Temperature field simulation method, device, equipment, medium and product for plate-fin heat exchanger

Abstract

The present application discloses a temperature field simulation method, device, equipment, medium and product for a plate-fin heat exchanger, and relates to the field of heat exchanger testing technology. The method comprises: obtaining material parameters of fins in a plate-fin heat exchanger; calculating configuration parameters of a monomer equivalent model based on the material parameters; constructing a plate-fin heat exchanger equivalent based on the monomer equivalent model configuration parameters, wherein the plate-fin heat exchanger equivalent is a layered structure in which a partition, a cold-side fin equivalent, a partition and a hot-side fin equivalent are periodically and repeatedly superimposed; and constructing a plate-fin heat exchanger equivalent heating model using the plate-fin heat exchanger equivalent to simulate the heating process of the plate-fin heat exchanger to obtain a transient temperature field state.

Description

Technical Field

[0001] The present application relates to the field of heat exchanger testing technology, and in particular to a temperature field simulation method, device, equipment, medium and product for a plate-fin heat exchanger. Background Art

[0002] Plate-fin heat exchangers, due to their compact structure, lightweight design, and high heat transfer efficiency, are widely used in industries such as refrigeration, petrochemicals, air separation, aerospace, power machinery, and superconductors. They are recognized as a new type of efficient heat exchanger. Analyzing the temperature field distribution during the heating process through simulation of a plate-fin heat exchanger is crucial for studying its heating methods and parameters.

[0003] Then, due to the complex layered structure characteristics of the plate-fin heat exchanger, such as small fin size, thin fin thickness, and tens of thousands of fin cycles in the complete heat exchanger core, if a simulation model is directly constructed based on the actual structure of the plate-fin heat exchanger, when performing finite element analysis on the simulation model, the number of grids divided based on the above simulation model is too large, that is, the number of solution units is too large. The current general high-end configuration server nodes cannot provide sufficient computing power for solving. Even if it can be processed, the efficiency of simulating the heating process to calculate the transient temperature field state is too low. Summary of the Invention

[0004] The purpose of this application is to provide a temperature field simulation method, device, equipment, medium and product for a plate-fin heat exchanger.

[0005] To achieve the above objectives, this application provides the following solutions:

[0006] In a first aspect, the present application provides a temperature field simulation method for a plate-fin heat exchanger, comprising:

[0007] Obtain the material parameters of the fins in the plate-fin heat exchanger;

[0008] Calculating monomer equivalent body model configuration parameters based on the material parameters;

[0009] Based on the configuration parameters of the monomer equivalent model, a plate-fin heat exchanger equivalent is constructed, wherein the plate-fin heat exchanger equivalent is a layered structure composed of a baffle, a cold-side fin equivalent, a baffle, and a hot-side fin equivalent that are periodically and repeatedly stacked;

[0010] A plate-fin heat exchanger equivalent heating model is constructed using the plate-fin heat exchanger equivalent, and a heating process of the plate-fin heat exchanger is simulated to obtain a transient temperature field state.

[0011] Optionally, the material parameters include at least: material size parameters, material performance parameters;

[0012] The step of calculating the configuration parameters of the monomer equivalent body model based on the material parameters includes:

[0013] The material performance parameters are converted into monomer equivalent body model configuration parameters based on the material size parameters.

[0014] Optionally, the material size parameters include at least fin length, fin height, and fin thickness; the material performance parameters include at least fin thermal conductivity, fin electrical conductivity, and fin specific heat capacity; and the monomer equivalent body model configuration parameters include at least equivalent body thermal conductivity, equivalent body electrical conductivity, and equivalent body specific heat capacity.

[0015] The step of converting the material performance parameters into monomer equivalent body model configuration parameters based on the material size parameters includes:

[0016] The fin thermal conductivity is converted into the equivalent bulk thermal conductivity based on the fin length, the fin height, and the fin thickness, the fin electrical conductivity is converted into the equivalent bulk electrical conductivity based on the fin length, the fin height, and the fin thickness, and the fin specific heat capacity is converted into the equivalent bulk specific heat capacity based on the fin length, the fin height, and the fin thickness.

[0017] Optionally, the equivalent body thermal conductivity includes: a first thermal conductivity in the bending direction of the fin, a second thermal conductivity in the fluid flow direction, and a third thermal conductivity in the stacking direction of the fin and the partition;

[0018] The step of converting the fin thermal conductivity into the equivalent body thermal conductivity based on the fin length, the fin height, and the fin thickness comprises:

[0019] Substituting the fin length, the fin height, the fin thickness, and the fin thermal conductivity into the following formula, a first thermal conductivity in the fin bending direction, a second thermal conductivity in the fluid flow direction, and a third thermal conductivity in the stacking direction of the fin and the partition are obtained:

[0020]

[0021] Among them, T s is the fin thickness, L s is the fin length, H s is the fin height, δ m is the fin thermal conductivity, δ i , i = x, y, z is the thermal conductivity of the equivalent body in different directions, the x direction is the bending direction of the fin, the y direction is the flow direction of the fluid in the fin, and the z direction is the stacking direction of the fin and the partition.

