Array substrate, light-emitting substrate and display device

Abstract

The embodiment of the invention provides an array substrate, a light-emitting substrate and a display device, relates to the technical field of display, and aims to reduce the number of flexible circuit boards and reduce the production cost. The array substrate is provided with a light-emitting area and a binding area, and the binding area is located on one side of the light-emitting area in the first direction. The array substrate comprises a plurality of binding parts, a plurality of device power supply signal lines and a plurality of driving units. The driving units are arranged in an array, each column comprises at least two driving units arranged in the first direction, and each row comprises at least two driving units arranged in the second direction. The second direction intersects the first direction. The driving unit comprises a driving bonding pad group and a plurality of light-emitting units, the plurality of light-emitting units in the driving unit are connected with the driving bonding pad group, and all the light-emitting units in one column of driving units are connected with the same device power supply signal line. At least two light-emitting units in the driving unit are arranged in the second direction. The method is used for image display.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to an array substrate, a light-emitting substrate and a display device. Background Art

[0002] With the development of light emitting diode technology, light emitting substrates using sub-millimeter (Mini) or even micron (Micro) light emitting diodes (Light Emitting Diode, LED) have been widely used. As a result, not only can the screen contrast of products such as liquid crystal displays (Liquid Crystal Display, LCD) using the light emitting substrate reach the level of organic light emitting diode (Organic Light Emitting Diode, OLED) display products, but also the products can retain the technical advantages of liquid crystal display, thereby improving the display effect of the picture and providing users with a better visual experience.

[0003] In some related technologies, the light-emitting substrate using Mini / Micro LED includes multiple signal lines, which are divided into multiple signal line groups. The multiple signal lines in each signal group are contracted in the binding area of ​​the light-emitting substrate to form a binding part, and each binding part is connected to a flexible circuit board. Among them, how to reduce the number of flexible circuit boards is an urgent problem to be solved. Summary of the invention

[0004] The present disclosure provides an array substrate, a light-emitting substrate and a display device, so as to reduce the number of flexible circuit boards and lower the production cost.

[0005] In one aspect, an array substrate is provided. The array substrate has a light-emitting area and a binding area, and along a first direction, the binding area is located on one side of the light-emitting area. The array substrate includes a plurality of binding parts, a plurality of device power signal lines, and a plurality of driving units.

[0006] The multiple binding parts are arranged in the binding area. The device power signal line is connected to the binding part. The multiple driving units are arranged in an array, each column includes at least two driving units arranged along the first direction, and each row includes at least two driving units arranged along the second direction. The second direction intersects with the first direction. Wherein, the driving unit includes a driving pad group and a plurality of light-emitting units, and each of the light-emitting units includes a plurality of device pad groups arranged in series and / or in parallel. The multiple light-emitting units in the driving unit are connected to the driving pad group, and in a column of driving units, all the light-emitting units are connected to the same device power signal line. In the driving unit, there are at least two light-emitting units arranged along the second direction.

[0007] In some embodiments, the device power signal line includes a first routing segment and a plurality of second routing segments. The first routing segment extends along the first direction and is located on a first side of a plurality of light-emitting units of a column of driving units; the first routing segment is connected to the binding portion. The second routing segment extends along the second direction. The plurality of second routing segments are connected to the first routing segment, and along the first direction, at least one side of each of the driving units is provided with a second routing segment. In the driving unit, the light-emitting units arranged along the second direction are connected to the corresponding same second routing segment.

[0008] In some embodiments, a second routing segment is provided on a side of each driving unit away from the binding area, and the light emitting units arranged along the second direction in the driving unit are connected to the second routing segment on the side away from the binding area.

[0009] In some embodiments, the plurality of device power signal lines are connected to a plurality of second routing segments that are farthest from the binding region.

[0010] In some embodiments, the multiple device pad groups in each of the light-emitting units are arranged in multiple rows and columns, each column includes at least two device pad groups arranged in the first direction, and each row includes at least two device pad groups arranged in the second direction.

[0011] Wherein, the driving pad group is located at the second side of a plurality of light-emitting units of a column of driving units, and the first side and the second side are opposite sides of a plurality of light-emitting units of a column of driving units. The plurality of device pad groups of the light-emitting units include a first device pad group and a second device pad group. The first device pad group is connected to the second routing segment. The first device pad group is a device pad group that is far away from the corresponding first routing segment in the first direction and close to the corresponding second routing segment in the second direction. The second device pad group is connected to the driving pad group. The second device pad group is a device pad group that is far away from the corresponding first routing segment in the first direction and far away from the corresponding second routing segment in the second direction.

[0012] In some embodiments, in the driving unit, there are at least two light emitting units arranged along the first direction. The device power signal line includes a third routing segment, a plurality of fourth routing segments, and a plurality of fifth routing segments.

[0013] The third routing segment extends along the first direction and is located at a first side of a plurality of light-emitting units of a column of driving units; the third routing segment is connected to the binding portion. The fourth routing segment extends along the second direction. The plurality of fourth routing segments are connected to the third routing segment, and along the first direction, the fourth routing segment is located at opposite sides of the driving unit. The fifth routing segment extends along the first direction. The fifth routing segment is connected to the fourth routing segment, and along the second direction, is located between two adjacent light-emitting units in the driving unit. In the driving unit, the light-emitting unit adjacent to the third routing segment is connected to the third routing segment, and the other light-emitting units are connected to the fifth routing segment.

[0014] In some embodiments, the driving pad group is located on the second side of a plurality of light-emitting units in a column of driving units; the first side and the second side are opposite sides of a plurality of light-emitting units in a column of driving units. Along the second direction, there are two fifth routing segments between every two adjacent light-emitting units in the driving unit. Along the first direction, the two fifth routing segments are arranged opposite to each other and are respectively connected to the two fourth routing segments on both sides of the driving unit.

[0015] In some embodiments, the multiple device pad groups in each of the light-emitting units are arranged in multiple rows and columns, each column includes at least two device pad groups arranged in the first direction, and each row includes at least two device pad groups arranged in the second direction.

[0016] Wherein, the plurality of device pad groups of the light-emitting unit include a third device pad group and a fourth device pad group. The third device pad group is connected to the device power signal line. The third device pad group is a device pad group close to the corresponding third routing segment in the second direction and close to the ends of two fifth routing segments arranged oppositely in the first direction. The fourth device pad group is connected to the driving pad group. The fourth device pad group is a device pad group far away from the corresponding third routing segment in the second direction and close to the ends of two fifth routing segments arranged oppositely in the first direction.

