Mother-son flexible circuit board and manufacturing method thereof

Abstract

The invention relates to the technical field of flexible circuit board manufacturing, and discloses a mother-son flexible circuit board and a manufacturing method thereof.According to the scheme, a first substrate and a second substrate are divided into two independent parts, and a first connecting part of the second substrate is welded to the first substrate; the orthographic projection, in the thickness direction of the first substrate, of the first connecting part is located on the inner side of the orthographic projection, in the thickness direction of the first substrate, of the first substrate, and then the second connecting part is bent relative to the first connecting part at the joint of the first connecting part and the second connecting part and bent to a preset angle; therefore, after fitting of accessories such as a reinforcing plate is completed, gaps are effectively prevented from being generated between the second substrate and fitting accessories such as the reinforcing plate, so that the assembled flexible circuit board has good air tightness, and the requirement of a terminal product for sealing performance is met.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible circuit board manufacturing, and in particular to a mother-and-child flexible circuit board and a manufacturing method thereof. Background Art

[0002] As the requirements for end products continue to increase, the airtightness requirements for flexible circuit boards after assembly at the customer end are gradually increasing. Fig. 9 and Fig.10 As shown, currently, most traditional flexible circuit boards are designed in one piece and the three-dimensional bending line can only be located at the outer edge of the flexible circuit board, which causes a gap between the flexible circuit board and the accessories fitted thereto, resulting in the inability of the assembled flexible circuit board to meet good air tightness. When the flexible circuit board is assembled on the client, it is necessary to make the flexible circuit board and the buttons provided on the casing correspond to each other, so that the user can control the conduction or disconnection of the circuit connected to the flexible circuit board by operating the buttons provided on the casing. Water vapor, dust and other debris in the external environment will enter through the gap between the buttons and the casing and further invade into the interior of the client through the gap between the bent part of the flexible circuit board and the gap between the fitted accessories, which will affect the normal operation of the client over time. Summary of the invention

[0003] The purpose of the present invention is to provide a mother-and-child flexible circuit board and a method for manufacturing the same, so as to solve the problem in the prior art that the flexible circuit board has poor air tightness, which causes moisture, dust and other debris in the external environment to easily penetrate into the casing and affect the normal use of the client.

[0004] In order to achieve the above objectives, in a first aspect, an embodiment of the present application provides a mother-child flexible circuit board, comprising:

[0005] A first substrate, wherein the first substrate has a front side and a back side disposed opposite to each other, and one or more first conductive members are disposed on the front side;

[0006] A second substrate is matched with the first conductive member, the second substrate comprises a first connecting portion and a second connecting portion, the second connecting portion is connected to one end of the first connecting portion and is bent relative to the first connecting portion, the first connecting portion is connected to the front surface of the first substrate in affixed manner, and the orthographic projection of the first connecting portion along the thickness direction of the first substrate is located on the inner side of the orthographic projection of the first substrate along the thickness direction of the first substrate; the first connecting portion is provided with a second conductive member connected to the first conductive member, and the second connecting portion is provided with a third conductive member for connecting to an external circuit; the first conductive member, the second conductive member, and the third conductive member are connected in sequence and can form a loop with the external circuit;

[0007] a reinforcing plate, coplanar with the first connecting portion and located outside the first connecting portion, the reinforcing plate being bonded and connected to the front surface of the first substrate; and

[0008] The conduction control component is attached to the back surface of the first substrate and is used to control the conduction of the first conductive component.

[0009] In some embodiments of the present application, the mother-child flexible circuit board further includes a first colloid disposed between the first substrate and the reinforcing plate, and the first colloid connects the first substrate and the reinforcing plate.

[0010] In some embodiments of the present application, the mother-child flexible circuit board further includes a second colloid bonded to the side of the reinforcing plate facing away from the first substrate, and a first protective film is provided on the side of the second colloid facing away from the reinforcing plate.

[0011] In some embodiments of the present application, the mother-child flexible circuit board also includes a third colloid bonded to the side of the second connection portion facing away from the third conductive component, and a second protective film is provided on the side of the third colloid facing away from the second connection portion.

