Chip processing bonding machine with positioning function

Abstract

The invention relates to a bonding machine with a positioning function for chip processing in the technical field of bonding machines. The problem that the flexible circuit board cannot be accurately fixed and positioned is solved. Comprising a machine body, a placing seat is fixedly connected to the machine body, a supporting sliding block is slidably connected to the placing seat, clamping plates are slidably connected to the placing seat and the supporting sliding block, a connecting hydraulic cylinder is fixedly connected to the placing seat, and a groove and a blind hole are formed in the supporting sliding block; the telescopic end of the connecting hydraulic cylinder is fixedly connected with a limiting plate in limiting fit with a groove of the supporting sliding block, the machine body is fixedly connected with a first electric push rod, and the telescopic end of the first electric push rod is fixedly connected with an extrusion plate. According to the invention, the purpose of clamping and flattening the flexible circuit board is achieved through the movement of the clamping plate in cooperation with the movement of the supporting slide block on the placement seat, and meanwhile, the circuit board is positioned in cooperation with the placement of the initial circuit board, so that the stability of the circuit board and a chip in the bonding process is ensured.

Description

Technical Field

[0001] The invention relates to a bonding machine with a positioning function for chip processing, which belongs to the technical field of bonding machines. Background Art

[0002] The bonding machine is a core device in the semiconductor packaging process, which is used to form an electrical and mechanical connection between the semiconductor chip and the circuit board or lead frame. When the existing bonding machine processes the semiconductor chip and the circuit board, the bonding machine fixes the circuit board and the chip through a clamp. Then, the bonding machine uses a visual system to accurately locate the bonding points on the chip and the circuit board, and then connects the metal wires or bumps between the chip and the circuit board through the bonding head to complete the bonding process of the chip and the circuit board. However, when the existing bonding machine performs bonding processing on the flexible circuit board and the semiconductor chip, the robot arm places the circuit board and chip in the storage state on the clamp for fixing. If the flexible circuit board is bent during the storage process, due to the elasticity and memory of the flexible circuit board's own material, the flexible circuit board will still have a slight arc or bend after it is fixed, resulting in the bottom of the flexible circuit board being unable to fully fit with the clamp when it is fixed by the clamp, which in turn causes the chip and circuit board to move slightly during the bonding process, causing the bonding machine to offset the positioning of the bonding points of the chip and circuit board, affecting the reliability of the electrical connection, and even causing the chip to short-circuit or break during use, seriously affecting the quality of the bonding machine's processing. For this reason, a bonding machine that can stably fix and position the flexible circuit board and chip is needed. Summary of the invention

[0003] In order to solve the problem that the flexible circuit board cannot be accurately fixed and positioned, the present invention provides a bonding machine with a positioning function for chip processing.

[0004] The technical solution of the present invention is: a bonding machine with a positioning function for chip processing, comprising a body, a placement seat fixedly connected to the body, a support slider slidably connected to the placement seat, a tension spring fixedly connected between the placement seat and the support slider, a clamping plate slidably connected to the placement seat and the support slider, a first elastic telescopic rod fixedly connected to the clamping plate on one side, the telescopic end of the first elastic telescopic rod penetrates the adjacent clamping plate, the first elastic telescopic rod is connected to a connecting pipe, a connecting hydraulic cylinder connected to the connecting pipe is fixedly connected to one side of the placement seat, A groove and a blind hole are provided on one side of the support slider close to the connecting hydraulic cylinder, the blind hole on the support slider is used to be inserted by the telescopic end of the first elastic telescopic rod, the telescopic end of the connecting hydraulic cylinder is fixedly connected to a limit plate that cooperates with the limit position of the groove of the support slider, a first electric push rod is fixedly connected to the fuselage, the telescopic end of the first electric push rod is fixedly connected to an extrusion plate, tension springs are provided between the extrusion plate and the mirror-image clamping plate, a positioning mechanism for locating the chip position is provided on the fuselage, and a fixing mechanism for fixing the position of the chip and the circuit board is provided on the fuselage.

[0005] The top of the sliding panel also is provided with an interlocking structure, and the interlocking structure is connected with the spring, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the

[0006] As a preferred embodiment of the present invention, the adjusting component includes a sliding bracket, which is slidably connected to a side of the placement seat close to the sliding bracket, a second elastic telescopic rod is fixedly connected to the sliding bracket, the telescopic end of the second elastic telescopic rod is extruded and matched with the sliding bracket, the side of the second elastic telescopic rod away from the sliding bracket is connected to a first fluid guide tube, a first hydraulic cylinder and a second hydraulic cylinder are fixedly connected to the support plate, the first hydraulic cylinder is connected to the first fluid guide tube, the telescopic end of the first hydraulic cylinder is fixedly connected to the sliding shell away from the sliding bracket, the side of the second hydraulic cylinder away from the sliding bracket is connected to a second fluid guide tube connected to a side of the second elastic telescopic rod close to the sliding bracket, and the telescopic end of the second hydraulic cylinder is limitedly slidably connected to the sliding shell close to the sliding bracket through a connecting bend.

[0007] As a preferred embodiment of the present invention, the difference between the cross-sectional area of ​​the first hydraulic cylinder and the cross-sectional area of ​​its telescopic end is half of the cross-sectional area of ​​the second elastic telescopic rod, so as to enable the sliding shell away from the sliding frame to accurately locate the chip position.

[0008] As a preferred embodiment of the present invention, the auxiliary positioning assembly includes a third hydraulic cylinder, the third hydraulic cylinder is fixedly connected to one side of the placement seat, the telescopic end of the third hydraulic cylinder is fixedly connected to the clamping plate on the supporting slider, the third hydraulic cylinder is connected to a third fluid guide tube, the mirror image sliding shell is commonly connected to the third fluid guide tube, the mirror image extrusion rods are both fixedly connected to a third elastic telescopic rod, the telescopic end of the third elastic telescopic rod is fixedly connected to a connecting plate, the connecting plate is fixedly connected to a limiting bent rod on one side close to the adjacent limit block, and the limiting bent rod slides with the adjacent moving rod in a limited manner.

[0009] As a preferred embodiment of the present invention, the reset assembly includes a third electric push rod, which is fixed to the upper side of the sliding frame, and the telescopic end of the third electric push rod is fixed with a fixed inclined block that is squeezed and matched with the adjacent sliding shell, and the side of the placement seat close to the first electric push rod is fixed with a fixed bent plate that is squeezed and matched with the adjacent clamping plate.

[0010] As a preferred embodiment of the present invention, a slope is provided on one side of the fixed bevel block adjacent to the sliding shell, and the width of the slope in the vertical direction is greater than the thickness of the chip, so as to facilitate the movement of the connecting plate.

