Case heat dissipation structure and electronic equipment

Abstract

The invention discloses a case heat dissipation structure and electronic equipment. The case heat dissipation structure comprises a case frame, and a cavity is formed in the case frame; the heat dissipation fins are arranged on the case frame in a matrix manner; the rear cover plate is arranged at the rear end of the case frame; the front panel assembly is arranged at the front end of the case frame; the fairing is arranged on the frame in a sleeving manner; the board card module is arranged in the case frame; the exhaust fan is arranged in the case frame; and the corrugated plate is inserted into the case frame. Wherein the air draft fan draws air flow to flow from the bottom to the top of the case frame to flow out, and the air flow continuously moves heat of the corrugated plate and the heat dissipation fins out of the case to dissipate heat of the board card module. The air duct is arranged in the middle of the case, so that the board card module and the case frame directly conduct heat, the heat conduction area is large, and the heat transfer resistance is reduced; and a plurality of air ducts are arranged in the case size, so that the heat dissipation efficiency of the whole machine is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of mechanical manufacturing and chassis heat dissipation, and in particular to a chassis heat dissipation structure and electronic equipment. Background Art

[0002] A traditional computer chassis is usually composed of upper and lower covers, left and right side panels, front and rear covers, and internal boards, which are fastened with screws. It has a large number of parts and many seams, and places high demands on the sealing design.

[0003] The current chassis design is not easy to achieve heat dissipation of high-power modules while being sealed; while meeting the heat dissipation requirements of the modules, the chassis needs to be connected to the outside environment for ventilation and heat dissipation through fans; it is very difficult to take into account both sealing and heat dissipation of high-power modules. Water-cooled chassis can take into account both sealing and heat dissipation, but they have poor reliability, require external water supply, and have high maintenance costs. For traditional sealed air-cooled chassis, the air duct is generally arranged on the outside of the chassis, and the heat dissipation area of ​​the multiple board modules arranged inside the chassis connected to the air duct is very small, making it difficult to achieve efficient heat dissipation.

[0004] In summary, there is at least one of the following technical problems:

[0005] It is difficult to dissipate heat for high-power modules under the premise of sealing;

[0006] A water-cooled chassis can take into account both sealing and heat dissipation, but it has poor reliability, requires an external water source, and has high maintenance costs.

[0007] For a traditional sealed air-cooled chassis, the air duct is generally arranged on the outside of the chassis, and the heat dissipation area of ​​the multiple board modules arranged inside the chassis connected to the air duct is very small, making it difficult to achieve efficient heat dissipation. Summary of the invention

[0008] The main purpose of the present invention is to provide a chassis heat dissipation structure, electronic equipment and use method thereof, so as to solve the problem that it is difficult to dissipate heat of high-power modules under the premise of sealing in the prior art; a water-cooled chassis can take into account both sealing and heat dissipation, but has poor reliability, requires an external water source, and has a high maintenance cost. For a traditional sealed air-cooled chassis, the air duct is generally arranged on the outside of the chassis, and the heat dissipation area of ​​the multiple board modules arranged inside the chassis connected to the air duct is very small, making it difficult to achieve at least one technical problem of efficient heat dissipation.

[0009] In order to achieve the above object, according to one aspect of the present invention, a chassis heat dissipation structure is provided, comprising:

[0010] A chassis frame, wherein a cavity is provided in the chassis frame;

[0011] Heat dissipation fins, which are arranged in a matrix on the chassis frame;

[0012] A rear cover plate, the rear cover plate being arranged at the rear end of the chassis frame;

[0013] A front panel, wherein the front panel assembly is arranged at the front end of the chassis frame;

[0014] A deflector cover, wherein the deflector cover is sleeved on the frame;

[0015] A board module, wherein the board module is arranged in a chassis frame;

[0016] An exhaust fan, wherein the exhaust fan is arranged in the chassis frame;

[0017] A corrugated plate is inserted into the chassis frame.

[0018] The exhaust fan draws air from the bottom of the chassis frame to the top, and the airflow continuously removes the heat of the corrugated plate and the heat dissipation fins out of the chassis to dissipate the heat of the board module.

[0019] Preferably, the chassis frame comprises:

[0020] Frame structure;

[0021] The threaded hole is arranged on the frame structure and is used for installing the front panel assembly, the rear cover plate, the air guide cover and the exhaust fan.

