Electronic equipment and air guide structure

Abstract

The invention discloses electronic equipment and an air guide structure. The electronic equipment comprises an air guide assembly and a plurality of GPU modules, the multiple GPU modules are arranged at intervals in the first direction, each GPU module comprises an air inlet and an air outlet which deviate from each other in the first direction, the air guide assembly comprises a plurality of partition plates, the multiple partition plates are arranged at intervals in the first direction, each partition plate is located in a gap between every two adjacent GPU modules, and each partition plate is located in the gap between every two adjacent GPU modules. And the partition plate is opposite to the air outlets and is used for isolating the air outlets and the air inlets of the two adjacent GPU modules. And the air outlets and the air inlets of the two adjacent GPU modules are isolated by the partition plates. In this way, hot air at the air outlet of the GPU module is blocked by the partition plate, so that the hot air is prevented from directly entering the air inlet of the adjacent GPU module. The GPU module sucks cooled air for heat dissipation, and the heat dissipation efficiency is high. And meanwhile, cold air around the partition plate can also enter the air inlet of the GPU module, so that the heat dissipation effect of the GPU module is improved.

Description

Technical Field

[0001] The present application relates to the technical field of server heat dissipation, and in particular to an electronic device and an air guide structure. Background Art

[0002] With the widespread application and development of artificial intelligence and Chat GPT, the increase in large-scale data processing and computing needs, the demand for GPU servers is also increasing. GPU is the abbreviation of Graphics Processing Unit, which is a microprocessor specially used to process images and graphics-related operations. GPU server is a server equipped with a graphics processing unit (GPU), which uses the parallel computing power of GPU to improve the overall computing speed, and is mainly used for high-performance computing, such as data processing, machine learning, artificial intelligence and other fields.

[0003] Each GPU server is usually equipped with multiple GPU modules, and multiple GPU modules are installed densely. Since the heat dissipation of each GPU module is high, the densely installed GPU modules will affect each other, thereby affecting the stability of the GPU server operation. Therefore, it is urgent to provide a GPU server device with better heat dissipation. Summary of the invention

[0004] The electronic device and air guide structure provided in the present application improve the heat dissipation efficiency of the GPU card, thereby improving the heat dissipation performance of the electronic device.

[0005] An electronic device provided by an embodiment of the present application includes: an air guide assembly and a plurality of GPU modules, wherein the plurality of GPU modules are arranged at intervals along a first direction, and each of the GPU modules includes an air inlet and an air outlet that are mutually divergent along the first direction. The air guide assembly includes a plurality of partitions, wherein the plurality of partitions are arranged at intervals along the first direction, and each of the partitions is located in a gap between two adjacent GPU modules and is opposite to the air outlet, and the partition is used to isolate the air outlet and the air inlet of two adjacent GPU modules.

[0006] In the above embodiment, the partition separates the air outlet and air inlet of two adjacent GPU modules. In this way, the hot air at the air outlet of the GPU module is blocked by the partition, thereby avoiding direct entry into the air inlet of the adjacent GPU module. A portion of the hot air flowing out of the air outlet of the GPU module bypasses the partition and enters the air inlet. This path is relatively longer than the path directly entering the air inlet. During the flow of this longer path, the temperature of the hot air gradually decreases. When entering the air inlet of the adjacent GPU module, the hot air has naturally cooled down. The GPU module inhales the cooled air to dissipate heat, and the heat dissipation efficiency is relatively high. At the same time, the cold air around the partition can also enter the air inlet of the GPU module, thereby improving the heat dissipation effect of the GPU module.

[0007] In one embodiment, the air guide assembly further includes a cover, the plurality of partitions are installed in the cover, and the cover is arranged outside the plurality of GPU modules. The cover is used to carry the partitions, so that the air guide assembly forms an integrated mounting part, which is convenient for the installation of the air guide assembly.

