Moisturizing method, wafer cleaning device and storage medium

Abstract

The invention provides a moisturizing method, a wafer cleaning device, a storage medium and electronic equipment, the moisturizing method is applied to a driving mechanism in the wafer cleaning device, the driving mechanism comprises a wheel body and a rotating shaft, the rotating shaft and the wheel body synchronously rotate, a first flow channel is arranged in the rotating shaft, and the wheel body internally comprises a second flow channel arranged in the radial direction of the wheel body; the outer edge of the wheel body is provided with a gap which is matched with the wafer and communicated with the second flow channel. The moisturizing method comprises the steps that whether the wafer is in place or not is monitored; if the wafer is in place, the control fluid is controlled to flow into the first flow channel in a micro-positive pressure mode and flow out of the outer edge of the wheel body through the second flow channel; and if the wafer is switched from the in-place state to the out-of-place state, the fluid is sucked from the first flow channel in a negative pressure mode so as to moisturize the wheel body.

Description

Technical Field

[0001] The present application relates to the technical field of wafer cleaning, and in particular to a moisturizing method, a wafer cleaning device, a storage medium and an electronic device. Background Art

[0002] In the semiconductor field, CMP (Chemical Mechanical Polishing) is one of the core processes in the wafer manufacturing process. Pollution and / or particulate matter will be introduced into the wafer surface after CMP, so the wafer needs to be post-processed such as cleaning and drying.

[0003] Generally, a scrubbing system for cleaning wafers generally includes a driving module and a spraying module. The driving module drives the wafer to rotate, and the spraying module sprays cleaning liquid onto the surface of the wafer for cleaning and moisturizing. However, in the prior art, the water consumption for moisturizing the driving module is large, resulting in high loss. Summary of the invention

[0004] In view of this, the present application provides a moisturizing method, a wafer cleaning device, a storage medium and an electronic device to at least partially solve the above problems.

[0005] According to a first aspect of the present application, a moisturizing method is provided, which is applied to a driving mechanism in a wafer cleaning device, wherein the driving mechanism includes a wheel body and a rotating shaft, the rotating shaft rotates synchronously with the wheel body, a first flow channel is arranged inside the rotating shaft, the wheel body includes a second flow channel arranged along the radial direction of the wheel body, and the outer edge of the wheel body is provided with a gap that cooperates with the wafer and communicates with the second flow channel. The moisturizing method includes: monitoring whether the wafer is in place; if the wafer is in place, controlling the fluid to flow into the first flow channel in a micro-positive pressure mode and flow out from the outer edge of the wheel body through the second flow channel; if the wafer switches from being in place to being out of place, sucking fluid from the first flow channel in a negative pressure mode to moisturize the wheel body.

[0006] According to a second aspect of the present application, a wafer cleaning device is provided, comprising: a fluid supply module, a driving mechanism and a controller, the driving mechanism comprising a wheel body and a rotating shaft, the rotating shaft rotates synchronously with the wheel body, a first flow channel is arranged inside the rotating shaft, the wheel body comprises a second flow channel arranged along the radial direction of the wheel body, and the outer edge of the wheel body is provided with a gap that cooperates with the wafer and communicates with the second flow channel; the controller is used to perform the following moisturizing method: monitor whether the wafer is in place; if the wafer is in place, control the fluid to flow into the first flow channel in a micro-positive pressure mode, and flow out from the outer edge of the wheel body through the second flow channel; if the wafer switches from being in place to being out of place, the fluid is sucked from the first flow channel in a negative pressure mode to moisturize the wheel body.

[0007] According to a third aspect of the present application, a computer storage medium is provided, on which a computer program is stored, and when the program is executed by a processor, the method described in the first aspect is implemented.

[0008] According to the fourth aspect of the present application, an electronic device is provided, including a processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface communicate with each other through the communication bus; the memory is used to store at least one executable instruction, and the executable instruction enables the processor to perform an operation corresponding to the method described in the first aspect.

[0009] In the present application, a first flow channel is arranged inside the rotating shaft of the driving mechanism, and a second flow channel is arranged inside the wheel body along the radial direction of the wheel body. If the wafer is in place, the fluid is controlled to flow into the first flow channel in a micro-positive pressure mode, and flow out from the outer edge of the wheel body through the second flow channel, so that the contact position between the wafer and the wheel body can be cleaned, thereby avoiding wear or contamination of the wafer edge; at the same time, the fluid flows out from the outer edge of the wheel body through the second flow channel, so that the wheel body can be moisturized, and there is no need to spray the wheel body separately for moisturizing, and if the wafer switches from being in place to being out of place, the fluid is sucked from the first flow channel in a negative pressure mode, so that the contaminants remaining on the wheel body can be sucked out, thereby improving the cleanliness of the wheel body and using less water resources.