[0012] In some embodiments of the present application, the reinforcing plate, the first colloid, and the second colloid are all provided with through holes along the thickness direction thereof for allowing the first connecting portion to pass through.

[0013] In some embodiments of the present application, the first conductive member includes two first contacts arranged at intervals, the second conductive member includes two second contacts arranged at intervals and respectively connected to the first contacts, the third conductive member includes two third contacts arranged at intervals and respectively connected to the second contacts, and the two third contacts are also used to connect the lead-in end and the lead-out end of the external circuit respectively;

[0014] A first conductive ring connected to one of the first contacts is disposed on the back of the first substrate, and a second conductive ring coaxially disposed inside the first conductive ring and connected to another of the first contacts is disposed;

[0015] The conduction control component includes a conductive disc arranged on the back side, the outer periphery of the conductive disc is connected to the first conductive ring, and the central area of ​​the conductive disc protrudes away from the back side to form a pressing portion, and the pressing portion is pressed toward the first substrate until it fits with the second conductive ring, so that the first conductive ring and the second conductive ring can be connected.

[0016] In some embodiments of the present application, the conduction control component also includes a flexible film adhered to the back side of the first substrate, and the side of the flexible film facing the first substrate is provided with a receiving groove for embedding the conductive disc, so that the conductive disc is encapsulated between the flexible film and the first substrate.

[0017] In a second aspect, an embodiment of the present application provides a method for manufacturing the mother-child flexible circuit board in the above embodiment, comprising the following steps:

[0018] Making a first plate, wherein the first plate has a plurality of first substrates arranged at intervals;

[0019] Punching the first plate below the first substrate to form a clearance area for welding the second substrate;

[0020] Manufacturing a second substrate, attaching a first connecting portion of the second substrate to the front surface of the first substrate, making the first conductive member correspond to the second conductive member and making the orthographic projection of the first connecting portion along the thickness direction of the first substrate be located inside the orthographic projection of the first substrate along the thickness direction of the first substrate, and then welding the first connecting portion to the first substrate;

[0021] Laminating a conduction control component on the back side of the first substrate;

[0022] Separating the first substrate and the second substrate after welding from the first plate;

[0023] The second connecting portion is bent at a connection point between the second connecting portion and the first connecting portion, and is bent to a preset angle relative to the first connecting portion;

[0024] A reinforcing plate is attached and connected to the front side of the first substrate to form a mother-child flexible circuit board.

[0025] In some embodiments of the present application, a first colloid is arranged between the first substrate and the reinforcement plate; a second colloid is adhered to the side of the reinforcement plate away from the first substrate and a first protective film is provided on the side of the second colloid away from the reinforcement plate; and pressure is applied by a cold press jig to tightly fit the reinforcement plate, the first substrate, the first colloid, and the second colloid.

[0026] In some embodiments of the present application, a third colloid is attached to a side of the second connection portion facing away from the third conductive component, and a second protective film is provided on a side of the third colloid facing away from the second connection portion.

[0027] Compared with the prior art, the mother-child flexible circuit board and the manufacturing method thereof in the embodiment of the present invention have the following beneficial effects: the present solution divides the first substrate and the second substrate into two separate components, and welds the first connection portion of the second substrate to the first substrate, and makes the orthographic projection of the first connection portion along the thickness direction of the first substrate located on the inner side of the orthographic projection of the first substrate along the thickness direction of the first substrate, and then bends the second connection portion relative to the first connection portion at the connection between the first connection portion and the second connection portion, and bends it to a preset angle, so that after the bonding of accessories such as a reinforcement plate is completed, a gap is effectively avoided between the second substrate and the bonding accessories such as the reinforcement plate, so that the assembled flexible circuit board has better airtightness, thereby meeting the sealing performance requirements of the terminal product. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the overall structure of the flexible circuit board after assembly of the present invention;

[0029] Figure 2 This is an exploded schematic diagram of the flexible circuit board structure of the present invention;

[0030] Figure 3 This is a schematic diagram of the second substrate of the present invention before being bent;

[0031] Figure 4 is a schematic diagram of the structure of the second substrate of the present invention;

[0032] Figure 5 This is a schematic diagram of the first plate structure of the present invention;

