Ceramic wiring member mother substrate and ceramic wiring member

Abstract

When viewed in the thickness direction, the ceramic wiring member mother substrate (100) is a ceramic wiring member mother substrate in which a plurality of rectangular ceramic wiring members (110, 120) are laid over and integrally connected. The plurality of ceramic wiring members (110, 120) include a first ceramic wiring member (110) and a second ceramic wiring member (120). The first ceramic wiring member (110) and the second ceramic wiring member (120) are disposed such that the first side (111) of the first ceramic wiring member (110) and the second side (121) of the second ceramic wiring member (120) partially overlap. A first via hole (131) and a first via hole conductor (28) are formed in a region where the first side (111) and the second side (121) overlap. The first ceramic wiring member (110) and the second ceramic wiring member (120) are disposed point-symmetrically with respect to the first via conductor (28).

Description

Technical Field

[0001] The present disclosure relates to a ceramic wiring member motherboard and a ceramic wiring member. Background Art

[0002] A ceramic wiring member is known, comprising: a main body portion made of ceramic having a plate-like portion; and a conductive portion configured to be in contact with the plate-like portion. Such a ceramic wiring member is used as a member for holding electronic components. The conductive portion constitutes a part of a current path for current to flow into or out of the electronic component. From the viewpoint of making the manufacturing process efficient, such a ceramic wiring member can be manufactured by manufacturing a ceramic wiring member mother substrate covered with a plurality of ceramic wiring members and connected as a whole, and then dividing it into a plurality of ceramic wiring members as a single piece (for example, refer to International Publication No. 2017 / 126596 (Patent Document 1), Japanese Patent Publication No. 2000-312060 (Patent Document 2), and Japanese Patent Publication No. 2016-66676 (Patent Document 3)).

[0003] Prior art literature Patent Literature Patent Document 1: International Publication No. 2017 / 126596 Patent Document 2: Japanese Patent Application Publication No. 2000-312060 Patent Document 3: Japanese Patent Application Publication No. 2016-66676 Summary of the invention

[0004] Technical problem to be solved by the invention A ceramic wiring component is known, which includes: a main body made of ceramic, which has a plate-like portion; and a conductive portion, which is configured to contact the main body, and the ceramic wiring component has a rectangular shape when viewed in a direction perpendicular to the plate-like portion. In such a ceramic wiring component, the following structure is sometimes adopted: the conductive portion includes a frame-like portion arranged on the main body in a ring shape along the outer periphery of the rectangle when looking down on the upper surface, and includes a ground terminal arranged on the main body when looking down on the back. In a ceramic wiring component with such a structure, electronic components such as crystal elements are accommodated in the space on the plate-like portion that is sealed by joining a metal cover portion to the frame-like portion. In addition, the grounding of the cover portion is ensured by electrically connecting the frame-like portion to the ground terminal. The electrical connection between the frame-like portion and the ground terminal can be achieved, for example, by forming a through hole that passes through the main body from the frame-like portion to the ground terminal, and filling the through hole with a conductor.

[0005] In response to the demand for miniaturization of electronic devices in recent years, ceramic wiring components are also required to be miniaturized. If the ceramic wiring component is miniaturized, the width of the frame-shaped portion becomes smaller, and it is difficult to achieve electrical connection between the frame-shaped portion and the ground terminal based on the formation of the through hole. In contrast, the following countermeasures can be adopted: instead of the through hole, a groove portion from the frame-shaped portion to the ground terminal is formed on the outer periphery of the main body, and a conductor is arranged on the wall surface of the groove portion, thereby achieving electrical connection between the frame-shaped portion and the ground terminal.

[0006] In the case of manufacturing such a ceramic wiring member by a manufacturing process for pre-manufacturing the above-mentioned ceramic wiring member mother substrate, the following process can be adopted: a ceramic wiring member mother substrate is prepared in which the ceramic wiring members are spread and arranged in a matrix in such a manner that four ceramic wiring members share the vertices of a rectangle, and on this basis, through holes are formed at positions corresponding to the vertices of the rectangle, and a conductor is arranged on the wall surface surrounding the through hole. Furthermore, the ceramic wiring member can be manufactured by dividing it into ceramic wiring members along the outer periphery of the rectangle.

[0007] However, according to the research of the inventors, when the above-mentioned process is adopted, when the conductor is divided into ceramic wiring components, the problem of the conductor arranged on the wall surface surrounding the through hole falling off may occur. It can be considered that the reason is that the conductor located at the vertex of the rectangle is separated into four by segmentation, so the contact area between the wall surface of the through hole and the conductor becomes smaller and is easy to fall off. The falling off of the conductor leads to a decrease in the reliability of the electrical connection between the frame-shaped portion and the ground terminal. On the other hand, by replacing the vertex of the rectangle and forming the through hole and the conductor at the position corresponding to the side away from the vertex of the rectangle, the contact area between the conductor and the wall surface of the through hole is increased, and the falling off of the conductor can be suppressed. However, if two ceramic wiring components that share the above-mentioned through hole and the conductor are separated, for example, left and right, in the state of the ceramic wiring component mother substrate, a ceramic wiring component with a conductor located on the left and a ceramic wiring component with a conductor located on the right will be obtained, and two ceramic wiring components with different structures will be obtained. In the manufacture of ceramic wiring components, it is preferred to mass-produce products of the same structure. Therefore, the manufacture of two ceramic wiring components with different structures requires the management of the structure of the ceramic wiring component, which becomes an obstacle to the efficiency of the manufacturing process.

[0008] The present disclosure aims to solve the above-mentioned problems, and one of the objects of the present disclosure is to provide a ceramic wiring member motherboard and a ceramic wiring member capable of maintaining reliability of electrical connection between a frame-shaped portion and a ground terminal and achieving efficient manufacturing process.

[0009] Means for solving technical problems The ceramic wiring component mother substrate according to the present disclosure has: a first surface, which is a surface in the thickness direction; and a second surface, which is a surface on the opposite side of the first surface in the thickness direction. When viewed in the thickness direction, the ceramic wiring component mother substrate is a ceramic wiring component mother substrate in which a plurality of ceramic wiring components having a rectangular shape are spread and connected as one. The plurality of ceramic wiring components include: a first ceramic wiring component; and a second ceramic wiring component connected to the first ceramic wiring component.