[0010] In the semiconductor field, wafer cleaning is a necessary process. Wafer cleaning is performed after each process procedure, resulting in a large amount of water consumption in wafer production. Deionized water is usually used for wafer cleaning, and the cost of producing deionized water is also high. It is not conducive to energy conservation, emission reduction, and carbon reduction. The solution provided by this application not only improves the yield of wafers, but also saves additional cleaning resources caused by wafer contamination or wear, while reducing the cleaning cost of the wheel body and improving the cleaning degree, which is conducive to enterprises to carry out ESG (Environment, Society, Governance) management. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the present application or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0012] Figure 1 is a schematic diagram of an exemplary driving mechanism corresponding to a moisturizing method according to an exemplary embodiment of the present application;

[0013] Figure 2is a schematic diagram of an outer end cover of a wheel body in a driving mechanism according to an exemplary embodiment of the present application;

[0014] Figure 3 is a flow chart of steps of a moisturizing method according to an exemplary embodiment of the present application;

[0015] Figure 4 is a flowchart of another moisturizing method according to an exemplary embodiment of the present application;

[0016] Figure 5 It is a schematic diagram of the control amount of the fluid in the first moisturizing mode according to an exemplary embodiment of the present application;

[0017] Figure 6 is a schematic structural diagram of an electronic device according to an exemplary embodiment of the present application;

[0018] Figure 7 It is a schematic structural diagram of a wafer cleaning device according to an exemplary embodiment of the present application. DETAILED DESCRIPTION

[0019] In order to make those skilled in the art better understand the technical solutions in the embodiments, the technical solutions in the embodiments are clearly and completely described below in conjunction with the drawings in the embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field should fall within the scope of protection of this application.

[0020] Before describing the moisturizing method of the embodiment, the application scenario of the moisturizing method is briefly described to facilitate understanding.

[0021] Reference Figure 1 , Figure 1 It is a schematic diagram of an exemplary drive mechanism corresponding to a moisturizing method according to an exemplary embodiment of the present application. The moisturizing method of this embodiment can be used for a drive mechanism 100 in a wafer cleaning device. The drive mechanism 100 includes a wheel body and a rotating shaft 103. The rotating shaft 103 can rotate synchronously with the wheel body. A first flow channel 105 is arranged inside the rotating shaft 103. The first flow channel 105 is arranged axially along the rotating shaft 103. The wheel body includes a second flow channel arranged radially along the wheel body. The first flow channel 105 and the second flow channel are connected. The fluid is transported to the second flow channel through the first flow channel 105. The fluid flows out from the outer edge of the wheel body through the second flow channel. The outer edge of the wheel body is provided with a gap that cooperates with the wafer and communicates with the second flow channel. The residual contaminants in the gap between the outer edge of the wheel body and the wafer can be washed by the fluid, thereby preventing the wafer from being contaminated.

[0022] In an embodiment, the wheel body may be the wheel body of a driving wheel or the wheel body of a driven wheel, and the fluid is used to clean the wafer or the wheel body supporting the wafer, which may be water, chemicals or any other appropriate fluid, which is not limited in this application.

[0023] In an optional implementation, the wheel body may include an outer end cover 101, an inner end cover 102 and an annular gasket 104. The outer end cover 101 and the inner end cover 102 are arranged on the rotating shaft 103 to form a gap, and the annular gasket 104 is clamped in the gap. The side of the outer end cover 101 opposite to the annular gasket 104 is provided with a first branch flow channel 108, and the side of the inner end cover 102 opposite to the annular gasket 104 is provided with a second branch flow channel 107. The first branch flow channel 108 and the second branch flow channel 107 form a second flow channel. The edge of the outer end cover 101 may be provided with a plurality of notches 109 along the circumferential direction, and the fluid flows out from the notches 109; or the outer end cover 101 may not be provided with notches, and the fluid flows out in the tangential direction of the wheel body.

[0024] In the semiconductor field, wafer cleaning is a necessary process. Wafer cleaning is performed after each process procedure, resulting in a large amount of water consumption in wafer production. Deionized water is usually used for wafer cleaning, and the cost of producing deionized water is also high. It is not conducive to energy conservation, emission reduction, and carbon reduction. The solution provided by this application not only improves the yield of wafers, but also saves additional cleaning resources caused by wafer contamination or wear, while reducing the cleaning cost of the wheel body and improving the cleaning degree, which is conducive to enterprises to carry out ESG (Environment, Society, Governance) management.

[0025] Reference Figure 3 , shows a step flow chart of a moisturizing method according to an exemplary embodiment of the present application.

[0026] The moisturizing method of this embodiment comprises the following steps:

[0027] S201, monitoring whether the wafer is in place.

