Two-in-one TOP LED lamp bead and preparation method thereof, and display screen

By connecting separately packaged color-separated lamp beads, the problem of multiple TOP LED lamp bead pins and differences in optoelectronic parameters is solved, achieving the effect of simplifying PCB design, improving display effects and reducing maintenance costs.

CN119364960BActive Publication Date: 2025-09-30JIANGXI MTC OPTOELECTRONICS CO LTD
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Patent Information

Application Number
CN202411483842.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-10-23
Publication Date
2025-09-30
Estimated Expiration
2044-10-23

AI Technical Summary

Technical Problem

Existing TOP LED lamp beads have a large number of pins, resulting in complex PCB circuits, low display accuracy, fixed pixel pitch, large differences in photoelectric parameters, low yield and high maintenance costs.

Method used

The first and second color separation lamp beads are separately packaged and detachably connected. The electrical connection is formed through the first and second pins, which simplifies the PCB leads, adjusts the pixel spacing, and optimizes the optical and color parameters.

Benefits of technology

The number of pins is reduced, the PCB circuit design is simplified, the display effect and yield are improved, the maintenance cost is reduced, and the pixel pitch is adjustable.

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Abstract

The present invention discloses a two-in-one TOP LED lamp bead and its preparation method and display screen, which relate to the technical field of LED devices. The two-in-one TOP LED lamp bead includes a first lamp bead and a second lamp bead that are separately packaged, color-separated, and detachably connected; the first lamp bead includes a first reflective cup, a first bracket, a first LED chip, a first pin, and a first packaging colloid; the first bracket extends a first connecting portion on the side close to the second lamp bead, the first pin is at least partially exposed to the top of the first connecting portion, and the first pin abuts against the bottom surface of the first bracket after bending; the second lamp bead includes a second reflective cup, a second bracket, a second LED chip, a second pin, and a second packaging colloid; the second reflective cup extends a second connecting portion on the side close to the first lamp bead, the second pin is at least partially exposed to the bottom of the second connecting portion; after the first lamp bead and the second lamp bead are connected, the first pin and the second pin are in contact to form an electrical connection. The implementation of the present invention can simplify the design of PCB lead circuits, improve display effects, and reduce maintenance costs.
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Description

Technical Field

[0001] The present invention relates to the technical field of LED devices, and in particular to a two-in-one TOP LED lamp bead, a preparation method thereof, and a display screen. Background Art

[0002] LED displays can be divided into outdoor and indoor types based on their operating environments. Indoor displays have lower environmental requirements and therefore can utilize a variety of packaging formats, including chip LEDs, top LEDs, and chip-on-board LEDs. However, due to the harsh operating environments and high brightness requirements of outdoor displays, top LEDs and direct-plug LEDs are still the primary packaging options. However, due to the larger size and lower display accuracy of direct-plug LEDs, they struggle to meet the requirements for high-resolution displays, limiting their application. Therefore, top LEDs are currently the most widely used LEDs.

[0003] Commonly used TOP LED lamp beads typically utilize a single RGB soldered functional area with a flat, externally wrapped pin structure. The lamp beads are grouped into a RGB structure with four pins (red, green, and blue polarity) and one common polarity. These large bead sizes preclude further design for smaller sizes, making it difficult to further reduce resolution and limiting application scenarios. Furthermore, the large number of pins in currently used TOP LED lamp beads necessitates a high number of corresponding circuits on the PCB, resulting in a complex structure.

[0004] For high-resolution indoor displays, a new type of two-in-one lamp can be used. For example, a two-in-one TOPLED lamp typically features two RGB soldering zones and an external pin-out structure. The lamp consists of two RGB lamp groups, with eight pins (two red, green, and blue polarity groups and two common polarity groups), and is completely encapsulated with adhesive. This type of lamp has the following issues: 1. The large number of pins requires the same number of PCB traces as the individual lamps, resulting in complex wiring. 2. Two-in-one lamps are integral and have a fixed size, effectively fixing the display's pixel pitch, making it difficult for customers to select the pixel pitch. 3. Because the die bonding process involves random selection, the optoelectronic parameters of the first and second RGB groups in the two-in-one lamp may differ significantly, affecting the final RGB display quality. 4. Damage to even one chip in a two-in-one lamp renders the entire device scrapped, severely impacting yield. Furthermore, after assembly into the display, a damaged chip renders the entire two-in-one lamp useless, leading to high repair costs. Summary of the Invention

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a two-in-one TOP LED lamp bead, which can improve the display effect and yield, reduce the design difficulty of the PCB circuit board, and reduce the cost.