[0010] The first ceramic wiring member and the second ceramic wiring member respectively include: a main body portion made of ceramic, which has a plate-like portion; and a conductive portion, which is configured to contact the main body portion. In a top view of the first surface side, the conductive portion includes: a frame-like portion, which is arranged on the main body portion in a ring shape along the outer periphery of the rectangle; and a pair of internal terminals, which are arranged on the area of ​​the main body portion surrounded by the frame-like portion. In a top view of the second surface side, the conductive portion includes: a pair of external terminals, which are arranged on the main body portion separately from each other; and a ground terminal, which is arranged on the main body portion separately from the pair of external terminals. One of the pair of internal terminals is electrically connected to one of the pair of external terminals. The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals.

[0011] A fracture groove extending along each side of the above-mentioned rectangle of the adjacent plurality of ceramic wiring components is formed on at least one of the first and second surfaces. The first ceramic wiring component and the second ceramic wiring component are arranged in such a manner that the first side of the first ceramic wiring component as one of the sides of the rectangle partially overlaps with the second side of the second ceramic wiring component as one of the sides of the rectangle, and the two ends of the first side do not overlap with the two ends of the second side. A first via hole penetrating the ceramic wiring component mother substrate in the thickness direction is formed in the area where the first side overlaps with the second side. The conductive portion also includes a first via conductor, which is formed on the wall surface surrounding the first via, and connects the grounding terminal of the first ceramic wiring component and the second ceramic wiring component to the frame-shaped portion of the first ceramic wiring component and the second ceramic wiring component. When observed in the thickness direction of the ceramic wiring component mother substrate, the first ceramic wiring component and the second ceramic wiring component are arranged point-symmetrically with respect to the first via conductor. A plurality of ceramic wiring components are composed of a first ceramic wiring component and a second ceramic wiring component connected to each other as a unit structure, and are formed by filling the unit structure without gaps.

[0012] The ceramic wiring component according to the present disclosure includes: a main body portion made of ceramic, which has a plate-like portion; and a conductive portion, which is configured to contact the main body portion, and the ceramic wiring component has a rectangular shape when viewed in a direction perpendicular to the plate-like portion. The plate-like portion has: a first main surface, which is a main surface in the thickness direction; and a second main surface, which is located on the opposite side of the first main surface in the thickness direction. In a top view from the first main surface side, the conductive portion includes: a frame-like portion, which is arranged on the main body portion in a ring shape along the outer periphery of the rectangle; and a pair of internal terminals, which are arranged on the area of ​​the main body portion surrounded by the frame-like portion. In a top view from the second main surface side, the conductive portion includes: a pair of external terminals, which are arranged on the main body portion separately from each other; and a ground terminal, which is arranged on the main body portion separately from the pair of external terminals.

[0013] One of a pair of internal terminals is electrically connected to one of a pair of external terminals. The other of a pair of internal terminals is electrically connected to the other of a pair of external terminals. On the periphery of the main body, a first groove portion is formed separately from the vertices of the rectangle and penetrates the main body in the thickness direction. The conductive portion also includes a first via conductor, which is formed on the wall surface of the first groove portion and connects the ground terminal to the frame-shaped portion. In at least one of the top view of the first main surface side and the top view of the second main surface side, the periphery of the ceramic wiring member is formed with: a first notch portion, which is formed separately from the vertex on the side of the rectangle in which the first groove portion is formed; and a second notch portion, which is formed separately from the vertex on the fourth side opposite to the third side. The first notch portion and the second notch portion are located on the same straight line orthogonal to the third side and the fourth side. It should be noted that in the present application, "rectangle" includes "square".

[0014] Effects of the Invention According to the ceramic wiring member motherboard and the ceramic wiring member, it is possible to provide a ceramic wiring member motherboard and a ceramic wiring member that can maintain reliability of electrical connection between the frame-shaped portion and the ground terminal and that can achieve efficient manufacturing processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic plan view of the first surface side of the ceramic wiring member motherboard in the first embodiment.

[0016] Figure 2 This is a schematic plan view of the second surface side of the ceramic wiring member motherboard in the first embodiment.

[0017] Figure 3 It is a schematic plan view of the upper surface side of the ceramic wiring member.

[0018] Figure 4 This is a schematic side view of a ceramic wiring member.

[0019] Figure 5 It is along Figure 3 and Figure 6 A schematic cross-sectional view of line segment VV.

[0020] Figure 6 It is a schematic plan view of the back surface side of the ceramic wiring member.

[0021] Figure 7 This is a schematic side view of a ceramic wiring member.

[0022] Figure 8 It is along Figure 3 and Figure 6 A schematic cross-sectional view along line segment VIII-VIII.

[0023] Fig. 9 This is a schematic plan view of the first surface side of the ceramic wiring member motherboard in the second embodiment.

[0024] Fig.10 This is a schematic plan view of the second surface side of the ceramic wiring member motherboard in the second embodiment. DETAILED DESCRIPTION

[0025] [Overview of Embodiments] First, the embodiments of the present disclosure are listed for explanation. The ceramic wiring component mother substrate of the present disclosure has: a first surface, which is a surface in the thickness direction; and a second surface, which is a surface on the opposite side of the first surface in the thickness direction. When observed in the thickness direction, the ceramic wiring component mother substrate is a ceramic wiring component mother substrate in which a plurality of ceramic wiring components having a rectangular shape are spread and connected as one. The plurality of ceramic wiring components include: a first ceramic wiring component; and a second ceramic wiring component, which is connected to the first ceramic wiring component.

[0026] The first ceramic wiring member and the second ceramic wiring member respectively include: a main body portion made of ceramic, which has a plate-like portion; and a conductive portion, which is configured to contact the main body portion. In a top view of the first surface side, the conductive portion includes: a frame-like portion, which is arranged on the main body portion in a ring shape along the outer periphery of the rectangle; and a pair of internal terminals, which are arranged on the area of ​​the main body portion surrounded by the frame-like portion. In a top view of the second surface side, the conductive portion includes: a pair of external terminals, which are arranged on the main body portion separately from each other; and a ground terminal, which is arranged on the main body portion separately from the pair of external terminals. One of the pair of internal terminals is electrically connected to one of the pair of external terminals. The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals.

