Packaging structure, packaging method and plastic packaging mold of laser and optical element

Abstract

The invention relates to the technical field of edge emitting laser packaging, in particular to a laser packaging structure, a packaging method, a plastic packaging mold and an optical element, the laser packaging structure comprises a first substrate, a laser emitter and a transparent plastic layer, the laser emitter and the transparent plastic layer are arranged on the first substrate, and a light outlet of the laser emitter is located in one side of the laser emitter; the first transparent plastic package body wraps the laser transmitter, the transparent plastic layer plays a role in plastic package of the laser transmitter, the first transparent plastic package body located on one side of the light outlet is provided with a concave part, and the side face of the side, facing the light outlet, of the concave part is an inclined face inclining up and down. The inclined surface is attached with the reflecting layer which is used for reflecting the laser emitted by the light outlet upwards, so that a reflecting element does not need to be additionally installed, and the production efficiency of the laser packaging structure is greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of edge-emitting laser packaging, and in particular to a laser packaging structure, a packaging method, a plastic packaging mold and an optical element. Background Art

[0002] Semiconductor laser chips are divided into two categories: EEL (Edge Emitting Laser) and VCSEL (Vertical Cavi tySurface Emitting Laser). Compared with surface emitting lasers, edge emitting lasers have the advantages of wide wavelength range, high electro-optical conversion efficiency, and high power, making them very suitable for laser processing, optical communications and other fields. At present, as an important part of the optoelectronics industry, edge emitting semiconductor lasers have been applied in industry, telecommunications, science, consumption, military, and aerospace.

[0003] The Chinese invention patent with application publication number CN106207741A discloses a laser packaging structure, which is provided with a laser emitter and a reflective element arranged at a relative interval on a substrate, and a reflective surface arranged obliquely on the side of the reflective element facing the laser emitter. The laser emitter emits incident light parallel to the substrate, and the incident light is reflected by the reflective surface as an outgoing light perpendicular to the substrate. Its packaging structure adopts a modular approach, and the laser emission module composed of the substrate and the laser emitter and the reflective module composed of the reflective element are processed separately. When manufacturing the laser packaging structure, the laser emission module and the reflective module need to be processed in parallel. When processing the laser generating module, the laser emitter needs to be attached to the substrate first, and then the laser emitter is plastic-sealed. After the reflective element is processed, the reflective element needs to be installed on the substrate to realize the assembly of the laser emission module and the reflective module. The installation efficiency of the reflective element is low, resulting in low production efficiency of the laser packaging structure. Summary of the invention

[0004] The technical problem to be solved by the present invention is that: the existing laser packaging structure has a low installation efficiency for installing the reflective module on the substrate, resulting in a low production efficiency of the laser packaging structure.

[0005] In order to solve the above technical problems, the present invention aims to provide a packaging structure of a laser, comprising:

[0006] a first substrate;

[0007] A laser emitter, wherein the laser emitter is attached to the first substrate, and a light outlet of the laser emitter is located at one side of the laser emitter;

[0008] A first transparent plastic sealing body is attached to the first substrate and covers the laser emitter; the first transparent plastic sealing body located on one side of the light outlet has a recessed portion, and the side surface of the recessed portion facing the light outlet is an inclined surface inclined up and down, and a reflective layer is attached to the inclined surface for reflecting the laser emitted by the light outlet upward.

[0009] As a preferred solution, the recessed portion is integrally formed on the first transparent plastic sealing body by a plastic sealing mold.

[0010] As a preferred solution, the reflective layer is a metal layer sputtered on the inclined surface.

[0011] As a preferred solution, the laser emitter includes a base and a laser emitting chip arranged on the base, and the base is fixed on the first substrate.

[0012] As a preferred solution, the laser emitting chip is wire-bonded to the base, and the base is wire-bonded to the first substrate.

[0013] As a preferred solution, a side surface of the recessed portion opposite to the light outlet is perpendicular to the light beam emitted from the light outlet.

[0014] A packaging method is used to package the packaging structure of the laser, and the packaging method comprises the following steps:

[0015] Step S1, mounting a plurality of laser emitters in a matrix on a second substrate;

[0016] Step S2, using a plastic packaging mold to process a second transparent plastic packaging body on the second substrate, wherein the second transparent plastic packaging body covers each of the laser emitters and has a recessed portion arranged in one-to-one correspondence with the light outlet of each of the laser emitters;

[0017] Step S3, processing a reflective layer on the inclined surface of each of the recessed portions;

[0018] Step S4, cutting the second transparent plastic packaging body and the second substrate into a plurality of laser packaging units, each of the laser packaging units having the above-mentioned laser packaging structure.

