docking assembly. Then, the host computer can determine the position of the sample rack according to the real-time data fed back by the operation robot. When it is determined that the sample rack has been transported to the tray docking assembly, the sample rack import instruction can be sent to the tray docking assembly. The instruction can include an import direction and an import speed, etc. After receiving the instruction, the tray docking assembly can slowly import the sample rack into the optical microscope stage according to the import direction and import speed contained in the instruction. In addition, a guide rail matching the sample rack can also be set in the optical microscope stage, so that the sample rack can be slid into the optical microscope stage through the guide rail, so as to reduce unnecessary shaking and maintain the stability of the import stroke.

[0073] Furthermore, after the present application imports the sample rack into the optical microscope stage through the tray docking assembly, in order to further ensure the stability of the sample rack during subsequent operations, the host computer can also send a sample rack locking instruction to the operating robot after receiving the import completion instruction sent by the tray docking assembly. After receiving the instruction, the operating robot can replace the gripper with a tray locking gripper, and use the tray locking gripper to lock the sample rack and the optical microscope stage. During this process, the host computer can send locking direction, locking angle and other information to the operating robot through the sample rack locking instruction, so that the operating robot can quickly lock according to the instruction.

[0074] In one embodiment, when the host computer is working, calling the external camera to image the real image magnified by the objective lens, analyzing the imaged light microscope picture, and driving the operating robot to adjust the sample stage on the sample rack according to the analysis result, may include:

[0075] When the host computer adjusts the height and level of the sample stage on the sample rack, it calls the external camera to image the real image magnified by the objective lens, and uses the first algorithm SDK to analyze the first optical microscope image after imaging, determines the type of sample stage on the sample rack, and drives the operating robot to adjust the sample stage according to the type of the sample stage.

[0076] In this embodiment, when the host computer calls the external camera to work, the external camera can image the real image obtained by magnifying the optical microscope objective lens. The real image can be a sample stage to be adjusted in height and level, a sample stage to be adjusted in angle, or a sample rack to be adjusted in height. The specific collection can be based on the actual working conditions and is not limited here.

[0077] When the host computer in the present application adjusts the sample stage on the sample rack, it indicates that the host computer has driven the operating robot to lock the sample rack on the optical microscope stage. At this time, the host computer calls the external camera to image the real image magnified by the objective lens, and the first optical microscope picture obtained after imaging is the sample rack loaded on the optical microscope stage, the sample stage on the sample rack, the sample fixed on the sample stage, and other parts on the sample rack except the sample stage, such as height-limiting blocking plates, Faraday cups, marks, etc. The host computer can call the first algorithm SDK to analyze the first optical microscope picture after imaging to determine the type of sample stage on the sample rack, and drive the operating robot to adjust the sample stage according to the type of sample stage, such as adjusting the height and level of the sample stage, so that the sample stage meets the preset height or level requirements.

[0078] Among them, the first algorithm SDK called by the host computer in this application can be an existing image recognition algorithm, or it can be an image recognition algorithm adjusted according to the type of laboratory sample rack. The specific setting can be based on actual conditions and is not limited here.

[0079] In one embodiment, the process in which the host computer drives the operating robot to adjust the sample stage according to the type of the sample stage may include:

[0080] When the host computer determines that the sample stage is of the press type, it drives the operating robot to adjust the height and level of the sample stage using the press type calibration method.

[0081] When the host computer determines that the sample stage is a knob type, it drives the operating robot to adjust the height and level of the sample stage using the knob type calibration method.

[0082] In this embodiment, Figure 5 , 6 As shown, Figure 5This is a schematic diagram of the structure of the press-type sample stage provided in the embodiment of the present application. Figure 6 A schematic diagram of the structure of a knob-type sample stage provided in an embodiment of the present application. When the host computer in the present application analyzes the first optical microscope image after imaging through the first algorithm SDK and determines that the sample stage type on the sample rack is a press-type, the operating robot can be driven to use a press-type calibration method to adjust the height and level of the sample stage; when the host computer analyzes the first optical microscope image after imaging through the first algorithm SDK and determines that the sample stage type on the sample rack is a knob-type, the operating robot can be driven to use a knob-type calibration method to adjust the height and level of the sample stage.