[0027] A fracture groove extending along each side of the above-mentioned rectangle of the adjacent plurality of ceramic wiring components is formed on at least one of the first and second surfaces. The first ceramic wiring component and the second ceramic wiring component are arranged in such a manner that the first side of the first ceramic wiring component as one of the sides of the rectangle partially overlaps with the second side of the second ceramic wiring component as one of the sides of the rectangle, and the two ends of the first side do not overlap with the two ends of the second side. A first via hole penetrating the ceramic wiring component mother substrate in the thickness direction is formed in the area where the first side overlaps with the second side. The conductive portion also includes a first via conductor, which is formed on the wall surface surrounding the first via, and connects the grounding terminal of the first ceramic wiring component and the second ceramic wiring component to the frame-shaped portion of the first ceramic wiring component and the second ceramic wiring component. When observed in the thickness direction of the ceramic wiring component mother substrate, the first ceramic wiring component and the second ceramic wiring component are arranged point-symmetrically with respect to the first via conductor. A plurality of ceramic wiring components are composed of a first ceramic wiring component and a second ceramic wiring component connected to each other as a unit structure, and are formed by filling the unit structure without gaps.

[0028] In the ceramic wiring component mother substrate disclosed in the present invention, a first via is formed in the area where the first side of the first ceramic wiring component overlaps with the second side of the second ceramic wiring component, and the ground terminal is connected to the frame-shaped portion by a first via conductor formed on the wall surface surrounding the first via. In this way, by arranging the first via and the first via conductor at a position corresponding to the side of the rectangle instead of at the vertex of the rectangle, when the first ceramic wiring component and the second ceramic wiring component are separated along the first side and the second side, the contact area between the first via conductor and the wall surface of the through hole becomes larger, thereby suppressing the first via conductor from falling off. In addition, the first ceramic wiring component and the second ceramic wiring component are arranged point-symmetrically with respect to the first via conductor in a state where they are staggered with each other in a manner that the first side and the second side partially overlap, so that the first ceramic wiring component and the second ceramic wiring component after separation become ceramic wiring components having the same structure. As a result, the manufacturing process is made more efficient.

[0029] As described above, according to the ceramic wiring member motherboard of the present disclosure, the reliability of the electrical connection between the frame-shaped portion and the ground terminal can be maintained, and the efficiency of the manufacturing process can be improved.

[0030] In the ceramic wiring member mother substrate, a first through hole penetrating from the first surface to the second surface may be formed at each vertex of the rectangle of the plurality of ceramic wiring members. According to this structure, even if there is a slight error in the formation position of the fracture groove extending along each side of the rectangle, the fracture grooves extending perpendicularly to each other can be connected to each other at a desired position.

[0031] Alternatively, in a plan view from the first surface side, a pair of internal terminals of the first ceramic wiring member and a pair of internal terminals of the second ceramic wiring member of the ceramic wiring member mother substrate may be arranged in opposite directions along the first side and the second side in the region surrounded by the frame-shaped portion. According to this structure, even when the internal terminals are arranged in an offset manner due to the structure of the electronic component held by the ceramic wiring member, the manufacturing process can be made more efficient.

[0032] The ceramic wiring component disclosed in the present invention includes: a main body portion made of ceramic, which has a plate-like portion; and a conductive portion, which is configured to contact the main body portion, and when viewed in a direction perpendicular to the plate-like portion, the ceramic wiring component has a rectangular shape. The plate-like portion has: a first main surface, which is a main surface in the thickness direction; and a second main surface, which is located on the opposite side of the first main surface in the thickness direction. In a top view from the first main surface side, the conductive portion includes: a frame-like portion, which is arranged on the main body in a ring shape along the outer periphery of the rectangle; and a pair of internal terminals, which are arranged on the area of ​​the main body surrounded by the frame-like portion. In a top view from the second main surface side, the conductive portion includes: a pair of external terminals, which are arranged on the main body separately from each other; and a ground terminal, which is arranged on the main body separately from the pair of external terminals.

[0033] One of a pair of internal terminals is electrically connected to one of a pair of external terminals. The other of a pair of internal terminals is electrically connected to the other of a pair of external terminals. A first groove portion penetrating the main body in the thickness direction is formed on the periphery of the main body, separated from the vertex of the rectangle. The conductive portion also includes a first via conductor, which is formed on the wall surface of the first groove portion and connects the ground terminal to the frame-shaped portion. In at least one of the top view of the first main surface side and the top view of the second main surface side, a first notch portion is formed on the periphery of the ceramic wiring member, which is separated from the vertex on the side of the rectangle where the first groove portion is formed; and a second notch portion is formed on the fourth side opposite to the third side, which is separated from the vertex. The first notch portion and the second notch portion are located on the same straight line orthogonal to the third side and the fourth side.

[0034] The ceramic wiring component disclosed in the present invention can maintain the reliability of the electrical connection between the frame-shaped portion and the ground terminal by dividing the ceramic wiring component mother substrate disclosed in the present invention into ceramic wiring components along the fracture groove, and can be manufactured efficiently. Here, the first notch portion and the second notch portion are formed corresponding to the area of ​​the fracture groove branch of the ceramic wiring component mother substrate.

[0035] In the ceramic wiring member, the first notch and the second notch may penetrate the ceramic wiring member in the thickness direction of the main body. Such a first notch and the second notch are formed by forming a first through hole in the ceramic wiring member mother substrate. According to this structure, in the ceramic wiring member mother substrate, the fracture grooves extending perpendicularly to each other can be connected to each other at desired positions, thereby suppressing the deviation of the shape of the ceramic wiring member.

[0036] In the ceramic wiring member, the first notch and the second notch may be arranged to be biased to one side in the direction along the third side and the fourth side. According to this structure, even when an electronic component is mounted on the ceramic wiring member and the electronic component cannot be visually identified due to being sealed by the cover, the orientation of the electronic component can be grasped by the first notch and the second notch.

[0037] [Specific example of embodiment] Next, specific embodiments of the ceramic wiring member motherboard and the ceramic wiring member disclosed in the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and their description will not be repeated.

