Cold plate, cooling system and electronic equipment

Abstract

The invention relates to the technical field of heat dissipation, and discloses a cold plate, a cooling system and electronic equipment, the cold plate comprises a cold plate body and at least one heat conduction piece, and the cold plate body is internally provided with a liquid cooling cavity; the cold plate body is provided with a first face, and at least part of the first face is used for making contact with a heating element. The at least one heat conduction piece is arranged in the liquid cooling cavity, the heat conduction piece is connected with the portion, corresponding to the first face, in the liquid cooling cavity and extends in the direction away from the first face, and the heat dissipation efficiency can be effectively improved.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation, and particularly to a cold plate, a cooling system, and an electronic device. Background Art

[0002] In the related art, with the continuous development of electronic devices, their power density is increasing day by day, posing higher requirements for heat dissipation technology. In the related art, cold plate heat dissipation is a heat dissipation technology that uses a metal plate (cold plate) to contact the heat-generating element and a fluid (such as water, oil, or other heat dissipation media) to flow through the cold plate to take away heat. As an efficient heat dissipation method, it has gradually been widely used.

[0003] However, the contact area between the cold plate and the heat-generating element is limited, and it is impossible to effectively improve the heat dissipation efficiency. Summary of the Invention

[0004] This application provides a cold plate, a cooling system, and an electronic device, which can effectively improve the heat dissipation efficiency.

[0005] In a first aspect, this application provides a cold plate, including a cold plate body and at least one heat conducting member. A liquid cooling cavity is provided in the cold plate body. A first surface is provided on the cold plate body, and at least a part of the first surface is used to contact the heat-generating element. At least one heat conducting member is arranged in the liquid cooling cavity, and the heat conducting member is connected to the part corresponding to the first surface in the liquid cooling cavity and extends in a direction away from the first surface.

[0006] In a second aspect, this application further provides a cooling system, including: the cold plate in the first aspect.

[0007] In a third aspect, this application further provides an electronic device, including: the cold plate in the first aspect, or the cooling system in the second aspect.

[0008] Advantageous Effects: This application provides a cold plate, a cooling system, and an electronic device. By arranging a liquid cooling cavity in the cold plate body and arranging a plurality of heat conducting members in the liquid cooling cavity, the heat conducting members extend in a direction away from the first surface, which can transfer the heat generated by the heat-generating element in a direction perpendicular to the first surface in the liquid cooling cavity. The heat conducting members increase the contact area with the heat dissipation medium and improve the heat exchange rate between the heat and the heat dissipation medium, thereby improving the heat dissipation efficiency of the cold plate. Description of the Drawings

[0009] In order to more clearly illustrate the specific embodiments of this application or the technical solutions in the related art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the related art. Obviously, the following drawings are some embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0010] Figure 1 Is an axonometric view of a cold plate according to an embodiment of the present application; Figure 2 Is an axonometric view of a cold plate without a top cover according to an embodiment of the present application; Figure 3 Is an axonometric view of a jet component in a cold plate according to an embodiment of the present application; Figure 4 Is an axonometric view of a jet plate in a cold plate according to an embodiment of the present application; Figure 5 Is an axonometric view of a heat conducting member in a cold plate according to an embodiment of the present application; Figure 6 Is a top view of a cold plate without a top cover according to an embodiment of the present application; Figure 7 Is another top view of a cold plate without a top cover according to an embodiment of the present application; Figure 8 Is yet another top view of a cold plate without a top cover according to an embodiment of the present application; Figure 9 Is a top view of a cold plate according to an embodiment of the present application; Figure 10 Is Figure 9 A cross-sectional view taken at A-A in; Figure 11 Is Figure 9 A cross-sectional view of another structure at A-A in; Figure 12 Is Figure 9 A cross-sectional view of yet another structure at A-A in; Figure 13 Is a schematic structural view of a cold plate body in a cold plate according to an embodiment of the present application.

[0011] Explanation of reference numerals: 1, cold plate body; 2, heat conducting member; 3, jet component; 11, liquid cooling cavity; 12, first surface; 13, second heat dissipation cavity; 14, liquid inlet; 15, liquid outlet; 16, substrate; 17, side wall shell; 171, wall plate; 18, top cover; 111, static pressure cavity; 112, flow channel cavity; 21, first heat dissipation cavity; 22, fin; 31, jet hole; 32, jet surface; 33, jet plate. Detailed implementation manners

[0012] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application.

[0013] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. The terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. The terms "parallel", "perpendicular" and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either one. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0014] In the related technologies, with the continuous development of electronic equipment, its power density is increasing, which puts higher requirements on heat dissipation technology; in the related technologies, cold plate heat dissipation is a heat dissipation technology that uses a metal plate (cold plate) to contact the heating element and uses a fluid (such as water, oil or other heat dissipation media) to flow through the cold plate to take away the heat. As an efficient heat dissipation method, it has gradually been widely used.

[0015] However, the contact area between the cold plate and the heat generating element is limited, and the heat dissipation efficiency cannot be effectively improved.

[0016] To solve the above technical problems, the present application provides a cold plate, a cooling system and an electronic device, which can effectively improve the heat dissipation efficiency.

[0017] The following combines Figures 1 to 13 to describe the embodiments of the present application.

[0018] According to an embodiment of the present application, on the one hand, a cold plate is provided, as Figures 1 to 6 shown, including a cold plate body 1 and at least one heat conducting member 2. The specific solution is as follows.

[0019] As Figure 2 shown, the cold plate body 1 is a metal cavity, such as a copper cavity or an aluminum cavity, etc., and can also be a composite material cavity, specifically, a silicon carbide particle reinforced aluminum matrix composite material cavity, etc.; a liquid cooling cavity 11 is provided in the cold plate body 1; a first surface 12 is provided on the cold plate body 1, and at least part of the first surface 12 is used to contact the heat generating element; specifically, the cold plate body 1 is connected and fixed to an electronic device (such as a server motherboard) through a plurality of connecting members (such as locking screws, etc.).

[0020] As Figure 2 shown, the heat conducting member 2 can be one or more. Specifically, the heat conducting member 2 can be a heat conducting metal block, such as a copper block or an aluminum block, etc. The specific shape of the heat conducting member 2 can be any shape such as a cuboid, a cylinder, a triangular pyramid, etc.; the heat conducting member 2 is arranged in the liquid cooling cavity 11, and the part of the heat conducting member 2 corresponding to the first surface 12 in the liquid cooling cavity 11 is connected by welding or integrally formed, and extends along the direction away from the first surface 12.

[0021] Specifically, when there are multiple heat conducting members 2, the multiple heat conducting members 2 are arranged in the liquid cooling cavity 11 in any arrangement manner, such as a circular array, a rectangular array, etc.

