A shock absorbing device for loading wafers

Abstract

The present invention discloses a shock absorbing device for loading wafers, in the field of semiconductor material technology, the device comprises: a loading arm body, two guide members and two support members; the two support members are respectively fixedly arranged on both sides of the loading part of the loading arm body; a first water flow channel is provided on the support member, and a second water flow channel connected to the first water flow channel is provided on the loading arm body near the support member; the second water flow channel is connected to the outside; the maximum height of the water inlet of the first water flow channel from the lifting part is less than the minimum height of the water outlet of the second water flow channel from the lifting part; wherein the wafer enters the support member after passing through the guide member. The present invention improves the wafer loading utilization rate of the loading arm by floating the wafer guide through the rebound force of the guide member; the first water flow channel and the second water flow channel drain water, and the reaction force of the drainage pressure increases the buoyancy effect on the wafer, thereby buffering and damping the wafer descent process, and improving the wafer production quality yield.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor materials, and in particular to a wafer loading shock absorbing device. Background Art

[0002] Wafer refers to the substrate silicon chip used to make silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. In the wafer production process, there is a process of grinding both sides of the wafer. There are many wafer grinding technologies. The commonly used grinding method in the modern semiconductor industry is chemical-mechanical polishing (CMP). Chemical mechanical polishing is used to flatten the etched surface of the wafer to nanometer-level smoothness, while taking into account various indicators such as the warpage and flatness of the silicon wafer, so as to avoid problems encountered in the microlithography and etching process of silicon wafers in high-end applications. Therefore, wafer grinding is an important part of semiconductor processing technology.

[0003] For wafer substrate processing, the wafer is transferred and loaded into the groove of the supporting arm. In the prior art, this process uses non-metallic materials to make the supporting groove. The non-metallic supporting groove collides and scratches with the wafer, causing scratches on the corners of the wafer, which affects the wafer yield at the process end and is very likely to affect the wafer quality. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a wafer loading shock absorbing device. The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0005] A first aspect of an embodiment of the present invention provides a wafer loading shock absorbing device, comprising: a loading arm body, two guide members and two support members;

[0006] The two support members are respectively fixedly arranged on both sides of the loading part of the loading arm body, and the two guide members are respectively located on one side of one end of the two support members close to the lifting part of the loading arm body;

[0007] The support member is provided with a first water flow channel, and the loading arm body is provided with a second water flow channel in communication with the first water flow channel at a position close to the support member; the second water flow channel is in communication with the outside;

[0008] The maximum height of the water inlet of the first water flow channel from the lifting portion is less than the minimum height of the water outlet of the second water flow channel from the lifting portion;

[0009] Wherein, the wafer enters the supporting member after passing through the guiding member.

[0010] In one embodiment of the present invention, the flow direction of the fluid in the first water flow channel and the second water flow channel is parallel to the radial direction of the circle where the bottom of the supporting groove of the supporting member is located.

[0011] In one embodiment of the present invention, the first water flow channel is located in the middle of the bottom of the supporting groove.

[0012] In one embodiment of the present invention, a guide groove is provided on the inner surface of the guide member;

[0013] The guide through groove is communicated with the support groove, and the long axis of the guide through groove coincides with the long axis of the support groove.

[0014] In one embodiment of the present invention, the width of the guide groove gradually decreases from the groove opening to the groove bottom.

[0015] In one embodiment of the present invention, the guide member comprises: a first guide portion and a second guide plate;

[0016] The first guide portion has one end located on one side of one end of the support member and extends from the loading arm body in a direction away from the support member;

[0017] The second guide plate is located at one side of the first guide portion and is fixedly connected to the first guide portion;

[0018] The guide through groove is formed between the first guide portion and the second guide plate.

[0019] In one embodiment of the present invention, the guide through groove is a trapezoidal groove.