[0017] In some embodiments, along the second direction, two adjacent driving units are symmetrically arranged, and at least two adjacent columns of driving units are connected to the same device power signal line.

[0018] In some embodiments, the array substrate further comprises a plurality of address signal lines, the address signal lines extending along the first direction and connected to the binding portion. The address signal lines are located between two adjacent columns of drive units. The drive pad group comprises an address input pad and an address output pad, and along the first direction, the address output pad of two adjacent drive units that is farther from the binding area is connected to the address input pad that is closer to the binding area. The address input pad of the drive pad group that is farthest from the binding area is connected to the address signal line.

[0019] And / or; The array substrate further comprises a plurality of driving power signal lines, which extend along the first direction and are connected to the binding portion. The driving power signal line is located between two adjacent columns of driving units. Wherein, the driving pad group comprises a power input pad and a power output pad, and along the first direction, in two adjacent driving units, the power output pad that is relatively far from the binding area is connected to the power input pad that is relatively close to the binding area. The power input pad of the driving pad group that is farthest from the binding area is connected to the driving power signal line.

[0020] And / or; The array substrate further comprises a plurality of data signal lines extending along the first direction and connected to the binding portion. The data signal line is located between two adjacent columns of drive units. The drive pad group comprises a data input pad and a data output pad. Along the first direction, the data output pad of two adjacent drive units that is relatively far from the binding area is connected to the data input pad that is relatively close to the binding area. The data input pad of the drive pad group that is farthest from the binding area is connected to the data signal line.

[0021] In some embodiments, the driving pad group includes an address input pad, an address output pad, a power input pad, a power output pad, a data input pad, and a data output pad.

[0022] Along the first direction, in two adjacent driving units, the address output pad closer to the binding area is connected to the address input pad farther from the binding area. The address input pad of the driving pad group closest to the binding area is connected to the binding portion.

[0023] and / or; along the first direction, in two adjacent driving units, the power output pad closer to the binding area is connected to the power input pad farther from the binding area. The power input pad of the driving pad group closest to the binding area is connected to the binding portion.

[0024] and / or; along the first direction, in two adjacent driving units, the data output pad closer to the binding area is connected to the data input pad farther from the binding area. The data input pad of the driving pad group closest to the binding area is connected to the binding portion.

[0025] In some embodiments, the array substrate further includes a ground signal line, which extends along the first direction and is connected to the binding portion and the driving pad group. The ground signal line is located between two adjacent columns of driving units. Wherein, when the power input pad of the driving pad group closest to the binding area is connected to the binding portion, the address input pad of the driving pad group closest to the binding area is connected to the binding portion, and the data input pad of the driving pad group closest to the binding area is connected to the binding portion, at least two adjacent columns of the driving units are connected to the same ground signal line.

[0026] In some embodiments, the array substrate includes a plurality of connecting lines, a plurality of cascade lines, and a plurality of signal lines. The light-emitting unit is connected to the driving pad group through the connecting lines. Along the first direction, the driving pad groups in two adjacent driving units are connected through the cascade lines. The plurality of signal lines include at least one of a device power signal line, a ground signal line, a data signal line, a driving power signal line, and an address signal line. The plurality of signal lines, the plurality of connecting lines, and the plurality of cascade lines are made of the same material and are arranged in the same layer.

[0027] In the array substrate of the embodiment of the present disclosure, at least two light-emitting units arranged along the second direction are connected to the same device power signal line. That is, at least two columns of light-emitting units can share a device power signal line. In this way, the number of device power signal lines can be reduced, thereby reducing the number of binding pins. At this time, the number of binding pins included in each binding part can be reduced to reduce the frame of the display device; the number of binding parts can also be reduced to reduce the number of flexible circuit boards and reduce production costs.

[0028] On the other hand, a light-emitting substrate is provided. The light-emitting substrate comprises an array substrate according to any of the above embodiments, a plurality of driving chips and a plurality of light-emitting devices. The driving chip is connected to a driving pad group of the array substrate. The light-emitting device is connected to a device pad group of the array substrate.

[0029] In another aspect, a display device is provided, wherein the display device comprises the above-mentioned light-emitting substrate and a plurality of flexible circuit boards, wherein the plurality of flexible circuit boards are connected to the binding portion of the light-emitting substrate.

[0030] The beneficial effects of the light-emitting substrate and the display device provided by the embodiments of the present disclosure are the same as the beneficial effects of the array substrate provided by the above technical solution, and are not elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0032] Figure 1 is a structural diagram of a display device according to some embodiments;

[0033] Figure 2 for Figure 1 A sectional view along the section line AA';

[0034] Figure 3 is a structural diagram of a flexible circuit board of a display device when it is not bent according to some embodiments;

[0035] Figure 4 is a structural diagram of a flexible circuit board of a display device after being bent according to some embodiments;

[0036] Figure 5 is a circuit diagram of a driving unit according to some embodiments;

[0037] Figure 6 is a partial enlarged view of a driving unit of an array substrate according to some embodiments;

[0038] Figure 7 is a structural diagram of an array substrate according to some embodiments;

[0039] Figure 8 is a partial enlarged view of a driving unit of another array substrate according to some embodiments;

[0040] Fig. 9 is a structural diagram of another array substrate according to some embodiments;

[0041] Fig.10 is a structural diagram of another array substrate according to some embodiments;

[0042] Fig.11 is a structural diagram of yet another array substrate according to some embodiments;

[0043] Fig.12 is a structural diagram of a driving pad group according to some embodiments;

[0044] Fig.13 is a partial enlarged view of a driving unit of yet another array substrate according to some embodiments;

[0045] Fig.14 is a partial enlarged view of a driving unit of yet another array substrate according to some embodiments;

[0046] Fig.15 This is a partial enlarged view of a driving unit of yet another array substrate according to some embodiments. DETAILED DESCRIPTION

[0047] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0048] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0049] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0050] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0051] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0052] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0053] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0054] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0055] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of variation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0056] As used herein, "parallel", "perpendicular", and "equal" include the conditions described and conditions similar to the conditions described, the range of which is within an acceptable range of deviations, wherein the acceptable range of deviations is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "equal" includes absolute equality and approximate equality, wherein the acceptable range of deviations for approximate equality may include, for example, a difference between the two being equal that is less than or equal to 5% of either.

[0057] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0058] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0059] like Figure 1 As shown, some embodiments of the present disclosure provide a display device 1000, which may be any device that displays images, whether in motion (eg, video) or fixed (eg, still image), and whether text or images.

[0060] For example, see Figure 1 The display device 1000 can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a wearable device, a virtual reality (VR) device, etc.