[0028] See also Figure 7The wafer cleaning device includes a box body 601, a driving mechanism and a wafer 602 are placed in the box body; the driving mechanism may include: an A driving wheel 603, a B driving wheel 604 and a driven wheel 605, the A driving wheel 603 and the B driving wheel 604 are used to support the wafer 602, and the driven wheel 605 is used to monitor the rotation speed of the wafer, and any one or more of the A driving wheel 603, the B driving wheel 604 and the driven wheel 605 may adopt the above-mentioned driving structure. The A driving wheel, the B driving wheel and / or the driven wheel adopting the above-mentioned driving structure are also connected to the fluid supply module. When the wafer is cleaned, the fluid supply module controls the fluid pressure so that the fluid flows into the corresponding A driving wheel, the B driving wheel and / or the driven wheel, thereby cleaning the wafer.

[0029] During the wafer cleaning process, since the wafer is supported on the wheel body and the outer edge of the wheel body is provided with a gap that cooperates with the wafer and communicates with the second flow channel, the fluid flowing out of the wheel body may affect the rotation of the wafer and thus affect the wafer cleaning process.

[0030] To this end, different moisturizing methods can be used according to different scenarios corresponding to the wafer cleaning, such as cleaning the wafer, replacing the wafer, and pausing the wafer cleaning. In order to reduce the impact of the moisturizing process on the wafer cleaning process, it is possible to monitor whether the wafer is in place and use different moisturizing methods when the wafer is in place and when it is not in place.

[0031] In an optional implementation, monitoring whether the wafer is in place includes: monitoring whether the wheel body is in motion; if the wheel body is in motion, determining that the wafer is in place; if the wheel body is in a stationary state, monitoring the movement of a robot corresponding to the wafer cleaning device, if the robot does not perform a wafer-taking movement, determining that the wafer is in place, and if the robot performs a wafer-taking movement, determining that the wafer is not in place.

[0032] Ideally, the wafer and wheel will rotate synchronously. However, in the actual cleaning process, the wheel may stall. Therefore, in order to ensure the accuracy of the monitoring results, the robot action of the wafer cleaning device can be combined to determine whether the wafer is in place.

[0033] In an optional implementation, monitoring whether the wafer is in place includes: monitoring whether the wafer is in place by a light sensor in a wafer cleaning device.

[0034] The light sensor includes a transmitting end and a receiving end, which are located on both sides of the wafer respectively. If the light emitted by the transmitting end is received by the receiving end, it is determined that the wafer is not in place; if the light emitted by the transmitting end is not received by the receiving end, it means that the light is blocked by the wafer, and it is determined that the wafer is in place.

[0035] S202: If the wafer is in place, control the fluid to flow into the first flow channel in a micro-positive pressure mode, and flow out from the outer edge of the wheel body through the second flow channel.

[0036] If the wafer is in place, the fluid is controlled to flow into the first flow channel in a micro-positive pressure mode, so that the pressure generated by the fluid at the outer edge of the wheel body is close to 0, and the micro-positive pressure state is maintained to ensure that contaminants do not flow into the flow channel, and the pressure generated by the fluid does not damage the wafer. The pressure of the fluid in the micro-positive pressure mode is greater than 0psi and less than 100psi.

[0037] Reference Figure 1 , the side 106 of the annular pad 104 away from the rotation axis contacts the edge of the wafer through the gap, the outer end cover 101, the annular pad 104 and the inner end cover 102 rotate synchronously with the wafer around the axis direction of the rotation axis 103, and by maintaining a slight positive pressure of the fluid, after the fluid enters the first flow channel 105, the fluid flows through the first branch flow channel 108 and the second branch flow channel 107 respectively through both sides of the annular pad 104, and flows out from the side of the annular pad 104 away from the rotation axis, that is, flows out from the outer edge of the wheel body in the tangential direction of the wheel body. At this time, the control fluid flows into the first flow channel in a slight positive pressure mode, the fluid speed is low, and the pressure of the fluid is greater than 0psi and less than 100psi. While moisturizing the wheel body, it is ensured that the pollutants will be discharged outward with the flow of the fluid, and the pollutants are avoided from entering the interior of the flushing drive mechanism as much as possible, reducing the residual pollutants and ensuring the cleaning effect of the wafer.

[0038] Further, refer to Figure 2 The edge of the outer end cover 101 is provided with a plurality of notches 109 along the circumferential direction, and the height of the notches 109 can be the same as the gap on the wheel body. After the fluid flows through the first branch channel 108 and the second branch channel 107 respectively, it flows through the two sides of the annular pad 104, then passes through the gap in contact with the wafer, and finally flows out from the notch 109 of the outer end cover 101.

[0039] S203: If the wafer is switched from being in place to being out of place, fluid is sucked from the first flow channel in a negative pressure mode to moisturize the wheel body.

