Semiconductor wafer edge finding positioning device and method

Abstract

The invention discloses a semiconductor wafer edge finding and positioning device and method, and belongs to an edge finding and positioning device in the technical field of wafer positioning equipment.The technical scheme is that a cavity is formed in a shell, and the shell is used for installation of parts and containing and rotary positioning of crystal slides; the motor mounting frame is fixedly arranged below the shell; the rotating motor is vertically and fixedly arranged on the motor mounting frame, and a rotating shaft of the rotating motor penetrates through the shell and is rotationally arranged in the shell; the slide holder is horizontally arranged and is fixedly connected with the rotating end of the rotating motor, and a crystal slide arranged on the slide holder is arranged between the two transmitting ends; according to the semiconductor wafer edge finding and positioning device and method provided by the invention, the slide holder is arranged in the shell capable of realizing a vacuum environment, and the sensor transceiving assembly arranged outside the shell is used for acquiring the position information of the crystal slide rotating in the shell, so that the circle center positioning operation after edge finding and positioning is realized.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer positioning equipment, and in particular relates to a semiconductor wafer edge patrol positioning device and method. Background Art

[0002] The flat edge of the wafer is also called the positioning edge. Before processing or cutting, the direction of the positioning edge must be specified. This can help the subsequent process determine the placement of the wafer. For positioning, the crystal direction of the single crystal growth is also marked. It is convenient for subsequent cutting and testing. Moreover, the cutting position is at the edge, which is mostly an area that cannot be used.

[0003] Before the wafer is processed, such as single-chip operations such as coating and etching, it is stored in a material box and picked up and placed by a robot. Most existing wafers are circular in structure. After the wafer is cut, it is generally placed on a round placement rack. Since the structure of the wafer is relatively fragile and the wafer must not have scratches, etc., the wafer placement rack generally reserves enough space to prevent the wafer from being hit or scratched during the process of picking and placing. Before the subsequent processing of the wafer, the wafer needs to be pre-positioned, that is, to find the center of the wafer. Summary of the invention

[0004] The first object of the present invention is to provide a semiconductor wafer edge positioning device, by arranging a wafer stage in a shell that can provide a vacuum environment, placing a crystal glass slide that needs to be positioned on the wafer stage for rotation, and a sensor transceiver component arranged outside the shell to collect position information of the crystal glass slide rotating in the shell, thereby realizing the center positioning operation after edge positioning; The second purpose is to provide an edge-finding positioning method that performs positioning operations through an edge-finding positioning device, by positioning the position of the crystal glass slide that needs to be edge-finding positioned during the rotation process, and after the edge position is positioned, the position is adjusted in combination with the current coordinate position and coordinate deviation, thereby achieving accurate positioning operations.

[0005] The object of the present invention is achieved by providing a semiconductor wafer edge positioning device, comprising: A housing, wherein a cavity is provided inside the housing, and the housing is used for mounting components and accommodating and rotating and positioning a crystal glass slide; A motor mounting frame, the motor mounting frame is fixedly arranged below the housing; a rotating motor, the rotating motor being vertically fixedly arranged on the motor mounting frame, the rotating shaft of the rotating motor passing through the housing and being rotatably arranged in the housing, and A sensor transceiver assembly, wherein two transmitting ends provided in the sensor transceiver assembly are arranged opposite to each other in the cavity; The slide stage is horizontally arranged and fixedly connected to the rotating end of the rotating motor, and the crystal glass slide arranged on the slide stage is placed between the two emitting ends.

[0006] Furthermore, two side plates of the shell in the width direction are provided with passage openings.

[0007] Furthermore, both side panels of the shell in the length direction are provided with a first observation window, and the shell is provided with a second observation window at the top.

[0008] Furthermore, the rotating shaft of the rotating motor is connected with a magnetic fluid via a coupling, the upper end of the magnetic fluid is fixedly connected to the bottom of the shell, and the rotating end of the magnetic fluid is fixedly connected to the wafer stage.

[0009] Furthermore, the sensor transceiver assembly includes a first sensor and a second sensor vertically fixed on the shell, and the transmitting ends of the first sensor and the second sensor are arranged opposite to each other.

[0010] Furthermore, a light-transmitting mounting plate is arranged at positions opposite to the upper end surface and the lower end surface of the shell, the light-transmitting mounting plate is fixedly arranged on the shell, the light-transmitting mounting plate is provided with a light-transmitting area, and one side of the output end of the first sensor and the second sensor is fixedly mounted on the corresponding light-transmitting mounting plate.