[0061] In some embodiments, see Figure 2 The display device 1000 includes a light emitting substrate 100, the light emitting substrate 100 has a light emitting side and a non-light emitting side opposite to each other, and the light emitting side refers to a side of the light emitting substrate 100 that provides a light source ( Figure 2 The non-luminous side refers to the upper side of the luminous substrate 100, and the non-luminous side refers to the other side opposite to the luminous side ( Figure 2 The lower side of the light emitting substrate 100).

[0062] In some examples, such as Figure 2 As shown, the display device 1000 further includes a plurality of optical films 200 , and the plurality of optical films 200 are disposed on the light emitting side of the light emitting substrate 100 .

[0063] The light-emitting substrate 100 can directly emit white light, which is then emitted after being homogenized by the multiple optical films 200. Alternatively, the light-emitting substrate 100 can also emit light of other colors (such as blue light), which is then emitted after being color-converted and homogenized by the multiple optical films 200.

[0064] For example, see Figure 2 , along a direction perpendicular to the light emitting substrate 100 and away from the light emitting substrate 100 , the plurality of optical films 200 include a diffuser plate 201 , a quantum dot film 202 , a diffuser sheet 203 and a composite film 204 which are sequentially arranged.

[0065] The diffuser 201 can blur the light emitted by the light-emitting substrate 100 and provide support for the quantum dot film 202, the diffuser 203 and the composite film 204. The quantum dot film 202 can convert the light of a certain color emitted by the light-emitting substrate 100 into white light under the stimulation of the light, so as to improve the utilization rate of the light energy of the light-emitting substrate 100. The diffuser 203 can homogenize the light passing through the diffuser 203. The composite film 204 can improve the light extraction efficiency of the light-emitting substrate 100 and improve the display brightness of the display device 1000.

[0066] It should be noted that the composite film 204 may include a brightness enhancement film (BEF) and a dual brightness enhancement film (DBEF), which utilizes the principles of total reflection, refraction and polarization to increase the light flux within a certain angle range to improve the brightness of the display device 1000.

[0067] For example, the light-emitting substrate 100 emits blue light in a direction away from the light-emitting substrate 100. The quantum dot film 202 may include a red quantum dot material, a green quantum dot material, and a transparent material. When the blue light emitted by the light-emitting substrate 100 passes through the red quantum dot material, it is converted into red light; when the blue light passes through the green quantum dot material, it is converted into green light; the blue light can directly pass through the transparent material; then, the blue light, the red light, and the green light are mixed and superimposed in a certain proportion to present white light. Finally, the diffuser 201 and the diffuser sheet 203 can mix the white light to improve the light shadow produced by the light-emitting substrate 100 and improve the display quality of the display device 1000.

[0068] In some examples, such as Figure 3 and Figure 4 As shown, the display device 1000 further includes a plurality of flexible circuit boards 300 and a circuit board 400 .

[0069] like Figure 3 and Figure 4 As shown, the circuit board 400 is connected to the flexible circuit board 300 , and the flexible circuit board 300 is connected to the light emitting substrate 100 to provide a signal for controlling light emission to the light emitting substrate 100 .

[0070] By bending the flexible circuit board 300 through a bending process, the circuit board 400 can be located on the non-light-emitting side of the light-emitting substrate 100 , so as to reduce the frame of the display device 1000 .

[0071] In some embodiments, see Figure 2 The light emitting substrate 100 includes an array substrate 10 , a light emitting device 20 and a driving chip 30 .

[0072] like Figure 2 As shown, the light emitting device 20 may include a Micro LED and / or a Mini LED. In some examples, the size (e.g., length) of the Micro LED is less than 50 microns, for example, 10 microns to 50 microns. In some examples, the size (e.g., length) of the Mini LED is 50 microns to 150 microns, for example, 80 microns to 120 microns. The embodiments of the present disclosure may select different light emitting devices 20 according to actual needs.

[0073] like Figure 3 As shown, the array substrate 10 has a light emitting area A1 and a binding area A2, and the binding area A2 is located on one side of the light emitting area A1 along the first direction X. The light emitting area A1 is configured to set the light emitting device 20 and the driving chip 30, and the binding area A2 is configured to connect the flexible circuit board 300.

[0074] It should be noted that the array substrate 10 may further have a test area A3. Along the first direction X, the test area A3 is located on a side of the light emitting area A1 away from the binding area A2.

[0075] For example, see Figure 3 and Figure 5 The array substrate 10 includes a plurality of binding portions 110 , a plurality of driving units 120 and a plurality of device power signal lines 131 .

[0076] like Figure 3 , Figure 6 and Figure 7 As shown, a plurality of driving units 120 are arranged in an array and located in the light emitting area A1, each column includes at least two driving units 120 arranged along a first direction X, and each row includes at least two driving units 120 arranged along a second direction Y. The second direction Y intersects with the first direction X, for example, the second direction Y is perpendicular to the first direction X.

[0077] Among them, see Figure 5 and Figure 6The driving unit 120 includes a driving pad group 1210 and at least one light emitting unit 1220, and each light emitting unit 1220 includes a plurality of device pad groups 1221 connected in series and / or in parallel.

[0078] like Figure 5 and Figure 6 As shown, each device pad group 1221 may include, for example, two device pads arranged adjacently. The light-emitting device 20 is connected to the two device pads of the device pad group 1221. Each driving pad group 1210 includes a plurality of driving pads, and the number of driving pads is set according to the light-emitting unit 1220 to be driven, and the details can be referred to below. The driving chip 30 is connected to the plurality of driving pads of the driving pad group 1210.

[0079] For example, Figure 5 As shown, each light-emitting unit 1220 includes four light-emitting devices 20 connected in series. Of course, each light-emitting unit 1220 may also include five, six, seven or eight light-emitting devices 20, and the connection mode of the multiple light-emitting devices 20 in the light-emitting unit 1220 is not limited to series connection, but may also be parallel connection, and the embodiments of the present disclosure are not limited thereto.

[0080] In addition, see Figure 5 , the light emitting units 1220 in the driving unit 120 are connected to the driving pad group 1210, that is, one driving chip 30 drives all the light emitting units 1220 in one driving unit 120. Figure 7 In each column of driving units 120 , all the light-emitting units 1220 are connected to the same device power signal line 131 , that is, one device power signal line 131 provides power signals to at least all the light-emitting units 1220 in one column of driving units 120 .