[0040] If the wafer switches from in-place to out-of-place, it means that the wafer has been removed from the chamber after cleaning. At this time, no new contaminants will be added to the wheel body, and the wheel body can be cleaned.

[0041] After cleaning, some water droplets and pollutants will remain on the surface of the wheel body, and the pollutants that have not been cleaned will also be concentrated in the water droplets. At this time, the fluid can be sucked from the first flow channel in a negative pressure mode to suck out the water droplets that may contain pollutants on the wheel body, thereby improving the cleanliness of the wheel body.

[0042] Specifically, in the negative pressure mode, the first flow channel and the second flow channel suck water droplets at the gap at the outer edge of the wheel body, so as not to affect the wet environment near the outer edge of the wheel body, thereby ensuring that the wheel body is in a wet state.

[0043] The suction pressure in the negative pressure mode may also be greater than 0 psi and less than 100 psi, that is, a slight negative pressure that can suck out water droplets in the gap at the outer edge of the wheel body but will not affect the humidity of the environment.

[0044] In the present application, a first flow channel is arranged inside the rotating shaft of the driving mechanism, and a second flow channel is arranged inside the wheel body along the radial direction of the wheel body. If the wafer is in place, the fluid is controlled to flow into the first flow channel in a micro-positive pressure mode, and flow out from the outer edge of the wheel body through the second flow channel, so that the contact position between the wafer and the wheel body can be cleaned, thereby avoiding wear or contamination of the wafer edge; at the same time, the fluid flows out from the outer edge of the wheel body through the second flow channel, so that the wheel body can be moisturized, and there is no need to spray the wheel body separately for moisturizing, and if the wafer switches from being in place to being out of place, the fluid is sucked from the first flow channel in a negative pressure mode, so that the contaminants remaining on the wheel body can be sucked out, thereby improving the cleanliness of the wheel body and using less water resources.

[0045] Reference Figure 4 , shows a step flow chart of another moisturizing method according to an exemplary embodiment of the present application.

[0046] The moisturizing method of this embodiment comprises the following steps:

[0047] S301, monitoring whether the wafer is in place.

[0048] S302: If the wafer is in place, control the fluid to flow into the first flow channel in a micro-positive pressure mode, and flow out from the outer edge of the wheel body through the second flow channel.

[0049] S303, if the wafer is switched from being in place to being out of place, control the fluid to flow into the first flow channel in a flushing mode to flush the wheel body until it is determined that the wafer is moved out of the wafer cleaning device, and then suck the fluid from the first flow channel in a negative pressure mode.

[0050] If it is monitored that the wafer switches from being in place to being out of place, it means that the cleaning of this wafer is completed. When the wafer is cleaned and has been removed from the cavity, no new contaminants will be added inside the cavity. At this time, the fluid is controlled to flow into the first flow channel in a flushing mode to flush the wheel body. The fluid pressure in the flushing mode is greater than the fluid pressure in the micro-positive pressure mode to minimize the contaminants remaining from the previous wafer cleaning.

[0051] After flushing is completed, fluid can be sucked from the first flow channel in a negative pressure mode, further reducing the contaminants remaining on the wheel body.

[0052] S304, controlling the fluid to flow into the first flow channel in a first moisturizing mode to moisturize the wheel body.

[0053] In addition, if the wafer is continuously out of position, it means that the wafer cleaning device needs to wait for a period of time before cleaning the next wafer, and the fluid can be controlled to flow into the first flow channel in a first moisturizing mode to moisturize the wheel body.

[0054] Specifically, when the fluid is controlled to flow into the first flow channel in the first moisturizing mode, the controlled amount of the fluid can be determined according to the film running frequency of the driving mechanism, wherein the film running frequency refers to the number of wafers that the driving mechanism can process per unit time. According to different film running frequencies, different controlled amounts of the fluid are set to moisturize the wheel body during the film running process. The wheel body can be moisturized after rinsing and before the wheel body carries the next wafer. The controlled amount of the fluid may include an opening interval, a duration, and a flow rate, etc., which are not limited in this embodiment.

[0055] In an optional implementation, the first moisturizing mode includes a correspondence between different frequency intervals and a control amount of the fluid, the control amount includes an opening interval and a duration, and the fluid is controlled to flow into the first flow channel in the first moisturizing mode to moisturize the wheel body, including: determining the running frequency of the wafer cleaning device for processing the wafer; based on the first moisturizing mode, according to the target frequency interval corresponding to the running frequency, determining the target control amount of the fluid corresponding to the target frequency interval; according to the target control amount of the fluid, controlling the fluid to flow into the first flow channel to moisturize the wheel body.

