Clean room waffle board bottom surface epoxy construction device and method

Abstract

This invention provides a device and method for epoxy coating on the bottom surface of waffle boards in cleanrooms, belonging to the technical field of epoxy coating on the bottom surface of waffle boards. The device and method include a template frame, a pressing plate, a support assembly, an injection assembly, an exhaust assembly, and an infrared assembly. The template frame has the same shape as the waffle board and is fixed around its perimeter. The pressing plate is positioned on one side of the template frame, corresponding to the position of the waffle board. The template frame, the pressing plate, and the bottom surface of the waffle board form a sealed structure. The support assembly is fixed to the bottom of the template frame, and the support assembly is used to push the pressing plate upwards to create an epoxy curing gap between the pressing plate and the waffle board. The injection assembly is located on both the left and right sides of the template frame. This invention solves the problems of bulging and sagging of the waffle board bottom surface during construction.

Description

Technical Field

[0001] This invention belongs to the field of epoxy construction technology for the bottom surface of waffle boards, and specifically relates to an epoxy construction device and method for the bottom surface of waffle boards in clean rooms. Background Technology

[0002] With the rapid development of information technology, the construction of electronic factories such as panel manufacturing plants and IC manufacturing plants has reached a peak in recent years. Among them, the design and construction of IC (chip / semiconductor industry) factories are more complex than ordinary processing plants, and the requirements for construction quality are also higher. The most significant difference between chip factories and ordinary factories lies in their core structure—cleanrooms. To ensure the air cleanliness of large-area production workshops, chip factories need to establish sophisticated and complex cleanroom air conditioning and ventilation systems. To meet this requirement, a large number of holes are usually evenly reserved in the workshop floor slab to form return air channels, achieving efficient air circulation and filtration. Waffle slab flooring is an ideal choice to meet this requirement. Traditional waffle tubes use materials such as SMC and FRP resin, serving both as a formwork and as part of the engineering structure.

[0003] However, existing removable waffle board bottoms for cleanrooms are prone to defects such as bulging and sagging during construction, resulting in substandard flatness of the overall waffle board bottom surface. This not only affects the aesthetics of the entire building but also the acceptance of the entire building construction. Summary of the Invention

[0004] In view of this, the present invention provides an epoxy construction device and method for the bottom surface of waffle boards in cleanrooms, which can solve the problems of bulging and sagging that easily occur on the bottom surface of waffle boards during construction.

[0005] This invention is implemented as follows:

[0006] This invention provides a cleanroom waffle board bottom epoxy construction device, comprising a template frame, a pressing plate, a support assembly, an injection assembly, an exhaust assembly, and an infrared assembly. The template frame is identical in shape to the waffle board and is fixed around its perimeter. The pressing plate is positioned on one side of the template frame, corresponding to the position of the waffle board. The template frame, the pressing plate, and the bottom surface of the waffle board form a sealed structure. The support assembly is fixed to the bottom of the template frame, and is used to push the pressing plate upwards to create an epoxy curing gap between the pressing plate and the waffle board. The injection assembly is located on both the left and right sides of the template frame, and is used to inject epoxy adhesive between the pressing plate and the waffle board. The exhaust assembly is located within the injection assembly, and is used to create a vacuum in the injected epoxy adhesive to accelerate its curing speed. The infrared assembly is located on the side of the pressing plate closest to the waffle board to further reinforce the curing of the epoxy adhesive.

[0007] The technical advantages of the epoxy coating application device for the bottom surface of waffle boards in cleanrooms provided by this invention are as follows: This device can enclose a single waffle board of the same area for epoxy coating, which has the following benefits:

[0008] Uniform adhesive thickness: Ensuring that the enclosed area is the same area ensures that the adhesive layer thickness of each waffle board is consistent, which helps to achieve a uniform surface effect, avoids strength differences caused by uneven thickness, and improves construction quality.

[0009] Improved adhesion: Uniform adhesive thickness can enhance the adhesion and bonding strength between epoxy adhesive and waffle board, reduce the risk of peeling and detachment, extend service life, and enhance the stability of the overall structure.

[0010] Reduced bubble formation: Injecting epoxy resin into a specific area can reduce air ingress, thereby reducing bubble formation and ensuring the smoothness, transparency, and density of the epoxy layer.

[0011] Convenient for controlling construction progress: The enclosed area allows construction workers to better control the amount of adhesive used and the degree of drying, preventing the adhesive from curing too slowly.

[0012] Easy to manage and maintain: The enclosed area makes construction more concentrated, easier to manage and monitor, less susceptible to external interference during construction, and ensures a smooth construction process.

[0013] Reduce material waste: The enclosed construction method can maximize the use of epoxy adhesive, better control the amount of epoxy adhesive used, reduce excess adhesive waste, and lower construction costs; it can also prevent epoxy adhesive from being lost during the pouring process, ensuring that each waffle board is fully covered.

[0014] Facilitates subsequent handling: After construction is completed, the enclosed area can be more easily cleaned and handled, ensuring the cleanliness and safety of the construction site.

[0015] Enhanced aesthetics: A uniform adhesive thickness and a smooth surface can enhance the overall aesthetics, making the floor look more professional and clean.