[0081] like Figure 3 As shown, the binding part 110 is disposed in the binding area A2, and each binding part 110 includes a plurality of binding pins 111. Each device power signal line 131 is connected to at least one binding pin 111, and one binding part 110 is connected to one flexible circuit board 300.

[0082] In some examples, such as Figure 3 As shown, the plurality of device power signal lines 131 are divided into a plurality of groups, each group including at least two adjacent device power signal lines 131 .

[0083] On this basis, multiple binding parts 110 are arranged at intervals along the second direction Y, and each group of device power signal lines 131 are contracted in the binding area A2 and connected to the nearest binding part 110 to shorten the routing length of the device power signal line 131 and reduce the voltage drop of the device power signal line 131.

[0084] In the related art, the driving unit includes a light-emitting unit or a column of light-emitting units, that is, each column of light-emitting units needs to be connected to a device power signal line. In this case, the number of device power signal lines is large, resulting in a large number of binding pins. In this way, when the number of binding pins included in each binding part is fixed, the number of binding parts is large, which in turn leads to a large number of flexible circuit boards and high production costs.

[0085] Based on this, see Figure 6 In some embodiments of the present disclosure, in the array substrate 10 provided, the driving unit 120 includes a plurality of light emitting units 1220 , and among the plurality of light emitting units 1220 of the driving unit 120 , at least two light emitting units 1220 are arranged along the second direction Y.

[0086] In this case, at least two light-emitting units 1220 arranged along the second direction Y are connected to the same device power signal line 131. That is, at least two columns of light-emitting units 1220 can share one device power signal line 131. In this case, the number of device power signal lines 131 can be reduced, thereby reducing the number of binding pins 111. At this time, the number of binding pins 111 included in each binding portion 110 can be reduced to reduce the frame of the display device 1000; the number of binding portions 110 can also be reduced to reduce the number of flexible circuit boards 300 and reduce production costs.

[0087] In some embodiments, see Figure 6 The device power signal line 131 includes a first routing segment 1311 and a plurality of second routing segments 1312 .

[0088] See also Figure 6 and Figure 7 The first wiring segment 1311 extends along the first direction X and is located on a first side of a plurality of light emitting units 1220 of a column of driving units 120 (eg Figure 7 The first wiring segment 1311 and the binding portion 110 (see Figure 3 ) is connected, that is, the first routing segment 1311 is connected to the binding pin 111.

[0089] See also Figure 6 and Figure 7 , a plurality of second routing segments 1312 extend along the second direction Y and are connected to the first routing segments 1311. In particular, along the first direction X, at least one side of each driving unit 120 is provided with a second routing segment 1312.

[0090] On this basis, in the driving unit 120 , the light emitting units 1220 arranged along the second direction Y are connected to the corresponding same second wiring segment 1312 .

[0091] For example, Figure 6 and Figure 7 As shown, a second wiring segment 1312 is provided on a side of each driving unit 120 away from the binding area A2. Moreover, the light emitting units 1220 arranged along the second direction Y in the driving unit 120 are connected to the second wiring segment 1312 on the side away from the binding area A2.

[0092] In this case, the light-emitting unit 1220 in the driving unit 120 can be directly connected to the same second routing segment 1312 on the side away from the binding area A2 to avoid overlapping of the routing connecting the light-emitting unit 1220 and the same device power signal line 131, thereby avoiding the routing bridge switching design, having a simple structure and helping to reduce costs.

[0093] Furthermore, the wiring connecting the light-emitting unit 1220 and the driving pad group 1210 can be routed on the side of the light-emitting unit 1220 close to the binding area A2 and connected to the driving pad group 1210, thereby avoiding the overlap of the wiring connecting the light-emitting unit 1220 and the driving pad group 1210 with other circuit wirings, avoiding the wiring bridge switching design, having a simple structure, and helping to reduce costs.

[0094] That is, the array substrate 10 further includes a connection line 140, one end of which is connected to the light emitting unit 1220 and to the corresponding driving pad group 1210. The connection line 140 is on the side of the light emitting unit 1220 close to the binding area A2, bypasses all the light emitting units 1220 along the second direction Y, and is connected to the corresponding driving pad group 1210.

[0095] For example, Figure 6 As shown, the driving unit 120 includes four light-emitting units 1220, and the four light-emitting units 1220 are arranged along the second direction Y, and the four light-emitting units 1220 are all connected to the second routing segment 1312 on the side away from the binding area A2, so that the four light-emitting units 1220 are connected to the same device power signal line 131.

[0096] At this time, the four light-emitting units 1220 can be directly connected to the same second routing segment 1312 on the side away from the binding area A2, so that the four light-emitting units 1220 are connected to the same device power signal line 131. In this way, the routing lines connecting the four light-emitting units 1220 to the same device power signal line 131 can be avoided from overlapping, thereby avoiding the bridging and switching design of the routing lines, which has a simple structure and is conducive to reducing costs. In addition, the connecting lines 140 corresponding to the four light-emitting units 1220, on the side of the light-emitting unit 1220 close to the binding area A2, bypass all the light-emitting units 1220 along the second direction Y and are connected to the corresponding driving pad group 1210.

[0097] In addition, if Figure 7 As shown, the plurality of second routing segments 1312 of the plurality of device power signal lines 131 farthest from the binding area A2 are connected, which can reduce the resistance of the device power signal lines 131 and reduce the power consumption of the light-emitting substrate 100. At the same time, the power signals transmitted by the plurality of device power signal lines 131 are the same, which is conducive to balancing the light-emitting brightness of the plurality of light-emitting devices and improving the brightness uniformity of the light-emitting substrate.

[0098] In some examples, such as Figure 6 As shown, the multiple device pad groups 1221 in each light emitting unit 1220 are arranged in multiple rows and columns, each column includes at least two device pad groups 1221 arranged in a first direction X, and each row includes at least two device pad groups 1221 arranged in a second direction Y.

[0099] Among them, combined Figure 7 The driving pad group 1210 is located on the second side of the plurality of light emitting units 1220 of a column of driving units 120 (eg Figure 7 Here, the first side and the second side of the plurality of light emitting units 1220 of a column of driving units 120 are two opposite sides of the plurality of light emitting units 1220 of a column of driving units 120.

[0100] On this basis, if Figure 6 As shown, the plurality of device pad groups 1221 in the light emitting unit 1220 include a first device pad group 1222 and a second device pad group 1223 .

[0101] like Figure 6 As shown, the first device pad group 1222 is connected to the second routing segment 1312. The first device pad group 1222 is a device pad group 1221 that is away from the corresponding first routing segment 1311 in the first direction X and close to the corresponding second routing segment 1312 in the second direction Y.