[0011] As a preferred embodiment of the present invention, the fixing mechanism includes a mounting slide, the mounting slide is slidably connected to the fuselage, the mounting slide is slidably connected to a supporting slide, the supporting slide is slidably connected to a connecting shell, a friction force is arranged between the supporting slide and the connecting shell, an adsorption cylinder is slidably connected to the lower side of the connecting shell, a spring is fixedly connected between the connecting shell and the adsorption cylinder, a piston rod penetrating the connecting shell is slidably connected to the inside of the adsorption cylinder, a tension spring is fixedly connected between the adsorption cylinder and the piston rod, the piston rod is extruded and matched with the supporting slide, a rubber ring is arranged on the lower side of the adsorption cylinder, and a rubber ring is arranged on the upper side of the adsorption cylinder. A one-way valve is provided, and the inner wall surface of the connecting shell is set as a step surface. The upper side of the adsorption cylinder is connected to an exhaust pipe which cooperates with the connecting shell for sealing. The supporting slide plate is fixedly connected with a fourth electric push rod, and the telescopic end of the fourth electric push rod is squeezed and matched with the connecting shell, and the telescopic end of the fourth electric push rod is fixedly connected with an elastic rope penetrating the connecting shell. The side wall of the adsorption cylinder is provided with a through hole, and the side wall of the adsorption cylinder is slidably connected with a sliding bent plate which cooperates with its through hole for sealing, the sliding bent plate is squeezed and matched with the connecting shell, and the sliding bent plate is fixedly connected to the elastic rope, and a moving component which assists the adsorption cylinder in positioning the center of the chip is provided on the fuselage.

[0012] As a preferred embodiment of the present invention, the moving component includes a fourth hydraulic cylinder, the fourth hydraulic cylinder is fixedly connected to a side of the fuselage close to the mounting slide, the fourth hydraulic cylinder is connected to a guide pipe connected to a side of the second hydraulic cylinder close to the sliding frame, the telescopic end of the fourth hydraulic cylinder is fixedly connected to the mounting slide, a fifth electric push rod is fixedly connected to the mounting slide, and the telescopic end of the fifth electric push rod is fixedly connected to the supporting slide.

[0013] As a preferred embodiment of the present invention, it also includes an anti-pull mechanism, which is arranged on the connecting shell, and is used to assist the adsorption cylinder in releasing the adsorption of the chip. The anti-pull mechanism includes a cylinder, and the cylinder is fixed to the connecting shell. The telescopic end of the cylinder is fixed to the telescopic end of the fourth electric push rod, and the cylinder is connected to an air duct connected to the lower part of the adsorption cylinder. An auxiliary pressure rod is slidably connected in the adsorption cylinder, and a tension spring is fixed between the auxiliary pressure rod and the adsorption cylinder, and an elastic block is arranged on the lower side of the auxiliary pressure rod.

[0014] The beneficial effects of the present invention are as follows: 1. The present invention achieves the purpose of clamping and flattening the flexible circuit board by moving the clamping plate in coordination with the movement of the supporting slider on the placement seat, and at the same time completes the positioning of the circuit board in coordination with the placement of the initial circuit board, thereby ensuring the stability of the circuit board and the chip during the bonding process.

[0015] 2. The present invention completes the positioning of the chip by moving the connecting plate in the auxiliary positioning assembly in cooperation with the extrusion rod, so that the chip is fixed at a fixed position on the circuit board, thereby ensuring the accuracy and rapidity of the subsequent chip bonding point positioning.

[0016] 3. The present invention fixes the chip by adsorbing it through the cooperation of the connecting shell and the adsorption cylinder in the fixing mechanism, thereby preventing the chip and the circuit board from moving during the bonding process, and ensuring the stability of the device during bonding.

[0017] 4. The present invention injects gas into the adsorption cylinder through the cylinder in the anti-pulling mechanism, and cooperates with the auxiliary pressure rod to delay pressing and fixing the chip, so as to avoid the situation where the chip is moved due to the untimely release of the adsorption state of the chip, thereby ensuring the stability and safety of the electrical connection between the chip and the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0019] Figure 2 It is a three-dimensional structural schematic diagram of the sliding frame and the parts where the sliding plate is installed according to the present invention;

[0020] Figure 3 It is a three-dimensional structural schematic diagram of the connecting pipe and the parts connected to the hydraulic cylinder of the present invention;

[0021] Figure 4 It is a three-dimensional structural schematic diagram of the parts connecting the hydraulic cylinder and the limit plate of the present invention;

[0022] Figure 5 It is a three-dimensional structural schematic diagram of the parts of the sliding frame and the sliding bracket of the present invention;

[0023] Figure 6 It is a three-dimensional structural schematic diagram of the parts of the support plate and the sliding shell of the present invention;

[0024] Figure 7 It is a three-dimensional structural schematic diagram of the parts of the connecting plate and the limit bending rod of the present invention;

[0025] Figure 8 It is a three-dimensional structural schematic diagram of the parts at the extrusion rod and the limit block of the present invention;

[0026] Fig. 9 It is a three-dimensional structural schematic diagram of the parts of the third electric push rod and the fixed inclined block of the present invention;

[0027] Fig.10 It is a three-dimensional structural schematic diagram of the parts of the fourth hydraulic cylinder and the guide pipe of the present invention;

[0028] Fig.11 It is a three-dimensional structural schematic diagram of the parts of the cylinder and the air guide pipe of the present invention.

[0029] Markings in the accompanying drawings: 1-body, 2-placement seat, 3-support slider, 4-clamping plate, 5-first elastic telescopic rod, 6-connecting pipe, 7-connecting hydraulic cylinder, 8-limiting plate, 9-first electric push rod, 10-extrusion plate, 201-sliding frame, 202-support plate, 203-second electric push rod, 204-sliding shell, 205-moving rod, 206-extrusion rod, 207-limiting block, 301-sliding bracket, 302-second elastic telescopic rod, 303-first liquid guide tube, 304-first hydraulic cylinder, 305-second hydraulic cylinder, 306-second liquid guide tube, 401-first Three hydraulic cylinders, 402-third liquid guide tube, 403-third elastic telescopic rod, 404-connecting plate, 405-limiting bent rod, 501-third electric push rod, 502-fixed inclined block, 503-fixed bent plate, 601-installing slide plate, 602-supporting slide plate, 603-connecting shell, 604-adsorption cylinder, 605-piston rod, 606-exhaust pipe, 607-fourth electric push rod, 608-elastic rope, 609-sliding bent plate, 701-fourth hydraulic cylinder, 702-guide tube, 703-fifth electric push rod, 801-cylinder, 802-air guide tube, 803-auxiliary pressure rod. DETAILED DESCRIPTION

[0030] The following is combined with Figure 1-Figure 11 , the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0031] Example 1: When the existing bonding machine performs bonding processing on the flexible circuit board and the semiconductor chip, the robotic arm is required to clamp the circuit board and the chip in the storage state and place them on the fixture for fixation. If the flexible circuit board is bent during the storage process, due to the elasticity and memory of the flexible circuit board's own material, the flexible circuit board will still have a slight arc or bend after the fixation is completed, resulting in the bottom of the flexible circuit board being unable to fully fit with the fixture when it is fixed by the fixture, thereby causing the semiconductor chip and the flexible circuit board to move during the bonding process, causing the bonding machine to offset the positioning of the semiconductor chip and the flexible circuit board, seriously affecting the accuracy and quality of the bonding machine's processing.

