A method for manufacturing a high-precision semi-flexural rigid-flexible combined plate

Abstract

This invention discloses a method for manufacturing a high-precision semi-flexible rigid-flex board. The method involves sequentially fabricating a carrier board with a wet film pattern, a prepreg sheet with windows corresponding to the wet film pattern, and a core board with windows. A cover film is attached to one side of the board corresponding to the wet film pattern, and an adhesive layer is attached to the other side. The aforementioned board layers and copper layers are stacked and pressed together from top to bottom to form a laminated board. The aluminum sheet and adhesive layer on the surface of the laminated board are removed. A dry film pattern, a protective copper pattern, a solder resist pattern, an etched protective copper pattern, and a wet film pattern are then sequentially fabricated to form the high-precision semi-flexible rigid-flex board. By forming a process of first creating grooves, then filling the grooves, and then removing the filler, the method avoids the problem of difficult-to-control milling accuracy associated with depth-controlled milling. The cover film and adhesive layer provide protection for the bending layer, effectively preventing board surface contamination. The overall processing is simple, achieves high-precision machining, and improves the lifespan of the circuit board.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing, and more particularly to a method for manufacturing a high-precision semi-flexible rigid-flex board. Background Technology

[0002] For some three-dimensional assembly designs of circuit board application modules that do not require multiple bends, semi-flexible rigid-flex boards are usually used, that is, they need to be bent in a localized one-time process during installation and application.

[0003] The existing method for manufacturing semi-flexible rigid-flex boards is as follows: the boards are processed according to traditional multilayer circuit boards. In the forming process, a depth-controlled milling plate is used to mill away the non-retained layers in the bending area, leaving the layers that need to be bent and conduct, forming a locally "thinned" stepped structure. When installed and applied, the area where the layers are retained forms the flexural zone.

[0004] However, the existing manufacturing methods have certain drawbacks for circuit boards with relatively thin overall thickness. On the one hand, the precision of controlled-depth milling is difficult to meet the processing requirements of thin circuit boards, and problems such as milling too deep or too shallow are easy to occur. On the other hand, the prepreg in the reserved area after controlled-depth milling is exposed. When bending in subsequent applications, the prepreg is prone to cracks and breaks. After long-term use, the prepreg ages and is prone to shedding, exposing the internal copper layer circuits, causing the circuits to oxidize, thereby reducing the overall service life of the circuit board.

[0005] Therefore, in order to solve the problems mentioned in the background technology, it is necessary to provide a method for manufacturing a high-precision semi-flexible rigid-flex plate. Summary of the Invention

[0006] This invention aims to address the challenges of existing semi-flexible rigid-flex plates requiring thinness, high precision, and other comprehensive performance characteristics. It proposes a method for manufacturing a high-precision semi-flexible rigid-flex plate, comprising the following steps:

[0007] S10: Take an aluminum sheet, a first copper layer and an adhesive layer, and bond the aluminum sheet and the first copper layer together with the adhesive layer to form a board. Then, make a wet film pattern on the first copper layer to form a carrier board.

[0008] S20: Take a prepreg and make a prepreg window pattern corresponding to the wet film pattern to form a windowed prepreg; make a windowed core board with a core board window pattern, wherein the core board window pattern corresponds to the wet film pattern;

[0009] S30: Fabricate a bending layer, wherein the bending layer is a semi-cured sheet, a cover film is attached to the surface of the semi-cured sheet, and an adhesive layer is attached to the other side to form a bending plate;

[0010] The covering film corresponds to the window pattern of the core board;

[0011] S40: Take the second copper layer, and then stack the bearing plate, the windowed prepreg, the windowed core plate, the bending plate and the second copper layer from top to bottom to form a stacked structure, and then press them together to form a press plate;

[0012] The wet film pattern in the stacked structure is arranged opposite to the covering film;

[0013] The thickness of the wet film pattern in the laminate is equal to the sum of the thickness of the prepreg window pattern and the core board window pattern;

[0014] S50: Remove the aluminum sheet and adhesive layer from the press plate, and then apply dry film and create surface circuit patterns on the surface of the press plate in sequence to form a circuit pattern board.