[0006] In order to solve the above technical problems, the present invention provides a two-in-one TOP LED lamp bead, which includes a first lamp bead and a second lamp bead that are separately packaged and color-separated, and the first lamp bead and the second lamp bead are detachably connected;

[0007] The first lamp bead includes a first reflector cup, a first bracket, at least one first LED chip, at least one first pin, and a first encapsulation colloid; the first reflector cup is arranged on the first bracket and surrounds the first LED chip; a first connecting portion extends from a side of the first bracket close to the second lamp bead; the first pin is at least partially exposed at the top of the first connecting portion, and the first pin is bent to abut against the bottom surface of the first bracket;

[0008] The second lamp bead includes a second reflector cup, a second bracket, at least one second LED chip, at least one second pin, and a second encapsulation colloid; the second reflector cup is arranged on the second bracket and surrounds the second LED chip; a second connecting portion extends from a side of the second reflector cup close to the first lamp bead, and the second pin is at least partially exposed at the bottom of the second connecting portion;

[0009] After the first lamp bead and the second lamp bead are connected, the first pin exposed at the top of the first connecting portion and the second pin exposed at the bottom of the second connecting portion come into contact with each other, thereby forming an electrical connection.

[0010] As an improvement of the above technical solution, a first pin exposed at the top of the first connecting portion is welded to a second pin exposed at the bottom of the second connecting portion.

[0011] As an improvement of the above technical solution, after the first lamp bead and the second lamp bead are connected, the second connecting portion partially or completely covers the first connecting portion.

[0012] As an improvement to the above technical solution, the first pin includes a first embedded portion, a first exposed portion, and a second exposed portion connected in sequence, the first exposed portion is provided above the first connecting portion, one end of the second exposed portion is provided on a side surface of the first bracket, and the other end is bent and abuts against the bottom surface of the first bracket; and / or

[0013] The second pin includes a second embedded portion and a third exposed portion connected in sequence. The third exposed portion is arranged below the second connecting portion and extends toward the first lamp bead.

[0014] As an improvement of the above technical solution, the third exposed portion is provided with a bent portion bent upward, so that the first reflective cup and the second reflective cup are flush after the first lamp bead and the second lamp bead are connected.

[0015] As an improvement to the above technical solution, the first lamp bead further includes at least one third pin, one end of the third pin is provided on the front side of the first bracket, and the other end is bent and abuts against the back side of the first bracket; the first pin and the third pin are provided on both sides of the first LED chip; and / or

[0016] The second lamp bead further includes a fourth pin, one end of which is bonded to the front of the second bracket, and the other end is bent and abuts against the back of the second bracket; the second pin and the fourth pin are arranged on both sides of the second LED chip.

[0017] As an improvement of the above technical solution, the first lamp bead further includes at least one first crystal-fixing area, and the first crystal-fixing area is connected to or not connected to the first pin; and / or

[0018] The second lamp bead further includes a second crystal-bonding area, and the second crystal-bonding area is connected to or not connected to the second pin.

[0019] As an improvement of the above technical solution, the first LED chip includes a first red LED chip, a first green LED chip and a first blue LED chip;

[0020] The first lamp bead includes three first pins, which are respectively used to electrically connect the positive electrodes of the first red LED chip, the first green LED chip, and the first blue LED chip; the first lamp bead includes a third pin, which is used to electrically connect the negative electrodes of the first red LED chip, the first green LED chip, and the first blue LED chip;

[0021] The first lamp bead includes three first crystal-fixing areas, which are respectively used to fix the first red LED chip, the first green LED chip and the first blue LED chip;

[0022] The second LED chip includes a second red LED chip, a second green LED chip and a second blue LED chip;

[0023] The second lamp bead includes three second pins, which are respectively used to electrically connect the positive electrodes of the second red LED chip, the second green LED chip, and the second blue LED chip; the second lamp bead includes a fourth pin, which is used to electrically connect the negative electrodes of the second red LED chip, the second green LED chip, and the second blue LED chip;

[0024] The second lamp bead includes three second crystal fixing areas, which are respectively used to fix the second red LED chip, the second green LED chip and the second blue LED chip.