[0083] For example, if Figure 5 As shown, when the sample stage type of the present application is a press type, the height of the sample stage can be adjusted by inserting an isolation sheet at the lower end of the height limiting blocking sheet, such as Figure 6 As shown, when the sample stage type of the present application is a knob type, the height of the sample stage can be adjusted by adjusting the height of the bolts on the height limiting blocking piece; the above-mentioned height limiting blocking piece is set at the edge of the sample stage, and the number of the height limiting blocking pieces can be set to three. The specific process of adjusting the three height limiting blocking pieces to change the horizontal height of the sample stage is as follows:

[0084] When the sample stage type of the present application is a press type, the host computer can drive the operating robot to press down the sample stage, place isolation plates under the three height-limiting blocking plates, and then slowly bounce up the sample stage, thereby adjusting the height and level of the sample stage.

[0085] In the above process, the first light microscopy image after imaging can be obtained by an external camera, and the first light microscopy image after imaging can be used to analyze whether the upper surface of the sample and the top of the height limit blocking piece of the sample stage are in the same horizontal plane; or a laser altimeter or other height detector can be arranged on the operating robot to obtain the initial inclination angle of the sample stage to determine whether the upper surface of the sample and the top of the height limit blocking piece of the sample stage are in the same horizontal plane.

[0086] When the sample stage type of the present application is a knob type, the upper computer can send a horizontal correction instruction to the operating robot based on the height of at least three marked positions of the sample detected by the laser altimeter. After receiving the instruction, the operating robot can use the 1cm and 2cm silicon wafer height adjustment claws to twist the bolts of the height limit blocking plate to make the upper surface of the sample and the top of the height limit blocking plate of the sample stage in the same horizontal plane. Among them, the laser altimeter can be connected to the terminal device for communication, and the number of turns of the bolt required to be turned in the horizontal correction instruction is determined according to the height of the sample marked position detected by the laser altimeter, and the correction is stopped when the height of the three marked positions of the sample obtained by the laser altimeter are all 0.

[0087] In one embodiment, when the host computer is working, calling the external camera to image the real image magnified by the objective lens, analyzing the imaged light microscope picture, and driving the operating robot to adjust the sample stage on the sample rack according to the analysis result, may include:

[0088] When the host computer adjusts the angle of the sample stage on the sample rack, it calls the external camera to image the real image magnified by the objective lens, and uses the second algorithm SDK to analyze the second optical microscope picture after imaging, determines the angle information of the sample on the sample stage in the second optical microscope picture after imaging, and drives the operating robot to adjust the angle of the sample stage according to the angle information.

[0089] In this embodiment, the host computer can not only adjust the height and level of one or more sample stages on the sample rack, but also adjust their angles. When the host computer adjusts the angle of the sample stage, it can call an external camera to image the real image magnified by the objective lens. At this time, the second optical microscope picture after imaging is the sample rack whose sample stage angle is to be adjusted. The host computer can use the second algorithm SDK to analyze the second optical microscope picture after imaging to determine the angle information of the sample on the sample stage in the second optical microscope picture after imaging, and drive the operating robot to adjust the angle of the sample stage according to the angle information so that the edge of the sample is orthogonal to the objective lens picture.

[0090] The second algorithm SDK here can be an existing image threshold segmentation algorithm, or an image threshold segmentation algorithm adjusted according to the type of laboratory sample rack. The specific setting can be based on actual conditions and is not limited here.

[0091] In one embodiment, the process of the host computer driving the operating robot to adjust the sample stage according to the angle information may include:

[0092] The host computer determines the rotation angle and rotation direction when the edge of the sample is orthogonal to the imaged second optical microscope image based on the angle information, and drives the operating robot to rotate the sample stage according to the rotation angle and the rotation direction.