[0032] A bonding machine with positioning function for chip processing, referring to Figure 1-Figure 4As shown, it includes a body 1, a control panel is arranged on the body 1, a placement seat 2 is fixedly connected to the body 1, a support slider 3 is slidably connected to the front of the placement seat 2, a tension spring is fixedly connected between the placement seat 2 and the support slider 3, and the tension spring is initially in a stretched state, the placement seat 2 and the support slider 3 are both slidably connected to a clamping plate 4, the two clamping plates 4 are distributed in front and back mirror images, the two clamping plates 4 move, and cooperate with the placement seat 2 and the support slider 3 to complete the clamping and fixing of the front and back sides of the flexible circuit board, a first elastic telescopic rod 5 is fixedly connected to the front clamping plate 4, the telescopic end of the first elastic telescopic rod 5 penetrates the adjacent clamping plate 4, the first elastic telescopic rod 5 is connected to a connecting pipe 6, a connecting hydraulic cylinder 7 is fixedly connected to the right side of the placement seat 2, and the connecting hydraulic cylinder 7 is connected to the connecting pipe 6, a groove and a blind hole are arranged on the right side of the support slider 3, if the front clamping plate 4 fails to complete the clamping of the front side of the circuit board (that is, the circuit board is not clamped well), the telescopic end of the first elastic telescopic rod 5 is inserted into the blind hole of the support slider 3, and the connecting hydraulic cylinder 7 is connected to the connecting hydraulic cylinder 7. The telescopic end of the pressure cylinder 7 is fixedly connected to the limit plate 8, and the limit plate 8 is limitedly matched with the groove of the supporting slider 3. Initially, the limit plate 8 is in the state of limiting the supporting slider 3. A first electric push rod 9 is fixedly connected to the fuselage 1, and a squeezing plate 10 is fixedly connected to the telescopic end of the first electric push rod 9. Tension springs are arranged between the squeezing plate 10 and the two clamping plates 4, which are used to control the two clamping plates 4 to move up and down synchronously through the movement of the telescopic end of the first electric push rod 9. A positioning mechanism for locating the chip position is arranged on the fuselage 1, and a fixing mechanism for fixing the position of the chip and the circuit board is arranged on the fuselage 1. The first electric push rod 9, the positioning mechanism and the fixing mechanism are all electrically connected to the control panel. The first elastic telescopic rod 5, the connecting pipe 6 and the connecting hydraulic cylinder 7 are all filled with hydraulic oil. The front and rear sides of the flexible circuit board are clamped by moving the two clamping plates 4, and the circuit board is flattened in cooperation with the support slider 3 to keep the surface of the circuit board flat. At the same time, the positioning of the circuit board is completed, thereby ensuring the stability of the circuit board during the subsequent operation of the device.

[0033] Reference Figure 1 , Figure 2 and Figure 5-Figure 8As shown, the positioning mechanism includes a sliding frame 201, which is slidably connected to the fuselage 1, and the sliding frame 201 is located on the right side of the placement seat 2. The sliding frame 201 is L-shaped, and a support plate 202 is slidably connected to the upper side of the sliding frame 201. The support plate 202 only slides back and forth on the sliding frame 201. A spring is fixedly connected between the support plate 202 and the sliding frame 201. A second electric push rod 203 is fixedly connected to one side of the fuselage 1 close to the sliding frame 201. The second electric push rod 203 is located on the sliding frame 201. On the right side, the telescopic end of the second electric push rod 203 is fixedly connected to the sliding frame 201, and two sliding shells 204 of left and right mirror images are slidably connected on the support plate 202. The moving distance of the left sliding shell 204 on the sliding frame 201 is twice the moving distance of the right sliding shell 204. A moving rod 205 is slidably connected in the sliding shell 204, and an extrusion rod 206 is slidably connected to the lower side of the moving rod 205. The relative position of the chip on the circuit board is adjusted by squeezing the extrusion rod 206. The extrusion rod 206 and the support plate 202 is extruded and matched, a through hole is provided on the extrusion rod 206, and a limited block 207 is slidably connected on the moving rod 205. The limited block 207 is limited and matched with the through hole on the adjacent extrusion rod 206. The position of the left and right edges of the chip on the circuit board is positioned by limiting the position of the limited block 207 and the through hole on the adjacent extrusion rod 206, so as to ensure the accurate positioning of the bonding point in the subsequent bonding process. A tension spring is fixedly connected between the limited block 207 and the adjacent moving rod 205, and the tension spring is initially in a stretched state. An adjustment component for adjusting the fixed position of the chip is provided on the right side of the placement seat 2, and an auxiliary positioning component for assisting in positioning the chip position is provided on the placement seat 2. A reset component for moving the support plate 202 is provided on the sliding frame 201, and the second electric push rod 203 and the reset component are evenly electrically connected to the control panel. The sliding shell 204 is filled with hydraulic oil. The sliding frame 201, the sliding shell 204 and the extrusion rod 206 are moved to achieve the purpose of adjusting the position of the chip on the circuit board, so as to facilitate the subsequent bonding process.

[0034] Reference Figure 2 , Figure 3 and Figure 5-Figure 7As shown, the adjustment component includes a sliding bracket 301, which is slidably connected to the right side of the placement seat 2 and is used to locate the right edge position of the circuit board, so as to facilitate the adaptive adjustment of the position of the chip on the circuit board by the device. A second elastic telescopic rod 302 is fixedly connected to the sliding bracket 201. Initially, the telescopic end of the second elastic telescopic rod 302 contacts the sliding bracket 301, and the telescopic end of the second elastic telescopic rod 302 is squeezed and matched with the sliding bracket 301. The right side of the second elastic telescopic rod 302 is connected with a first liquid guide tube 303. A first hydraulic cylinder 304 and a second hydraulic cylinder 305 are fixedly connected to the support plate 202. The first hydraulic cylinder 304 is located behind the second hydraulic cylinder 305, and the first hydraulic cylinder 304 is connected to the first liquid guide tube 303. The telescopic end of the first hydraulic cylinder 304 is fixedly connected to the sliding shell 204 on the left side. The difference between the cross-sectional area inside the first hydraulic cylinder 304 and the cross-sectional area of ​​its telescopic end is the second elastic telescopic rod. Half of the cross-sectional area of ​​302 is used to accurately position the sliding shell 204 away from the sliding frame 201. During the movement of the two sliding shells 204 driven by the sliding frame 201 through the support plate 202, the two sliding shells 204 approach each other to complete the extrusion positioning of the chip. The left side of the second hydraulic cylinder 305 is connected with a second liquid guide tube 306, and the second liquid guide tube 306 is connected with the left side of the second elastic telescopic rod 302. The telescopic end of the second hydraulic cylinder 305 is connected to the sliding shell 204 on the right side through a connecting bend block. The sliding shell 204 can move up and down when driven by the telescopic end of the second hydraulic cylinder 305. The second elastic telescopic rod 302, the first liquid guide tube 303, the first hydraulic cylinder 304, the second hydraulic cylinder 305 and the second liquid guide tube 306 are all filled with hydraulic oil. Through the cooperation of the sliding bracket 301 and the second elastic telescopic rod 302, the positioning of the chip by the device is adaptively controlled.