[0025] Correspondingly, the present invention also discloses a method for preparing a two-in-one TOP LED lamp bead, which is used to prepare the above-mentioned two-in-one TOP LED lamp bead, and the method comprises the following steps:

[0026] (1) stamping and stretching a metal substrate to obtain a first metal bracket and a second metal bracket, respectively, wherein the first metal bracket includes a pin portion, and the second metal bracket includes a second pin;

[0027] (2) forming a first bracket and a first reflector cup by injection molding on the first metal bracket, and forming a second bracket and a second reflector cup by injection molding on the second metal bracket;

[0028] (3) bending the pin portion to form a first pin;

[0029] (4) Fixing the first LED chip in the first reflector cup and fixing the second LED chip in the second reflector cup;

[0030] (5) forming a first encapsulating colloid and a second encapsulating colloid to obtain a first lamp bead and a second lamp bead;

[0031] (6) Splitting light from the first lamp bead and the second lamp bead;

[0032] (7) Connect the first lamp bead and the second lamp bead after the splitting.

[0033] Correspondingly, the present invention also discloses a display screen, which includes the above-mentioned two-in-one TOP LED lamp beads.

[0034] The implementation of the present invention has the following beneficial effects:

[0035] The two-in-one TOP LED lamp bead in one embodiment of the present invention includes a first lamp bead and a second lamp bead that are separately packaged, color-separated, and detachably connected; the first lamp bead includes a first reflector cup, a first bracket, a first LED chip, a first pin, and a first packaging colloid; a first connecting portion extends from the side of the first bracket close to the second lamp bead, the first pin is at least partially exposed to the top of the first connecting portion, and the first pin is bent and abuts against the bottom surface of the first bracket; the second lamp bead includes a second reflector cup, a second bracket, a second LED chip, a second pin, and a second packaging colloid; a second connecting portion extends from the side of the second reflector cup close to the first lamp bead, the second pin is at least partially exposed to the bottom of the second connecting portion; after the first lamp bead and the second lamp bead are connected, the first pin and the second pin are in contact to form an electrical connection. Based on the above-mentioned two-in-one TOP LED lamp bead, firstly, the first lamp bead and the second lamp bead share at least one pin, which reduces the number of pins on the back of the two-in-one TOP LED lamp bead and simplifies the design of the PCB lead circuit; secondly, the first lamp bead and the second lamp bead are separately packaged and split, so that the first lamp bead and the second lamp bead with consistent optical parameters (such as luminous flux, brightness, color temperature) and colorimetric parameters (such as color rendering index and color quality index) can be connected to form a two-in-one lamp bead, which greatly optimizes the display effect. Thirdly, the first connecting part and the second connecting part are detachably connected, that is, the distance between the first lamp bead and the second lamp bead is adjustable, which also makes the pixel spacing based on the two-in-one TOP LED lamp bead adjustable, and also makes it possible to discard one of the lamp beads according to the specific situation during subsequent maintenance, thereby reducing maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 2 is a schematic cross-sectional view of a two-in-one TOP LED lamp bead according to an embodiment of the present invention;

[0037] Figure 2 1 is a schematic cross-sectional structural diagram of a first lamp bead in one embodiment of the present invention;

[0038] Figure 3 This is a schematic diagram of the front structure of the first lamp bead in one embodiment of the present invention;

[0039] Figure 4 This is a schematic diagram of the back structure of the first lamp bead in one embodiment of the present invention;

[0040] Figure 5 1 is a schematic diagram of the cross-sectional structure of the second lamp bead in one embodiment of the present invention;

