Phase change type temperature control system and electronic component detection equipment and method

Abstract

The invention discloses a phase change type temperature control system and an electronic component detection device and method. In one embodiment, the system utilizes a temperature control fluid chamber containing a temperature control fluid, such that the temperature control fluid covers at least a portion of at least one surface of an electronic component. When the temperature of the electronic element reaches the boiling point of the temperature control fluid, the temperature control fluid is changed into steam, heat energy is transferred out of the temperature control fluid and condensed on the inner surface of the fluid containing cavity, and the steam heat energy is further transferred to the temperature controller. And the condensed temperature control fluid flows back to the temperature control fluid, so that the temperature control fluid is circulated.

Description

Technical Field

[0001] The present invention relates to a phase change temperature control system, electronic component detection equipment and method, and in particular to a temperature control system utilizing fluid phase change, and electronic component detection equipment and method having the system. Background Art

[0002] Electronic components are tested for function or characteristics before leaving the factory to ensure the quality of the product. However, during the testing process, since electronic components will generate heat, most testing equipment will be equipped with temperature control measures for electronic components.

[0003] like Figure 1 As shown, Figure 1 It is a cross-sectional schematic diagram of an existing electronic component testing device with temperature control means. The electronic component C to be tested is accommodated in a wafer seat S, and a pressing mechanism PM is used above the wafer seat S to press against the electronic component C to ensure that the electronic component C can be in complete contact with the probe in the wafer seat. Furthermore, in the prior art, the temperature control means is set in the pressing mechanism PM, which cools the electronic component C by heat conduction. However, as the functions of the electronic component C become more and more powerful, the power consumed is getting higher and higher, and the temperature during the test is also relatively greatly increased. The existing cooling form of heat conduction by contact with the pressing mechanism PM seems to be unable to meet the testing requirements of high-power electronic components C.

[0004] In addition, the concept of heterogeneous integration (Heterogeneous Integration Design Architecture System, HIDAS) has become the mainstream of existing semiconductor packaging technology. This technology mainly integrates a variety of different chips, such as memory and logic chips, optoelectronic and electronic components, through packaging, 3D stacking and other technologies. However, this will also cause the surface height of the semiconductor package to vary, which directly leads to the inability of the downward pressure mechanism to fully contact the entire surface of the semiconductor package, thereby affecting the heat dissipation efficiency. Summary of the invention

[0005] In view of this, an embodiment of the present invention provides a phase change temperature control system and an electronic component detection device equipped with the system, which can utilize fluid to directly contact electronic components and control the temperature of the electronic components through a cycle process of two phase changes of the fluid, which will effectively improve the temperature control efficiency and significantly reduce energy consumption.

[0006] A phase-change temperature control system according to an embodiment of the present invention includes a temperature controller, a temperature-control fluid supply module, a temperature-control fluid recovery module, and a controller; the temperature controller includes a temperature-control fluid storage chamber, which covers at least a portion of at least one surface of an electronic component; the controller is electrically connected to the temperature controller, the temperature-control fluid supply module, and the temperature-control fluid recovery module. The controller controls the temperature-control fluid supply module to supply a temperature-control fluid into the temperature-control fluid storage chamber; in response to the temperature of the electronic component being greater than or equal to the boiling point of the temperature-control fluid, the temperature-control fluid evaporates in the temperature-control fluid storage chamber and condenses on the inner surface of the temperature-control fluid storage chamber; the controller controls the temperature-control fluid recovery module to recover the temperature-control fluid from the temperature-control fluid storage chamber.

[0007] An electronic component detection method according to an embodiment of the present invention comprises the following steps: first, a temperature-controlled fluid supply module provides a temperature-controlled fluid to a temperature-controlled fluid chamber, the temperature-controlled fluid chamber covering at least a portion of at least one surface of an electronic component; second, the electronic component is tested; and finally, a temperature-controlled fluid recovery module recovers the temperature-controlled fluid from the temperature-controlled fluid chamber. In the process of testing the electronic component, in response to the temperature of the electronic component being greater than or equal to the boiling point of the temperature-controlled fluid, the temperature-controlled fluid evaporates in the temperature-controlled fluid chamber and condenses on the inner surface of the temperature-controlled fluid chamber.