[0022] Optionally, the equivalent body conductivity includes: a first conductivity in the fin bending direction, a second conductivity in the fluid flow direction, and a third conductivity in the fin and partition stacking direction;

[0023] The step of converting the fin conductivity into the equivalent body conductivity based on the fin length, the fin height, and the fin thickness comprises:

[0024] Substituting the fin length, the fin height, the fin thickness, and the fin conductivity into the following formula, a first conductivity in the fin bending direction, a second conductivity in the fluid flow direction, and a third conductivity in the fin and separator stacking direction are obtained:

[0025]

[0026] Among them, T s is the fin thickness, L s is the fin length, H s is the fin height, ρ m is the fin conductivity, ρ i , i = x, y, z is the conductivity of the equivalent body in different directions, the x direction is the bending direction of the fin, the y direction is the flow direction of the fluid in the fin, and the z direction is the stacking direction of the fin and the partition.

[0027] Optionally, the step of converting the fin specific heat capacity into the equivalent body specific heat capacity based on the fin length, the fin height, and the fin thickness includes:

[0028] Substitute the fin length, the fin height, the fin thickness and the fin specific heat capacity into the following formula to calculate the equivalent body specific heat capacity:

[0029]

[0030] Among them, C d is the specific heat capacity of the fin equivalent body, C m is the specific heat capacity of the material, T s is the fin thickness, L s is the fin length, H s is the fin height.

[0031] Optionally, the step of using the plate-fin heat exchanger equivalent to simulate the heating process of the plate-fin heat exchanger to obtain a transient temperature field state includes:

[0032] The plate-fin heat exchanger is simulated by using the plate-fin heat exchanger monomer equivalent heating model to obtain a transient temperature field state during the radiation heating and / or self-resistance heating process.

[0033] In a second aspect, the present application provides a temperature field simulation device for a plate-fin heat exchanger, comprising:

[0034] An acquisition module, used for acquiring material parameters of fins in a plate-fin heat exchanger;

[0035] a processing module, configured to calculate configuration parameters of a monomer equivalent body model based on the material parameters;

[0036] A simulation module configured to construct a plate-fin heat exchanger equivalent based on the configuration parameters of the monomer equivalent model, wherein the plate-fin heat exchanger equivalent is a layered structure composed of a baffle, a cold-side fin equivalent, a baffle, and a hot-side fin equivalent that are periodically and repeatedly stacked;

[0037] A plate-fin heat exchanger equivalent heating model is constructed using the plate-fin heat exchanger equivalent, and a heating process of the plate-fin heat exchanger is simulated to obtain a transient temperature field state.

[0038] Optionally, the material parameters include at least: material size parameters, material performance parameters;

[0039] The processing module is further configured to:

[0040] The material performance parameters are converted into monomer equivalent body model configuration parameters based on the material size parameters.

[0041] Optionally, the material size parameters include at least fin length, fin height, and fin thickness; the material performance parameters include at least fin thermal conductivity, fin electrical conductivity, and fin specific heat capacity; and the monomer equivalent body model configuration parameters include at least equivalent body thermal conductivity, equivalent body electrical conductivity, and equivalent body specific heat capacity.

[0042] The processing module is further configured to:

[0043] The fin thermal conductivity is converted into the equivalent bulk thermal conductivity based on the fin length, the fin height, and the fin thickness, the fin electrical conductivity is converted into the equivalent bulk electrical conductivity based on the fin length, the fin height, and the fin thickness, and the fin specific heat capacity is converted into the equivalent bulk specific heat capacity based on the fin length, the fin height, and the fin thickness.

[0044] Optionally, the equivalent body thermal conductivity includes: a first thermal conductivity in the bending direction of the fin, a second thermal conductivity in the fluid flow direction, and a third thermal conductivity in the stacking direction of the fin and the partition;

[0045] The processing module is further configured to:

[0046] Substituting the fin length, the fin height, the fin thickness, and the fin thermal conductivity into the following formula, a first thermal conductivity in the fin bending direction, a second thermal conductivity in the fluid flow direction, and a third thermal conductivity in the stacking direction of the fin and the partition are obtained:

[0047]

[0048] Among them, T s is the fin thickness, L s is the fin length, H s is the fin height, δ m is the fin thermal conductivity, δ i , i = x, y, z is the thermal conductivity of the equivalent body in different directions, the x direction is the bending direction of the fin, the y direction is the flow direction of the fluid in the fin, and the z direction is the stacking direction of the fin and the partition.

