Device for welding electronic component

Abstract

The invention provides a device for welding electronic components. The device comprises a bearing table, a pushing mechanism and an energy generating mechanism. The bearing table is used for bearing an electronic element to be welded and a related substrate. The pushing mechanism comprises a pushing body and an air pump. The pushing and pressing body comprises a plurality of rigid peripheral walls and a non-rigid pushing and pressing wall, the rigid peripheral walls and the non-rigid pushing and pressing wall surround to form a closed space, and the non-rigid pushing and pressing wall faces the bearing table. The air pump is communicated with the closed space and can pump external air into the closed space and pump out the air in the closed space. The energy generating mechanism can generate energy light beams, and the energy light beams are projected on the bearing table through the pushing and pressing body of the pushing and pressing mechanism.

Description

Technical Field

[0001] The invention relates to a device for soldering electronic components. Background Art

[0002] With the development of the technology of electronic components (such as microelectronic components, light emitting diodes or micro light emitting diodes), a process of transferring electronic components, light emitting diodes or micro light emitting diodes in large quantities from one substrate to another substrate has been developed, which is conducive to the mass production of electronic components.

[0003] However, in the process of transferring electronic components, LEDs or micro LEDs from one substrate to another, the two substrates need to be placed face to face, and then laser processing is used to transfer the electronic components, LEDs or micro LEDs. At this time, whether the two substrates are tightly attached during laser processing is crucial to the yield of the transfer process.

[0004] A conventional process is to form a closed space above the substrate and fill the closed space with gas to directly press the substrate with gas pressure. However, in order to form such a closed space, this process uses silica gel to apply pressure to the peripheral area of ​​the substrate and use silica gel to block the gas from flowing out from the side. However, when the silica gel applies pressure to the peripheral area of ​​the substrate, it is easy to generate local high pressure due to the small area of ​​the silica gel, which is easy to damage the thin film transistor circuit or electronic components on the substrate, thereby reducing the yield of the process. Summary of the invention

[0005] The present invention is directed to a device for welding electronic components, which can effectively improve the process yield.

[0006] One embodiment of the present invention proposes a device for welding electronic components, including a carrier, a pushing mechanism and an energy generating mechanism. The carrier is used to carry the electronic components to be welded and their related substrates, and the pushing mechanism includes a pushing body and an air pump. The pushing body includes a plurality of rigid peripheral walls and a non-rigid pushing wall, and the plurality of rigid peripheral walls and the non-rigid pushing walls surround to form a closed space, wherein the non-rigid pushing wall faces the carrier. The air pump is connected to the above-mentioned closed space, and can pump external air into the closed space, and extract the air in the closed space. The energy generating mechanism can generate an energy beam, which is projected onto the carrier through the pushing body of the pushing mechanism.

[0007] In the device for welding electronic components of the embodiment of the present invention, since a plurality of rigid peripheral walls and non-rigid pushing walls are used to surround and form a closed space, and the non-rigid pushing walls are pushed against the substrate by inflating the closed space, the device for welding electronic components of the embodiment of the present invention will not have the situation in the conventional technology where silicone is used to compress the peripheral area of ​​the substrate to produce a closed space. In this way, the device for welding electronic components of the embodiment of the present invention will not have the situation in the conventional technology where silicone is used to crush the thin-film transistor circuit on the peripheral area of ​​the substrate, thereby reducing the yield of the process. Therefore, the device for welding electronic components of the embodiment of the present invention can use the non-rigid pushing walls to evenly push the substrate to complete the process without damaging the circuit on the substrate, and thus the device for welding electronic components of the embodiment of the present invention can effectively improve the yield of the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 FIG. 4 is a cross-sectional schematic diagram of a device for soldering electronic components according to an embodiment of the present invention.

[0009] Figure 2 FIG. 4 is a cross-sectional schematic diagram of a device for soldering electronic components according to another embodiment of the present invention.

[0010] Figure 3 FIG. 4 is a cross-sectional schematic diagram of a device for soldering electronic components according to another embodiment of the present invention.

[0011] Figure 4 for Figure 3 A partially enlarged stereoscopic view of a device for soldering electronic components.