[0035] Reference Figure 2 and Figure 5-Figure 8As shown, the auxiliary positioning assembly includes a third hydraulic cylinder 401, the third hydraulic cylinder 401 is fixedly connected to the front side of the placement seat 2, the telescopic end of the third hydraulic cylinder 401 is fixedly connected to the clamping plate 4 on the support slider 3, the third hydraulic cylinder 401 is connected to the third liquid guide tube 402, and the two sliding shells 204 are commonly connected to the third liquid guide tube 402. By moving the clamping plate 4, the purpose of detecting the thickness of the circuit board is achieved, and then the height of the two extrusion rods 206 is controlled to adjust the extrusion of the chip. The two extrusion rods 206 are both fixedly connected to the third elastic telescopic rod 403, and the telescopic end of the third elastic telescopic rod 403 is initially extended to the storage The third elastic telescopic rod 403 is in a force state, the telescopic end of the third elastic telescopic rod 403 is fixedly connected with a connecting plate 404, and the back sides of the two connecting plates 404 are fixedly connected with a limit bending rod 405. The limit bending rod 405 slides with the adjacent moving rod 205. The limit bending rod 405 is provided with an inclined surface on one side close to the adjacent connecting plate 404, which is used for squeezing and resetting with the adjacent moving rod 205. The third hydraulic cylinder 401 and the third liquid guiding tube 402 are filled with hydraulic oil. The height of the two squeezing rods 206 is controlled by the two moving rods 205, and the two connecting plates 404 are coordinated to adjust the front and rear sides of the chip, thereby ensuring the accuracy of the chip position adjustment on the circuit board.

[0036] Reference Figure 2 , Figure 5 and Fig. 9 As shown, the reset component includes a third electric push rod 501, the third electric push rod 501 is fixedly connected to the upper side of the sliding frame 201, the telescopic end of the third electric push rod 501 is fixedly connected to a fixed inclined block 502, the fixed inclined block 502 is squeezed and matched with the adjacent sliding shell 204, and a slope is arranged on the left side of the fixed inclined block 502, which is inclined from top to bottom and backward. The width of the slope in the vertical direction is greater than the thickness of the chip, which is convenient for the movement of the connecting plate 404, so that the connecting plate 404 moves upward and breaks away from contact with the chip, and is convenient for subsequent backward movement to leave enough space for bonding. A fixed bent plate 503 is fixedly connected to the front side of the placement seat 2, and the upper side of the fixed bent plate 503 is inclined upward from front to back, and the fixed bent plate 503 is squeezed and matched with the adjacent clamping plate 4. The third electric push rod 501 is electrically connected to the control panel, and the right sliding shell 204 is squeezed by the fixed inclined block 502, so that the device leaves enough processing space for the chip bonding position on the circuit board.

[0037] Reference Figure 2 , Fig.10 and Fig.11As shown, the fixing mechanism includes a mounting slide 601, which is slidably connected to the fuselage 1. The mounting slide 601 only slides left and right on the fuselage 1. A supporting slide 602 is slidably connected inside the mounting slide 601. The supporting slide 602 is used to drive the connected parts to move forward and backward on the mounting slide 601. The supporting slide 602 is slidably connected to a connecting shell 603. A friction force is provided between the supporting slide 602 and the connecting shell 603 to prevent the connecting shell 603 from moving without an external force on the supporting slide 602. An adsorption cylinder 604 is slidably connected to the lower side of the connecting shell 603. A spring is fixed between the connecting shell 603 and the adsorption cylinder 604. The adsorption cylinder 604 slides inside. It is connected with a piston rod 605, which penetrates the connecting shell 603. A tension spring is fixedly connected between the adsorption cylinder 604 and the piston rod 605. The tension spring is initially in a stretched state. The piston rod 605 is squeezed and matched with the supporting slide 602. When the connecting shell 603 drives the adsorption cylinder 604 to reset, the piston rod 605 is squeezed by the supporting slide 602 to restore the initial power storage state. A rubber ring is provided on the lower side of the adsorption cylinder 604. After the rubber ring on the lower side of the adsorption cylinder 604 contacts the chip, it is used to ensure the sealing inside the adsorption cylinder 604. A one-way valve is provided on the upper side of the adsorption cylinder 604, which is used to allow the gas in the connecting shell 603 to only enter the adsorption cylinder 604. The inner wall surface of the connecting shell 603 is set as a step surface. , the upper side of the adsorption cylinder 604 is connected with an exhaust pipe 606, and the exhaust pipe 606 is sealed with the connecting shell 603. Only when the exhaust pipe 606 moves to the step surface of the connecting shell 603, the exhaust pipe 606 discharges the gas on the upper side of the piston rod 605 in the adsorption cylinder 604, so that the adsorption cylinder 604 adsorbs the chip, and the supporting slide plate 602 is fixedly connected with a fourth electric push rod 607, and the telescopic end of the fourth electric push rod 607 is extruded and matched with the connecting shell 603, and the telescopic end of the fourth electric push rod 607 is fixedly connected with an elastic rope 608, and the elastic rope 608 penetrates the connecting shell 603. The side wall of the adsorption cylinder 604 is provided with a through hole, and the side wall of the adsorption cylinder 604 is slidably connected with a sliding bent plate 609, and the sliding bent plate 609 is connected to the adsorption cylinder 604. The through hole of the cylinder 604 is blocked and matched. Initially, the sliding bent plate 609 does not block the through hole of the adsorption cylinder 604, which is used to release the adsorption state of the chip by the adsorption cylinder 604. The sliding bent plate 609 is squeezed and matched with the connecting shell 603. The sliding bent plate 609 is fixedly connected to the elastic rope 608. A moving component for assisting the adsorption cylinder 604 in positioning the center of the chip is provided on the fuselage 1. The fourth electric push rod 607 and the moving component are electrically connected to the control panel. Through the movement of the piston rod 605 and the sliding bent plate 609 in the adsorption cylinder 604, the purpose of making the adsorption cylinder 604 adsorb and fix the chip position is achieved, thereby ensuring the accuracy of the fitting and positioning of the circuit board and the chip when the device is bonded, and improving the quality of the bonding process of the device.