[0022] A sealing groove, wherein the sealing groove is arranged on a side of the frame structure;

[0023] A boss is arranged in the frame structure to form a locking strip.

[0024] Preferably, it also includes a puller, which is arranged on the front panel and includes:

[0025] handle;

[0026] Bases, the bases are arranged in pairs, and a pair of bases are respectively arranged at two ends of the handle;

[0027] Axles, the axles are arranged in pairs, and a pair of axles are respectively arranged at two ends of the handle;

[0028] A copper sleeve is arranged on the shaft.

[0029] Preferably, the top of the air guide cover is provided with fan ventilation holes corresponding to the exhaust fan, and the air guide cover is provided with side ventilation holes on both sides near the top.

[0030] Preferably, the board module is fixed inside the chassis frame via a locking strip.

[0031] Preferably, the heat dissipation fins are arranged on the top and both sides of the chassis frame.

[0032] Preferably, the corrugated plate is welded at the middle position of the chassis frame.

[0033] Preferably, the board module includes a high-power board module and a low-power board module. The high-power board module is placed on both sides of the inner wall of the cavity. The heat transfer path of the high-power board module is to pass through the chip, thermal silicon pad, board housing, heat spreader, inner wall of the chassis frame, corrugated plate and air duct in sequence; the heat transfer path of the low-power board module is to pass through the chip, thermal silicon pad, board housing, heat spreader, chassis frame, heat sink and air duct in sequence.

[0034] The present invention further provides an electronic device, comprising a board module, wherein the board module is arranged in a chassis heat dissipation structure.

[0035] According to another aspect of the present invention, a method for using a chassis heat dissipation structure is provided, comprising: an exhaust fan draws air from the cavity to flow from the bottom to the top of the chassis frame and out from the fan vents, and a portion of the air flows to both sides of the top of the chassis frame under the guidance of the air guide cover and then flows out through the side vents, thereby forming an air duct; through the action of the airflow in the air duct, the heat conducted to the corrugated plate and the heat dissipation fins in the cavity is continuously moved out of the chassis, thereby effectively dissipating the heat of the board module.

[0036] The application of the technical solution of the present invention has the following technical effects:

[0037] The present invention achieves heat dissipation for high-power board modules in a sealed chassis, reduces the number of parts of the whole machine by designing the chassis frame, and makes sealing easy to achieve; the introduction of corrugated plates greatly increases the heat dissipation area in a limited space, improves the heat transfer efficiency of the high-power board modules, and the use of heat spreaders avoids excessive local temperature rise of the board; an air duct is arranged in the middle of the chassis so that a high-power board can directly conduct heat to the chassis frame, with a large heat conduction area and reduced heat transfer thermal resistance; multiple air ducts can be arranged under the condition that the chassis size allows, thereby improving the heat dissipation efficiency of the whole machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0039] Figure 1 A schematic diagram of the structure of the chassis heat dissipation structure according to the present invention is shown;

[0040] Figure 2 Shows Figure 1 A first structural view of a sealed chassis chassis frame of a chassis heat dissipation structure;

[0041] Figure 3 Shows Figure 1A second structural view of a sealed chassis chassis frame of the chassis heat dissipation structure;

[0042] Figure 4 Shows Figure 1 A view of the sealed chassis air shroud structure of the chassis heat dissipation structure;

[0043] Figure 5 Shows Figure 1 A view of the structure of the extractor for the chassis heat dissipation structure;

[0044] Figure 6 Shows Figure 1 Schematic view of the air duct of the chassis heat dissipation structure;

[0045] Figure 7 Shows Figure 1 A view of the extractor handle of the chassis heat dissipation structure;

[0046] Figure 8 Shows Figure 1 The working principle diagram of the extractor of the chassis heat dissipation structure;

[0047] Fig. 9 Shows Figure 1 The working process of removing and installing the extractor of the chassis heat dissipation structure in the front panel is shown in the status Ⅰ view;

[0048] Fig.10 Shows Figure 1 The chassis heat dissipation structure's puller dismantles the front panel working process status II view.