[0008] In one embodiment, the GPU module extends in a second direction, the GPU module includes a first end and a second end arranged along the second direction, the first direction is perpendicular to the second direction, the air outlet is located at the first end, and the cover is located at the first end. The second end of the GPU module is not blocked externally, so that the space above the second end is open, which is conducive to air flow, thereby improving the heat dissipation efficiency of the GPU module.

[0009] In one embodiment, the cover body includes a top plate and side plates that are connected to each other, and the multiple partitions are detachably connected to the top plate and the side plates. Therefore, the partitions can be replaced with corresponding sizes for GPU modules of different lengths, thereby widening the application range of the air guide assembly.

[0010] In one embodiment, the partition divides the cover into a plurality of storage spaces, and each GPU module is located in one storage space. The side panels are provided with air inlets at positions corresponding to each storage space, and the top panels are provided with air outlets at positions corresponding to each storage space. The air outside the air guide assembly enters the cover from the air inlet and flows out of the cover from the air outlet, so that the air in the cover flows, thereby reducing the temperature of the air in the cover. This helps to reduce the air temperature at the air inlet of the GPU module. It can also ensure that the GPU module in each storage space can obtain sufficient airflow and good exhaust effect.

[0011] In one embodiment, the electronic device further comprises a chassis and a mounting bracket, the chassis comprises a first side panel and a second side panel spaced apart along the first direction, the mounting bracket is connected between the first side panel and the second side panel, and the air guide assembly and the mounting bracket are mounted on the mounting bracket. The mounting bracket is used to fix the air guide assembly to the chassis, so that the positions of the air guide assembly and the GPU module are relatively fixed to improve the heat dissipation performance.

[0012] In one embodiment, the first side panel is provided with at least two mounting positions spaced apart along the second direction, and the mounting bracket is installed at any one of the mounting positions. The multiple mounting positions allow the position of the mounting bracket to be adjusted to adapt to the layout of the positions of the internal components of the server. The mounting bracket can be installed in different mounting positions according to the size of the GPU module, so that the position of the air guide assembly is variable to adapt to GPU modules of different sizes.

[0013] In one embodiment, the GPU module includes a connector, which is connected to the mounting bracket, so that the GPU module can be firmly installed to prevent it from shaking. The air guide assembly and the GPU module are both connected to the mounting bracket so that the relative positions of the two are fixed, so that the electronic device can maintain a good heat dissipation effect.

[0014] The embodiment of the present application also provides an air guide structure, which includes a cover body and a plurality of partition groups, each of the partition groups includes a plurality of partitions spaced apart along a first direction, and each of the partition groups extends along a second direction; each of the plurality of partition groups can be detachably connected to the cover body. The lengths of any two of the partition groups along the second direction are different, and the plurality of partition groups can be replaced with each other to meet the size requirements of different devices to be cooled. The first direction is perpendicular to the second direction. The air guide structure can reduce the problem of wind cross-flow between the devices to be cooled, so that the devices to be cooled can dissipate heat in their respective heat dissipation channels, thereby improving the heat dissipation efficiency.

[0015] In one embodiment, the cover body includes a top plate and side plates connected to each other, a plurality of partitions are connected to the top plate and the side plates, and the top plate, the side plates and the partitions are perpendicular to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0017] Figure 2 A schematic diagram of the structure of a GPU module provided in an embodiment of the present application;

[0018] Figure 3 A schematic diagram of the structure of a GPU module from another angle provided in an embodiment of the present application;

[0019] Figure 4 A schematic diagram of the structure of an electronic device provided in another embodiment of the present application;

[0020] Figure 5 A schematic diagram of the structure of an air guide assembly provided in an embodiment of the present application;

[0021] Figure 6 A schematic structural diagram of another angle air guide assembly provided in an embodiment of the present application;

[0022] Figure 7 An assembly diagram of a chassis and a mounting bracket provided for an embodiment of the present application;

[0023] Figure 8 An assembly diagram of a chassis, a mounting bracket, and a GPU module provided in an embodiment of the present application.