[0093] In this embodiment, Figure 7 As shown, Figure 7 Schematic diagram of the second optical microscope image after the external camera provided in the embodiment of the present application forms an image of the real image magnified by the objective lens. It can be understood that the angle of the sample on the sample stage in the present application varies according to the placement position of the sample stage in the sample holder. Figure 7As shown, the host computer can capture the edge of the sample through the image threshold segmentation algorithm, calculate the angle between it and the orthogonal axis of the second optical microscope image (i.e., the X-axis and Y-axis, which are equivalent to the eyepiece scale), and then determine the angle information that needs to be adjusted, such as the rotation angle and rotation direction. Through the angle information, the host computer can send a sample stage plane rotation adjustment instruction to the operating robot, instructing it to rotate the sample stage clockwise / counterclockwise until the edge of the sample is orthogonal to the objective lens image, thereby effectively improving the accuracy of subsequent electron beam exposure.

[0094] In one embodiment, when the host computer is working, calling the external camera to image the real image magnified by the objective lens, analyzing the imaged light microscope picture, driving the adjustment component to adjust the sample holder on the light microscope stage according to the analysis result, and controlling the operating robot to perform zeroing operation on the XY axis of the electron beam exposure device, may include:

[0095] When the host computer adjusts the plane reference coordinates of the electron beam exposure device, it calls the external camera to image the real image magnified by the objective lens, and uses the third algorithm SDK to analyze the third optical microscope picture after imaging, and then determines the position information of the Faraday cup on the sample holder in the third optical microscope picture after imaging, and drives the adjustment component to adjust the sample holder according to the position information, and then controls the operating robot to perform a zeroing operation on the XY axis of the electron beam exposure device.

[0096] In this embodiment, the host computer can not only adjust the height and level of one or more sample stages on the sample rack, or adjust the angle of the sample stage, but also adjust the plane reference coordinates of the electron beam exposure device. When the host computer adjusts the plane reference coordinates of the electron beam exposure device, it can be adjusted through the positioning marks on the sample rack.

[0097] For example, the Faraday cup is a mark on the sample rack for plane position calibration. There is only one on a specific sample rack, and it is in a fixed position. It is usually a black round object when observed through the eyepiece. Therefore, in this application, after the host computer calls the external camera to image the real image obtained by magnifying the objective lens, and uses the third algorithm SDK to analyze the third optical microscope picture after imaging, it can determine the position information of the Faraday cup on the sample rack in the third optical microscope picture after imaging, and after driving the adjustment component to adjust the sample rack according to the position information, the control operation robot performs zeroing operation on the XY axis of the electron beam exposure device.

[0098] Among them, the above-mentioned third algorithm SDK can be the existing image clarity recognition algorithm and contour recognition algorithm, or it can be the image clarity recognition algorithm and contour recognition algorithm adjusted according to the shape and position of the Faraday cup, or other recognition algorithms. The specific setting can be based on actual conditions and is not limited here.

[0099] In a specific implementation, Figure 8 , 9 As shown, Figure 8 A schematic diagram of a process of focusing a picture using an image clarity recognition algorithm provided in an embodiment of the present application, Fig. 9 A schematic diagram of the process of calling the contour recognition algorithm to perform contour recognition on the Faraday cup provided in an embodiment of the present application; Figure 8 , Fig. 9 It can be seen that the host computer of the present application can first use the image clarity recognition algorithm to identify the focus status of the picture under the objective lens screen. The algorithm will output a normalized VAR value for clarity evaluation (the value is positively correlated with the clarity), so as to gradually adjust the focus to a clearer state; then, the host computer can call the contour recognition algorithm to identify the contour of the Faraday cup, obtain the position coordinates, form the position information and send it to the adjustment component, so as to control the adjustment component to adjust the plane position until the target is roughly located in the center of the picture.

[0100] In one embodiment, the adjustment component may include an X-axis automatic adjustment component and a Y-axis automatic adjustment component.

[0101] After the host computer drives the adjustment component to adjust the sample holder according to the position information, the process of controlling the operation robot to perform a zeroing operation on the XY axis of the electron beam exposure device may include:

[0102] The host computer determines, according to the position information, an X-axis moving distance and a Y-axis moving distance when the Faraday cup is located at the center of the scale of the third optical mirror image after imaging.

[0103] After the host computer drives the X-axis automatic adjustment component to adjust the distance of the sample holder in the X-axis direction according to the X-axis moving distance, the host computer controls the operating robot to perform a zeroing operation on the X-axis of the electron beam exposure device.