[0038] (Implementation method 1) Figure 1 This is a schematic plan view of the first surface side of the ceramic wiring member motherboard in Embodiment 1 which is one embodiment of the present disclosure. Figure 2 This is a schematic plan view of the second surface side of the ceramic wiring member motherboard in the first embodiment. Figure 3 It is a schematic plan view of the upper surface side of the ceramic wiring member. Figure 4 This is a schematic side view of a ceramic wiring member. Figure 5 It is along Figure 3 and Figure 6 A schematic cross-sectional view of line segment VV. Figure 6 It is a schematic plan view of the back surface side of the ceramic wiring member. Figure 7 This is a schematic side view of a ceramic wiring member. Figure 8 It is along Figure 3 and Figure 6 A schematic cross-sectional view along line segment VIII-VIII.

[0039] Reference Figure 1 and Figure 2 The ceramic wiring member motherboard 100 of the present embodiment has: a first surface 100A, which is a surface in the thickness direction (Z-axis direction) (refer to Figure 1 ); and a second surface 100B, which is a surface on the opposite side of the first surface 100A in the thickness direction (reference Figure 2). When viewed in the thickness direction (when viewed along the Z-axis direction), the ceramic wiring member mother substrate 100 has a structure in which a plurality of ceramic wiring members 110, 120 having a rectangular shape are spread out and connected as one. The plurality of ceramic wiring members 110, 120 include: a first ceramic wiring member 110; and a second ceramic wiring member 120, which is connected to the first ceramic wiring member 110. The first ceramic wiring member 110 and the second ceramic wiring member 120 are arranged in different orientations in the ceramic wiring member mother substrate 100, but as shown below based on Figure 3 to Figure 8 As described above, the ceramic wiring member 1 has the same structure.

[0040] Reference Figure 3 to Figure 8 , the ceramic wiring member 1 (the first ceramic wiring member 110 and the second ceramic wiring member 120 respectively) includes: a main body 10 made of ceramic; and a conductive part 20, which is configured to be in contact with the main body 10. The ceramic constituting the main body 10 is not particularly limited, for example, alumina can be used. The main body 10 includes: a plate-like portion 11, which has a flat plate shape; and a frame 12. When observed in the thickness direction (Z-axis direction), the plate-like portion 11 has a rectangular shape. The plate-like portion 11 includes: a first main surface 11A; and a second main surface 11B, which is located on the opposite side of the first main surface 11A in the thickness direction. The thickness t of the main body 10 can be set to, for example, not less than 0.1 mm and not more than 0.6 mm.

[0041] The frame 12 has a frame-like shape rising from the outer edge of the first main surface 11A of the plate-like portion 11. More specifically, it has an annular shape along the outer edge of the first main surface 11A of the plate-like portion 11 whose planar shape is a rectangle. When viewed in a direction perpendicular to the first main surface 11A, the frame 12 surrounds a cavity 50 which is a space on the first main surface 11A. The frame 12 includes: a planar first end surface 12A; and a second end surface 12B, which is a planar end surface on the opposite side of the first end surface 12A in the thickness direction of the plate-like portion 11. The frame 12 is connected to the first main surface 11A of the plate-like portion 11 at the second end surface 12B. The first end surface 12A is located on a single plane throughout the entire area. As a result, the cavity 50 can be closed by placing a flat cover member on the first end surface 12A. Electronic components such as crystal elements that require airtightness can be accommodated in the cavity 50. Such a ceramic wiring member 1 can be used as a ceramic package for housing electronic components. For example, if the electrodes covering both surfaces of a crystal element are connected to a pair of internal terminals 22, a crystal oscillator is formed.

[0042] The conductive portion 20 includes a frame portion 21, a pair of internal terminals 22, a pair of external terminals 23, a pair of ground terminals 24, a first via-hole conductor 28, a second via-hole conductor 25, a third via-hole conductor 27, a first connection portion 26, and a second connection portion 29. The frame portion 21 is arranged so as to cover the first end surface 12A of the frame body 12. The frame portion 21 has an annular shape corresponding to the first end surface 12A of the frame body 12. That is, on the first surface 100A side ( Figure 1 and Figure 3 In a plan view from a viewpoint of the first surface 100A, the frame-like portion 21 is arranged in a ring shape on the frame body 12 of the main body 10 along the outer circumference of the ceramic wiring member 1 having a rectangular shape. A pair of internal terminals 22 are arranged in contact with each other on the first main surface 11A of the plate-like portion 11 surrounded by the frame body 12. That is, in a plan view from the first surface 100A side, the pair of internal terminals 22 are arranged on the area surrounded by the frame-like portion 21 in the first main surface 11A of the plate-like portion 11 included in the main body 10.

[0043] It should be noted that the frame 12 may be omitted. That is, the conductive portion 20 includes a frame-shaped portion 21, a pair of internal terminals 22, a pair of external terminals 23, a pair of ground terminals 24, a first via-hole conductor 28, a second via-hole conductor 25, a third via-hole conductor 27, a first connecting portion 26, and a second connecting portion 29. In a plan view ( Figure 1 and Figure 3 The frame-like portion 21 is arranged in a ring shape on the first main surface 11A of the main body 10 (plate-like portion 11) along the outer periphery of the ceramic wiring member 1 having a rectangular shape (from a viewpoint of ). The pair of internal terminals 22 are arranged on the first main surface 11A in contact with each other. In a plan view from the first surface 100A side, the pair of internal terminals 22 are arranged on the area surrounded by the frame-like portion 21 in the first main surface 11A of the plate-like portion 11 included in the main body 10.

[0044] As a result, by placing the bathtub-shaped cover member having a cavity on the frame-shaped portion 21, electronic components such as crystal elements that require airtightness can be accommodated in the cavity of the cover member. Such a ceramic wiring member 1 can be used as a ceramic package for accommodating electronic components. For example, if the electrodes covering both surfaces of the crystal element are connected to a pair of internal terminals 22, a crystal oscillator is formed.