[0038] Reference Figure 2 , Figure 5 , Figure 6 and Fig.10As shown, the moving component includes a fourth hydraulic cylinder 701, which is fixedly connected to a side of the fuselage 1 close to the mounting slide 601, and the fourth hydraulic cylinder 701 is connected to a guide tube 702, and the guide tube 702 is connected to the right side of the second hydraulic cylinder 305. The telescopic end of the fourth hydraulic cylinder 701 is fixedly connected to the mounting slide 601, and a fifth electric push rod 703 is fixedly connected to the mounting slide 601. The fifth electric push rod 703 is used to control the support slide 602 to drive the adsorption cylinder 604 to align with the center point of the chip. The telescopic end of the fifth electric push rod 703 is fixedly connected to the support slide 602, and the fifth electric push rod 703 is electrically connected to the control panel. Through the positioning of the sliding bracket 301, the adsorption cylinder 604 is quickly assisted to align with the center point of the chip, thereby ensuring the accuracy of the chip fixing position.

[0039] When the operator uses the present device to perform bonding processing on a flexible circuit board (to be replaced by a circuit board later) and a semiconductor chip (to be replaced by a chip later), the robotic arm places the stored circuit board and chip to be processed from the left side of the extrusion plate 10 between the placement seat 2 and the two clamping plates 4 on the support slider 3. The chip is slightly adhered to the circuit board by a temporary adhesive. The rear side of the circuit board placed on the placement seat 2 contacts the clamping plate 4 on the rear side, and the right side of the circuit board contacts the sliding bracket 301. At this point, the placement of the circuit board and the chip is completed. Then the operator starts the first electric push rod 9 through the control panel, and the telescopic end of the first electric push rod 9 is retracted. The telescopic end of the first electric push rod 9 drives the two clamping plates 4 to move downward through the extrusion plate 10 and the tension spring. The two clamping plates 4 clamp and fix the front and rear sides of the circuit board, and complete the positioning of the edge of the circuit board through the sliding bracket 301. After the two clamping plates 4 complete the clamping of the front and rear sides of the circuit board, the first electric push rod 9 stops, and the telescopic end of the first electric push rod 9 stops driving the extrusion plate 10 to move.

[0040] During the downward movement of the two clamping plates 4, the front clamping plate 4 drives the first elastic telescopic rod 5 to move downward. If the telescopic end of the first elastic telescopic rod 5 does not contact the extruded circuit board, it means that the front clamping plate 4 cannot clamp the front edge of the circuit board. The telescopic end of the first elastic telescopic rod 5 is finally inserted into the blind hole of the supporting slider 3. At this time, the operator checks the placement of the circuit board and controls the telescopic end of the first electric push rod 9 through the control panel to drive the two clamping plates 4 to move upward and reset through the extrusion plate 10 and the tension spring. After readjusting the placement position of the circuit board, the above-mentioned circuit board fixing operation is repeated. When the telescopic end of the first elastic telescopic rod 5 contacts the extruded circuit board during the movement, the telescopic end of the first elastic telescopic rod 5 is retracted, and the hydraulic oil in the first elastic telescopic rod 5 flows into the connecting pipe 6. When the two clamping plates 4 complete the fixation of the front and rear sides of the circuit board, the telescopic end of the first elastic telescopic rod 5 is completely retracted into the front clamping plate 4, and the front clamping plate 4 is in full contact with the circuit board. The circuit board is clamped by the two clamping plates 4, so that the circuit board becomes flat in the left and right directions. At the same time, the telescopic end connected to the hydraulic cylinder 7 drives the limit plate 8 to move to the right to the extreme position, and the limit plate 8 is just moved out of the groove of the support slider 3. The limit of the support slider 3 is released, and the support slider 3 clamps the front side of the circuit board and moves forward under the tension of the tension spring connected to it, stretching the circuit board in the front and rear directions, thereby flattening the circuit board in the front and rear directions, and restoring the flat state of the flexible circuit board, thereby ensuring the stability of the device for fixing the flexible circuit board and the accuracy of subsequent processing.

[0041] During the downward movement of the two clamping plates 4, the front clamping plate 4 drives the telescopic end of the third hydraulic cylinder 401 to move downward, and the telescopic end of the third hydraulic cylinder 401 is retracted. The hydraulic oil in the third hydraulic cylinder 401 flows into the two sliding shells 204 through the third liquid guide tube 402, and the two moving rods 205 drive the parts connected thereto to move downward, and finally make the two extrusion rods 206 contact with the upper side of the circuit board for extruding and aligning the chip. The circuit board is clamped and positioned by the two clamping plates 4 to achieve the purpose of detecting the thickness of the circuit board, so that the extrusion rod 206 can align the position of the chip by moving and extruding. When the extrusion plate 10 stops, the control panel starts the second electric push rod 203, and the telescopic end of the second electric push rod 203 drives the sliding frame 201 and the parts connected thereto to move to the left by the length of a chip, and then the second electric push rod 203 stops.

[0042] During the movement of the sliding frame 201 to the left, the sliding frame 201 drives the second elastic telescopic rod 302 to move synchronously, the telescopic end of the second elastic telescopic rod 302 contacts and squeezes the sliding frame 301, the telescopic end of the second elastic telescopic rod 302 is retracted, the hydraulic oil on the right side of the second elastic telescopic rod 302 flows into the first hydraulic cylinder 304 through the first liquid guide pipe 303, the hydraulic oil on the left side of the second hydraulic cylinder 305 flows into the left side of the second elastic telescopic rod 302 through the second liquid guide pipe 306, the telescopic end of the first hydraulic cylinder 304 drives the left sliding shell 204 and the parts connected to it to move to the right, the telescopic end of the second hydraulic cylinder 305 drives the right sliding shell 204 and the parts connected to it to move to the left, and the sliding shell 204 drives the connected parts to move to the left. During the movement relative to the support plate 202, if the position of the chip has not changed, the two extrusion rods 206 contact the chip at the same time. If the position of the chip on the circuit board shifts during the circuit board fixing process, the extrusion rod 206 on one side contacts the chip first. Taking the extrusion rod 206 on the right side as an example, the extrusion rod 206 contacts the right side of the extrusion chip, and the extrusion rod 206 moves to the right relative to the moving rod 205. When the through hole on the extrusion rod 206 is aligned with the limit block 207, the limit block 207 moves downward under the tension of the tension spring connected to it and is inserted into the through hole of the extrusion rod 206. The extrusion rod 206 is limited and fixed relative to the moving rod 205. As the sliding shell 204 moves, the extrusion rod 206 squeezes and pushes the chip to move to the set position.

[0043] When the limit block 207 limits the extrusion rod 206, the limit bending rod 405 loses contact with the moving rod 205, and the telescopic end of the third elastic telescopic rod 403 drives the connecting plate 404 and the limit bending rod 405 to move backward, and the connecting plate 404 contacts the front side of the extruded circuit board. The two connecting plates 404 and the two extrusion rods 206 work together to accurately move the electrical chip to the set position relative to the circuit board. When the sliding frame 201 moves a chip length and then stops, the two extrusion rods 206 are both limited, and the two sliding shells 204 are both moved to the extreme position. The telescopic end of the second hydraulic cylinder 305 drives the right sliding shell 204 to move a chip length, and the first hydraulic cylinder 304 drives the left sliding shell 204 to move two chip lengths. At this point, the chip is moved and positioned to the set position on the circuit board, avoiding unstable connection between the circuit board and the chip, resulting in misalignment of the chip and the circuit board during movement, affecting the accurate positioning of the bonding point during subsequent bonding of the device, and reducing the quality of the bonding processing of the chip and the circuit board by the device.

