Chip and packaging method thereof

Abstract

The invention discloses a chip and a packaging method thereof. The chip comprises a first plate, a second plate, a first packaging adhesive and a second packaging adhesive, the second plate and the first plate are oppositely arranged, the first packaging adhesive is arranged between the first plate and the second plate, a channel is formed in the first packaging adhesive, and the second packaging adhesive is arranged around the edge of the channel. Therefore, the first packaging adhesive can form a stable channel for biochemical reaction of the reagent, and the second packaging adhesive can isolate the first packaging adhesive from the channel, so that the influence of special molecules released by the first packaging adhesive on the biochemical reaction in the channel is reduced or avoided, and the sequencing quality is improved.

Description

Technical Field

[0001] The present invention relates to the field of gene sequencing, and in particular to a chip and a packaging method thereof. Background Art

[0002] The chip adapted to the sequencing platform is a reaction device that can carry the nucleic acid to be tested and can contain a solution to provide a reaction environment or a detection environment for the nucleic acid to be tested, also known as a flow chamber or a flow cell.

[0003] On a platform that realizes sequencing based on an optical imaging system detection chip (sometimes referred to as a sequencer), by imaging specific positions of the chip (positions connected to the nucleic acid molecules to be tested, sometimes also referred to as reaction areas or fluid channels), the base arrangement order of the nucleic acid molecules to be tested is identified and determined based on the information of these images. For example, specifically, in a platform that uses optically labeled nucleotides and performs sequencing based on the principle of sequencing by synthesis, during sequencing, the sequencer irradiates the markers in the reagent solution and excites them to emit optical signals, and then collects these optical signals, such as taking pictures to obtain images, and identifies and determines the base arrangement order based on the information on these images to achieve the purpose of sequencing.

[0004] In the related art, the chip includes a substrate and a cover plate, and the substrate and the cover plate are packaged by adhesive material. The channel formed between the substrate and the cover plate is unstable, and there is a large problem of adhesive release, which affects the biochemical reaction. Summary of the invention

[0005] The invention provides a chip and a packaging method thereof.

[0006] The present application provides a chip, which includes a first plate, a second plate, a first packaging glue and a second packaging glue. The second plate is arranged opposite to the first plate, the first packaging glue is arranged between the first plate and the second plate, the first packaging glue forms a channel, and the second packaging glue is arranged around the edge of the channel.

[0007] In this way, the first encapsulation glue can form a stable channel for reagents to perform biochemical reactions, and the second encapsulation glue can isolate the first encapsulation glue from the channel, reducing or avoiding the influence of special molecules released by the first encapsulation glue on the biochemical reactions in the channel, thereby improving the sequencing quality.

[0008] In some embodiments, an outer edge of the first encapsulant is flush with outer edges of the first plate and the second plate.

[0009] In certain embodiments, the second encapsulant contacts an edge of the channel.

[0010] In some embodiments, the first packaging adhesive and the second packaging adhesive do not overlap in the thickness direction of the first board.

[0011] In some embodiments, the second encapsulant connects the first board and the second board.

[0012] In certain embodiments, the first packaging adhesive is a pressure sensitive adhesive.

[0013] In some embodiments, the second packaging glue is UV glue.

[0014] In certain embodiments, the thickness of the first sheet is less than the thickness of the second sheet.

[0015] In some embodiments, the surfaces of the first plate and the second plate facing each other are both planes.

[0016] In some embodiments, the distance between the first plate and the second plate is 50 μm to 200 μm.

[0017] In some embodiments, the width of the second packaging adhesive is in the range of 0.2 mm to 0.3 mm.

[0018] In certain embodiments, the width of the channel ranges from 3 mm to 15 mm; and / or the length of the channel ranges from 50 mm to 200 mm.

[0019] In some embodiments, the ends of the channel in the length direction are convergent.

[0020] In certain embodiments, the minimum distance between two adjacent channels is 2.0 mm.

[0021] The present application provides a chip packaging method, the method comprising:

[0022] Disposing a first packaging adhesive on the first plate, wherein the first packaging adhesive forms a channel;

[0023] placing a second encapsulation adhesive at the edge of the channel;

[0024] The first plate provided with the first packaging adhesive and the second packaging adhesive is bonded to the second plate.

[0025] In some embodiments, before disposing the first packaging adhesive on the first board, the method includes:

[0026] cleaning the first plate and the second plate;

[0027] The cleaned first plate and second plate are dried.