[0045] The pair of external terminals 23 are arranged in contact with each other on the second main surface 11B of the plate-like portion 11. That is, in a plan view ( Figure 2 and Figure 6), a pair of external terminals 23 are arranged on the second main surface 11B of the plate-like portion 11 included in the main body 10 in a manner separated from each other. A pair of grounding terminals 24 are separated from the pair of external terminals 23 and are arranged in contact with each other on the second main surface 11B of the plate-like portion 11. That is, when viewed from above from the second surface 100B side, a pair of grounding terminals 24 are separated from the pair of external terminals 23 and are arranged on the second main surface 11B of the plate-like portion 11 included in the main body 10 in a manner separated from each other. When viewed from above from the second surface 100B side, a pair of external terminals 23 are arranged on one diagonal of the rectangle, and a pair of grounding terminals 24 are arranged on the other diagonal of the rectangle. A pair of external terminals 23 and a pair of grounding terminals 24 are respectively arranged at the four corners of the rectangle. Such a terminal configuration can facilitate the wiring design of the external substrate on which the ceramic wiring component 1 is to be mounted.

[0046] The second via-hole conductor 25 is arranged in such a manner as to reach the second main surface 11B from the first main surface 11A of the plate-like portion 11. More specifically, the second via-hole conductor 25 is formed in such a manner as to fill the through hole formed in the plate-like portion 11. The second via-hole conductor 25 is physically and electrically connected to one of the pair of external terminals 23 at the end portion on the second main surface 11B side of the plate-like portion 11. The first connecting portion 26 is formed on the first main surface 11A of the plate-like portion 11. The first connecting portion 26 connects one of the pair of internal terminals 22 to the second via-hole conductor 25. The second via-hole conductor 25 is physically and electrically connected to one of the pair of internal terminals 22 at the end portion on the first main surface 11A side of the plate-like portion 11. That is, one of the pair of internal terminals 22 is electrically connected to one of the pair of external terminals 23 via the first connecting portion 26 and the second via-hole conductor 25.

[0047] The third via-hole conductor 27 is arranged so as to extend from the first main surface 11A of the plate-like portion 11 to the second main surface 11B. More specifically, the third via-hole conductor 27 is formed so as to fill the through hole formed in the plate-like portion 11. The third via-hole conductor 27 is physically and electrically connected to the other of the pair of external terminals 23 at the end on the second main surface 11B side of the plate-like portion 11. The third via-hole conductor 27 is physically and electrically connected to the other of the pair of internal terminals 22 at the end on the first main surface 11A side of the plate-like portion 11. That is, the other of the pair of internal terminals 22 and the other of the pair of external terminals 23 are electrically connected via the third via-hole conductor 27.

[0048] The second connection portion 29 electrically connects a pair of ground terminals 24 inside the plate-like portion 11. It should be noted that the second connection portion 29 may also be formed on the second main surface 11B of the plate-like portion 11. In this case, it is preferred that a portion of the second connection portion 29 in the longitudinal direction is covered by an insulator. Thus, when the ground terminal 24 is soldered to the wiring of the external substrate, poor connection caused by the ground terminals 24 being connected to each other by solder can be prevented. In addition, the second connection portion 29 may also be omitted. In this case, the ground terminal 24 that is not connected to the first via conductor 28 does not have a function as a ground. As a result, there is only one ground terminal 24 that functions as a ground.

[0049] Reference Figure 1 and Figure 2 , a fracture groove 151 extending along each side of the rectangle of the adjacent plurality of ceramic wiring components 110, 120 is formed on the first surface 100A and the second surface 100B. It should be noted that in the present embodiment, the fracture groove 151 is formed on both the first surface 100A and the second surface 100B, but one side may be omitted. The ceramic wiring component mother substrate 100 can be divided along the fracture groove 151. The depth of the fracture groove 151 can be set, for example, to be greater than 0.025 mm and less than 0.200 mm. In addition, a dummy portion made of the same material may be provided around the ceramic wiring component mother substrate 100. By providing a dummy portion, accidental damage to the ceramic wiring component mother substrate 100 can be prevented.

[0050] Next, we focus on Figure 1 The unit structure is composed of a first ceramic wiring member 110 at the center of the left end column and a second ceramic wiring member 120 at the center of the second column from the left end, and the details of the arrangement of multiple ceramic wiring members 110 and 120 are described. The first ceramic wiring member 110 includes a side 111 that is one of the sides of the rectangle, a side 112 opposite to the side 111, a side 113 orthogonal to the side 111 and the side 112, and a side 114 opposite to the side 113. The side 111 and the side 112 correspond to the long sides extending along the Y-axis direction. The side 113 and the side 114 correspond to the short sides extending along the X-axis direction. The second ceramic wiring member 120 includes a side 121 that is one of the sides of the rectangle, a side 122 opposite to the side 121, a side 123 orthogonal to the side 121 and the side 122, and a side 124 opposite to the side 123. The side 121 and the side 122 correspond to the long sides extending along the Y-axis direction. The side 123 and the side 124 correspond to short sides extending along the X-axis direction.

[0051] The first ceramic wiring member 110 and the second ceramic wiring member 120 are arranged in such a manner that the side 111 as the first side of the first ceramic wiring member 110 partially overlaps with the side 121 as the second side of the second ceramic wiring member 120, and the two ends 111A, 111B of the side 111 do not overlap with the two ends 121A, 121B of the side 121. More specifically, the side 111 and the side 121 are arranged to be staggered in the Y-axis direction in such a manner that a portion corresponding to approximately half of their respective lengths overlap. When the ceramic wiring member mother substrate 100 is divided along the fracture groove 151, the side 111 and the side 121 become the side 71 as the third side of the ceramic wiring member 1 (see Figure 3 and Figure 6 ). Similarly, side 112 and side 122 become side 72 which is the fourth side of ceramic wiring member 1. Side 113 and side 123 become side 73 of ceramic wiring member 1. Side 114 and side 124 become side 74 of ceramic wiring member 1.

[0052] A first via hole 131 is formed in the region where the first side 111 and the second side 121 overlap, penetrating the ceramic wiring member mother substrate 100 in the thickness direction. When the ceramic wiring member mother substrate 100 is divided along the fracture groove 151, the first via hole 131 becomes the first groove portion 31 of the ceramic wiring member 1 (see Figure 3 , Figure 4 and Figure 6 ). The first groove 31 is formed on the outer periphery of the main body 10. The first groove 31 is separated from the apex of the rectangle and penetrates the main body 10 in the thickness direction. The first groove 31 penetrates the frame 21, the frame body 12, the plate 11, and one of the pair of ground terminals 24.