[0008] An electronic component detection device according to an embodiment of the present invention includes a test seat, a temperature controller, a temperature-controlled fluid supply module, a temperature-controlled fluid recovery module and a controller; the test seat includes a wafer container, which is suitable for accommodating electronic components; the lower surface of the temperature controller includes a liquid container; the controller electrically connects the test seat, the temperature controller, the temperature-controlled fluid supply module and the temperature-controlled fluid recovery module. The controller controls the temperature controller to contact the electronic component, and the liquid container and the upper surface of the electronic component form a temperature-controlled fluid container; the controller controls the temperature-controlled fluid supply module to supply the temperature-controlled fluid into the temperature-controlled fluid container; and in response to the temperature of the electronic component being greater than or equal to the boiling point of the temperature-controlled fluid, the temperature-controlled fluid evaporates in the temperature-controlled fluid container and condenses on the inner surface of the temperature-controlled fluid container; and the controller controls the temperature-controlled fluid recovery module to recover the temperature-controlled fluid from the temperature-controlled fluid container.

[0009] In summary, the temperature control principle adopted by the phase change temperature control system and the electronic component detection equipment equipped with the system according to some embodiments is to use the temperature control fluid to directly contact the electronic components of the temperature controlled object, and when the temperature of the electronic components reaches the boiling point of the temperature control fluid, the temperature control fluid changes into steam and transfers the heat energy from the temperature control fluid itself. Furthermore, the steam condenses on the inner surface of the temperature control fluid cavity, and further transfers the steam heat energy to the temperature controller; the condensed temperature control fluid flows back to the temperature control fluid, thereby the cycle continues. Accordingly, through the two phase changes of the temperature control fluid, the heat generated by the electronic components can be quickly and effectively transferred to the temperature controller, thereby achieving excellent heat conduction efficiency.

[0010] Moreover, due to the strong permeability of the temperature control fluid, it can penetrate into any gap between chips. Therefore, even when facing 2.5D or 3D packaged electronic components, it can completely cover the highly uneven surfaces of the electronic components, thereby achieving comprehensive and complete temperature control, which can significantly improve the temperature control efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a cross-sectional schematic diagram of an existing electronic component testing device with temperature control means.

[0012] Figure 2 It is a system architecture diagram of an embodiment of an electronic component detection device of the present invention.

[0013] Figure 3 It is a schematic diagram of an embodiment of an electronic component detection device of the present invention.

[0014] Figure 4 It is a cross-sectional schematic diagram of the first embodiment of the test station of the present invention.

[0015] Figure 5 It is a cross-sectional schematic diagram of a second embodiment of a test station of the present invention.

[0016] Figure 6 It is a cross-sectional schematic diagram of a third embodiment of a test station of the present invention.

[0017] Wherein, the reference numerals are:

[0018] 1: Testing Station

[0019] 2: Test socket

[0020] 3: Thermostat

[0021] 4: Temperature control fluid supply module

[0022] 5: Temperature Control Fluid Recovery Module

[0023] 6: Controller

[0024] 7: Filter

[0025] 8: Heat exchanger

[0026] 9: Liquid storage tank

[0027] 21: Wafer trough

[0028] 22: Fluid inlet channel

[0029] 23: Fluid outlet channel

[0030] 31: Liquid storage tank

[0031] 32: Ring frame convex wall

[0032] 321: Fluid inlet

[0033] 322: Fluid outlet

[0034] A: Atmosphere

[0035] C: Electronic components

[0036] Cf: Temperature control fluid chamber

[0037] F: Temperature control fluid

[0038] G: Groove

[0039] P: Fluid pipeline

[0040] PH: Pressure probe

[0041] PM: Pressing mechanism

[0042] S: Wafer holder

[0043] V: Solenoid valve DETAILED DESCRIPTION

[0044] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention.