[0033] Figure 6 This is a schematic diagram of the state in which the second substrate of the present invention is welded to the first substrate;

[0034] Figure 7 This is a schematic diagram of the back structure of the first substrate of the present invention;

[0035] Figure 8 For the present invention Figure 7 Schematic diagram of the AA section structure;

[0036] Fig. 9 It is a schematic diagram of the structure of a flexible circuit board before being bent in the prior art;

[0037] Fig.10 It is a schematic diagram of the structure of a flexible circuit board after being bent and fitted with accessories in the prior art;

[0038] Fig.11 This is a schematic diagram of the structure of the flexible circuit board before being bent in the present invention;

[0039] Fig.12 It is a schematic diagram of the structure after the flexible circuit board in the present invention is bent and fitted with accessories.

[0040] In the figure, 1, first substrate; 11, first conductive member; 111, first contact point; 12, first conductive ring; 13, second conductive ring;

[0041] 2. second substrate; 21. first connection portion; 22. second connection portion; 23. second conductive member; 231. second contact point; 24. third conductive member; 241. third contact point;

[0042] 3. Reinforcement plate;

[0043] 4. conduction control member; 41. conductive disc; 42. pressing portion; 43. flexible film; 431. receiving groove;

[0044] 5. First colloid; 6. Second colloid; 61. First protective film; 611. First handle portion; 7. Third colloid; 71. Second protective film; 711. Second handle portion; 8. Perforation; 9. First plate; 91. Avoidance zone; 10. Bending portion. DETAILED DESCRIPTION

[0045] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0046] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. It should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but such information should not be limited to these terms, which are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information.

[0047] First, as Figure 1-Figure 12As shown, the embodiment of the present application proposes a mother-child flexible circuit board, including a first substrate 1, the first substrate 1 has a front side and a back side arranged opposite to each other, and one or more first conductive members 11 are arranged on the front side of the first substrate 1; a second substrate 2 is arranged to match the number of the first conductive members 11, the first substrate 1 and the second substrate 2 are both flexible circuit boards, which are made of polyimide or polyester film as a substrate and have high reliability and excellent flexibility. The second substrate 2 includes a first connecting portion 21 and a second connecting portion 22, the second connecting portion 22 is connected to one end of the first connecting portion 21 and is bent relative to the first connecting portion 21, and the bending angle between the first connecting portion 21 and the second connecting portion 22 is set accordingly according to actual production requirements, such as: 90°, 45° or other angles; a bending portion 10 is formed at the bending point of the first connecting portion 21 and the second connecting portion 22; the first connecting portion 21 and the first substrate 1 The front side of the flexible circuit board is bonded and connected, and the positive projection of the first connecting part 21 along the thickness direction of the first substrate 1 is located on the inner side of the positive projection of the first substrate 1 along the thickness direction of the first substrate 1; a second conductive member 23 connected to the first conductive member 11 is provided on the first connecting part 21, and a third conductive member 24 for connecting to an external circuit is provided on the second connecting part 22; the first conductive member 11, the second conductive member 23, and the third conductive member 24 are connected and can form a loop with the external circuit; a reinforcing plate 3, which is coplanar with the first connecting part 21 and is located on the outside of the first connecting part 21, and the reinforcing plate 3 is bonded and connected to the front side of the first substrate 1 to improve the strength of the overall structure of the flexible circuit board; and a conduction control member 4, which is bonded and connected to the back side of the first substrate 1, and is used to control the on and off of the first conductive member 11. When the first conductive member 11 is in the on state, the external circuit connected to the flexible circuit board is in the on state, otherwise it is in the off state.

[0048] This solution adopts a technical solution in which the first substrate 1 and the second substrate 2 are separately arranged and the second substrate 2 is bent separately, so that the first connecting portion 21 of the second substrate 2 is connected to the first substrate 1 in a bonded manner. Fig.11 and the first connecting portion 21, the second connecting portion 22 at the connection portion 10 is located in the first substrate 1 along the thickness direction of the first substrate 1 is projected inside, such as Fig.12 As shown; thus, after the second connection portion 22 is bent relative to the first connection portion 21 and the fitting of the accessories is completed, no gap is generated between the second connection portion 22 and the fitting accessories, so that the assembled flexible circuit board has good air tightness, which can effectively prevent the external water vapor, dust and other debris that enter through the gap between the button and the casing from further invading the interior of the casing, so as to improve the durability of the client.