[0028] In some embodiments, disposing a first packaging adhesive on a first plate includes:

[0029] placing the first plate on the carrying platform;

[0030] placing the first packaging glue on the conveying device;

[0031] Driving the carrying platform and the conveying device to move relative to each other, so that the carrying platform and the conveying device are close to each other, thereby driving the first packaging glue and the first plate to be close to each other;

[0032] Using a positioning device to assist in positioning the first plate and the first packaging adhesive;

[0033] The pressing device is controlled to attach the first packaging adhesive to the first plate.

[0034] In some embodiments, before disposing the second encapsulant at the edge of the channel, the method includes:

[0035] The first plate provided with the first packaging glue is defoamed by using a defoaming device.

[0036] In some embodiments, disposing a second encapsulant at an edge of the channel includes:

[0037] Placing the first plate on the dispensing jig;

[0038] Positioning using a first packaging adhesive;

[0039] Add a second dot of encapsulation glue to the edge of the channel.

[0040] In some embodiments, laminating a first plate provided with a first packaging adhesive and a second packaging adhesive to a second plate includes:

[0041] Placing the first plate and the second plate provided with the first packaging glue and the second packaging glue on a bonding jig;

[0042] The first plate and the second plate are bonded together using a vacuum bonding machine.

[0043] In some embodiments, after laminating the first sheet provided with the first packaging glue and the second packaging glue to the second sheet, the method includes:

[0044] Using a pressure holding device to hold the chip after the first plate and the second plate are bonded together;

[0045] Use curing equipment to cure the chips after pressure maintenance;

[0046] The cured chip is defoamed using defoaming equipment.

[0047] In some embodiments, curing the chip after pressure maintenance using a curing device includes:

[0048] The curing device is used to emit ultraviolet rays to the second packaging adhesive to cure the second packaging adhesive.

[0049] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0051] Figure 1 is a schematic structural diagram of a chip according to an embodiment of the present invention;

[0052] Figure 2 yes Figure 1 Schematic cross-sectional view along the AA direction;

[0053] Figure 3 This is a performance comparison chart of chips using different types of plastic packaging;

[0054] Figure 4 is a flow chart of a chip packaging method according to an embodiment of the present invention;

[0055] Figure 5 is a flow chart of a chip packaging method according to an embodiment of the present invention;

[0056] Figure 6 is a flow chart of a chip packaging method according to an embodiment of the present invention;

[0057] Figure 7 is a flow chart of a chip packaging method according to an embodiment of the present invention;

[0058] Figure 8 is a flow chart of a chip packaging method according to an embodiment of the present invention;

[0059] Fig. 9 It is a flow chart of a chip packaging method according to an embodiment of the present invention.

[0060] Explanation of the reference numerals: 100, chip; 10, first plate; 20, second plate; 21, inlet; 22, outlet; 30, first packaging glue; 31, channel; 32, middle section; 33, first end; 34, second end; 40, second packaging glue. DETAILED DESCRIPTION

[0061] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0062] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0063] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0064] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0065] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0066] See also Figure 1 and Figure 2 The present application provides a chip 100, which includes a first plate 10, a second plate 20, a first packaging glue 30 and a second packaging glue 40. The second plate 20 is arranged opposite to the first plate 10, the first packaging glue 30 is arranged between the first plate 10 and the second plate 20, the first packaging glue 30 forms a channel 31, and the second packaging glue 40 is arranged around the edge of the channel 31.

[0067] In this way, the first encapsulation glue 30 can form a stable channel 31 for reagents to perform biochemical reactions, and the second encapsulation glue 40 can isolate the first encapsulation glue 30 from the channel 31, reducing or avoiding the influence of special molecules released by the first encapsulation glue 30 on the biochemical reaction in the channel 31, thereby improving the sequencing quality.

[0068] Specifically, the chip 100 may be a reactor having fixed thereon nucleic acid molecules to be tested with optical detection labels, having a space for accommodating liquid and capable of being used to fix samples to be tested, also referred to as a flow cell or flow chamber.

[0069] The first plate 10 and the second plate 20 may be made of glass, silicon dioxide, crystal, quartz glass, plastic, ceramic, PET (polyethylene terephthalate), PMMA (polymethyl methacrylate), etc. In one embodiment, the first plate 10 and the second plate 20 are optically transparent, such as glass sheets / glass layers, so that the optical system can collect optical signals generated on the surface of the chip 100. The thickness directions of the first plate 10, the second plate 20 and the first packaging glue 30 may be in the same direction.

