Circuit board, circuit board assembly including circuit board, and device including circuit board

Abstract

The invention relates to a circuit board, a circuit board assembly including the circuit board and a device including the circuit board. The circuit board assembly according to an embodiment of the present invention may include: a circuit board including a first outer surface and a second outer surface opposite to each other; and a semiconductor package disposed on a first outer surface of the circuit board, in which the circuit board includes: at least one opening disposed adjacent to at least a portion of an edge of the semiconductor package and formed in the shape of a groove or a hole; and a filling member which is filled in the at least one opening.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of priority to Korean Patent Application No. 10-2022-0087177, filed on Jul. 14, 2022, and Korean Patent Application No. 10-2023-0089764, filed on Jul. 11, 2023, which are hereby incorporated by reference herein in their entirety. Technical Field

[0003] The present invention relates to a circuit board, a circuit board assembly including the circuit board, and a device including the circuit board, and more particularly, to a circuit board capable of improving vibration durability, a circuit board assembly including the circuit board, and a device including the circuit board. Background Art

[0004] Recently, as the demand for portable electronic products such as notebook computers, camcorders, and mobile phones has rapidly increased, and the development of electric vehicles, energy storage batteries, robots, satellites, etc. has become systematic, a lot of research has been conducted on secondary batteries as driving power sources.

[0005] The secondary battery may transmit a signal through a circuit board on which various electronic components are mounted. A conductive pad formed on the circuit board may be electrically connected to a chip-shaped electronic component through a plurality of connection terminals. When external vibration is transmitted to such a circuit board, fatigue may accumulate at a portion where the connection terminal and the conductive pad contact each other. Damage due to fatigue accumulation may easily occur at a portion where the connection terminal and the conductive pad contact each other, to reduce durability against fatigue damage. Summary of the invention

[0006] Technical Solution

[0007] Embodiments of the present invention provide a circuit board capable of improving vibration durability, a circuit board assembly including the circuit board, and a device including the circuit board.

[0008] The objects of the present invention are not limited thereto, and those skilled in the art will clearly understand other objects not described herein from the following description.

[0009] Technical Solution

[0010] A circuit board assembly according to an embodiment of the present invention may include: a circuit board, which includes a first outer surface and a second outer surface facing each other; and a semiconductor package, which is placed on the first outer surface of the circuit board, wherein the circuit board may include: at least one opening, which is placed adjacent to at least a portion of an edge of the semiconductor package and is arranged in the form of a groove or a hole; and a filling member, which is filled into the at least one opening.

[0011] According to an embodiment, the at least one opening may be provided in the form of a hole passing through the first outer surface and the second outer surface.

[0012] According to an embodiment, the at least one opening may be configured to pass through at least a portion of at least one insulating layer among a plurality of insulating layers provided in the circuit board.

[0013] According to an embodiment, a thermal expansion coefficient of the filling member may be the same as a thermal expansion coefficient of at least one of the plurality of insulation layers.

[0014] According to an embodiment, the filling member may be made of insulating resin.

[0015] According to an embodiment, the circuit board assembly may further include: a plurality of connection terminals configured to electrically connect the semiconductor package to the circuit board, and each of the plurality of connection terminals is arranged in the form of a ball; a plurality of conductive pads connected to the plurality of connection terminals, wherein the opening may be positioned adjacent to at least one connection terminal positioned at the outermost side of the plurality of connection terminals.

[0016] According to an embodiment, the circuit board assembly may further include a signal line provided as at least one conductive layer of a plurality of conductive layers provided in the circuit board, wherein the signal line may be disposed between the openings or disposed to bypass the openings.

[0017] According to an embodiment, the circuit board assembly may further include: a plurality of conductive layers disposed between the plurality of insulating layers; a through hole passing through at least one of the plurality of insulating layers; and a conductive via disposed in the through hole to connect adjacent conductive layers to each other, wherein a depth of the opening may be deeper than a depth of the through hole.

[0018] According to an embodiment, the circuit board assembly may further include an encapsulation member configured to cover the circuit board and a portion of the semiconductor package and to contact the filling member.

[0019] According to an embodiment, the encapsulation member may be in contact with the filling member within the opening.

[0020] According to an embodiment, the circuit board assembly may further include an encapsulation member configured to cover a portion of the circuit board and the semiconductor package and made of the same material as the filling member.

[0021] According to an embodiment, the encapsulating member may be integral with the filling member.