[0022] In the specific use process, as Figures 1 to 6 shown, taking the data processing module in the server as the heat generating element, the cold plate body 1 is fixed on the motherboard of the server through locking screws to realize the crimping of the first surface 12 and the data processing module. Of course, a heat conducting silicone grease can be provided between the first surface 12 and the data processing module to enhance the heat transfer efficiency; an inlet 14 and an outlet 15 are provided on the cold plate body 1 to communicate with the heat dissipation medium generating device.

[0023] In the specific working process, as Figure 2As shown, the heat generated during the operation of the data processing module is transferred to the first surface 12 and then extends in the direction of the liquid cooling cavity 11. The heat conducting member 2 conducts the heat in a direction perpendicular to the first surface 12, and the heat conducting member 2 exchanges heat with the liquid cooling medium in the liquid cooling cavity 11.

[0024] In this embodiment, as Figures 1 to 6 shown, a liquid cooling cavity 11 is provided in the cold plate body 1, and a plurality of heat conducting members 2 are provided in the liquid cooling cavity 11. The heat conducting members 2 extend in a direction away from the first surface 12, and can transfer the heat generated by the heating element in a direction perpendicular to the first surface 12 within the liquid cooling cavity 11. The heat conducting members 2 increase the contact area with the heat dissipation medium, improve the heat exchange rate between the heat and the heat dissipation medium, and thus improve the heat dissipation efficiency of the cold plate.

[0025] In one embodiment, as Figure 2 and Figure 3 shown, the cold plate further includes at least one jet assembly 3. The jet assembly 3 is arranged in the liquid cooling cavity 11 by welding or bonding. As Figure 3 shown, a plurality of jet holes 31 are provided on the jet assembly 3, and the jet holes 31 face the heat conducting member 2.

[0026] Specifically, the jet assembly 3 can be a perforated metal plate or plastic plate, etc. In a specific solution, the jet assembly 3 can be arranged at a liquid inlet 14 of the liquid cooling cavity 11.

[0027] The diameter of the jet holes 31 is 0.5 mm to 2.5 mm, and can be any value or the range between any two values among 0.5 mm, 1 mm, 1.5 mm, 2 mm, and 2.5 mm. Preferably, it is 1 mm.

[0028] The principle is as follows: The heat dissipation medium directly passes through the jet holes 31 and jets onto the surface of the heat conducting member 2. The high-speed fluid directly impacts the surface of the heat conducting member 2, forming a very thin velocity boundary layer on the impacted surface. Therefore, extremely strong convective heat transfer ability can be generated locally, and the local convective heat transfer coefficient is increased by nearly 10 times compared with the shovel-tooth cold plate. However, the convective heat transfer coefficient gradually decreases as it moves away from the jet center region; the fluid flow state in the jet region is turbulent, and the fluid flow state between the shovel teeth away from the jet region is laminar.

[0029]

[0030]

[0031] The above first formula ( ) is the calculation formula for the local convective heat transfer coefficient in the turbulent scenario, and the above second formula ( The formula for the local convective heat transfer coefficient in the laminar flow scenario. In the formula, h1 and h2 are the convective heat transfer coefficients, Nu is the Nusselt number, Re is the Reynolds number, and Pr is the Prandtl number, which are three dimensionless physical quantities. In the laminar flow scenario, D is the gap between the shovel teeth, and in the turbulent flow scenario, D is the aperture of the jet hole 31. H is the jet distance, λ is the thermal conductivity, and r is the distance from the jet surface to the surface of the heat conducting member.

[0032] The calculation formula for convective heat conduction is: Q = h·S1·ΔT.

[0033] In the formula, Q is the chip power consumption, h is the convective heat transfer coefficient, S1 is the convective heat transfer area, and ΔT is the temperature difference between the center temperature of the chip surface and the inlet water temperature. When the power consumption, convective heat transfer area, and inlet water temperature are certain, by increasing the local convective heat transfer coefficient, the center temperature of the chip surface will decrease, achieving a good heat dissipation effect. The solution proposed in this application has a higher convective heat transfer coefficient compared to the conventional shovel tooth cold plate.

[0034] During the specific use process, as Figure 2 shown, after the heat dissipation medium entering the liquid cooling cavity 11 passes through the jet assembly 3, a jet is formed and vertically jets onto the outer surface of the heat conducting member 2 at a high speed, forming a locally high-intensity impact flow. The jet impact will form an extremely thin fluid boundary layer in the impact area (stagnation area), significantly reducing the thermal resistance and enhancing the heat transfer efficiency (the heat transfer coefficient can be several times higher than that of traditional convection).

[0035] In this embodiment, as Figure 2 and Figure 3 shown, a jet assembly 3 is arranged in the liquid cooling cavity 11, and the jet holes 31 on the jet assembly 3 face the heat conducting member 2, so that at least part of the heat dissipation medium forms a high-speed jet to impact the surface of the heat conducting member 2, thereby enhancing the heat transfer speed between the heat dissipation medium and the heat conductor and improving the heat transfer efficiency.

[0036] In one embodiment, as Figure 2 shown, the jet assembly 3 divides the liquid cooling cavity 11 into a static pressure cavity 111 and a flow channel cavity 112, and at least part of the heat conducting member 2 is located in the flow channel cavity 112. As Figure 2 shown, at least one liquid inlet 14 and at least one liquid outlet 15 are arranged on the cold plate body 1. The static pressure cavity 111 is communicated with the liquid inlet 14 of the heat dissipation medium, and the flow channel cavity 112 is communicated with the liquid outlet 15 of the heat dissipation medium.

[0037] Specifically, a specific structure is: as Figure 2As shown, the jet component 3 extends in a direction away from the first surface 12 to divide the liquid cooling cavity 11 into a static pressure cavity 111 and a flow channel cavity 112; the side-by-side direction of the static pressure cavity 111 and the flow channel cavity 112 is parallel to the first surface 12; the heat conducting member 2 can be completely located within the flow channel cavity 112, and of course, it can also be partially located within the flow channel cavity 112 and partially located within the static pressure cavity 111.

[0038] Another specific structure is as follows: not shown in the figure, the jet component 3 extends in a direction parallel to the first surface 12 (i.e., the main surface of the jet component 3 is parallel to the first surface 12), dividing the liquid cooling cavity 11 into a static pressure cavity 111 and a flow channel cavity 112, and the side-by-side direction of the static pressure cavity 111 and the flow channel cavity 112 is perpendicular to the first surface 12; the heat conducting member 2 can be completely located within the flow channel cavity 112, and of course, it can also be partially located within the flow channel cavity 112 and partially located within the static pressure cavity 111.

[0039] As Figure 8 shown, when a part of the heat conducting member 2 is located within the flow channel cavity 112 and another part is located within the static pressure cavity 111, the part of the heat conducting member 2 located within the static pressure cavity 111 conducts convective heat exchange with the heat dissipation medium, and at least part of the heat conducting member 2 located within the flow channel cavity 112 corresponds to the jet holes 31 on the jet component 3 to form a jet area for jet heat exchange, and there is also a part that conducts convective heat exchange with the heat dissipation medium located within the flow channel cavity 112.