[0016] Facilitates quality inspection: The uniform adhesive thickness makes it easier to inspect and evaluate the construction quality later, ensuring that the design and usage requirements are met.

[0017] Based on the above technical solution, the cleanroom waffle board bottom epoxy construction device of the present invention can be further improved as follows:

[0018] The support assembly includes a push column, a push plate, and a cylinder. The push column comprises multiple push columns, one end of which is fixedly connected to the side of the pressing plate away from the waffle plate, and the other end is fixedly connected to the push plate. The output shaft of the cylinder is fixed to the side of the push plate away from the push column, and is used to push the push plate to move towards one side of the waffle plate.

[0019] The pushing column near the pressing plate and on both sides of the pushing plate are configured with a trumpet-shaped structure to balance the force, and the cross-sectional area at its center is smaller than the cross-sectional area on both sides.

[0020] The plurality of push columns are arranged in a sinusoidal curve structure on the pressing plate.

[0021] The beneficial effects of adopting the above-mentioned improved scheme are as follows: Multiple push columns can apply uniform pressure, keeping the pressed plate in contact with the epoxy adhesive flat and ensuring a consistent adhesive layer thickness. Multiple push columns increase the rigidity of the pressed plate, preventing deformation or tilting during the adhesive pouring process. The multiple push columns also make the pressed plate flatter, resulting in more uniform epoxy adhesive pouring and reducing unevenness. The push columns effectively prevent warping or deformation of the pressed plate during epoxy adhesive curing, thereby improving the quality of the epoxy layer. By providing uniform support, the probability of defects such as bubbles and wrinkles during construction is reduced, improving the quality of the finished product. The push columns have flared ends, which better distribute pressure evenly across the contact surface, reducing local stress concentration and improving structural stability. The narrower middle section helps reduce the overall weight of the push columns, facilitating operation by construction personnel and reducing material costs.

[0022] Furthermore, the push plate includes a top plate, a bottom plate, and a flexible layer. The top plate and the flexible layer are fixedly connected to the push column and the output shaft of the cylinder, respectively. The flexible layer is disposed between the top plate and the bottom plate to balance the force transmitted from the cylinder to the bottom plate on the flexible layer, so that the force received by the top plate and transmitted to the pressing plate through the push column is applied evenly on the plane of the pressing plate.

[0023] The thickness of the bottom plate is 1.5-2.5 times the thickness of the top plate.

[0024] The beneficial effects of adopting the above-mentioned improved scheme are as follows: the flexible layer can effectively distribute the pressure applied from below evenly to the upper structure, avoiding local stress concentration and reducing the risk of structural damage. By balancing the transfer of forces, it reduces structural fatigue and wear, helping to extend the service life of the entire system. The flexible layer can provide additional support, increasing the overall stability of the upper structure, especially under uneven loads.

[0025] Furthermore, the filling assembly includes an epoxy hose and a filling pump. One end of the epoxy hose is connected to the side wall of the template frame, and the other end extends to the bottom of the epoxy resin storage tank. The filling pump gradually draws epoxy resin from the epoxy resin storage tank and fills it between the pressing plate and the waffle plate.

[0026] The epoxy tubing has a corrugated structure, which is used to repeatedly collide the extracted epoxy adhesive to remove air bubbles.

[0027] The end of the epoxy hose that is connected to the template frame adopts a semi-parabolic structure, with its focal point located at the center of the pressing plate and the waffle plate in the vertical direction, so as to reduce the impact of the epoxy adhesive on the waffle plate and the pressing plate.

[0028] The filling pump is connected in connection with the epoxy resin container and is used to draw epoxy resin from the container and pump it into the epoxy resin hose. The filling pump includes a cavity, a first valve, a second valve, an impact plate, and a compression spring. The cavity is disposed in the connecting pipe. The first valve is disposed on the side of the cavity near the epoxy resin container, and the second valve is disposed on the side of the cavity near the epoxy resin hose. The first valve includes a first valve plate, a first valve cavity, and a first valve shaft. The upper end face of the first valve plate is connected to the first valve shaft, and the first valve shaft passes through the first valve cavity and is connected to the impact plate. The first valve cavity is disposed on the side of the cavity. On the wall, the first valve shaft is movably connected to the impact plate bracket, and the impact plate bracket is fixedly connected to the first valve hole in the first valve cavity; the second valve includes a second valve plate, a second valve cavity, and a second valve shaft, the left end face of the second valve plate is connected to the second valve shaft, the right end face of the second valve shaft is connected to the compression spring, the second valve shaft axially moves into the valve bushing and moves the second valve plate into the second valve cavity, the valve bushing is fixedly connected to the second valve hole in the second valve cavity, and the first valve hole and the second valve hole are connected to the outside; an energy storage device is also provided, and the energy storage device is disposed between the cavity and the second valve;

[0029] The filling pump is internally equipped with multi-stage plates, which are used to further eliminate air bubbles inside the epoxy resin through the impact between the epoxy resin and the multi-stage plates.

