A debonding device for semiconductor wafers

Abstract

The present invention relates to the field of wafer degumming, and discloses a degumming device for semiconductor wafers, including a degumming frame and a cover plate. A heating medium and a temperature sensor are arranged inside the degumming frame. The top of the degumming frame is hinged with a cover plate through a hinge. A handle is installed on the cover plate. A rotating degumming structure is arranged inside the degumming frame. By placing the wafers on each placement plate inside the degumming frame, the wafers can be directly rotated. By utilizing the rotation of the side surfaces of the wafers in close contact with the degumming thin sheets, the degumming work of multiple wafers can be carried out simultaneously. The structure is simpler, the manufacturing cost is lower, and it is also convenient for placing or taking out the wafers inside the degumming frame. At the same time, under the action of the first extrusion structure, when the wafers rotate, the first clamping structure can be automatically driven to clamp and fix the wafers inside the placement plate, making the degumming smoother.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer degumming, and particularly relates to a degumming device for semiconductor wafers. Background Art

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystalline silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer. When degumming between the wafer and the socket, a degumming device is required;

[0003] In the prior art, the degumming device for semiconductor wafers uses an integral automatic degumming structure to degum and separate large-sized wafers and sockets, ensuring the high-quality preparation of large-sized wafers;

[0004] In the prior art degumming device, when degumming each wafer, for each wafer degumming, a corresponding number of jaws need to be coordinated for each wafer, which increases the manufacturing cost of the device. And the jaws are arranged above the wafer, making it inconvenient to take out or put in the wafer in this device. Therefore, there are areas for improvement. Summary of the Invention

[0005] In order to solve the problems raised in the above background art, the present invention provides a degumming device for semiconductor wafers.

[0006] The degumming device for semiconductor wafers provided by the present invention adopts the following technical solutions:

[0007] A degumming device for semiconductor wafers includes a degumming frame and a cover plate. A heating medium and a temperature sensor are arranged inside the degumming frame. The top end of the degumming frame is hinged with a cover plate through a hinge. A handle is installed on the cover plate. A rotating degumming structure is arranged inside the degumming frame;

[0008] The rotation degumming structure includes a plurality of fixed seats fixedly installed on the inner wall of the left side of the degumming frame. The plurality of fixed seats are connected by a first connecting bar. A guide rail groove is formed on the arc surface of the fixed seat away from the inner wall of the left side of the degumming frame. A first moving seat is slidably arranged in the guide rail groove. A placement plate is installed at the middle of the upper surface of the first moving seat. A placement groove is formed in the placement plate. First clamping structures are arranged on the front and rear side surfaces of the placement plate. Second connecting bars are connected to the front and rear side surfaces of each first moving seat. The plurality of first moving seats are connected by the second connecting bars. Third connecting bars are respectively connected to the ends of the second connecting bars away from the first moving seats at both ends. A turntable is connected to the top of each group of two third connecting bars. A rotating rod is fixedly connected to the front turntable. One end of the rotating rod is rotatably connected to the inner wall of the front side of the degumming frame. A motor is installed on the rear side surface of the degumming frame. One end of the output shaft of the motor is connected to the other turntable;

[0009] Degumming thin sheets are connected to the positions near the upper right of the front and rear inner walls of the degumming frame. Second clamping structures are arranged on the right inner wall of the degumming frame corresponding to the positions of each fixed seat. A collection box is installed on the lower inner wall of the degumming frame below the degumming thin sheets.

[0010] Preferably, the first clamping structure includes through holes formed on the front and rear side surfaces of the placement plate. U-shaped bars are connected to the front and rear side surfaces of the placement plate at the positions of the through holes. A first extrusion rod movably passes through the middle of the U-shaped bar. A clamping piece is connected to the end of the first extrusion rod inserted into the through hole. A fixed sleeve is fixedly sleeved on the first extrusion rod. A first spring is connected between the fixed sleeve and the U-shaped bar. A first extrusion structure is arranged between the first extrusion rod and the fixed seat.

[0011] Preferably, the first extrusion structure includes first extrusion bars arranged at the front and rear sides of each fixed seat. The end of the first extrusion bar away from the first extrusion rod is connected to the fixed seat. A first extrusion part with an inclined surface is arranged at the end of the first extrusion bar close to the first extrusion rod. An extrusion ball is connected to the bottom end of the first extrusion rod. Each first extrusion rod passes through between the two second connecting bars in each group.