[0049] Optionally, the equivalent body conductivity includes: a first conductivity in the fin bending direction, a second conductivity in the fluid flow direction, and a third conductivity in the fin and partition stacking direction;

[0050] The processing module is further configured to:

[0051] Substituting the fin length, the fin height, the fin thickness, and the fin conductivity into the following formula, a first conductivity in the fin bending direction, a second conductivity in the fluid flow direction, and a third conductivity in the fin and separator stacking direction are obtained:

[0052]

[0053] Among them, T s is the fin thickness, L s is the fin length, H s is the fin height, ρ m is the fin conductivity, ρ i , i = x, y, z is the conductivity of the equivalent body in different directions, the x direction is the bending direction of the fin, the y direction is the flow direction of the fluid in the fin, and the z direction is the stacking direction of the fin and the partition.

[0054] Optionally, the processing module is further configured to:

[0055] Substitute the fin length, the fin height, the fin thickness and the fin specific heat capacity into the following formula to calculate the equivalent body specific heat capacity:

[0056]

[0057] Among them, C d is the specific heat capacity of the fin equivalent body, C mis the specific heat capacity of the material, T s is the fin thickness, L s is the fin length, H s is the fin height.

[0058] Optionally, the simulation module is further configured to:

[0059] The plate-fin heat exchanger is simulated by using the plate-fin heat exchanger monomer equivalent heating model to obtain a transient temperature field state during the radiation heating and / or self-resistance heating process.

[0060] In a third aspect, the present application provides a computer device comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the temperature field simulation method for a plate-fin heat exchanger described in any one of the above.

[0061] In a fourth aspect, the present application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the temperature field simulation method of a plate-fin heat exchanger described in any one of the above.

[0062] In a fifth aspect, the present application provides a computer program product, comprising a computer program, which, when executed by a processor, implements the steps of the temperature field simulation method of a plate-fin heat exchanger described in any one of the above.

[0063] According to the specific embodiments provided in this application, this application discloses the following technical effects:

[0064] The present application provides a temperature field simulation method, device, equipment, medium and product for a plate-fin heat exchanger. By calculating the configuration parameters of a single equivalent model based on the material parameters of the plate-fin heat exchanger, a plate-fin heat exchanger equivalent with a simple structure is constructed for a plate-fin heat exchanger with a complex structure. Therefore, a heating model can be built through the plate-fin heat exchanger equivalent, and the heating process of the plate-fin heat exchanger can be efficiently simulated. It is adapted to the feature that the plate-fin heat exchanger equivalent divides the number of grids, which can effectively reduce the calculation amount of the temperature field simulation of the plate-fin heat exchanger and improve the efficiency of the temperature field simulation of the plate-fin heat exchanger. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0066] Figure 1A schematic flow chart of a temperature field simulation method for a plate-fin heat exchanger provided in one embodiment of the present application;

[0067] Figure 2 This is one of the schematic diagrams of a plate-fin heat exchanger provided in one embodiment of the present application;

[0068] Figure 3 This is a second schematic diagram of a plate-fin heat exchanger provided in one embodiment of the present application;

[0069] Figure 4 A schematic diagram of a plate-fin heat exchanger equivalent provided in one embodiment of the present application;

[0070] Figure 5 This is one of the effect schematic diagrams of a temperature field simulation method for a plate-fin heat exchanger provided in one embodiment of the present application;

[0071] Figure 6 This is a second schematic diagram of the effect of a temperature field simulation method for a plate-fin heat exchanger provided in one embodiment of the present application;

[0072] Figure 7 A schematic diagram of the architecture of a plate-fin heat exchanger in a vacuum brazing furnace using radiation heating and self-resistance heating, according to one embodiment of the present application;

[0073] Figure 8 A schematic diagram of the functional modules of a temperature field simulation device for a plate-fin heat exchanger provided in one embodiment of the present application;

[0074] Figure 9 A schematic diagram of a layered structure of a computer device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0075] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0076] like Figure 1 As shown, some embodiments of the present application provide a method for simulating the temperature field of a plate-fin heat exchanger, which includes the following steps 101 to 104.

[0077] Step 101: Obtain material parameters of fins in a plate-fin heat exchanger.

[0078] It should be noted that a plate-fin heat exchanger is composed of baffles, fins, seals, and guide vanes. Fins, guide vanes, and seals are placed between adjacent baffles to form a sandwich, called a channel. These sandwiches are stacked according to different fluid flow patterns and brazed together to form a plate bundle, which is the core of the plate-fin heat exchanger. It has an extended secondary heat transfer surface (fins), so the heat transfer process occurs not only on the primary heat transfer surface (baffles) but also on the secondary heat transfer surface. In addition to heat from the high-temperature side medium being transferred to the low-temperature side medium from the primary surface, some heat is also transferred along the height of the fin surface. That is, along the height of the fin, heat is poured in by the baffles and then transferred to the low-temperature side medium by convection. Because the fin height significantly exceeds the fin thickness, the heat conduction process along the fin height is similar to that of a homogeneous, slender guide rod. At this point, the thermal resistance of the fin cannot be ignored. The highest temperature at both ends of the fin is equal to the partition temperature. As the fin and the medium release heat through convection, the temperature continues to decrease until it reaches the medium temperature in the middle area of the fin.