[0045] Please also see Figure 2 and Figure 3 , Figure 2 is a system architecture diagram of an embodiment of an electronic component detection device of the present invention, Figure 3 Schematic diagram of an embodiment of the electronic component testing device of the present invention. In one embodiment, the device may include a test socket 2, a temperature controller 3, a temperature control fluid supply module 4, a temperature control fluid recovery module 5, a controller 6, a filter 7, a heat exchanger 8, a liquid storage tank 9 and a solenoid valve V; the controller 6 is electrically connected to the test socket 2, the temperature controller 3, the temperature control fluid supply module 4, the temperature control fluid recovery module 5 and the solenoid valve V, and controls the operation of these components.

[0046] Furthermore, the temperature-controlled fluid supply module 4, the temperature-controlled fluid recovery module 5, the filter 7, the heat exchanger 8, the liquid storage barrel 9 and the solenoid valve V form a closed fluid circulation loop with the test station 1 through the fluid pipeline P. The test station 1 is composed of the test seat 2 and the temperature controller 3. Among them, the temperature-controlled fluid supply module 4 and the temperature-controlled fluid recovery module 5 can each be a pump. The temperature-controlled fluid supply module 4 is used to draw the temperature-controlled fluid F from the liquid storage barrel 9 and pump it to the test station 1, while the temperature-controlled fluid recovery module 5 sucks the temperature-controlled fluid F from the test station 1.

[0047] In other embodiments, the temperature control fluid supply module 4 is not limited to a pump, and any mechanism or device that can supply the temperature control fluid F to the test station 1 is included, such as using gas pressure or gravity to transport water. Similarly, in other embodiments, the temperature control fluid supply module 4 is not limited to a pump, and any mechanism or device that can recover the temperature control fluid F from the test station 1 is included, such as using gas pressure to drain water or using negative pressure to drain water.

[0048] The controller 6 is any single or multiple processor computing device or system capable of executing computer readable instructions, examples include but are not limited to: a workstation, a laptop, a client terminal, a server, a distributed computing system, a handheld device or any other computing system or device. In its most basic configuration, the controller 6 may include at least one processor and system memory.

[0049] In one embodiment, the temperature control fluid F can be selected from electronic engineering fluids with low boiling points, such as 3M Fluorinert FC-72 (boiling point of 56°C), 3M Novec Fluids 7000 (boiling point of 34°C), or 3M Novec Fluids 7100 (boiling point of 61°C), but is not limited to this. As long as the working fluid can achieve phase change within a relatively low temperature range (90°C) and take away a large amount of heat energy during the phase change process, it can be applied to the present invention.

[0050] The filter 7 is used to filter foreign matter such as impurities or dust in the temperature control fluid F; the heat exchanger 8 is used to perform heat exchange on the temperature control fluid F, for example, to cool the temperature control fluid F; the liquid storage tank 9 is used to store the temperature control fluid F. The solenoid valve V can be controlled to switch so that the test station 1 is connected to the fluid pipeline P or the atmosphere A; its function is that when the temperature control fluid supply module 4 supplies the temperature control fluid F to the test station 1, the solenoid valve V is controlled to switch so that the test station 1 is connected to the fluid pipeline P, and when the temperature control fluid recovery module 5 wants to recover the temperature control fluid F from the test station 1, the solenoid valve V is controlled to switch so that the test station 1 is connected to the atmosphere A.

[0051] Please also read Figure 4 , which is a cross-sectional schematic diagram of the first embodiment of the test station 1 of the present invention; as shown in the figure, the test socket 2 includes a chip receiving groove 21, which is suitable for accommodating an electronic component C and testing the electronic component C; the test socket 2 can be provided with a plurality of probes for electrically contacting the contacts or solder balls on the bottom surface of the electronic component C.

[0052] The temperature controller 3 may be disposed in a pressure probe PH, and the pressure probe PH may be controlled by the controller 6 to approach the electronic component C on the pressure test seat 2. The temperature controller 3 may be a high temperature generator or a low temperature generator, which may include but is not limited to a resistive heat source, a thermoelectric cooling module (TEC), or other devices using a temperature control fluid F. In one embodiment, the temperature controller 3 may be used as a condenser, such as a circuitous flow channel in which a refrigerant flows in the pressure probe PH, and the refrigerant may be liquid nitrogen, ethylene glycol, halogenated hydrocarbons, ammonia, sulfur dioxide, methane or other low temperature fluids.