[0012] Preferably, the second clamping structure includes guide rails installed on the right inner wall of the degumming frame at the position of each fixing seat. A second moving seat is slidably arranged in the guide rails. A second arc-shaped spring is connected between the second moving seat and the lower inner wall of the guide rails. A groove is formed on the side surface of the second moving seat away from the guide rails. A fixing rod is connected between the two end walls of the groove. Moving blocks are movably sleeved at both ends of the fixing rod. The side surface of the moving block is closely attached to the inner wall of the groove. A third spring is sleeved in the middle of the fixing rod. The two ends of the third spring in a compressed state are respectively connected to the two moving blocks. A second extrusion structure is arranged between the two moving blocks and the right inner wall of the degumming frame. Clamping blocks are arranged on the two moving blocks. A pulling structure is arranged between the second moving seat and the first moving seat.

[0013] Preferably, the second extrusion structure includes second extrusion rods connected to the mutually remote side surfaces of each group of two moving blocks. Second extrusion strips are connected to the front and rear sides of each guide rail on the right inner wall of the degumming frame. A second extrusion part with an arc-shaped surface is arranged at the upper end of the side surface of the second extrusion strip close to the guide rail. One end of the second extrusion rod is inserted into the position between the corresponding second extrusion strip and the guide rail. A driving structure is arranged between the clamping block and the second extrusion strip.

[0014] Preferably, the driving structure includes inserting blocks connected to the side surface of the clamping block close to the moving block. First slots for the inserting blocks to movably insert are formed on the end surfaces of the moving blocks. Inserting rods are connected to the mutually remote side surfaces of each group of two moving blocks. First arc-shaped grooves are formed at the upper ends of the mutually remote side surfaces of each group of two second extrusion strips. A communicating groove communicating with the bottom end of the first arc-shaped groove is formed on the second extrusion strip. A second arc-shaped groove communicating with the bottom end of the communicating groove is formed on the second extrusion strip. The groove wall of the second arc-shaped groove is 1.1 times the diameter of the first arc-shaped groove. One end of the inserting rod movably passes through the first arc-shaped groove.

[0015] Preferably, the pulling structure includes a first arc-shaped strip connected to the second moving seat near the bottom end. A first pulling strip is connected to the bottom end of the first arc-shaped strip. A second arc-shaped strip is connected to the right end of the first moving seat and passes through the guide rail groove. A second pulling strip extending above the first pulling strip is connected to one end of the second arc-shaped strip.

[0016] Preferably, a second slot for the collecting frame to movably pass through is formed at the lower right front of the degumming frame. An inserting plate is connected to the front end of the collecting frame. The inserting plate movably inserts into the second slot. A magnetic strip is fixedly embedded on the inner side surface of the inserting plate. The magnetic strip is adsorbed on the iron strip on the inner groove of the second slot. A pull ring is installed in the middle of the front surface of the inserting plate.

[0017] In summary, the present invention includes the following beneficial technical effects:

[0018] 1. The present invention is provided with a rotating degumming structure, degumming flakes, a first clamping structure, and a first pressing structure on the degumming frame. When the wafer is placed on each placement plate inside the degumming frame, the wafer can be directly rotated. By using the rotation of the side of the wafer against the degumming flakes, the degumming work of multiple wafers can be carried out simultaneously. The structure is simpler, the manufacturing cost is lower, and it is also convenient for placing or removing the wafers inside the degumming frame. At the same time, under the action of the first pressing structure, when the wafer rotates, it can automatically drive the first clamping structure to clamp and fix the wafer inside the placement plate, making the degumming smoother.

[0019] 2. The present invention is provided with a second clamping structure, a second pressing structure, a driving structure, and a pulling structure inside the degumming frame. When the wafer rotates, the second clamping structure can clamp the wafer to the material seat on the side of the wafer for degumming. After clamping, the second clamping structure can pull the material seat away from the center of the wafer in a square shape, so as to better carry out the degumming work and make the degumming smoother. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic structural diagram of a degumming device for semiconductor wafers in an embodiment of the present invention;

[0021] Figure 2 is a schematic structural diagram after the cover plate is disassembled in an embodiment of the present invention;

[0022] Figure 3 is a schematic structural diagram of the inside of the degumming frame in an embodiment of the present invention;

[0023] Figure 4 is a schematic structural diagram after the cover plate and the degumming frame are disassembled in an embodiment of the present invention;

[0024] Figure 5 is a schematic structural diagram at the fixed seat in an embodiment of the present invention;

[0025] Figure 6 is in an embodiment of the present invention Figure 5 The enlarged view of the structure at A;

[0026] Figure 7 is a schematic structural diagram of the second clamping structure in an embodiment of the present invention;

[0027] Figure 8 is a schematic structural diagram of the collection frame in an embodiment of the present invention.