[0041] Figure 6 1 is a schematic diagram of the front structure of the second lamp bead in one embodiment of the present invention;

[0042] Figure 7 1 is a schematic diagram of the back structure of the second lamp bead in one embodiment of the present invention;

[0043] In the figure, 1 is the first lamp bead, 11 is the first reflective cup, 12 is the first bracket, 121 is the first connecting part, 13 is the first LED chip, 131 is the first red LED chip, 132 is the first green LED chip, 133 is the first blue LED chip, 14 is the first pin, 141 is the first embedded part, 142 is the first exposed part, 143 is the second exposed part, 15 is the first packaging colloid, 16 is the third pin, 17 is the first solid crystal area, 2 is the first lamp bead, 21 is the second reflective cup, 211 is the second connecting part, 22 is the second bracket, 23 is the second LED chip, 231 is the second red LED chip, 232 is the second green LED chip, 233 is the second blue LED chip, 24 is the second pin, 241 is the second embedded part, 242 is the third exposed part, 243 is the bending part, 25 is the second packaging colloid, 26 is the fourth pin, and 27 is the first solid crystal area. DETAILED DESCRIPTION

[0044] To make the objectives, technical solutions, and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present invention.

[0045] In the description of the present invention, it should be understood that the terms "up", "down", "left", "right", "top", "bottom", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0046] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted" and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0047] See also Figure 1 This embodiment provides a two-in-one TOP LED lamp bead, which includes a first lamp bead 1 and a second lamp bead 2 that are separately packaged and color-separated. The first lamp bead 1 and the second lamp bead 2 are detachably connected.

[0048] For details, see Figures 2 to 4The first lamp bead 1 includes a first reflective cup 11 , a first bracket 12 , at least one first LED chip 13 , at least one first pin 14 and a first encapsulation colloid 15 .

[0049] The first bracket 12 and the first reflector cup 11 are both injection molded from a common bracket adhesive in the art. Specifically, the bracket adhesive can be, but is not limited to, PPA, PA6T, PA9T, PCT, EMC, or epoxy resin. Preferably, PPA is used as the bracket adhesive due to its high strength, good rigidity, and excellent fatigue resistance. Specifically, the first reflector cup 11 is formed above the first bracket 12 and surrounds the first LED chip 13. The first encapsulation colloid 15 is formed within the first reflector cup 11.

[0050] The first LED chip 13 can be a common upright LED chip or a vertical LED chip in the art, but is not limited thereto. Regarding the emission wavelength, it can be a single-color, dual-color, or tri-color combination of red, green, and blue LED chips. The design is based on the functional requirements of the actual product and is not limited here. Using the first LED chip 13 described above, various display types can be formed, such as full-color, dual-color, and single-color displays.

[0051] The first pin 14 has a bent structure. One end of the first pin 14 is located on the front of the first bracket 12 for electrical connection to the electrode of the first LED chip 13. The other end of the first pin 14 is bent and abuts against the back of the first bracket 12, later electrically connecting to the driver circuit on the PCB. The first pin 14 is made of, but not limited to, Cu, Ag, or Al. Preferably, it is Cu with a Ni layer and an Ag layer formed on the surface.

[0052] The first encapsulating colloid 15 is formed by curing a common encapsulating glue in the art. Specifically, the encapsulating glue can be epoxy resin or silicone resin, but is not limited thereto. Preferably, the encapsulating glue is epoxy resin.

[0053] For details, see Figures 5 to 7 The second lamp bead 2 includes a second reflective cup 21 , a second bracket 22 , at least one second LED chip 23 , at least one second pin 24 and a second encapsulation colloid 25 .

[0054] The second bracket 22 and second reflector cup 21 are both injection-molded from a common bracket adhesive in the art. Specifically, the bracket adhesive can be, but is not limited to, PPA, PA6T, PA9T, PCT, EMC, or epoxy resin. Preferably, PPA is used as the bracket adhesive due to its high strength, good rigidity, and excellent fatigue resistance. Specifically, a second reflector cup 21 is formed above the second bracket 22, surrounding the second LED chip 23. The second encapsulation colloid 25 is formed within the second reflector cup 21.