[0040] In this embodiment, as Figure 2 and Figure 8 shown, using the jet component 3 to divide the liquid cooling cavity 11 into a static pressure cavity 111 and a flow channel cavity 112 can increase the area of the part of the jet component 3, thereby increasing the jet area of the jet component 3 for the heat conducting member 2 to expand the jet heat dissipation area, and further improving the heat exchange efficiency.

[0041] In a specific embodiment, as Figure 2 shown, there are multiple heat conducting members 2. Specifically, the number of heat conducting members 2 is from 1 to 8, and the number of heat conducting members 2 is preferably any value or the range between any two values among 2, 3, 4, 5, 6, and 7, and more preferably 4 or 5; the shape of the heat conducting member 2 is cuboid; the multiple heat conducting members 2 are arranged at intervals. Specifically, the distance between the heat conducting members 2 is from 10 mm to 30 mm, and can be any value or the range between any two values among 12 mm, 14 mm, 16 mm, 18 mm, 20 mm, 22 mm, and 24 mm.

[0042] As Figure 3 and Figure 4 shown, the jet component 3 has multiple jet surfaces 32. As Figure 4 shown, multiple jet holes 31 are arranged on each jet surface 32; among them, asFigure 2 As shown, at least one surface of the heat conducting member 2 located within the flow channel cavity 112 is arranged in parallel with a jet surface portion 32.

[0043] In a specific structure, a plurality of heat conducting members 2 are all located within the fluid cavity. The jet assembly 3 is a single component and is planar. A plurality of spaced jet surface portions 32 are arranged on the jet assembly 3 along the direction in which the heat conducting members 2 are spaced. The surface of the fluid guide body adjacent to the jet assembly 3 is arranged in parallel with a jet surface portion 32.

[0044] In another specific structure, as Figure 2 shown, the jet assembly 3 is provided with a protruding portion. The protruding portion is located between two heat conducting members 2. A jet surface portion 32 is provided on the protruding portion to be arranged in parallel with any one of the two opposite surfaces on the two heat conducting members 2.

[0045] In this embodiment, as Figure 2 shown, a plurality of heat conducting members 2 are adopted, and at least one surface of the heat conducting member 2 located within the flow channel cavity 112 is arranged in parallel with a jet surface portion 32. The structure is simple and easy to manufacture.

[0046] In one embodiment, as Figure 2 and Figure 6 shown, a plurality of heat conducting members 2 are arranged at intervals along a first direction. The first direction is arranged in parallel with the first surface 12, that is, a plurality of heat conducting members 2 are arranged at intervals in a row along the first direction.

[0047] It should be noted that any two heat conducting members 2 can be arranged in parallel (referring to that the surfaces of the two heat conducting members 2 close to each other are parallel) or in a cross arrangement (referring to that the surfaces of the two heat conducting members 2 close to each other form an included angle, and the angle of the included angle is less than 90°).

[0048] Preferably, the first direction is perpendicular to the flow direction of the heat dissipation medium within the liquid cavity.

[0049] In this embodiment, as Figure 2 and Figure 6 shown, by arranging a plurality of heat conducting members 2 at intervals along the first direction, and the first direction is arranged in parallel with the first surface 12, the flow resistance of the heat dissipation medium can be reduced, the driving force can be reduced, and the energy consumption can be lowered.

[0050] In one embodiment, as Figure 7 shown, the jet assembly 3 is arranged at intervals from a plurality of heat conducting members 2. Specifically, the distance between the jet assembly 3 and the heat conducting members 2 can be arranged according to the space of the liquid flow cavity; the distance between the jet assembly 3 and the heat conducting members 2 can be any value among 1mm, 2mm, 3mm, 4mm, 5mm, and 6mm or the range between any two values, and preferably 4mm.

[0051] As Figure 7 shown, between at least one group of two adjacent heat conducting members 2, there are two jet faces 32 arranged at intervals. In a specific structure, the jet assembly 3 is provided with a protruding portion, the protruding portion is in a U shape, the protruding portion is located between the two heat conducting members 2, and two jet faces 32 are provided on the protruding portion to be respectively arranged parallel to two opposite faces on the two heat conducting members 2.

[0052] It should be noted that between at least one group of two adjacent heat conducting members 2, there are two jet faces 32 arranged at intervals, which means that at least in one group of two adjacent heat conducting members 2, there are two jet faces 32 arranged at intervals. It can also be that in two groups of two adjacent heat conducting members 2, there are two jet faces 32 arranged at intervals; even more, in any two adjacent heat conducting members 2, there are two jet faces 32 arranged at intervals.

[0053] During the specific use process, as Figure 6 shown, the heat dissipation medium introduced into the static pressure chamber 111 is ejected through the jet holes 31 on the jet face 32 to form a high-pressure water column, enters the flow channel chamber 112, and shoots towards the opposite side surfaces between two adjacent heat conducting members 2 to conduct heat exchange contact with the two side surfaces of the heat conducting member 2 along the first direction, and then is discharged from the liquid outlet 15.

[0054] In this embodiment, as Figure 6 shown, the jet assembly 3 is arranged at intervals with a plurality of heat conducting members 2, and between at least one group of two adjacent heat conducting members 2, there are two jet faces 32 arranged at intervals to jet towards the two adjacent side surfaces of two adjacent heat conducting members 2, which can increase the jet area, improve the heat exchange efficiency, and can avoid the problem that the temperature of the cold plate gradually increases from the side of the liquid inlet 14 to the side of the liquid outlet 15, resulting in uneven heat dissipation of the cold plate.

[0055] In one embodiment, as Figure 8 shown, the jet assembly 3 includes a plurality of jet plates 33, and a plurality of jet faces 32 are provided on each jet plate 33. The plurality of jet plates 33 are arranged at intervals along the first direction. The two ends of the jet plate 33 along the first direction are respectively connected to the side surfaces of the two heat conducting members 2 by welding or bonding. Among them, the side surface of the heat conducting member 2 refers to the side surface of the heat conducting member 2 perpendicular to the first surface 12; among any two adjacent jet plates 33, the two ends of the two jet plates 33 approaching each other along the first direction are connected to the same heat conducting member 2; among them, between any two adjacent heat conducting members 2, there are two jet faces 32 arranged at intervals.

[0056] Specifically, as Figure 8As shown, the jet plate 33 is a plate with multiple bent surfaces. Three bent surfaces form a convex part, and the convex part is located between two adjacent heat conducting members 2. Among the three bent surfaces, jet surface parts 32 are provided on two oppositely arranged bent surfaces, and are respectively arranged in parallel with the two heat conducting members 2.

[0057] It should be noted that between the two heat conducting members 2 connected to the same jet plate 33, one heat conducting member 2 can be provided, or multiple heat conducting members 2 can be provided. Among them, between at least one group of two adjacent heat conducting members 2, two jet surface parts 32 arranged at intervals can be provided. Preferably, two jet surface parts 32 arranged at intervals are provided between any two adjacent heat conducting members 2.