[0024] Reference numerals:

[0025] 1-air guide assembly; 2-GPU module; M-first direction; N-second direction; 101-partition; 201-air inlet; 202-air outlet; 203-fan assembly; 204-base plate; 205-fin heat sink; 206-chip assembly; 3-chassis; 102-cover; A-first end; B-second end; 1021-top plate; 1022-side plate; 10221-air inlet; 10211-outlet Air hole; 4-mounting bracket; 207-connecting piece; 31-first side panel; 32-second side panel; 33-third side panel; 51-limiting I-pin; 41-first mounting arm; 411-limiting slot; 42-crossbeam; 421-first guide hole; 422-first fixing hole; 423-second guide hole; 424-second fixing hole; 2071-second guide pin; 1023-flange; 10231-avoidance hole. DETAILED DESCRIPTION

[0026] In order to make the objectives, technical solutions and advantages of the present application more clear, the present application is further described in detail below with reference to the accompanying drawings.

[0027] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.

[0028] References to "one embodiment" or "a specific embodiment" in this specification mean that one or more embodiments of the present application include a particular feature, structure or characteristic described in conjunction with the embodiment. The terms "include", "comprises", "has" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0029] In some related technologies, there are two main cooling methods for chip cooling (including CPU and GPU): air cooling and water cooling. Under the same power consumption, water cooling has stronger heat dissipation capacity, but it is expensive, so air cooling is often used. The working principle of air cooling is that a large amount of heat generated by the CPU or GPU during operation is transferred to the radiator, causing the radiator to heat up. Under the action of the fan, the radiator transfers heat with the surrounding air. When the heat dissipated by the radiator is equal to the heat generated at the maximum power consumption of the CPU or GPU, the temperature reaches a balanced and stable state.

[0030] The air inlet and air outlet of the GPU module with an active cooling fan are located on opposite sides of the GPU module. Air enters from the air inlet and flows out from the air outlet, thereby taking away the heat of the GPU module. The GPU server includes multiple GPU modules arranged in sequence, and the air inlet side of the GPU module is opposite to the air outlet side of an adjacent GPU module. This will cause the hot air discharged from the air outlet side of the previous GPU module to be directly sucked into the next GPU module, causing the temperature of the GPU module that sucks in the hot air to rise and the heat dissipation performance to decrease.

[0031] In order to solve the above problems, the present application provides an electronic device and an air guide structure, which can improve the heat dissipation performance of the GPU module 2, thereby improving the heat dissipation performance of the electronic device.

[0032] like Figure 1 As shown, an electronic device provided by an embodiment of the present application includes: an air guide component 1 and a plurality of GPU modules 2, wherein the plurality of GPU modules 2 are arranged at intervals along a first direction M, and each GPU module 2 has an air inlet 201 and an air outlet 202 that are mutually divergent along the first direction M. The air guide component 1 includes a plurality of partitions 101, wherein the plurality of partitions 101 are arranged at intervals along the first direction M, and each partition 101 is located in the gap between two adjacent GPU modules 2 and is opposite to the air outlet 202. The partition 101 is used to isolate the air outlet 202 and the air inlet 201 of two adjacent GPU modules 2. In this way, the hot air discharged from the air outlet 202 of the GPU module 2 is blocked by the partition 101, thereby avoiding direct entry into the air inlet 201 of the adjacent GPU module 2. A portion of the hot air flowing out of the air outlet 202 of the GPU module 2 bypasses the partition 101 and enters the air inlet 201. This path is relatively longer than the path directly entering the air inlet 201. During the flow of this longer path, the temperature of the exhausted hot air gradually decreases. When it enters the air inlet 201 of the adjacent GPU module 2, the hot air has naturally cooled down. The GPU module 2 inhales the cooled air to dissipate heat, and the heat dissipation efficiency is relatively high. At the same time, the cold air around the partition 101 can also enter the air inlet 201 of the GPU module 2, thereby improving the heat dissipation effect of the GPU module 2.