[0102] For example, Figure 6 As shown, each light emitting unit 1220 includes four device pad groups 1221, and the four device pad groups 1221 are arranged in two rows and two columns. At this time, the first device pad group 1222 is the device pad group 1221 located in the first row and the second column.

[0103] like Figure 6 As shown, the second device pad group 1223 is connected to the driving pad group 1210. The second device pad group 1223 is a device pad group 1221 that is away from the corresponding first routing segment 1311 in the first direction X and away from the corresponding second routing segment 1312 in the second direction Y.

[0104] For example, Figure 6As shown, each light emitting unit 1220 includes four device pad groups 1221, and the four device pad groups 1221 are arranged in two rows and two columns. At this time, the second device pad group 1223 is the device pad group 1221 located in the second row and the second column.

[0105] In the above manner, the connection between the multiple device pad groups 1221 in the light-emitting unit 1220, the connection between the first device pad group 1222 and the second routing segment 1312, and the connection between the second device pad group 1223 and the driving pad group 1210 are simple in design and low in cost.

[0106] In other embodiments, see Figure 8 In the driving unit 120, there are at least two light emitting units 1220 arranged along the first direction X.

[0107] In this case, the light emitting units 1220 arranged along the first direction X in the driving unit 120 are all connected to the same driving pad group 1210. That is, multiple rows of light emitting units 1220 in the driving unit 120 can share a driving chip 30 to reduce the number of driving chips 30 and reduce production costs.

[0108] At this time, see Figure 8 The device power signal line 131 includes a third routing segment 1313 , a plurality of fourth routing segments 1314 , and a plurality of fifth routing segments 1315 .

[0109] See also Figure 8 and Fig. 9 The third wiring segment 1313 extends along the first direction X and is located on a first side of a plurality of light emitting units 1220 of a column of driving units 120 (eg Fig. 9 The third wiring segment 1313 is connected to the binding portion 110 (see Figure 3 That is, the third wiring segment 1313 is connected to the binding pin 111.

[0110] See also Figure 8 and Fig. 9 The plurality of fourth routing segments 1314 extend along the second direction Y and are connected to the third routing segments 1313 . The fourth routing segments 1314 are located at two opposite sides of the driving unit 120 along the first direction X.

[0111] See also Figure 8 and Fig. 9 , a plurality of fifth routing segments 1315 extend along the first direction X. Moreover, the fifth routing segment 1315 is connected to the fourth routing segment 1314 . Wherein, along the second direction Y, the fifth routing segment 1315 is located between two adjacent light emitting units 1220 in the driving unit 120 .

[0112] On this basis, in the driving unit 120 , the light emitting unit 1220 adjacent to the third routing segment 1313 is connected to the third routing segment 1313 , and the other light emitting units 1220 are connected to the fifth routing segment 1315 .

[0113] For example, Figure 8 and Fig. 9 As shown, the driving pad group 1210 is located at the second side of the plurality of light emitting units 1220 of a column of driving units 120 .

[0114] On this basis, along the second direction Y, there are two fifth routing segments 1315 between each two adjacent light emitting units 1220 in the driving unit 120. Along the first direction X, the two fifth routing segments 1315 are arranged opposite to each other and are respectively connected to the two fourth routing segments 1314 on both sides of the driving unit 120.

[0115] In this case, the light-emitting unit 1220 located on the side of the fifth routing segment 1315 away from the driving pad group 1210 can be routed between the two relatively arranged fifth routing segments 1315 and connected to the corresponding driving pad group 1210, thereby avoiding the overlap of the routing connecting the light-emitting unit 1220 and the driving pad group 1210 with other circuit routings, avoiding the routing bridge switching design, having a simple structure, and helping to reduce costs.

[0116] That is, the array substrate 10 further includes a connecting wire 140, one end of which is connected to the light emitting unit 1220 and connected to the corresponding driving pad group 1210. The connecting wire 140 connected to the light emitting unit 1220 located on the side of the fifth routing segment 1315 away from the driving pad group 1210 passes between the two fifth routing segments 1315 and is connected to the corresponding driving pad group 1210.

[0117] For example, Figure 8 As shown, the driving unit 120 includes four light-emitting units 1220, and the four light-emitting units 1220 are arranged in two rows and two columns. Two fourth routing segments 1314 are located on opposite sides of the driving unit 120, and two fifth routing segments 1315 exist between the two columns of light-emitting units 1220, and are respectively connected to the two fourth routing segments 1314 on both sides of the driving unit 120.

[0118] At this time, the two light-emitting units 1220 in the first column are connected to the third routing segment 1313, and the corresponding connecting wire 140 passes between the two fifth routing segments 1315 and is connected to the driving pad group 1210. The two light-emitting units 1220 in the second column are respectively connected to the adjacent fifth routing segments 1315, and the corresponding connecting wire 140 is directly connected to the driving pad group 1210.

[0119] It should be noted that the driving pad group 1210 may be located between the straight lines where two opposite boundaries of the two fifth wiring segments 1315 are located, so as to reduce the winding design of the connecting wire 140 and simplify the circuit.

[0120] In some examples, such as Figure 8 As shown, the multiple device pad groups 1221 in each light emitting unit 1220 are arranged in multiple rows and columns, each column includes at least two device pad groups 1221 arranged in a first direction X, and each row includes at least two device pad groups 1221 arranged in a second direction Y.

[0121] Among them, combined Figure 8 , the plurality of device pad groups 1221 in the light emitting unit 1220 include a third device pad group 1224 and a fourth device pad group 1225 .

[0122] like Figure 8 As shown, the third device pad group 1224 is connected to the device power signal line 131. The third device pad group 1224 is close to the corresponding third routing segment 1313 in the second direction Y, and close to the ends of two oppositely arranged fifth routing segments 1315 in the first direction X.

[0123] That is, when the driving pad group 1210 is between the straight lines where the two opposite boundaries of the two fifth routing segments 1315 are located, the third device pad group 1224 is close to the corresponding third routing segment 1313 in the second direction Y, and close to the device pad group 1221 corresponding to the driving pad group 1210 in the first direction X.

[0124] For example, Figure 8 As shown, each light emitting unit 1220 includes four device pad groups 1221, and the four device pad groups 1221 are arranged in two rows and two columns. At this time, in the first row of light emitting units 1220, the third device pad group 1224 of each light emitting unit 1220 is the device pad group 1221 of the second row and the first column. In the second row of light emitting units 1220, the third device pad group 1224 of each light emitting unit 1220 is the device pad group 1221 of the first row and the first column.

