Device and method for low-stress assembly of MEMS inertial device

Abstract

The invention discloses a device and method for low-stress assembly of an MEMS inertial device. The device comprises two adhesive buckles, and each adhesive buckle comprises a shell fixing function module, an adhesive thickness control module and a circuit board fixing function module; the shell fixing function module is connected with the end part of the circuit board fixing function module in a concentric-square-shaped manner, and the glue thickness control module is positioned between the shell fixing function module and the circuit board fixing function module and is connected with the end part of the circuit board fixing function module; the device is used for assembling the MEMS inertial device, after the whole process is completed, no other materials are left in the system except the adhesive material, and a certain optimization effect is achieved on simplifying the system assembling mode and reducing the weight; and meanwhile, the mounting position of the MEMS inertial device and the thickness of the adhesive are ensured, the stress in the assembly process of the MEMS inertial device is reduced, and the performance level of the MEMS inertial device is ensured.

Description

Technical Field

[0001] The present invention relates to a MEMS inertial device, and in particular to a device and method for low-stress assembly of a MEMS inertial device. Background Art

[0002] With the development of MEMS inertial devices and the continuous improvement of their performance level, the assembly stress will seriously affect the performance and accuracy of the MEMS inertial devices themselves during the assembly process of MEMS inertial devices into the system. MEMS inertial devices are electronic devices with sensitive direction, mainly used for inertial navigation, attitude measurement and control of carriers, etc. MEMS inertial devices are soldered to the circuit board according to the recommended soldering curve. The stress caused by this process has been considered when designing the MEMS inertial devices, and has little impact on the performance level; when assembling the circuit board with MEMS inertial devices into the system, due to the variety of systems and application environments, the assembly method is also designed to match the system. The stress of this assembly process has a greater impact on the performance of MEMS inertial devices.

[0003] At present, the assembly methods of MEMS inertial devices include: screw installation, adhesive fixation, potting fixation and a combination of several methods. According to the simulation results and engineering experience of different assembly methods, the adhesive fixation assembly method has the least stress impact and can guarantee the performance of MEMS inertial as much as possible. However, compared with other methods, the adhesive fixation assembly method of MEMS inertial devices reduces the impact of stress, but it is difficult to ensure the assembly accuracy. The circuit board is easy to slide during the adhesive bonding and fixing process, and the control of the adhesive thickness is also difficult. The resulting assembly error is large, resulting in a large deviation between the sensitive direction of the MEMS inertial device and the detection axis, affecting the installation accuracy of the MEMS inertial device. Summary of the invention

[0004] The purpose of the present invention is to reduce the influence of stress on MEMS inertial devices during assembly, and at the same time, to address the limitations of adhesive fixation during the assembly of MEMS inertial devices. The present invention proposes a device and method for low-stress assembly of MEMS inertial devices. The assembly device is universal for the adhesive fixation method of MEMS inertial devices, solving the problem of low installation accuracy during low-stress assembly of MEMS inertial devices.

[0005] The technical solution of the present invention is: A device for low-stress assembly of a MEMS inertial device, the device comprising two adhesive buckles, both of which comprise a shell fixing functional module, an adhesive thickness control module and a circuit board fixing functional module; the shell fixing functional module and the circuit board fixing functional module are connected in a circular shape at their ends, the adhesive thickness control module is located between the shell fixing functional module and the circuit board fixing functional module, and is connected to the end of the circuit board fixing functional module; The shell fixing functional modules of the two adhesive buckles are fixed to the outer side of the MEMS inertial device shell, the circuit board fixing functional module is fixed to the inner side of the circuit board welded with the MEMS inertial device, and the adhesive thickness control module is located between the circuit board and the shell.

[0006] Preferably, the MEMS inertial device is welded on the outside of the circuit board and connected to the inner wall of the housing.

[0007] Preferably, the circuit board fixing functional module is designed according to the layout of electronic components on the circuit board.

[0008] Preferably, the glue thickness control function module is designed according to the thickness of the MEMS inertial device on the circuit board and the required glue thickness, and the thickness of the glue is reserved.

[0009] Preferably, the shell fixing functional module is designed according to the shape of the shell, and the adhesive buckle is fixed on the shell.

[0010] Preferably, the lengths of the shell fixing functional module, the glue thickness control module and the circuit board fixing functional module of the two adhesive buckles are L1, L2 and L3 respectively, wherein L1>L3>L2.