[0070] The first encapsulation glue 30 is arranged between the first plate 10 and the second plate 20, and one or more channels 31, for example, 1, 2, 3, 4, 6, 8, etc., can be formed between the first plate 10 and the second plate 20 through a partial hollowing design. The channel 31 has a space for accommodating liquid, which can accommodate the sample to be tested and the reagent so that the sample to be tested and the reagent undergo a biochemical reaction. The arrangement of the channel 31 in the chip 100 can be adjusted based on different needs. In one embodiment, the channel 31 can extend along the length direction of the first encapsulation glue 30, and a plurality of channels 31 can be arranged at intervals along the width direction of the first encapsulation glue 30. In another embodiment, the channel 31 can be set as a U-shaped channel with an opening facing the same end.

[0071] The second packaging glue 40 is disposed around the edge of the channel 31, that is, the shape of the second packaging glue 40 can be consistent with the shape formed by the edge of the channel 31. For example, the channel 31 is rectangular, and the second packaging glue 40 is disposed in a rectangular ring shape.

[0072] See also Figure 2 In some embodiments, the outer edge of the first packaging adhesive 30 is flush with the outer edges of the first plate 10 and the second plate 20 .

[0073] In this way, the bonding area between the first packaging adhesive 30 and the first plate 10 and the second plate 20 can be increased, thereby improving the stability of the chip 100 packaging.

[0074] Specifically, the first packaging glue 30, the first plate 10, and the second plate 20 have the same shape and size. For example, the first packaging glue 30, the first plate 10, and the second plate 20 are all rectangular and have four right angles, and the first packaging glue 30, the first plate 10, and the second plate 20 have the same length and width. For another example, the first packaging glue 30, the first plate 10, and the second plate 20 are all rectangular and have four rounded or chamfered corners, and the first packaging glue 30, the first plate 10, and the second plate 20 have the same length and width, and the radius of the rounded corners or the shape and size of the chamfers are also the same.

[0075] See also Figure 1 In some embodiments, the second packaging adhesive 40 contacts the edge of the channel 31 .

[0076] The second packaging glue 40 can be arranged inside the channel 31 and around the edge of the channel 31. In this way, a gap can be prevented from being formed between the second packaging glue 40 and the inner edge of the first packaging glue 30, and the overflow of the first packaging glue 30 along the gap direction can be reduced, so that the channel 31 has a stable depth.

[0077] See also Figure 2In some embodiments, the first packaging adhesive 30 and the second packaging adhesive 40 do not overlap in the thickness direction of the first plate 10 .

[0078] In this way, the first packaging glue 30 can form a channel 31 with a stable depth, thereby preventing the depth variation of the channel 31 from affecting the imaging of the optical system.

[0079] Specifically, the first packaging glue 30 connects the first plate 10 and the second plate 20 , and the second packaging glue 40 is disposed around the inner side of the channel 31 , and the outer edge of the second packaging glue 40 contacts the inner edge of the first packaging glue 30 .

[0080] See also Figure 2 In some embodiments, the second packaging adhesive 40 connects the first plate 10 and the second plate 20 .

[0081] In this way, the second encapsulation glue 40 can isolate the inner edge of the first encapsulation glue 30 from the inside of the channel 31, preventing the second encapsulation glue 40 from forming a gap with the first plate 10 or the second plate 20. The special molecules released by the first encapsulation glue 30 affect the biochemical reaction in the channel 31 through the gap, thereby improving the sequencing quality. Specifically, the thickness of the second encapsulation glue 40 can be the distance between the first plate 10 and the second plate 20.

[0082] In some embodiments, the first packaging adhesive 30 is a pressure sensitive adhesive.

[0083] The pressure-sensitive adhesive can form a stable channel 31. Specifically, the material of the pressure-sensitive adhesive can be a resin-type pressure-sensitive adhesive, including polyacrylate, polyurethane, polyvinyl chloride, polyvinyl ether, etc., or a rubber-type pressure-sensitive adhesive, including styrene-butadiene rubber, polyisoprene rubber, polyisobutylene and butyl rubber, as well as chloroprene rubber, nitrile rubber, etc.

[0084] The processing and cutting methods of the pressure-sensitive adhesive with the channel 31 include laser cutting, die cutting and other methods. The laser cutting and die cutting methods have high processing precision and high efficiency. The pressure-sensitive adhesive after processing is protected by release films on both sides, and there will be no adhesion between the release film and the pressure-sensitive adhesive. In other words, the pressure-sensitive adhesive will not be damaged by the outside world when it is not in use. During use, the release protective films on both sides of the pressure-sensitive adhesive are removed in turn according to specific needs, and the object to be adhered is attached to the pressure-sensitive adhesive. Under the action of external force, the bonded object will be firmly adhered by the pressure-sensitive adhesive.

[0085] In some embodiments, the second packaging adhesive 40 is UV adhesive.

[0086] The UV glue has strong adhesion and stable properties, and will not release special molecules to affect the biochemical reaction of the reagents in the channel 31.