[0058] It should also be noted that the end of the jet plate 33 along the first direction can be connected to the side surface of the heat conducting member 2 along the first direction, or the end of the jet plate 33 along the first direction can be connected to the surface or edge of the heat conducting member 2 facing the static pressure chamber 111.

[0059] In this embodiment, as Figure 8 shown, the jet assembly 3 includes multiple jet plates 33. Multiple jet surface parts 32 are provided on each jet plate 33. The multiple jet plates 33 are arranged at intervals along the first direction. The jet plates 33 are respectively connected to the side surfaces of two heat conducting members 2 at both ends along the first direction, which can simplify the structure, make the jet plate 33 a general part, and match cold plates of different sizes by assembling with different numbers of heat conducting members 2.

[0060] In one embodiment, as Figure 2 and Figure 13 shown, among the multiple heat conducting members 2, the heat conducting members 2 located at both ends along the first direction form a part of the wall surface of the cold plate body 1, that is, both wall surfaces of the cold plate body 1 along the first direction are heat conducting members 2.

[0061] In this embodiment, as Figure 2 and Figure 13 shown, by adopting the setting that among the multiple heat conducting members 2, the heat conducting members 2 located at both ends along the first direction form a part of the wall surface of the cold plate body 1, the space of the cold plate can be fully utilized to arrange more heat conducting members 2, thereby improving the heat dissipation performance of the cold plate.

[0062] In one embodiment, not shown in the figure, a first heat dissipation fin group is provided at the part of the heat conducting members 2 located at both ends along the first direction on the outer surface of the cold plate body 1. Specifically, the first heat dissipation fin group includes multiple first heat dissipation fins. The multiple first heat dissipation fins can be arranged according to the cooling air flow in the environment where the cold plate is located to facilitate the passage of the cooling air flow and improve the heat dissipation efficiency.

[0063] During the specific use process, the inside of the liquid cooling cavity 11 is combined with the part corresponding to the first surface 12 in the liquid cooling cavity 11 through the heat conducting member 2 to exchange heat with the heat dissipation medium (including the jet heat dissipation medium) flowing in the liquid cooling cavity 11. On the outer side of the heat conducting member 2 that serves as the wall surface of the cold plate body 1, heat exchange is carried out with the cooling air flow through the first heat dissipation fin group to reduce the temperature.

[0064] In this embodiment, the heat conducting members 2 located at both ends along the first direction are provided with the first heat dissipation fin groups at the parts on the outer surface of the cold plate body 1 to make up for the defect that the contact area between the heat conducting member 2 serving as the wall surface of the cold plate body 1 and the internal heat dissipation medium in the liquid cooling cavity 11 is small, so as to improve the heat dissipation uniformity of each part of the cold plate.

[0065] In one embodiment, as Figure 9 and Figure 11 shown, the heat conducting member 2 is a heat pipe, and a first heat pipe cavity 21 is arranged inside the heat pipe. The first heat pipe cavity 21 extends along the direction away from the first surface 12; specifically, the heat pipe is a vacuum cavity with a micro structure on its inner wall.

[0066] During the specific use process, as Figure 9 and Figure 11 shown, when heat is conducted from the part corresponding to the first surface 12 on the cold plate body 1 to the evaporation area of the first heat pipe cavity 21 (i.e., the part of the first heat pipe cavity 21 close to the first surface 12), the phase change medium in the first heat pipe cavity 21 starts to vaporize after being heated in a low vacuum environment. At this time, it absorbs heat energy and its volume expands rapidly. The gaseous phase change medium quickly fills the entire first heat pipe cavity 21. When the gaseous phase change medium contacts a relatively cold area, condensation will occur, and the heat accumulated during evaporation will be released through the condensation phenomenon. The condensed liquid phase change medium will return to the evaporation area through the capillary pipes of the micro structure, and this process will be carried out repeatedly in the first heat pipe cavity 21.

[0067] In this embodiment, as Figure 9 and Figure 11 shown, by using the heat conducting member 2 as a heat pipe with a first heat pipe cavity 21 arranged inside and the first heat pipe cavity 21 extending along the direction away from the first surface 12, the heat conduction ability of the heat conducting member 2 along the direction away from the first surface 12 can be improved, thereby increasing the heat exchange speed between the heat conducting member 2 and the heat dissipation medium in the liquid cooling cavity 11, and thus improving the heat dissipation efficiency of the cold plate.

[0068] In one embodiment, as Figure 9 and Figure 11 shown, a second heat pipe cavity 13 is arranged at the part of the cold plate body 1 for contacting the heat generating component, that is, the second heat pipe cavity 13 is arranged inside the part corresponding to the first surface 12 on the cold plate body 1; specifically, the second heat pipe cavity 13 is in a cuboid shape or can also be in a cylindrical shape.

[0069] In the specific use process, such as Figure 9 and Figure 11 As shown, when heat is conducted from the heating element to the corresponding part of the first surface 12 of the cold plate body 1, the phase change medium at the evaporation area of the second heat dissipation cavity 13 (i.e., the part of the second heat dissipation cavity 13 close to the first surface 12) starts to vaporize when heated in an environment of low vacuum. At this time, it absorbs heat energy and the volume expands rapidly. The gaseous phase change medium quickly fills the entire second heat dissipation cavity 13. When the gaseous phase change medium contacts a relatively cold area, condensation will occur, and the heat accumulated during evaporation will be released through the condensation phenomenon. The condensed liquid phase change medium will return to the evaporation area through the capillary pipes of the micro-structure, and this process will repeat in the second heat dissipation cavity 13.

[0070] In this embodiment, such as Figure 9 and Figure 11 As shown, the second heat dissipation cavity 13 is arranged at the part of the cold plate body 1 used to contact the heating component, which can improve the heat transfer rate between the heat on the heating element and the corresponding part of the first surface 12 of the cold plate body 1, thereby increasing the heat exchange amount per unit time between the heat conducting member 2 and the heat dissipation medium in the liquid cooling cavity 11, and thus improving the heat dissipation efficiency of the cold plate.

[0071] In one embodiment, such as Figure 9 and Figure 12 As shown, the first heat dissipation cavity 21 is communicated with the second heat dissipation cavity 13. In a specific structure, the part of the heat conducting member 2 corresponding to the first surface 12 of the cold plate body 1 is made by an integral molding process.

[0072] Specifically, the first heat dissipation cavity 21 and the second heat dissipation cavity 13 are communicated through a plurality of ventilation holes (that is, at least one ventilation hole is arranged at the part where the first heat dissipation cavity 21 and the second heat dissipation cavity 13 are communicated). Or, the part of the first heat dissipation cavity 21 close to the first surface 12 is arranged to be open, and the part of the second heat dissipation cavity 13 far from the first surface 12 and communicated with the first heat dissipation cavity 21 is arranged to be open (that is, the first heat dissipation cavity 21 and the second heat dissipation cavity 13 are directly communicated through a large opening).