[0049] In some embodiments of the present application, Figure 2As shown, the mother-child flexible circuit board also includes a first colloid 5 arranged between the first substrate 1 and the reinforcing plate 3. The first colloid 5 is a 3M double-sided adhesive tape, and the first colloid 5 is used to connect the first substrate 1 and the reinforcing plate 3.

[0050] In some embodiments of the present application, Figure 2 As shown, the mother-child flexible circuit board also includes a second colloid 6 that is attached to the side of the reinforcing plate 3 away from the first substrate 1. The second colloid 6 is a foam glue (also a double-sided adhesive). A first protective film 61 is provided on the side of the second colloid 6 away from the reinforcing plate 3. The first protective film 61 is used to protect the adhesive surface of the second colloid 6 away from the reinforcing plate 3. When the flexible circuit board needs to be assembled in the client, the first protective film 61 can be torn off and the flexible circuit board can be bonded and fixed to the casing through the adhesive surface of the second colloid 6 away from the reinforcing plate 3, so as to achieve reliable fixation of the flexible circuit board. In order to facilitate the tearing off of the first protective film 61, a first handle portion 611 can be integrally extended from the edge of the first protective film 61, and the staff can easily tear off the first protective film 61 from the adhesive surface of the second colloid 6 by pulling the first handle portion 611.

[0051] In some embodiments of the present application, Figure 1 As shown, the mother-child flexible circuit board also includes a third colloid 7 that is attached to the side of the second connection part 22 away from the third conductive member 24. The side of the third colloid 7 away from the second connection part 22 is provided with a second protective film 71. The second protective film 71 is used to protect the adhesive surface of the third colloid 7 away from the second connection part 22. The third colloid 7 is used to tear off the second protective film 71 after the flexible circuit board is installed in the client, and then the second connection part 22 is bonded and fixed to the corresponding position in the casing through the third colloid 7 to achieve the fixation of the second connection part 22; as shown in FIG. Figure 2 As shown, in order to facilitate tearing off the second protective film 71 from the third colloid 7, a second handle portion 711 can be integrally extended from the edge of the second protective film 71, and the staff can easily tear off the second protective film 71 from the adhesive surface of the third colloid 7 by pulling the second handle portion 711.

[0052] In some embodiments of the present application, Figure 1 , Figure 2 As shown, the reinforcing plate 3, the first colloid 5, and the second colloid 6 are all penetrated along the thickness direction thereof with a through hole 8 for the first connecting portion 21 to pass through. The setting of the through hole 8 is used to enable the first connecting portion 21 to pass through the through hole 8 provided on the above components when the first colloid 5, the reinforcing plate 3, and the second colloid 6 need to be bonded in sequence, without hindering the bonding of the reinforcing plate 3, the first colloid 5, and the second colloid 6.

[0053] In some embodiments of the present application, Figure 5As shown, the first conductive member 11 includes two first contacts 111 spaced apart from each other. Figure 4 As shown, the second conductive member 23 includes two second contacts 231 that are spaced apart and respectively connected to the first contacts 111, and the third conductive member 24 includes two third contacts 241 that are spaced apart and respectively connected to the second contacts 231, and the two third contacts 241 are also used to connect to the lead-in end and the lead-out end of the external circuit respectively; Figure 7 As shown, a first conductive ring 12 connected to one of the first contacts 111 is provided on the back side of the first substrate 1, and a second conductive ring 13 coaxially provided on the inner side of the first conductive ring 12 and connected to the other first contact 111; the conduction control member 4 includes a conductive disc 41 provided on the back side of the first substrate 1, the outer periphery of the conductive disc 41 is connected to the first conductive ring 12, and the central area of ​​the conductive disc 41 protrudes toward the back side away from the first substrate 1 to form a pressing portion 42, and the pressing portion 42 is pressed toward the first substrate 1 until it fits with the second conductive ring 13, so that the first conductive ring 12 and the second conductive ring 13 can be connected; in this solution, the conduction control member 4 and the matching first conductive ring 12 and the second conductive ring 13 are correspondingly arranged. In the actual production process, a suitable number of conduction control members 4 and the matching first conductive ring 12 and the second conductive ring 13 can be arranged according to different user requirements.