[0056] Exemplarily, the first moisturizing mode includes a correspondence between different frequency intervals and the control amount of the fluid, referring to Figure 5 , multiple frequency intervals can be set, corresponding to the control amounts of multiple fluids, and the target frequency interval corresponding to the running frequency can be determined, and then the target control amount of the corresponding fluid, that is, the target opening interval and the target duration, can be determined; according to the target control amount of the fluid, the fluid is controlled to flow into the first flow channel to moisturize the wheel body.

[0057] In this implementation, a correspondence between different frequency intervals and the control amount of the fluid is set, so that the corresponding control amount of the fluid can be determined according to the frequency interval reached by the running frequency of the wheel body, which can reduce fluid loss while ensuring the moisturizing effect of the wafer cleaning device in the working state.

[0058] In an optional implementation, the frequency interval includes a first frequency interval, a second frequency interval and a third frequency interval that do not overlap with each other. Based on the first moisturizing mode, according to the target frequency interval corresponding to the running frequency, the target control amount of the fluid corresponding to the target frequency interval is determined, including: if the running frequency of the wheel body is in the first frequency interval, the target control amount of the fluid is determined to be the first control amount; if the running frequency of the wheel body is in the second frequency interval, the target control amount of the fluid is determined to be the second control amount, the value in the second frequency interval is greater than the value in the first frequency interval, and the second control amount is less than the first control amount; if the running frequency of the wheel body is in the third frequency interval, the target control amount of the fluid is determined to be the third control amount, the value in the third frequency interval is greater than the value in the second frequency interval, and the third control amount is less than the second control amount.

[0059] For example, refer to Figure 5 The frequency interval may include a first frequency interval, a second frequency interval, and a third frequency interval that do not overlap with each other. For example, the first frequency interval is less than 5 pcs / h, the second frequency interval is 5-15 pcs / h, and the third frequency interval is 15-30 pcs / h. The first frequency interval, the second frequency interval, and the third frequency interval may be flexibly set by those skilled in the art according to actual conditions, and this embodiment does not limit this. Among them, the value in the second frequency interval is greater than the value in the first frequency interval, and the value in the third frequency interval is greater than the value in the second frequency interval. Correspondingly, the second control amount is less than the first control amount, and the third control amount is less than the second control amount, that is, as the running frequency increases, the opening interval and duration of the fluid decrease.

[0060] In this implementation, by setting the opening interval and duration of the fluid to decrease as the running frequency increases, the fluid loss can be further reduced while ensuring the moisturizing effect of the wafer cleaning device in the working state.

[0061] Optionally, in this embodiment, in the working state, the fluid can be controlled to flow into the first flow channel in the first moisturizing mode throughout the entire process, or targeted control can be performed in combination with the state of the wafer in the wafer cleaning device, all of which are within the protection scope of this application.

[0062] Another embodiment of the present application provides a wafer cleaning device, including: a fluid supply module, a driving mechanism and a controller, the driving mechanism including a wheel body and a rotating shaft, the rotating shaft rotates synchronously with the wheel body, a first flow channel is arranged inside the rotating shaft, the wheel body includes a second flow channel arranged along the radial direction of the wheel body, and the outer edge of the wheel body is provided with a gap that cooperates with the wafer and communicates with the second flow channel; the controller is used to execute the moisturizing method.

[0063] In one implementation, the moisturizing method may include: monitoring whether the wafer is in place; if the wafer is in place, controlling the fluid to flow into the first flow channel in a micro-positive pressure mode, and to flow out from the outer edge of the wheel body through the second flow channel; if the wafer switches from being in place to being out of place, sucking the fluid from the first flow channel in a negative pressure mode to moisturize the wheel body.

[0064] Optionally, in this embodiment, the pressure of the fluid in the micro-positive pressure mode is greater than 0psi and less than 100psi.

[0065] Optionally, in this embodiment, in the negative pressure mode, the first flow channel and the second flow channel suck water droplets in the gap at the outer edge of the wheel body.

[0066] Optionally, in this embodiment, if the wafer switches from being in place to being out of place, fluid is sucked from the first flow channel in a negative pressure mode, including: if the wafer switches from being in place to being out of place, the fluid is controlled to flow into the first flow channel in a flushing mode to flush the wheel body until it is determined that the wafer is removed from the wafer cleaning device, and then the fluid is sucked from the first flow channel in a negative pressure mode.

[0067] Optionally, in this embodiment, if the wafer is not in place, after the negative pressure mode draws fluid from the first flow channel, the method further includes: controlling the fluid to flow into the first flow channel in a first moisturizing mode to moisturize the wheel body.