[0087] Specifically, UV glue can be epoxy UV glue, acrylic UV glue, silicone UV glue, etc. UV glue needs to be loaded by dispensing, spin coating, spraying, etc. through corresponding equipment, and then the objects to be bonded are bonded and fixed, and then UV glue is irradiated with ultraviolet light to solidify and fix it, so as to achieve the purpose of bonding and fixing.

[0088] Figure 3 Chip 100 No. 1-6 is a comparison of the effects of packaging the first plate 10 and the second plate 20 using different types of pressure-sensitive adhesives, and chip 100 No. 7-12 is a comparison of the effects of packaging the first plate 10 and the second plate 20 using different types of pressure-sensitive adhesives and UV adhesives. It can be seen from the figure that when the first packaging adhesive 30 is OCA adhesive and the second packaging adhesive 40 is epoxy UV adhesive DELO OB749, the chip 100 has good pressure resistance, low adhesive release, good stability of the channel 31, and good appearance of the adhesive line.

[0089] See also Figure 2 In some embodiments, the thickness of the first plate 10 is less than the thickness of the second plate 20.

[0090] Specifically, the first plate 10 can be a cover plate of the chip 100, and the second plate 20 can be a substrate of the chip 100. The cover plate can provide protection for the substrate, and after the analysis process is completed, the sample located in the channel 31 may leak. The cover plate can prevent the sample from overflowing the chip 100.

[0091] The first plate 10 can be made of a transparent material, which can ensure that when the imaging mechanism takes pictures of the sample, a clear photo can be obtained smoothly, and the photo will not be blurred due to the first plate 10. Exemplarily, the thickness of the first plate 10 is 0.1 mm to 0.5 mm, and the thickness of the second plate 20 is 0.5 mm to 1 mm.

[0092] In order to form a flow-through channel 31 between the first plate 10 and the second plate 20 of the chip 100, an inlet 21 and an outlet 22 may be provided on the second plate 20, and the inlet 21 and the outlet 22 are connected to the channel 31, so that the biochemical reaction sequencing reagents can flow from the inlet 21 into the channel 31 and flow out from the outlet 22, forming a smooth flow channel.

[0093] In some embodiments, the surfaces of the first plate 10 and the second plate 20 facing each other are both planes.

[0094] In the process of theoretical simulation calculation of the fluid inside the simulation chip 100, it is found that the flow of the fluid includes laminar flow, turbulent flow, turbulent flow, etc., and the factors affecting the uniformity of the flow and distribution of the fluid are not limited to the flow velocity inside the flow channel and the distribution of streamlines, but also include the distribution of the pressure inside the channel 31, and the stress distribution inside the channel 31 and the first plate 10. Therefore, in order to ensure the uniformity of the flow and distribution of the fluid, the height of the channel 31 is the same as the height of the first packaging glue 30, so that the surface of the first plate 10 and the second plate 20 that are relatively arranged is a plane structure, which is convenient for processing and conducive to reducing costs, and the plane structure is conducive to reducing the resistance of the biochemical reactant in the channel 31, ensuring that the pressure on the inner surface of the first plate 10 and the second plate 20 that are relatively arranged is uniform, which is conducive to improving the accuracy of gene sequencing.

[0095] In some embodiments, the distance between the first plate 10 and the second plate 20 is 50 μm to 200 μm.

[0096] Specifically, the distance between the first plate 10 and the second plate 20 is the thickness of the first packaging glue 30, that is, the depth of the channel 31. When the depth of the channel 31 is within the above range, it is convenient for biochemical reactions to occur in the channel 31, and it is also beneficial for double-sided imaging.

[0097] The distance between the first plate 10 and the second plate 20 can be 70 μm, 72 μm, 74 μm, 76 μm, 78 μm, 80 μm, etc. The first encapsulation glue 30 of different thicknesses can be selected according to actual needs to form channels 31 of different depths to meet different sequencing needs. The distance between the first plate 10 and the second plate 20 can be equal everywhere and within the above range, or can be within the above range everywhere.

[0098] In some embodiments, the width of the second packaging adhesive 40 is in the range of 0.2 mm to 0.3 mm.

[0099] Thus, when the width of the second packaging glue 40 is within the above range, the first packaging glue 30 can be isolated from the channel 31 , and at the same time, the width of the channel 31 surrounded by the second packaging glue 40 is convenient for biochemical reactions.