[0054] like Figure 2 , Figure 7 , Figure 8As shown, the conduction control member 4 in this solution corresponds to the button provided on the housing, that is, the pressing portion 42 corresponds to the position of the button provided on the housing, and the user operates the button and then realizes the conduction or disconnection of the external circuit connected to the flexible circuit board through the conduction control member 4. Specifically: the external circuit has an introduction end and an extraction end, and the introduction end and the extraction end are respectively connected to the third contact 241, and the third contact 241 is connected to the corresponding second contact 231 and the first contact 111. By controlling the on-off between the two first contacts 111, the on-off control of the external circuit can be realized; when the user presses the button, the pressing portion 42 is subjected to a downward pressure from the button, thereby forcing the pressing portion 42 to move toward the first substrate 1, so that the pressing portion 42 and the second conductive substrate 1 are connected. The outer periphery of the conductive disc 41 is always in contact with the first conductive ring 12, so that the first conductive ring 12 and the second conductive ring 13 are in a connected state under the action of the conductive disc 41, and the first conductive ring 12 and the second conductive ring 13 are respectively connected to the first contact 111, so that the two first contacts 111 are in a connected state, so that the external circuit connected to the flexible circuit board is connected, and when the key is released, the pressing portion 42 in the middle of the conductive disc 41 bounces away from the first substrate 1 and breaks contact with the second conductive ring 13, so that the first conductive ring 12 and the second conductive ring 13 are in a disconnected state, and the two first contacts 111 are also in a disconnected state, so that the external circuit connected to the flexible circuit board is disconnected.

[0055] In some embodiments of the present application, Figure 2 As shown, the mother-child flexible circuit board also includes a flexible film 43 bonded to the back side of the first substrate 1, and the flexible film 43 is provided with a receiving groove 431 for embedding the conductive round piece 41 on the side facing the first substrate 1, so that the conductive round piece 41 is encapsulated between the flexible film 43 and the first substrate 1; the flexible film 43 is a transparent film and the side of the flexible film 43 facing the first substrate 1 is a glue surface, through which the flexible film 43 is bonded to the back side of the first substrate 1 and the conductive round piece 41 is embedded in the receiving groove 431, thereby encapsulating the conductive round piece 41 between the flexible film 43 and the first substrate 1.

[0056] In a second aspect, an embodiment of the present application provides a method for manufacturing the mother-child flexible circuit board in the above embodiment, comprising the following steps:

[0057] like Figure 5As shown, a first plate 9 is manufactured, and a plurality of first substrates 1 are arranged at intervals on the first plate 9; the first plate 9 located below the first substrate 1 is punched to form an air avoidance area 91 for welding the second substrate 2, and the shape and size of the air avoidance area 91 are adaptively set according to the second substrate 2 to be welded; a single second substrate 2 is manufactured, and the first connecting portion 21 of the second substrate 2 is attached to the front surface of the first substrate 1, and the welding jig is used for positioning to determine the relative positions of the first substrate 1 and the second substrate 2, so that the first conductive member 11 corresponds to the second conductive member 23 and the orthographic projection of the first connecting portion 21 along the thickness direction of the first substrate 1 is located at the orthographic projection of the first substrate 1 along the thickness direction of the first substrate 1. On the inside, use a soldering iron tip and set its temperature to 320±20℃, and use a tin to solder the second connection part 22 of the second substrate 2 to the first substrate 1; at this time, the welding is completed and multiple matching first substrates 1 and second substrates 2 are all on the first plate 9, and then functional accessories such as the conduction control part 4 are attached to the back of the first substrate 1; the first substrate 1 and the second substrate 2 after welding are separated from the first plate 9 by punching to form a single flexible mother-child board; through a bending jig, the second connection part 22 is bent to a preset angle relative to the first connection part 21, and the bending angle between the two is set according to customer needs; the reinforcing plate 3 is attached to the front of the first substrate 1 to form a mother-child flexible circuit board.