[0053] Furthermore, in one embodiment, the lower surface of the temperature controller 3 includes a liquid containing groove 31, whose opening faces the test socket 2, and the liquid containing groove 31 can form a temperature control fluid containing cavity Cf with the upper surface of the electronic component C. Further, the lower surface of the temperature controller 3 includes a ring frame convex wall 32, and the liquid containing groove 31 is formed inside thereof, and the corresponding two sides of the ring frame convex wall 32 are provided with a fluid inlet 321 and a fluid outlet 322.

[0054] The operation flow of the first embodiment is described below. First, the controller 6 controls the pressure probe PH to drop, and the ring frame convex wall 32 on the lower surface of the temperature controller 3 applies force to press down the electronic component C. At this time, the liquid containing tank 31 and the upper surface of the electronic component C form a temperature control fluid containing cavity Cf. In other embodiments, a sealing member (not shown in the figure), such as an O-ring, a rubber pad, etc., can be attached to the lower surface of the ring frame convex wall 32 to ensure the sealing effect of the temperature control fluid containing cavity Cf.

[0055] Furthermore, the controller 6 controls the temperature control fluid supply module 4 to supply the temperature control fluid F into the temperature control fluid chamber Cf through the fluid inlet 321. The supply of the temperature control fluid F can be stopped when a specific amount of the temperature control fluid F is reached, for example, when the temperature control fluid F occupies 60% of the volume of the temperature control fluid chamber Cf, without completely filling the entire temperature control fluid chamber Cf.

[0056] Next, the controller 6 controls the test socket 2 to start testing the electronic component C; however, during the test, the electronic component C will generate heat, and when the temperature of the electronic component C reaches the boiling point of the temperature control fluid F, the temperature control fluid F evaporates in the temperature control fluid cavity Cf and expands rapidly, transferring heat energy from the temperature control fluid F itself, and the vapor phase temperature control fluid F will quickly fill the entire temperature control fluid cavity Cf. When the vapor phase temperature control fluid F contacts an area with a lower temperature, such as the inner surface of the temperature control fluid cavity Cf, especially the upper surface of the cavity, condensation will occur, and the heat accumulated during evaporation will be released through condensation. The condensed liquid phase temperature control fluid F will flow back to the liquid temperature control fluid F below under the influence of gravity, and this operation will be repeated in the temperature control fluid cavity Cf.

[0057] When the test is completed, the solenoid valve V is controlled by the controller 6 to switch the fluid inlet 321 to the atmosphere A, and control the start of the temperature control fluid recovery module 5 to start sucking the temperature control fluid F, and then recover the temperature control fluid F from the temperature control fluid chamber Cf through the fluid outlet 322. After the temperature control fluid F is recovered, the controller 6 controls the pressure probe PH to rise, and then the next electronic component C can be replaced for testing.

[0058] As can be seen from the above description, in the first embodiment, the temperature control fluid cavity Cf covers most of the upper surface of the electronic component C, so the temperature of the electronic component C can be effectively controlled, at least the temperature of the electronic component C can be roughly maintained near the boiling point of the temperature control fluid F, and when the temperature control fluid F changes phase for the first time, that is, it boils and evaporates from the liquid state to the vapor state, heat can be taken away from the liquid temperature control fluid F; and when the temperature control fluid F changes phase for the second time, that is, it cools and condenses from the vapor state to the liquid state, the heat in the vapor can be transferred to the temperature controller 3. Accordingly, the temperature control fluid F can provide excellent heat conduction efficiency and heat dissipation efficiency after two phase changes.

[0059] See also Figure 5 , which is a cross-sectional schematic diagram of a second embodiment of the test station of the present invention; in the embodiment shown in the figure, the test seat 2 further includes a fluid inlet channel 22 and a fluid outlet channel 23, the fluid inlet channel 22 is coupled to the temperature-controlled fluid supply module 4, and the fluid outlet channel 23 is coupled to the temperature-controlled fluid recovery module 5. Moreover, the fluid inlet channel 22 and the fluid outlet channel 23 can be arranged on two corresponding sides of the bottom of the wafer receiving tank 21, and the number can be single or multiple.