[0030] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: The corrugated structure of the epoxy adhesive tube generates multiple collisions during the flow of the epoxy adhesive, increasing liquid turbulence and effectively promoting the rise and expulsion of air bubbles, reducing air bubble residue. The corrugated design improves the flowability of the epoxy adhesive, making the adhesive flow more smoothly in the tube, reducing the risk of blockage and improving extraction efficiency. Under the influence of the corrugated structure, the contact time between the epoxy adhesive and air is increased, which helps to improve the uniformity of the material and ensure the consistency of the finished product's performance. The corrugated tube can reduce the resistance caused by excessive viscosity of the epoxy adhesive during flow, allowing the adhesive to pass through the tube more smoothly and improving work efficiency. The multiple collision process reduces the risk of gelation and maintains the effectiveness of the epoxy adhesive.

[0031] Furthermore, the epoxy hose has an internal reinforcing tube, which is sleeved inside the epoxy hose and forms an venting assembly with the sidewall of the epoxy hose. The thickness of the venting assembly is smaller where the epoxy hose has a large curvature and larger where the epoxy hose has a small curvature, which increases the curvature of the epoxy hose to increase shear force and turbulence, thereby enhancing the bursting of bubbles in the liquid. A spiral texture is formed on the inner wall of the reinforcing tube to guide the bubbles to flow along the spiral texture path so that the bubbles detach from the fluid. The venting of bubbles from the epoxy adhesive accelerates its curing speed.

[0032] The beneficial effects of the above-mentioned improvement scheme are as follows: The venting assembly allows the epoxy hose to have greater flexibility, which increases the disturbance and turbulence during the epoxy flow process, promotes the rising speed of air bubbles, and makes it easier for air bubbles to be expelled. The increased flexibility makes the flow path of the epoxy adhesive in the hose more complex, thereby improving the mixing of the flow and reducing the amount of air bubbles remaining in the adhesive. The wavy, curved structure causes the epoxy adhesive to collide multiple times in the hose, which helps air bubbles to aggregate and eventually be expelled, reducing the impact of air bubbles on the adhesive performance.

[0033] Furthermore, the pressing plate is provided with reinforcing ribs on the side near the support assembly to ensure its strength; the pressing plate is provided with a release layer on the side near the waffle plate.

[0034] The infrared component includes an infrared lamp assembly and an isolation layer. The isolation layer is fixed to the side wall of the pressing plate, and the infrared lamp assembly is fixed between the isolation layer and the inner wall of the pressing plate for rapid curing of the epoxy adhesive by means of infrared lamps.

[0035] A curing section is provided between the isolation layer and the waffle board.

[0036] The beneficial effects of adopting the above-mentioned improved scheme are as follows: Infrared lamps can significantly shorten the curing time of epoxy adhesives, enabling them to reach sufficient strength in a short time and quickly complete construction and production. The concentrated and efficient energy of the infrared lamps allows for rapid curing, reducing energy consumption. Infrared radiation can penetrate the epoxy adhesive surface uniformly, resulting in consistent curing and preventing localized over-curing or under-curing. The rapid curing process improves the adhesion between the epoxy adhesive and the substrate, enhancing the overall structural strength and durability. During the curing process, the heat radiation from the infrared lamps reduces the formation of air bubbles within the adhesive, improving the quality and appearance of the finished product.

[0037] Furthermore, a sealing strip is provided at the edge of the template frame. The sealing strip has an L-shaped structure and is used to cover the edge of the waffle board to prevent epoxy adhesive from dripping during the curing process.

[0038] A sliding rail is provided at the connection point between the template frame and the pressing plate, and scale lines are provided at the edge of the sliding rail.

[0039] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: Preventing epoxy adhesive dripping reduces subsequent repair and cleaning work, saves manpower and time, and improves overall production efficiency. Using sealing strips keeps the bonding area neat and prevents excess adhesive from flowing out, thereby improving the appearance quality of the final product. Preventing epoxy adhesive from dripping onto the ground or equipment reduces the risk of slipping or equipment damage, improving the safety of the working environment.

[0040] This invention provides a method for epoxy coating on the bottom surface of waffle boards in cleanrooms, wherein the specific steps include:

[0041] S01: Erect mobile scaffolding;

[0042] S02: Measurement and marking of bottom elevation of waffle beam;

[0043] S03: Fully enclosed site protection;

[0044] S04: Remove redundant concrete at the bottom of the waffle beam;

[0045] S05: Re-measurement of bottom elevation of waffle plate beam;

[0046] S06: Treatment of sagging stirrups;

[0047] S07: Treatment of floating dust at the bottom of waffle slab beams;

[0048] S08: Fix the template frame to the edge of the waffle board and push the pressing plate to the specified height through the support assembly;

[0049] S09: Apply a first layer of epoxy primer to the bottom of the waffle beam through the injection assembly;

[0050] S10: After the first layer is fixed, apply the second layer of epoxy primer to the bottom of the waffle beam through the injection component;

[0051] S11: After curing, the template frame is removed;

[0052] S12: Grind the bottom of the waffle board;

[0053] S13: Removal of enclosure;

[0054] S14: Dismantling of full-scale scaffolding;

[0055] S15: Ground cleaning.