[0011] Preferably, a first slot is formed between the shell fixing functional module and the glue thickness control module, and is stuck on the upper edge of the shell; A second slot is formed between the glue thickness control module and the circuit board fixing function module and is clamped on the upper edge of the circuit board.

[0012] Preferably, the bottoms of the first card slot and the second card slot are rounded.

[0013] Preferably, the two adhesive buckles are integrally formed by processing with polyetheretherketone material.

[0014] A method for low stress assembly of MEMS inertial devices, comprising the steps of: S1. Use the glue dispensing tool to apply glue to the circuit board and MEMS inertial device surface to ensure sufficient glue amount; S2, stick the glued circuit board to the inner wall of the shell; S3, install two adhesive buckles, and clamp the circuit board in the second card slot; the adhesive thickness control function module is located between the circuit board and the shell to ensure the distance between the circuit board and the shell and control the thickness of the adhesive; the first card slot clamps the shell; S4. Remove excess glue and keep the non-adhesive part clean and tidy; S5. After the glue is cured, pull out the two adhesive clips to complete the adhesive fixation of the MEMS inertial device.

[0015] The advantages of the present invention are: 1. The device for low-stress assembly of MEMS inertial devices proposed by the present invention is composed of a plurality of adhesive buckles. Through the device, the thickness of the adhesive when the MEMS inertial device is fixed by adhesive can be controlled, and the installation accuracy of the MEMS inertial device under low-stress assembly can be ensured. The device is simple to operate and easy to implement, and can effectively ensure the accuracy and performance level of the MEMS inertial device; 2. This device is used to assemble MEMS inertial devices. After the entire process is completed, there is no material left inside the system except for the adhesive material, which has a certain optimization effect on simplifying the system assembly method and reducing weight; 3. The materials used in the design and processing of the device of the present invention are high in strength and reusable, thereby reducing the assembly cost of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below in conjunction with the accompanying drawings and embodiments: Figure 1 It is a schematic diagram of the structure of the adhesive buckle of the present invention; Figure 2 It is a schematic diagram of assembling the MEMS inertial device of the present invention. DETAILED DESCRIPTION

[0017] The device for low stress assembly of MEMS inertial devices of the present invention comprises two Figure 1 The adhesive buckle 1 shown in the figure includes a shell fixing functional module 11, a glue thickness control module 12 and a circuit board fixing functional module 13; the shell fixing functional module 11 and the circuit board fixing functional module 13 are connected in a circular shape at the ends, and the glue thickness control module 12 is located between the shell fixing functional module 11 and the circuit board fixing functional module 13, and is connected to the end of the circuit board fixing functional module 13.

[0018] Figure 1 In the embodiment, the lengths of the shell fixing functional module 11, the glue thickness control module 12 and the circuit board fixing functional module 13 of the two adhesive buckles 1 are L1, L2 and L3 respectively, wherein L1>L3>L2. A first card slot is formed between the shell fixing functional module 11 and the glue thickness control module 12, which is stuck on the upper edge of the shell; a second card slot is formed between the glue thickness control module 12 and the circuit board fixing functional module 13, which is stuck on the upper edge of the circuit board.

[0019] During the assembly process, the adhesive buckle 1 contacts with the system housing 2 and the circuit board 3. To avoid scratches on the housing 2 and the circuit board 3 and to ensure the strength and reuse of the adhesive buckle, polyetheretherketone (PEEK) material is selected to complete the design and processing of one-piece molding. At the same time, the parts in contact with the housing and the circuit board, namely the bottom of the first card slot and the second card slot, are rounded.

[0020] like Figure 2 As shown, during specific installation, the shell fixing function module 11 of the two adhesive buckles 1 is fixed to the outer side of the shell 2 of the MEMS inertial device, the circuit board fixing function module 13 is fixed to the inner side of the circuit board 3 welded with the MEMS inertial device 4, and the glue thickness control module 12 is located between the circuit board and the shell.

[0021] The MEMS inertial device 4 is welded on the outside of the circuit board 3 and connected to the inner wall of the housing 2. The circuit board fixing functional module 13 is designed according to the layout of the electronic devices on the circuit board. The glue thickness control functional module 12 is designed according to the thickness of the MEMS inertial device 4 on the circuit board and the required adhesive thickness, and the adhesive thickness is reserved. The housing fixing functional module 11 is designed according to the shape of the housing 2, and the adhesive buckle is fixed on the housing 2.