[0104] After the host computer drives the Y-axis automatic adjustment component to adjust the distance of the sample holder in the Y-axis direction according to the Y-axis moving distance, the host computer controls the operating robot to perform a zeroing operation on the Y-axis of the electron beam exposure device.

[0105] In this embodiment, when the host computer adjusts the plane reference coordinates of the electron beam exposure device, the adjustment can be made through the positioning marks on the sample holder. Specifically, in this application, the host computer can determine the X-axis moving distance and the Y-axis moving distance when the Faraday cup is located at the center of the scale of the third optical microscope image after imaging according to the position information, and then adjust the sample holder according to the X-axis moving distance and the Y-axis moving distance.

[0106] Among them, when the host computer of the present application drives the adjustment component to adjust the sample holder according to the position information, and controls the operation robot to perform the zeroing operation on the XY axis of the electron beam exposure device, such as Fig.10 As shown, Fig.10 A schematic diagram of the positional relationship between various adjustment components and the optical microscope and the optical microscope stage provided in the embodiment of the present application; Fig.10 In the present application, the adjustment component may include an X-axis automatic adjustment component and a Y-axis automatic adjustment component, and the X-axis automatic adjustment component may be composed of a linear motor and two sets of piezoelectric preload brakes. The linear motor has a repeatability accuracy of ±0.002 (mm), and the C5 type piezoelectric preload brake has a closed-loop resolution of 1.08um. In the present application, Fig.11 As shown, Fig.11 Schematic diagram of the positional relationship between the X-axis automatic adjustment component and other devices on the optical microscope stage provided in the embodiment of the present application; the upper computer can determine the X-axis movement distance and Y-axis movement distance when the Faraday cup is in the center of the scale of the third optical microscope screen after imaging based on the position information, and then drive the linear motor to push the X-axis for rough positioning based on the X-axis movement distance, and then further drive the C5 piezoelectric pre-load brakes at both ends of the linear motor to accurately position and adjust the position of the X-axis.

[0107] Furthermore, the Y-axis automatic adjustment assembly in the present application can be composed of two sets of linear motors and two sets of piezoelectric preload brakes. The linear motor repeatability is ±0.002 (mm), and the C5 type piezoelectric preload brake closed-loop resolution is 1.08um. Fig.12 As shown, Fig.12 Schematic diagram of the positional relationship between the Y-axis automatic adjustment component and other devices on the optical microscope stage provided in the embodiment of the present application; in the present application, the host computer can use the linear motor to push the Y-axis sideways for rough positioning, and then use the C5-type piezoelectric preload brakes at both ends of the linear motor to accurately position and adjust the position of the Y-axis. After the adjustment of the two is completed, the host computer can also control the operating robot to return the XY axis of the electron beam exposure equipment to zero.

[0108] In one embodiment, when the host computer is working, calling the external camera to image the real image magnified by the objective lens, analyzing the imaged optical microscope picture, driving the adjustment component to adjust the optical microscope according to the analysis result, and controlling the operating robot to perform a zeroing operation on the Z axis of the electron beam exposure device, may include:

[0109] When the host computer adjusts the Z-axis reference coordinate of the electron beam exposure device, it calls the external camera to image the real image magnified by the objective lens, and uses the fourth algorithm SDK to analyze the fourth optical microscope picture after imaging, determines the clarity of the mark on the sample holder in the fourth optical microscope picture after imaging, and drives the adjustment component to adjust the optical microscope according to the clarity, and then controls the operating robot to perform a zeroing operation on the Z-axis of the electron beam exposure device.

[0110] In this embodiment, after adjusting the XY axis coordinates of the electron beam exposure equipment, the host computer can also adjust the Z axis reference coordinates. During the adjustment, the host computer can call an external camera to image the real image obtained by magnifying the objective lens, and use the fourth algorithm SDK to analyze the fourth optical microscope picture after imaging, and determine the clarity of the positioning mark on the sample holder in the fourth optical microscope picture after imaging, so as to drive the adjustment component to adjust the optical microscope to adjust the height of the sample holder.