[0056] Based on the above technical solution, the epoxy coating construction method for the bottom surface of waffle boards in cleanrooms according to the present invention can be further improved as follows:

[0057] Furthermore, the specific steps for applying epoxy primer to the bottom of the waffle beam include:

[0058] The first step is to push the pressing plate to the designated height and then let it stand still;

[0059] The second step is to inject epoxy primer between the waffle plate and the pressing plate through the epoxy hose.

[0060] The third step is to irradiate the epoxy primer with the infrared lamps to accelerate its curing.

[0061] Furthermore, the specific steps for measuring and marking the bottom elevation of the waffle beam include:

[0062] The first step is to use a laser rangefinder to accurately measure the height of each key point on the bottom of the waffle beam;

[0063] The second step is to draw the corresponding elevation lines on the bottom of the beam based on the measured data;

[0064] The third step is to repeatedly check and verify the elevation lines;

[0065] The specific steps for repeatedly checking and verifying the elevation line include:

[0066] The first step is to use a level to measure the height of the key points at the bottom of the beam again;

[0067] The second step is to compare the data obtained from the retest with the data from the initial measurement to analyze whether there are significant differences.

[0068] Compared with existing technologies, the beneficial effects of the epoxy construction device and method for the bottom surface of waffle boards in cleanrooms provided by this invention are as follows: It effectively solves the problems of bulging and sagging that occur during the construction of detachable waffle board bottom surfaces in cleanrooms, not only improving the flatness and aesthetics of the waffle board bottom surface but also enhancing the quality and efficiency of construction, reducing construction costs, and ensuring the smooth acceptance of the entire construction project; through precise measurement and marking, as well as the mixing and repair of epoxy mortar, it ensures that the elevation and surface quality of the waffle board beam bottom meet design requirements, improving the aesthetics and overall quality of the building; through fully enclosed enclosure and regular maintenance and inspection, it reduces the impact of construction on the surrounding environment and extends the service life of the waffle board bottom surface; by re-measuring the elevation of the waffle board beam bottom, it ensures that the height control during construction meets requirements, avoiding quality problems caused by height errors, and improving construction accuracy and reliability. Attached Figure Description

[0069] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0070] Figure 1 A cross-sectional view of an epoxy coating application device for the bottom surface of a waffle board in a cleanroom.

[0071] Figure 2 A flowchart of a method for applying epoxy coating to the bottom surface of waffle boards in a cleanroom.

[0072] The attached diagram lists the components represented by each number as follows:

[0073] 10. Template frame; 20. Press plate; 30. Support assembly; 31. Push column; 32. Push plate; 321. Top plate; 322. Bottom plate; 323. Flexible layer; 33. Cylinder; 40. Injection assembly; 41. Epoxy hose; 50. Exhaust assembly; 60. Infrared assembly; 61. Infrared lamp assembly; 62. Isolation layer. Detailed Implementation

[0074] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0075] like Figure 1The diagram shows a structural schematic of an epoxy coating application device for the bottom surface of a waffle board in a cleanroom, provided by the present invention. This structure includes a template frame 10, a pressing plate 20, a support assembly 30, an injection assembly 40, an exhaust assembly 50, and an infrared assembly 60. The template frame 10 has the same shape as the waffle board and is fixed around its perimeter. The pressing plate 20 is positioned on one side of the template frame 10, corresponding to the position of the waffle board. The template frame 10, the pressing plate 20, and the bottom surface of the waffle board form a sealed structure. A support is fixed to the bottom of the template frame 10. The support component 30 is used to push the pressing plate 20 upward so that an epoxy curing gap is formed between the pressing plate 20 and the waffle plate; both sides of the template frame 10 are provided with injection components 40, which are used to inject epoxy adhesive between the pressing plate 20 and the waffle plate; the injection component 40 is provided with an exhaust component 50, which is used to evacuate the injected epoxy adhesive to accelerate its curing speed; an infrared component 60 is provided on the side of the pressing plate 20 near the waffle plate to further reinforce the curing of the epoxy adhesive.

[0076] In the above technical solution, the support component 30 includes a push column 31, a push plate 32, and a cylinder 33. The push column 31 includes multiple push columns, one end of which is fixedly connected to the side of the pressing plate 20 away from the waffle plate, and the other end is fixedly connected to the push plate 32. The output shaft of the cylinder 33 is fixed to the side of the push plate 32 away from the push column 31, and is used to push the push plate 32 to move towards one side of the waffle plate.

[0077] The push column 31 is set with a flared structure on both sides near the pressing plate 20 and the push plate 32 to balance the force, and the cross-sectional area at its center is smaller than the cross-sectional area on both sides.

[0078] Multiple push columns 31 form a sinusoidal curve structure on the pressing plate 20.

[0079] Furthermore, in the above technical solution, the push plate 32 includes a top plate 321, a bottom plate 322, and a flexible layer 323. The top plate 321 and the flexible layer 323 are fixedly connected to the push column 31 and the output shaft of the cylinder 33, respectively. The flexible layer 323 is disposed between the top plate 321 and the bottom plate 322 to balance the force transmitted from the cylinder 33 to the bottom plate 322 on the flexible layer 323, so that the force received by the top plate 321 and transmitted to the pressing plate 20 through the push column 31 is applied evenly on the plane of the pressing plate 20.