[0073] In the specific use process, such as Figure 9 and Figure 12As shown, when heat is conducted from the heating element to the corresponding part of the first surface 12 of the cold plate body 1, the phase change medium at the evaporation area of the second heat dissipation cavity 13 (i.e., the part of the second heat dissipation cavity 13 close to the first surface 12) starts to vaporize when heated in an environment of low vacuum. At this time, it absorbs heat energy and the volume expands rapidly. The gaseous phase change medium quickly fills the entire second heat dissipation cavity 13 and is immediately transferred into the first heat dissipation cavity 21. When the gaseous phase change medium in the first heat dissipation cavity 21 contacts a relatively cold area, condensation will occur, and the heat accumulated during evaporation will be released through the condensation phenomenon. The condensed liquid phase change medium will return to the evaporation area of the second heat dissipation cavity 13 through the capillary channels of the micro-structure. This process will repeat between the first heat dissipation cavity 21 and the second heat dissipation cavity 13.

[0074] In this embodiment, as Figure 9 and Figure 12 shown, by directly connecting the first heat dissipation cavity 21 and the second heat dissipation cavity 13, the phase change medium in the second heat dissipation cavity 13 can be directly transferred into the first heat dissipation cavity 21 after vaporization, so as to enhance the heat transfer speed from the heating element to the heat conducting member 2, and enhance the heat exchange speed between the heat conducting member 2 and the heat dissipation medium in the liquid cooling cavity 11, thereby improving the cooling effect of the cold plate on the heating element.

[0075] In one embodiment (not shown in the figure), a plurality of liquid inlets 14 communicating with the static pressure cavity 111 are provided on the cold plate body 1. The plurality of liquid inlets 14 are evenly distributed at the corresponding parts of the static pressure cavity 111 on the cold plate body 1, that is, the static pressure cavity 111 is supplied with heat dissipation medium from the plurality of liquid inlets 14 at different positions; a plurality of liquid outlets 15 communicating with the flow channel cavity 112 are provided on the cold plate body 1. The plurality of liquid outlets 15 are evenly distributed at the corresponding parts of the flow channel cavity 112 on the cold plate body 1, that is, the flow channel cavity 112 delivers the heat dissipation medium outward through the plurality of liquid outlets 15 at different positions.

[0076] Specifically, the number of the liquid inlets 14 is 2 to 6, and can be any value among 3, 4, and 5 or the range between any two values; the number of the liquid outlets 15 is 2 to 6, and can be any value among 3, 4, and 5 or the range between any two values.

[0077] During specific use, multiple liquid inlets 14 are communicated with the output port of the heat dissipation medium generating device, and multiple liquid outlets 15 are communicated with the input port of the heat dissipation medium generating device. The heat dissipation medium enters the static pressure chamber 111 through the multiple liquid inlets 14 at different positions, which can improve the pressure equality at various places in the static pressure chamber 111. The heat dissipation medium flows out of the flow channel chamber 112 through the multiple liquid outlets 15 at different positions, which can improve the pressure equality at various places in the flow channel chamber 112, so as to ensure that the jet flow amounts at various places of the jet component 3 are the same, that is, to ensure the equality of the heat dissipation amounts of each heat conducting member 2.

[0078] In this embodiment, the cold plate body 1 is provided with multiple liquid inlets 14 communicated with the static pressure chamber 111, and the multiple liquid inlets 14 are evenly arranged at the corresponding parts of the static pressure chamber 111 on the cold plate body 1. The cold plate body 1 is provided with multiple liquid outlets 15 communicated with the flow channel chamber 112, and the multiple liquid outlets 15 are evenly arranged at the corresponding parts of the flow channel chamber 112 on the cold plate body 1, which can improve the pressure equality of the heat dissipation medium at various places in the static pressure chamber 111 and the pressure equality of the heat dissipation medium at various places in the flow channel chamber 112, ensure that the jet flow amounts at various places of the jet component 3 are the same, that is, ensure the equality of the heat dissipation amounts of each heat conducting member 2, so as to ensure the uniform heat dissipation temperature of the cold plate.

[0079] In one embodiment, as Figure 5 and Figure 10 shown, at least part of the outer surface of the heat conducting member 2 is provided with fins 22. Specifically, the fins 22 are in any one of a cylindrical shape, an elliptical cylindrical shape, and a rhombic cylindrical shape, or can also be other shapes, as long as the contact area with the heat dissipation medium can be increased.

[0080] In this embodiment, by providing fins 22 on the surface of the heat conducting member 2, the convection area with the heat dissipation medium can be increased, the heat exchange speed can be improved, and the heat dissipation efficiency of the cold plate can be improved.

[0081] In one embodiment, as Figure 5 and Figure 10 shown, at least part of the surface of the heat conducting member 2 facing the jet surface 32 is provided with fins 22. In a specific structure, fins 22 are provided at all parts of the heat conducting member 2 facing the jet surface 32; in this embodiment, the setting of the fins 22 can enhance the heat exchange efficiency between the heat conducting member 2 and the jet.

[0082] In one embodiment, the distance between the surface of the heat conducting member 2 facing the jet surface 32 and the jet surface 32 is 2 to 6 times the diameter of the jet holes 31 on the jet surface 32. Specifically, the distance between the surface of the heat conducting member 2 facing the jet surface 32 and the jet surface 32 can be any value or the range between any two values among 2 times, 2.5 times, 3 times, 3.5 times, 4 times, 4.5 times, 5 times, 5.5 times and 6 times the diameter of the jet holes 31 on the jet surface 32; preferably, the distance between the surface of the heat conducting member 2 facing the jet surface 32 and the jet surface 32 is 3.5 to 4.5 times the diameter of the jet holes 31 on the jet surface 32. More preferably, the distance between the surface of the heat conducting member 2 facing the jet surface 32 and the jet surface 32 is 4 times the diameter of the jet holes 31 on the jet surface 32.

[0083] Specifically, the diameter of the jet holes 31 is generally 1 mm, then the distance between the jet surface 32 and the heat conducting member 2 is 2 mm to 6 mm, preferably, the distance between the jet surface 32 and the heat conducting member 2 is 4 mm.

[0084] In this embodiment, the distance between the surface of the heat conducting member 2 facing the jet surface 32 and the jet surface 32 is 2 to 5 times the diameter of the jet holes 31 on the jet surface 32. Within this range, the heat exchange rate between the heat dissipation medium and the heat conducting member 2 through the jet is relatively high.

[0085] In one embodiment, as Figure 13 shown, the cold plate body 1 includes a base plate 16, side wall shells 17 and a top cover 18. Specifically, the materials of the base plate 16, side wall shells 17 and the top plate are any one of copper, aluminum and other heat conducting materials; the side wall shells 17 are open on both sides perpendicular to the first surface 12. The base plate 16 and the top cover 18 respectively seal the two openings by welding or bonding methods. The heat conducting member 2 is connected and arranged on the base plate 16 by welding. The first surface 12 is located on the base plate 16, that is, the base plate 16, side wall shells 17 and the top cover 18 enclose a liquid cooling cavity 11.