[0015] The fabrication of the surface circuit pattern includes fabricating a first protective copper pattern corresponding to the wet film pattern;

[0016] S60: A solder resist pattern is formed on the surface of the circuit pattern board. The solder resist pattern includes forming a solder resist window pattern on the surface of the first protective copper pattern, then etching the first protective copper pattern, and then removing the wet film pattern to form the high-precision semi-flexible rigid-flex board.

[0017] Furthermore, the formation of the carrier plate involves: taking a thick copper layer and forming the wet film pattern on the surface of the thick copper layer to form the carrier plate; the formation of the circuit pattern board involves: thinning the thick copper layer to the thickness of the first copper layer, and then sequentially applying a dry film and forming a surface circuit pattern on the surface of the lamination board to form the circuit pattern board.

[0018] Furthermore, one side of the adhesive layer is larger than the window pattern of the core board.

[0019] Furthermore, the adhesive layer is made of micro-adhesive.

[0020] Furthermore, the process of fabricating the bent layer involves taking a single-sided copper-clad laminate and fabricating a bent copper layer pattern on its copper side corresponding to the wet film pattern, thereby forming the bent layer.

[0021] Furthermore, the thickness of the bent copper layer pattern is less than the thickness of the surface circuit pattern.

[0022] Furthermore, one side of the bent copper layer pattern is larger than the cover film.

[0023] Furthermore, one side of the covering film is larger than the window pattern of the core board.

[0024] Furthermore, the fabrication of the surface circuit pattern includes fabricating a second protective copper pattern in the region of the second copper layer corresponding to the adhesive layer, wherein one side of the second protective copper pattern is larger than the adhesive layer.

[0025] Furthermore, the removal of the wet film pattern involves creating a blue adhesive layer in the area outside the first protective copper pattern, etching the first protective copper pattern, removing the wet film pattern, and then peeling off the blue adhesive layer.

[0026] This invention's technical solution involves sequentially fabricating a carrier plate with wet film patterns, a core plate with corresponding wet film patterns and windows for each layer, and a bent plate with a cover film applied to the corresponding wet film patterns, all laminated together. This process forms a groove first, then fills the groove, and finally removes the filler. This effectively avoids the problems of difficulty in controlling precision and the risk of milling the bent plate, leading to processing failure, associated with the controlled-depth milling method. By setting the cover film and adhesive layer at the corresponding wet film patterns of the bent layer, the bent layer is protected, preventing cracks and breaks in the prepreg during bending applications, thus avoiding board surface contamination. The overall processing is simple, enables high-precision processing, and improves the lifespan of the circuit board. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the process flow of an embodiment of the present invention;

[0029] Figure 2 This is a cross-sectional schematic diagram of the stacked structure according to an embodiment of the present invention;

[0030] Figure 3 This is a schematic diagram of the cross-sectional structure of the pressing plate according to an embodiment of the present invention;

[0031] Figure 4 This is a schematic cross-sectional view of the circuit pattern board according to an embodiment of the present invention;

[0032] Figure 5 This is a schematic diagram of the cross-sectional structure of the high-precision semi-flexible rigid-flexible plate according to an embodiment of the present invention.

[0033] Explanation of icon numbers:

[0034]

[0035] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0037] It should be noted that all directional indications (such as up, down, left, right, front, back, inside, outside, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0038] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0040] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the process flow according to an embodiment of the present invention. Figure 2 This is a cross-sectional schematic diagram of the stacked structure according to an embodiment of the present invention.

[0041] The manufacturing process of this invention includes using Figure 1 The implementation of each step in the process will be described below. Figure 1 The process of each step will be explained step by step.