[0079] In the examples of this application, refer to Figure 2 The plate-fin heat exchanger unit consists of a baffle, cold-side fins, and hot-side fins. The cold-side fins have 5 repeating periods in the fin bending direction, and the hot-side fins have 5 repeating periods in the fluid flow direction. Of course, this is only an exemplary description. The repetition period of the fins in the plate-fin heat exchanger unit can be set according to actual needs and is not limited here. Multiple plate-fin heat exchanger units can also be stacked and combined in the stacking direction of the fins and baffles to increase the repetition period cost of the fins. Research has found that if the repetition period of the plate-fin heat exchanger in the fluid flow direction and the bending direction is greater than 100, and the repetition period in the stacking direction of the fins and baffles is greater than 50, if a model is constructed to divide the grid, the number of grids will be in the hundreds of millions, which requires a huge amount of processing resources and the efficiency of the simulation experiment is too low. Therefore, the embodiment of the present application will reduce the number of divided grids by converting a complex plate-fin heat exchanger into a simple-structured single-body equivalent heat exchanger. This requires first obtaining the material parameters of the plate-fin heat exchanger that needs to simulate the heating process. The material parameters can be the size, material, performance indicators, etc. of the fin edge and partition. The specific settings can be based on actual needs and are not limited here.

[0080] Step 102: Calculate configuration parameters of a monomer equivalent body model based on the material parameters.

[0081] In the embodiment of the present application, compared with the repetition period greater than 1 in the direction of the partition and the fin, the monomer equivalent model has only one repetition period, and the material parameters of the plate-fin heat exchanger can be used to set the configuration parameters of the monomer equivalent model, so that the model subsequently constructed based on the configuration parameters of the monomer equivalent model is similar in size and performance to the plate-fin heat exchanger, which can better represent the actual structure of the plate-fin heat exchanger, making the temperature field state obtained by the simulation more accurate.

[0082] Step 103: construct a plate-fin heat exchanger equivalent based on the configuration parameters of the monomer equivalent model. The plate-fin heat exchanger equivalent is a layered structure composed of a baffle, a cold side fin equivalent, a baffle, and a hot side fin equivalent that are periodically and repeatedly stacked.

[0083] In an embodiment of the present application, a single-body plate-fin heat exchanger model can be pre-constructed using physical field modeling software, and then the obtained single-body equivalent model configuration parameters are input into the model to obtain a plate-fin heat exchanger equivalent body composed of a partition, a cold-side fin equivalent body, a partition, and a hot-side fin equivalent body stacked along the partition and fin stacking direction.

[0084] Step 104 : constructing a plate-fin heat exchanger equivalent heating model using the plate-fin heat exchanger equivalent, and simulating the heating process of the plate-fin heat exchanger to obtain a transient temperature field state.

[0085] In the embodiments of the present application, the transient temperature field state is an indicator parameter used to reflect the temperature field changes and distribution during the heating process of the heat exchanger. Physical field modeling software can be used to construct a heating model of the plate-fin heat exchanger equivalent, including the heat exchanger, heat shield, press, and heater, based on the already constructed plate-fin heat exchanger equivalent. This plate-fin heat exchanger equivalent heating model can then be used to simulate heating, thereby equivalently simulating the heating process of the plate-fin heat exchanger and calculating the transient temperature field state of the plate-fin heat exchanger.

[0086] This application calculates the configuration parameters of the monomer equivalent model based on the material parameters of the plate-fin heat exchanger, so as to construct a plate-fin heat exchanger equivalent with a simple structure for the plate-fin heat exchanger with a complex structure, so that the heating model can be built through the plate-fin heat exchanger equivalent, and the heating process of the plate-fin heat exchanger can be efficiently simulated. It is adapted to the feature of the plate-fin heat exchanger equivalent with a small number of grids, which can effectively reduce the calculation amount of the temperature field simulation of the plate-fin heat exchanger and improve the efficiency of the temperature field simulation of the plate-fin heat exchanger.

[0087] Optionally, the material parameters include at least material size parameters and material performance parameters, and step 102 includes converting the material performance parameters into monomer equivalent body model configuration parameters based on the material size parameters.

[0088] In the embodiments of the present application, the material size parameters are used to reflect the size parameters of the materials such as fins and baffles that make up the plate-fin heat exchanger, such as length, thickness, height, etc., which can be set according to actual needs and are not limited here. The material performance parameters are used to reflect the physical property parameters of the materials such as fins and baffles that make up the plate-fin heat exchanger, such as thermal conductivity, electrical conductivity, specific heat capacity, hardness, etc., which can be set according to actual needs and are not limited here. By determining the monomer equivalent model configuration parameters for generating the plate-fin heat exchanger equivalent based on the material size parameters and material performance parameters, the generated plate-fin monomer equivalent can be similar in size and performance to the plate-fin heat exchanger, and can better represent the actual structure of the plate-fin heat exchanger.

