Patterned shielding grounding structure and circuit

Abstract

The invention provides a patterned shielding grounding structure and a circuit wherein the patterned shielding grounding structure comprises: a collinear group, the collinear group comprising a plurality of collinear lines, the collinear lines being connected to divide a plurality of open shielding areas; the conductor units are respectively arranged in the shielding areas and are connected to the collinear group; and the number of the grounding points is at least one, and the grounding points are located on the collinear group or the conductor units. According to the scheme, the inductance Q value can be effectively improved.

Description

Technical Field

[0001] The present invention belongs to the field of shielding technology, and in particular relates to a patterned shielding grounding structure and circuit. Background Art

[0002] The inductor Q value (Q value for short), also known as the inductor quality factor, is an important parameter to measure the performance of inductor components in AC circuits. The higher the Q value, the lower the energy loss of the inductor component and the better the performance. A high Q value helps stabilize the oscillation frequency, reduce phase noise, and improve the purity and stability of the signal. Factors that affect the inductor Q value include the DC resistance of the coil wire, the dielectric loss of the coil frame, the loss caused by the iron core, shielding cover, etc., the distribution of capacitance and the self-resonance effect of inductance, etc.

[0003] In radio frequency integrated circuits (RFICs), inductors are key components whose performance directly affects the efficiency and stability of the entire circuit. The quality factor Q (Q value) of an inductor is an important indicator of its performance. A high Q value means lower loss and higher efficiency. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a patterned shielding grounding structure and circuit to reduce the energy loss of the inductor and improve the inductor quality factor.

[0005] To achieve the above objectives and other related objectives, the present invention provides a patterned shielding grounding structure, comprising: A collinear group, the collinear group comprising a plurality of collinear lines, the collinear lines being connected to divide a plurality of open shielding areas; Conductor units are respectively arranged in the shielding area and connected to the collinear group; At least one grounding point is provided, and the grounding point is located on the collinear group or the conductor unit.

[0006] Optionally, the collinear group includes a first collinear line, a second collinear line and a third collinear line, the second collinear line and the third collinear line are arranged in parallel, and the middle parts of the second collinear line and the third collinear line are respectively connected to the first collinear line.

[0007] Optionally, the conductor unit includes a middle unit and an outer unit, the middle unit is arranged in a middle area between the second collinearity and the third collinearity, the side of the second collinearity away from the middle area is a first outer area, the side of the third collinearity away from the middle area is a second outer area, and the outer unit is arranged in the first outer area and the second outer area.

[0008] Optionally, the intermediate unit is connected to the first collinear line and is symmetrically arranged with the first collinear line as an axis of symmetry.

[0009] Optionally, the outer units in the first outer region are connected to the second collinearly, and the outer units in the second outer region are connected to the third collinearly.

[0010] Optionally, the outer units are symmetrically arranged with the first common line as the axis of symmetry.

[0011] Optionally, the conductor unit includes a skeleton connected to the collinear group, bone spurs are symmetrically arranged on both sides of the skeleton, and the bone spurs are connected to the skeleton.

[0012] Optionally, the bone spurs in the middle unit are arranged toward the first co-linear direction, and the bone spurs in the outer units are arranged toward the middle area.

[0013] Optionally, the outer units are symmetrically arranged along the spurs of the middle unit.

[0014] To achieve the above-mentioned purpose and other related purposes, the present invention also provides a circuit, comprising multiple metal layers, the metal layers comprising at least a bottom metal, a sub-top metal and a top metal, a patterned shielding grounding structure is arranged on the bottom metal, an inductor is arranged on the sub-top metal and the top metal, the patterned shielding grounding structure is arranged in parallel with the inductor, and the coverage area of ​​the patterned shielding grounding structure is greater than the coverage area of ​​the inductor. As described above, the patterned shielding grounding structure and circuit of the present invention have the following beneficial effects: When in use, the patterned shielding grounding structure is set on the bottom metal of the circuit, and then connected to the top metal by punching holes layer by layer, and then the top metal is grounded. The inductor is connected to the second top metal and the top metal to perform grounding shielding through the patterned shielding grounding structure to improve the Q value of the inductor.

[0015] In this solution, the shielding area is opened to avoid the formation of ground loops. The current flowing in the ground loop will cause coupling interference problems. This interference signal may mix with the useful signal, thus affecting the normal operation of the circuit. The grounding point is set to connect to the bottom metal. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 FIG. 4 is a schematic diagram of a patterned shielding grounding structure in an embodiment of the present invention.

[0017] Figure 2 FIG. 4 is a schematic diagram of the coordination between the patterned shielding grounding structure and the inductor in an embodiment of the present invention.

[0018] Figure 31 is a comparison diagram of the inductance values ​​of an inductor with a patterned shielding ground structure and an inductor without a patterned shielding ground structure in an embodiment of the present invention.