[0049] The above drawings include the following reference numerals:

[0050] Chassis frame 1; heat sink fin 101; threaded hole 102; sealing groove 103; boss 104; cavity 105; front panel assembly 2; rear cover 3; corrugated plate 4; air guide cover 5; side vent 501; fan vent 502; board module 6; exhaust fan 7; extractor 8; copper sleeve 801; handle 802; base 803; shaft 804. DETAILED DESCRIPTION

[0051] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0052] like Figures 1 to 10As shown, an embodiment of the present invention provides a chassis heat dissipation structure, including: a chassis frame 1; heat dissipation fins 101, which are arranged in a matrix on the chassis frame 1; a rear cover plate 3, which is arranged at the rear end of the chassis frame 1; a front panel, which is arranged at the front end of the chassis frame 1; a shroud 5, which is sleeved on the frame; a board module 6, which is arranged in the chassis frame 1; an exhaust fan 7, which is arranged in the chassis frame 1; and a corrugated plate 4, which is inserted in the chassis frame 1. The exhaust fan 7 draws airflow from the bottom of the chassis frame 1 to the top, and the airflow continuously removes the heat of the corrugated plate 4 and the heat dissipation fins 101 out of the chassis to dissipate the heat of the board module 6.

[0053] The chassis structure of the present invention includes a chassis frame 1, a front panel assembly 2, a rear cover 3, a corrugated plate 4, an air guide 5, a card module 6, an exhaust fan 7 and an extractor 8. The front panel and the rear cover 3 are fixed to the chassis frame 1 by screws, the corrugated plate 4 is welded to the middle of the chassis frame 1, the air guide 5 is fixed to both sides of the chassis frame 1 by screws, the card module 6 is fixed to the inside of the chassis frame 1 by a locking strip, and two exhaust fans 7 are fixed to the upper side of the chassis frame 1 by screws. Specifically, the chassis frame 1 structure is as follows Figure 2 , Figure 3 As shown. The chassis frame 1 is designed with heat dissipation fins 101 on the top and left and right positions to increase the heat dissipation area of ​​the whole machine; the threaded holes 102 are used to install the front panel assembly 2, the rear cover 3, the air guide 5 and the exhaust fan 7; the sealing groove 103 cooperates with the front panel assembly 2, the rear cover 3 and the sealing strip to achieve the sealing of the whole machine; the boss 104 cooperates with the board module 6 to achieve the installation and fixation of the board module 6, and also has the function of guiding and heat dissipation; the cavity 105 is used to install the corrugated plate 4, and is also the space where the air duct is located.

[0054] In this embodiment, the chassis frame 1 plays a supporting role, and a cavity 105 is provided in the chassis frame 1; the chassis frame 1 includes: a frame structure; heat dissipation fins 101, which are arranged in a matrix on the frame structure; the heat dissipation fins 101 are arranged on the top and both sides of the chassis frame 1. Threaded holes 102, which are arranged on the frame structure, and are used to install the front panel assembly 2, the rear cover plate 3, the air guide cover 5 and the exhaust fan 7. Sealing groove 103, which is arranged on the side of the frame structure; boss 104, which is arranged in the frame structure to form a locking strip. The sealing groove 103 on the chassis frame 1 is combined with the sealing strip and the front panel assembly 2 and the rear cover plate 3 to achieve the sealing of the whole machine. The sealing technology is mature, reliable and easy to implement. The rear cover plate 3 is arranged at the rear end of the chassis frame 1; the front panel assembly 2 is arranged at the front end of the chassis frame 1. The front cover plate and the rear cover plate 3 play a sealing role.

[0055] In this embodiment, the air deflector 5 is sleeved on the frame; the top of the air deflector 5 is provided with a fan vent 502 corresponding to the exhaust fan 7, and the air deflector 5 is provided with side vents 501 on both sides near the top. Specifically, the structure of the air deflector 5 is shown in the figure. The air deflector 5 is made of sheet metal, with side vents 501 designed on the left and right, and fan vents 502 designed on the top. The air deflector 5 is installed above the fan, which can protect the fan on the one hand, and guide the airflow direction on the other hand to reduce flow loss.

[0056] In this embodiment, the board module 6 is a board module, and the board module 6 is arranged in the chassis frame 1; the board module 6 is fixed inside the chassis frame 1 by a locking strip. The board module 6 includes a high-power board module 6 and a low-power board module 6, and the high-power board module 6 is placed on both sides of the inner wall of the cavity 105. The heat transfer path of the high-power board module 6 is sequentially through the chip, the thermal conductive silicon pad, the board shell, the heat plate, the inner wall of the chassis frame 1, the corrugated plate 4 and the air duct; the heat transfer path of the low-power board module 6 is sequentially through the chip, the thermal conductive silicon pad, the board shell, the heat plate, the chassis frame 1, the heat dissipation fin 101 and the air duct.