[0022] According to an embodiment of the present invention, a circuit board includes a first outer surface and a second outer surface facing the first outer surface, the first outer surface is a surface on which a semiconductor package is placed, and the circuit board may include: at least one opening, which is placed adjacent to at least a portion of an edge of the semiconductor package and is arranged in the form of a groove or a hole; and a filling member, which is filled into the at least one opening.

[0023] A battery device according to an embodiment of the present invention may include: at least one battery pack, each battery pack including a plurality of battery cells; a battery management system (BMS) configured to manage the plurality of battery cells and provided as a semiconductor package; and the above-mentioned circuit board, on which the battery management system is mounted.

[0024] Beneficial effects

[0025] According to an embodiment of the present invention, a filling member filled into an opening passing through at least a portion of a circuit board may be provided. Therefore, the present invention may attenuate vibration transmitted from the filling member to the connection terminal to improve vibration durability.

[0026] Furthermore, according to the embodiments of the present invention, the circuit board can be prevented from being damaged due to environmental vibration input from the outside, and fatigue failure of the joint portion between the conductive pad and the connection terminal can be delayed to improve reliability.

[0027] Furthermore, various effects directly or indirectly recognized by the present disclosure can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 1 is a schematic plan view showing a circuit board assembly according to a first embodiment of the present invention.

[0029] Figure 2 is along Figure 1 A cross-sectional view taken along line "AA'" in the circuit board assembly is shown.

[0030] Figure 3 is a cross-sectional view for explaining a vibration attenuation process of a circuit board assembly according to an embodiment of the present invention.

[0031] Figure 4 yes Figure 1 An enlarged plan view of area B.

[0032] Figure 5 is a cross-sectional view showing a filling member in contact with an encapsulation member of a circuit board assembly according to a second embodiment of the present invention.

[0033] Figure 6 is a sectional view showing a filling member integrated with an encapsulation member of a circuit board assembly according to a second embodiment of the present invention. DETAILED DESCRIPTION

[0034] Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily perform the present invention. However, the present invention can be implemented in several different forms and is not limited or constrained by the following embodiments.

[0035] In order to explain the present invention clearly, detailed description of parts not related to the description of the main points of the present invention or related known technologies that may unnecessarily obscure the present invention is omitted, and in this specification, reference numerals are added to the components in each drawing. In this case, the same or similar reference numerals are assigned to the same or similar elements throughout the specification.

[0036] Furthermore, the terms or words used in the specification and claims should not be restrictively interpreted as ordinary meanings or dictionary-based meanings, but should be interpreted as meanings and concepts consistent with the scope of the present invention based on the principle that the inventor can appropriately define the concepts of the terms in order to best describe and explain his or her invention.

[0037] Circuit Board Assembly According to the First Embodiment

[0038] Figure 1 is a plan view showing a circuit board assembly according to a first embodiment of the present invention, and Figure 2 is along Figure 1 A cross-sectional view taken along line "AA'" of the circuit board assembly is shown.

[0039] Reference Figure 1 and Figure 2 , a circuit board assembly 100 according to an embodiment of the present invention may include a circuit board 200 and a semiconductor package 110 mounted on the circuit board 200 .

[0040] The semiconductor package 110 may be placed on the circuit board 200 and may be electrically connected to the circuit board 200 through the connection terminal 120. The semiconductor package 110 may include at least one of an active element or a passive element. The active element may include a transistor or an integrated circuit (IC). The passive element may include at least one of a capacitor, a resistor, or an inductor. For example, the semiconductor package 110 may include at least one semiconductor chip, and the passive element may increase the signal processing speed of the semiconductor chip or perform a filtering function.

[0041] The semiconductor package 110 may include a plurality of connection terminals 120 disposed on a surface thereof facing the circuit board 200. The connection terminals 120 may include solder balls or pads. Depending on the type of the connection terminals 120, the semiconductor package 110 may have a form of a ball grid array (BGA), a fine ball grid array (FBGA), or a land grid array (LGA).

[0042] The connection terminal 120 may be interposed between the semiconductor package 110 and the circuit board 200 , and at least one may be provided.