[0053] Reference Figure 1 and Figure 2 , the first via-hole conductor 28 is formed on the wall surface surrounding the first via hole 131. In the present embodiment, the first via-hole conductor 28 fills the first via hole 131. The first via-hole conductor 28 may cover the wall surface of the first via hole 131 instead of filling the first via hole 131. The first via-hole conductor 28 physically and electrically connects one of the pair of ground terminals 24 of the first ceramic wiring member 110 and the second ceramic wiring member 120 to the frame-like portion 21 of the first ceramic wiring member 110 and the second ceramic wiring member 120. If the ceramic wiring member mother substrate 100 is divided along the fracture groove 151, the first via-hole conductor 28 of the ceramic wiring member mother substrate 100 becomes the first via-hole conductor 28 formed on the wall surface defining the first groove portion 31 (refer to Figure 3 , Figure 4 and Figure 6 ). The first via-hole conductor 28 physically and electrically connects one of the pair of ground terminals 24 to the frame-shaped portion 21 .

[0054] Reference Figure 1 and Figure 2 , a first through hole 161 is formed at each vertex of the rectangle of the plurality of ceramic wiring members 110, 120, penetrating from the first surface 100A to the second surface 100B. The first through hole 161 is arranged on a straight line 191 extending in the X-axis direction in a manner including the short sides 113, 114 of the first ceramic wiring member 110, and on a straight line 192 extending in the X-axis direction in a manner including the short sides 123, 124 of the second ceramic wiring member 120. When the ceramic wiring member mother substrate 100 is divided along the fracture groove 151, the first through hole 161 becomes a first notch 41, a second notch 42, a third notch 43, a fourth notch 44, a fifth notch 45, and a sixth notch 46 (see Figure 3 and Figure 6 ). The first notch portion 41 is formed at a distance from the vertex on the side 71 which is the third side where the first groove portion 31 is formed. The second notch portion 42 is formed at a distance from the vertex on the side 72 which is the fourth side opposite to the side 71. The third notch portion 43 is formed at a position corresponding to the intersection of the side 71 and the side 74. The fourth notch portion 44 is formed at a position corresponding to the intersection of the side 71 and the side 73. The fifth notch portion 45 is formed at a position corresponding to the intersection of the side 72 and the side 73. The sixth notch portion 46 is formed at a position corresponding to the intersection of the side 72 and the side 74. The first notch portion 41, the second notch portion 42, the third notch portion 43, the fourth notch portion 44, the fifth notch portion 45, and the sixth notch portion 46 penetrate the ceramic wiring member 1 in the thickness direction of the main body portion 10. The first notch portion 41 and the second notch portion 42 are located on a straight line 91 orthogonal to the side 71 which is the third side and the side 72 which is the fourth side. The width w of the first notch 41 and the second notch 42 can be set to be greater than 0. μ m and 40 μ The depth d of the first notch 41 and the second notch 42 can be set to be greater than 0. μ m and 50 μ m or less.

[0055] It should be explained, refer to Figure 1 and Figure 2 , the first through hole 161 can be omitted. In this case, if the ceramic wiring member mother substrate 100 is divided along the fracture groove 151, the first notch 41 and the second notch 42 are formed in a state that does not penetrate the ceramic wiring member 1 in the thickness direction (refer to Figure 3 and Figure 6). More specifically, the first notch portion 41 and the second notch portion 42 are formed to have a depth corresponding to the depth of the rupture groove 151. This is because, when the rupture groove 151 is formed in the manufacturing process, from the viewpoint of avoiding interruption in the region where the rupture groove 151 branches, the rupture grooves 151 are intentionally formed in a slightly intersecting manner in the region. From the viewpoint of forming the first notch portion 41 and the second notch portion 42 more clearly, the rupture grooves 151 are made to intersect each other by a distance corresponding to the desired size of the first notch portion 41 and the second notch portion 42. It should be noted that when the rupture groove 151 is formed on the raw sheet by laser irradiation in the manufacturing process, the irradiated portion volatilizes. In the region where the rupture grooves 151 intersect, volatilization further proceeds because the laser is irradiated twice. Therefore, in the region where the rupture grooves 151 intersect, the depth of the rupture grooves 151 becomes deeper than other parts, for example, more than 1 times and less than 1.2 times.

[0056] like Figure 1 and Figure 2 As shown, when observing in the thickness direction of the ceramic wiring component mother substrate 100, the ceramic wiring components 1 having the same structure as described above, namely the first ceramic wiring component 110 and the second ceramic wiring component 120, are arranged point-symmetrically with respect to the first via-hole conductor 28 (if rotated 180° with the first via-hole conductor 28 as the center, they will overlap as a whole). In addition, the plurality of ceramic wiring components 110 and 120 included in the ceramic wiring component mother substrate 100 are composed of the first ceramic wiring component 110 and the second ceramic wiring component 120 connected to each other as a unit structure, and are formed by spreading the unit structure without gaps. More specifically, in the adjacent unit structures in the long side direction (Y-axis direction) of the rectangle, the side 113 and the side 114 are overlapped in the entire length, and the side 124 and the side 123 are overlapped in the entire length. In addition, in the adjacent unit structures in the short side direction (X-axis direction) of the rectangle, the side 112 and the side 122 are overlapped in the range of approximately half of the total length. In this way, the unit structures composed of the first ceramic wiring members 110 and the second ceramic wiring members 120 having the same structure are arranged in a matrix, so that the raw materials can be used without waste.