[0020] Beneficial effects of the present invention:

[0021] In the present invention, after the wafer is put into water, it enters the guide member under the action of gravity and then gradually sinks into the support groove of the support member. During the process, the guide member is located above the support member. After the wafer is put into water, it can first pass through the guide member. The guide member can play a guiding role for the wafer before it is supported on the loading arm body, so that the wafer is aligned with the supporting position of the support member of the loading arm body, and smoothly enters the loading arm body, avoiding collision and damage with other parts of the loading arm body during the sinking process of the wafer. At the same time, the wafer moves into the support groove of the support member during the sinking process, and the water in the support groove is discharged through the first water flow channel and the second water flow channel. Since the water flow channel is small, the drainage pressure increases. Correspondingly, the reaction force of the drainage pressure increases a certain amount of water buoyancy, which increases the buoyancy effect on the wafer. The buoyancy supports the wafer, so that the wafer can be buffered and shock-absorbed during the descent process, avoiding collision and damage between the wafer and the surrounding groove wall. In addition, if the wafers are loaded on the loading arm body and then put into the water together, the water flow will be pressurized to enter the first water flow channel from the second water flow channel and then into the support groove of the support member, thereby increasing the buoyancy of the wafer and increasing the support for the wafer, thereby buffering and reducing shock during the wafer descent process, avoiding collision and damage between the wafer and the surrounding groove walls, improving the manufacturing quality of the wafer, increasing the wafer loading rhythm of the loading arm, and improving the utilization rate of the wafer transfer mechanism.

[0022] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings.

[0023] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0025] Figure 1 A schematic structural diagram of a wafer loading shock absorbing device provided by an embodiment of the present invention;

[0026] Figure 2 A schematic cross-sectional structure diagram of a wafer loading shock absorbing device provided by an embodiment of the present invention;

[0027] Figure 3 for Figure 2 A magnified view of part A;

[0028] Figure 4 A schematic cross-sectional structure diagram of another industrial control wafer loading shock absorbing device provided by an embodiment of the present invention;

[0029] Figure 5 for Figure 4 A magnified view of part B;

[0030] Figure 6 A top view of a loading arm body loading a wafer provided by an embodiment of the present invention;

[0031] Figure 7 for Figure 6 Enlarged view of part C;

[0032] Figure 8 A side view of a loading arm body loading a wafer provided in an embodiment of the present invention.

[0033] Description of reference numerals:

[0034] 10-loading arm body; 11-lifting part; 20-guide member; 21-guide groove; 22-first guide part; 23-second guide plate; 30-support member; 31-first water flow channel; 32-second water flow channel; 33-support groove; 40-wafer. DETAILED DESCRIPTION

[0035] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0036] like Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a wafer loading shock absorbing device, including: a loading arm body 10, two guide members 20 and two support members 30.

[0037] The two support members 30 are respectively fixedly disposed on both sides of the loading portion of the loading arm body 10 , and the two guide members 20 are respectively located on one side of the two support members 30 close to one end of the lifting portion 11 of the loading arm body 10 .

[0038] In this embodiment, the loading arm body 10 has a loading portion for loading the wafer 40 and a lifting portion 11, and the lifting portion 11 is used to clamp the loading arm body 10 to achieve lifting or lowering the loading arm body 10. The loading portion is in a notch shape, and the lifting portion 11 is located at one end of the notch. Two support members 30 are respectively fixed on both sides of the loading portion, and one end of the support member 30 is close to the lifting portion 11. During the preparation of the wafer 40, the upper end of the support member is close to the lifting portion 11, and the guide member 20 is located on the upper side of the upper end of the support member 30.

[0039] like Figure 3As shown, a first water channel 31 is provided on the support member 30, and a second water channel 32 connected to the first water channel 31 is provided on the loading arm body 10 near the support member 30. The second water channel 32 is connected to the outside; the maximum height of the water inlet of the first water channel 31 from the lifting part 11 is less than the minimum height of the water outlet of the second water channel 32 from the lifting part 11. Here, the water inlet of the first water channel 31 is closer to the lifting part 11, that is, the water inlet of the first water channel 31 is higher than the water outlet of the second water channel 32.

[0040] Among them, the wafer 40 enters the support member 30 after passing through the guide member 20. Here, the wafer 40 can be prepared in two ways, one is to put the loading part of the loading arm body 10 into the water first, and then put the wafer 40 in, and the other is to place the wafer 40 on the loading arm body 10 first, and then sink the two into the water together. In these two methods, when the wafer 40 is loaded with the loading arm body 10, it is necessary to first move downward to the support groove 33 of the support member 30 through the upper guide member 20. The guide member 20 guides the wafer 40 and guides the position of the wafer 40 so that the wafer 40 can be stably loaded onto the support member 30.