[0028] Description of reference numerals: 1, degumming frame; 2, cover plate; 3, handle; 5, fixed seat; 6, first connecting bar; 7, guide rail groove; 8, first moving seat; 9, placing plate; 10, placing groove; 11, second connecting bar; 12, third connecting bar; 13, rotating rod; 14, turntable; 15, motor; 16, degumming sheet; 17, U-shaped bar; 18, first extrusion rod; 19, clamping piece; 20, through hole; 21, extrusion ball; 22, first extrusion strip; 23, first extrusion part; 24, guide rail; 25, second moving seat; 26, groove; 27, fixed rod; 28, moving block; 29, clamping block; 30, second extrusion rod; 31, inserting block; 32, first inserting slot; 33, inserting rod; 34, first arc-shaped groove; 35, second arc-shaped groove; 36, communicating groove; 37, second extrusion part; 38, second extrusion strip; 39, first arc-shaped strip; 40, first pulling strip; 41, second arc-shaped strip; 42, second pulling strip; 43, collecting frame; 44, inserting plate; 45, pull ring; 46, magnetic strip; 47, second inserting slot. Detailed implementation manners

[0029] The following further describes the present invention in detail in conjunction with the attached Figures 1-8 drawings.

[0030] An embodiment of the present invention discloses a degumming device for semiconductor wafers, including a degumming frame 1 and a cover plate 2. A heating medium and a temperature sensor are arranged in the degumming frame 1. The top end of the degumming frame 1 is hinged with the cover plate 2 through a hinge. A handle 3 is installed on the cover plate 2. A rotating degumming structure is arranged in the degumming frame 1;

[0031] The rotating degumming structure includes a plurality of fixed seats 5 fixedly installed on the left inner wall of the degumming frame 1. The plurality of fixed seats 5 are connected by a first connecting bar 6. A guide rail groove 7 is formed on the arc surface of the fixed seat 5 away from the left inner wall of the degumming frame 1. A first moving seat 8 is slidably arranged in the guide rail groove 7. A placing plate 9 is installed in the middle of the upper surface of the first moving seat 8. A placing groove 10 is formed in the placing plate 9. First clamping structures are arranged on the front and rear side surfaces of the placing plate 9. Second connecting bars 11 are connected to the front and rear side surfaces of each first moving seat 8. The plurality of first moving seats 8 are connected by the second connecting bars 11. Third connecting bars 12 are respectively connected to the ends of the second connecting bars 11 away from the first moving seats 8 at both ends. Turntables 14 are connected to the tops of each group of two third connecting bars 12. A rotating rod 13 is fixedly connected to the front turntable 14. One end of the rotating rod 13 is rotatably connected to the front inner wall of the degumming frame 1. A motor 15 is installed on the rear side surface of the degumming frame 1. One end of the output shaft of the motor 15 is connected to the other turntable 14;

[0032] On the inner walls of the front and rear sides of the degumming frame 1 near the upper right position, a degumming thin sheet 16 is connected. At the position corresponding to each fixing seat 5 on the right inner wall of the degumming frame 1, a second clamping structure is provided. A collection frame 43 is installed at the lower inner wall of the degumming frame 1 below the degumming thin sheet 16. Place the wafer to be degummed and the material seat as a whole into the placement groove 10 of the placement plate 9. The material seat is located directly above the placement plate 9. Close the cover plate 2. Through the temperature sensor, use the heating medium to heat the temperature inside the degumming frame 1 to the degumming temperature. Start the motor 15 to drive the first moving seat 8 and the wafer as a whole to rotate clockwise in the guide rail groove 7. Use the side of the wafer to tightly adhere to the degumming thin sheet 16 and rotate, then the wafer and the material seat can be separated to achieve the degumming work, and the degummed material seat falls into the collection frame 43 for collection;

[0033] At the lower right front of the degumming frame 1, a second slot 47 is opened for the collection frame 43 to pass through. A plug board 44 is connected to the front end of the collection frame 43. The plug board 44 is movably inserted into the second slot 47. A magnetic strip 46 is fixedly embedded on the inner side surface of the plug board 44. The magnetic strip 46 is adsorbed on the iron strip in the inner groove of the second slot 47. A pull ring 45 is installed in the middle of the front surface of the plug board 44. When it is necessary to clean the material seat collected in the collection frame 43, the collection frame 43 can be directly pulled out from the degumming frame 1, and then the collected material seat can be centrally processed.