[0057] In the ceramic wiring member mother substrate 100 of the present embodiment, the first via hole 131 is formed in the region where the side 111 of the first ceramic wiring member 110 and the side 121 of the second ceramic wiring member 120 overlap, and the ground terminal 24 is connected to the frame-shaped portion 21 through the first via hole conductor 28 formed on the wall surface surrounding the first via hole 131. In this way, by arranging the first via hole 131 and the first via hole conductor 28 at positions corresponding to the sides of the rectangle rather than at the vertices of the rectangle, when the first ceramic wiring member 110 and the second ceramic wiring member 120 are separated along the fracture groove 151 along the side 111 and the side 121, the contact area between the first via hole conductor 28 and the wall surface of the first via hole 131 becomes large, and the first via hole conductor 28 is suppressed from falling off. In addition, the first ceramic wiring member 110 and the second ceramic wiring member 120 are arranged point-symmetrically with respect to the first via conductor 28 in a state where the sides 111 and 121 are partially overlapped with each other, so that the first ceramic wiring member 110 and the second ceramic wiring member 120 after separation become ceramic wiring members 1 having the same structure. As a result, the efficiency of the manufacturing process is achieved. In addition, even in a state where electronic components are mounted on the ceramic wiring member 1 and the electronic components cannot be visually recognized due to being sealed by the cover, the orientation of the electronic components can be grasped through the first via 131 (the first groove portion 31 after separation) and the first via conductor 28.

[0058] As described above, the ceramic wiring member motherboard 100 of the present embodiment can maintain the reliability of the electrical connection between the frame-shaped portion 21 and the ground terminal 24 and can realize efficient manufacturing process.

[0059] In addition, in the ceramic wiring member mother substrate 100 of the present embodiment, first via holes 131 are formed at the vertices of the rectangles of the plurality of ceramic wiring members 110 and 120, penetrating from the first surface 100A to the second surface 100B. Thus, even if there is a slight error in the formation position of the fracture grooves 151 extending along the sides of the rectangle, the fracture grooves 151 extending in the X-axis direction and the fracture grooves 151 extending in the Y-axis direction can be connected at a desired position.

[0060] In addition, in a plan view from the first surface 100A side, a pair of internal terminals 22 of the first ceramic wiring member 110 and a pair of internal terminals 22 of the second ceramic wiring member 120 of the ceramic wiring member mother substrate 100 of the present embodiment are arranged in opposite directions along the sides 111 and 121 (Y-axis direction) in the region surrounded by the frame-shaped portion 21. Thus, even when the internal terminals 22 are arranged in an offset manner in accordance with the structure of the electronic component held by the ceramic wiring member 1, the efficiency of the manufacturing process can be achieved.

[0061] The ceramic wiring member 1 of the present embodiment can maintain reliability of electrical connection between the frame portion 21 and the ground terminal 24 and can be manufactured efficiently by dividing the ceramic wiring member motherboard 100 of the present embodiment into ceramic wiring members 1 along the fracture grooves 151 .

[0062] In addition, in the ceramic wiring member 1 of the present embodiment, the first notch 41 and the second notch 42 penetrate the ceramic wiring member 1 in the thickness direction of the main body 10. Thus, in the ceramic wiring member motherboard 100, the fracture grooves 151 extending perpendicularly to each other can be connected at desired positions, so that the shape deviation of the ceramic wiring member 1 can be suppressed.

[0063] In addition, in the ceramic wiring member 1 of the present embodiment, the first notch 41 and the second notch 42 are arranged to be biased to one side in the direction (Y-axis direction) along the side 111 and the side 121. Thus, even when the ceramic wiring member 1 is loaded with electronic components and the electronic components cannot be visually recognized due to being sealed by the cover, the orientation of the electronic components can be grasped by the first notch 41 and the second notch 42.

[0064] The ceramic wiring component mother substrate 100 of the present embodiment described above can be manufactured, for example, roughly through the following steps. First, prepare the raw sheet to become the main body 10. Specifically, a ceramic powder constituting the main body 10, such as alumina powder, is mixed with a resin, a solvent, etc. using a ball mill to obtain a slurry. The slurry is processed into a raw sheet by a scraper method. Thus, a raw sheet to become the main body 10 is obtained. On the premise that the main body 10 is constituted by stacking raw sheets, a plurality of raw sheets are prepared.

[0065] Next, a paste to be the conductive portion 20 is printed on the prepared raw sheet. The paste is made by mixing additives, resins, solvents, etc. in powder of a conductor such as a metal and kneading them. For example, the paste is printed on a plurality of raw sheets by screen printing. Then, on the basis of a laminate having the structure of the desired ceramic wiring component mother substrate 100 formed by stacking a plurality of raw sheets, a first via 131 and a first through hole 161 are formed. The above-mentioned paste is filled in the first via 131. Furthermore, a fracture groove 151 is formed, for example, by laser irradiation. Thereafter, by firing the laminate, the ceramic wiring component mother substrate 100 can be manufactured.

[0066] Furthermore, the ceramic wiring member 1 of the present embodiment described above can be manufactured by dividing the ceramic wiring member mother substrate 100 along the fracture grooves 151 .

[0067] (Implementation method 2) Next, Embodiment 2 which is another embodiment of the present disclosure will be described. Fig. 9This is a schematic plan view of the first surface side of the ceramic wiring member motherboard in the second embodiment. Fig.10 This is a schematic plan view of the second surface side of the ceramic wiring member motherboard in the second embodiment.

[0068] Reference Fig. 9 and Fig.10 as well as Figure 1 and Figure 2 The ceramic wiring member mother substrate 100 in the second embodiment basically has the same structure as that in the first embodiment, can achieve the same effect, and is manufactured in the same manner. However, the ceramic wiring member mother substrate 100 in the second embodiment is different from that in the first embodiment in the positional relationship between the first ceramic wiring member 110 and the second ceramic wiring member 120. The differences from the first embodiment are described below.

[0069] Reference Fig. 9 and Fig.10 The first ceramic wiring member 110 and the second ceramic wiring member 120 constituting the unit structure are arranged in a staggered manner in the Y-axis direction in such a manner that the side 111 of the first ceramic wiring member 110 and the side 121 of the second ceramic wiring member 120 overlap each other by a portion corresponding to 3 / 4 of their respective lengths. Moreover, in the above-mentioned unit structures adjacent to each other in the short side direction (X-axis direction) of the rectangle, the side 122 and the side 112 are arranged in such a manner that they overlap by 3 / 4 of the total length. Even in the case where such a positional relationship between the first ceramic wiring member 110 and the second ceramic wiring member 120 is adopted, the same effect as that of the case of the first embodiment can be obtained. In addition, the ceramic wiring member 1 of the second embodiment has the same structure as the case of the first embodiment, except that the formation position of the first notch 41 and the second notch 42 is changed in the Y-axis direction as a result of the change in the formation position of the first through hole 161 due to the difference in the positional relationship between the first ceramic wiring member 110 and the second ceramic wiring member 120, and has the same effect.