[0060] During the test, the controller 6 controls the temperature-control fluid supply module 4 to supply the temperature-control fluid F to the wafer tank 21 through the fluid inlet channel 22, and controls the temperature-control fluid recovery module 5 to recover the temperature-control fluid F from the wafer tank 21 through the fluid outlet channel 23. In other words, during the entire test, the temperature-control fluid F circulates continuously in the wafer tank 21, which is different from the continuous phase change of the temperature-control fluid F in the temperature-control fluid chamber Cf.

[0061] However, the specific technical means for allowing the temperature-controlled fluid F to circulate continuously in the wafer container 21 is to configure the fluid inlet channel 22 and the fluid inlet 321 as different fluid passages, and use a solenoid valve (not shown) to switch. That is, when the temperature-controlled fluid chamber Cf contains enough temperature-controlled fluid F, the solenoid valve switches to connect the fluid inlet channel 22 to the temperature-controlled fluid supply module 4. Similarly, the fluid outlet channel 23 and the fluid outlet channel 23 can also be configured in the same way. In addition, a plurality of grooves G are provided on the inner top surface of the temperature-controlled fluid chamber Cf, the purpose of which is not only to increase the heat exchange area and improve the condensation efficiency, but also to increase the speed of the condensed liquid reflux.

[0062] In general, in the second embodiment, the temperature control means on the upper surface of the electronic component C is still achieved by the phase change of the temperature control fluid F, which belongs to two-phase cooling; while the temperature control means on the lower surface of the electronic component C is simply achieved by the circulating temperature control fluid F, which belongs to single-phase cooling. In this way, the present embodiment can provide temperature control means for both the upper and lower surfaces of the electronic component C, thereby achieving an excellent temperature control effect. In addition, in other embodiments, the temperature control means provided on the lower surface of the electronic component C is not limited to the liquid temperature control fluid F, and other different fluids or gases may also be used, such as compressed air, nitrogen or carbon dioxide after low temperature adjustment.

[0063] See also Figure 6 , which is a cross-sectional schematic diagram of the third embodiment of the test station 1 of the present invention; in this embodiment, the temperature-controlled fluid chamber Cf is formed by the wafer chamber 21 of the test seat 2 and the lower surface of the temperature controller 3. Therefore, before testing the electronic component C, since the electronic component C is entirely located in the temperature-controlled fluid chamber Cf, when the controller 6 controls the temperature-controlled fluid supply module 4 to supply the temperature-controlled fluid F to the temperature-controlled fluid chamber Cf through the fluid inlet channel 22, the electronic component C is completely immersed in the temperature-controlled fluid F, so comprehensive temperature control can be provided.

[0064] In summary, in various embodiments of the present invention, in addition to using the temperature control fluid F to perform a two-phase physical phase change on a single surface of the electronic component C to dissipate heat, the temperature control fluid F can also be forced to flow on another surface of the electronic component C to perform single-phase cooling. In addition, the electronic component C can also be completely immersed in the temperature control fluid F, and the temperature control fluid F can be directly and completely in contact with the electronic component C to conduct heat energy, thereby achieving an immersive temperature control effect.

[0065] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Any person having ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.

Claims

1. A phase change temperature control system, characterized in that: It includes: A temperature controller comprising a temperature control fluid chamber, the temperature control fluid chamber covering at least a portion of at least one surface of an electronic component; a temperature-controlled fluid supply module; a temperature-controlled fluid recovery module; as well as a controller electrically connected to the temperature controller, the temperature-control fluid supply module and the temperature-control fluid recovery module; Wherein, the controller controls the temperature control fluid supply module to supply a temperature control fluid into the temperature control fluid chamber; in response to the temperature of the electronic component being greater than or equal to the boiling point of the temperature control fluid, the temperature control fluid evaporates in the temperature control fluid chamber and condenses on an inner surface of the temperature control fluid chamber; the controller controls the temperature control fluid recovery module to recover the temperature control fluid from the temperature control fluid chamber.

