Impressing preparation method of single-layer double-sided touch screen
Through the imprint preparation method of a single-layer double-sided touch screen, nanoimprint technology and plasma cleaning technology are used to solve the existing problems of complex preparation of transparent conductive materials, large surface resistance and high raw material costs, achieving simplified processes, reduced costs and The effect of improving precision.
Patent Information
- Application Number
- CN202411265667.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-10
- Publication Date
- 2025-01-24
AI Technical Summary
The existing transparent conductive materials are complex and time-consuming in the preparation process, and have large surface resistance, resulting in limited application in high-performance electronic devices. In addition, nano-silver and other materials are prone to silver ion migration during use, resulting in degradation of device performance. , and the cost of raw materials is high, limiting its application in low-cost fields.
Adopt a single -layer double -sided touch screen compression preparation method, to form an X/Y cross -channel structure through nano -printing technology, and use plasma to clean and activate the substrate to enhance the combination of conductive glue and substrate. Equipment to avoid the use of chemical reagents.
It simplifies the preparation process of the touch screen, reduces the production cost, improves the preparation accuracy of the substrate, solves the problem of large surface resistance, meets the green and environmentally friendly manufacturing requirements, and extends the service life of the device.
Smart Images

Figure CN119361240A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of touch screen preparation, and in particular to an embossing preparation method for a single-layer double-sided touch screen. Background Art
[0002] Transparent conductive materials are a type of electronic materials with good electrical conductivity and high light transmittance, which are widely used in touch, sensing, electromagnetic shielding, transparent heating and other fields. At present, the main transparent conductive materials include ITO (indium tin oxide), nanosilver, metal grid and graphene. These materials have certain defects in the preparation process:
[0003] Traditional methods for preparing transparent conductive materials usually involve multiple steps, such as sputtering and chemical vapor deposition. These processes require complex equipment and strict process conditions, resulting in a complex and time-consuming preparation process. Since the conductive properties of traditional transparent conductive materials are limited by their structure and composition, their surface resistance is large, which affects their application in high-performance electronic devices. Transparent conductive materials such as nanosilver are prone to silver ion migration during use, resulting in device performance degradation or even failure. Some transparent conductive materials, such as ITO and nanosilver, have high raw material costs, resulting in expensive final products, limiting their application in some low-cost fields. Summary of the invention
[0004] The object of the present invention is to provide a method for preparing a single-layer double-sided touch screen by embossing, so as to solve the problems raised in the above-mentioned background technology.
[0005] To achieve the above object, the present invention provides the following technical solution: a method for preparing a single-layer double-sided touch screen by embossing, the method comprising the following steps:
[0006] S1: Pretreatment of the stamping plate: Use acetone and ethanol to rinse the stamping plate, and heat and dry it to ensure the cleanliness and dryness of the stamping plate;
[0007] S2: Substrate precursor filling and imprinting: Nanoimprinting is used to imprint the substrate precursor to form an x / y cross channel structure;
[0008] S3: substrate curing and molding: curing the substrate by photothermal curing;
[0009] S4: Demolding the substrate: removing the cured substrate from the embossing plate to obtain a transparent substrate with x / y embossed grooves;
[0010] S5: Conductive slurry filling: Use coating method and plasma cleaning to activate the substrate before filling to enhance the bonding strength between the conductive adhesive and the substrate.
[0011] Preferably, the volume ratio of acetone to ethanol is 1:1.
[0012] Preferably, the substrate precursor is a mobile phase, and the viscosity of the mobile phase substrate precursor is 100-200 cps.
[0013] Preferably, the nanoimprinting method includes a flat-bed imprinting method or a roll-to-roll imprinting method.
[0014] Preferably, the photothermal curing method includes a photocuring method and a thermal curing method.
[0015] Preferably, the thermal curing temperature is 80-120°C, and the light curing intensity is 300-500mW / cm 2 .
[0016] Preferably, the light curing method is completed with the assistance of an embossing plate made of quartz glass.
[0017] Preferably, the coating method includes a scraping filling method and a slit filling method.
[0018] Preferably, the thickness of the transparent substrate is 0.5-1.0 mm.
[0019] Preferably, the resistivity of the conductive paste is 0.01-0.05Ω·m.