[0080] The thickness of the base plate 322 is 1.5-2.5 times that of the top plate 321.

[0081] Furthermore, in the above technical solution, the filling component 40 includes an epoxy hose 41 and a filling pump. One end of the epoxy hose 41 is connected to the side wall of the template frame 10, and the other end extends into the bottom of the epoxy resin storage tank. The epoxy resin in the epoxy resin storage tank is gradually drawn out by the filling pump and poured into the space between the pressing plate 20 and the waffle plate.

[0082] The epoxy tube 41 has a corrugated structure, which is used to repeatedly collide the extracted epoxy adhesive to remove air bubbles.

[0083] The end of the epoxy hose 41 that is connected to the template frame 10 adopts a semi-parabolic structure, with its focal point located at the center of the pressing plate 20 and the waffle plate in the vertical direction, so as to reduce the impact of the epoxy adhesive on the waffle plate and the pressing plate 20.

[0084] The filling pump is connected in connection with the epoxy resin container and is used to draw epoxy resin from the container and pump it into the epoxy resin hose. The filling pump includes a cavity, a first valve, a second valve, an impact plate, and a compression spring. The cavity is disposed in the connecting pipe. The first valve is disposed on the side of the cavity near the epoxy resin container, and the second valve is disposed on the side of the cavity near the epoxy resin hose. The first valve includes a first valve plate, a first valve cavity, and a first valve shaft. The upper end face of the first valve plate is connected to the first valve shaft, and the first valve shaft passes through the first valve cavity and is connected to the impact plate. The first valve cavity is disposed on the side of the cavity. On the wall, the first valve shaft is movably connected to the impact plate bracket, and the impact plate bracket is fixedly connected to the first valve hole in the first valve cavity; the second valve includes a second valve plate, a second valve cavity, and a second valve shaft, the left end face of the second valve plate is connected to the second valve shaft, the right end face of the second valve shaft is connected to the compression spring, the second valve shaft axially moves into the valve bushing and moves the second valve plate into the second valve cavity, the valve bushing is fixedly connected to the second valve hole in the second valve cavity, and the first valve hole and the second valve hole are connected to the outside; an energy storage device is also provided, and the energy storage device is disposed between the cavity and the second valve;

[0085] The filling pump is internally equipped with multi-stage plates, which are used to further eliminate air bubbles inside the epoxy resin through the impact between the epoxy resin and the multi-stage plates.

[0086] Furthermore, in the above technical solution, a reinforcing tube is provided inside the epoxy hose 41. The reinforcing tube is sleeved inside the epoxy hose 41, and the side wall of the epoxy hose 41 forms an exhaust assembly 50. The thickness of the exhaust assembly 50 is smaller where the epoxy hose 41 has a large curvature and larger where the epoxy hose 41 has a small curvature. This is used to increase the curvature of the epoxy hose 41, thereby increasing shear force and turbulence, and enhancing the bursting of bubbles in the liquid. A spiral texture is provided on the inner wall of the reinforcing tube to guide the bubbles to flow along the spiral texture path so that the bubbles detach from the fluid. The expulsion of bubbles from the epoxy adhesive is used to accelerate its curing speed.

[0087] Furthermore, in the above technical solution, the pressing plate 20 is provided with reinforcing ribs on the side near the support component 30 to ensure its strength; the pressing plate 20 is provided with a release layer on the side near the waffle plate.

[0088] The infrared component 60 includes an infrared lamp assembly 61 and an isolation layer 62. The isolation layer 62 is fixed on the side wall of the pressing plate 20, and the infrared lamp assembly 61 is fixed between it and the inner wall of the pressing plate 20 for rapid curing of epoxy resin by infrared lamps.

[0089] The space between the isolation layer 62 and the waffle board is set as a curing section.

[0090] The isolation layer 62 is made of polyurethane, which has good transparency and mechanical properties and is easy to separate from the epoxy adhesive. It also has good infrared transmittance.

[0091] Furthermore, in the above technical solution, a sealing strip is provided at the edge of the template frame 10. The sealing strip has an L-shaped structure and is used to cover the edge of the waffle board to prevent epoxy adhesive from dripping during the curing process.

[0092] A sliding rail is provided at the connection between the template frame 10 and the pressing plate 20, and scale lines are provided at the edge of the sliding rail.

[0093] In use, a template frame is erected at the edge of the waffle board to be injected, isolating the waffle board at the construction site from those at other locations. The cylinder 33 is activated, causing the push plate 32 to move the push column 31 vertically. The pressing plate 20 at the top of the push column 31 slides into the template frame 10 via a sliding track. As the push plate 32 moves the push column 31 upwards, the flexible layer 323 balances the uneven force on the base plate 322, ensuring that the force transmitted upwards by the push column 31 is the same at all locations. Once the pressing plate 20 is pushed to the appropriate position, epoxy adhesive is injected between the template frame 10 and the pressing plate 20 through the epoxy adhesive tube 41. As the epoxy adhesive flows through the epoxy adhesive tube 41, it continuously impacts the wavy inner wall of the tube, causing air bubbles to be continuously expelled. The infrared lamp assembly 61 is then turned on, and the infrared light emitted by the infrared lamp assembly 61 shines through the isolation layer 62 onto the injected epoxy adhesive, causing it to cure.