[0012] Figure 5 FIG. 4 is a cross-sectional schematic diagram of a device for soldering electronic components according to another embodiment of the present invention. DETAILED DESCRIPTION

[0013] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0014] Figure 1 FIG. 1 is a cross-sectional schematic diagram of a device for soldering electronic components according to an embodiment of the present invention. Figure 1 The device 100 for soldering electronic components in this embodiment includes a carrier 110, a pushing mechanism 200, and an energy generating mechanism 120. The carrier 110 is used to carry the electronic components 300 to be soldered and their related substrates, wherein the related substrates may be a single substrate or multiple sub-substrates. For example, the above-mentioned related substrates may include a transfer substrate 50 and a target substrate 60. In this embodiment, a plurality of electronic components 300 are attached to the transfer substrate 50 by means of an adhesive layer 52, and Figure 1 The enlarged view in FIG. 1 shows one of the electronic components 300 as an example. The electronic component 300 has an electrode 310. The target substrate 60 is, for example, a circuit substrate, and is provided with a pad 62 and a circuit (for example, a thin film transistor circuit) electrically connected to the pad 62. In addition, a solder 70 is provided on the pad 62. In this embodiment, the material of the transfer substrate 50 is, for example, glass, and the material of the target substrate 60 is, for example, glass. The target substrate 60 is, for example, a thin film transistor (TFT) substrate.

[0015] The pushing mechanism 200 includes a pushing body 400 and an air pump 210. The pushing body 400 includes a plurality of rigid peripheral walls 410 and a non-rigid pushing wall 420, and the plurality of rigid peripheral walls 410 and the non-rigid pushing wall 420 surround and form a closed space S, wherein the non-rigid pushing wall 420 faces the support platform 110. The air pump 210 is connected to the above-mentioned closed space S, and can pump external air into the closed space S, and extract the air in the closed space S. In the present embodiment, the non-rigid pushing wall 420 includes a pushing member 422, and both sides of the pushing member 422 are respectively connected to the adjacent rigid peripheral walls 410 by elastic members 424, for example, connected to the rigid peripheral wall 412. In the present embodiment, the pushing member 422 is flexible quartz. In addition, in this embodiment, one end of the elastic member 424 is attached to the lower surface 411 of the adjacent rigid peripheral wall 410 facing the carrier 110, and the other end of the elastic member 424 is attached to the upper surface 423 of the push member 422 facing away from the carrier 110. In one embodiment, the push member 422 is a flexible glass.

[0016] In this embodiment, the pushing body 400 includes five rigid peripheral walls 410, which and the non-rigid pushing wall 420 surround the closed space S in a hexahedral manner. Specifically, the rigid peripheral wall 410 may include a rigid peripheral wall 414 opposite to the non-rigid pushing wall 420 and four rigid peripheral walls 412 surrounding the closed space S, wherein the rigid peripheral wall 414 opposite to the non-rigid pushing wall 420 is light-permeable. In one embodiment, the material of the rigid peripheral wall 414 opposite to the non-rigid pushing wall 420 is quartz.

[0017] The energy generating mechanism 120 can generate an energy beam 122, which is projected onto the support platform 110 through the pushing body 400 of the pushing mechanism 200. In this embodiment, the energy beam 122 is a laser beam, and the energy generating mechanism 120 is, for example, a laser source. The energy beam 122 can penetrate the rigid peripheral wall 414 and the pushing member 422 and irradiate onto the support platform 110.

[0018] The electronic component 300 is, for example, a light emitting diode chip or other electronic components, which is originally attached to the transfer substrate 50 by means of an adhesive layer 52, and the device 100 for soldering electronic components can transfer the electronic component 300 from the transfer substrate 50 to the target substrate 60. First, the transfer substrate 50 can be adsorbed onto the rigid peripheral wall 412 by means of a plurality of adsorption structures 430 (e.g., suction nozzles), and the side of the transfer substrate 50 having the electronic component 300 faces the target substrate 60, and the electrode 310 of the electronic component 300 is aligned with the solder 70 and the pad 62. Next, the air pump 210 is used to inflate the closed space S. For example, the air pump 210 can pump external air into the closed space S through the channel 402. At this time, the elastic member 424 will deform downward, so that the push member 422 evenly pushes the surface of the transfer substrate 50 where the electronic component 300 is not disposed, thereby making the electrode 310 in close contact with the solder 70. Then, the energy generating mechanism 120 emits an energy beam 122, and the energy beam 122 irradiates the solder 70 after penetrating the rigid peripheral wall 414 and the push member 422 to melt the solder 70. After the solder 70 cools and solidifies, the electrode 310 and the pad 62 are bonded. After that, the air pump 210 can be used to extract the air in the closed space S so that the push member 422 no longer presses the transfer substrate 50, and then the transfer substrate 50 and the target substrate 60 are separated. At this time, the bonding force between the solder 70 and the electrode 310 of the electronic component 300 is greater than the bonding force between the adhesive layer 52 and the electronic component 300, so the electronic component 300 will be separated from the transfer substrate 50. At this point, the electronic component 300 is successfully transferred from the transfer substrate 50 to the target substrate 60. In the present embodiment, the material of the elastic member 424 is, for example, silicone.