[0034] See Figures 1-6 , the first clamping structure includes through holes 20 opened on the front and rear side surfaces of the placement plate 9. U-shaped strips 17 are connected to the front and rear side surfaces of the placement plate 9 at the positions of the through holes 20. A first extrusion rod 18 is movably passed through the middle of the U-shaped strip 17. A clamping piece 19 is connected to the end of the first extrusion rod 18 inserted into the through hole 20. A fixed sleeve is fixedly sleeved on the first extrusion rod 18. A first spring is connected between the fixed sleeve and the U-shaped strip 17. A first extrusion structure is provided between the first extrusion rod 18 and the fixing seat 5;

[0035] The first extrusion structure includes first extrusion strips 22 arranged on the front and rear sides of each fixing seat 5. The end of the first extrusion strip 22 far from the first extrusion rod 18 is connected to the fixing seat 5. The end of the first extrusion strip 22 close to the first extrusion rod 18 is provided with a first extrusion part 23 with an inclined surface. An extrusion ball 21 is connected to the bottom end of the first extrusion rod 18. Each first extrusion rod 18 passes through between two second connection strips 11 in each group. When the first moving seat 8 slides in the guide rail groove 7, it drives the extrusion ball 21 at the bottom end of the first extrusion rod 18 to slide on the first extrusion part 23 of the first extrusion strip 22. Using the push of the first extrusion strip 22 on the extrusion ball 21, the two clamping pieces 19 can be automatically driven to move towards each other, and the wafer is automatically clamped inside the placement plate 9, so that the wafer can smoothly carry out the degumming work.

[0036] SeeFigure 1 , Figure 6 and Figure 8 , the second clamping structure includes guide rails 24 installed at the positions of each fixed seat 5 on the right inner wall of the degumming frame 1. A second moving seat 25 is slidably arranged in the guide rails 24. An arc-shaped second spring is connected between the second moving seat 25 and the lower inner wall of the guide rails 24. A groove 26 is formed on the side of the second moving seat 25 away from the guide rails 24. A fixed rod 27 is connected between the two end walls of the groove 26. Moving blocks 28 are movably sleeved at both ends of the fixed rod 27. The side surfaces of the moving blocks 28 are in close contact with the inner wall of the groove 26. A third spring is sleeved in the middle of the fixed rod 27. The two ends of the compressed third spring are respectively connected to the two moving blocks 28. A second extrusion structure is arranged between the two moving blocks 28 and the right inner wall of the degumming frame 1. Clamping blocks 29 are arranged on the two moving blocks 28. A pulling structure is arranged between the second moving seat 25 and the first moving seat 8;

[0037] The second extrusion structure includes second extrusion rods 30 connected to the sides of each group of two moving blocks 28 away from each other. Second extrusion strips 38 are connected to the front and rear sides of each guide rail 24 on the right inner wall of the degumming frame 1. An arc-shaped second extrusion part 37 is arranged at the upper end of the side of the second extrusion strip 38 close to the guide rail 24. One end of the second extrusion rod 30 is inserted into the position between the corresponding second extrusion strip 38 and the guide rail 24. A driving structure is arranged between the clamping block 29 and the second extrusion strip 38. The guide rails 24 and the guide rail grooves 7 are concentrically arranged;

[0038] The driving structure includes insertion blocks 31 connected to the sides of the clamping blocks 29 close to the moving blocks 28. First slots 32 for the insertion blocks 31 to movably insert are formed on the end faces of the moving blocks 28. Insertion rods 33 are connected to the sides of each group of two moving blocks 28 away from each other. First arc-shaped grooves 34 are formed at the upper ends of the sides of each group of two second extrusion strips 38 away from each other. A communication groove 36 communicating with the bottom end of the first arc-shaped groove 34 is formed on the second extrusion strip 38. A second arc-shaped groove 35 communicating with the bottom end of the communication groove 36 is formed on the second extrusion strip 38. The groove wall of the second arc-shaped groove 35 is 1.1 times the diameter of the first arc-shaped groove 34. One end of the insertion rod 33 movably passes through the first arc-shaped groove 34;