[0086] Specifically, as Figure 13 shown, the side wall shell 17 includes two heat conducting members 2 and two wall plates 171. The two wall plates 171 are connected by the two heat conducting members 2.

[0087] In this embodiment, as Figure 13 shown, the cold plate body 1 includes a base plate 16, side wall shells 17 and a top cover 18. The side wall shells 17 are open on both sides perpendicular to the first surface 12. The base plate 16 and the top cover 18 respectively seal the two openings. The heat conducting member 2 is connected and arranged on the base plate 16. The structure is simple and easy to manufacture.

[0088] In one embodiment, not shown in the figure, the top cover 18 is spaced from the end of the heat conducting member 2 away from the first surface 12, which can enhance the contact area between the end of the heat conducting member 2 away from the first surface 12 and the heat dissipation medium and improve the heat dissipation efficiency.

[0089] In one embodiment, as Figure 11 shown, the top cover 18 is in contact with the end of the heat conducting member 2 away from the first surface 12. Not shown in the figure, the surface of the top cover 18 located outside the liquid cooling cavity 11 is provided with a second heat dissipation fin group. Specifically, the second heat dissipation fin group includes a plurality of second heat dissipation fins, and the plurality of second heat dissipation fins can be arranged according to the cooling air flow in the environment where the cold plate is located to facilitate the passage of the cooling air flow and improve the heat dissipation efficiency.

[0090] In this embodiment, by providing a second heat dissipation fin group at the part of the top cover 18 located outside the liquid cooling cavity 11, the heat dissipation effect on the end of the heat conducting member 2 away from the first surface 12 can be enhanced.

[0091] In one embodiment, a cold plate is provided. As Figures 1 to 6 shown, it includes a cold plate body 1 and at least one heat conducting member 2. The specific scheme is as follows.

[0092] As Figure 2 shown, the cold plate body 1 is a metal cavity, such as a copper cavity or an aluminum cavity, etc., or can also be a composite material cavity, specifically, a silicon carbide particle-reinforced aluminum matrix composite material cavity, etc.; a liquid cooling cavity 11 is provided inside the cold plate body 1; a first surface 12 is provided on the cold plate body 1, and at least part of the first surface 12 is used to contact the heat generating element; specifically, the cold plate body 1 is connected and fixed to an electronic device (such as a server motherboard, etc.) through a plurality of connecting members (such as locking screws, etc.).

[0093] As Figure 2 shown, specifically, the heat conducting member 2 can be a heat conducting metal block, such as a copper block, an aluminum block, etc., and the specific shape of the heat conducting member 2 can be any shape such as a cuboid, a cylinder, a triangular pyramid, etc.; the heat conducting member 2 is arranged in the liquid cooling cavity 11, and the part of the heat conducting member 2 corresponding to the first surface 12 in the liquid cooling cavity 11 is connected by welding or integrally formed, and extends along the direction away from the first surface 12.

[0094] Further specifically, as Figure 2 and Figure 3 shown, the cold plate further includes at least one jet component 3. The jet component 3 is arranged in the liquid cooling cavity 11 by welding or bonding. As Figure 3 shown, a plurality of jet holes 31 are provided on the jet component 3, and the jet holes 31 face the heat conducting member 2.

[0095] Specifically, the jet component 3 can be a perforated metal plate, plastic plate, etc. In a specific solution, the jet component 3 can be arranged at an inlet 14 of the liquid cooling cavity 11.

[0096] The diameter of the jet holes 31 is 0.5 mm to 2.5 mm, and can be any value among 0.5 mm, 1 mm, 1.5 mm, 2 mm, and 2.5 mm or the range between any two values, preferably 1 mm.

[0097] More specifically, as Figure 2 shown, the jet component 3 divides the liquid cooling cavity 11 into a static pressure cavity 111 and a flow channel cavity 112, and the heat conducting member 2 is at least partially located in the flow channel cavity 112; as Figure 2 shown, at least one inlet 14 and at least one outlet 15 are provided on the cold plate body 1. The static pressure cavity 111 is communicated with the inlet 14 of the heat dissipation medium, and the flow channel cavity 112 is communicated with the outlet 15 of the heat dissipation medium.

[0098] The specific structure is: as Figure 2 shown, the jet component 3 extends in a direction away from the first surface 12 to divide the liquid cooling cavity 11 into a static pressure cavity 111 and a flow channel cavity 112; the side-by-side direction of the static pressure cavity 111 and the flow channel cavity 112 is parallel to the first surface 12; the heat conducting member 2 can be completely located in the flow channel cavity 112. Of course, it can also be partially located in the flow channel cavity 112 and partially located in the static pressure cavity 111.

[0099] More specifically, as Figure 2 shown, there are multiple heat conducting members 2. Specifically, the number of the heat conducting members 2 is 1 to 8, and the number of the heat conducting members 2 is preferably any value among 2, 3, 4, 5, 6, and 7 or the range between any two values, and more preferably 4 or 5; the shape of the heat conducting member 2 is rectangular; the multiple heat conducting members 2 are arranged at intervals. Specifically, the distance between the heat conducting members 2 is 10 mm to 30 mm, and can be any value among 12 mm, 14 mm, 16 mm, 18 mm, 20 mm, 22 mm, and 24 mm or the range between any two values.

[0100] As Figure 3 and Figure 4 shown, the jet component 3 has multiple jet surfaces 32. As Figure 4 shown, multiple jet holes 31 are arranged on each jet surface 32; among them, as Figure 2 shown, at least one surface of the heat conducting member 2 located in the flow channel cavity 112 is arranged parallel to a jet surface 32.

[0101] In the specific structure, as Figure 2As shown, the jet component 3 is provided with a protrusion. The protrusion is located between two heat conducting members 2, and a jet surface portion 32 is provided on the protrusion to be arranged parallel to any one of the two opposite surfaces on the two heat conducting members 2.

[0102] More specifically, as Figure 2 and Figure 6 shown, a plurality of heat conducting members 2 are arranged at intervals along a first direction. The first direction is arranged parallel to the first surface 12, that is, the plurality of heat conducting members 2 are arranged at intervals in a row along the first direction.

[0103] It should be noted that any two heat conducting members 2 can be arranged in parallel (referring to the surfaces of the two heat conducting members 2 close to each other being parallel), or can be arranged in a cross (referring to the surfaces of the two heat conducting members 2 close to each other forming an included angle, and the angle of the included angle is less than 90°).

[0104] Preferably, the first direction is perpendicular to the flow direction of the heat dissipation medium in the liquid cavity.

[0105] More specifically, as Figure 2 and Figure 13 shown, among the plurality of heat conducting members 2, the heat conducting members 2 located at both ends along the first direction form a part of the wall surface of the cold plate body 1, that is, both wall surfaces of the cold plate body 1 along the first direction are heat conducting members 2.