[0100] Specifically, the width of the second encapsulation glue 40 is the distance between the inner edge and the outer edge of the second encapsulation glue 40, that is, the distance between the inner edge of the second encapsulation glue 40 and the edge of the channel 31. The width of the second encapsulation glue 40 can be 0.2 mm, 0.22 mm, 0.24 mm, 0.26 mm, 0.28 mm, 0.3 mm, etc. The amount of the second encapsulation glue 40 can be set according to the width, thickness and length of the second encapsulation glue 40, and the length of the second encapsulation glue 40 is the circumference of the center ring line.

[0101] In some embodiments, the width of the channel 31 ranges from 3 mm to 15 mm; and / or the length of the channel 31 ranges from 50 mm to 200 mm.

[0102] Thus, when the width and / or length of the channel 31 is within the above range, a space of suitable size can be provided for the biochemical reaction, so as to facilitate the biochemical reaction between the sample to be tested and the reagent in the channel 31 .

[0103] Specifically, the width of the channel 31 is the maximum dimension of the channel 31 along the width direction. The width direction of the channel 31 is the direction in which multiple channels 31 are arranged at intervals. The width of the channel 31 can be 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, 11mm, 12mm, etc.

[0104] The length of the channel 31 is the maximum dimension of the channel 31 along the length direction. The length direction of the channel 31 is perpendicular to the width direction and thickness direction of the channel 31. The length of the channel 31 can be 70mm, 80mm, 90mm, 100mm, 110mm, 120mm, 130mm, etc.

[0105] The width of the channel 31 may be in the range of 5 mm to 12 mm, the length of the channel 31 may be in the range of 70 mm to 130 mm, or the width of the channel 31 may be in the range of 5 mm to 12 mm and the length of the channel 31 may be in the range of 70 mm to 130 mm.

[0106] See also Figure 1 In some embodiments, the ends of the channel 31 in the length direction are gathered.

[0107] In this way, it is convenient for the reagent solution to disperse and flow into the channel 31 from the end, and it is also convenient for the reagent solution in the channel 31 to gather toward the end.

[0108] Specifically, the shape of the channel 31 may be an irregular shape, for example, the channel 31 may include a middle section 32, a first end 33 and a second end 34. The first end 33 and the second end 34 are symmetrically arranged at the two ends of the channel 31, and are both triangular in shape, and the middle section 32 is in the shape of a long narrow rectangle. Of course, the first end 33 and the second end 34 may also be in different shapes, for example, the first end 33 forms an angle, and the second end 34 forms a rounded corner.

[0109] The first end 33, the middle section 32 and the second end 34 are sequentially arranged along the length direction of the first packaging glue 30. Among them, the middle section 32 is used for the reagent solution to perform the corresponding reaction; the first end 33 can be set as a liquid inlet area for the reagent solution to flow into the channel 31, and the second end 34 can be set as a liquid outlet area for the reagent solution to discharge from the channel 31. Of course, it should be understood that the positions of the first end 33 and the second end 34 can be interchanged, so the channel 31 can also be set as: the second end 34 is a liquid inlet area for the reagent solution to flow into the channel 31, and the first end 33 is a liquid outlet area for the reagent solution to discharge from the channel 31.

[0110] In some embodiments, the minimum distance between two adjacent channels 31 is 2.0 mm.

[0111] In this way, the strength of the first packaging glue 30 can be improved while reducing the risk of cross contamination between different samples to be tested and different reagents in different channels 31 .

[0112] Specifically, the distance between two adjacent channels 31 may be the distance between the middle sections 32 of the two adjacent channels 31 , and the distance between two adjacent channels 31 may be 2.0 mm, 2.2 mm, 2.4 mm, 2.6 mm, 2.8 mm, 3.0 mm, etc.

[0113] See also Figure 4 The present application provides a chip 100 packaging method, the method comprising:

[0114] S10, disposing a first packaging adhesive 30 on the first plate 10, wherein the first packaging adhesive 30 forms a channel 31;

[0115] S20, placing the second packaging glue 40 at the edge of the channel 31;

[0116] S30 , bonding the first plate 10 provided with the first packaging adhesive 30 and the second packaging adhesive 40 to the second plate 20 .

[0117] Specifically, in step S10 , before the first packaging adhesive 30 is disposed on the first plate 10 , the first packaging adhesive 30 may be cut so that the first packaging adhesive 30 is formed with a channel 31 .

[0118] In step S20 , a dispensing machine may be used to dispose the second packaging glue 40 on the edge of the channel 31 . The dispensing machine may be divided into a manual dispensing machine, a semi-automatic dispensing machine and a fully automatic dispensing machine.

[0119] In step S30, the first plate 10 and the second plate 20 may be bonded together by pressure or by vacuum bonding.