[0043] The circuit board 200 may include a first outer surface 201 facing the semiconductor package 110 and a second outer surface 202 pointing to the opposite direction of the first outer surface 201. At least one semiconductor package 110 may be mounted on the first outer surface 201 of the circuit board 200. The first outer surface 201 of the circuit board 200 may be the top surface of the insulating layer 225 disposed on the uppermost side of a plurality of insulating layers 221, 222, 223, 224 and 225, or may be the top surface of a solder resist layer (not shown). The solder resist layer may be disposed on an area other than an area where the connection terminal 120 is disposed. The solder resist layer may be disposed around at least one of the conductive pads 220. The solder resist layer may be used to prevent the conductive pads 220 disposed on the circuit board 200 from short-circuiting, and to protect the conductive pads 220 from external impact, moisture or contaminants. The second outer surface 202 of the circuit board 200 may be a bottom surface of the insulating layer 221 disposed at the lowermost side of the plurality of insulating layers 221 , 222 , 223 , 224 , and 225 .

[0044] The circuit board 200 may include a plurality of insulating layers 221 , 222 , 223 , 224 , and 225 , a plurality of conductive layers 211 , 212 , 213 , and 214 , at least one conductive pad 220 , at least one opening 230 , and a filling member 300 (or a damping member).

[0045] A plurality of insulating layers 221, 222, 223, 224, and 225 may be disposed between the plurality of conductive layers 211, 212, 213, and 214 to prevent short circuits of adjacent conductive layers 211, 212, 213, and 214. At least one of the plurality of insulating layers 221, 222, 223, 224, and 225 may be provided as a thermosetting resin (such as an epoxy resin), a thermoplastic resin (such as polyimide), or a resin (for example, at least one of prepreg, ajinomoto build-up film ABF, FR-4, or bismaleimide triazine (BT)) impregnated into a core material (such as glass fiber (glass cloth, glass fabric)) together with an inorganic filler. Figure 1 , for ease of explanation, a 5-layer structure in which a plurality of insulating layers 221 , 222 , 223 , 224 , and 225 are stacked is shown, but the embodiment is not limited thereto, and the number of insulating layers 221 , 222 , 223 , 224 , and 225 may be less than 5 or greater than 5.

[0046] A plurality of conductive layers 211, 212, 213, and 214 may be disposed on the insulating layers 221, 222, 223, 224, and 225 so as to be alternately disposed with the plurality of insulating layers 221, 222, 223, 224, and 225. At least one of the plurality of conductive layers 211, 212, 213, and 214 may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof. Among the plurality of conductive layers 211, 212, 213, and 214, the plurality of conductive layers 211, 212, 213, and 214 disposed on different planes may be electrically connected by a conductive via 240 disposed in a through hole 242 passing through at least one insulating layer 221, 222, 223, 224, or 225. For example, a plurality of vertically adjacent conductive layers 211, 212, 213, and 214 may be electrically connected by conductive vias 240 disposed in through-holes 242. Conductive vias 240 may be disposed such that each through-hole 242 is completely filled with metal material, or may be disposed along a wall of through-hole 242 except for the center of through-hole 242.

[0047] A metal material may be used as the material of the conductive via 240, and examples of the metal material may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. The conductive via 240 may be made of the same material as or different from at least one of the plurality of conductive layers 211, 212, 213, and 214.

[0048] A plurality of conductive pads 220 may be disposed on the first outer surface 201 included in the circuit board 200. The conductive pads 220 may be electrically connected through the connection terminals 120 of the semiconductor package 100 connected to the circuit board 200.

[0049] At least one opening 230 may be defined adjacent to at least a portion of an edge of the semiconductor package 110. At least one opening 230 may be defined along at least one side of the plurality of side surfaces of the semiconductor package 110. At least one opening 230 may be positioned adjacent to at least one connection terminal 120 positioned at the outermost side of the plurality of connection terminals 120. At least one opening 230 may be positioned adjacent to at least one conductive pad 220 positioned at the outermost side of the plurality of conductive pads 220 contacting the semiconductor package 110.

[0050] The depth of the at least one opening 230 may be deeper than the depth of at least one of the plurality of through holes 242. The at least one opening 230 may be defined in the shape of a groove or a hole. The hole-shaped opening 230 may be defined to pass through the first outer surface 201 and the second outer surface 202 of the circuit board 200. The hole-shaped opening 230 may be defined to pass through each of the plurality of insulating layers 221, 222, 223, 224, and 225 included in the circuit board 200. The groove-shaped opening 230 may be defined to pass through at least a portion of at least one of the plurality of insulating layers 221, 222, 223, 224, and 225 included in the circuit board 200.