[0011] Furthermore, the wafer carrier includes a circular body and a plurality of caps arranged on the circular body, the plurality of caps are evenly distributed in the circumferential direction of the circular body, and a silicone ball is arranged on the upper end of the cap.

[0012] A semiconductor wafer edge positioning method, using a semiconductor wafer edge positioning device, sealing and fixing a housing with an external device, comprising the following steps: S1, vacuum treatment is performed on the inside of the shell; S2, placing the crystal glass slide that needs to be edge-finding and positioning on the slide stage; S3, starting the sensor transceiver assembly and the rotating motor, placing the edge area of ​​the crystal glass slide between the sensor transceiver assembly and rotating it, and the sensor transceiver assembly measures the acquired position and obtains the current position; S4. Calculate the edge position data detected by the crystal slide, determine the center of the crystal slide, and move the crystal slide so that the crystal slide is placed at a corresponding position.

[0013] Furthermore, after calculating the data collected from the rotating crystal glass slide, the center coordinate data of the crystal glass slide is obtained, and the center coordinate data includes the coordinates x, y and the orientation angle θ on the horizontal plane.

[0014] Furthermore, the center coordinate data of the current crystal slide and the center coordinate data of the crystal slide calculated by measurement are calculated to obtain a first adjustment angle α and a second adjustment angle β and a translation distance L. The first adjustment angle α and the second adjustment angle β have a common reference edge, and the translation distance L is the distance between the vertex angle of the first adjustment angle α and the vertex angle of the second adjustment angle β.

[0015] The beneficial effects of the present invention are embodied in: 1. In the present invention, a shell capable of realizing internal vacuum operation is provided, and a motor mounting frame is provided under the shell to realize vertical installation of the rotating motor, and then the output end of the rotating motor is placed in the shell to provide rotational power, and a wafer stage is provided in the shell. The wafer stage is controlled by the power of the rotating motor and rotates in the shell, thereby accurately collecting positional data of the crystal slide that needs to be positioned, and after calculating the collected data, the position of the crystal slide is corrected, so that the center of the crystal slide can be accurately placed in the set position; the device has a simple and compact structure, and can conveniently and accurately locate the center of the crystal slide.

[0016] 2. In the present invention, the two side panels of the shell in the width direction are provided with channel openings; since the channel openings are provided on the side panels of the shell in the width direction, and the shell is connected with external components through the channel openings, the shell with a sealed connection can be evacuated under the action of external components, thereby realizing a vacuum environment in the shell, which is beneficial to the accuracy of positioning the crystal glass slide that needs to be emitted and received by the sensor.

[0017] 3. In the present invention, by respectively arranging the first observation window and the second observation window on the two side plates in the length direction of the shell, the operation of the crystal glass slide in a closed vacuum environment can be easily observed, thereby improving the convenience of experimental operation.

[0018] 4. In the present invention, since the output end of the rotating motor is provided with a magnetic fluid for rotational transmission, the rotational motion is transmitted to the sealed housing, which can enhance the sealing and stability of the rotational transmission in a vacuum environment.

[0019] 5. In the present invention, the first sensor and the second sensor in the sensor transceiver assembly are respectively arranged on the upper and lower sides of the shell relative to each other, and a light-transmitting mounting plate is arranged at the position of the transmitting end of the first sensor and the second sensor, so that the first sensor and the second sensor can pass through the interior of the shell to collect data on the position of the crystal glass slice placed therein. Such an arrangement greatly facilitates the position detection of the edge of the crystal glass slice.

[0020] 6. In the present invention, a silicone ball is provided on the cap on the upper end surface of the stage to achieve stable support for the placed crystal glass slide, and it can also ensure that the stage placed on the stage will not be shifted in position due to the action of centrifugal force during rotation, thereby improving the accuracy of position scanning and positioning of the crystal glass slide in a rotating manner.

[0021] 7. In the present invention, the edge position data of the crystal glass slice placed in the shell in a rotating state are scanned and collected in a vacuum environment, and the actual center position of the crystal glass slice is calculated. Specifically, the x, y and orientation angle θ of the currently placed crystal glass slice are first determined, so that the first adjustment angle α, the second adjustment angle β and the translation distance L can be calculated. Therefore, the position deflection of the second adjustment angle β can be performed after the deviation deflection of the first adjustment angle α and the translation distance L, thereby realizing the precise edge-finding and positioning operation of the crystal glass slice. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for the specific embodiments or the description of the prior art. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn according to the actual scale.