[0111] Among them, the mark in this application is the same as the Faraday cup on the sample stage, with only one location, and is usually located in the upper right position of the Faraday cup. When the mark of the designated area is observed under the eyepiece and adjusted to be clear, the current sample stage height can be regarded as the Z-axis reference coordinate. At this time, the robot can be controlled to click the "Zo" button on the touch screen of the device to return the Z axis to zero and record the coordinate information of each mark in the picture, so as to accurately locate the sample.

[0112] The fourth algorithm SDK mentioned above can be an existing image clarity recognition algorithm, or an image clarity recognition algorithm adjusted according to the shape and position of the mark, or other recognition algorithms. The specific setting can be based on actual conditions and is not limited here.

[0113] In one embodiment, the adjustment assembly may further include a large knob adjustment assembly and a small knob adjustment assembly.

[0114] After the host computer drives the adjustment component to adjust the optical microscope according to the definition, the process of controlling the operating robot to perform a zeroing operation on the Z axis of the electron beam exposure device may include:

[0115] The host computer determines the focusing data when the mark reaches a preset clarity threshold according to the clarity, and drives the large knob adjustment component to adjust the coarse adjustment knob on the optical microscope according to the focusing data, and drives the small knob adjustment component to adjust the fine adjustment knob on the optical microscope to adjust the height of the sample holder, and controls the operating robot to perform zeroing operation on the Z axis of the electron beam exposure equipment.

[0116] In this embodiment, Fig.10 As shown, the adjustment component of the present application may include not only an X-axis automatic adjustment component and a Y-axis automatic adjustment component, but also a large knob adjustment component and a small knob adjustment component. When the upper computer adjusts the optical microscope according to the clarity drive adjustment component, it can first adjust the sample holder height to make the mark clear to complete the focusing work, and return the Z-axis coordinate to zero; as mentioned above, the upper computer of the present application can call the image clarity recognition algorithm to identify the clarity of the mark, and output the VAR value to evaluate the clarity. Therefore, the focusing process can refer to the above, and the next action is determined by comparing the clarity of the two focusing adjustments before and after; in addition, the present application can also pre-set the clarity threshold. When the VAR value is greater than the threshold, it is considered that the clarity meets the standard and exits the focusing process; the above process is applicable to coarse adjustment and fine adjustment; after the focus adjustment is completed, the upper computer can control the operating robot to return the Z axis to zero, so as to use the current sample holder height as the Z-axis reference coordinate.

[0117] Furthermore, if Fig.13 As shown, Fig.13 A schematic diagram of the structure of the large and small knob adjustment components provided in the embodiment of the present application; the large knob adjustment component and the small knob adjustment component of the present application have similar components and are both composed of an electric module, a servo rotary motor, a synchronous belt drive, a spring floating head, and a knob adjustment tool. After the electric module pushes the servo rotary motor into place, the servo rotary motor can drive the synchronous belt drive to drive the knob adjustment tool to adjust the large and small knobs. The mechanism prevents the knob adjustment tool from over-pressing the knob through the spring floating head. The soft rubber on the surface of the tool can prevent the knob from being scratched. The servo rotary motor can monitor the torque to prevent the knob from being damaged by over-twisting. The knob adjustment tool achieves the effect of adjusting the coarse adjustment knob and fine adjustment knob of the optical microscope by turning the end faces of the large and small knobs.

[0118] In one embodiment, after the host computer controls the operating robot to perform a zeroing operation on the XYZ axes of the electron beam exposure device, it may also perform the following operations:

[0119] The external camera is called to image the real image magnified by the objective lens, and the fifth algorithm SDK is used to analyze the fifth optical microscope picture after imaging, to determine the position coordinates of all the marks around the sample on the sample rack, and the position coordinates are saved.

[0120] In this embodiment, after the present application adjusts the height, angle, level, etc. of the sample holder and the sample stage, and controls the operating robot to perform zeroing operation on the XYZ axis of the electron beam exposure equipment, the present application can also call an external camera to image the real image obtained by magnifying the objective lens, and use the fifth algorithm SDK to analyze the fifth optical microscope image after imaging, determine the position coordinates of all mark marks on the sample holder around the sample, and save the position coordinates so as to position the sample during subsequent electron beam exposure to accurately control the exposure of the electron beam at different positions.