[0051] The at least one opening 230 may be provided in plurality. Each of the plurality of openings 230 may be disposed to be spaced apart from an adjacent opening 230. The plurality of openings 230 may be disposed to be spaced apart from an adjacent opening 230 in a direction parallel to an edge of the semiconductor package 110.

[0052] At least one opening 230 may be provided as one opening. The one opening 230 may be provided in an elliptical shape having widths and lengths different from each other. The length of the one opening 230 may be longer than the width. The length of the one opening 230 may be provided parallel to the edge of the semiconductor package 110 and may be longer than the width of the opening 230.

[0053] The filling member 300 may be filled into each of the plurality of openings 230. The filling member 300 may be partially or completely filled into the space within the opening 230. The filling member 300 may be in contact with the side surface of each of the plurality of insulating layers 221, 222, 223, 224, and 225 exposed by the opening 230. The filling member 300 may be provided by filling the space within the opening 230 with an insulating material (or resin) in a slurry state or an ink state and then curing. For example, the filling member 300 may be made of the same material as at least one of the plurality of insulating layers 221, 222, 223, 224, and 225. The filling member 300 may absorb or attenuate vibration transmitted through the circuit board 200 due to an externally applied impact. Even if the number of the connection terminals 120 soldered to the conductive pad 220 is large, the size of each of the connection terminals 120 is small, and the strain rate of each of the connection terminals 120 due to vibration is different, the filling member 300 may absorb and attenuate the vibration. Therefore, the present invention can block the transmission of vibration to the connection terminal 120 and the semiconductor package 110 to improve the vibration durability of the connection terminal 120 and the semiconductor package 110 .

[0054] The fact that the opening 230 is defined to be adjacent to at least a portion of the edge of the semiconductor package 110 may mean that the opening 230 is defined to be close to the semiconductor package 110, so that the presence of the opening 230 effectively reduces the vibration transmitted from the outside to the semiconductor package 110. Specifically, when the opening 230 moves away from the semiconductor package 110, the opening 230 may be defined within a range in which the amount of vibration newly generated on the area between the opening 230 and the semiconductor package 110 is less than the amount by which the opening 230 attenuates the vibration transmitted from the outside to the semiconductor package 110.

[0055] The filling member 300 may have a thermal expansion coefficient corresponding to the thermal expansion coefficient of at least one of the plurality of insulating layers 221, 222, 223, 224, and 225. The thermal expansion coefficient of the filling member 300 may be the same as or similar to the thermal expansion coefficient of at least one of the plurality of insulating layers 221, 222, 223, 224, and 225. The difference in thermal expansion coefficient between the filling member 300 and the insulating layers 221, 222, 223, 224, and 225 may be small. When the circuit board 200 expands or contracts due to temperature changes, the expansion rate of the filling member 300 and the expansion rate of each of the insulating layers 221, 222, 223, 224, and 225 may correspond to each other. The stress between the filling member 300 and the insulating layers 221, 222, 223, 224, and 225 may be minimized. Therefore, it is possible to prevent cracks from occurring in at least one of the insulating layers 221 , 222 , 223 , 224 , and 225 and the filling member 300 due to temperature change.

[0056] Figure 3 is a cross-sectional view for explaining a vibration attenuation process of a circuit board assembly according to an embodiment of the present invention.

[0057] Reference Figure 3 The circuit board 200 according to the embodiment of the present invention may include a first region R1, a second region R2 and a third region R3. At least a portion of the third region R3 may be disposed outside the first region R1, and at least a portion of the second region R2 may be disposed outside the third region R3.

[0058] At least one semiconductor package 110 and a connection terminal 120 may be disposed on at least a portion of the first region R1. At least a portion of the first region R1 may overlap with the semiconductor package 110 and the connection terminal 120. The first region R1 may include a plurality of layer structures. For example, the first region R1 may include a plurality of insulating layers (e.g., Figure 2 Insulating layers 221, 222, 223, 224 and 225) and a plurality of conductive layers (eg, Figure 2As described above, the first region R1 may be a region in which the connection terminal 120 is disposed and a plurality of insulating layers and a plurality of conductive layers are disposed.

[0059] The second region R1 may be a region disposed between the outer surface 203 of the circuit board 200 and the filling member 300. Since at least one semiconductor package 110 is not mounted on the second region R1, the second region R1 may not overlap with at least one semiconductor package 110 and the connection terminal 120. The second region R2 may include a plurality of layer structures. For example, the second region R2 may include a plurality of insulating layers (e.g., Figure 2 Insulating layers 221, 222, 223, 224 and 225) and a plurality of conductive layers (eg, Figure 2 As described above, the second region R2 may be a region in which the filling member 300 and the connection terminal 120 are not disposed but a plurality of insulating layers and a plurality of conductive layers are disposed.