[0033] Figure 2 A schematic diagram of the structure of a GPU module provided in an embodiment of the present application, Figure 3 This is a schematic diagram of the structure of a GPU module from another angle provided by an embodiment of the present application. Figure 2 and Figure 3As shown, in one embodiment, the GPU module 2 includes a GPU body and a fan assembly 203, and the GPU body includes a chip assembly 206, a substrate 204 and a fin heat sink 205. The chip is installed between the substrate 204 and the fin heat sink 205. The heat generated by the chip assembly 206 is transferred to the fin heat sink 205, and the heat is dissipated through the fin heat sink 205. The fan assembly 203 is installed on the side of the GPU body away from the substrate 204, and is used to introduce external cold air into the GPU module 2 to accelerate the heat dissipation of the fin heat sink 205. A plurality of hollow structures are provided on the substrate 204, and the hollow structures are the air outlets 202 of the GPU module. The fan assembly 203 inhales air for the GPU module 2, and the air enters the GPU body, dissipates the heat for the fin heat sink 205 and the chip assembly 206, and then flows out from the air outlet 202 on the other side of the GPU module 2. The fan assembly 203 may include a plurality of fans to improve the heat dissipation efficiency of the GPU module 2, and the plurality of fans are arranged along the second direction N. When the GPU module 2 is installed in the GPU server, the electronic device slot can be installed in a vertical insertion mode, which can reduce the occupied space so that the electronic device can install more GPU modules. Usually, the GPU modules in the GPU server are installed horizontally. In this installation mode, the air inlet 201 and the air outlet 202 of two adjacent GPU modules 2 are opposite. The vertical projection of the partition 101 on the substrate 204 completely covers the air outlet 202 to block the flow channel of the hot air flowing out of the air outlet 202, preventing the hot air from directly entering the air inlet 201 of the adjacent GPU module, causing the temperature of the GPU module to rise instead of falling.

[0034] Figure 4 A schematic diagram of the structure of an electronic device provided in another embodiment of the present application is shown in FIG. Figure 4 As shown, the electronic device further includes a chassis 3 and a motherboard (not shown in the figure), the motherboard is mounted on the bottom surface of the chassis 3, and a plurality of slots (not shown in the figure) are arranged at intervals along a first direction M on the side of the motherboard away from the bottom surface of the chassis 3. The above-mentioned multiple GPU modules 2 are installed in a one-to-one correspondence with the slots. Specifically, each GPU module 2 includes a gold finger, which is plugged into the slot, and the GPU module 2 transmits electrical signals to the motherboard through the gold finger.

[0035] When assembling the electronic device, the GPU module 2 is first installed in the slot, and then the air guide assembly 1 is installed. Figure 5 A schematic diagram of the structure of the air guide assembly provided in the embodiment of the present application, Figure 6 This is a schematic diagram of the structure of another angle wind guide assembly provided in an embodiment of the present application. Figure 5 and Figure 6As shown, in order to facilitate the installation of the plurality of baffles 101, in one embodiment, the air guide assembly 1 further includes a cover 102, wherein the plurality of baffles 101 are installed in the cover 102, and the cover 102 is used to carry the plurality of baffles 101, so that the air guide assembly 1 forms an integrated mounting part, which facilitates the installation of the baffles 101. The cover 102 is disposed outside the plurality of GPU modules 2.

[0036] Please combine Figure 2 to Figure 4 In a further embodiment, the GPU module 2 extends in a second direction N, and the GPU module 2 includes a first end A and a second end B arranged along the second direction N, the first direction M is perpendicular to the second direction N, the air outlet 202 is located at the first end A, and the cover 102 is covered at the first end A of the GPU module 2. Specifically, one end of the cover 102 is closed and the other end is open along the first direction M. The cover 102 is covered at the first end A of the GPU module 2, and the GPU module 2 extends from one end of the cover 102 to the outside of the cover 102. In this way, there is an open space above the second end B of the GPU module 2, which is conducive to the flow of air, thereby improving the heat dissipation efficiency of the GPU module 2.