[0023] Figure 1 This is a schematic diagram of the overall structure of the edge-finding and positioning device of the present invention; Figure 2 This is a working principle diagram of the sensor transceiver assembly of the present invention; Figure 3 It is a schematic diagram of the structure of the wafer stage of the present invention; Figure 4 It is a schematic diagram of the wafer positioning process of the present invention.

[0024] In the accompanying drawings, 1-shell, 2-crystal glass slide, 3-motor mounting frame, 4-rotating motor, 5-sensor transceiver assembly, 6-cavity, 7-slide stage, 8-channel opening, 9-first observation window, 10-second observation window, 11-first sensor, 12-second sensor, 13-light-transmitting mounting plate, 14-light-transmitting area, 17-round body, 18-cap, 19-silicone ball, 20-coupling, 21-magnetic fluid. DETAILED DESCRIPTION

[0025] The following embodiments of the technical solution of the present invention are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and are therefore only used as examples, and cannot be used to limit the protection scope of the present invention. It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by those skilled in the art to which the present invention belongs.

[0026] A semiconductor wafer edge inspection and positioning device, comprising: A housing 1, wherein a cavity 6 is disposed inside the housing 1, and the housing 1 is used for mounting components and accommodating and rotating and positioning the crystal glass plate 2; A motor mounting frame 3, wherein the motor mounting frame 3 is fixedly arranged below the housing 1; a rotating motor 4, wherein the rotating motor 4 is vertically fixedly arranged on the motor mounting frame 3, and the rotating shaft of the rotating motor 4 passes through the housing 1 and is rotatably arranged in the housing 1, and A sensor transceiver assembly 5, wherein two transmitting ends provided in the sensor transceiver assembly 5 are arranged opposite to each other in the cavity 6; The slide stage 7 is horizontally arranged and fixedly connected to the rotating end of the rotating motor 4. The crystal glass slide 2 arranged on the slide stage 7 is placed between the two emitting ends.

[0027] It can be understood that by setting up a shell 1 that can realize internal vacuum operation, and setting a motor mounting frame 3 under the shell 1, after the rotating motor 4 is vertically installed, the output end of the rotating motor 4 is placed in the shell 1 to provide rotational power, and a slide stage 7 is set in the shell 1. The slide stage 7 is controlled by the power of the rotating motor 4 to perform a rotation operation in the shell 1; then, the crystal glass slide 2 that needs to be positioned is subjected to precise positional data collection, and after calculating the collected data, the position of the crystal glass slide 2 is corrected, so that the center of the crystal glass slide 2 can be accurately placed in the set position; the device has a simple and compact structure, and can conveniently and accurately realize the positioning of the center of the crystal glass slide 2.

[0028] As a preferred embodiment of the present invention, passage openings 8 are provided on two side plates of the housing 1 in the width direction.

[0029] The two side panels of the shell 1 in the width direction are provided with channel openings 8; since the channel openings 8 are provided on the side panels of the shell 1 in the width direction, and the shell 1 is connected with external components through the channel openings 8, the shell 1 with a sealed connection can be evacuated under the action of external components, thereby realizing a vacuum environment in the shell 1, which is beneficial to the accuracy of positioning the crystal glass slide 2 that needs to be emitted and received by the sensor.

[0030] Preferably, the two side panels of the shell 1 in the length direction are both provided with a first observation window 9, and the shell 1 is provided with a second observation window 10 at the top.

[0031] By respectively arranging the first observation window 9 and the second observation window 10 on the two side plates in the length direction of the housing 1, the operation of the crystal slide 2 in a closed vacuum environment can be easily observed, thereby improving the convenience of experimental operation.

[0032] Preferably, the rotating shaft of the rotating motor is connected with a magnetic fluid 21 via a coupling, the upper end of the magnetic fluid 21 is fixedly connected to the bottom of the shell, and the rotating end of the magnetic fluid 21 is fixedly connected to the wafer stage.

[0033] Since the output end of the rotating motor 4 is rotated and transported by setting a magnetic fluid, the rotational motion is transmitted to the sealed housing 1, which can enhance the sealing and stability of the rotational transmission in a vacuum environment.

[0034] Preferably, the sensor transceiver assembly 5 includes a first sensor 11 and a second sensor 12 vertically fixed on the housing 1 , and transmitting ends of the first sensor 11 and the second sensor 12 are arranged opposite to each other.