[0068] Optionally, in this embodiment, the first moisturizing mode includes a correspondence between different frequency intervals and the control amount of the fluid, the control amount includes an opening interval and a duration, and the controlling the fluid to flow into the first flow channel in the first moisturizing mode to moisturize the wheel body includes: determining the running frequency of the wafer cleaning device for processing wafers; based on the first moisturizing mode, according to the target frequency interval corresponding to the running frequency, determining the target control amount of the fluid corresponding to the target frequency interval; according to the target control amount of the fluid, controlling the fluid to flow into the first flow channel to moisturize the wheel body.

[0069] Optionally, in this embodiment, the frequency interval includes a first frequency interval, a second frequency interval and a third frequency interval that do not overlap with each other, and the target control amount of the fluid corresponding to the target frequency interval is determined based on the first moisturizing mode and according to the target frequency interval corresponding to the running frequency, including: if the running frequency of the wheel body is in the first frequency interval, the target control amount of the fluid is determined to be the first control amount; if the running frequency of the wheel body is in the second frequency interval, the target control amount of the fluid is determined to be the second control amount, the value in the second frequency interval is greater than the value in the first frequency interval, and the second control amount is less than the first control amount; if the running frequency of the wheel body is in the third frequency interval, the target control amount of the fluid is determined to be the third control amount, the value in the third frequency interval is greater than the value in the second frequency interval, and the third control amount is less than the second control amount.

[0070] Optionally, in this embodiment, the monitoring of whether the wafer is in place includes: monitoring whether the wheel body is in motion; if the wheel body is in motion, determining that the wafer is in place; if the wheel body is in a stationary state, monitoring the movement of a robot corresponding to the wafer cleaning device, if the robot does not perform a wafer-taking movement, determining that the wafer is in place, and if the robot performs a wafer-taking movement, determining that the wafer is not in place.

[0071] Reference Figure 6 , shows a schematic diagram of the structure of an electronic device according to an exemplary embodiment of the present application. The specific embodiment of the present invention does not limit the specific implementation of the electronic device.

[0072] like Figure 6 As shown, the electronic device may include: a processor (processor) 501, a memory (memory) 503, a communication bus (communication bus) 504, and a communication interface (Communications Interface) 505.

[0073] Wherein: the processor 501 , the memory 503 and the communication interface 505 communicate with each other via the communication bus 504 .

[0074] The communication interface 505 is used to communicate with other electronic devices or servers.

[0075] The processor 501 is used to execute the program 502, and specifically can execute the steps of any one of the moisturizing methods in the above embodiments.

[0076] Specifically, the program 502 may include program codes, which include computer operation instructions.

[0077] The processor 501 may be a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiment. The one or more processors included in the smart device may be processors of the same type, such as one or more CPUs; or processors of different types, such as one or more CPUs and one or more ASICs.

[0078] The memory 503 is used to store the program 502. The memory 503 may include a high-speed RAM memory, and may also include a non-volatile memory, such as at least one disk memory.

[0079] The program 502 can be specifically used to enable the processor 501 to execute the steps of any one of the moisturizing methods described in the embodiments. The specific implementation of each step in the program 502 can refer to the corresponding descriptions in the steps and units executed by any one of the moisturizing methods in the above steps, which will not be repeated here. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the above-described devices and modules can refer to the corresponding process description in the above-mentioned method embodiments.

[0080] See also Figure 7 , provides a wafer cleaning device, which may include a fluid supply module, a driving mechanism, and a controller.

[0081] Specifically, the wafer cleaning device includes a box body 601, a driving mechanism and a wafer 602 are placed in the box body; the driving mechanism may include: an A driving wheel 603, a B driving wheel 604 and a driven wheel 605, the A driving wheel 603 and the B driving wheel 604 are used to support the wafer 602, and the driven wheel 605 is used to monitor the rotation speed of the wafer, and any one or more of the A driving wheel 603, the B driving wheel 604 and the driven wheel 605 may adopt the above-mentioned driving structure. The A driving wheel, the B driving wheel and / or the driven wheel adopting the above-mentioned driving structure are also connected to the fluid supply module. When the wafer is cleaned, the fluid supply module controls the fluid pressure so that the fluid flows into the corresponding A driving wheel, the B driving wheel and / or the driven wheel, thereby cleaning the wafer.

[0082] The driving wheel or driven wheel may include: a wheel body and a rotating shaft, the rotating shaft rotates synchronously with the wheel body, a first flow channel is arranged inside the rotating shaft, the wheel body includes a second flow channel arranged along the radial direction of the wheel body, the first flow channel is used to transport fluid to the second flow channel, the fluid flows out from the outer edge of the wheel body through the second flow channel, and the outer edge of the wheel body is provided with a gap that matches the wafer and communicates with the second flow channel. The specific structure is as above and will not be repeated here.

[0083] The embodiment further provides a computer storage medium on which a computer program is stored. When the program is executed by a processor, the moisturizing method described in any one of the above-mentioned method embodiments is implemented.