[0125] like Figure 8 As shown, the fourth device pad group 1225 is connected to the driving pad group 1210. The fourth device pad group 1225 is away from the corresponding third routing segment 1313 in the second direction Y and close to the ends of two oppositely arranged fifth routing segments 1315 in the first direction X.

[0126] That is, when the driving pad group 1210 is between the straight lines where the two opposite boundaries of the two fifth routing segments 1315 are located, the fourth device pad group 1225 is away from the corresponding third routing segment 1313 in the second direction Y and close to the device pad group 1221 corresponding to the driving pad group 1210 in the first direction X.

[0127] For example, Figure 8 As shown, each light emitting unit 1220 includes four device pad groups 1221, and the four device pad groups 1221 are arranged in two rows and two columns. At this time, in the first row of light emitting units 1220, the fourth device pad group 1225 of each light emitting unit 1220 is the device pad group 1221 of the second row and the second column. In the second row of light emitting units 1220, the fourth device pad group 1225 of each light emitting unit 1220 is the device pad group 1221 of the first row and the second column.

[0128] Arranged in the above manner, the connection between the multiple device pad groups 1221 in the light-emitting unit 1220, the connection between the third device pad group 1224 and the device power signal line 131, and the connection between the fourth device pad group 1225 and the driving pad group 1210 are simple in design and low in cost.

[0129] In some embodiments, Fig.10 and Fig.11 As shown, two adjacent driving units 120 are symmetrically arranged along the second direction Y. On this basis, there are at least two adjacent columns of driving units 120 connected to the same device power signal line 131 .

[0130] For example, Fig.10 As shown, a plurality of columns of driving units 120 are divided into a plurality of groups, each group includes two adjacent columns of driving units 120 , and the two adjacent columns of driving units 120 in each group are connected to the same device power signal line 131 .

[0131] In this case, two adjacent driving units 120 along the second direction Y are connected to the same device power signal line 131. That is, at least four columns of light-emitting units 1220 can share one device power signal line 131. In this way, the number of device power signal lines 131 can be further reduced, thereby reducing the number of binding pins 111. At this time, the number of binding pins 111 included in each binding portion 110 can be reduced to further reduce the frame of the display device 1000; the number of binding portions 110 can also be reduced to further reduce the number of flexible circuit boards 300 and reduce production costs.

[0132] In some embodiments, see Fig.12The driving pad group 1210 includes an address input pad 1211 , an address output pad 1212 , a power input pad 1213 , a power output pad 1214 , a data input pad 1215 , a data output pad 1216 , and a ground pad 1217 .

[0133] It should be noted that the driving pad group 1210 further includes a signal output pad 1218 , and the light emitting unit 1220 is connected to the signal output pad 1218 via a connecting line 140 .

[0134] Among them, see Figure 3 , Figure 6 , Figure 7 and Fig.12 , the array substrate 10 may include a plurality of cascade lines 150, along the first direction X, adjacent address input pads 1211 and address output pads 1212 are connected via a cascade line 150; adjacent power input pads 1213 and power output pads 1214 are connected via a cascade line 150; adjacent data input pads 1215 and data output pads 1216 are connected via a cascade line 150.

[0135] On this basis, combined with Figure 6 , Figure 13 to Figure 15 The array substrate 10 further includes at least one of an address signal line 132 , a driving power signal line 133 , a data signal line 134 and a ground signal line 135 .

[0136] For some examples, see Figure 3 , Fig.10 , Fig.12 and Fig.14 , the address input pad 1211 of the driving pad group 1210 closest to the binding area A2 is connected to the binding part 110; the power input pad 1213 of the driving pad group 1210 closest to the binding area A2 is connected to the binding part 110; and, the data input pad 1215 of the driving pad group 1210 closest to the binding area A2 is connected to the binding part 110.

[0137] That is, the address output pad 1212 closer to the binding area A2 is connected to the address input pad 1211 farther from the binding area A2. In two adjacent driving units 120, the power output pad 1214 closer to the binding area A2 is connected to the power input pad 1213 farther from the binding area A2. And, the data output pad 1216 closer to the binding area A2 is connected to the data input pad 1215 farther from the binding area A2.

[0138] On this basis, if Fig.10 and Fig.14As shown, the array substrate 10 includes a ground signal line 135 extending along the first direction X and connected to the binding portion 110 and the ground pad 1217 in the driving pad group 1210 . Moreover, the ground signal line 135 is located between two adjacent columns of driving units 120 .

[0139] At this time, when two adjacent driving units 120 are symmetrically arranged along the second direction Y, at least two adjacent columns of driving units 120 may be connected to the same ground signal line 135 .

[0140] For example, see Fig.10 and Fig.14 The multiple columns of driving units 120 are divided into multiple groups, each group includes two adjacent columns of driving units 120 , and the two adjacent columns of driving units 120 in each group are connected to the same ground signal line 135 .

[0141] In this case, two adjacent driving units 120 along the second direction Y are connected to the same ground signal line 135. That is, at least four columns of light-emitting units 1220 can share one ground signal line 135. In this way, the number of ground signal lines 135 can be reduced, thereby reducing the number of binding pins 111. At this time, the number of binding pins 111 included in each binding portion 110 can be reduced to further reduce the frame of the display device 1000; the number of binding portions 110 can also be reduced to further reduce the number of flexible circuit boards 300 and reduce production costs.

[0142] For other examples, see Figure 3 , Figure 6 , Figure 7 and Fig.12 , the power input pad 1213 of the driving pad group 1210 closest to the binding area A2 is connected to the binding portion 110 ; and the data input pad 1215 of the driving pad group 1210 closest to the binding area A2 is connected to the binding portion 110 .

[0143] That is, in two adjacent driving units 120, the power output pad 1214 closer to the binding area A2 is connected to the power input pad 1213 farther from the binding area A2, and the data output pad 1216 closer to the binding area A2 is connected to the data input pad 1215 farther from the binding area A2.

[0144] On this basis, the array substrate 10 includes a ground signal line 135 and an address signal line 132. Among them, the address input pad 1211 of the driving pad group 1210 farthest from the binding area A2 is connected to the address signal line 132. That is, the address input pad 1211 closer to the binding area A2 is connected to the address output pad 1212 farther from the binding area A2.

[0145] like Figure 6 As shown, the ground signal line 135 extends along the first direction X and is connected to the binding portion 110 and the ground pad 1217 in the driving pad group 1210 . Moreover, the ground signal line 135 is located between two adjacent columns of driving units 120 .