2. The phase change temperature control system according to claim 1, characterized in that: The lower surface of the temperature controller includes a liquid containing tank, and the liquid containing tank is suitable for forming the temperature control fluid containing cavity with the upper surface of the electronic component.

3. The phase change temperature control system according to claim 2, characterized in that: The lower surface of the temperature controller includes a ring frame convex wall, and the liquid containing groove is formed on the inner side of the ring frame convex wall; the ring frame convex wall is provided with a fluid inlet and a fluid outlet; the temperature control fluid supply module supplies the temperature control fluid to the temperature control fluid containing cavity through the fluid inlet, and the temperature control fluid recovery module draws the temperature control fluid from the temperature control fluid containing cavity through the fluid outlet.

4. A method for detecting an electronic component, characterized in that: It includes the following steps: (A) a temperature-control fluid supply module provides a temperature-control fluid into a temperature-control fluid chamber, the temperature-control fluid chamber covering at least a portion of at least one surface of an electronic component; (B) testing the electronic component; and (C) a temperature control fluid recovery module recovers the temperature control fluid from the temperature control fluid chamber; Wherein, in the step (B), in response to the temperature of the electronic component being greater than or equal to the boiling point of the temperature control fluid, the temperature control fluid evaporates in the temperature control fluid chamber and condenses on an inner surface of the temperature control fluid chamber.

5. The electronic component detection method according to claim 4, characterized in that: In the step (A), a temperature controller contacts the electronic component, and the temperature controller includes a liquid containing tank, which is suitable for forming the temperature control fluid containing cavity with the at least one surface of the electronic component.

6. The electronic component detection method according to claim 5, characterized in that: The lower surface of the temperature controller includes a ring frame convex wall, and the liquid containing groove is formed on the inner side of the ring frame convex wall; the ring frame convex wall is provided with a fluid inlet and a fluid outlet; the temperature control fluid supply module supplies the temperature control fluid to the temperature control fluid containing cavity through the fluid inlet, and the temperature control fluid recovery module draws the temperature control fluid from the temperature control fluid containing cavity through the fluid outlet.

7. The electronic component detection method according to claim 4, characterized in that: In the step (A), the electronic component is entirely located in the temperature-controlled fluid chamber.

8. An electronic component testing device, characterized in that: It includes: A test socket, comprising a wafer receiving slot, suitable for receiving an electronic component; A temperature controller, the lower surface of which includes a liquid tank; a temperature-controlled fluid supply module; a temperature-controlled fluid recovery module; as well as a controller electrically connected to the test socket, the temperature controller, the temperature-controlled fluid supply module and the temperature-controlled fluid recovery module; The controller controls the temperature controller to contact the electronic component, and the liquid tank and the upper surface of the electronic component form a temperature-controlled fluid cavity; the controller controls the temperature-controlled fluid supply module to supply a temperature-controlled fluid into the temperature-controlled fluid cavity; in response to the temperature of the electronic component being greater than or equal to the boiling point of the temperature-controlled fluid, the temperature-controlled fluid evaporates in the temperature-controlled fluid cavity and condenses on an inner surface of the temperature-controlled fluid cavity; the controller controls the temperature-controlled fluid recovery module to recover the temperature-controlled fluid from the temperature-controlled fluid cavity.

9. The electronic component testing device according to claim 8, characterized in that: The test seat further includes a fluid inlet channel and a fluid outlet channel; the controller controls the temperature-controlled fluid supply module to supply the temperature-controlled fluid to the chip container through the fluid inlet channel, and controls the temperature-controlled fluid recovery module to recover the temperature-controlled fluid from the chip container through the fluid outlet channel.

10. The electronic component testing device according to claim 8, characterized in that: The lower surface of the temperature controller includes a ring frame convex wall, and the liquid containing groove is formed on the inner side of the ring frame convex wall; the ring frame convex wall is provided with a fluid inlet and a fluid outlet; the temperature control fluid supply module supplies the temperature control fluid to the temperature control fluid containing cavity through the fluid inlet, and the temperature control fluid recovery module draws the temperature control fluid from the temperature control fluid containing cavity through the fluid outlet.

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