[0106] More specifically, as Figure 9 and Figure 11 shown, the heat conducting member 2 is a heat pipe. A first heat pipe cavity 21 is arranged in the heat pipe, and the first heat pipe cavity 21 extends along the direction away from the first surface 12; specifically, the heat pipe is a vacuum cavity with a fine structure on the inner wall.

[0107] More specifically, as Figure 9 and Figure 11 shown, a second heat pipe cavity 13 is arranged at the part of the cold plate body 1 for contacting the heat generating component, that is, the second heat pipe cavity 13 is arranged in the part corresponding to the first surface 12 on the cold plate body 1; specifically, the second heat pipe cavity 13 is in a cuboid shape or can also be in a cylindrical shape.

[0108] More specifically, as Figure 9 and Figure 12 shown, the first heat pipe cavity 21 is communicated with the second heat pipe cavity 13. In a specific structure, the part of the heat conducting member 2 corresponding to the first surface 12 on the cold plate body 1 is made by an integral molding process.

[0109] Specifically, the first soaking cavity 21 and the second soaking cavity 13 are connected through a plurality of ventilation holes (that is, at least one ventilation hole is provided at the connecting part of the first soaking cavity 21 and the second soaking cavity 13). Alternatively, the part of the first soaking cavity 21 close to the first surface 12 is open, the second soaking cavity 13 is far from the first surface 12, and the part connected to the first soaking cavity 21 is open (that is, the first soaking cavity 21 and the second soaking cavity 13 are directly connected through a large opening).

[0110] More specifically, as Figure 5 and Figure 10 shown, fins 22 are provided on at least part of the outer surface of the heat conducting member 2. Specifically, the fins 22 are in any one of a cylindrical shape, an elliptical cylindrical shape, and a rhombic cylindrical shape, or may be other shapes as long as the contact area with the heat dissipation medium can be increased.

[0111] More specifically, as Figure 5 and Figure 10 shown, fins 22 are provided on at least part of the surface of the heat conducting member 2 facing the jet surface portion 32. In a specific structure, fins 22 are provided on the part of the heat conducting member 2 facing the jet surface portion 32; in this embodiment, the setting of the fins 22 can enhance the heat exchange efficiency between the heat conducting member 2 and the jet.

[0112] More specifically, the distance between the surface of the heat conducting member 2 facing the jet surface portion 32 and the jet surface portion 32 is 2 to 6 times the diameter of the jet hole 31 on the jet surface portion 32. Specifically, the distance between the surface of the heat conducting member 2 facing the jet surface portion 32 and the jet surface portion 32 can be any value or the range between any two values among 2 times, 2.5 times, 3 times, 3.5 times, 4 times, 4.5 times, 5 times, 5.5 times, and 6 times the diameter of the jet hole 31 on the jet surface portion 32; preferably, the distance between the surface of the heat conducting member 2 facing the jet surface portion 32 and the jet surface portion 32 is 3.5 to 4.5 times the diameter of the jet hole 31 on the jet surface portion 32. More preferably, the distance between the surface of the heat conducting member 2 facing the jet surface portion 32 and the jet surface portion 32 is 4 times the diameter of the jet hole 31 on the jet surface portion 32.

[0113] Specifically, the diameter of the jet hole 31 is generally 1 mm, then the distance between the jet surface portion 32 and the heat conducting member 2 is 2 mm to 6 mm, and preferably, the distance between the jet surface portion 32 and the heat conducting member 2 is 4 mm.

[0114] More specifically, as Figure 13As shown in the figure, the cold plate body 1 includes a base plate 16, a side wall shell 17, and a top cover 18. Specifically, the materials of the base plate 16, the side wall shell 17, and the top plate are any one of copper, aluminum, and other heat-conducting materials; the side wall shell 17 is open on both sides perpendicular to the first surface 12, and the base plate 16 and the top cover 18 respectively seal the two openings by welding or bonding. The heat-conducting member 2 is connected to the base plate 16 by welding, and the first surface 12 is located on the base plate 16, that is, the base plate 16, the side wall shell 17, and the top cover 18 enclose a liquid cooling cavity 11.

[0115] Specifically, as Figure 13 shown, the side wall shell 17 includes two heat-conducting members 2 and two wall plates 171, and the two wall plates 171 are connected by the two heat-conducting members 2.

[0116] Further specifically, as Figure 11 shown, the top cover 18 is in contact with the end of the heat-conducting member 2 away from the first surface 12.

[0117] In the above solution, the number of the heat-conducting members 2 is 4, the aperture of the jet holes 31 is 1 mm, and the distance between the surface of the heat-conducting member 2 facing the jet surface 32 and the jet surface 32 is 4 times the diameter of the jet holes 31 on the jet surface 32.

[0118] For the simulation of the above solution, the variable is: the distance between the surface of the heat-conducting member 2 facing the jet surface 32 and the jet surface 32 is 2 times, 3 times, 4 times, 5 times, and 6 times the diameter of the jet holes 31 on the jet surface 32.

[0119] Specifically, the temperature of the heat-dissipating medium (water) at the liquid inlet 14 is 35 °C, the heating element is a chip, the power consumption is 500 W, the flow rate of the heat-dissipating medium is 1 LPM, the diameter of the jet holes 31 is 1 mm, and the simulation software is flotherm (a set of electronic system heat dissipation simulation software). The results are shown in Table 1.

[0120] Table 1

[0121] From Table 1, it can be seen that when the distance between the surface of the heat-conducting member 2 facing the jet surface 32 and the jet surface 32 is 4 times the diameter of the jet holes 31 on the jet surface 32, the temperature of the chip is the lowest, that is, when the distance between the surface of the heat-conducting member 2 facing the jet surface 32 and the jet surface 32 is 4 times the diameter of the jet holes 31 on the jet surface 32, the heat dissipation efficiency of the cold plate is the best.

[0122] Simulate the above solution again. The comparison example is: a standard heat pipe radiator, with the specific model being Cu base (copper base) + 5 Heatpipe (5 heat pipes) + Al Fin (aluminum fins). The number of aluminum fins is 51, the thickness is 0.3 mm, and the fin pitch is 1.56 mm.

[0123] Specifically, the temperature of the heat dissipation medium (water) at the liquid inlet 14 is 35°C, the heating element is a chip, the power consumption is 500 W, the flow rate of the heat dissipation medium is 1 LPM, and the simulation software is flotherm. The results are shown in Table 2.

[0124] Table 2

[0125] As can be seen from Table 2, using the cold plate in this application to cool the chip results in a temperature 4.7°C lower than that of the standard heat pipe radiator for chip cooling, demonstrating the technical effect of the high heat dissipation efficiency of the cold plate in this application.