[0089] Optionally, the material size parameters include at least: fin length, fin height, and fin thickness; the material performance parameters include at least: fin thermal conductivity, fin electrical conductivity, and fin specific heat capacity; the monomer equivalent body model configuration parameters include at least: equivalent body thermal conductivity, equivalent body electrical conductivity, and equivalent body specific heat capacity, and step 102 includes: converting the fin thermal conductivity into the equivalent body thermal conductivity based on the fin length, the fin height, and the fin thickness, and converting the fin electrical conductivity into the equivalent body electrical conductivity based on the fin length, the fin height, and the fin thickness, and converting the fin specific heat capacity into the equivalent body specific heat capacity based on the fin length, the fin height, and the fin thickness.

[0090] In the embodiment of the present application, by fully considering the structural characteristics and performance characteristics of the plate-fin heat exchanger, the fin thermal conductivity, fin electrical conductivity and fin specific heat of the plate-fin heat exchanger are converted into equivalent body thermal conductivity, equivalent body electrical conductivity and equivalent body specific heat according to the fin length, fin height and fin thickness of the plate-fin heat exchanger, so that the generated plate-fin monomer equivalent can be similar in size and performance to the plate-fin heat exchanger, and can better represent the actual structure of the plate-fin heat exchanger.

[0091] Optionally, the equivalent body thermal conductivity includes: a first thermal conductivity in the fin bending direction, a second thermal conductivity in the fluid flow direction, and a third thermal conductivity in the fin and partition stacking direction. Step 102 includes:

[0092] Step 1021: Substitute the fin length, the fin height, the fin thickness, and the fin thermal conductivity into the following formula to obtain a first thermal conductivity in the fin bending direction, a second thermal conductivity in the fluid flow direction, and a third thermal conductivity in the fin and baffle stacking direction:

[0093]

[0094] Among them, Ts is the fin thickness, L s is the fin length, H s is the fin height, δ m is the fin thermal conductivity, δ i , i = x, y, z is the thermal conductivity of the equivalent body in different directions, the x direction is the bending direction of the fin, the y direction is the flow direction of the fluid in the fin, and the z direction is the stacking direction of the fin and the partition.

[0095] Optionally, the equivalent body conductivity includes: a first conductivity in the fin bending direction, a second conductivity in the fluid flow direction, and a third conductivity in the fin and partition stacking direction. Step 102 includes:

[0096] Step 1022: Substitute the fin length, the fin height, the fin thickness, and the fin conductivity into the following formula to obtain a first conductivity in the fin bending direction, a second conductivity in the fluid flow direction, and a third conductivity in the fin and baffle stacking direction:

[0097]

[0098] Among them, T s is the fin thickness, L s is the fin length, H s is the fin height, ρ m is the fin conductivity, ρ i , i = x, y, z is the conductivity of the equivalent body in different directions, the x direction is the bending direction of the fin, the y direction is the flow direction of the fluid in the fin, and the z direction is the stacking direction of the fin and the partition.

[0099] Optionally, step 102 includes:

[0100] Step 1023: Substitute the fin length, the fin height, the fin thickness, and the fin specific heat into the following formula to calculate the equivalent body specific heat capacity:

[0101]

[0102] Among them, C d is the specific heat capacity of the fin equivalent body, C m is the specific heat capacity of the material, T s is the fin thickness, L s is the fin length, H s is the fin height.

[0103] Optionally, the step 104 includes: simulating the plate-fin heat exchanger using the plate-fin heat exchanger monomer equivalent heating model to obtain a transient temperature field state during the radiation heating and / or self-resistance heating process.

[0104] For example, assume that the material parameters of a plate-fin heat exchanger are as shown in Table 1:

[0105]

[0106] Table 1

[0107] The temperature field simulation method of the plate-fin heat exchanger provided in some embodiments of the present application is used to convert the material of the plate-fin heat exchanger into the plate-fin heat exchanger equivalent configuration parameters shown in Table 2 below:

[0108]

[0109] Table 2

[0110] Then, the parameters in Table 1 above are used to construct a single plate-fin heat exchanger model. Figure 3 , using the parameters in Table 2 to construct the equivalent model of the plate-fin heat exchanger Figure 4 , in the right Figure 3 The temperature field state of the plate-fin heat exchanger monomer model after heating is as follows Figure 5 ,right Figure 4 The temperature field state of the plate-fin heat exchanger equivalent model after heating is as follows Figure 6 It can be seen that after heating, the temperature distributions of the two models are very close, which also illustrates the effectiveness of the temperature field simulation method of the plate-fin heat exchanger provided in some embodiments of the present application.

[0111] Reference Figure 7 , showing a schematic diagram of the architecture of a plate-fin heat exchanger radiant heating + self-resistance heating model in a vacuum brazing furnace provided by an embodiment of the present application. Generally speaking, the plate-fin heat exchanger has a repetition period greater than 100 in the x and y directions and a repetition period greater than 50 in the z direction. If meshing is performed, the amount of mesh data exceeds 100 million, making finite element calculations impossible. Using the method in this application, the plate-fin heat exchanger is modeled as a layered structure consisting of baffles, cold-side fin equivalents, baffles, and hot-side fin equivalents stacked along the z direction. The number of meshes is 710,000, allowing for transient finite element calculations.