[0035] exist Figure 2 In the embodiment, the first sensor 11 and the second sensor 12 in the sensor transceiver assembly 5 are respectively arranged on the upper and lower sides of the shell 1, and a light-transmitting mounting plate 13 is arranged at the transmitting ends of the first sensor 11 and the second sensor 12, so that the first sensor 11 and the second sensor 12 can pass through the interior of the shell 1 to collect data on the position of the crystal glass plate 2 placed therein. With such an arrangement, the position detection of the edge of the crystal glass plate 2 is extremely convenient.

[0036] Preferably, a light-transmitting mounting plate 13 is provided at positions opposite to the upper end surface and the lower end surface of the shell 1, the light-transmitting mounting plate 13 is fixedly provided on the shell 1, the light-transmitting mounting plate 13 is provided with a light-transmitting area 14, and one side of the output end of the first sensor 11 and the second sensor 12 is fixedly installed on the corresponding light-transmitting mounting plate.

[0037] It can be understood that by respectively arranging the first sensor 11 and the second sensor 12 in the light-transmitting area 14 at relative positions on the upper and lower end surfaces of the shell 1, the sensors are placed outside the shell 1, so that the vacuum environment in the shell 1 can be better used for the rotation operation of the wafer.

[0038] As a preferred embodiment of this embodiment, the wafer carrier 7 includes a circular body 17 and a plurality of caps 18 arranged on the circular body 17. The plurality of caps 18 are evenly distributed in the circumferential direction of the circular body 17, and a silicone ball 19 is arranged on the upper end of the cap 18.

[0039] By arranging a silicone ball 19 on the cap 18 on the upper end surface of the slide stage 7, stable support for the placed crystal glass slide 2 can be achieved, and it can also be ensured that the slide stage 7 placed on the slide stage 7 will not be shifted in position due to the action of centrifugal force during rotation, thereby improving the accuracy of position scanning and positioning of the crystal glass slide 2 in a rotating manner.

[0040] A semiconductor wafer edge positioning method, using a semiconductor wafer edge positioning device, sealing and fixing a housing with an external device, comprising the following steps: S1, vacuum treatment is performed on the interior of the housing 1; S2, placing the crystal glass slide 2 to be edge-finding and positioning on the slide stage 7; S3, start the sensor transceiver assembly 5 and the rotating motor 4, place the edge area of ​​the crystal glass plate 2 between the sensor transceiver assembly 5 and rotate, the sensor transceiver assembly 5 measures the acquired position and obtains the current position; S4, calculating the edge position data detected by the crystal slide 2, determining the center of the crystal slide 2, and moving the crystal slide 2 so that the crystal slide 2 is placed at a corresponding position.

[0041] Preferably, after calculating the data collected from the rotating crystal slide, the center coordinate data of the crystal slide is obtained, and the center coordinate data includes coordinates x, y and a direction angle θ on a horizontal plane.

[0042] Preferably, the center coordinate data of the current crystal slide and the center coordinate data of the crystal slide calculated by measurement are calculated to obtain a first adjustment angle α and a second adjustment angle β and a translation distance L. The first adjustment angle α and the second adjustment angle β have a common reference edge, and the translation distance L is the distance between the vertex angle of the first adjustment angle α and the vertex angle of the second adjustment angle β.

[0043] It should be emphasized that, during the operation of adjusting the position of the wafer, it can be moved by a robot disposed in the vacuum chamber, and the robot extends into the channel opening 8 in the external device to adjust the position of the wafer.

[0044] Working principle and working process of the present invention: A semiconductor wafer edge positioning device provided by the present invention, when in use, is provided with a shell 1 capable of realizing internal vacuum operation, and a motor mounting frame 3 is provided under the shell 1, so that a rotating motor 4 is vertically installed, and then the output end of the rotating motor 4 is placed in the shell 1 to provide rotational power, and a wafer carrier 7 is provided in the shell 1, and the wafer carrier 7 is rotated in the shell 1 through the power control of the rotating motor 4, and then, the position data of the crystal glass slide 2 to be positioned is accurately collected, and after calculating the collected data, the position correction operation is performed on the crystal glass slide 2, so that the center of the crystal glass slide 2 can be accurately placed in the set position; the device has a simple and compact structure, and can conveniently and accurately realize the positioning of the center of the crystal glass slide 2.

[0045] Specifically, the steps include: S1, vacuum treatment is performed on the interior of the housing 1; S2, placing the crystal glass slide 2 to be edge-finding and positioning on the slide stage 7; S3, start the sensor transceiver assembly 5 and the rotating motor 4, place the edge area of ​​the crystal glass plate 2 between the sensor transceiver assembly 5 and rotate, the sensor transceiver assembly 5 measures the acquired position and obtains the current position; S4, calculating the edge position data detected by the crystal slide 2, determining the center of the crystal slide 2, and moving the crystal slide 2 so that the crystal slide 2 is placed at a corresponding position.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and specification of the present invention.