[0070] It should be understood that the embodiments disclosed this time are illustrative in all aspects and are not restrictive in any aspect. The scope of the present disclosure is defined not by the above description but by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0071] Description of symbols 1: ceramic wiring member; 10: main body; 11: plate-shaped portion; 11A: first main surface; 11B: second main surface; 12: frame; 12A: first end surface; 12B: second end surface; 20: conductive portion; 21: frame-shaped portion; 22: internal terminal; 23: external terminal; 24: ground terminal; 25: second via-hole conductor; 26: first connecting portion; 27: third via-hole conductor; 28: first via-hole conductor; 29: second connecting portion; 31: first groove portion; 41: first notch portion; 42: second notch portion; 43: third Notch portion; 44: fourth notch portion; 45: fifth notch portion; 46: sixth notch portion; 50: cavity; 71~74: edge; 91: straight line; 100: ceramic wiring component mother substrate; 100A: first surface; 100B: second surface; 110: first ceramic wiring component; 111~114: edge; 111A, 111B: both ends; 120: second ceramic wiring component; 121~124: edge; 121A, 121B: both ends; 131: first via hole; 151: fracture groove; 161: first through hole.

Claims

1. A ceramic wiring member mother substrate, characterized in that: The ceramic wiring member mother substrate comprises: a first surface, which is a surface in the thickness direction; and a second surface, which is a surface on the opposite side of the first surface in the thickness direction. When viewed in the thickness direction, the ceramic wiring member mother substrate is a ceramic wiring member mother substrate in which a plurality of ceramic wiring members having a rectangular shape are laid and connected as one. The plurality of ceramic wiring members include: a first ceramic wiring member; and a second ceramic wiring member connected to the first ceramic wiring member, The first ceramic wiring member and the second ceramic wiring member each include: a main body made of ceramic, having a plate-shaped portion; and a conductive portion configured to contact the main body portion, In a top view of the first surface side, the conductive portion includes: a frame-shaped portion, which is annularly arranged on the main body along the outer periphery of the rectangle; and a pair of internal terminals arranged on a region of the main body surrounded by the frame-shaped portion, In a top view of the second surface side, the conductive portion includes: a pair of external terminals disposed on the main body portion so as to be separated from each other; and a ground terminal disposed on the main body portion separately from the pair of external terminals, One of the pair of internal terminals is electrically connected to one of the pair of external terminals, The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals, A fracture groove extending along each side of the rectangle of the plurality of adjacent ceramic wiring members is formed on at least one of the first surface and the second surface. The first ceramic wiring member and the second ceramic wiring member are arranged so that a first side of the first ceramic wiring member, which is one of the sides of the rectangle, partially overlaps with a second side of the second ceramic wiring member, which is one of the sides of the rectangle, and both ends of the first side do not overlap with both ends of the second side, A first via hole is formed in a region where the first side and the second side overlap and penetrates the ceramic wiring member mother substrate in a thickness direction. The conductive portion further includes a first via-hole conductor, which is formed on a wall surface surrounding the first via hole and connects the ground terminals of the first ceramic wiring member and the second ceramic wiring member to the frame-shaped portions of the first ceramic wiring member and the second ceramic wiring member. When viewed in the thickness direction of the ceramic wiring member motherboard, the first ceramic wiring member and the second ceramic wiring member are arranged point-symmetrically with respect to the first via conductor. The plurality of ceramic wiring members are formed by forming a unit structure with the first ceramic wiring member and the second ceramic wiring member connected to each other, and the unit structures are laid out without any gap.

2. The ceramic wiring member motherboard according to claim 1, wherein: A first through hole penetrating from the first surface to the second surface is formed at each vertex of the rectangle of the plurality of ceramic wiring members.

3. The ceramic wiring member motherboard according to claim 1 or 2, wherein: The pair of internal terminals of the first ceramic wiring member and the pair of internal terminals of the second ceramic wiring member are arranged in opposite directions along the first side and the second side in a region surrounded by the frame-shaped portion in a plan view from the first main surface.

4. A ceramic wiring member, characterized in that: The ceramic wiring member includes: a main body portion made of ceramic, which has a plate-shaped portion; and a conductive portion, which is arranged to be in contact with the main body portion, and the ceramic wiring member has a rectangular shape when viewed in a direction perpendicular to the plate-shaped portion. The plate-like portion has: a first main surface which is one main surface in the thickness direction; and a second main surface which is located on the opposite side to the first main surface in the thickness direction. In a top view from the first main surface side, the conductive portion includes: a frame-shaped portion, which is annularly arranged on the main body along the outer periphery of the rectangle; and a pair of internal terminals arranged on a region of the main body surrounded by the frame-shaped portion, In a top view from the second main surface side, the conductive portion includes: a pair of external terminals disposed on the main body portion so as to be separated from each other; and a ground terminal disposed on the main body portion separately from the pair of external terminals, One of the pair of internal terminals is electrically connected to one of the pair of external terminals, The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals, A first groove portion is formed on the outer periphery of the main body portion and is separated from the apex of the rectangle and penetrates the main body portion in the thickness direction. The conductive portion further includes a first via-hole conductor, which is formed on a wall surface of the first groove portion and connects the ground terminal to the frame-shaped portion. In at least one of a plan view from the first main surface side and a plan view from the second main surface side, the ceramic wiring member has: a first notch portion formed on a third side of the rectangle on which the first groove portion is formed, separated from a vertex; and a second notch portion formed on a fourth side opposite to the third side and separated from the vertex, The first notch portion and the second notch portion are located on the same straight line that is orthogonal to the third side and the fourth side.

5. The ceramic wiring member according to claim 4, wherein The first notch portion and the second notch portion penetrate the ceramic wiring member in the thickness direction of the main body portion.

6. The ceramic wiring member according to claim 4 or 5, wherein The first notch portion and the second notch portion are arranged to be offset to one side in a direction along the third side and the fourth side.

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