[0044] When the telescopic end of the second hydraulic cylinder 305 is retracted and drives the right sliding shell 204 to move to the left, the hydraulic oil in the fourth hydraulic cylinder 701 flows into the right side of the second hydraulic cylinder 305 through the guide pipe 702, and the telescopic end of the fourth hydraulic cylinder 701 extends to drive the mounting slide 601 and the parts connected to it to move to the left, so that the axis of the mounting slide 601 is aligned with the center point of the positioned chip. When the second electric push rod 203 stops, the control panel starts the fifth electric push rod 703, and the telescopic end of the fifth electric push rod 703 drives the supporting slide 602 and the parts connected to it to move forward a set distance. When the axis of the adsorption cylinder 604 is aligned with the center point of the chip, the fifth electric push rod 703 stops, and then the control panel starts the fourth electric push rod 607. After the telescopic end of the fourth electric push rod 607 squeezes and drives the connecting shell 603 and the parts on its lower side to move downward a fixed distance, the fourth electric push rod 607 stops.

[0045] When the connecting shell 603 moves downward, the rubber ring on the lower side of the adsorption cylinder 604 contacts the chip and stops moving. As the connecting shell 603 moves downward, the spring in the connecting shell 603 is compressed, and the exhaust pipe 606 moves upward in the connecting shell 603. The connecting shell 603 contacts and squeezes the sliding bent plate 609 and moves downward. The through hole of the adsorption cylinder 604 is blocked. Then, when the exhaust pipe 606 moves to the step surface of the side wall of the connecting shell 603, the blockage of the exhaust pipe 606 is released, and the piston rod 605 moves upward under the tension of the tension spring connected to it. The gas on the upper side of the piston rod 605 in the adsorption cylinder 604 enters the connecting shell 603 through the exhaust pipe 606. The adsorption cylinder 604 adsorbs the chip through the rubber ring, and at the same time cooperates with the elastic force of the spring on the upper side of the adsorption cylinder 604 to complete the stable fixation of the bonding position of the chip on the circuit board, so that the chip and the circuit board are relatively fixed in the subsequent bonding process of the device, ensuring the rapidity and accuracy of the device in positioning the bonding point.

[0046] When the fourth electric push rod 607 stops, the control panel starts the third electric push rod 501, the telescopic end of the third electric push rod 501 is retracted and drives the supporting slide plate 602 to move backward, the inclined surface of the supporting slide plate 602 contacts and squeezes the right sliding shell 204, the sliding shell 204 moves upward, and then the supporting slide plate 602 drives the supporting plate 202 to move backward through the sliding shell 204, the supporting plate 202 compresses the spring connected to it, the right connecting plate 404 and the squeezing rod 206 move upward, and then the two sliding shells 204 drive the connected parts to move backward, leaving enough space on the front side and left and right sides of the chip, and the fuselage 1 performs bonding processing on the three surfaces of the circuit board of the chip. When the three surfaces of the chip are processed, the control panel controls the telescopic end of the fourth electric push rod 607 to be retracted.

[0047] During the process of retracting the telescopic end of the fourth electric push rod 607, the telescopic end of the fourth electric push rod 607 loses contact with the connecting shell 603, and the connecting shell 603 moves upward under the elastic force of the spring inside it. When the relative positions of the connecting shell 603 and the adsorption cylinder 604 return to the initial state, as the telescopic end of the fourth electric push rod 607 is retracted, the telescopic end of the fourth electric push rod 607 drives the sliding bent plate 609 to move upward through the elastic rope 608, the through hole of the adsorption cylinder 604 opens, and the outside air enters the adsorption cylinder 604, the adsorption cylinder 604 releases the adsorption of the chip, and then the telescopic end of the fourth electric push rod 607 is retracted. The end contacts and drives the connecting shell 603 to move upward to restore to the initial position, the connecting shell 603 drives the adsorption cylinder 604 to move synchronously to restore to the initial position, the rubber ring on the lower side of the adsorption cylinder 604 loses contact with the chip, the piston rod 605 contacts and squeezes the supporting slide plate 602, the piston rod 605 moves downward in the adsorption cylinder 604 and stretches the connected tension spring, the gas in the connecting shell 603 enters the upper side of the piston rod 605 in the adsorption cylinder 604 through the one-way valve, and finally the telescopic end of the fifth electric push rod 703 drives the supporting slide plate 602 and related parts to restore to the initial position, and the fuselage 1 performs bonding processing on the back side of the chip with the circuit board.

[0048] When the bonding of the chip in four directions is completed, the control panel controls the telescopic end of the third electric push rod 501 to drive the fixed inclined block 502 to restore the initial position. The support plate 202 drives the connected parts to move forward and reset under the elastic force of the connected spring. When the fixed inclined block 502 loses contact with the right sliding shell 204, the right sliding shell 204 drives the parts connected to it to move downward and restore the initial position, and then starts the first electric push rod 9. The telescopic end of the first electric push rod 9 drives the two clamping plates 4 to move upward through the extrusion plate 10 and the tension spring to release the clamping of the circuit board. During the upward movement of the front clamping plate 4, the fixed bent plate 503 is contacted and extruded. The front clamping plate 4 drives the supporting slider 3 to move backward, and the supporting slider 3 restores the initial position. The supporting slider 3 stretches the tension spring connected to it, and the hydraulic oil in the connecting tube 6 and the third liquid guide tube 402 performs the above-mentioned reverse flow. The limit plate 8 is reinserted into the groove of the supporting slider 3, and the supporting slider 3 restores the limited state. The telescopic end of the first elastic telescopic rod 5 extends out, and the two moving rods 205 move upward and reset.

[0049] When the telescopic end of the first electric push rod 9 returns to its initial position, the first electric push rod 9 stops, the second electric push rod 203 starts, the telescopic end of the second electric push rod 203 is retracted, and then the second electric push rod 203 stops, the sliding frame 201 drives the connected parts to reset, the telescopic end of the sliding bracket 301 extends, and the hydraulic oil in the first liquid guide tube 303, the second liquid guide tube 306 and the guide tube 702 flows in the above-mentioned reverse direction, and the related parts perform the above-mentioned reverse movement to restore the initial position. Taking the right extrusion rod 206 as an example, during the reset process of the extrusion rod 206 moving to the right, the extrusion rod 206 contacts the extrusion support plate 202, and the extrusion The edge of the through hole of the pressure rod 206 squeezes the limit block 207, and the limit block 207 moves upward to reset and stretch the connected tension spring. The inclined surface of the limit bending rod 405 squeezes the moving rod 205, and the limit bending rod 405 drives the telescopic end of the third elastic telescopic rod 403 to extend, and the limit bending rod 405 returns to the squeezed state with the moving rod 205. Finally, the operator takes away the processed circuit board and chip, and a bonding process is completed. The next circuit board and chip are repeated with the above placement and processing operations to achieve the purpose of bonding the chip and circuit board. When the use of this device is completed, the power supply is disconnected and wait for the next use.