[0042] Step S10:

[0043] An aluminum sheet 1010, a first copper layer 1020, and an adhesive layer 1030 are taken. The aluminum sheet 1010 and the first copper layer 1020 are bonded together by the adhesive layer 1030 to form a board. Then, a wet film pattern 1040 is made on the first copper layer 1020 to form a carrier board 100. The aluminum sheet 1010 and the adhesive layer 1030 form a support structure for the first copper layer 1030. The ductility of the aluminum sheet 1010 is used to effectively spread the pressure, providing a flat and processable first copper layer 1020 for thinner circuit boards.

[0044] Another embodiment of forming the carrier plate 100 is as follows: a thick copper layer is taken, and a wet film pattern 1040 is made on the surface of the thick copper layer to form the carrier plate 100. Compared with using an aluminum sheet 1010 and a first copper layer 1020 to bond together to form a carrier plate 100 to provide load-bearing support, the processing of this embodiment is relatively simple. However, since the original design of the circuit board requires a thinner thickness, the thick copper layer needs to be reduced in the subsequent process of forming the circuit pattern board to meet the thin board design requirements of the circuit board. That is, the thick copper layer is reduced to the thickness of the first copper layer 1020, and then the surface of the lamination board 20 is sequentially processed by subsequent processes such as applying a dry film and making a surface circuit pattern 3010.

[0045] It is worth noting that the thickness of the aforementioned thick copper layer is less than or equal to 105 micrometers. This is to avoid a large difference in the thickness of the copper layers on the two surfaces, which could easily lead to severe warping of the laminated board 20 during subsequent lamination processes. On the other hand, the greater the thickness of the thick copper layer, the more etching solution is needed for copper reduction in subsequent processes, resulting in higher processing costs and more etching waste liquid, which would cause serious harm to the environment.

[0046] Furthermore, the adhesive layer 1030 is made of micro-adhesive, commonly epoxy resin or acrylic adhesive. It has uniform adhesion, which allows it to adhere to the aluminum sheet 1010 and the first copper layer 1020, preventing the carrier plate 100 from shifting during subsequent pressing processes and causing issues such as layer misalignment. On the other hand, during subsequent thickness reduction processes, the micro-adhesive does not completely adhere the aluminum sheet 1010 to the first copper layer 1020, making it easy to peel off and leaving little residue, effectively preventing tearing damage to the surface of the first copper layer 1020.

[0047] Step S20:

[0048] Take a prepreg and make a prepreg window pattern 2010 corresponding to the wet film pattern 1040 to form a windowed prepreg 200; make a windowed core board 300 with a core board window pattern 3110, the core board window pattern 3110 corresponding to the wet film pattern 1040.

[0049] In this embodiment, the windowed semi-cured sheet 200 and the windowed core board 300 are effectively matched by the corresponding core board window pattern 3110 and wet film pattern 1040. After subsequent pressing and bonding processes, a flat pressed board surface is formed, which effectively prevents problems such as pressing depressions and forms a solid circuit board structure.

[0050] It is worth noting that the adhesive strength of the windowed prepreg 200 is greater than that of the adhesive layer 1030, which ensures that the removal of the aluminum sheet 1010 and the adhesive layer 1030 in the subsequent process will not remove the first copper layer 1020 at the same time, and will not easily cause tearing damage to the first copper layer 1020, resulting in short circuits, circuit board processing failures, and other problems.

[0051] Step S30:

[0052] A bending layer 4010 is fabricated. The bending layer 4010 is a prepreg. A cover film 4020 is attached to the surface of the prepreg, and an adhesive layer 4030 is attached to the other side to form a bending plate 400. That is, a cover film 4020 and an adhesive layer 4030 are respectively attached to both sides of the bending layer 4010. Through the combination structure of the adhesive layer 4030 and the cover film 4020 attached to the top and bottom of the bending layer 4010, it plays a role in buffering bending stress and protecting the bending layer 4010 when bending is applied. At the same time, it provides a stable processing layer foundation for subsequent lamination processes and provides a bending foundation for circuit board applications.