[0019] As a preferred solution, step S3 includes:

[0020] Step S31, covering the upper end of the second transparent plastic sealing body with a shielding member, wherein the shielding member is provided with through holes at positions opposite to the inclined surfaces of the recessed portions in the upper and lower directions;

[0021] Step S32: sputtering the reflective layer on each of the inclined surfaces through each of the through holes by sputtering.

[0022] A plastic sealing mold is used to form the above-mentioned second transparent plastic sealing body. The plastic sealing mold includes an upper mold and a lower mold that can be opened and closed. The lower mold has a lower mold cavity that matches the second substrate, and the upper mold has an upper mold cavity that matches the second transparent plastic sealing body. The top wall of the upper mold cavity has a plurality of protrusions, and each of the protrusions matches each of the recessed portions.

[0023] An optical element comprises the packaging structure of the laser mentioned above.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] The laser packaging structure of the present invention comprises a first substrate, a laser emitter arranged on the first substrate and a transparent plastic layer, wherein the light outlet of the laser emitter is located at one side of the laser emitter; the first transparent plastic packaging body covers the laser emitter, the transparent plastic layer not only plays the role of plastic sealing of the laser emitter, but also the first transparent plastic packaging body located at the side of the light outlet has a recessed portion, the side surface of the recessed portion facing the light outlet is an inclined surface inclined up and down, and a reflective layer for reflecting the laser emitted by the light outlet upward is attached to the inclined surface, so there is no need to install a reflective element separately, which greatly improves the production efficiency of the laser packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A top view of the packaging structure of the laser of the present invention;

[0027] Figure 2 for Figure 1 Middle AA section view;

[0028] Figure 3 A schematic diagram of a structure in which a first substrate and a laser emitter are mounted on a second substrate;

[0029] Figure 4 It is a schematic diagram of the structure after wire bonding of the laser emission chip and the first substrate;

[0030] Figure 5 It is a schematic diagram of the structure after plastic packaging;

[0031] Figure 6 It is a schematic diagram of the structure of the processing reflection layer;

[0032] Figure 7 A schematic diagram of a structure in which a plurality of laser packaging units are formed after cutting the second transparent plastic packaging body and the second substrate;

[0033] Figure 8 It is a structural schematic diagram of the plastic packaging mold;

[0034] In the figure, 1, first substrate, 2, laser emitter, 21, base, 22, laser emitting chip, 23, light outlet, 3, first transparent plastic package, 31, recessed portion, 311, inclined surface, 312, reflective layer, 4, second substrate, 5, second transparent plastic package, 6, shielding member, 61, through hole, 7, upper template, 71, upper mold cavity, 72, raised portion, 8, lower template, 81, lower mold cavity. DETAILED DESCRIPTION

[0035] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0036] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "top", "bottom", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but such information should not be limited to these terms, which are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the "first" information may also be referred to as the "second" information, and similarly, the "second" information may also be referred to as the "first" information.

[0037] like Figure 1 , Figure 2 As shown, the packaging structure of the laser of the present invention includes a first substrate 1, a laser emitter 2 and a first transparent plastic sealing body 3, the laser emitter 2 is attached to the first substrate 1, and the light outlet 23 of the laser emitter 2 is located at one side of the laser emitter 2; the first transparent plastic sealing body 3 is attached to the first substrate 1 and covers the laser emitter 2; the first transparent plastic sealing body 3 located at one side of the light outlet 23 has a recessed portion 31, and the side surface of the recessed portion 31 facing the light outlet 23 is an inclined surface 311 inclined up and down, and the inclined surface 311 is attached with a reflective layer 312 for reflecting the laser emitted by the light outlet 23 upward. Specifically, the recessed portion 31 and the light outlet 23 are arranged horizontally with an interval. After the light beam emitted by the light outlet 23 passes through the transparent packaging layer between the recessed portion 31 and the light outlet 23, it irradiates the reflective layer 312, and is reflected by the reflective layer 312 and then emitted upward to the outside of the plastic packaging layer. The plastic packaging layer not only seals the laser emitter 2, but also serves as a substrate for attaching the reflective layer 312. Therefore, there is no need for additional processing and installation of reflective elements, which greatly improves the processing efficiency of the laser packaging structure.