[0126] In summary, this application proposes a cold plate that breaks through the height direction limit of conventional cold plates, greatly increases the heat transfer coefficient while also increasing the heat dissipation area, and improves the heat dissipation capacity by more than 30% compared to traditional shovel-tooth cold plates; at the same time, it solves the problem of uneven temperature distribution on the upstream and downstream surfaces of the traditional shovel-tooth cold plate, optimizes the temperature distribution on the contact surface between the cold plate and the chip, and optimizes the temperature uniformity; and the jet impingement will wash away the deposits between the shovel teeth, effectively solving the problem of cold plate flow channel blockage.

[0127] According to an embodiment of the present application, in a second aspect, a cooling system is provided, including at least one cold plate in the first aspect.

[0128] Specifically, the cold plate is a plate body through which a heat dissipation medium is passed. The heat dissipation medium can be a liquid medium or a low-temperature gas medium.

[0129] In this embodiment, since the cooling system includes a cold plate, it has the same technical effects as the cold plate and will not be elaborated here.

[0130] According to an embodiment of the present application, in a third aspect, an electronic device is provided, including at least one cold plate in the first aspect or a cooling system in the second aspect.

[0131] Specifically, the electronic device is a device with data processing capabilities such as a server.

[0132] In this embodiment, since the electronic device includes a cold plate, it has the same technical effects as the cold plate and will not be elaborated here.

[0133] Although embodiments of the present application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations fall within the scope defined by the appended claims.

Claims

1. A cold plate, characterized in that, Comprising: A cold plate body (1), within which a liquid cooling cavity (11) is provided; on the cold plate body (1), there is a first surface (12), and at least a part of the first surface (12) is used for contacting a heating element; At least one heat conducting member (2), disposed within the liquid cooling cavity (11), the heat conducting member (2) is connected to a portion corresponding to the first surface (12) within the liquid cooling cavity (11), and extends in a direction away from the first surface (12).

2. The cold plate according to claim 1, characterized in that, It further includes at least one jet assembly (3), the jet assembly (3) is disposed within the liquid cooling cavity (11), and a plurality of jet holes (31) are provided on the jet assembly (3), and the jet holes (31) face the heat conducting member (2).

3. The cold plate according to claim 2, characterized in that, The jet assembly (3) divides the liquid cooling cavity (11) into a static pressure cavity (111) and a flow channel cavity (112), and at least a part of the heat conducting member (2) is located within the flow channel cavity (112).

4. The cold plate according to claim 3, characterized in that, There are a plurality of the heat conducting members (2), and the plurality of heat conducting members (2) are spaced apart. The jet assembly (3) has a plurality of jet faces (32), and a plurality of the jet holes (31) are arranged on each of the jet faces (32); Wherein, at least one surface of the heat conducting member (2) located within the flow channel cavity (112) is arranged parallel to one of the jet faces (32).

5. The cold plate according to claim 4, characterized in that, The plurality of heat conducting members (2) are arranged at intervals along a first direction, and the first direction is arranged parallel to the first surface (12).

6. The cold plate according to claim 5, characterized in that, The jet assembly (3) is spaced apart from the plurality of heat conducting members (2), and two spaced-apart jet faces (32) are provided between at least a group of two adjacent heat conducting members (2).

7. The cold plate according to claim 5, characterized in that, The jet assembly (3) includes a plurality of jet plates (33), and a plurality of the jet faces (32) are provided on each of the jet plates (33). The plurality of jet plates (33) are arranged at intervals along the first direction. The two ends of the jet plate (33) along the first direction are respectively connected to the side surfaces of two of the heat conducting members (2). Among any two adjacent jet plates (33), the two ends of the two jet plates (33) that are close to each other along the first direction are connected to the same heat conducting member (2); Wherein, two spaced-apart jet faces (32) are provided between any two adjacent heat conducting members (2).

8. The cold plate according to claim 5, characterized in that, Among the plurality of heat conducting members (2), the heat conducting members (2) located at both ends along the first direction form a part of the wall surface of the cold plate body (1).

9. The cold plate according to claim 8, characterized in that, At the parts of the heat conducting members (2) located at both ends along the first direction and on the outer surface of the cold plate body (1), a first heat dissipation fin group is provided.

10. The cold plate according to any one of claims 1 to 9, characterized in that, The heat conducting member (2) is a heat pipe, and a first heat pipe cavity (21) is provided within the heat pipe, and the first heat pipe cavity (21) extends in a direction away from the first surface (12).

11. The cold plate according to claim 10, wherein A second heat pipe cavity (13) is provided at the part of the cold plate body (1) for contacting a heating component.

12. The cold plate according to claim 11, wherein, The first heat pipe cavity (21) is in communication with the second heat pipe cavity (13).

13. The cold plate according to any one of claims 3 to 9, characterized in that, A plurality of liquid inlets (14) communicating with the static pressure chamber (111) are provided on the cold plate body (1), and the plurality of liquid inlets (14) are uniformly arranged on the corresponding part of the static pressure chamber (111) on the cold plate body (1); And / or, a plurality of liquid outlets (15) communicating with the flow channel chamber (112) are provided on the cold plate body (1), and the plurality of liquid outlets (15) are uniformly arranged on the corresponding part of the flow channel chamber (112) on the cold plate body (1).

14. The cold plate according to any one of claims 4 to 9, wherein Fins (22) are provided on at least part of the outer surface of the heat conducting member (2).

15. The cold plate according to claim 14, characterized in that, Fins (22) are provided on at least part of the surface of the heat conducting member (2) facing the jet surface (32); And / or, the fins (22) are any one of cylindrical, elliptical cylindrical and rhombic columnar shapes.

16. The cold plate according to any one of claims 4 to 9, characterized in that, The distance between the surface of the heat conducting member (2) facing the jet surface (32) and the jet surface (32) is 2 to 5 times the diameter of the jet hole (31) on the jet surface (32).

17. The cold plate according to claim 16, characterized in that, The distance between the surface of the heat conducting member (2) facing the jet surface (32) and the jet surface (32) is 3.5 to 4.5 times the diameter of the jet hole (31) on the jet surface (32).

18. The cold plate according to any one of claims 1 to 9, characterized in that, The cold plate body (1) includes a base plate (16), a side wall shell (17) and a top cover (18). The side wall shell (17) is open on both sides perpendicular to the first surface (12). The base plate (16) and the top cover (18) respectively seal the two openings. The heat conducting member (2) is connected and arranged on the base plate (16), and the first surface (12) is located on the base plate (16).

19. The cold plate according to claim 18, wherein, The top cover (18) is spaced from the end of the heat conducting member (2) away from the first surface (12); Or, the top cover (18) is in contact with the end of the heat conducting member (2) away from the first surface (12), and a second heat dissipation fin group is provided on the surface of the top cover (18) located outside the liquid cooling chamber (11).

20. A cooling system, characterized in that, Comprising: At least one cold plate as described in any one of claims 1 to 19.

21. An electronic device, characterized in that, Comprising: At least one cold plate as described in any one of claims 1 to 19, or a cooling system as described in claim 20.

Images