[0053] Furthermore, the cover film 4020 corresponds to the core board window pattern 3110. That is, the cover film 4020 is attached to the area on the surface of the bent layer 4010 corresponding to the wet film pattern 1040. The press plate 20 formed by the subsequent pressing process achieves the effect of easy separation between the wet film pattern 1040 and the cover film 4020, and also provides a processing basis for the removal of the wet film pattern 1040 in the subsequent process.

[0054] In one embodiment, the bending layer 4010 is fabricated as follows: a single-sided copper-clad laminate is taken, and a bending copper layer pattern 4010A is fabricated on the wet film pattern 1040 corresponding to its copper side to form a bending layer; by setting the bending copper layer pattern 4010A and the cover film 4020 to form a double protection effect on the insulating dielectric layer 4010B, the insulating dielectric layer 4010B is prevented from tearing, flaking, and causing board surface contamination when it is bent.

[0055] Furthermore, the thickness of the bent copper layer pattern 4010A is less than the thickness of the surface circuit pattern 3010. The thinner design of the bent copper layer pattern 4010A serves two purposes: firstly, the thinner bent copper layer pattern 4010A is easier to bend, resulting in better bendability during application; secondly, the addition of the bent copper layer pattern 4010A is equivalent to adding a core layer, and the increased copper layer thickness provides some support for bending, thereby increasing the bending force and stability after a single bend.

[0056] Furthermore, the bent copper layer pattern 4010A is larger on one side than the cover film 4020, forming a structure in which the bent copper layer pattern 4010A penetrates deep into the circuit board. This avoids the problem of the edge of the bent copper layer pattern 4010A lifting up when bending it in later applications, which would cause the cover film 4020 to bulge locally or even tear, causing contamination to the surface of the circuit board.

[0057] Furthermore, the cover film 4020 is larger on one side than the core board window pattern 3110, forming a structure in which the cover film 4020 penetrates deep into the circuit board. The cover film 4020 is made of PI material, which has high reliability, good flexibility, and is not prone to cracking or chipping. It has a long service life and protects the bending layer 4010, preventing the bending layer 4010 from tearing or chipping during bending, thus avoiding problems such as board surface contamination. This has the effect of extending the service life of the circuit board.

[0058] Furthermore, the adhesive layer 4030 is larger on one side than the core board window pattern 3110, forming a structure in which the adhesive layer 4030 penetrates deep into the circuit board. The adhesive properties of the adhesive layer 4030 are used to disperse stress during bending, avoiding stress concentration that could cause the bending layer 4010 to break, thereby improving the bending stability of the circuit board and the reliability of the circuit board application.

[0059] In this embodiment, when the cover film 4020, the bent copper pattern 4010A and the adhesive layer 4030 are provided simultaneously, the three can be configured to form a "stepped" structure in which each side is smaller than the lower layer board from top to bottom. This can reduce the drop of the stacked layers, make the board surface after lamination flatter, and buffer the pressure on the edge of the bent layer 4010 during folding applications, thereby improving the stability of the circuit board structure.

[0060] Please see Figure 3 , Figure 3 This is a schematic diagram of the cross-sectional structure of the pressing plate according to an embodiment of the present invention.

[0061] Step S40:

[0062] The second copper layer 500 is taken, and then the carrier plate 100, the windowed prepreg 200, the windowed core board 300, the bending plate 400, and the second copper layer 500 are stacked sequentially from top to bottom to form a stacked structure 10. These are then pressed together to form a pressing plate 20. The second copper layer 500 and the aluminum sheet 1010 provide a complete pressing surface for the pressing process, ensuring uniform stress distribution on the circuit board during pressing. This avoids deformation of the circuit board due to uneven stress caused by uneven pressing surfaces, preventing processing problems such as bending or warping.

[0063] Furthermore, the wet film pattern 1040 in the stacked structure 10 is positioned opposite to the cover film 4020, providing a basis for the subsequent process to remove the wet film pattern 1040.