[0094] like Figure 2 The diagram shows a flowchart of an epoxy coating application method for the bottom surface of a waffle board in a cleanroom, provided by this invention. The specific steps in this process include:

[0095] S01: Erect mobile scaffolding;

[0096] S02: Measurement and marking of bottom elevation of waffle beam;

[0097] S03: Fully enclosed site protection;

[0098] S04: Remove redundant concrete at the bottom of the waffle beam;

[0099] S05: Re-measurement of bottom elevation of waffle plate beam;

[0100] S06: Treatment of sagging stirrups;

[0101] S07: Treatment of floating dust at the bottom of waffle slab beams;

[0102] S08: Fix the template frame 10 to the edge of the waffle board and push the pressing plate 20 to the specified height through the support assembly 30;

[0103] S09: Apply the first layer of epoxy primer to the bottom of the waffle beam by injecting component 40;

[0104] S10: After the first layer is fixed, apply the second layer of epoxy primer to the bottom of the waffle beam by injecting component 40;

[0105] S11: Remove the template frame 10 after curing;

[0106] S12: Grind the bottom of the waffle board;

[0107] S13: Removal of enclosure;

[0108] S14: Dismantling of full-scale scaffolding;

[0109] S15: Ground cleaning.

[0110] Furthermore, in the above technical solution, the specific steps for applying epoxy primer to the bottom of the waffle beam include:

[0111] The first step is to push the pressing plate 20 to the designated height and then let it stand still;

[0112] The second step is to inject epoxy primer between the waffle plate and the press plate 20 through epoxy hose 41.

[0113] The third step is to irradiate the epoxy primer with infrared lamps 61 to accelerate its curing.

[0114] Furthermore, in the above technical solution, the specific steps for measuring and marking the bottom elevation of the waffle beam include:

[0115] The first step is to use a laser rangefinder to accurately measure the height of each key point on the bottom of the waffle beam;

[0116] The second step is to draw the corresponding elevation lines on the bottom of the beam based on the measured data;

[0117] The third step is to repeatedly check and verify the elevation lines;

[0118] The specific steps for repeatedly checking and verifying the elevation line include:

[0119] The first step is to use a level to measure the height of the key points at the bottom of the beam again;

[0120] The second step is to compare the data obtained from the retest with the data from the initial measurement to analyze whether there are significant differences.

[0121] The preparation steps for epoxy mortar are as follows:

[0122] Prepare the necessary epoxy resin, curing agent, and filler according to the construction requirements and epoxy mortar mixing ratio, and ensure that the quality of these materials meets the standard requirements;

[0123] According to the specified proportions and order, epoxy resin, curing agent and filler are put into a mixer and mixed to make epoxy mortar. Pay attention to controlling the mixing time and speed to ensure the uniformity and stability of epoxy mortar.

[0124] The specific steps for measuring and marking the bottom elevation of the S02 Huafu slab beam include:

[0125] S021: Use professional measuring tools, such as laser rangefinders or levels, to accurately measure the height of various key points at the bottom of the waffle beam. These key points are usually selected at different locations on the bottom of the beam to ensure the comprehensiveness and accuracy of the measurement data.

[0126] S022: Based on the measured data, draw the corresponding elevation lines on the bottom of the beam. These elevation lines are usually marked with a bright color so that construction workers can see and follow them clearly. At the same time, in order to ensure the accuracy of the elevation, the elevation lines need to be repeatedly checked and verified.

[0127] S023: During the process of elevation measurement and line marking, attention should also be paid to the maintenance and calibration of measuring tools to ensure their measurement accuracy and stability.

[0128] The specific method for re-measuring the bottom elevation of the Huafu slab beam in the fifth step is as follows:

[0129] S1: Using the same measuring tools as in the preliminary measurement, such as a laser rangefinder or level, measure the height of the key points at the bottom of the beam again. These key points should correspond to the points selected in the preliminary measurement to ensure the continuity and comparability of the measurements.

[0130] S2: Compare the data obtained from the remeasurement with the data from the initial measurement, and analyze whether there are significant differences. If the difference is within the allowable error range, it means that the height control during the construction process meets the requirements. If the difference exceeds the error range, it is necessary to find the cause in time and make corresponding adjustments and treatments.

[0131] S3: Record the retest results and archive them together with the preliminary measurement data for reference and comparison in subsequent construction processes.

[0132] The specific steps for re-measuring the bottom elevation of S05 waffle slab beam are as follows:

[0133] S051: Using the same measuring tools as in the preliminary measurement, such as a laser rangefinder or level, measure the height of the key points at the bottom of the beam again. These key points should correspond to the points selected in the preliminary measurement to ensure the continuity and comparability of the measurements.