Claims

1. A semiconductor wafer edge positioning device, characterized in that: include: A housing (1), wherein a cavity (6) is provided inside the housing (1), and the housing (1) is used for mounting components and accommodating and rotating a crystal glass slide (2); A motor mounting frame (3), the motor mounting frame (3) being fixedly arranged below the housing (1); a rotating motor (4), the rotating motor (4) being vertically fixedly arranged on the motor mounting frame (3), the rotating shaft of the rotating motor (4) passing through the housing (1) and being rotatably arranged in the housing (1), and A sensor transceiver component (5), wherein two transmitting ends provided in the sensor transceiver component (5) are arranged opposite to each other in the cavity (6); A slide stage (7), the slide stage (7) is arranged horizontally and fixedly connected to the rotating end of the rotating motor (4), and the crystal glass slide (2) arranged on the slide stage (7) is placed between the two emission ends.

2. The semiconductor wafer edge positioning device according to claim 1, characterized in that: The two side plates of the housing (1) in the width direction are provided with passage openings (8).

3. The semiconductor wafer edge positioning device according to claim 1, characterized in that: Both side panels of the shell (1) in the length direction are provided with a first observation window (9), and the shell (1) is provided with a second observation window (10) at the top.

4. The semiconductor wafer edge positioning device according to claim 1, characterized in that: The rotating shaft of the rotating motor (4) is connected to a magnetic fluid (21) via a coupling (20); the upper end of the magnetic fluid (21) is fixedly connected to the bottom of the housing (1); and the rotating end of the magnetic fluid (21) is fixedly connected to the wafer stage (7).

5. The semiconductor wafer edge patrol positioning device according to claim 1, characterized in that: The sensor transceiver assembly (5) comprises a first sensor (11) and a second sensor (12) which are vertically fixed on the housing (1), and the transmitting ends of the first sensor (11) and the second sensor (12) are arranged opposite to each other.

6. The semiconductor wafer edge positioning device according to claim 5, characterized in that: A light-transmitting mounting plate (13) is arranged at positions opposite to the upper end surface and the lower end surface of the housing (1); the light-transmitting mounting plate (13) is fixedly arranged on the housing (1); the light-transmitting mounting plate (13) is provided with a light-transmitting area (14); and one side of the output ends of the first sensor (11) and the second sensor (12) is fixedly mounted on the corresponding light-transmitting mounting plate.

7. The semiconductor wafer edge patrol positioning device according to claim 1, characterized in that: The wafer carrier (7) comprises a circular body (17) and a plurality of caps (18) arranged on the circular body (17), wherein the plurality of caps (18) are evenly distributed in the circumferential direction of the circular body (17), and a silicone ball (19) is arranged at the upper end of the cap (18).

8. A semiconductor wafer edge positioning method, characterized in that: The semiconductor wafer edge patrol positioning device according to any one of claims 1 to 7 is used to seal and fix the housing to an external device, comprising the following steps: S1, subjecting the interior of the housing (1) to a vacuum treatment; S2, placing the crystal glass slide (2) to be edge-finding and positioning on the slide stage (7); S3, starting the sensor transceiver assembly (5) and the rotating motor (4), placing the edge area of ​​the crystal glass plate (2) between the sensor transceiver assembly (5) and rotating it, and the sensor transceiver assembly (5) measures the acquired position and obtains the current position; S4, calculating the edge position data detected by the crystal slide (2), determining the center of the crystal slide (2), and moving the crystal slide (2) so that the crystal slide (2) is placed at a corresponding position.

9. The semiconductor wafer edge positioning method according to claim 8, characterized in that: After calculating the data collected from the rotating crystal glass slide, the center coordinate data of the crystal glass slide is obtained, and the center coordinate data includes coordinates x, y and a direction angle θ on a horizontal plane.

10. The semiconductor wafer edge positioning method according to claim 9, characterized in that: The center coordinate data of the current crystal glass and the center coordinate data of the crystal glass calculated by measurement are calculated to obtain a first adjustment angle α and a second adjustment angle β and a translation distance L. The first adjustment angle α and the second adjustment angle β have a common reference edge, and the translation distance L is the distance between the vertex angle of the first adjustment angle α and the vertex angle of the second adjustment angle β.

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