[0020] Compared with the prior art, the present invention has the following beneficial effects:
[0021] The present invention provides a method for preparing a single-layer double-sided touch screen by embossing, which simplifies the preparation process of the touch screen, reduces production costs, adopts nanoimprinting technology, improves the preparation accuracy of the substrate, activates the substrate by plasma cleaning, and enhances the bonding force between the conductive paste and the substrate. The entire preparation process does not require high vacuum equipment, reduces equipment dependence, and avoids the use of chemical reagents in traditional processes, meets green and environmentally friendly manufacturing requirements, and solves the product defects of large surface resistance caused by oxidation of metal particles and poor contact in existing nanoimprinting film circuits. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 The present invention is a flow chart of the embossing preparation of a single-layer double-sided touch screen. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0024] See also Figure 1 The present invention provides a technical solution: a method for preparing a single-layer double-sided touch screen by embossing, the method comprising the following steps:
[0025] S1: Pretreatment of the stamping plate: Place the stamping plate on a clean workbench and rinse it with acetone and ethanol in sequence. The volume ratio of acetone and ethanol is 1:1 to remove oil, dust and other impurities on the surface of the stamping plate. After rinsing, put the stamping plate in an oven, set the temperature to 60°C, and dry it for 30 minutes to ensure the cleanliness and dryness of the stamping plate surface. Through this step, the stamping plate surface reaches an ideal clean state, providing a good foundation for the subsequent stamping process.
[0026] S2: Substrate precursor filling and stamping: prepare the mobile phase substrate precursor with a viscosity of 100-200cps, and the precursor has good fluidity and filling performance; place the stamping plate on a flatbed stamping machine, and adjust the temperature and pressure parameters; evenly apply the substrate precursor on the stamping plate, and use the pressure of the flatbed stamping machine to fill the substrate precursor into the x / y cross-channel structure of the stamping plate; during the stamping process, maintain appropriate temperature and pressure to ensure that the substrate precursor is fully filled and forms a uniform x / y cross-channel structure.
[0027] Nanoimprinting methods include flat-bed imprinting and roll-to-roll imprinting. Flat-bed imprinting involves pressing a flat mold against a substrate coated with a resist. This technology is suitable for precise imprinting of small-area substrates and is often used in laboratory research and small-batch production. Roll-to-roll imprinting uses a roller-shaped mold to imprint on continuous flexible materials, such as plastic films or metal sheets, which is suitable for large-scale production.
[0028] S3: substrate curing and molding: curing the substrate by photothermal curing, which includes light curing and heat curing;
[0029] Using light curing method, the light curing intensity is 300-500mW / cm 2 The specific steps are as follows: move the filled stamping plate to the light-curing device; use a stamping plate made of quartz glass as an auxiliary to ensure the uniformity of the light-curing process; turn on the light-curing device, adjust the light source intensity and irradiation time, so that the substrate precursor is fully cured during the light-curing process; after the light-curing is completed, turn off the device and take out the cured substrate.
[0030] The thermal curing method is adopted, and the specific steps are as follows: the substrate that has been imprinted and filled with conductive adhesive is placed in a hot press, and the substrate is pre-baked at a low temperature before thermal curing to remove residual solvent or water molecules; the heating process is started, and the temperature is gradually increased to the target temperature required for curing according to the type of selected substrate and conductive adhesive, and the thermal curing temperature is 80-120°C; the target temperature is maintained for a certain time, and this time is determined according to the thickness of the substrate and the curing characteristics of the resin; after the curing is completed, the cooling rate is controlled to prevent stress from being generated inside the substrate; after the substrate is cured, it is removed from the imprinting mold.
[0031] S4: Demolding of substrate: Gently remove the cured substrate from the embossing plate, and use a special demoulding tool such as a spatula or a scraper to assist the demoulding process; ensure that the substrate is not damaged during the demoulding process, and obtain a transparent substrate with x / y embossed grooves, the thickness of the transparent substrate is 0.5-1.0mm.
[0032] S5: Conductive slurry filling: Use coating method, and use plasma cleaning to activate the substrate before filling to enhance the bonding force between the conductive adhesive and the substrate. The resistivity of the conductive slurry is 0.01-0.05Ω·m.