[0019] In one embodiment, the device 100 for welding electronic components further includes a driving mechanism 130, which can drive the pushing body 400 and the carrier 110 of the pushing mechanism 200 to move relative to each other. In this way, the pushing body 400 can push different areas of the target substrate 60 to transfer the electronic components 300 to different areas of the target substrate 60. That is, in this embodiment, the area of ​​the target substrate 60 that can be used to carry the electronic components 300 is larger than the surface area of ​​the non-rigid pushing wall 420, so the pushing body 400 and the carrier 110 of the pushing mechanism 200 can be moved relative to each other by the driving mechanism 130 to transfer the electronic components 300 in different areas.

[0020] In the device 100 for welding electronic components of the present embodiment, since a plurality of rigid peripheral walls 410 and non-rigid pushing walls 420 are used to surround and form a closed space S, and the non-rigid pushing walls 420 are pushed against the substrate by inflating the closed space S, the device 100 for welding electronic components of the present embodiment will not use silicone to compress the peripheral area of ​​the substrate to produce a closed space. In this way, the device 100 for welding electronic components of the present embodiment will not have the situation where silicone crushes the thin film transistor circuit or electronic components on the peripheral area of ​​the substrate, thereby reducing the yield of the process. Therefore, the device 100 for welding electronic components of the present embodiment can use the non-rigid pushing wall 420 to evenly push the substrate to complete the process without damaging the circuit (such as a thin film transistor circuit) or electronic components on the substrate, so the device 100 for welding electronic components of the present embodiment can effectively improve the process yield.

[0021] Figure 2 FIG. 1 is a cross-sectional schematic diagram of a device for soldering electronic components according to another embodiment of the present invention. Figure 2 The device 100a for soldering electronic components of this embodiment is Figure 1 The present invention is similar to the device 100 for welding electronic components, and the difference between the two is that in the device 100a for welding electronic components of the present embodiment, one end of the elastic member 424 is attached to the upper surface 413 of the adjacent rigid peripheral wall 410 facing away from the supporting platform 110, and the upper surface 413 is located on the lateral extension arm 415 at the bottom of the rigid peripheral wall 410.

[0022] Figure 3 is a cross-sectional schematic diagram of a device for soldering electronic components according to another embodiment of the present invention, and Figure 4 for Figure 3 A partial enlarged stereoscopic view of a device for soldering electronic components. Figure 3 and Figure 4 The device 100b for soldering electronic components of this embodiment is Figure 1 The pushing body 400 of the device 100b for welding electronic components of this embodiment is similar, and the main differences between the two are as follows. The pushing body 400 of the device 100b for welding electronic components of this embodiment also includes a pushing wall clamping piece 440. In this embodiment, the non-rigid pushing wall 420 also includes an elastic member 424, which is located on the peripheral side of the pushing member 422. The pushing wall clamping piece 440 is arranged on the adjacent rigid peripheral wall 410 (for example, the rigid peripheral wall 412), and the elastic member 424 is clamped between the adjacent rigid peripheral wall 410 (for example, the rigid peripheral wall 412) and the pushing wall clamping piece 440. In this embodiment, one end of the elastic member 424 away from the pushing wall clamping piece 440 is attached to the upper surface 423 of the pushing member 422 facing away from the carrier 110.

[0023] In the device 100b for welding electronic components of the present embodiment, since a plurality of rigid peripheral walls 410 and non-rigid pressing walls 420 are used to surround and form a closed space S, and the pressing member 422 of the non-rigid pressing wall 420 is pushed against the substrate by inflating the closed space S, the device 100b for welding electronic components of the present embodiment will not use silicone to press the peripheral area of ​​the substrate to produce a closed space. In this way, the device 100b for welding electronic components of the present embodiment will not have the situation where silicone presses the thin film transistor circuit or electronic components on the peripheral area of ​​the substrate, thereby reducing the process yield. Therefore, the device 100b for welding electronic components of the present embodiment can use the pressing member 422 of the non-rigid pressing wall 420 to uniformly push the substrate to complete the process without damaging the circuit (such as a thin film transistor circuit) or electronic components on the substrate, so the device 100b for welding electronic components of the present embodiment can effectively improve the process yield.

[0024] In this embodiment, if Figure 4 As shown, the adjacent rigid peripheral wall 410 includes a peripheral wall bottom surface 418 with a receiving hole 419, and the pushing wall engaging member 440 includes a fixing hole 442 and a fixing member 444, and the fixing hole 442 is engaged with the receiving hole 419 to fix the pushing wall engaging member 440 to the rigid peripheral wall 410. In addition, such a design method can remove the fixing member 444 from the fixing hole 442 to disassemble the pushing wall engaging member 440, and then disassemble the non-rigid pushing wall 420 from the adjacent rigid peripheral wall 410, so that the non-rigid pushing wall 420 can be replaced.