[0019] Figure 4 1 is a comparison diagram of Q values ​​of an inductor with a patterned shielding ground structure and an inductor without a patterned shielding ground structure in an embodiment of the present invention. DETAILED DESCRIPTION

[0020] The reference numerals in the drawings of the specification include: Patterned shielding ground structure 1, collinear group 110, first collinear group 111, second collinear group 112, third collinear group 113, shielding area 120, middle area 121, first outer area 122, second outer area 123, conductor unit 130, skeleton 131, bone spur 132, Inductor 2.

[0021] The following is a description of the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0022] Reference Figure 1 As shown, in an exemplary embodiment of the present application, a patterned shielding grounding structure is provided, comprising: A co-linear group 110, the co-linear group 110 includes a plurality of co-linear lines, and the co-linear lines are connected to divide a plurality of open shielding areas 120; Conductor units 130 are respectively disposed in the shielding area 120 and connected to the co-linear group 110; At least one grounding point is provided, and the grounding point is located on the collinear group 110 or the conductor unit 130 .

[0023] When in use, the patterned shielding grounding structure 1 is set on the bottom metal of the circuit, and then connected to the top metal by punching holes layer by layer, and the top metal is grounded. The inductor 2 is connected to the second top metal and the top metal to perform grounding shielding through the patterned shielding grounding structure 1, so as to improve the Q value of the inductor 2.

[0024] It is worth noting that the open shielding area 120, that is, at least one side of the area is not closed by the collinearity, to avoid the formation of a ground loop. The current flowing in the ground loop will cause coupling interference problems. This interference signal may be mixed with the useful signal, thereby affecting the normal operation of the circuit. The grounding point is set to connect to the bottom metal.

[0025] In an exemplary embodiment, the collinear group 110 includes a first collinear line 111 , a second collinear line 112 and a third collinear line 113 . The second collinear line 112 and the third collinear line 113 are arranged in parallel, and the middle of the second collinear line 112 and the third collinear line 113 are respectively connected to the first collinear line 111 .

[0026] In this embodiment, the second common line 112 and the third common line 113 are arranged in parallel and intersect with the first common line 111 at the middle position to form six open shielding areas 120, so as to facilitate the arrangement of the conductor unit 130 in each shielding area 120. Each conductor unit 130 is independent of each other and is only connected to the corresponding common lines to avoid forming a loop and interfering with the shielding effect.

[0027] Exemplarily, the grounding point is an end of the first common line 111 .

[0028] In an exemplary embodiment, the conductor unit 130 includes a middle unit and an outer unit, the middle unit is arranged in the middle area 121 between the second common line 112 and the third common line 113, the side of the second common line 112 away from the middle area 121 is the first outer area 122, the side of the third common line 113 away from the middle area 121 is the second outer area 123, and the outer unit is arranged in the first outer area 122 and the second outer area 123.

[0029] In this embodiment, in order to increase the shielding effect, each shielding area 120 is divided into a middle area 121 and an outer area (including a first outer area 122 and a second outer area 123 ).

[0030] Exemplarily, two of the six shielding regions 120 are middle regions 121 and four are outer regions. One conductor unit 130 is disposed in each middle region 121 and two conductor units 130 are disposed in each outer region.

[0031] In an exemplary embodiment, the intermediate unit is connected to the first common line 111 and is symmetrically arranged with the first common line 111 as a symmetry axis.

[0032] In this embodiment, the symmetrically arranged structure helps to achieve more uniform current distribution and electric field distribution, thereby providing better shielding effect.

[0033] In an exemplary embodiment, the outer cells in the first outer region 122 are connected to the second common line 112 , and the outer cells in the second outer region 123 are connected to the third common line 113 .

[0034] In this embodiment, each conductor unit 130 is connected to a different common line to avoid the conductor units 130 being connected to each other to form a loop.

[0035] Exemplarily, a gap is provided between the middle unit and the second and third collinear lines 112 and 113, and a gap is provided between the outer unit and the first collinear line 111, so as to realize the independence of each conductor unit 130 and avoid forming a loop due to multiple connection points between each other, thereby affecting the shielding effect.

[0036] In an exemplary embodiment, the outer units are symmetrically arranged with the first common line 111 as a symmetry axis.

[0037] It should also be noted that the structural symmetry can provide similar shielding performance in different directions, thereby ensuring the electromagnetic compatibility of the entire circuit.

[0038] In an exemplary embodiment, the conductor unit 130 includes a skeleton 131 connected to the collinear group 110 , and bone spurs 132 are symmetrically arranged on both sides of the skeleton 131 , and the bone spurs 132 are connected to the skeleton 131 .

[0039] Exemplarily, the skeleton 131 and the bone spurs 132 form a fishbone structure. The bone spurs 132 are spaced apart, with a gap of 2.5um to 3um, and the width of the skeleton 131 is 1.8um to 2.2um.

[0040] Exemplarily, the interval between adjacent bone spurs 132 is 3 um, and the width of the bone spurs 132 is 2 um.