[0057] In this embodiment, the exhaust fan 7 is used to generate wind suction, and the exhaust fan 7 is arranged in the chassis frame 1; in this embodiment, the corrugated plate 4 is used to achieve heat dissipation, and the corrugated plate 4 is inserted in the chassis frame 1. The corrugated plate 4 is welded in the middle of the chassis frame 1. The exhaust fan 7 extracts airflow from the bottom of the chassis frame 1 to the top, and the airflow continuously removes the heat of the corrugated plate 4 and the heat dissipation fins 101 out of the chassis to dissipate heat for the board module 6.

[0058] In this embodiment, the puller 8 is arranged at the front panel, and the puller 8 includes: a handle 802; a base 803, the bases 803 are arranged in pairs, and a pair of bases 803 are respectively arranged at both ends of the handle 802; a shaft 804, the shaft 804 is arranged in pairs, and a pair of shafts 804 are respectively arranged at both ends of the handle 802; a copper sleeve 801, and the copper sleeve 801 is sleeved on the shaft 804. Specifically, the handle 802 of the puller 8 has a semicircular convex feature, as shown in FIG. Figure 7 The working principle of the puller 8 for disassembling the front panel is shown in Figure 8 As shown. Turn the handles 802 of the puller 8 on both sides of the front panel, and the semicircular protrusions of the handles 802 will be tangent to the end surface of the chassis frame 1 to form a reaction force, which will then drive the LRM connector to disengage from the plug connector, and realize the removal of the front panel assembly 2. Turn the front panel handles 802 in the opposite direction to install the front panel assembly 2 in place. The whole working process is shown in Fig. 9 and Fig.10 As shown. The structure of the puller 88 is as follows Figure 5 The extractor 8 is composed of a handle 802, two bases 803, two copper sleeves 801, two shafts 804 and a plurality of screws and nuts.

[0059] The present invention maximizes the effective heat dissipation area of ​​the board and solves the heat dissipation problem of the high-power consumption module through the reasonable layout of the board and the design of the air duct; adopts a mature and reliable air-cooling heat dissipation solution; the chassis frame 1 is welded and formed in an integrated manner to reduce the number of joints and parts, reduce the difficulty of sealing design and the complexity of assembly; and designs a puller 8 fixed to the front panel of the chassis to facilitate the disassembly and assembly of the front panel.

[0060] In this embodiment, the air duct schematic diagram is as follows Figure 6 As shown. The exhaust fan 7 works to extract the airflow from the cavity 105 from the bottom to the top of the chassis frame 1 and flows out from the fan vents 502; another part of the airflow flows to the two sides of the top of the chassis frame 1 due to the guide effect of the air guide cover 5, and then flows out through the vents, thus forming an air duct. In this process, the heat conducted to the corrugated plate 4 and the heat dissipation fins 101 in the cavity 105 is continuously moved out of the chassis, thereby achieving effective heat dissipation of high-power boards.

[0061] In this embodiment, the chassis has a total of seven boards, and the three boards with the largest power consumption are arranged on both sides of the inner wall of the cavity 105. The main heat transfer path of the high-power board is chip-thermal silicon pad-board shell-heat plate-inner wall of the chassis frame 1-corrugated plate 4-air. The remaining boards are distributed on the outside of the chassis frame 1, and their main heat transfer paths are chip-thermal silicon pad-board shell-heat plate-chassis frame 1 heat sink fin 101-air. Boards with different power consumption are arranged in different positions of the chassis, and different heat transfer paths are designed to ensure that all high-power consumption board modules 6 operate stably and reliably.

[0062] The present invention further provides an electronic device, comprising a board module 6, wherein the board module is arranged in a chassis heat dissipation structure.

[0063] In another embodiment of the present invention, a method for using a chassis heat dissipation structure is provided, including: an exhaust fan 7 draws air from the cavity 105 from the bottom to the top of the chassis frame 1, and flows out from the fan ventilation holes 502; a portion of the air flow flows to the two sides of the top of the chassis frame 1 under the guidance of the air guide cover 5, and then flows out through the side ventilation holes 501, thereby forming an air duct; through the action of the air flow in the air duct, the heat conducted to the corrugated plate 4 and the heat dissipation fins 101 in the cavity 105 is continuously removed from the chassis, thereby effectively dissipating the heat of the board module 6.