[0120] See also Figure 5In some embodiments, before disposing the first packaging adhesive 30 on the first plate 10, the method includes:

[0121] S01, cleaning the first plate 10 and the second plate 20;

[0122] S02, performing surface treatment on the cleaned first plate 10 and second plate 20;

[0123] S03, drying the first plate 10 and the second plate 20 after the surface treatment.

[0124] Specifically, in step S01, the cleaning may be immersion cleaning, ultrasonic cleaning, plasma cleaning, etc., the purpose of which is to remove impurities on the first plate 10 and the second plate 20 to provide a clean surface for subsequent surface treatment.

[0125] In step S02, since the second plate 20 and the first plate 10 of the chip 100 are the core components of the entire chip 100, the main functions of the second plate 20 and the first plate 10 are to capture DNA through specific surface properties, and then make the DNA react with the biochemical reaction sequencing reagent in the chip 100, and finally the instrument detects the signal on the second plate 20 or the first plate 10. The performance of the second plate 20 and the first plate 10 directly affects the biochemical reaction effect and the test result. Therefore, the surface treatment of the second plate 20 and the first plate 10 is one of the very important links.

[0126] Specifically, the surface treatment of the second plate 20 and the first plate 10 can be a chemical vapor deposition method, which can ensure that the surfaces of the second plate 20 and the first plate 10 of the chip 100 form the required functional groups evenly distributed. The effect of the surface treatment forms a hydrophilic or hydrophobic surface according to specific needs, or the specific functional groups formed can be hydroxyl, carboxyl, ether bond, aldehyde, carbonyl, etc., all of which are for the purpose of effectively connecting and fixing NDA, while making the biochemical reaction sequencing reagents react more effectively inside the flow channel. The temperature range of the surface treatment is 25°C to 50°C, and the time of the surface treatment is 5min to 60min.

[0127] The surface treatment method of the second plate 20 and the first plate 10 may also be a liquid phase immersion method, a surface spin coating method, a surface spray coating method, and the like.

[0128] In step S03 , nitrogen gas may be used to remove moisture from the first plate 10 and the second plate 20 to reduce oxidation of the first plate 10 and the second plate 20 .

[0129] See also Figure 6 In some embodiments, the first packaging glue 30 is disposed on the first plate 10 (step S10), including:

[0130] S11, placing the first plate 10 on the carrying platform;

[0131] S12, placing the first packaging glue 30 on the conveying device;

[0132] S13, driving the carrying platform and the conveying device to move relative to each other, so that the carrying platform and the conveying device are close to each other, so as to drive the first packaging glue 30 and the first plate 10 to be close to each other;

[0133] S14, using a positioning device to assist in positioning the first plate 10 and the first packaging adhesive 30;

[0134] S15 , controlling the pressing device to attach the first packaging adhesive 30 to the first plate 10 .

[0135] In this way, by driving the conveying device and the carrying platform to move relative to each other, the positioning device is used to assist in the precise positioning of the first plate 10 and the first packaging glue 30, thereby improving the fitting accuracy of the first packaging glue 30 and the first plate 10 after being pressed by the pressing device, thereby reducing the defects of the first plate 10 and the first packaging glue 30.

[0136] Specifically, in step S11, the carrying platform can provide support for the first plate 10, and an installation position is set on the carrying platform. The carrying platform can form a negative pressure to adsorb the first plate 10 at the installation position. The surface shape of the carrying platform is not strictly limited. For example, the carrying platform can be a roughly rectangular plate-shaped structure.

[0137] In step S12 , an installation position is provided on the conveying device, and the conveying device can form a negative pressure to adsorb the first packaging glue 30 at the installation position.

[0138] In step S13, the conveying device can move or rotate to convey the first packaging glue 30 from a loading position away from the carrying platform to a bonding position close to the carrying platform. The distance of the conveying device relative to the carrying platform can be adjusted according to actual needs.

[0139] In step S14, the positioning device may include a camera and a display screen, the camera and the display screen may be located above the carrying platform, and the conveying device may be located between the carrying platform and the positioning device. Positioning may be to align the first packaging glue 30 and the first plate 10 diagonally to ensure the fitting accuracy.

[0140] In step S15, the pressing device may be a roller for rolling pressing or a plate-like structure for pressing pressing, and the pressing device may roll along the length direction of the carrying platform or move up and down along the height direction of the carrying platform, so that the first plate 10 and the first packaging glue 30 are tightly attached. When attaching, the film of the first packaging glue 30 may be torn off first, and then the first sheet 10 may be attached to one side of the film of the first packaging glue 30.

[0141] In some embodiments, before disposing the second encapsulant 40 at the edge of the channel 31, the method includes:

[0142] The first plate 10 provided with the first packaging adhesive 30 is subjected to a degassing treatment by using a degassing device.