[0146] like Figure 6 As shown, the address signal line 132 extends along the first direction X and is connected to the binding portion 110 . The address signal line 132 is located between two adjacent columns of driving units 120 .

[0147] It should be noted that the ground signal line 135 is closer to the corresponding driving unit 120 than the address signal line 132 .

[0148] For some further examples, see Figure 3 , Figure 7 , Fig.12 and Fig.15 , the power input pad 1213 of the driving pad group 1210 closest to the binding area A2 is connected to the binding portion 110 .

[0149] That is, the power output pad 1214 closer to the bonding area A2 is connected to the power input pad 1213 farther from the bonding area A2.

[0150] On this basis, the array substrate 10 includes a ground signal line 135, an address signal line 132 and a data signal line 134. Among them, the address input pad 1211 of the driving pad group 1210 farthest from the binding area A2 is connected to the address signal line 132, and the data input pad 1215 of the driving pad group 1210 farthest from the binding area A2 is connected to the data signal line 134.

[0151] That is, the address input pad 1211 closer to the binding area A2 is connected to the address output pad 1212 farther from the binding area A2. The data input pad 1215 closer to the binding area A2 is connected to the data output pad 1216 farther from the binding area A2.

[0152] like Fig.15 As shown, the ground signal line 135 extends along the first direction X and is connected to the binding portion 110 and the ground pad 1217 in the driving pad group 1210 . Moreover, the ground signal line 135 is located between two adjacent columns of driving units 120 .

[0153] like Fig.15 As shown, the address signal line 132 extends along the first direction X and is connected to the binding portion 110 . The address signal line 132 is located between two adjacent columns of driving units 120 .

[0154] like Fig.15As shown, the data signal line 134 extends along the first direction X and is connected to the binding portion 110 . The data signal line 134 is located between two adjacent columns of driving units 120 .

[0155] It should be noted that the ground signal line 135 and the data signal line 134 are located at opposite sides of the address signal line 132 ; and the ground signal line 135 is closer to the corresponding driving unit 120 than the address signal line 132 and the data signal line 134 .

[0156] For some further examples, see Figure 3 , Figure 7 , Fig.12 and Fig.13 The array substrate 10 includes a ground signal line 135 , an address signal line 132 , a data signal line 134 and a driving power signal line 133 .

[0157] Among them, the address input pad 1211 of the driving pad group 1210 farthest from the binding area A2 is connected to the address signal line 132; the data input pad 1215 of the driving pad group 1210 farthest from the binding area A2 is connected to the data signal line 134; and the power input pad 1213 of the driving pad group 1210 farthest from the binding area A2 is connected to the driving power signal line 133.

[0158] That is, the address input pad 1211 closer to the binding area A2 is connected to the address output pad 1212 farther from the binding area A2. In two adjacent driving units 120, the power input pad 1213 closer to the binding area A2 is connected to the power output pad 1214 farther from the binding area A2. And, the data input pad 1215 closer to the binding area A2 is connected to the data output pad 1216 farther from the binding area A2.

[0159] like Fig.13 As shown, the ground signal line 135 extends along the first direction X and is connected to the binding portion 110 and the ground pad 1217 in the driving pad group 1210 . Moreover, the ground signal line 135 is located between two adjacent columns of driving units 120 .

[0160] like Fig.13 As shown, the address signal line 132 extends along the first direction X and is connected to the binding portion 110 . The address signal line 132 is located between two adjacent columns of driving units 120 .

[0161] like Fig.13 As shown, the driving power signal line 133 extends along the first direction X and is connected to the binding portion 110 . The driving power signal line 133 is located between two adjacent columns of driving units 120 .

[0162] like Fig.13As shown, the data signal line 134 extends along the first direction X and is connected to the binding portion 110 . The data signal line 134 is located between two adjacent columns of driving units 120 .

[0163] It should be noted that the ground signal line 135 and the data signal line 134 are located on opposite sides of the address signal line 132; the driving power signal line 133 is located on the side of the data signal line 134 away from the ground signal line 135, and the ground signal line 135 is closer to the corresponding driving unit 120 than the address signal line 132, the driving power signal line 133 and the data signal line 134.

[0164] In some embodiments, Figure 6 , Figure 13 to Figure 15 As shown, the array substrate 10 includes a plurality of connection lines 140 , a plurality of cascade lines 150 and a plurality of signal lines 130 .

[0165] The light emitting unit 1220 is connected to the driving pad group 1210 via a connecting line 140. Along the first direction X, the driving pad groups 1210 in two adjacent driving units 120 are connected via a cascade line 150. In addition, the plurality of signal lines 130 include at least one of a device power signal line 131, a ground signal line 135, a data signal line 134, a driving power signal line 133, and an address signal line 132.

[0166] On this basis, the multiple signal lines 130, the multiple connecting lines 140 and the multiple cascade lines 150 are made of the same material and are arranged in the same layer. In other words, the multiple signal lines 130, the multiple connecting lines 140 and the multiple cascade lines 150 do not cross each other. In this case, the array substrate 10 can form the multiple signal lines 130, the multiple connecting lines 140 and the multiple cascade lines 150 through a conductive layer, which can avoid the bridge switching design of the circuit routing, and does not need to introduce new materials and production steps, which is conducive to reducing costs.

[0167] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. An array substrate, characterized in that: It has a light-emitting area and a binding area, and along a first direction, the binding area is located at one side of the light-emitting area; The array substrate comprises: A plurality of binding parts, arranged in the binding area; A plurality of device power signal lines connected to the binding portion; A plurality of driving units, wherein the plurality of driving units are arranged in an array, each column includes at least two driving units arranged along the first direction, and each row includes at least two driving units arranged along a second direction; the second direction intersects the first direction; Among them, the driving unit includes a driving pad group and multiple light-emitting units, each of the light-emitting units includes multiple device pad groups arranged in series and / or parallel; the multiple light-emitting units in the driving unit are connected to the driving pad group, and, in a column of driving units, all the light-emitting units are connected to the same device power signal line; in the driving unit, there are at least two light-emitting units arranged along the second direction.

2. The array substrate according to claim 1, characterized in that: The device power signal line includes: A first wiring segment extends along the first direction and is located at a first side of a plurality of light-emitting units of a column of driving units; the first wiring segment is connected to the binding portion; A plurality of second routing segments extend along the second direction; the plurality of second routing segments are connected to the first routing segment, and along the first direction, at least one side of each of the driving units is provided with a second routing segment; in the driving unit, the light-emitting units arranged along the second direction are connected to the same corresponding second routing segment.