[0050] Example 2: During the bonding process of a circuit board and a chip, if the chip is fixed on the circuit board by adsorption, when the bonding is completed, the adsorption of the chip is released and quickly removed. If the speed of releasing the adsorption of the parts that adsorb and fix the chip is too slow, the chip may be driven away from the surface of the circuit board, and the metal wires connecting the chip and the circuit board may be disconnected, causing damage to the circuit board and the chip, making the electrical connection between the circuit board and the chip unstable or completely disconnected, affecting the signal transmission between the chip and the circuit board.

[0051] Based on Example 1, Fig.10 and Fig.11As shown, it also includes an anti-pull mechanism, which is arranged on the connecting shell 603. The anti-pull mechanism is used to assist the adsorption cylinder 604 in releasing the adsorption of the chip. The anti-pull mechanism includes a cylinder 801, which is fixedly connected to the connecting shell 603. The cylinder 801 is located on the left side of the fourth electric push rod 607. The telescopic end of the cylinder 801 is fixedly connected to the telescopic end of the fourth electric push rod 607, which is used to retract the telescopic end of the cylinder 801 when the telescopic end of the fourth electric push rod 607 loses contact and extrusion with the connecting shell 603. The upper side of the fixed part of the cylinder 801 is connected to An air guide tube 802 is connected to the lower part of the adsorption cylinder 604, an auxiliary pressure rod 803 is slidably connected inside the adsorption cylinder 604, a tension spring is fixed between the auxiliary pressure rod 803 and the adsorption cylinder 604, an elastic block is arranged on the lower side of the auxiliary pressure rod 803, the chip is delayed fixed by the auxiliary pressure rod 803 and the air cylinder 801 is used to inject air into the adsorption cylinder 604, thereby ensuring the timely release of the adsorption effect of the adsorption cylinder 604 on the chip, ensuring the stability of the chip's own position when the chip is released, and improving the safety of the electrical connection after the chip and the circuit board are bonded.

[0052] Repeat the above-mentioned fixing and positioning operations of the circuit board and the chip. When the rubber ring on the lower side of the adsorption cylinder 604 contacts the surface of the chip, the lower side of the auxiliary pressure rod 803 in the adsorption cylinder 604 contacts the chip first, and the auxiliary pressure rod 803 moves into the adsorption cylinder 604 and stretches the connected spring. Then, the rubber ring on the lower side of the adsorption cylinder 604 contacts the surface of the chip. Then, repeat the above-mentioned fixing and bonding operations. When the three sides of the chip are bonded to the circuit board, the fourth electric push rod 607 is started, and the telescopic end of the fourth electric push rod 607 is retracted and reset. The above operations are repeated on related parts. When the telescopic end of the fourth electric push rod 607 drives the sliding bent plate 609 to move upward through the elastic rope 608, the through hole on the adsorption cylinder 604 is opened, and the adsorption cylinder 604 is gradually released. The chip is adsorbed, and at the same time, the telescopic end of the fourth electric push rod 607 drives the telescopic end of the cylinder 801 to retract, and the gas in the cylinder 801 is injected into the lower part of the adsorption tube 604 through the air guide tube 802, which quickly releases the adsorption state of the adsorption tube 604 on the chip. When the telescopic end of the cylinder 801 is retracted to the limit position, the telescopic end of the fourth electric push rod 607 drives the connecting shell 603 to move upward through the cylinder 801 to restore the initial position, and the connecting shell 603 drives the adsorption tube 604 to perform the above-mentioned reset operation, and injects gas into the adsorption tube 604 through the cylinder 801 to prevent the adsorption tube 604 from still having adsorption force on the chip when it moves upward, causing the chip to be driven, resulting in the metal wire electrically connecting the chip and the circuit board to be disconnected or deformed, affecting the signal transmission between the chip and the circuit board.

[0053] During the process of the connecting shell 603 driving the adsorption cylinder 604 to move upward and reset, when the rubber ring on the lower side of the adsorption cylinder 604 loses contact with the chip, the auxiliary pressure rod 803 still maintains the pressing and fixing of the chip through the tension of the connected tension spring, further ensuring the safety and stability of the connection between the chip and the circuit board. Afterwards, the auxiliary pressure rod 803 is driven by the adsorption cylinder 604 to separate from the chip and reset, and the above operation is repeated. When the use of this device is completed, disconnect the power supply and wait for the next use.

[0054] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A chip processing bonding machine with a positioning function, comprising a body (1), a placement seat (2) fixedly connected to the body (1), characterized in that: The invention also comprises a support slider (3), wherein the support slider (3) is slidably connected to the placement seat (2), a tension spring is fixedly connected between the placement seat (2) and the support slider (3), the placement seat (2) and the support slider (3) are both slidably connected to a clamping plate (4), a first elastic telescopic rod (5) is fixedly connected to the clamping plate (4) on one side, the telescopic end of the first elastic telescopic rod (5) penetrates the adjacent clamping plate (4), the first elastic telescopic rod (5) is connected to a connecting pipe (6), a connecting hydraulic cylinder (7) connected to the connecting pipe (6) is fixedly connected to one side of the placement seat (2), and the support slider (3) is close to the connecting hydraulic cylinder (7). A groove and a blind hole are provided on one side of the pressure cylinder (7); the blind hole on the support slider (3) is used to be inserted by the telescopic end of the first elastic telescopic rod (5); the telescopic end of the connecting hydraulic cylinder (7) is fixedly connected to a limit plate (8) that cooperates with the groove of the support slider (3); a first electric push rod (9) is fixedly connected to the machine body (1); the telescopic end of the first electric push rod (9) is fixedly connected to an extrusion plate (10); tension springs are provided between the extrusion plate (10) and the mirror-image clamping plate (4); a positioning mechanism for locating the chip position is provided on the machine body (1); and a fixing mechanism for fixing the position of the chip and the circuit board is provided on the machine body (1).

2. A chip processing bonding machine with positioning function according to claim 1, characterized in that: The positioning mechanism comprises a sliding frame (201), the sliding frame (201) is slidably connected to the body (1), a support plate (202) is slidably connected to the upper side of the sliding frame (201), a spring is fixedly connected between the support plate (202) and the sliding frame (201), a second electric push rod (203) is fixedly connected to the side of the body (1) close to the sliding frame (201), the telescopic end of the second electric push rod (203) is fixedly connected to the sliding frame (201), a mirror image sliding shell (204) is slidably connected to the support plate (202), a moving rod (205) is slidably connected inside the sliding shell (204), and the lower side of the moving rod (205) is fixedly connected to the sliding frame (201). A sliding connection is provided with an extrusion rod (206) which is extruded and matched with the support plate (202), and a through hole is provided on the extrusion rod (206). A limit block (207) which is limited and matched with the through hole on the adjacent extrusion rod (206) is slidably connected on the moving rod (205), and a tension spring is fixedly connected between the limit block (207) and the adjacent moving rod (205). An adjustment component for adjusting the fixed position of the chip is provided on the side of the placement seat (2) close to the sliding frame (201), an auxiliary positioning component for assisting in positioning the chip position is provided on the placement seat (2), and a reset component for moving the support plate (202) is provided on the sliding frame (201).