[0037] Figure 5 A schematic diagram of the structure of the air guide assembly provided in the embodiment of the present application, Figure 6 This is a schematic diagram of the structure of another angle wind guide assembly provided in an embodiment of the present application. Figure 5 and Figure 6 As shown, in one embodiment, the cover body 102 includes a top plate 1021 and a side plate 1022 connected to each other, and a plurality of partitions 101 are detachably connected to the top plate 1021 and the side plate 1022. Due to the different models of the GPU module 2, the length of the GPU module 2 is different, and accordingly, the position of its air inlet 201 will also be relatively adjusted. Therefore, the partition 101 can include multiple models to adapt to the position of the air inlet 201 of different models of GPU modules 2 and shield them.

[0038] In one embodiment, the length of the N partition plates 101 along the second direction may be equal to the length of the top plate 1021. Alternatively, the length of the N partition plates 101 along the second direction may be greater than the length of the top plate 1021. Alternatively, the length of the N partition plates 101 along the second direction may be less than the length of the top plate 1021. When replacing partition plates 101 of different lengths, the cover body 102 may not be replaced to save costs.

[0039] In one embodiment, the partition 101 divides the cover 102 into a plurality of accommodating spaces, and each GPU module 2 is located in one accommodating space. An air inlet 10221 is provided at a position of the side panel 1022 corresponding to each accommodating space, and an air outlet 10211 is provided at a position of the top panel 1021 corresponding to each accommodating space. The air outside the air guide assembly 1 enters the cover 102 from the air inlet 10221 and flows out of the cover 102 from the air outlet 202, so that the air in the cover 102 flows, thereby reducing the temperature of the air in the cover 102. This helps to reduce the air temperature at the air inlet 201 of the GPU module 2. It can also ensure that the GPU module 2 in each accommodating space can obtain sufficient wind flow and good exhaust effect.

[0040] Figure 7 The assembly diagram of the chassis and the mounting bracket provided in the embodiment of the present application is as follows: Figure 7 As shown, in one embodiment, the electronic device further includes a mounting bracket 4, the chassis 3 includes a first side panel 31 and a second side panel 32 spaced apart along a first direction M, the mounting bracket 4 is connected between the first side panel 31 and the second side panel 32, and the air guide assembly 1 is mounted on the mounting bracket 4. The mounting bracket is used to fix the air guide assembly 1 to the chassis 3, so that the positions of the air guide assembly 1 and the GPU module 2 are relatively fixed.

[0041] Figure 8 The assembly diagram of the chassis, mounting bracket and GPU module provided in the embodiment of the present application is combined with Figure 4 and Figure 8 In one embodiment, the chassis 3 further includes a third side panel 33, and the third side panel 33 is fixedly connected between the first side panel 31 and the second side panel 32. The mounting bracket 4, the first side panel 31, the second side panel 32 and the third side panel 33 enclose an installation space. Multiple GPU modules 2 are located in the installation space. Since the length dimensions of GPU modules 2 of different models and brands along the second direction N are different, and the third side panel 33 is fixedly connected to the first side panel 31 and the second side panel 32 respectively, the position of the third side panel 33 cannot be moved. In order to enable the electronic device to be compatible with GPU modules 2 of different lengths, the first side panel 31 and the second side panel 32 are respectively provided with at least two groups of mounting positions spaced apart along the second direction N, and the mounting bracket 4 can be installed in any group of mounting positions. Multiple groups of mounting positions make the distance between the mounting bracket 4 and the third side panel 33 variable, and the mounting bracket 4 can be installed in different mounting positions according to the size of the GPU module 2, so that the position of the air guide assembly 1 is variable to adapt to GPU modules 2 of different sizes.