[0112] Through the temperature field simulation method of the plate-fin heat exchanger provided in some embodiments provided in this application, the temperature field distribution of the plate-fin heat exchanger under the self-resistance-radiation composite heating state can be calculated, and the temperature field distribution of the plate-fin heat exchanger under the self-resistance heating or radiation heating state can also be calculated separately.

[0113] Based on the same inventive concept, embodiments of the present application also provide a plate-fin heat exchanger temperature field simulation device for implementing the aforementioned plate-fin heat exchanger temperature field simulation method. The solution provided by this device is similar to the solution described in the aforementioned method. Therefore, the specific limitations of one or more plate-fin heat exchanger temperature field simulation device embodiments provided below can be found in the aforementioned limitations of the plate-fin heat exchanger temperature field simulation method and will not be further elaborated here.

[0114] In an exemplary embodiment, Figure 8 As shown, a temperature field simulation device 20 for a plate-fin heat exchanger is provided, comprising:

[0115] An acquisition module 201 is used to acquire material parameters of fins in a plate-fin heat exchanger;

[0116] A processing module 202 is configured to calculate configuration parameters of a monomer equivalent body model based on the material parameters;

[0117] A simulation module 203 is configured to construct a plate-fin heat exchanger equivalent body based on the configuration parameters of the monomer equivalent body model, wherein the plate-fin heat exchanger equivalent body is a layered structure composed of a baffle, a cold side fin equivalent body, a baffle, and a hot side fin equivalent body that are periodically and repeatedly stacked;

[0118] A plate-fin heat exchanger equivalent heating model is constructed using the plate-fin heat exchanger equivalent, and a heating process of the plate-fin heat exchanger is simulated to obtain a transient temperature field state.

[0119] Optionally, the material parameters include at least: material size parameters, material performance parameters;

[0120] The processing module 202 is further configured to:

[0121] The material performance parameters are converted into monomer equivalent body model configuration parameters based on the material size parameters.

[0122] Optionally, the material size parameters include at least fin length, fin height, and fin thickness; the material performance parameters include at least fin thermal conductivity, fin electrical conductivity, and fin specific heat capacity; and the monomer equivalent body model configuration parameters include at least equivalent body thermal conductivity, equivalent body electrical conductivity, and equivalent body specific heat capacity.

[0123] The processing module 202 is further configured to:

[0124] The fin thermal conductivity is converted into the equivalent bulk thermal conductivity based on the fin length, the fin height, and the fin thickness, the fin electrical conductivity is converted into the equivalent bulk electrical conductivity based on the fin length, the fin height, and the fin thickness, and the fin specific heat capacity is converted into the equivalent bulk specific heat capacity based on the fin length, the fin height, and the fin thickness.

[0125] Optionally, the equivalent body thermal conductivity includes: a first thermal conductivity in the bending direction of the fin, a second thermal conductivity in the fluid flow direction, and a third thermal conductivity in the stacking direction of the fin and the partition;

[0126] The processing module 202 is further configured to:

[0127] Substituting the fin length, the fin height, the fin thickness, and the fin thermal conductivity into the following formula, a first thermal conductivity in the fin bending direction, a second thermal conductivity in the fluid flow direction, and a third thermal conductivity in the stacking direction of the fin and the partition are obtained:

[0128]

[0129] Among them, T s is the fin thickness, L s is the fin length, H s is the fin height, δ m is the fin thermal conductivity, δ i , i = x, y, z is the thermal conductivity of the equivalent body in different directions, the x direction is the bending direction of the fin, the y direction is the flow direction of the fluid in the fin, and the z direction is the stacking direction of the fin and the partition.

[0130] Optionally, the equivalent body conductivity includes: a first conductivity in the fin bending direction, a second conductivity in the fluid flow direction, and a third conductivity in the fin and partition stacking direction;

[0131] The processing module 202 is further configured to:

[0132] Substituting the fin length, the fin height, the fin thickness, and the fin conductivity into the following formula, a first conductivity in the fin bending direction, a second conductivity in the fluid flow direction, and a third conductivity in the fin and separator stacking direction are obtained:

[0133]

[0134] Among them, T s is the fin thickness, L s is the fin length, H s is the fin height, ρ m is the fin conductivity, ρ i, i = x, y, z is the conductivity of the equivalent body in different directions, the x direction is the bending direction of the fin, the y direction is the flow direction of the fluid in the fin, and the z direction is the stacking direction of the fin and the partition.