[0058] In some embodiments of the present application, before bonding and connecting the reinforcing plate 3, the first colloid 5 is first bonded to the front side of the first substrate 1, and the first colloid 5 is a double-sided adhesive. Then, the reinforcing plate 3 is correspondingly bonded to the side of the first colloid 5 away from the first substrate 1, so as to achieve the bonding of the reinforcing plate 3 to the first substrate 1. Then, the second colloid 6 is bonded to the side of the reinforcing plate 3 away from the first substrate 1, and the second colloid 6 is also a double-sided adhesive. A first protective film 61 is provided on the side of the second colloid 6 away from the reinforcing plate 3 to protect the adhesive surface of the second colloid 6 away from the reinforcing plate 3. Then, a cold pressing jig is used to make the first colloid 5, the first substrate 1, the reinforcing plate 3, and the second colloid 6 fit tightly with each other at a pressure of 0.4±0.1Mpa and a pressing time of 20±5S.

[0059] In some embodiments of the present application, the third colloid 7 is attached to the side of the second connection portion 22 away from the third conductive member 24 , and a second protective film 71 is provided on the side of the third colloid 7 away from the second connection portion 22 . The second protective film 71 is provided to protect the adhesive surface of the third colloid 7 away from the second connection portion 22 .

[0060] The working process of the present invention is as follows: a first plate 9 is manufactured, on which a plurality of first substrates 1 are arranged at intervals; the first plate 9 located below the first substrate 1 is punched to form an air avoidance area 91 for welding the second substrate 2; a single second substrate 2 is manufactured, and the first connecting portion 21 of the second substrate 2 is bonded to the front surface of the first substrate 1, so that the first conductive member 11 corresponds to the second conductive member 23 and the positive projection of the first connecting portion 21 along the thickness direction of the first substrate 1 is located on the inner side of the positive projection of the first substrate 1 along the thickness direction of the first substrate 1, and then the first connecting portion 21 is welded to the first substrate 1; a conduction control member 4 is bonded to the back surface of the first substrate 1; the first substrate 1 and the second substrate 2 are separated from the first plate 9 after welding by punching to form a single mother-child board; a bending jig is used to bend at the connection between the second connecting portion 22 and the first connecting portion 21, and the bending is performed to a preset angle relative to the first connecting portion 21; a reinforcing plate 3 is bonded to the front surface of the first substrate 1 to form a mother-child flexible circuit board.

[0061] In summary, an embodiment of the present invention provides a mother-and-child flexible circuit board and a manufacturing method thereof. In this solution, the first substrate 1 and the second substrate 2 are divided into two separate components, and the first connection portion 21 of the second substrate 2 is welded to the first substrate 1, and the orthographic projection of the first connection portion 21 along the thickness direction of the first substrate 1 is located on the inner side of the orthographic projection of the first substrate 1 along the thickness direction of the first substrate 1. Subsequently, the second connection portion 22 is bent relative to the first connection portion 21 at the connection between the first connection portion 21 and the second connection portion 22, and bent to a preset angle; thereby, after the bonding of accessories such as the reinforcement plate 3 is completed, a gap is effectively avoided between the second substrate 2 and the bonding accessories such as the reinforcement plate 3, so that the assembled flexible circuit board has better airtightness, thereby meeting the sealing performance requirements of the terminal product.

[0062] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A mother-child flexible circuit board, characterized in that: include: A first substrate, wherein the first substrate has a front side and a back side disposed opposite to each other, and one or more first conductive members are disposed on the front side; A second substrate is matched with the first conductive member, the second substrate comprises a first connecting portion and a second connecting portion, the second connecting portion is connected to one end of the first connecting portion and is bent relative to the first connecting portion, the first connecting portion is connected to the front surface of the first substrate in affixed manner, and the orthographic projection of the first connecting portion along the thickness direction of the first substrate is located on the inner side of the orthographic projection of the first substrate along the thickness direction of the first substrate; the first connecting portion is provided with a second conductive member connected to the first conductive member, and the second connecting portion is provided with a third conductive member for connecting to an external circuit; the first conductive member, the second conductive member, and the third conductive member are connected in sequence and can form a loop with the external circuit; A reinforcing plate, coplanar with the first connecting portion and located outside the first connecting portion, the reinforcing plate being bonded and connected to the front surface of the first substrate; as well as The conduction control component is attached to the back surface of the first substrate and is used to control the conduction of the first conductive component.