[0022] The method for low-stress assembly of MEMS inertial devices of the present invention specifically comprises the steps of: S1. Use the glue dispensing tool to apply glue to the circuit board and MEMS inertial device surface to ensure sufficient glue amount; S2, stick the glued circuit board to the inner wall of the shell; S3, install two adhesive buckles, and clamp the circuit board in the second card slot; the adhesive thickness control function module is located between the circuit board and the shell to ensure the distance between the circuit board and the shell and control the thickness of the adhesive; the first card slot clamps the shell; S4. Remove excess glue and keep the non-adhesive part clean and tidy; S5. After the glue is cured, pull out the two adhesive clips to complete the adhesive fixation of the MEMS inertial device.

[0023] The present invention utilizes the above-mentioned device to assemble the MEMS inertial device. After the whole process is completed, except for the adhesive material, no other materials remain in the system, which has a certain optimization effect on simplifying the system assembly method and reducing the weight; at the same time, the installation position of the MEMS inertial device and the thickness of the adhesive are guaranteed, the stress in the assembly process of the MEMS inertial device is reduced, and the performance level of the MEMS inertial device is guaranteed; the materials used in the design and processing of the device are high in strength and can be reused, which reduces the assembly cost of the system.

[0024] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any modifications made according to the spirit of the main technical solution of the present invention should be included in the protection scope of the present invention.

Claims

1. A device for low stress assembly of MEMS inertial devices, characterized in that: The device includes two adhesive buckles, each of which includes a shell fixing function module, an adhesive thickness control module and a circuit board fixing function module; the shell fixing function module and the circuit board fixing function module are connected in a circular shape at the end, and the adhesive thickness control module is located between the shell fixing function module and the circuit board fixing function module and is connected to the end of the circuit board fixing function module; The shell fixing functional modules of the two adhesive buckles are fixed to the outer side of the MEMS inertial device shell, the circuit board fixing functional module is fixed to the inner side of the circuit board welded with the MEMS inertial device, and the adhesive thickness control module is located between the circuit board and the shell.

2. The device for low stress assembly of MEMS inertial devices according to claim 1, characterized in that: The MEMS inertial device is welded on the outer side of the circuit board and connected to the inner wall of the shell.

3. The device for low stress assembly of MEMS inertial devices according to claim 2, characterized in that: The circuit board fixing functional module is designed according to the layout of electronic components on the circuit board.

4. The device for low stress assembly of MEMS inertial devices according to claim 3, characterized in that: The glue thickness control function module is designed according to the thickness of the MEMS inertial device on the circuit board and the required glue thickness, and the thickness of the glue is reserved.

5. The device for low stress assembly of MEMS inertial devices according to claim 4, characterized in that: The shell fixing functional module is designed according to the shape of the shell and fixes the adhesive buckle on the shell.

6. The device for low stress assembly of MEMS inertial devices according to claim 2, characterized in that: The lengths of the shell fixing functional module, the glue thickness control module and the circuit board fixing functional module of the two adhesive buckles are L1, L2 and L3 respectively, wherein L1>L3>L2.

7. The device for low stress assembly of MEMS inertial devices according to claim 6, characterized in that: A first slot is formed between the housing fixing functional module and the glue thickness control module and is clamped on the upper edge of the housing; A second slot is formed between the glue thickness control module and the circuit board fixing function module and is clamped on the upper edge of the circuit board.

8. The device for low stress assembly of MEMS inertial devices according to claim 7, characterized in that: The bottoms of the first card slot and the second card slot are rounded.

9. According to the device for low-stress assembly of MEMS inertial devices according to any one of claims 1 to 8, the two adhesive buckles are integrally formed by processing with polyetheretherketone material.

10. A method for low stress assembly of MEMS inertial devices, using the device according to any one of claims 1 to 8, characterized in that: Includes steps: S1. Use the glue dispensing tool to apply glue to the circuit board and MEMS inertial device surface to ensure sufficient glue amount; S2, stick the glued circuit board to the inner wall of the shell; S3, install two adhesive buckles, and clamp the circuit board in the second card slot; the adhesive thickness control function module is located between the circuit board and the shell to ensure the distance between the circuit board and the shell and control the thickness of the adhesive; the first card slot clamps the shell; S4. Remove excess glue and keep the non-adhesive part clean and tidy; S5. After the glue is cured, pull out the two adhesive clips to complete the adhesive fixation of the MEMS inertial device.

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