[0084] The embodiment further provides a computer program product, including computer instructions, which instruct a computing device to execute operations corresponding to the moisturizing method described in any one of the above-mentioned method embodiments.

[0085] It should be pointed out that, according to the needs of implementation, the various components / steps described in the embodiment can be split into more components / steps, or two or more components / steps or partial operations of components / steps can be combined into new components / steps to achieve the purpose of the embodiment.

[0086] The above-mentioned method according to the embodiment can be implemented in hardware, firmware, or can be implemented as software or computer code that can be stored in a recording medium (such as CD ROM, RAM, floppy disk, hard disk or magneto-optical disk), or can be implemented as computer code that is originally stored in a remote recording medium or a non-temporary machine-readable medium downloaded through a network and will be stored in a local recording medium, so that the method described herein can be stored in such software processing on a recording medium using a general-purpose computer, a special-purpose processor or programmable or special-purpose hardware (such as ASIC or FPGA). It can be understood that a computer, a processor, a microprocessor controller or programmable hardware includes a storage component (e.g., RAM, ROM, flash memory, etc.) that can store or receive software or computer code, and when the software or computer code is accessed and executed by a computer, a processor or hardware, the method described herein is implemented. In addition, when a general-purpose computer accesses the code for implementing the method shown here, the execution of the code converts the general-purpose computer into a special-purpose computer for executing the method shown here.

[0087] Those of ordinary skill in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0088] The above implementation modes are only used to illustrate the present application, and are not intended to limit the present application. Ordinary technicians in the relevant technical field may make various changes and modifications without departing from the spirit and scope of the present application. Therefore, all equivalent technical solutions also belong to the scope of the present application, and the scope of patent protection of the present application shall be limited by the claims.

Claims

1. A moisturizing method, characterized in that: A driving mechanism used in a wafer cleaning device, the driving mechanism comprising a wheel body and a rotating shaft, the rotating shaft rotates synchronously with the wheel body, a first flow channel is arranged inside the rotating shaft, the wheel body comprises a second flow channel arranged along the radial direction of the wheel body, the outer edge of the wheel body is provided with a gap matched with a wafer and communicating with the second flow channel, the moisturizing method comprises: Monitor whether the wafer is in place; If the wafer is in place, controlling the fluid to flow into the first flow channel in a slightly positive pressure mode and to flow out from the outer edge of the wheel body through the second flow channel; If the wafer is switched from being in place to being out of place, fluid is sucked from the first flow channel in a negative pressure mode to moisturize the wheel body.

2. The moisturizing method according to claim 1, characterized in that: In the micro-positive pressure mode, the pressure of the fluid is greater than 0 psi and less than 100 psi.

3. The moisturizing method according to claim 1, characterized in that: In the negative pressure mode, the first flow channel and the second flow channel suck water droplets in the gap at the outer edge of the wheel body.

4. The moisturizing method according to claim 1, characterized in that: If the wafer is switched from being in place to being out of place, the fluid is sucked from the first flow channel in a negative pressure mode, including: If the wafer switches from being in place to being out of place, the fluid is controlled to flow into the first flow channel in a flushing mode to flush the wheel body until it is determined that the wafer is moved out of the wafer cleaning device, and then the fluid is sucked from the first flow channel in a negative pressure mode.

5. The moisturizing method according to claim 4, characterized in that: If the wafer is not in place, after the negative pressure mode draws fluid from the first flow channel, the method further includes: The fluid is controlled to flow into the first flow channel in a first moisturizing mode to moisturize the wheel body.

6. The moisturizing method according to claim 5, characterized in that: The first moisturizing mode includes a correspondence between different frequency intervals and a control amount of the fluid, the control amount includes an opening interval and a duration, and the fluid is controlled to flow into the first flow channel in the first moisturizing mode to moisturize the wheel body, including: Determining a wafer running frequency of the wafer cleaning device for processing wafers; Based on the first moisturizing mode, determining a target control amount of the fluid corresponding to the target frequency interval according to the target frequency interval corresponding to the running frequency; According to the target control amount of the fluid, the fluid is controlled to flow into the first flow channel to moisturize the wheel body.

7. The moisturizing method according to claim 6, characterized in that: The frequency interval includes a first frequency interval, a second frequency interval, and a third frequency interval that do not overlap with each other, and determining the target control amount of the fluid corresponding to the target frequency interval based on the first moisturizing mode and according to the target frequency interval corresponding to the running frequency includes: If the running frequency of the wheel body is in the first frequency interval, determining the target control amount of the fluid to be the first control amount; If the running frequency of the wheel body is in the second frequency interval, the target control amount of the fluid is determined to be the second control amount, the value in the second frequency interval is greater than the value in the first frequency interval, and the second control amount is less than the first control amount; If the running frequency of the wheel body is in the third frequency interval, the target control amount of the fluid is determined to be the third control amount, the value in the third frequency interval is greater than the value in the second frequency interval, and the third control amount is less than the second control amount.