[0121] It can be understood that the above-mentioned requirements of this application all involve the premise of placing the target object under the objective lens. From the known information, the absolute positions of the targets on different sample stages and the relative positions of the targets in this application are basically fixed. In this application, there is a certain business logic relationship between the requirements, so the host computer can achieve this goal based on the above-mentioned position information.

[0122] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0123] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The various embodiments can be combined as needed, and the same or similar parts can refer to each other.

[0124] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An automatic adjustment system for electron beam exposure equipment, characterized in that: The system includes a host computer, an external camera, a light microscope stage, an adjustment component arranged on the light microscope stage, and an operating robot arranged on one side of the light microscope stage; The optical microscope and the optical microscope stage of the electron beam exposure device are arranged on the optical microscope stage, the optical microscope stage is used to load a sample rack with a sample fixed thereon, the adjustment component and the operating robot are arranged around the optical microscope, the lens of the external camera is docked with the objective lens of the optical microscope, and the input and output ends of the host computer are respectively connected to the external camera, the adjustment component and the operating robot; When the host computer is working, the external camera is called to image the real image magnified by the objective lens, and after analyzing the imaged light microscope picture, the adjustment component or the operating robot is driven according to the analysis result to adjust the sample rack on the light microscope stage, the sample stage on the sample rack, and the optical microscope, and the operating robot is controlled to perform a zeroing operation on the XYZ axis of the electron beam exposure equipment to adjust the sample on the sample stage.

2. The automatic adjustment system for electron beam exposure equipment according to claim 1, characterized in that: The system further comprises: a tray docking assembly disposed between the optical microscope stage and the operating robot, the tray docking assembly being disposed opposite to the optical microscope stage; Before the host computer calls the external camera to image the real image magnified by the objective lens, the following operations are also performed: Sending a sample rack transport instruction to the operating robot to drive the operating robot to transport the sample rack with samples fixed in the designated area to the tray docking assembly; Sending a sample rack import instruction to the tray docking assembly to drive the tray docking assembly to import the sample rack into the optical microscope stage; A sample rack locking instruction is sent to the operating robot to drive the operating robot to lock the sample rack and the optical microscope stage.

3. The automatic adjustment system for electron beam exposure equipment according to claim 1 or 2, characterized in that: When the host computer is working, the external camera is called to image the real image magnified by the objective lens, and after analyzing the imaged light microscope picture, the operating robot is driven to adjust the sample stage on the sample rack according to the analysis result, including: When the host computer adjusts the sample stage on the sample rack, it calls the external camera to image the real image magnified by the objective lens, and uses the first algorithm SDK to analyze the first optical microscope image after imaging, determines the type of sample stage on the sample rack, and drives the operating robot to adjust the sample stage according to the type of the sample stage.

4. The automatic adjustment system for electron beam exposure equipment according to claim 3, characterized in that: The process in which the host computer drives the operating robot to adjust the sample stage according to the type of the sample stage includes: When the host computer determines that the sample stage is of a press type, the host computer drives the operating robot to adjust the height and level of the sample stage using the press type calibration method; When the host computer determines that the sample stage is a knob type, it drives the operating robot to adjust the height and level of the sample stage using the knob type calibration method.

5. The automatic adjustment system for electron beam exposure equipment according to claim 1 or 2, characterized in that: When the host computer is working, the external camera is called to image the real image magnified by the objective lens, and after analyzing the imaged light microscope picture, the operating robot is driven to adjust the sample stage on the sample rack according to the analysis result, including: When the host computer adjusts the angle of the sample stage on the sample rack, it calls the external camera to image the real image magnified by the objective lens, and uses the second algorithm SDK to analyze the second optical microscope picture after imaging, determines the angle information of the sample on the sample stage in the second optical microscope picture after imaging, and drives the operating robot to adjust the angle of the sample stage according to the angle information.