[0134] S052: Compare the data obtained from the remeasurement with the data from the initial measurement, and analyze whether there are significant differences. If the difference is within the allowable error range, it means that the height control during the construction process meets the requirements. If the difference exceeds the error range, it is necessary to find the cause in time and make corresponding adjustments and treatments.

[0135] S053: Record the retest results and archive them together with the preliminary measurement data for reference and comparison in subsequent construction processes.

[0136] Specifically, the principle of this invention is as follows: First, by erecting mobile scaffolding and implementing full on-site enclosure, the safety and environmental friendliness of the construction process are ensured. Then, by accurately measuring and marking the elevation of the bottom of the waffle slab beams, and by removing excess concrete and treating the sagging stirrups at the bottom of the beams, the problems of formwork bulging and sagging are solved, improving the flatness and aesthetics of the waffle slab bottom surface. Next, construction equipment is used to perform point-by-point construction on the waffle slab surface, ensuring the epoxy adhesive is laid smoothly. In this entire working principle, each link is interconnected and coordinated, forming a complete construction system. Through precise measurement and re-measurement, the height control during construction is ensured to meet the requirements. By removing excess concrete and treating the sagging stirrups at the bottom of the beams, the problems of formwork bulging and sagging are solved. Through formwork removal, defect repair, and grinding, the flatness and aesthetics of the waffle slab bottom surface are improved. These improvements not only enhance the quality and efficiency of construction but also reduce construction costs and ensure the smooth acceptance of the entire construction project.

[0137] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A device for applying epoxy coating to the bottom surface of waffle boards in a cleanroom, characterized in that, The system includes a template frame (10), a pressing plate (20), a support assembly (30), an injection assembly (40), an exhaust assembly (50), and an infrared assembly (60). The template frame (10) has the same shape as the waffle board and is fixed around the waffle board. The pressing plate (20) is located on one side of the template frame (10) and is positioned corresponding to the waffle board. The template frame (10), the pressing plate (20), and the bottom surface of the waffle board form a sealed structure. The support assembly (30) is fixed to the bottom of the template frame (10) and is used to push the pressing plate upward. The plate (20) is used to form an epoxy curing gap between the pressing plate (20) and the waffle plate; the template frame (10) is provided with the injection assembly (40) on both the left and right sides, the injection assembly (40) is used to inject epoxy glue into the space between the pressing plate (20) and the waffle plate; the injection assembly (40) is provided with the venting assembly (50), the venting assembly (50) is used to evacuate the injected epoxy glue to accelerate its curing speed; the pressing plate (20) is provided with the infrared assembly (60) on the side near the waffle plate, which is used to further reinforce the curing of the epoxy glue; The support assembly (30) includes a push column (31), a push plate (32), and a cylinder (33). The push column (31) includes multiple push columns, one end of which is fixedly connected to the side of the pressing plate (20) away from the waffle plate, and the other end is fixedly connected to the push plate (32). The output shaft of the cylinder (33) is fixed to the side of the push plate (32) away from the push column (31) and is used to push the push plate (32) to move towards one side of the waffle plate. The push column (31) is configured with a horn-shaped structure on both sides near the pressing plate (20) and the push plate (32) to balance the force, and the cross-sectional area at its center is smaller than the cross-sectional area on both sides. The plurality of push columns (31) are arranged in a sinusoidal curve structure on the pressing plate (20); The filling assembly (40) includes an epoxy hose (41) and a filling pump. One end of the epoxy hose (41) is connected to the side wall of the template frame (10), and the other end extends into the bottom of the epoxy resin storage tank. The filling pump gradually draws epoxy resin from the epoxy resin storage tank and fills it between the pressing plate (20) and the waffle plate. The epoxy tube (41) has a corrugated structure, which is used to repeatedly collide the extracted epoxy adhesive to remove air bubbles. The end of the epoxy tube (41) that is connected to the template frame (10) adopts a semi-parabolic structure, and its focal point is located at the center of the pressing plate (20) and the waffle plate in the vertical direction, so as to reduce the impact of the epoxy adhesive on the waffle plate and the pressing plate (20). The filling pump is connected in connection with the epoxy resin container and is used to draw epoxy resin from the container and pump it into the epoxy resin hose. The filling pump includes a cavity, a first valve, a second valve, an impact plate, and a compression spring. The cavity is disposed in the connecting pipe. The first valve is disposed on the side of the cavity near the epoxy resin container, and the second valve is disposed on the side of the cavity near the epoxy resin hose. The first valve includes a first valve plate, a first valve cavity, and a first valve shaft. The upper end face of the first valve plate is connected to the first valve shaft, and the first valve shaft passes through the first valve cavity and is connected to the impact plate. The first valve cavity is disposed on the side of the cavity. On the wall, the first valve shaft is movably connected to the impact plate bracket, and the impact plate bracket is fixedly connected to the first valve hole in the first valve cavity; the second valve includes a second valve plate, a second valve cavity, and a second valve shaft, the left end face of the second valve plate is connected to the second valve shaft, the right end face of the second valve shaft is connected to the compression spring, the second valve shaft axially moves into the valve bushing and moves the second valve plate into the second valve cavity, the valve bushing is fixedly connected to the second valve hole in the second valve cavity, and the first valve hole and the second valve hole are connected to the outside; an energy storage device is also provided, and the energy storage device is disposed between the cavity and the second valve; The filling pump is internally equipped with multi-stage plates, which are used to further eliminate air bubbles inside the epoxy resin through the impact between the epoxy resin and the multi-stage plates.