[0135] Optionally, the processing module 202 is further configured to:

[0136] Substitute the fin length, the fin height, the fin thickness and the fin specific heat capacity into the following formula to calculate the equivalent body specific heat capacity:

[0137]

[0138] Among them, C d is the specific heat capacity of the fin equivalent body, C m is the specific heat capacity of the material, T s is the fin thickness, L s is the fin length, H s is the fin height.

[0139] Optionally, the simulation module 203 is further configured to:

[0140] The plate-fin heat exchanger is simulated by using the plate-fin heat exchanger monomer equivalent heating model to obtain a transient temperature field state during the radiation heating and / or self-resistance heating process.

[0141] The embodiment of the present application calculates the configuration parameters of the monomer equivalent model based on the material parameters of the plate-fin heat exchanger, so as to construct a plate-fin heat exchanger equivalent with a simple structure for the plate-fin heat exchanger with a complex structure, so that a heating model can be built through the plate-fin heat exchanger equivalent, and the heating process of the plate-fin heat exchanger can be efficiently simulated. It is adapted to the feature of the plate-fin heat exchanger equivalent that a small number of grids are divided, which can effectively reduce the calculation amount of the temperature field simulation of the plate-fin heat exchanger and improve the efficiency of the temperature field simulation of the plate-fin heat exchanger.

[0142] In an exemplary embodiment, a computer device is provided. The computer device may be a server or a terminal. The internal structure diagram thereof may be as follows: Figure 9As shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, abbreviated as I / O) and a communication interface. The processor, memory and input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store temperature field simulation data of the plate-fin heat exchanger. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a temperature field simulation method of a plate-fin heat exchanger is implemented.

[0143] Those skilled in the art will understand that Figure 9 The layered structure shown in the figure is only a block diagram of a partial structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0144] In an exemplary embodiment, a computer device is further provided, including a memory and a processor. The memory stores a computer program, and the processor implements the steps in the above method embodiments when executing the computer program.

[0145] In an exemplary embodiment, a computer-readable storage medium is provided, storing a computer program. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0146] In an exemplary embodiment, a computer program product is provided, including a computer program. When the computer program is executed by a processor, the steps in the above method embodiments are implemented.

[0147] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0148] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, database or other media used in the embodiments provided in this application may include at least one of non-volatile and volatile memory. Non-volatile memory may include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory may include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM may be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0149] The databases involved in the various embodiments provided herein may include at least one of a relational database and a non-relational database. Non-relational databases may include, but are not limited to, distributed databases based on blockchains. The processors involved in the various embodiments provided herein may include, but are not limited to, general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic units, data processing logic units based on quantum computing, and the like.

[0150] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0151] This document uses specific examples to illustrate the principles and implementation methods of this application. The description of the above examples is only intended to help understand the method and core concept of this application. At the same time, for those skilled in the art, based on the concept of this application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting this application.

Claims

1. A temperature field simulation method for a plate-fin heat exchanger, characterized in that: The temperature field simulation method of the plate-fin heat exchanger includes: Obtain the material parameters of the fins in the plate-fin heat exchanger; Calculating monomer equivalent body model configuration parameters based on the material parameters; Based on the configuration parameters of the monomer equivalent model, a plate-fin heat exchanger equivalent is constructed, wherein the plate-fin heat exchanger equivalent is a layered structure composed of a baffle, a cold-side fin equivalent, a baffle, and a hot-side fin equivalent that are periodically and repeatedly stacked; A plate-fin heat exchanger equivalent heating model is constructed using the plate-fin heat exchanger equivalent, and a heating process of the plate-fin heat exchanger is simulated to obtain a transient temperature field state; The material parameters include at least material size parameters and material performance parameters, the material size parameters include at least fin length, fin height and fin thickness, and the material performance parameters include at least fin thermal conductivity, fin electrical conductivity and fin specific heat capacity; Calculating the monomer equivalent body model configuration parameters based on the material parameters includes converting the material performance parameters into monomer equivalent body model configuration parameters based on the material size parameters, wherein the monomer equivalent body model configuration parameters include at least equivalent body thermal conductivity, equivalent body electrical conductivity, and equivalent body specific heat capacity; The converting of the material performance parameters into single body equivalent model configuration parameters based on the material size parameters includes converting the fin thermal conductivity into the equivalent body thermal conductivity, converting the fin electrical conductivity into the equivalent body electrical conductivity, and converting the fin specific heat capacity into the equivalent body specific heat capacity in sequence based on the fin length, the fin height, and the fin thickness; The equivalent body thermal conductivity includes a first thermal conductivity in the fin bending direction, a second thermal conductivity in the fluid flow direction, and a third thermal conductivity in the fin and partition stacking direction. When converting to obtain the equivalent body thermal conductivity, the fin length, the fin height, the fin thickness, and the fin thermal conductivity are substituted into the following formula to obtain the first thermal conductivity in the fin bending direction, the second thermal conductivity in the fluid flow direction, and the third thermal conductivity in the fin and partition stacking direction: In the above formula, T s is the fin thickness, L s is the fin length, H s is the fin height, δ m is the thermal conductivity of the fin, δ i , i = x, y, z are the thermal conductivities of the equivalent body in different directions, the x direction is the fin bending direction, the y direction is the fluid flow direction in the fin, and the z direction is the stacking direction of the fin and the partition; The equivalent bulk conductivity includes a first conductivity in the fin bending direction, a second conductivity in the fluid flow direction, and a third conductivity in the fin and partition stacking direction. When converting to obtain the equivalent bulk conductivity, the fin length, the fin height, the fin thickness, and the fin conductivity are substituted into the following formula to obtain the first conductivity in the fin bending direction, the second conductivity in the fluid flow direction, and the third conductivity in the fin and partition stacking direction: In the above formula, ρ m is the fin conductivity, ρ i ,i=x,y,z is the conductivity of the equivalent body in different directions; When converting to obtain the equivalent volume specific heat capacity, the fin length, the fin height, the fin thickness, and the fin specific heat capacity are substituted into the following formula to obtain the equivalent volume specific heat capacity: In the above formula, C d is the equivalent volume specific heat, C m is the specific heat capacity of the material.