[0055] The second LED chip 23 can be a common upright LED chip or a vertical LED chip in the art, but is not limited thereto. Regarding the emission wavelength, it can be a single-color, dual-color, or tri-color combination of red, green, and blue LED chips. The design is based on the functional requirements of the actual product and is not limited here. Using this second LED chip 23, various display types can be formed, such as full-color, dual-color, and single-color displays.

[0056] The second pin 24 is provided on the front of the second bracket 22 for connecting to the electrode of the second chip. The second pin 24 is made of, but not limited to, Cu, Ag, or Al. Preferably, it is Cu with a Ni layer and an Ag layer formed on the surface.

[0057] The second encapsulating colloid 25 is formed by curing a common encapsulating glue in the art. Specifically, the encapsulating glue can be epoxy resin or silicone resin, but is not limited thereto. Preferably, the encapsulating glue is epoxy resin.

[0058] Specifically, a first connection portion 121 extends from a side of the first bracket 12 close to the second lamp bead 2, and the first pin 14 is at least partially exposed at the top of the first connection portion 121. A second connection portion 211 extends from a side of the second reflector cup 21 close to the first lamp bead 1, and the second pin 24 is at least partially exposed at the bottom of the second connection portion 211. After the first lamp bead 1 and the second lamp bead 2 are connected, the first pin 14 exposed at the top of the first connection portion 121 and the second pin 24 exposed at the bottom of the second connection portion 211 are in contact, forming an electrical connection. Based on the above connection method, on the one hand, the first lamp bead 1 and the second lamp bead 2 share at least one pin, which reduces the number of pins on the back of the two-in-one TOP LED lamp bead and simplifies the design of the PCB lead circuit; on the other hand, the first lamp bead 1 and the second lamp bead 2 are separately packaged and split, so that the first lamp bead 1 and the second lamp bead 2 with consistent optical parameters (such as luminous flux, brightness, color temperature) and colorimetric parameters (such as color rendering index and chromaticity index) can be connected to form a two-in-one lamp bead, which greatly optimizes the display effect. Third, the first connecting part 121 and the second connecting part 211 are detachably connected, that is, the distance between the first lamp bead 1 and the second lamp bead 2 is adjustable, which also makes the pixel spacing based on the two-in-one TOP LED lamp bead adjustable, and also makes it possible to discard one of the lamp beads according to the specific situation during subsequent maintenance, thereby reducing maintenance costs.

[0059] Specifically, the first connecting portion 121 and the second connecting portion 211 can be bonded to achieve the connection between the first lamp bead 1 and the second lamp bead 2, but the present invention is not limited thereto. Preferably, in one embodiment, the first pin 14 exposed at the top of the first connecting portion 121 is welded to the second pin 24 exposed at the bottom of the second connecting portion 211 to achieve the connection between the first lamp bead 1 and the second lamp bead 2. Firstly, this connection process can be integrated with the later mounting welding process to simplify the preparation process of the lamp bead; secondly, the connection formed by welding is convenient for disassembly and assembly during the later maintenance process. Thirdly, the electrical connection between the first pin 14 and the second pin 24 can be optimized so that the first lamp bead 1 and the second lamp bead 2 can share at least one pin drive. Fourthly, by welding, the overlapping area of ​​the first connecting portion 121 and the second connecting portion 211 can be more accurately controlled, that is, it is more conducive to achieving the spacing between the first lamp bead 1 and the second lamp bead 2, and more conducive to achieving pixel spacing adjustment.

[0060] Specifically, after the first lamp bead 1 is connected to the second lamp bead 2, the second connecting portion 211 is located above the first connecting portion 121, and the second connecting portion 211 partially covers or completely covers the second connecting portion 211 to achieve pixel pitch adjustment. Preferably, in one embodiment, the second connecting portion 211 completely covers the first connecting portion 121. Based on this structure, the reliability of the two-in-one TOP LED lamp bead can be improved. Based on this embodiment, the extension length of the first connecting portion 121 and the second connecting portion 211 can be designed according to the requirements of the pixel pitch.