[0025] In the present embodiment, the push-wall clamping member 440 includes a compression structure 446, which is disposed adjacent to the elastic member 424. The elastic member 424 is clamped between the compression structure 446 and the bottom surface 418 of the peripheral wall. In this way, one end of the elastic member 424 can be firmly fixed on the adjacent rigid peripheral wall 410 without horizontal or vertical movement and without air leakage. The compression structure 446 is, for example, a strip-shaped square. In other embodiments, the compression structure 446 is, for example, a triangle or a semicircle. In the present embodiment, the material of the push-wall clamping member 440 is a rigid material.

[0026] The pushing wall engaging member 440 includes an engaging member bottom surface 441, and the pushing member 422 includes a pushing member bottom surface 425, wherein the distance D1 between the pushing member bottom surface 425 and the peripheral wall bottom surface 418 is greater than the distance D2 between the engaging member bottom surface 441 and the peripheral wall bottom surface 418, so that the pushing wall engaging member 440 will not touch the substrate (for example, it will not touch the transfer substrate 50) and damage the thin film transistor circuit or electronic components on the substrate.

[0027] Figure 5FIG. 2 is a cross-sectional schematic diagram of a device for soldering electronic components according to another embodiment of the present invention. Figure 5 The device 100c for soldering electronic components of this embodiment is Figure 3 The device 100b for soldering electronic components is similar to the device 100b for soldering electronic components, and the main differences between the two are as follows. Figure 3 In the device 100b for welding electronic components, the pushing wall clamp 440 and the adjacent rigid peripheral wall 410 (i.e., the rigid peripheral wall 412) are two separate components, while in the device 100c for welding electronic components in this embodiment, the pushing wall clamp 440 and the adjacent rigid peripheral wall 410 (i.e., the rigid peripheral wall 412) are an integrally formed component, and one end of the elastic member 424 is clamped by the lateral extension arm 443 of the pushing wall clamp 440 and the lateral extension arm 417 of the rigid peripheral wall 412.

[0028] In summary, in the device for welding electronic components of the embodiment of the present invention, since a plurality of rigid peripheral walls and non-rigid pushing walls are used to surround and form a closed space, and the non-rigid pushing walls are pushed against the substrate by inflating the closed space, the device for welding electronic components of the embodiment of the present invention will not have the situation in the conventional technology where silicone is used to compress the peripheral area of ​​the substrate to produce a closed space. In this way, the device for welding electronic components of the embodiment of the present invention will not have the situation in the conventional technology where silicone is used to crush the thin film transistor circuit on the peripheral area of ​​the substrate, thereby reducing the yield of the process. Therefore, the device for welding electronic components of the embodiment of the present invention can use the non-rigid pushing wall or the pushing member of the non-rigid pushing wall to evenly push the substrate to complete the process without damaging the circuit on the substrate, so the device for welding electronic components of the embodiment of the present invention can effectively improve the yield of the process.

[0029] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A device for welding electronic components, characterized in that: include: A carrying platform, used for carrying the electronic components to be welded and their related substrates; The pushing mechanism comprises: A pushing body, comprising a plurality of rigid peripheral walls and a non-rigid pushing wall, wherein the plurality of rigid peripheral walls and the non-rigid pushing wall surround and form a closed space, wherein the non-rigid pushing wall faces the supporting platform; and an air pump, which is in communication with the enclosed space and can pump external air into the enclosed space and extract the air from the enclosed space; and The energy generating mechanism can generate an energy beam, which is projected onto the supporting platform through the pushing body of the pushing mechanism.

2. The device for soldering electronic components according to claim 1, characterized in that: The non-rigid pushing wall comprises a pushing piece, and two sides of the pushing piece are respectively connected to adjacent rigid peripheral walls through elastic pieces.

3. The device for soldering electronic components according to claim 2, characterized in that: The pushing member is made of flexible quartz or glass.

4. The device for soldering electronic components according to claim 1, characterized in that: It also includes a driving mechanism, which can drive the pushing body and the bearing platform of the pushing mechanism to move relative to each other.

5. The device for soldering electronic components according to claim 1, characterized in that: The pushing body includes five rigid peripheral walls, which together with the non-rigid pushing wall surround the closed space in a hexahedral manner.

6. The device for soldering electronic components according to claim 5, characterized in that: The rigid peripheral wall opposite to the non-rigid pushing wall is light-transmissive.

7. The device for soldering electronic components according to claim 6, characterized in that: The material of the rigid peripheral wall opposite to the non-rigid pushing wall is quartz.

8. The device for soldering electronic components according to claim 1, characterized in that: The energy beam is a laser beam.

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