2. The temperature field simulation method of a plate-fin heat exchanger according to claim 1, characterized in that: The method of constructing a plate-fin heat exchanger equivalent heating model by using the plate-fin heat exchanger equivalent to simulate the heating process of the plate-fin heat exchanger to obtain a transient temperature field state includes: The plate-fin heat exchanger equivalent body heating model is used to simulate the plate-fin heat exchanger to obtain a transient temperature field state during the radiation heating and / or self-resistance heating process.

3. A temperature field simulation device for a plate-fin heat exchanger, characterized in that: The temperature field simulation device of the plate-fin heat exchanger comprises: An acquisition module, used for acquiring material parameters of fins in a plate-fin heat exchanger; a processing module, configured to calculate configuration parameters of a monomer equivalent body model based on the material parameters; A simulation module configured to construct a plate-fin heat exchanger equivalent based on the configuration parameters of the monomer equivalent model, wherein the plate-fin heat exchanger equivalent is a layered structure composed of a baffle, a cold-side fin equivalent, a baffle, and a hot-side fin equivalent that are periodically and repeatedly stacked; A plate-fin heat exchanger equivalent heating model is constructed using the plate-fin heat exchanger equivalent, and a heating process of the plate-fin heat exchanger is simulated to obtain a transient temperature field state; The material parameters include at least material size parameters and material performance parameters, the material size parameters include at least fin length, fin height and fin thickness, and the material performance parameters include at least fin thermal conductivity, fin electrical conductivity and fin specific heat capacity; The processing module is specifically configured to sequentially convert the fin thermal conductivity into equivalent body thermal conductivity, convert the fin electrical conductivity into equivalent body electrical conductivity, and convert the fin specific heat capacity into equivalent body specific heat capacity based on the fin length, the fin height, and the fin thickness, wherein the monomer equivalent body model configuration parameters include at least the equivalent body thermal conductivity, the equivalent body electrical conductivity, and the equivalent body specific heat capacity; The equivalent body thermal conductivity includes a first thermal conductivity in the fin bending direction, a second thermal conductivity in the fluid flow direction, and a third thermal conductivity in the fin and partition stacking direction. When converting to obtain the equivalent body thermal conductivity, the fin length, the fin height, the fin thickness, and the fin thermal conductivity are substituted into the following formula to obtain the first thermal conductivity in the fin bending direction, the second thermal conductivity in the fluid flow direction, and the third thermal conductivity in the fin and partition stacking direction: In the above formula, T s is the fin thickness, L s is the fin length, H s is the fin height, δ m is the thermal conductivity of the fin, δ i , i = x, y, z are the thermal conductivities of the equivalent body in different directions, the x direction is the fin bending direction, the y direction is the fluid flow direction in the fin, and the z direction is the stacking direction of the fin and the partition; The equivalent bulk conductivity includes a first conductivity in the fin bending direction, a second conductivity in the fluid flow direction, and a third conductivity in the fin and partition stacking direction. When converting to obtain the equivalent bulk conductivity, the fin length, the fin height, the fin thickness, and the fin conductivity are substituted into the following formula to obtain the first conductivity in the fin bending direction, the second conductivity in the fluid flow direction, and the third conductivity in the fin and partition stacking direction: In the above formula, ρ m is the fin conductivity, ρ i ,i=x,y,z is the conductivity of the equivalent body in different directions; When converting to obtain the equivalent volume specific heat capacity, the fin length, the fin height, the fin thickness, and the fin specific heat capacity are substituted into the following formula to obtain the equivalent volume specific heat capacity: In the above formula, C d is the equivalent volume specific heat, C m is the specific heat capacity of the material.

4. A computer device comprising: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the temperature field simulation method for a plate-fin heat exchanger according to any one of claims 1 to 2.

5. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the temperature field simulation method of the plate-fin heat exchanger according to any one of claims 1 to 2 are implemented.

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