3. A chip processing bonding machine with positioning function according to claim 2, characterized in that: The adjustment component comprises a sliding bracket (301), the sliding bracket (301) is slidably connected to a side of the placement seat (2) close to the sliding bracket (201), a second elastic telescopic rod (302) is fixedly connected inside the sliding bracket (201), the telescopic end of the second elastic telescopic rod (302) is extruded and matched with the sliding bracket (301), a side of the second elastic telescopic rod (302) away from the sliding bracket (301) is connected to a first liquid guide tube (303), and a first hydraulic cylinder (304) and a second hydraulic cylinder (305) are fixedly connected to the support plate (202). The first hydraulic cylinder (304) is connected to the first liquid guide tube (303), and the telescopic end of the first hydraulic cylinder (304) is fixedly connected to the sliding shell (204) on the side away from the sliding frame (201). The second hydraulic cylinder (305) is connected to a second liquid guide tube (306) on the side away from the sliding frame (201) and connected to the second elastic telescopic rod (302) on the side close to the sliding bracket (301). The telescopic end of the second hydraulic cylinder (305) is connected to the sliding shell (204) on the side close to the sliding frame (201) in a limited sliding manner through a connecting bend.

4. A chip processing bonding machine with positioning function according to claim 3, characterized in that: The difference between the inner cross-sectional area of ​​the first hydraulic cylinder (304) and the cross-sectional area of ​​its telescopic end is half the inner cross-sectional area of ​​the second elastic telescopic rod (302), so as to enable the sliding shell (204) on the side away from the sliding frame (201) to accurately locate the chip position.

5. The bonding machine with positioning function for chip processing according to claim 3, characterized in that: The auxiliary positioning assembly comprises a third hydraulic cylinder (401), the third hydraulic cylinder (401) is fixedly connected to one side of the placement seat (2), the telescopic end of the third hydraulic cylinder (401) is fixedly connected to the clamping plate (4) on the supporting sliding block (3), the third hydraulic cylinder (401) is connected to a third liquid guide tube (402), the mirror image sliding shell (204) is commonly connected to the third liquid guide tube (402), the mirror image extrusion rod (206) is fixedly connected to a third elastic telescopic rod (403), the telescopic end of the third elastic telescopic rod (403) is fixedly connected to a connecting plate (404), the connecting plate (404) is fixedly connected to a limiting bent rod (405) on one side close to the adjacent limiting block (207), and the limiting bent rod (405) slides with the adjacent moving rod (205) in a limited manner.

6. A chip processing bonding machine with positioning function according to claim 5, characterized in that: The reset assembly includes a third electric push rod (501), the third electric push rod (501) is fixedly connected to the upper side of the sliding frame (201), the telescopic end of the third electric push rod (501) is fixedly connected to a fixed inclined block (502) that is squeezed and matched with the adjacent sliding shell (204), and the side of the placement seat (2) close to the first electric push rod (9) is fixedly connected to a fixed bent plate (503) that is squeezed and matched with the adjacent clamping plate (4).

7. A chip processing bonding machine with positioning function according to claim 6, characterized in that: The fixed inclined block (502) is provided with an inclined surface on one side close to the adjacent sliding shell (204), and the width of the inclined surface in the vertical direction is greater than the thickness of the chip, so as to facilitate the movement of the connecting plate (404).

8. The bonding machine with positioning function for chip processing according to claim 3, characterized in that: The fixing mechanism comprises a mounting slide plate (601), wherein the mounting slide plate (601) is slidably connected to the fuselage (1), a supporting slide plate (602) is slidably connected inside the mounting slide plate (601), and the supporting slide plate (602) is slidably connected to a connecting shell (603), a friction force is provided between the supporting slide plate (602) and the connecting shell (603), an adsorption cylinder (604) is slidably connected to the lower side of the connecting shell (603), a spring is fixedly connected between the connecting shell (603) and the adsorption cylinder (604), a piston rod (605) penetrating the connecting shell (603) is slidably connected inside the adsorption cylinder (604), a tension spring is fixedly connected between the adsorption cylinder (604) and the piston rod (605), the piston rod (605) is extruded and matched with the supporting slide plate (602), a rubber ring is provided on the lower side of the adsorption cylinder (604), and a spring is fixedly connected between the connecting shell (603) and the adsorption cylinder (604). A one-way valve is provided on the side, the inner wall surface of the connecting shell (603) is set as a step surface, the upper side of the adsorption cylinder (604) is connected to an exhaust pipe (606) that is sealed with the connecting shell (603), the supporting slide plate (602) is fixedly connected with a fourth electric push rod (607), the telescopic end of the fourth electric push rod (607) is pressed and matched with the connecting shell (603), and the telescopic end of the fourth electric push rod (607) is fixedly connected with a plug that penetrates the connecting shell (603). 3), the side wall of the adsorption cylinder (604) is provided with a through hole, the side wall of the adsorption cylinder (604) is slidably connected with a sliding bent plate (609) which cooperates with the through hole to seal the side wall, the sliding bent plate (609) is squeezed and matched with the connecting shell (603), the sliding bent plate (609) is fixedly connected to the elastic rope (608), and a moving component is provided on the fuselage (1) to assist the adsorption cylinder (604) in locating the center of the chip.

9. A chip processing bonding machine with positioning function according to claim 8, characterized in that: The moving component includes a fourth hydraulic cylinder (701), the fourth hydraulic cylinder (701) is fixedly connected to a side of the fuselage (1) close to the mounting slide (601), the fourth hydraulic cylinder (701) is connected to a guide tube (702) connected to a side of the second hydraulic cylinder (305) close to the sliding frame (201), the telescopic end of the fourth hydraulic cylinder (701) is fixedly connected to the mounting slide (601), a fifth electric push rod (703) is fixedly connected to the mounting slide (601), and the telescopic end of the fifth electric push rod (703) is fixedly connected to the supporting slide (602).

10. A chip processing bonding machine with positioning function according to claim 8, characterized in that: It also includes an anti-pull mechanism, which is arranged on the connecting shell (603). The anti-pull mechanism is used to assist the adsorption cylinder (604) in releasing the adsorption of the chip. The anti-pull mechanism includes a cylinder (801), which is fixed to the connecting shell (603). The telescopic end of the cylinder (801) is fixed to the telescopic end of the fourth electric push rod (607). The cylinder (801) is connected to an air guide tube (802) connected to the lower part of the adsorption cylinder (604). An auxiliary pressure rod (803) is slidably connected inside the adsorption cylinder (604). A tension spring is fixed between the auxiliary pressure rod (803) and the adsorption cylinder (604). An elastic block is arranged on the lower side of the auxiliary pressure rod (803).

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