[0064] Furthermore, the thickness of the wet film pattern 1040 in the press plate 20 is equal to the sum of the thicknesses of the prepreg window pattern 2010 and the core board window pattern 3110, ensuring the flatness of the surface of the press plate 20 and the formation of a tightly pressed structure among the core boards in the press plate 20. If the thickness of the wet film pattern 1040 is large, but the sum of the thicknesses of the prepreg window pattern 2010 and the core board window pattern 3110 is small, it may easily lead to problems such as local bulging of the press plate 20.

[0065] It is worth noting that the prepreg is made of epoxy resin composite glass fiber, ceramic powder composite epoxy resin, polyimide or polytetrafluoroethylene, and different performance materials can be selected according to different application scenarios and needs.

[0066] Please see Figure 4 , Figure 4 This is a schematic cross-sectional view of the circuit pattern board according to an embodiment of the present invention.

[0067] Step S50:

[0068] Remove the aluminum sheet 1010 and adhesive layer 1030 from the laminating plate 20, and then apply dry film and create surface circuit pattern 3010 on the surface of the laminating plate 20 to form circuit pattern board 30. That is, the aluminum sheet 1010 and adhesive layer 1030 are auxiliary processing layers that need to be removed after lamination to expose the first copper layer 1020, which provides a surface copper layer base for etching copper patterns in the subsequent process.

[0069] Furthermore, the fabrication of the surface circuit pattern 3010 includes fabricating a first protective copper pattern 3010A corresponding to the wet film pattern 1040. The first protective copper pattern 3010A is used to protect the tank and the wet film pattern 1040, prevent ink or chemicals from entering during subsequent processing, and provide a smoother processable board surface.

[0070] In one embodiment, fabricating the surface circuit pattern 3010 includes fabricating a second protective copper pattern 3010B in the area of ​​the second copper layer 500 corresponding to the adhesive layer 4030, wherein one side of the second protective copper pattern 3010B is larger than the adhesive layer. When the area of ​​the adhesive layer 4030 corresponding to the second copper layer 500 is not covered by circuit patterns or has a small number of circuit patterns, the second protective copper pattern 3010B can be fabricated in that area. On the one hand, the combination of the second protective copper pattern 3010B and the adhesive layer 4030 can enhance the mechanical strength of the circuit board and protect the circuit board from damage during bending, thereby enhancing the stability of the circuit board. On the other hand, it enables the circuit board to better withstand stress during bending, reducing the risk of copper layer breakage or detachment caused by bending, thereby extending the service life of the circuit board.

[0071] Please see Figure 5 , Figure 5 This is a schematic diagram of the cross-sectional structure of the high-precision semi-flexible rigid-flexible plate according to an embodiment of the present invention.

[0072] Step S60:

[0073] A solder mask pattern 3020 is fabricated on the surface of the circuit pattern board 30. The solder mask pattern 3020 includes a solder mask window pattern 3020A fabricated on the surface of the first protective copper pattern 3010A to expose the first protective copper pattern 3010A, providing a processing basis for subsequent etching of the first protective copper pattern 3010A and the dehumidification film pattern 1040. After etching the first protective copper pattern 3010A, the dehumidification film pattern 1040 is removed to form a high-precision semi-flexible rigid-flex board 40.

[0074] It is worth noting that the solder resist pattern 3020 is made of flexible solder resist ink. On the one hand, flexible solder resist ink has good insulation properties, which can effectively isolate the circuit from the outside world, prevent short circuits and circuit damage, and play a role in protecting the circuit. On the other hand, flexible solder resist ink is flexible and will not affect the bending of the high-precision semi-flexible rigid-flex plate 40 during application.

[0075] Since a stripping solution is required when removing the wet film pattern 1040, and the stripping solution will react with the solder resist pattern 3020, the removal of the wet film pattern 1040 in this embodiment is as follows: a blue adhesive layer is made in the area outside the first protective copper pattern 3010A. The blue adhesive layer does not react with the stripping solution and plays a role in protecting the solder resist pattern 3020. Then the first protective copper pattern 3010A is etched, the wet film pattern 1040 is removed, and then the blue adhesive layer is peeled off to form a high-precision semi-flexible rigid-flex board 40.