2. The mother-child flexible circuit board according to claim 1, characterized in that: The mother-child flexible circuit board also includes a first colloid disposed between the first substrate and the reinforcing plate, and the first colloid connects the first substrate and the reinforcing plate.

3. The mother-child flexible circuit board according to claim 2, characterized in that: The mother-child flexible circuit board also includes a second colloid bonded to the side of the reinforcing plate away from the first substrate, and a first protective film is provided on the side of the second colloid away from the reinforcing plate.

4. The mother-child flexible circuit board according to claim 1, characterized in that: The mother-child flexible circuit board also includes a third colloid bonded to a side of the second connection portion away from the third conductive member, and a second protective film is provided on a side of the third colloid away from the second connection portion.

5. The mother-child flexible circuit board according to claim 3, characterized in that: The reinforcing plate, the first colloid, and the second colloid are all penetrated along the thickness direction thereof with a through hole for allowing the first connecting portion to pass through.

6. The mother-child flexible circuit board according to claim 1, characterized in that: The first conductive member includes two first contacts arranged at intervals, the second conductive member includes two second contacts arranged at intervals and connected to the first contacts respectively, the third conductive member includes two third contacts arranged at intervals and connected to the second contacts respectively, and the two third contacts are also used to connect the lead-in end and the lead-out end of the external circuit respectively; A first conductive ring connected to one of the first contacts is disposed on the back of the first substrate, and a second conductive ring coaxially disposed inside the first conductive ring and connected to another of the first contacts is disposed; The conduction control component includes a conductive disc arranged on the back side, the outer periphery of the conductive disc is connected to the first conductive ring, and the central area of ​​the conductive disc protrudes away from the back side to form a pressing portion, and the pressing portion is pressed toward the first substrate until it fits with the second conductive ring, so that the first conductive ring and the second conductive ring can be connected.

7. The mother-child flexible circuit board according to claim 6, characterized in that: The conduction control component further comprises a flexible film attached to the back of the first substrate, and a side of the flexible film facing the first substrate is provided with a receiving groove for embedding the conductive disc, so that the conductive disc is encapsulated between the flexible film and the first substrate.

8. A method for manufacturing a mother-child flexible circuit board according to any one of claims 1 to 7, characterized in that: The following steps are involved: Making a first plate, wherein the first plate has a plurality of first substrates arranged at intervals; Punching the first plate below the first substrate to form a clearance area for welding the second substrate; Manufacturing a second substrate, attaching a first connecting portion of the second substrate to the front surface of the first substrate, making the first conductive member correspond to the second conductive member and making the orthographic projection of the first connecting portion along the thickness direction of the first substrate be located inside the orthographic projection of the first substrate along the thickness direction of the first substrate, and then welding the first connecting portion to the first substrate; Laminating a conduction control component on the back side of the first substrate; Separating the first substrate and the second substrate after welding from the first plate; The second connecting portion is bent at a connection point between the second connecting portion and the first connecting portion, and is bent to a preset angle relative to the first connecting portion; A reinforcing plate is attached and connected to the front side of the first substrate to form a mother-child flexible circuit board.

9. The method for manufacturing a mother-child flexible circuit board according to claim 8, characterized in that: A first colloid is arranged between the first substrate and the reinforcing plate; a second colloid is attached to the side of the reinforcing plate away from the first substrate and a first protective film is arranged on the side of the second colloid away from the reinforcing plate; and pressure is applied by a cold pressing jig to make the reinforcing plate, the first substrate, the first colloid and the second colloid closely attached.

10. The method for manufacturing a mother-child flexible circuit board according to claim 8, characterized in that: A third colloid is attached to a side of the second connection portion away from the third conductive member, and a second protective film is provided on a side of the third colloid away from the second connection portion.

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