6. The automatic adjustment system for electron beam exposure equipment according to claim 5, characterized in that: The process in which the host computer drives the operating robot to adjust the sample stage according to the angle information includes: The host computer determines the rotation angle and rotation direction when the edge of the sample is orthogonal to the imaged second optical microscope image based on the angle information, and drives the operating robot to rotate the sample stage according to the rotation angle and the rotation direction.

7. The automatic adjustment system for electron beam exposure equipment according to claim 1 or 2, characterized in that: When the host computer is working, the external camera is called to image the real image magnified by the objective lens, and after analyzing the imaged light microscope picture, the adjustment component is driven to adjust the sample holder on the light microscope stage according to the analysis result, and the operating robot is controlled to perform zeroing operation on the XY axis of the electron beam exposure device, including: When the host computer adjusts the plane reference coordinates of the electron beam exposure device, it calls the external camera to image the real image magnified by the objective lens, and uses the third algorithm SDK to analyze the third optical microscope picture after imaging, and then determines the position information of the Faraday cup on the sample holder in the third optical microscope picture after imaging, and drives the adjustment component to adjust the sample holder according to the position information, and then controls the operating robot to perform a zeroing operation on the XY axis of the electron beam exposure device.

8. The automatic adjustment system for electron beam exposure equipment according to claim 7, characterized in that: The adjustment component includes an X-axis automatic adjustment component and a Y-axis automatic adjustment component; After the host computer drives the adjustment component to adjust the sample holder according to the position information, the process of controlling the operating robot to perform a zeroing operation on the XY axis of the electron beam exposure device includes: The host computer determines, according to the position information, an X-axis moving distance and a Y-axis moving distance when the Faraday cup is located at the center of the scale of the third optical mirror image after imaging; After the host computer drives the X-axis automatic adjustment component to adjust the distance of the sample holder in the X-axis direction according to the X-axis moving distance, the host computer controls the operating robot to perform a zeroing operation on the X-axis of the electron beam exposure device; After the host computer drives the Y-axis automatic adjustment component to adjust the distance of the sample holder in the Y-axis direction according to the Y-axis moving distance, the host computer controls the operating robot to perform a zeroing operation on the Y-axis of the electron beam exposure device.

9. The automatic adjustment system for electron beam exposure equipment according to claim 1 or 2, characterized in that: When the host computer is working, the external camera is called to image the real image magnified by the objective lens, and after analyzing the imaged optical microscope picture, the adjustment component is driven to adjust the optical microscope according to the analysis result, and the operating robot is controlled to perform a zeroing operation on the Z axis of the electron beam exposure device, including: When the host computer adjusts the Z-axis reference coordinate of the electron beam exposure device, it calls the external camera to image the real image magnified by the objective lens, and uses the fourth algorithm SDK to analyze the fourth optical microscope picture after imaging, determines the clarity of the mark on the sample holder in the fourth optical microscope picture after imaging, and drives the adjustment component to adjust the optical microscope according to the clarity, and then controls the operating robot to perform a zeroing operation on the Z-axis of the electron beam exposure device.

10. The automatic adjustment system for electron beam exposure equipment according to claim 9, characterized in that: The adjustment assembly also includes a large knob adjustment assembly and a small knob adjustment assembly; After the host computer drives the adjustment component to adjust the optical microscope according to the clarity, the process of controlling the operating robot to perform a zeroing operation on the Z axis of the electron beam exposure device includes: The host computer determines the focusing data when the mark reaches a preset clarity threshold according to the clarity, and drives the large knob adjustment component to adjust the coarse adjustment knob on the optical microscope according to the focusing data, and drives the small knob adjustment component to adjust the fine adjustment knob on the optical microscope to adjust the height of the sample holder, and controls the operating robot to perform zeroing operation on the Z axis of the electron beam exposure equipment.

11. The automatic adjustment system for electron beam exposure equipment according to claim 1 or 2, characterized in that: After the host computer controls the operating robot to perform a zeroing operation on the XYZ axes of the electron beam exposure device, the host computer further performs the following operations: The external camera is called to image the real image magnified by the objective lens, and the fifth algorithm SDK is used to analyze the fifth optical microscope picture after imaging, to determine the position coordinates of all the marks around the sample on the sample rack, and the position coordinates are saved.

Images