[0042] The mounting bracket 4 can be connected to different mounting positions of the chassis 3 by means of connecting members such as fixing pins and screws. In a specific embodiment, a plurality of limiting I-shaped nails 51 are respectively provided on the first side panel 31 and the second side panel 32, and the limiting I-shaped nails 51 on each side panel are spaced at a preset distance. The limiting I-shaped nails 51 of the first side panel 31 correspond to the limiting I-shaped nails 51 of the second side panel 32 in position. The mounting bracket 4 includes a first mounting arm 41 and a second mounting arm (not shown in the figure), the first mounting arm 41 is connected to the first side panel 31, and the second mounting arm is connected to the second side panel 32. The first mounting arm 41 and the second mounting arm are respectively spaced apart from each other by a plurality of limiting card slots 411. The spacing of the limiting card slots 411 is the same as the spacing of the limiting I-shaped nails 51. The limiting I-shaped nails 51 are snapped into the limiting card slots 411 to achieve the fixing of the mounting bracket 4 and the chassis 3.

[0043] The limiting slot 411 is a hole structure, and the shape of the hole structure can be approximately triangular, narrow at the top and wide at the bottom. During installation, the limiting I-shaped nail 51 is passed through the wider position of the limiting slot 411, and then the installation arm is moved downward so that the limiting I-shaped nail 51 is clamped at the narrower position at the top of the limiting slot 411. The mounting bracket 4 falls under the action of gravity and is firmly clamped with the limiting I-shaped nail 51.

[0044] Combination Figures 4 to 8 In one embodiment, the GPU module 2 includes a connector 207, which is connected to the mounting bracket 4 and is used to fix the GPU module 2 and the mounting bracket 4 together. The connector 207 can be located at the first end A of the GPU module 2. Specifically, the mounting bracket 4 also includes a crossbeam 42, which is connected between the first mounting arm 41 and the second mounting arm, and the crossbeam 42 extends along the first direction M. The crossbeam 42 is provided with a first guide hole 421, a first fixing hole 422, a second guide hole 423 and a second fixing hole 424. The cover body 102 is provided with a flange 1023 for connecting with the mounting bracket 4, and the flange 1023 is connected to the side plate 1022. The flange 1023 is provided with a first guide pin (not shown in the figure) corresponding to the first guide hole 421. During installation, the first guide pin is inserted into the first guide hole 421 to achieve alignment between the air guide assembly 1 and the mounting bracket 4. The connecting piece 207 of the GPU module 2 is provided with a second guide pin 2071 corresponding to the second guide hole 423, and the second guide pin 2071 is inserted into the second guide hole 423 to realize the alignment of the GPU module 2 and the mounting bracket 4. Then the air guide assembly 1 is connected to the first fixing hole 422 by screws, and the GPU module 2 is connected to the second fixing hole 424. The flange 1023 is provided with an avoidance hole 10231 and a mounting through hole. The avoidance hole 10231 is used to avoid the connecting piece 207. After the cover body 102 is installed on the mounting bracket 4, the connecting piece 207 can be exposed from the cover body 102 through the avoidance hole 10231, which is convenient for users to maintain the GPU module 2.

[0045] The first fixing hole 422 and the second fixing hole 424 can be sprout holes, and the hole wall of the sprout hole is provided with threads, and the air guide assembly 1 can be fixed to the sprout hole by screws passing through the mounting through hole. During assembly, the GPU module is first connected to the mounting bracket 4, and then the air guide assembly 1 is connected to the mounting bracket 4.