[0060] The third region R3 may be disposed between the first region R1 and the second region R2. At least one opening 230 passing through the first outer surface 201 and the second outer surface 202 of the circuit board 200 may be defined in the third region R3. The filling member 300 may be disposed in the opening 230. The filling member 300 may contact the inner surface 204 of the circuit board 200 provided by defining the opening 230. As described above, the third region R3 is a region in which the filling member 300 is disposed, and may be a region in which the connection terminal 120, the plurality of insulating layers, and the plurality of conductive layers are not disposed.

[0061] The opening 230 may be defined further outside the connection terminal 120. More specifically, the opening 230 may be disposed outside the outermost connection terminal 120, and the filling member 300 filled in the opening 230 may be disposed further outside than the outermost connection terminal 120 among the plurality of connection terminals 120. That is, one surface of the filling member 300 may be disposed further outside than one surface of the outermost connection terminal 120 among the plurality of connection terminals 120. When external vibration enters the circuit board, the vibration may be transmitted to the first region R1 through the second region R2, and therefore, the third region R3 may be disposed between the second region R2 and the first region R1 to allow the vibration passing through the second region R2 to pass through the third region R3, and also to reduce the amplitude and energy of the vibration transmitted to the first region R1. To this end, the opening 230 defined in the third region R3 may be placed more externally than the outermost connection terminal 120 of the connection terminal 120 placed in the first region R1, and the filling member 300 may be filled into the opening 230 to prevent the connection terminal 120 placed more internally than the opening 230 from being damaged due to vibration, thereby improving vibration durability. The filling member 300 may be placed in the vibration transmission path from the second region R2 of the circuit board 200 to the first region R1. The filling member 300 may be placed in the vibration transmission path from the outer surface 203 of the circuit board 200 to the inside of the circuit board 200. Since the filling member 300 has a buffering function, the vibration guided to the inside 204 of the circuit board 200 can be substantially absorbed and eliminated by the filling member 300 while passing through the filling member 300. As described above, the vibration transmitted from the outside through the inside of the circuit board 200 can be attenuated or absorbed in the filling member 300, and therefore, the transmission of the vibration from the second region R2 of the circuit board 200 to the first region R1 can be reduced or blocked. Therefore, since vibration transmitted to the connection terminal 120 and the semiconductor package 110 disposed in the first region R1 is reduced or blocked, the present invention can improve durability against vibration.

[0062] Figure 4 is a schematic diagram of multiple signal lines placed on a circuit board according to an embodiment of the present invention.

[0063] Reference Figure 4 , a plurality of signal lines 210 may be disposed on the circuit board 200. Each of the plurality of signal lines 210 may be provided as a plurality of conductive layers (eg, Figure 2 The signal line 210 may be electrically connected to the semiconductor package 110 to transmit at least one of an input signal and an output signal of the semiconductor package 110. For example, the signal line 210 may transmit a ground signal, a power signal, and a control signal.

[0064] At least one of the plurality of signal lines 210 may pass between the openings 230 arranged in a row. At least one of the plurality of signal lines 210 may be disposed to bypass at least one of the openings 230. Therefore, when the openings 230 passing through the plurality of insulating layers 201, 202, 203, 204, and 205 are defined, the signal line 210 disposed around the openings 230 may be prevented from being damaged.

[0065] Circuit board assembly according to the second embodiment

[0066] Figures 5 and 6 2 is a cross-sectional view showing a circuit board assembly according to a second embodiment of the present invention. Hereinafter, a detailed description of the same configuration as that of the circuit board assembly according to the first embodiment of the present invention will be omitted.

[0067] Reference Figure 5 and Figure 6 , a circuit board assembly 100 according to the second embodiment of the present invention may include a circuit board 200 , a semiconductor package 110 , and an encapsulation member 500 .

[0068] The circuit board 200 may include a plurality of insulating layers 221 , 222 , 223 , 224 , and 225 , a plurality of conductive layers 211 , 212 , 213 , and 214 , at least one conductive pad 220 , at least one opening 230 , and a filling member 300 .