2. The epoxy coating application device for the bottom surface of a cleanroom waffle board according to claim 1, characterized in that, The push plate (32) includes a top plate (321), a bottom plate (322), and a flexible layer (323). The top plate (321) and the flexible layer (323) are fixedly connected to the push column (31) and the output shaft of the cylinder (33), respectively. The flexible layer (323) is disposed between the top plate (321) and the bottom plate (322) to balance the force transmitted from the cylinder (33) to the bottom plate (322) on the flexible layer (323), so that the force received by the top plate (321) and transmitted to the pressing plate (20) through the push column (31) is applied evenly on the plane of the pressing plate (20). The thickness of the bottom plate (322) is 1.5-2.5 times the thickness of the top plate (321).

3. The epoxy coating application device for the bottom surface of a cleanroom waffle board according to claim 2, characterized in that, The epoxy hose (41) has a reinforcing tube inside, which is sleeved inside the epoxy hose (41). The reinforcing tube and the side wall of the epoxy hose (41) form an exhaust assembly (50). The thickness of the exhaust assembly (50) is smaller at the location of the large curvature of the epoxy hose (41) and larger at the location of the small curvature of the epoxy hose (41). This is used to increase the curvature of the epoxy hose (41) to increase shear force and turbulence, and enhance the bursting of bubbles in the liquid. A spiral texture is provided on the inner wall of the reinforcing tube to guide the bubbles to flow along the spiral texture path so that the bubbles detach from the fluid. The expulsion of bubbles from the epoxy adhesive is used to accelerate its curing speed.

4. The epoxy coating application device for the bottom surface of a cleanroom waffle board according to claim 3, characterized in that, The pressing plate (20) is provided with reinforcing ribs on the side near the support assembly (30) to ensure its strength; the pressing plate (20) is provided with a release layer on the side near the waffle plate; The infrared component (60) includes an infrared lamp assembly (61) and an isolation layer (62). The isolation layer (62) is fixed on the side wall of the pressing plate (20), and the infrared lamp assembly (61) is fixed between it and the inner wall of the pressing plate (20) for rapid curing of the epoxy adhesive by infrared lamps. The insulating layer (62) and the waffle board are provided with a curing section.

5. The cleanroom waffle board bottom epoxy construction device according to claim 4, characterized in that, A sealing strip is provided at the edge of the template frame (10). The sealing strip has an L-shaped structure and is used to cover the edge of the waffle board to prevent epoxy adhesive from dripping during the curing process. A sliding rail is provided at the position where the template frame (10) connects to the pressing plate (20), and scale lines are provided at the edge of the sliding rail.

6. A method for applying epoxy coating to the bottom surface of a cleanroom waffle board based on the cleanroom waffle board bottom epoxy application device described in claims 1-5, characterized in that, The specific steps include: S01: Erect mobile scaffolding; S02: Measurement and marking of bottom elevation of waffle beam; S03: Fully enclosed site protection; S04: Remove redundant concrete at the bottom of the waffle beam; S05: Re-measurement of bottom elevation of waffle plate beam; S06: Treatment of sagging stirrups; S07: Treatment of floating dust at the bottom of waffle slab beams; S08: Fix the template frame (10) at the edge of the waffle board, and push the pressing plate (20) to the specified height through the support assembly (30); S09: Apply a first layer of epoxy primer to the bottom of the waffle beam through the injection assembly (40); S10: After the first layer is fixed, apply the second layer of epoxy primer to the bottom of the waffle beam through the injection component (40); S11: After curing, the template frame (10) is removed; S12: Grind the bottom of the waffle board; S13: Removal of enclosure; S14: Dismantling of full-scale scaffolding; S15: Ground cleaning.

7. The method for epoxy coating on the bottom surface of a cleanroom waffle board according to claim 6, characterized in that, The specific steps for applying epoxy primer to the bottom of waffle beams include: The first step is to push the pressing plate (20) to the specified height and then let it stand still; The second step is to inject epoxy primer between the waffle plate and the pressing plate (20) through the epoxy tube (41); The third step is to irradiate the epoxy primer with the infrared lamp group (61) to accelerate its curing.

8. A method for epoxy coating on the bottom surface of a cleanroom waffle board according to claim 7, characterized in that, The specific steps for measuring and marking the bottom elevation of the waffle beam include: The first step is to use a laser rangefinder to accurately measure the height of each key point on the bottom of the waffle beam; The second step is to draw the corresponding elevation lines on the bottom of the beam based on the measured data; The third step is to repeatedly check and verify the elevation lines; The specific steps for repeatedly checking and verifying the elevation line include: The first step is to use a level to measure the height of the key points at the bottom of the beam again; The second step is to compare the data obtained from the retest with the data from the initial measurement to analyze whether there are significant differences.

Images