8. The moisturizing method according to any one of claims 1 to 7, characterized in that: The monitoring of whether the wafer is in place includes: Monitoring whether the wheel body is in motion; If the wheel is in motion, it is determined that the wafer is in place; If the wheel body is in a stationary state, the action of the robot corresponding to the wafer cleaning device is monitored. If the robot does not take the wafer, it is determined that the wafer is in place. If the robot takes the wafer, it is determined that the wafer is not in place.

9. A wafer cleaning device, characterized in that: include: Fluid supply module, drive mechanism and controller, The driving mechanism comprises a wheel body and a rotating shaft, the rotating shaft rotates synchronously with the wheel body, a first flow channel is arranged inside the rotating shaft, the wheel body comprises a second flow channel arranged along the radial direction of the wheel body, and a gap is arranged on the outer edge of the wheel body to match the wafer and communicate with the second flow channel; The controller is used to perform the following moisturizing method: Monitor whether the wafer is in place; If the wafer is in place, controlling the fluid to flow into the first flow channel in a slightly positive pressure mode and to flow out from the outer edge of the wheel body through the second flow channel; If the wafer is switched from being in place to being out of place, fluid is sucked from the first flow channel in a negative pressure mode to moisturize the wheel body.

10. The wafer cleaning device according to claim 9, characterized in that: In the micro-positive pressure mode, the pressure of the fluid is greater than 0 psi and less than 100 psi.

11. The wafer cleaning device according to claim 9, characterized in that: In the negative pressure mode, the first flow channel and the second flow channel suck water droplets in the gap at the outer edge of the wheel body.

12. The wafer cleaning device according to claim 9, characterized in that: If the wafer is switched from being in place to being out of place, the fluid is sucked from the first flow channel in a negative pressure mode, including: If the wafer switches from being in place to being out of place, the fluid is controlled to flow into the first flow channel in a flushing mode to flush the wheel body until it is determined that the wafer is moved out of the wafer cleaning device, and then the fluid is sucked from the first flow channel in a negative pressure mode.

13. The wafer cleaning device according to claim 12, characterized in that: If the wafer is not in place, after the negative pressure mode draws fluid from the first flow channel, the method further includes: The fluid is controlled to flow into the first flow channel in a first moisturizing mode to moisturize the wheel body.

14. The wafer cleaning device according to claim 13, characterized in that: The first moisturizing mode includes a correspondence between different frequency intervals and a control amount of the fluid, the control amount includes an opening interval and a duration, and the fluid is controlled to flow into the first flow channel in the first moisturizing mode to moisturize the wheel body, including: Determining a wafer running frequency of the wafer cleaning device for processing wafers; Based on the first moisturizing mode, determining a target control amount of the fluid corresponding to the target frequency interval according to the target frequency interval corresponding to the running frequency; According to the target control amount of the fluid, the fluid is controlled to flow into the first flow channel to moisturize the wheel body.

15. The wafer cleaning device according to claim 14, characterized in that: The frequency interval includes a first frequency interval, a second frequency interval, and a third frequency interval that do not overlap with each other, and determining the target control amount of the fluid corresponding to the target frequency interval based on the first moisturizing mode and according to the target frequency interval corresponding to the running frequency includes: If the running frequency of the wheel body is in the first frequency interval, determining the target control amount of the fluid to be the first control amount; If the running frequency of the wheel body is in the second frequency interval, the target control amount of the fluid is determined to be the second control amount, the value in the second frequency interval is greater than the value in the first frequency interval, and the second control amount is less than the first control amount; If the running frequency of the wheel body is in the third frequency interval, the target control amount of the fluid is determined to be the third control amount, the value in the third frequency interval is greater than the value in the second frequency interval, and the third control amount is less than the second control amount.

16. The wafer cleaning device according to any one of claims 9 to 15, characterized in that: The monitoring of whether the wafer is in place includes: Monitoring whether the wheel body is in motion; If the wheel is in motion, it is determined that the wafer is in place; If the wheel body is in a stationary state, the action of the robot corresponding to the wafer cleaning device is monitored. If the robot does not take the wafer, it is determined that the wafer is in place. If the robot takes the wafer, it is determined that the wafer is not in place.

17. An electronic device, characterized in that: include: A processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface communicate with each other via the communication bus; The memory is used to store at least one executable instruction, and the executable instruction enables the processor to perform an operation corresponding to the method according to any one of claims 1 to 8.

18. A computer storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the method according to any one of claims 1 to 8 is implemented.

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