[0143] In this way, bubbles generated when the first packaging glue 30 and the first plate 10 are attached to each other can be removed, the adhesion between the first packaging glue 30 and the first plate 10 can be increased, and the structural stability of the chip 100 can be improved.

[0144] Specifically, the degassing treatment may be to place the first board 10 with the first packaging glue 30 in a degassing machine and perform a degassing operation for 3 minutes under the conditions of a temperature of 40° C. and an air pressure of 0.45 MPa.

[0145] See also Figure 7 In some embodiments, the second packaging glue 40 is disposed at the edge of the channel 31 (step S20), including:

[0146] S21, placing the first plate 10 on a glue dispensing jig;

[0147] S22, positioning using a first packaging adhesive 30;

[0148] S23 , applying the second packaging glue 40 to the edge of the channel 31 .

[0149] Specifically, in step S21, the first plate 10 can be placed on the dispensing jig manually or by a robot. The dispensing jig can be located on a carrying platform of a dispensing machine, an installation space is formed on the dispensing jig, and the carrying platform of the dispensing machine can form a negative pressure to adsorb the first plate 10 in the installation space.

[0150] In step S22, the positioning points on the first packaging glue 30 are used to perform rough positioning of the glue dispensing, and the glue edge is grasped at each intermediate point of the glue dispensing to provide a certain glue dispensing offset.

[0151] In step S23 , the second packaging glue 40 may be applied to a position 0.1 mm to 0.15 mm away from the edge of the channel 31 . Before applying the glue, the thick film of the second packaging glue 40 may be torn off.

[0152] See also Figure 8 In some embodiments, the first plate 10 provided with the first packaging glue 30 and the second packaging glue 40 are bonded to the second plate 20 (step S30), including:

[0153] S31, placing the first plate 10 and the second plate 20 provided with the first packaging glue 30 and the second packaging glue 40 on a bonding jig;

[0154] S32, laminating the first plate 10 and the second plate 20 using a vacuum laminating machine.

[0155] Specifically, in step S31, the bonding jig can be located on the carrying platform of the vacuum bonding machine, and the bonding jig forms an installation space. The first plate 10 is placed in the installation space, and the second plate 20 is located on the side of the first plate 10 away from the carrying platform. Alternatively, the second plate 20 is placed in the installation space, and the first plate 10 is located on the side of the second plate 20 away from the carrying platform.

[0156] In step S32, the bonding principle of the vacuum bonding machine is to place the first plate 10 and the second plate 20 in a vacuum box in a vacuum environment, use the cylinder pressure of the machine to lower the inner mold of the vacuum cylinder, and completely press the glass cover plate and the LCD screen placed on the lower mold of the vacuum cylinder.

[0157] The vacuum degree during lamination can be 10pa to 50pa, such as 10pa, 20pa, 30pa, 40pa, 50pa, etc. The air pressure can be 0.05Mpa to 0.1Mpa, such as 0.05Mpa, 0.06Mpa, 0.07Mpa, 0.08Mpa, 0.09Mpa, 0.1Mpa, etc. The lamination time can be 10s to 30s, such as 10s, 15s, 20s, 25s, 30s. The parameters can be set according to different vacuum laminating machines, and the lamination pressure can be around 50N, such as 45N, 47N, 49N, 51N, 53N, 55N, etc.

[0158] See also Fig. 9 In some embodiments, after laminating the first plate 10 provided with the first packaging glue 30 and the second packaging glue 40 to the second plate 20, the method includes:

[0159] S33, using a pressure holding device to hold the chip 100 after the first plate 10 and the second plate 20 are bonded together;

[0160] S34, using a curing device to cure the chip 100 after the pressure maintenance;

[0161] S35 , performing a degassing process on the cured chip 100 using a degassing device.

[0162] Specifically, in step S33, the pressure holding gas pressure and the pressure holding time can be determined according to the actual pressure holding effect, so that during the pressure holding process, the second packaging glue 40 will not be subjected to excessive impact force and cause the second packaging glue 40 to explode, and at the same time, a certain pressure is maintained to press the chip 100 again, and some larger bubbles formed when the first plate 10 and the second plate 20 are attached are removed, or the large bubbles are turned into small bubbles. In one embodiment, the pressure holding gas pressure is 0.3Mpa, and the pressure holding time is 30s.

[0163] In step S34, the curing time and curing power can be determined according to the curing energy of the second encapsulant 40 and the power of the curing equipment. In one embodiment, the curing time is 20 seconds, the curing power is 90%, and the energy of the curing equipment is greater than 7000 mj / cm 2 .