[0061] Specifically, in some embodiments, the first pin 14 includes a first embedded portion 141, a first exposed portion 142, and a second exposed portion 143, which are sequentially connected. The first exposed portion 142 is located above the first connecting portion 121. One end of the second exposed portion 143 is located on the side of the first bracket 12, and the other end is bent and abuts the bottom surface of the first bracket 12. In other words, the portion of the first pin 14 corresponding to the first connecting portion 121 is completely exposed. Based on this embodiment, the electrical connection between the first pin 14 and the second pin 24 can be strengthened.

[0062] Specifically, in some embodiments, the second pin 24 includes a second embedded portion 241 and a third exposed portion 242, which are connected at one point. The third exposed portion 242 is located below the second connecting portion 211 and extends toward the first lamp bead 1. In other words, the portion of the second pin 24 corresponding to the second connecting portion 211 is completely exposed. This approach strengthens the electrical connection between the first pin 14 and the second pin 24.

[0063] Specifically, in some embodiments, the third exposed portion 242 is provided with a bending portion 243 that bends upward. Based on the bending portion 243, the first reflective cup 11 and the second reflective cup 21 are flush with each other after the first lamp bead 1 and the second lamp bead 2 are connected. Based on the above control, not only the display effect can be further optimized, but also the airtightness of the two-in-one TOP LED lamp bead can be improved.

[0064] Specifically, in some embodiments, the first lamp bead 1 further includes at least one third pin 16, one end of which is disposed on the front surface of the first bracket 12, and the other end of which is bent and abuts against the back surface of the first bracket 12. The first pin 14 and the third pin 16 are disposed on either side of the first LED chip 13. Preferably, in one embodiment, the first lamp bead 1 includes one third pin 16, which can be a cathode pin or a positive pin, but is not limited thereto. In other words, the multiple first LED chips 13 can share a common cathode or a common positive pole, but is not limited thereto.

[0065] Specifically, in some embodiments, the second lamp bead 2 further includes a fourth pin 26 , one end of which is bonded to the front of the second bracket 22 and the other end of which is bent and abuts the back of the second bracket 22 . The second pin 24 and the fourth pin 26 are disposed on either side of the second LED chip 23 . Preferably, in one embodiment, the second lamp bead 2 includes a fourth pin 26 , which can be a cathode pin or a positive pin, but is not limited thereto. In other words, the multiple first LED chips 13 can share a common cathode or a common positive pole, but is not limited thereto.

[0066] Specifically, in some embodiments, the first lamp bead 1 further includes at least one first die-bonding region 17, which may or may not be connected to the first pin 14. For example, in one embodiment, the first lamp bead 1 includes a first die-bonding region 17, which is a monolithic structure, with the plurality of first LED chips 13 fixed within the first die-bonding region 17. Based on this approach, the area of ​​the first die-bonding region 17 can be increased, improving heat dissipation and thereby enhancing the reliability of the two-in-one TOP LED lamp bead.

[0067] Specifically, in some embodiments, the second lamp bead 2 further includes a second die-bonding area 27, which may or may not be connected to the second pin 24. For example, in one embodiment, the second lamp bead 2 includes a single, integral second die-bonding area 27, with multiple second LED chips 23 secured within the second die-bonding area 27. This approach increases the area of ​​the second die-bonding area 27, improving heat dissipation and, consequently, the reliability of the two-in-one TOP LED lamp bead.

[0068] Preferably, in some embodiments, the first LED chip 13 includes a first red LED chip 131, a first green LED chip 132 and a first blue LED chip 133; the first lamp bead 1 includes three first solid crystal areas 17, which are respectively used to fix the first red LED chip 131, the first green LED chip 132 and the first blue LED chip 133; the first lamp bead 1 includes three first pins 14, which are respectively used to electrically connect the positive poles of the first red LED chip 131, the first green LED chip 132 and the first blue LED chip 133; the first lamp bead 1 includes a third pin 16, which is used to electrically connect the negative poles of the first red LED chip 131, the first green LED chip 132 and the first blue LED chip 133.