[0041] Specifically, Figure 2 and Figure 3 As shown, if the loading part of the loading arm body 10 is first placed in water, and then the wafer 40 is put into the water, after the wafer 40 is put into the water, it enters the guide part 20 under the action of gravity and then gradually sinks into the support groove 33 of the support part 30. In this process, the guide part 20 is located above the support part 30. After the wafer 40 is put into the water, it can first pass through the guide part 20. After the wafer 40 enters the guide part 20, the water in the guide part 20 will be discharged outward. During the discharge process, the water is blocked by the inside of the guide part 20 to generate a rebound force, which increases the buoyancy of the water at this position. Therefore, it can guide the wafer 40 on the loading arm body 10, so that the wafer 40 is aligned with the supporting position of the support part 30 of the loading arm body 10, and smoothly enters the loading arm body 10, avoiding collision and damage between the wafer 40 and other parts of the loading arm body 10 during the sinking process. At the same time, during the sinking process, the wafer 40 moves into the support groove 33 of the support member 30, and the water in the support groove 33 is discharged through the first water flow channel 31 and the second water flow channel 32. Since the water flow channels are relatively small, the drainage pressure increases. Correspondingly, the reaction force of the drainage pressure increases a certain water buoyancy, thereby increasing the buoyancy effect on the wafer 40. The buoyancy supports the wafer 40, thereby buffering and reducing shock during the descent of the wafer 40, thereby preventing the wafer 40 from colliding with the surrounding groove walls and causing damage. Figure 3 The arrow in the middle indicates the direction of water flow.

[0042] The water inlet position of the first water flow channel 31 is higher than the water outlet position of the second water flow channel 32, which matches the radial direction of the sinking of the wafer 40 during drainage, so that the reaction force generated on the wafer 40 is more stable, concentrated and uniform, making the force on the wafer 40 more stable during loading.

[0043] like Figure 4 and Figure 5 As shown, if the wafer 40 is loaded on the loading arm body 10 and then put into the water together, the water flow will be pressurized to enter the first water flow channel 31 from the second water channel 32 and then enter the support groove 33 of the support member 30, thereby increasing the buoyancy of the wafer 40 and increasing the support for the wafer 40, so that the descent process of the wafer 40 can be buffered and shock-absorbing, avoiding collision and damage between the wafer 40 and the surrounding groove walls, thereby improving the manufacturing quality of the wafer 40, improving the loading rhythm of the wafer 40 of the loading arm, and improving the utilization rate of the wafer 40 transfer mechanism. Figure 5 The arrow in the middle indicates the direction of water flow.

[0044] Furthermore, if Figure 3 and Figure 5 As shown, the flow direction of the fluid in the first water flow channel 31 and the second water flow channel 32 is parallel to the radial direction of the circle where the bottom of the groove of the support groove 33 of the support member 30 is located, or coincides with the radial extension direction. In this embodiment, the groove bottom of the support groove 33 is arc-shaped, matching the curvature of the wafer 40, and the flow direction of the fluid in the water flow channel is parallel to the radial direction of the circle where the bottom of the groove is located, or coincides with the radial extension direction, that is, the flow direction coincides with the radial parallel to the extended direction of the diameter of the wafer 40. Therefore, when the water flow channel is drained or filled with water, the water flow direction matches the radial direction of the sinking of the wafer 40, so that the reaction force (buoyancy) generated by the water flow in the water flow channel acts more stably, concentratedly and evenly on the wafer 40, so that the supporting buoyancy of the wafer 40 is more uniform and stable, and further makes the force on the wafer 40 more stable during the loading process.

[0045] Furthermore, the first water channel 31 is located in the middle of the bottom of the support groove 33. In this embodiment, when it is in the middle of the bottom, the reaction force generated on the wafer 40 is symmetrical and uniform, which further makes the force on the wafer 40 more stable during the loading process.