[0164] In step S35, the cured chip 100 is degassed to remove small bubbles after pressure curing. In one embodiment, the degassed time is 15 minutes and the degassed pressure is 0.45 MPa.

[0165] In some embodiments, curing the chip 100 after pressure maintenance using a curing device includes:

[0166] The curing device is used to emit ultraviolet rays to the second packaging adhesive 40 so as to cure the second packaging adhesive 40 .

[0167] Specifically, the second packaging glue 40 can be UV glue, which is also called ultraviolet curing glue. UV glue is a type of glue that needs to be irradiated with ultraviolet light to be cured. It can be used as an adhesive, and can also be used as a glue for paints, coatings, inks, etc. The curing principle of UV glue is that the photoinitiator (or photosensitizer) in the UV curing material absorbs ultraviolet light under ultraviolet light to generate active free radicals or cations, which trigger monomer polymerization and cross-linking chemical reactions, so that the adhesive is converted from liquid to solid within a few seconds. The stronger the ultraviolet light, the faster the curing speed.

[0168] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0169] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A chip, characterized in that: include: First Plate; a second plate, the second plate being arranged opposite to the first plate; A first packaging glue, wherein the first packaging glue is disposed between the first plate and the second plate, and the first packaging glue forms a channel; and A second packaging glue is disposed around the edge of the channel.

2. The chip according to claim 1, characterized in that: The outer edge of the first packaging glue is flush with the outer edges of the first plate and the second plate; Optionally, the second encapsulation adhesive contacts an edge of the channel.

3. The chip according to claim 1, characterized in that: The first packaging adhesive and the second packaging adhesive do not overlap in a thickness direction of the first plate.

4. The chip according to claim 1, characterized in that: The second packaging adhesive connects the first plate and the second plate.

5. The chip according to claim 1, characterized in that: The first packaging adhesive is a pressure sensitive adhesive; Optionally, the second packaging glue is UV glue.

6. The chip according to claim 1, characterized in that: The thickness of the first plate is smaller than the thickness of the second plate; Optionally, surfaces of the first plate and the second plate facing each other are both planes.

7. The chip according to claim 1, characterized in that: The distance between the first plate and the second plate is 50 μm to 200 μm; Optionally, the width of the second packaging glue is in the range of 0.2 mm to 0.3 mm.

8. The chip according to claim 1, characterized in that: The width of the channel ranges from 3 mm to 15 mm; and / or the length of the channel ranges from 50 mm to 200 mm; Optionally, the ends of the channel in the length direction are gathered; Optionally, the minimum distance between two adjacent channels is 2.0 mm.

9. A chip packaging method, characterized in that: include: Disposing a first packaging adhesive on a first plate, wherein the first packaging adhesive forms a channel; Disposing a second packaging adhesive at an edge of the channel; The first plate provided with the first packaging adhesive and the second packaging adhesive is bonded to the second plate.

10. The packaging method according to claim 9, characterized in that: Before the first packaging glue is disposed on the first plate, the method includes: cleaning the first plate and the second plate; performing surface treatment on the cleaned first plate and the second plate; Drying the first plate and the second plate after surface treatment; Optionally, the step of disposing the first packaging adhesive on the first plate includes: Placing the first plate on a carrying platform; placing the first packaging glue on a conveying device; Driving the carrying platform and the conveying device to move relative to each other so that the carrying platform and the conveying device are close to each other, thereby driving the first packaging glue and the first plate to be close to each other; Using a positioning device to assist in positioning the first plate and the first packaging adhesive; Controlling the laminating device to laminate the first packaging adhesive onto the first plate; Optionally, before disposing the second packaging glue on the edge of the channel, the method includes: Using a degassing device to perform a degassing process on the first plate provided with the first packaging glue; Optionally, disposing the second packaging glue at the edge of the channel includes: Placing the first plate on a dispensing jig; Positioning by using the first packaging glue; Applying the second encapsulation glue to the edge of the channel; Optionally, bonding the first plate provided with the first packaging glue and the second packaging glue to a second plate includes: Placing the first plate and the second plate provided with the first packaging glue and the second packaging glue on a bonding jig; Laminating the first plate and the second plate using a vacuum laminating machine; Optionally, after laminating the first plate provided with the first packaging glue and the second packaging glue to a second plate, the method includes: Using a pressure holding device to hold the chip after the first plate and the second plate are bonded together; Using a curing device to cure the chip after pressure maintenance; Degassing the cured chip using degassing equipment; Optionally, curing the chip after pressure maintenance by using a curing device comprises: The curing device is used to emit ultraviolet rays to the second packaging adhesive to cure the second packaging adhesive.

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