[0069] At least one opening 230 may be defined through the first and second outer surfaces 201 and 202 of the circuit board 200. As an example, at least one opening 230 may be defined through each of the plurality of insulating layers 221, 222, 223, 224, and 225 included in the circuit board 200.

[0070] The filling member 300 may be filled into each of the plurality of openings 230. The filling member 300 may be partially or completely filled into the space within the opening 230. For example, the filling member 300 may be made of the same material as at least one of the plurality of insulating layers 221, 222, 223, 224, and 225. The filling member 300 may absorb or attenuate vibration transmitted through the circuit board 200 due to an externally applied impact. Therefore, the present invention may prevent vibration from being transmitted to the connection terminal 120 and the semiconductor package 110.

[0071] The filling member 300 may have a thermal expansion coefficient corresponding to that of at least one of the plurality of insulating layers 221, 222, 223, 224, and 225. The thermal expansion coefficient of the filling member 300 may be the same as or similar to that of at least one of the plurality of insulating layers 221, 222, 223, 224, and 225. Therefore, cracks may be prevented from occurring in at least one of the insulating layers 221, 222, 223, 224, and 225 and the filling member 300 due to temperature changes.

[0072] The encapsulation member 500 may protect electrical connection between the circuit board 200 and the semiconductor package 110. The encapsulation member 500 may be provided to cover a portion of the circuit board 200 and the semiconductor package 110. The encapsulation member 500 may be interposed between the connection terminals 120 and between the conductive pads 220.

[0073] According to an embodiment, the encapsulation member 500 may be disposed in contact with the filling member 300, such as Figure 5 The encapsulating member 500 may be arranged to be in interface contact with one surface of the filling member 300, as shown in FIG. Figure 5 The encapsulation member 500 may be disposed in a portion of the opening 230 and may be in contact with the filling member 300 in the opening 230. Figure 5 1 and 10. The method for manufacturing the encapsulation member 500 and the filling member 300 shown in the figure is described. The filling member 300 can be formed by defining an opening 230 in the circuit board 200 and then printing a first insulating resin using a metal mask. Here, the first insulating resin can be partially filled in the opening 230 to form the filling member 300. Then, after the semiconductor package 110 is installed, the encapsulation member 500 can be formed by printing a second insulating resin on a portion of the circuit board 200 and the semiconductor package 110. The second insulating resin can be made of the same or different material as the first insulating resin. A portion of the encapsulation member 500 can be filled in the opening 230 so that the encapsulation member 500 contacts the filling member 300 in the opening 230.

[0074] According to another embodiment, the encapsulating member 500 may be formed integrally with the filling member 300, such as Figure 6 As shown. The encapsulation member 500 can be integrated with the filling member 300 without an interface. Figure 61 and 10. The method for manufacturing the encapsulation member 500 and the filling member 300 shown in the figure is described. The encapsulation member 500 can be formed by forming the opening 230 in the circuit board 200 and then printing the insulating resin as the material of the encapsulation member 500 using a metal mask. Here, a part of the insulating resin can be filled into the opening 230 to form the filling member 300. A part of the insulating resin can be squeezed into the opening 230 so that the filling member 300 is easily filled into the opening 230. The remaining part of the insulating resin can be formed on a part of the circuit board 200 and the semiconductor package 110 to form the encapsulation member 500. The encapsulation member 500 can be formed of the same material as the filling member 300 and can be integrated with the filling member 300.

[0075] The above-mentioned circuit board 200 can be mounted on a plurality of semiconductor packages 110 and on a designated electronic device. For example, the circuit board 200 can be mounted on a battery module including a rechargeable and dischargeable secondary battery. The battery module may include a battery management system (BMS), which is a safety system that protects battery cells from over-discharge, over-charge, and over-current. The BMS may be made of a semiconductor package 110 and may be mounted on the circuit board 200. The battery module including the BMS mounted on the circuit board 200 may be applied to various devices. It may be applied to transportation vehicles such as electric bicycles, electric vehicles, hybrid power, etc., but is not limited thereto, and may be applied to various devices capable of using battery modules.

[0076] While embodiments of the present invention have been described with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.