[0039] The pulling structure includes a first arc-shaped bar 39 connected to the second moving seat 25 near the bottom end. A first pulling bar 40 is connected to the bottom end of the first arc-shaped bar 39. A second arc-shaped bar 41 passing through the guide rail groove 7 is connected to the right end of the first moving seat 8. One end of the second arc-shaped bar 41 is connected to a second pulling bar 42 extending above the first pulling bar 40. When the first moving seat 8 moves, it drives the second arc-shaped bar 41 and the second pulling bar 42 to rotate as a whole. When the second pulling bar 42 moves to the first pulling bar 40, as the first moving seat 8 continues to rotate, it can automatically pull the second moving seat 25 to slide on the guide rail 24. When the second moving seat 25 moves, the second pressing part 37 on the second pressing bar 38 presses the second pressing rod 30, pushing the clamping block 29 on the moving block 28 to move and clamp the material seat on the wafer. After clamping, as the second moving seat 25 continues to rotate, one end of the inserting rod 33 slides from the first arc-shaped groove 34 and the communicating groove 36 to the second arc-shaped groove 35. Through the clamping block 29, the material seat can be pulled to move away from the center of the wafer, making the debonding of the wafer more smooth.

[0040] The implementation principle of a debonding device for semiconductor wafers in an embodiment of the present invention is as follows: First, multiple groups of wafers to be debonded and the susceptor are respectively placed on the placement plate 9 in the debonding frame 1. The cover plate 2 is tightly covered on the debonding frame 1 by using the handle 3. Then, through the temperature sensor, the temperature in the debonding frame 1 is heated to the debonding temperature by using a heating medium. Next, the motor 15 is started to drive the first moving seat 8 and the whole wafers to slide in the guide rail groove 7 of the fixed seat 5. The side of the wafer is closely attached to the debonding thin sheet 16. When the first moving seat 8 slides, the extrusion ball 21 at the bottom of the first extrusion rod 18 slides on the first extrusion part 23 of the first extrusion strip 22. By the pushing of the first extrusion strip 22 on the extrusion ball 21, the two clamping pieces 19 can be automatically driven to move towards each other, and the wafers are automatically clamped in the placement plate 9, so that the rotation of the first moving seat 8 can drive the wafers to rotate. In this way, the debonding thin sheet 16 can smoothly perform the debonding work between the wafers and the susceptor. At the same time, when the first moving seat 8 rotates, it drives the second arc-shaped strip 41 and the second pulling strip 42 to rotate as a whole. When the second pulling strip 42 moves to the first pulling strip 40, with the continuous rotation of the first moving seat 8, the second moving seat 25 can be automatically pulled to slide on the guide rail 24. When the second moving seat 25 moves, the second extrusion part 37 on the second extrusion strip 38 squeezes the second extrusion rod 30, and the clamping block 29 on the moving block 28 is pushed to move to clamp the susceptor on the wafer. After clamping, with the continuous rotation of the second moving seat 25, one end of the insertion rod 33 slides from the first arc-shaped groove 34 and the communication groove 36 to the second arc-shaped groove 35, and the susceptor can be pulled by the clamping block 29 to move away from the center of the wafer, making the debonding of the wafer smoother. After debonding, the motor 15 drives the first moving seat 8 to rotate in the reverse direction. Under the reset action of the second spring on the second moving seat 25, the two clamping blocks 29 automatically release the debonded susceptor, and the susceptor falls into the collection frame 43 for collection. In this way, the debonding work of the wafers can be realized.

[0041] The above are all preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby. Therefore, all equivalent changes made according to the structure, shape, and principle of the present invention should be covered within the protection scope of the present invention.