[0046] Combination Figures 4 to 6 , the embodiment of the present application also provides a wind guide structure, which includes a cover body 102 and a plurality of baffle groups, each baffle group includes a plurality of baffles 101 arranged at intervals along a first direction M, each baffle 101 extends along a second direction N, and the first direction M is perpendicular to the second direction N. Among them, each baffle group in the plurality of baffle groups can be detachably connected to the cover body 102. After the wind guide structure is installed on the device, each baffle 101 is used to isolate two adjacent heat dissipation devices in the device. The heat dissipation device is a device with an independent heat dissipation fan, and its air inlet 201 and air outlet 202 are separated from each other. The baffle 101 can block the heat dissipation channel between two adjacent heat dissipation devices, and prevent the hot air flowing out of the air outlet 202 of the previous heat dissipation device from directly entering the air inlet 201 of the next heat dissipation device, resulting in an increase in the temperature of the heat dissipation device and a reduction in the heat dissipation efficiency. The wind guide structure can reduce the problem of wind cross-flow between the heat dissipation devices, so that the heat dissipation devices can be cooled in their respective heat dissipation channels, thereby improving the heat dissipation efficiency.

[0047] The lengths of any two baffle groups along the second direction N are different, so that the air guide structure can be compatible with heat dissipation devices with independent heat dissipation fans of different lengths, models, and brands. At the same time, the replaceable baffle groups can also reduce the production cost of the air guide structure.

[0048] The above-mentioned device to be cooled may specifically be a chip module such as a GPU module 2 and a CPU module.

[0049] In one embodiment, the cover body 102 includes a top plate 1021 and a side plate 1022 connected to each other, a plurality of partitions 101 are connected to the top plate 1021 and the side plates 1022, and the top plate 1021, the side plates 1022 and the partitions 101 are perpendicular to each other.

[0050] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. An electronic device, characterized in that: include: An air guide assembly and a plurality of GPU modules, wherein the plurality of GPU modules are arranged at intervals along a first direction, and each of the GPU modules comprises an air inlet and an air outlet that are mutually divergent along the first direction. The air guide assembly includes a plurality of partitions, and the plurality of partitions are spaced apart along the first direction. Each of the partitions is located in the gap between two adjacent GPU modules and is opposite to the air outlet. The partition is used to isolate the air outlet and the air inlet of two adjacent GPU modules.

2. The electronic device according to claim 1, characterized in that: The air guide assembly further includes a cover body, the plurality of partitions are installed in the cover body, and the cover body is disposed outside the plurality of GPU modules.

3. The electronic device according to claim 2, characterized in that: The GPU module extends in a second direction, and the GPU module includes a first end and a second end arranged along the second direction, the first direction is perpendicular to the second direction, the air outlet is located at the first end, and the cover is located at the first end.

4. The electronic device according to claim 2, characterized in that: The cover body comprises a top plate and side plates connected to each other, and the plurality of partitions are detachably connected to the top plate and the side plates.

5. The electronic device according to claim 4, characterized in that: The partition divides the cover into a plurality of accommodating spaces, each of the GPU modules is located in one of the accommodating spaces, the side panels are provided with air inlets at positions corresponding to each of the accommodating spaces, and the top panels are provided with air outlets at positions corresponding to each of the accommodating spaces.

6. The electronic device according to claim 1, characterized in that: The electronic device also includes a chassis and a mounting bracket, the chassis includes a first side panel and a second side panel spaced apart along the first direction, the mounting bracket is connected between the first side panel and the second side panel, and the air guide assembly is mounted on the mounting bracket.

7. The electronic device according to claim 6, characterized in that: The first side plate is provided with at least two installation positions spaced apart along a second direction, the installation bracket is installed at any one of the installation positions, and the second direction is perpendicular to the first direction.

8. The electronic device according to claim 6, characterized in that: The GPU module includes a connecting piece, and the connecting piece is connected to the mounting bracket.

9. A wind guide structure, characterized in that: It includes a cover body and a plurality of partition groups, each of the partition groups includes a plurality of partitions spaced apart along a first direction, and each of the partitions extends along a second direction; each of the plurality of partition groups can be detachably connected to the cover body, and the lengths of any two of the partition groups along the second direction are different, and the first direction is perpendicular to the second direction.

10. The wind guide structure according to claim 9, characterized in that: The cover body includes a top plate and side plates connected to each other, a plurality of partitions are connected to the top plate and the side plates, and the top plate, the side plates and the partitions are perpendicular to each other.

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