[0046] Furthermore, if Figure 4 , Figure 6 and Figure 7 As shown, a guide groove 21 is formed on the inner surface of the guide member 20. The guide groove 21 is connected to the support groove 33, and the long axis of the guide groove 21 coincides with the long axis of the support groove 33. The width of the guide groove 21 gradually decreases from the groove opening to the groove bottom.

[0047] In this embodiment, the two guide members 20 have guide grooves 21 on the two opposite sides, so that the wafer 40 can pass through the guide grooves 21 and enter the support groove 33. Specifically, after the wafer 40 enters the guide grooves 21, the water in the guide grooves 21 will be discharged outwards. During the discharge process, the water is blocked by the groove wall of the guide grooves 21 to generate a rebound force, which increases the water buoyancy of the wafer 40 and plays a role in guiding the water buoyancy. At the same time, the groove mouth of the guide grooves 21 is wide and the groove bottom is narrow. Therefore, under the condition that the loading arm body 10 is first placed in the water and then the wafer 40 is put in, when the wafer 40 is close to the bottom of the groove, the bottom of the groove becomes narrower, and the water flow becomes smaller when the guide grooves 21 drain water outwards, then the outward drainage resistance is further increased, and the resistance acts on the wafer 40, thereby increasing the supporting force (water buoyancy) of the wafer 40, and further increasing the buffering and shock absorbing effect of the wafer 40 during the descent process. Preferably, the guide grooves 21 are trapezoidal grooves.

[0048] Here, if Figure 7 and Figure 8 As shown, the specific structure of the guide member 20 is as follows: the guide member 20 includes: a first guide portion 22 and a second guide plate 23 .

[0049] One end of the first guide portion 22 is located at one side of one end of the support member 30, and the first guide portion 22 extends from the loading arm body 10 in a direction away from the support member 30. The second guide plate 23 is located at one side of the first guide portion 22 and is fixedly connected to the first guide portion 22. A guide slot 21 is formed between the first guide portion 22 and the second guide plate 23.

[0050] In this embodiment, the first guide portion 22 is a portion of the structure extending upward from the loading arm body 10 , and the second guide plate 23 is located on one side of the first guide portion 22 and is fixedly connected to the first guide portion 22 .

[0051] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0052] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0053] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0055] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0056] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention belong to the scope of the present invention, the present invention is also intended to include these changes and variations.

Claims

1. A wafer loading shock absorbing device, characterized in that: include: Loading arm body, two guide members and two support members; The two support members are respectively fixedly arranged on both sides of the loading part of the loading arm body, and the two guide members are respectively located on one side of one end of the two support members close to the lifting part of the loading arm body; The support member is provided with a first water flow channel, and the loading arm body is provided with a second water flow channel in communication with the first water flow channel at a position close to the support member; the second water flow channel is in communication with the outside; The maximum height of the water inlet of the first water flow channel from the lifting portion is less than the minimum height of the water outlet of the second water flow channel from the lifting portion; Wherein, the wafer enters the supporting member after passing through the guiding member.

2. A wafer loading shock absorbing device as claimed in claim 1, characterized in that: The flow direction of the fluid in the first water flow channel and the second water flow channel is parallel to the radial direction of the circle where the groove bottom of the support groove of the support member is located.

3. A wafer loading shock absorbing device as claimed in claim 2, characterized in that: The first water flow channel is located in the middle of the bottom of the supporting groove.

4. A wafer loading shock absorbing device as claimed in claim 2, characterized in that: A guide groove is provided on the inner surface of the guide member; The guide through groove is communicated with the support groove, and the long axis of the guide through groove coincides with the long axis of the support groove.

5. A wafer loading shock absorbing device as claimed in claim 4, characterized in that: The width of the guide through groove gradually decreases from the groove opening to the groove bottom.

6. A wafer loading shock absorbing device as claimed in claim 4, characterized in that: The guide member comprises: a first guide portion and a second guide plate; The first guide portion has one end located on one side of one end of the support member and extends from the loading arm body in a direction away from the support member; The second guide plate is located at one side of the first guide portion and is fixedly connected to the first guide portion; The guide through groove is formed between the first guide portion and the second guide plate.

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