[0033] Prepare a conductive paste with good conductivity and adhesion; use a doctor blade or slot filling method to fill the conductive paste into the x / y embossed grooves of the substrate; before filling, use plasma cleaning to activate the substrate to enhance the bonding strength between the conductive paste and the substrate; after filling, perform appropriate drying and curing treatment to ensure that the conductive paste is fully cured and forms a good conductive layer.
[0034] The coating methods include a blade-filling method and a slot-filling method.
[0035] The scraping filling method is to place the slurry in front of the scraper, adjust the gap between the scraper and the substrate, and this gap determines the thickness of the coating. Move the scraper relative to the substrate so that it can be scraped smoothly across the surface of the substrate. The slurry forms a uniform wet film between the blade and the substrate. After the wet film is formed, it is dried and cured with hot air.
[0036] The slit filling method is that the slit head is composed of two upper and lower modules with a precise gap in the middle. The slurry is continuously transported to the slit head through a pumping system and squeezed out from the gap under pressure to be coated on the moving substrate. The gap of the slit head, the pumping speed and the moving speed of the substrate are adjusted to obtain the required coating thickness and uniformity. The slurry forms stable liquid beads between the slit head and the substrate and is transferred to the surface of the substrate to form a uniform wet film. After coating, it is also dried and cured by hot air.
[0037] In summary, the present invention provides a method for preparing a single-layer double-sided touch screen by embossing, which simplifies the preparation process of the touch screen, reduces production costs, uses nanoimprint technology, improves the preparation accuracy of the substrate, activates the substrate by plasma cleaning, and enhances the bonding force between the conductive paste and the substrate. The entire preparation process does not require high vacuum equipment, reduces equipment dependence, and avoids the use of chemical reagents in traditional processes, meets green and environmentally friendly manufacturing requirements, and solves the product defects of large surface resistance caused by oxidation of metal particles and poor contact in existing nanoimprint film circuits.
[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A method for preparing a single-layer double-sided touch screen by embossing, characterized in that: The embossing preparation method comprises the following steps: S1: Pretreatment of the stamping plate: Use acetone and ethanol to rinse the stamping plate, and heat and dry it to ensure the cleanliness and dryness of the stamping plate; S2: Substrate precursor filling and imprinting: Nanoimprinting is used to imprint the substrate precursor to form an x / y cross channel structure; S3: substrate curing and molding: curing the substrate by photothermal curing; S4: Demolding the substrate: removing the cured substrate from the embossing plate to obtain a transparent substrate with x / y embossed grooves; S5: Conductive slurry filling: Use coating method and plasma cleaning to activate the substrate before filling to enhance the bonding strength between the conductive adhesive and the substrate.
2. The embossing preparation method of a single-layer double-sided touch screen according to claim 1, characterized in that: The volume ratio of the acetone to the ethanol is 1:
1.
3. The embossing preparation method of a single-layer double-sided touch screen according to claim 1, characterized in that: The substrate precursor is a mobile phase, and the viscosity of the mobile phase substrate precursor is 100-200 cps.
4. The embossing method for preparing a single-layer double-sided touch screen according to claim 1, characterized in that: The nanoimprinting method includes a flat-bed imprinting method or a roll-to-roll imprinting method.
5. The embossing preparation method of a single-layer double-sided touch screen according to claim 1, characterized in that: The photothermal curing method includes a photocuring method and a thermal curing method.
6. The embossing method for preparing a single-layer double-sided touch screen according to claim 1, characterized in that: The thermal curing temperature is 80-120°C, and the light curing intensity is 300-500mW / cm 2 .
7. The embossing method for preparing a single-layer double-sided touch screen according to claim 1, characterized in that: The photocuring method is completed with the assistance of a stamping plate made of quartz glass.
8. The embossing method for preparing a single-layer double-sided touch screen according to claim 1, characterized in that: The coating method includes a scraping filling method and a slit filling method.
9. The embossing preparation method of a single-layer double-sided touch screen according to claim 1, characterized in that: The thickness of the transparent substrate is 0.5-1.0 mm.
10. The embossing preparation method of a single-layer double-sided touch screen according to claim 1, characterized in that: The resistivity of the conductive paste is 0.01-0.05Ω·m.