Claims

1. A debonding device for semiconductor wafers, comprising a debonding frame and a cover plate, characterized in that: A heating medium and a temperature sensor are arranged in the degumming frame, a cover plate is hingedly connected to the top of the degumming frame through a hinge, a handle is installed on the cover plate, and a rotating degumming structure is arranged in the degumming frame; The rotating degumming structure includes a plurality of fixed seats fixedly mounted on the left inner wall of the degumming frame, the plurality of fixed seats are connected by a first connecting strip, a guide rail groove is provided on the arc surface of the fixed seat away from the left inner wall of the degumming frame, a first movable seat is slidably arranged in the guide rail groove, a placement plate is installed in the middle of the upper part of the first movable seat, a placement groove is provided in the placement plate, a first clamping structure is provided on both front and rear side surfaces of the placement plate, a second connecting strip is connected to both front and rear side surfaces of each of the first movable seats, a plurality of the first movable seats are connected by a second connecting strip, and a third connecting strip is respectively connected to one end of the second connecting strip at both ends away from the first movable seat The connecting strips, each group of two third connecting strips are connected to a turntable on the top, the front turntable is fixedly connected to a turn rod, one end of the turn rod is rotatably connected to the front inner wall of the degumming frame, a motor is installed on the rear side of the degumming frame, one end of the motor output shaft is connected to another turntable, the side of the wafer is pressed against the degumming sheet, and the first moving seat drives the squeezing ball at the bottom end of the first squeezing rod to slide on the first squeezing part of the first squeezing strip when sliding, and the first squeezing strip pushes the squeezing ball, which can automatically drive the two clamps to move in a direction close to each other, automatically clamp the wafer in the placement plate, so that the rotation of the first moving seat can drive the wafer to rotate; A degumming sheet is connected to the inner walls on both sides of the degumming frame near the upper right side, a second clamping structure is provided on the right inner wall of the degumming frame at the position corresponding to each fixing seat, and a collecting frame is installed on the lower inner wall of the degumming frame below the degumming sheet.

2. A debonding device for semiconductor wafers according to claim 1, characterized in that: The first clamping structure includes through holes opened on the front and rear side surfaces of the placement plate, and U-shaped bars are connected to the front and rear side surfaces of the placement plate at the positions of the through holes, and a first extrusion rod is movably passed through the middle of the U-shaped bar, and a clamp is connected to one end of the first extrusion rod inserted into the through hole, a fixed sleeve on the first extrusion rod is provided, a first spring is connected between the fixed sleeve and the U-shaped bar, and a first extrusion structure is arranged between the first extrusion rod and the fixed seat.

3. A debonding device for semiconductor wafers according to claim 2, characterized in that: The first extrusion structure includes first extrusion strips arranged at the front and rear sides of each fixing seat, one end of the first extrusion strip away from the first extrusion rod is connected to the fixing seat, the end of the first extrusion strip close to the first extrusion rod is provided with a first extrusion portion with an inclined surface, the bottom end of the first extrusion rod is connected to a squeezing ball, and each of the first extrusion rods passes between the two second connecting strips of each group.

4. The debonding device for semiconductor wafers according to claim 1, characterized in that: The cam is provided with a second spring which is arranged on the side wall of the second movable seat and the second movable seat is connected with the second movable seat and the second movable seat is connected with the second movable seat and the second movable seat.

5. The debonding device for semiconductor wafers according to claim 4, characterized in that: The second extrusion structure includes a second extrusion rod connected to a side surface of each group of two moving blocks away from each other, and the right inner wall of the degumming frame is connected to a second extrusion strip at the front and rear sides of each guide rail. A second extrusion portion with an arc-shaped surface is provided at the upper end of the second extrusion strip close to one side of the guide rail, and one end of the second extrusion rod is inserted into a position corresponding to the second extrusion strip and the guide rail, and a driving structure is provided between the clamping block and the second extrusion strip.

6. The debonding device for semiconductor wafers according to claim 5, characterized in that: The driving structure includes an insertion block connected to a side of the clamping block close to the moving block, a first slot for movably inserting the insertion block is provided on the end surface of the moving block, an insertion rod is connected to a side surface away from each other of each group of two moving blocks, a first arc groove is provided at the upper end of a side surface away from each other of two second extrusion strips in each group, a connecting groove connected to the bottom end of the first arc groove is provided on the second extrusion strip, a second arc groove connected to the bottom end of the connecting groove is provided on the second extrusion strip, the groove wall of the second arc groove is 1.1 times the groove diameter of the first arc groove, and one end of the insertion rod movably passes through the first arc groove.

7. The debonding device for semiconductor wafers according to claim 4, characterized in that: The pulling structure includes a first arc-shaped bar connected to the second movable seat near the bottom end, a first pull bar is connected to the bottom end of the first arc-shaped bar, a second arc-shaped bar passing through the guide rail groove is connected to the right end of the first movable seat, and one end of the second arc-shaped bar is connected to a second pull bar extending above the first pull bar.

8. The debonding device for semiconductor wafers according to claim 1, characterized in that: A second slot for the collection frame to movably pass through is opened at the lower right side of the front side of the degumming frame. A plug plate is connected to the front end of the collection frame. The plug plate is movably inserted into the second slot. A magnetic strip is fixedly embedded on the inner side of the plug plate. The magnetic strip is adsorbed on the iron bar on the inner groove of the second slot. A pull ring is installed in the middle of the front side of the plug plate.

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