[0069] Preferably, in some embodiments, the second LED chip 23 includes a second red LED chip 231, a second green LED chip 232, and a second blue LED chip 233; the second lamp bead 2 includes three second die-bonding regions 27, which are respectively used to fix the second red LED chip 231, the second green LED chip 232, and the second blue LED chip 233. The second lamp bead 2 includes three second pins 24, which are respectively used to electrically connect to the positive electrodes of the second red LED chip 231, the second green LED chip 232, and the second blue LED chip 233; the second lamp bead 2 includes a fourth pin 26, which is used to electrically connect to the negative electrodes of the second red LED chip 231, the second green LED chip 232, and the second blue LED chip 233.

[0070] Specifically, in some embodiments of the present invention, the TOP LED lamp bead further includes a first lens colloid and a second lens colloid (not shown in the figure), which are respectively arranged on the first encapsulation colloid 15 and the second encapsulation colloid 25. Specifically, the first lens colloid and the first encapsulation colloid 15 can be an integrated structure or a split structure. Similarly, the second lens colloid and the second encapsulation colloid 25 can be an integrated structure or a split structure. The tops of the first lens colloid and the second lens colloid are spherical or ellipsoidal, which can further improve the brightness.

[0071] Correspondingly, an embodiment of the present invention further discloses a method for preparing a two-in-one TOP LED lamp bead, which is used to prepare the above-mentioned two-in-one TOP LED lamp bead, and the method comprises the following steps:

[0072] (1) stamping and stretching the metal substrate to obtain a first metal bracket and a second metal bracket, respectively, wherein the first metal bracket includes a pin portion, and the second metal bracket includes a second pin 24;

[0073] The metal substrate material may be copper foil, but is not limited thereto.

[0074] Specifically, after a stamping process and a stretching process commonly used in the art, unnecessary portions of the metal substrate may be removed to form the first metal bracket and the second metal bracket.

[0075] (2) forming a first bracket 12 and a first reflector cup 11 by injection molding on the first metal bracket, and forming a second bracket 22 and a second reflector cup 21 by injection molding on the second metal bracket;

[0076] (3) bending the pin portion to form a first pin 14;

[0077] (4) Fixing the first LED chip 13 in the first reflector cup 11 and fixing the second LED chip 23 in the second reflector cup 21;

[0078] (5) forming a first encapsulating colloid 15 and a second encapsulating colloid 25 to obtain a first lamp bead 1 and a second lamp bead 2;

[0079] (6) Splitting the light of the first lamp bead 1 and the second lamp bead 2;

[0080] (7) Connect the first lamp bead 1 and the second lamp bead 2 after the splitting.

[0081] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will readily conceive of other specific embodiments of the present invention without inventive effort, and such embodiments will fall within the scope of protection of the present invention.

Claims

1. A two-in-one TOP LED lamp bead, characterized in that: It comprises a first lamp bead and a second lamp bead which are separately packaged and color-separated, and the first lamp bead and the second lamp bead are detachably connected; The first lamp bead includes a first reflector cup, a first bracket, at least one first LED chip, at least one first pin, and a first encapsulation colloid; the first reflector cup is arranged on the first bracket and surrounds the first LED chip; a first connecting portion extends from a side of the first bracket close to the second lamp bead; the first pin is at least partially exposed at the top of the first connecting portion, and the first pin is bent to abut against the bottom surface of the first bracket; The second lamp bead includes a second reflector cup, a second bracket, at least one second LED chip, at least one second pin, and a second encapsulation colloid; the second reflector cup is arranged on the second bracket and surrounds the second LED chip; a second connecting portion extends from a side of the second reflector cup close to the first lamp bead, and the second pin is at least partially exposed at the bottom of the second connecting portion; After the first lamp bead and the second lamp bead are connected, the first pin exposed at the top of the first connecting portion and the second pin exposed at the bottom of the second connecting portion come into contact with each other, thereby forming an electrical connection.