[0041] In an exemplary embodiment, the spurs 132 (conductive direction) of the middle unit are arranged toward the first common line 111 , and the spurs 132 (conductive direction) of the outer unit are arranged toward the middle region 121 .

[0042] Exemplarily, the bone spur 132 and the skeleton 131 form an angle of 45°.

[0043] In an exemplary embodiment, the lateral cells are symmetrically arranged along the spurs 132 of the middle cell.

[0044] In this embodiment, in order to further improve the shielding effect, the outer units are symmetrical with respect to the center line of the middle unit.

[0045] Reference Figure 2 As shown, in an exemplary embodiment of the present application, a circuit is provided, including multiple metal layers, the metal layers at least including a bottom metal, a sub-top metal and a top metal, the above-mentioned patterned shielding grounding structure 1 is arranged on the bottom metal, and an inductor 2 is arranged on the sub-top metal and the top metal, the patterned shielding grounding structure 1 is arranged in parallel with the inductor 2, and the coverage area of ​​the patterned shielding grounding structure 1 is greater than the coverage area of ​​the inductor 2.

[0046] In this embodiment, the provision of the patterned shielding grounding structure 1 helps to reduce the capacitive coupling between the inductor 2 and the underlying metal, thereby reducing energy loss.

[0047] It should also be noted that, when the inductance value of the inductor 2 remains almost unchanged, the patterned shielding grounding structure 1 in this solution significantly improves the Q value of the inductor. The patterned shielding grounding structure 1 effectively shields the eddy current generated by the inductor magnetic field through the unique fishbone structure design. This structure reduces the energy loss and maintains the high-frequency performance of the inductor by reducing the capacitive coupling between the inductor and the silicon substrate.

[0048] like Figure 3 As shown in the figure, the red line is the inductance with a patterned shielding ground structure, and the blue line is the inductance without a patterned shielding ground structure. The inductance values ​​of the two are the same at 5G. Figure 4 It can be seen that the red line is the inductor with a patterned shield grounding structure, with a maximum Q value of about 36.02, while the blue line is the inductor without a patterned shield grounding structure, with a maximum Q value of about 26.58. In comparison, the Q value of the inductor with a patterned shield grounding structure is increased by about 26.2%. This greatly improves the performance of the inductor. In addition, increasing the Q value can allow the inductor to be designed smaller because they can use fewer coil turns without sacrificing performance, thereby reducing the area and reducing costs.

[0049] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A patterned shielding grounding structure, characterized in that: include: A collinear group, the collinear group comprising a plurality of collinear lines, the collinear lines being connected to divide a plurality of open shielding areas; Conductor units are respectively arranged in the shielding area and connected to the collinear group; At least one grounding point is provided, and the grounding point is located on the collinear group or the conductor unit.

2. The patterned shielding grounding structure according to claim 1, characterized in that: The collinear group includes a first collinear group, a second collinear group and a third collinear group. The second collinear group and the third collinear group are arranged in parallel, and the middle parts of the second collinear group and the third collinear group are respectively connected to the first collinear group.

3. The patterned shielding grounding structure according to claim 2, characterized in that: The conductor unit includes a middle unit and an outer unit, the middle unit is arranged in the middle area between the second collinear line and the third collinear line, the side of the second collinear line away from the middle area is the first outer area, the side of the third collinear line away from the middle area is the second outer area, and the outer unit is arranged in the first outer area and the second outer area.

4. The patterned shielding grounding structure according to claim 3, characterized in that: The intermediate unit is connected to the first collinear line and is symmetrically arranged with the first collinear line as a symmetry axis.

5. The patterned shielding grounding structure according to claim 3, characterized in that: The outer cells in the first outer region are connected to the second collinearly, and the outer cells in the second outer region are connected to the third collinearly.

6. The patterned shielding grounding structure according to claim 3, characterized in that: The outer units are symmetrically arranged with the first common line as a symmetry axis.

7. The patterned shielding grounding structure according to any one of claims 3 to 6, characterized in that: The conductor unit comprises a frame connected to the collinear group, bone spurs are symmetrically arranged on both sides of the frame, and the bone spurs are connected to the frame.

8. The patterned shielding grounding structure according to claim 7, characterized in that: The bone spurs of the middle unit are arranged toward the first collinear direction, and the bone spurs in the outer units are arranged toward the middle area.

9. The patterned shielding grounding structure according to claim 7, characterized in that: The outer units are symmetrically arranged along the spurs of the middle unit.

10. A circuit, characterized in that: It comprises a plurality of metal layers, wherein the metal layers comprise at least a bottom metal, a sub-top metal and a top metal, a patterned shielding grounding structure as described in any one of claims 1 to 9 is arranged on the bottom metal, an inductor is arranged on the sub-top metal and the top metal, the patterned shielding grounding structure is arranged in parallel with the inductor, and the coverage area of ​​the patterned shielding grounding structure is greater than the coverage area of ​​the inductor.

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