[0064] From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects: the present invention realizes the heat dissipation of the high-power board module 6 in the sealed chassis, reduces the number of parts of the whole machine by designing the chassis frame 1, and makes sealing easy to achieve; the introduction of the corrugated plate 4 greatly increases the heat dissipation area in a limited space, improves the heat transfer efficiency of the high-power board module 6, and the use of the heat spreader avoids excessive local temperature rise of the board; the air duct is set in the middle position of the chassis so that a high-power board can directly conduct heat with the chassis frame 1, the heat conduction area is large, and the heat transfer thermal resistance is reduced; multiple air ducts can be arranged under the condition that the chassis size allows, thereby improving the heat dissipation efficiency of the whole machine.

[0065] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A chassis heat dissipation structure, characterized in that: include: A chassis frame, wherein a cavity is provided in the chassis frame; Heat dissipation fins, which are arranged in a matrix on the chassis frame; A rear cover plate, the rear cover plate being arranged at the rear end of the chassis frame; A front panel, wherein the front panel assembly is arranged at the front end of the chassis frame; A deflector cover, wherein the deflector cover is sleeved on the frame; A board module, wherein the board module is arranged in a chassis frame; An exhaust fan, wherein the exhaust fan is arranged in the chassis frame; A corrugated plate, wherein the corrugated plate is inserted into the chassis frame; The exhaust fan draws air from the bottom of the chassis frame to the top, and the airflow continuously removes the heat of the corrugated plate and the heat dissipation fins out of the chassis to dissipate the heat of the board module.

2. The chassis heat dissipation structure according to claim 1, characterized in that: The chassis frame comprises: Frame structure; Threaded holes, the threaded holes are arranged on the frame structure, and the threaded holes are used to install the front panel assembly, the rear cover plate, the air guide cover and the exhaust fan; A sealing groove, wherein the sealing groove is arranged on a side of the frame structure; A boss is arranged in the frame structure to form a locking strip.

3. The chassis heat dissipation structure according to claim 1, characterized in that: It also includes a puller, which is arranged on the front panel and includes: handle; Bases, the bases are arranged in pairs, and a pair of bases are respectively arranged at two ends of the handle; Axles, the axles are arranged in pairs, and a pair of axles are respectively arranged at two ends of the handle; A copper sleeve is arranged on the shaft.

4. The chassis heat dissipation structure according to claim 1, characterized in that: The top of the air guide cover is provided with a fan ventilation hole corresponding to the exhaust fan, and the air guide cover is provided with side ventilation holes on both sides close to the top.

5. The chassis heat dissipation structure according to claim 1, characterized in that: The board module is fixed inside the chassis frame through a locking strip.

6. The chassis heat dissipation structure according to claim 1, characterized in that: The heat dissipation fins are arranged on the top and both sides of the chassis frame.

7. The chassis heat dissipation structure according to claim 1, characterized in that: The corrugated plate is welded at the middle position of the chassis frame.

8. The chassis heat dissipation structure according to claim 1, characterized in that: The board module includes a high-power board module and a low-power board module. The high-power board module is placed on both sides of the inner wall of the cavity. The heat transfer path of the high-power board module passes through the chip, thermal silicon pad, board shell, heat spreader, inner wall of the chassis frame, corrugated plate and air duct in sequence; the heat transfer path of the low-power board module passes through the chip, thermal silicon pad, board shell, heat spreader, chassis frame, heat dissipation fins and air duct in sequence.

9. An electronic device, based on the chassis heat dissipation structure according to any one of claims 1 to 8, characterized in that: It comprises a board module, and the board module is arranged in the chassis heat dissipation structure.

10. A method for using a chassis heat dissipation structure, based on the chassis heat dissipation structure according to any one of claims 1 to 9, characterized in that: include: The exhaust fan draws air from the cavity from the bottom to the top of the chassis frame and flows out from the fan vents. Another part of the air flows to the two sides of the top of the chassis frame under the guidance of the air guide cover and then flows out through the side vents, thus forming an air duct. Through the action of the air flow in the duct, the heat conducted to the corrugated plate and the heat dissipating fins in the cavity is continuously moved out of the chassis, thereby effectively dissipating the heat of the board module.

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