2. The two-in-one TOP LED lamp bead according to claim 1, characterized in that: The first pin exposed at the top of the first connection portion is welded to the second pin exposed at the bottom of the second connection portion.

3. The two-in-one TOP LED lamp bead according to claim 1, characterized in that: After the first lamp bead and the second lamp bead are connected, the second connecting portion partially or completely covers the first connecting portion.

4. The two-in-one TOP LED lamp bead according to claim 1, characterized in that: The first pin includes a first embedded portion, a first exposed portion, and a second exposed portion connected in sequence, wherein the first exposed portion is provided above the first connecting portion, and one end of the second exposed portion is provided on a side surface of the first bracket, and the other end is bent and abuts against the bottom surface of the first bracket; and / or The second pin includes a second embedded portion and a third exposed portion connected in sequence. The third exposed portion is arranged below the second connecting portion and extends toward the first lamp bead.

5. The two-in-one TOP LED lamp bead according to claim 4, characterized in that: The third exposed portion is provided with a bent portion bent upward, so that the first reflective cup is flush with the second reflective cup after the first lamp bead is connected to the second lamp bead.

6. The two-in-one TOP LED lamp bead according to any one of claims 1 to 5, characterized in that: The first lamp bead further includes at least one third pin, one end of the third pin is arranged on the front of the first bracket, and the other end is bent and abuts against the back of the first bracket; the first pin and the third pin are arranged on both sides of the first LED chip; and / or The second lamp bead further includes a fourth pin, one end of which is bonded to the front of the second bracket, and the other end is bent and abuts against the back of the second bracket; the second pin and the fourth pin are arranged on both sides of the second LED chip.

7. The two-in-one TOP LED lamp bead according to any one of claims 1 to 5, characterized in that: The first lamp bead further includes at least one first crystal-fixing area, and the first crystal-fixing area is connected to or not connected to the first pin; and / or The second lamp bead further includes a second crystal-bonding area, and the second crystal-bonding area is connected to or not connected to the second pin.

8. The two-in-one TOP LED lamp bead according to claim 7, characterized in that: The first LED chips include a first red LED chip, a first green LED chip and a first blue LED chip; The first lamp bead includes three first pins, which are respectively used to electrically connect the positive electrodes of the first red LED chip, the first green LED chip, and the first blue LED chip; the first lamp bead includes a third pin, which is used to electrically connect the negative electrodes of the first red LED chip, the first green LED chip, and the first blue LED chip; The first lamp bead includes three first crystal-fixing areas, which are respectively used to fix the first red LED chip, the first green LED chip and the first blue LED chip; The second LED chip includes a second red LED chip, a second green LED chip and a second blue LED chip; The second lamp bead includes three second pins, which are respectively used to electrically connect the positive electrodes of the second red LED chip, the second green LED chip, and the second blue LED chip; the second lamp bead includes a fourth pin, which is used to electrically connect the negative electrodes of the second red LED chip, the second green LED chip, and the second blue LED chip; The second lamp bead includes three second crystal fixing areas, which are respectively used to fix the second red LED chip, the second green LED chip and the second blue LED chip.

9. A method for preparing a two-in-one TOP LED lamp bead, for preparing the two-in-one TOP LED lamp bead according to any one of claims 1 to 8, characterized in that: The following steps are involved: (1) stamping and stretching a metal substrate to obtain a first metal bracket and a second metal bracket, respectively, wherein the first metal bracket includes a pin portion, and the second metal bracket includes a second pin; (2) forming a first bracket and a first reflector cup by injection molding on the first metal bracket, and forming a second bracket and a second reflector cup by injection molding on the second metal bracket; (3) bending the pin portion to form a first pin; (4) Fixing the first LED chip in the first reflector cup and fixing the second LED chip in the second reflector cup; (5) forming a first encapsulating colloid and a second encapsulating colloid to obtain a first lamp bead and a second lamp bead; (6) Splitting light from the first lamp bead and the second lamp bead; (7) Connect the first lamp bead and the second lamp bead after the splitting.

10. A display screen, characterized in that: It comprises the two-in-one TOP LED lamp bead as described in any one of claims 1 to 8.

Citation Information

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