[0076] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing a high-precision semi-flexible rigid-flexible composite plate, characterized in that, The manufacturing method includes the following steps: S10: Take an aluminum sheet, a first copper layer and an adhesive layer, and bond the aluminum sheet and the first copper layer together with the adhesive layer to form a board. Then, make a wet film pattern on the first copper layer to form a carrier board. S20: Take a prepreg and make a prepreg window pattern corresponding to the wet film pattern to form a windowed prepreg; make a windowed core board with a core board window pattern, wherein the core board window pattern corresponds to the wet film pattern; S30: Fabricate a bending layer, wherein the bending layer is a semi-cured sheet, a cover film is attached to the surface of the semi-cured sheet, and an adhesive layer is attached to the other side to form a bending plate; The covering film corresponds to the window pattern of the core board; S40: Take the second copper layer, and then stack the bearing plate, the windowed prepreg, the windowed core plate, the bending plate and the second copper layer from top to bottom to form a stacked structure, and then press them together to form a press plate; The wet film pattern in the stacked structure is arranged opposite to the covering film; The thickness of the wet film pattern in the laminate is equal to the sum of the thickness of the prepreg window pattern and the core board window pattern; S50: Remove the aluminum sheet and adhesive layer from the press plate, and then apply dry film and create surface circuit patterns on the surface of the press plate in sequence to form a circuit pattern board. The fabrication of the surface circuit pattern includes fabricating a first protective copper pattern corresponding to the wet film pattern; S60: A solder resist pattern is formed on the surface of the circuit pattern board. The solder resist pattern includes forming a solder resist window pattern on the surface of the first protective copper pattern, then etching the first protective copper pattern, and then removing the wet film pattern to form the high-precision semi-flexible rigid-flex board.

2. The method for manufacturing a high-precision semi-flexible rigid-flexible composite plate as described in claim 1, characterized in that, The formation of the carrier board is as follows: a thick copper layer is taken, and the wet film pattern is made on the surface of the thick copper layer to form the carrier board; the formation of the circuit pattern board is as follows: the thick copper layer is thinned to the thickness of the first copper layer, and then a dry film is applied to the surface of the lamination board and a surface circuit pattern is made to form the circuit pattern board.

3. The method for manufacturing a high-precision semi-flexible rigid-flexible composite plate as described in claim 1, characterized in that, The adhesive layer is larger on one side than the window pattern of the core board.

4. The method for manufacturing a high-precision semi-flexible rigid-flexible composite plate as described in claim 1, characterized in that, The adhesive layer is made of micro-adhesive.

5. The method for manufacturing a high-precision semi-flexible rigid-flexible composite plate as described in claim 1, characterized in that, The process of creating the bent layer involves taking a single-sided copper-clad laminate and creating a bent copper layer pattern on its copper side corresponding to the wet film pattern, thereby forming the bent layer.

6. The method for manufacturing a high-precision semi-flexible rigid-flexible composite plate as described in claim 5, characterized in that, The thickness of the bent copper layer pattern is less than the thickness of the surface circuit pattern.

7. The method for manufacturing a high-precision semi-flexible rigid-flexible composite plate as described in claim 5, characterized in that, The bent copper layer pattern is larger on one side than the cover film.

8. A method for manufacturing a high-precision semi-flexible rigid-flexible composite plate as described in claim 1 or 7, characterized in that, The cover film is larger on one side than the window pattern of the core board.

9. The method for manufacturing a high-precision semi-flexible rigid-flexible composite plate as described in claim 1, characterized in that, The process of creating a surface circuit pattern includes creating a second protective copper pattern in the region of the second copper layer corresponding to the adhesive layer, wherein one side of the protective copper pattern is larger than the adhesive layer.

10. The method for manufacturing a high-precision semi-flexible rigid-flexible composite plate as described in claim 1, characterized in that, The process of removing the wet film pattern involves creating a blue adhesive layer in the area outside the first protective copper pattern, etching the first protective copper pattern, removing the wet film pattern, and then peeling off the blue adhesive layer.

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