[0077] [Description of symbol]

[0078] 100: Circuit board assembly

[0079] 110: Semiconductor packaging

[0080] 120: Connection terminal

[0081] 200: Circuit board

[0082] 211, 212, 213, 214: Conductive layer

[0083] 220: Conductive pad

[0084] 221, 222, 223, 224, 225: Insulation layer

[0085] 230: Opening

[0086] 240: Conductive parts

[0087] 242: Through hole

[0088] 300: Filling component

[0089] 500: Encapsulation component

Claims

1. A circuit board assembly, comprising: a circuit board, the circuit board comprising a first outer surface and a second outer surface facing each other; as well as a semiconductor package disposed on the first outer surface of the circuit board, Wherein, the circuit board comprises: at least one opening disposed adjacent to at least a portion of an edge of the semiconductor package and configured in the form of a recess or a hole; and A filling member is filled into the at least one opening.

2. The circuit board assembly according to claim 1, wherein: The at least one opening is provided in the form of a hole passing through the first outer surface and the second outer surface.

3. The circuit board assembly according to claim 1, further comprising at least one connection terminal between the semiconductor package and the circuit board, in, The opening is positioned further outward than the connection terminal.

4. The circuit board assembly according to claim 3, wherein: The connection terminals are provided in plurality, and One surface of the filling member is disposed more outer than one surface of the connection terminal disposed at the outermost side of the plurality of connection terminals.

5. The circuit board assembly according to claim 1, wherein: The at least one opening is configured to pass through at least a portion of at least one insulating layer among a plurality of insulating layers disposed in the circuit board.

6. The circuit board assembly according to claim 5, wherein: The filling member has a thermal expansion coefficient that is the same as a thermal expansion coefficient of at least one of the plurality of insulating layers.

7. The circuit board assembly according to claim 1, wherein: The filling member is made of insulating resin.

8. The circuit board assembly according to claim 1, further comprising: a plurality of connection terminals configured to electrically connect the semiconductor package to the circuit board, and each of the plurality of connection terminals being provided in the form of a ball; a plurality of conductive pads connected to the plurality of connection terminals, The opening is disposed adjacent to at least one connection terminal disposed at the outermost side of the plurality of connection terminals.

9. The circuit board assembly according to claim 1, further comprising a signal line, the signal line being provided as at least one conductive layer among a plurality of conductive layers provided in the circuit board, in, The signal line is disposed between the openings or is disposed so as to bypass the openings.

10. The circuit board assembly according to claim 5, further comprising: a plurality of conductive layers disposed between the plurality of insulating layers; a through hole, the through hole passing through at least one insulating layer among the plurality of insulating layers; as well as a conductive via disposed in the through hole to connect adjacent conductive layers to each other, Wherein, the depth of the opening is deeper than the depth of the through hole. 11 . The circuit board assembly according to claim 1 , further comprising an encapsulation member configured to cover the circuit board and a portion of the semiconductor package and to be in contact with the filling member.

12. The circuit board assembly according to claim 11, wherein: The encapsulating member is in contact with the filling member within the opening. 13 . The circuit board assembly according to claim 1 , further comprising an encapsulation member configured to cover the circuit board and a portion of the semiconductor package and made of the same material as the filling member.

14. The circuit board assembly according to claim 13, wherein: The encapsulating member is integral with the filling member.

15. A circuit board, comprising a first outer surface and a second outer surface facing the first outer surface, the first outer surface being a surface on which a semiconductor package is placed, the circuit board comprising: at least one opening disposed adjacent to at least a portion of an edge of the semiconductor package and configured in the form of a recess or a hole; as well as A filling member is filled into the at least one opening.

16. The circuit board according to claim 15, wherein: The at least one opening is provided in the form of a hole passing through the first outer surface and the second outer surface.

17. The circuit board according to claim 15, wherein: The at least one opening is configured to pass through at least a portion of at least one insulating layer among a plurality of insulating layers provided in the circuit board.

18. The circuit board according to claim 17, wherein: The filling member is made of an insulating resin having the same thermal expansion coefficient as that of at least one of the plurality of insulating layers.

19. The circuit board according to claim 15, further comprising at least one connection terminal between the semiconductor package and the circuit board, in, The opening is positioned further outward than the connection terminal.

20. The circuit board according to claim 19, wherein The connection terminals are provided in plurality, and One surface of the filling member is disposed more outer than one surface of the connection terminal disposed at the outermost side of the plurality of connection terminals.

21. A battery device comprising: at least one battery pack, each battery pack of the at least one battery pack comprising a plurality of battery cells; a battery management system (BMS) configured to manage the plurality of battery cells and provided as a semiconductor package; as well as The circuit board according to any one of claims 15 to 20, wherein the battery management system is mounted on the circuit board.

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