[0038] There are many ways to form the recessed portion 31. In this embodiment, the recessed portion 31 is integrally formed by a plastic encapsulation mold on the first transparent plastic encapsulation body 3, further improving the processing efficiency of the packaging structure. In other embodiments of the present invention, the recessed portion 31 can be processed by cutting after the plastic encapsulation is completed.

[0039] In this embodiment, the reflective layer 312 is a metal layer sputtered on the inclined surface 311. The reflective layer 312 is processed by sputtering, which can better ensure the thickness and smoothness of the reflective layer 312, and facilitate precise control of the distribution area of ​​the reflective layer 312 to avoid overflow plating.

[0040] In this embodiment, the laser emitter 2 includes a base 21 and a laser emitting chip 22 disposed on the base 21, and the base 21 is fixed on the first substrate 1. The laser emitting chip 22 is fixed on the base 21 by welding, and the laser emitting chip 22 and the base 21 are electrically connected by wire bonding, and the base 21 and the first substrate 1 are electrically connected by wire bonding.

[0041] In this embodiment, the side surface of the recessed portion 31 opposite to the light outlet 23 is perpendicular to the light beam emitted from the light outlet 23. Specifically, the light beam emitted from the light outlet 23 is parallel to the first substrate 1, and the side surface of the recessed portion 31 opposite to the light outlet 23 is a vertical surface. This arrangement can ensure that the thickness of the plastic sealing layer between the recessed portion 31 and the light outlet 23 is the same, and ensure that the intensity of the light beam emitted from the light outlet 23 when irradiating the reflective layer 312 is the same, thereby improving the measurement accuracy.

[0042] The above packaging method comprises the following steps:

[0043] Step S1, mounting a plurality of laser emitters 2 in a matrix on a second substrate 4; wherein step S1 comprises:

[0044] Step S11, installing each base 21 on the second substrate 4;

[0045] Step S12: Figure 3 As shown, each laser emitting chip 22 is mounted on each base 21;

[0046] Step S13: Figure 4 As shown, wire bonding is performed on the pad of the base 21 and the welding piece of the second substrate 4, so that the laser emitting chip 22 is connected to the second substrate 4;

[0047] Step S2: Figure 5As shown, a second transparent plastic package 5 is processed on the second substrate 4 by using a plastic package mold, and the second transparent plastic package 5 covers each laser emitter 2 and has a recessed portion 31 arranged one-to-one corresponding to the light outlet 23 of each laser emitter 2;

[0048] Step S3: Figure 6 As shown, a reflective layer 312 is processed on the inclined surface 311 of each recessed portion 31;

[0049] Step S4: Figure 7 As shown, the second transparent plastic packaging body 5 and the second substrate 4 are cut into a plurality of laser packaging units, each of which has the above-mentioned laser packaging structure.

[0050] The structures of the laser packaging units are the same, and a large number of laser packaging units can be cut out through a single cutting, thereby ensuring the production efficiency of the laser packaging units.

[0051] In step S3, processing the reflective layer 312 on the inclined surface 311 of each recessed portion 31 includes:

[0052] Step S31, covering the upper end of the second transparent plastic package body 5 with a shielding member 6, wherein the shielding member 6 is provided with through holes 61 at positions where the shielding member 6 and the inclined surfaces 311 of the recessed portions 31 are opposite to each other in the vertical direction;

[0053] Step S32 , sputtering a reflective layer 312 on each inclined surface 311 through each through hole 61 by sputtering.

[0054] The shielding member 6 is a shielding plate. In other embodiments of the present invention, the shielding member 6 may be a shielding film.

[0055] A preferred embodiment of a plastic encapsulation mold is as follows Figure 8 As shown, the plastic sealing mold used to form the above-mentioned second transparent plastic sealing body 5 includes an upper mold plate 7 and a lower mold plate 8 that can be opened and closed. The lower mold plate 8 has a lower mold cavity 81 that matches the second substrate 4, and the upper mold plate 7 has an upper mold cavity that matches the second transparent plastic sealing body 5. The top wall of the upper mold cavity has a plurality of protrusions 72, and each protrusion 72 matches each recessed portion 31.

[0056] The second transparent plastic package body 5 having a plurality of recessed portions 31 is integrally formed by injection molding, thereby further improving the production efficiency of the laser packaging unit. In other embodiments of the present invention, the recessed portions 31 can be processed by cutting.

[0057] An embodiment of an optical element includes the above-mentioned laser packaging structure. The optical element can be an ambient light sensor, a spectral light sensor, a proximity sensor, or other sensor that needs to emit laser light.