3. The array substrate according to claim 2, characterized in that: A second routing segment is provided on a side of each driving unit away from the binding area; and the light-emitting units arranged along the second direction in the driving unit are connected to the second routing segment on the side away from the binding area.

4. The array substrate according to claim 3, characterized in that: The plurality of device power signal lines are connected to a plurality of second routing segments that are farthest from the binding area.

5. The array substrate according to claim 2, characterized in that: The plurality of device pad groups in each of the light-emitting units are arranged into a plurality of rows and columns, each column includes at least two device pad groups arranged in the first direction, and each row includes at least two device pad groups arranged in the second direction; The driving pad group is located on the second side of a plurality of light-emitting units of a column of driving units, the first side and the second side are opposite sides of a plurality of light-emitting units of a column of driving units; the plurality of device pad groups of the light-emitting units include: a first device pad group connected to the second routing segment; the first device pad group is a device pad group that is far away from the corresponding first routing segment in the first direction and close to the corresponding second routing segment in the second direction; The second device pad group is connected to the driving pad group; the second device pad group is a device pad group that is far away from the corresponding first routing segment in the first direction and far away from the corresponding second routing segment in the second direction.

6. The array substrate according to claim 1, characterized in that: In the driving unit, there are at least two light-emitting units arranged along the first direction; The device power signal line includes: a third wiring segment extending along the first direction and located at a first side of a plurality of light-emitting units of a column of driving units; the third wiring segment is connected to the binding portion; A plurality of fourth routing segments extending along the second direction; the plurality of fourth routing segments are connected to the third routing segment, and along the first direction, the fourth routing segments are located on two opposite sides of the driving unit; A plurality of fifth routing segments extending along the first direction; the fifth routing segment is connected to the fourth routing segment and is located between two adjacent light-emitting units in the driving unit along the second direction; Among them, in the driving unit, the light-emitting units adjacent to the third routing segment are connected to the third routing segment, and the other light-emitting units are connected to the fifth routing segment.

7. The array substrate according to claim 6, characterized in that: The driving pad group is located at a second side of a plurality of light-emitting units of a column of driving units; the first side and the second side are two opposite sides of a plurality of light-emitting units of a column of driving units; Along the second direction, in the driving unit, there are two fifth routing segments between every two adjacent light-emitting units; along the first direction, the two fifth routing segments are arranged opposite to each other and are respectively connected to the two fourth routing segments on both sides of the driving unit.

8. The array substrate according to claim 7, characterized in that: The plurality of device pad groups in each of the light-emitting units are arranged into a plurality of rows and columns, each column includes at least two device pad groups arranged in the first direction, and each row includes at least two device pad groups arranged in the second direction; Wherein, the plurality of device pad groups of the light emitting unit include: a third device pad group connected to the device power signal line; the third device pad group is a device pad group close to the corresponding third routing segment in the second direction and close to the ends of two fifth routing segments arranged oppositely in the first direction; The fourth device pad group is connected to the driving pad group; the fourth device pad group is a device pad group that is far away from the corresponding third routing segment in the second direction and close to the ends of two oppositely arranged fifth routing segments in the first direction.

9. The array substrate according to any one of claims 1 to 8, characterized in that: Along the second direction, two adjacent driving units are symmetrically arranged; and at least two adjacent columns of driving units are connected to the same device power signal line.

10. The array substrate according to claim 9, characterized in that: Also includes: A plurality of address signal lines extending along the first direction and connected to the binding portion; the address signal lines are located between two adjacent columns of driving units; The driving pad group includes an address input pad and an address output pad. Along the first direction, in two adjacent driving units, the address output pad farther from the binding area is connected to the address input pad closer to the binding area; the address input pad of the driving pad group farthest from the binding area is connected to the address signal line. and / or; A plurality of driving power signal lines extending along the first direction and connected to the binding portion; the driving power signal lines are located between two adjacent columns of driving units; The driving pad group includes a power input pad and a power output pad. Along the first direction, in two adjacent driving units, the power output pad farther from the binding area is connected to the power input pad closer to the binding area; the power input pad of the driving pad group farthest from the binding area is connected to the driving power signal line; and / or; A plurality of data signal lines extending along the first direction and connected to the binding portion; the data signal lines are located between two adjacent columns of driving units; Among them, the driving pad group includes a data input pad and a data output pad. Along the first direction, in two adjacent driving units, the data output pad that is farther away from the binding area is connected to the data input pad that is closer to the binding area; the data input pad of the driving pad group farthest from the binding area is connected to the data signal line.

11. The array substrate according to claim 9, characterized in that: The driving pad group includes an address input pad, an address output pad, a power input pad, a power output pad, a data input pad and a data output pad; Along the first direction, in two adjacent driving units, the address output pad closer to the binding area is connected to the address input pad farther from the binding area; the address input pad of the driving pad group closest to the binding area is connected to the binding portion; and / or; Along the first direction, in two adjacent driving units, the power output pad closer to the binding area is connected to the power input pad farther from the binding area; the power input pad of the driving pad group closest to the binding area is connected to the binding portion; and / or; Along the first direction, in two adjacent driving units, the data output pad closer to the binding area is connected to the data input pad farther from the binding area; the data input pad of the driving pad group closest to the binding area is connected to the binding portion.

12. The array substrate according to claim 11, characterized in that: Also includes: A ground signal line extending along the first direction and connected to the binding portion and the driving pad group; The ground signal line is located between two adjacent columns of driving units; Among them, when the power input pad of the driving pad group closest to the binding area is connected to the binding part, the address input pad of the driving pad group closest to the binding area is connected to the binding part, and the data input pad of the driving pad group closest to the binding area is connected to the binding part, there are at least two adjacent columns of the driving units connected to the same ground signal line.

13. The array substrate according to claim 1, characterized in that: include: A plurality of connecting wires, through which the light-emitting unit is connected to the driving pad group; A plurality of cascade lines, along the first direction, driving pad groups in two adjacent driving units are connected by the cascade lines; A plurality of signal lines, including at least one of a device power signal line, a ground signal line, a data signal line, a drive power signal line and an address signal line; the plurality of signal lines, the plurality of connecting lines and the plurality of cascade lines are made of the same material and are arranged in the same layer.

14. A light-emitting substrate, characterized in that: include: The array substrate according to any one of claims 1 to 13; A plurality of driving chips connected to the driving pad group of the array substrate; A plurality of light emitting devices are connected to the device pad group of the array substrate.

15. A display device, characterized in that: include: The light-emitting substrate as claimed in claim 14; A plurality of flexible circuit boards are connected to the binding portion of the light emitting substrate.

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