[0058] In summary, the packaging structure of the laser of the present invention includes a first substrate 1, a laser emitter 2 and a transparent plastic layer arranged on the first substrate 1, and the light outlet 23 of the laser emitter 2 is located on one side of the laser emitter 2; the first transparent plastic sealing body 3 covers the laser emitter 2, and the transparent plastic layer not only plays the role of plastic sealing for the laser emitter 2, but also the first transparent plastic sealing body 3 located on the side of the light outlet 23 has a recessed portion 31, and the side surface of the recessed portion 31 facing the light outlet 23 is an inclined surface 311 inclined up and down, and the inclined surface 311 is attached with a reflective layer 312 for reflecting the laser emitted by the light outlet 23 upward, so there is no need to install a reflective element separately, which greatly improves the production efficiency of the laser packaging structure.

[0059] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A laser packaging structure, characterized in that: include: A first substrate (1); A laser emitter (2), the laser emitter (2) being attached to the first substrate (1), and a light outlet (23) of the laser emitter (2) being located on one side of the laser emitter (2); A first transparent plastic sealing body (3), the first transparent plastic sealing body (3) is attached to the first substrate (1) and covers the laser emitter (2); the first transparent plastic sealing body (3) located on one side of the light outlet (23) has a recessed portion (31), the side surface of the recessed portion (31) facing the light outlet (23) is an inclined surface (311) inclined up and down, and a reflective layer (312) is attached to the inclined surface (311) for reflecting the laser emitted by the light outlet (23) upward.

2. The packaging structure of the laser according to claim 1, characterized in that: The recessed portion (31) is integrally formed on the first transparent plastic sealing body (3) by a plastic sealing mould.

3. The packaging structure of the laser according to claim 1, characterized in that: The reflective layer (312) is a metal layer sputtered on the inclined surface (311).

4. The packaging structure of the laser according to claim 1, characterized in that: The laser emitter (2) comprises a base (21) and a laser emission chip (22) arranged on the base (21); the base (21) is fixed on the first substrate (1).

5. The laser packaging structure according to claim 4, characterized in that: The laser emitting chip (22) and the base (21) are bonded via wires, and the base (21) and the first substrate (1) are bonded via wires.

6. The laser packaging structure according to claim 1, characterized in that: The side surface of the recessed portion (31) opposite to the light outlet (23) is perpendicular to the light beam emitted from the light outlet (23).

7. A packaging method for packaging the packaging structure of the laser according to any one of claims 1 to 6, characterized in that: The packaging method comprises the following steps: Step S1, mounting a plurality of laser emitters (2) in a matrix on a second substrate (4); Step S2, using a plastic packaging mold to process a second transparent plastic packaging body (5) on the second substrate (4), wherein the second transparent plastic packaging body (5) covers each of the laser emitters (2) and the second transparent plastic packaging body (5) has recessed portions (31) arranged in one-to-one correspondence with the light outlets (23) of each of the laser emitters (2); Step S3, processing a reflective layer (312) on the inclined surface (311) of each of the recessed portions (31); Step S4, cutting the second transparent plastic packaging body (5) and the second substrate (4), and cutting the second transparent plastic packaging body (5) and the second substrate (4) into a plurality of laser packaging units, each of the laser packaging units having a packaging structure of the laser according to any one of claims 1 to 6.

8. The packaging method according to claim 7, characterized in that: The step S3 comprises: Step S31, covering the upper end of the second transparent plastic sealing body (5) with a shielding member (6), wherein the shielding member (6) is provided with through holes (61) at positions corresponding to the inclined surfaces (311) of the respective recessed portions (31) above and below; Step S32: sputtering the reflective layer (312) on each of the inclined surfaces (311) through each of the through holes (61) by sputtering.

9. A plastic sealing mold for molding the second transparent plastic sealing body (5) according to claim 7 or 8, characterized in that: The plastic encapsulation mold comprises an upper mold plate (7) and a lower mold plate (8) which can be opened and closed, wherein the lower mold plate (8) has a lower mold cavity (81) matching with the second substrate (4), and the upper mold plate (7) has an upper mold cavity matching with the second transparent plastic encapsulation body (5), and the top wall of the upper mold cavity has a plurality of protrusions (72), and each of the protrusions (72) matches with each of the recessed portions (31).

10. An optical element, characterized in that: A packaging structure comprising the laser according to any one of claims 1 to 6.

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