Method for manufacturing strain gauge sensor by hot melting and strain gauge sensor

Abstract

The present invention is applicable to the field of sensor manufacturing technology, and provides a method for hot-melt manufacturing of strain gauge sensors and strain gauge sensors. The method includes selecting the number of strain gauges that is not less than the number of patch walls according to the number of patch walls on the carrier where strain gauges need to be attached; selecting the number of fixing glues that is not less than the number of strain gauges according to the number of strain gauges, and each fixing glue has a different melting point; heating to melt the fixing glue, and the strain gauge is attached to the carrier through the melted fixing glue after cooling. In an embodiment of the invention, the heating temperature is set in the order of the melting points of each fixing glue from high to low, and the strain gauge is first fixed by melting the fixing glue with a high melting point, and then melting the fixing glue with a low melting point. When the fixing glue with a low melting point is heated, the fixing glue with a high melting point will not melt, which better avoids affecting the position of the strain gauges that have been attached. The position of each strain gauge is accurate and will not be offset, thereby improving the quality of the product.

Description

Technical Field

[0001] The invention belongs to the technical field of sensor manufacturing, and in particular relates to a method for hot-melt manufacturing of a strain gauge sensor and the strain gauge sensor. Background Art

[0002] Strain gauge sensors use strain gauges to detect changes in factors such as force, light, and temperature in the operating environment, which can cause changes in their own resistance, capacitance, etc., and then generate corresponding electrical signals, thereby achieving the measurement of the value of the changing factor.

[0003] In the specific setting, the strain gauge is usually pasted on the detection beam to achieve installation. The strain gauge can convert the strain on the detection beam into an electrical signal output. By measuring the change in its resistance, the actual strain value of the detection beam can be calculated. The cross-section of the detection beam is a rectangle, including four walls: upper, lower, left, and right. The upper wall is opposite to the lower wall, and the left wall is opposite to the right wall. In order to achieve multi-directional detection, strain gauges are pasted on the upper, lower, left, and right surfaces of the detection beam, so that detection can be performed through strain gauges in different directions to improve the sensitivity and accuracy of detection. When the strain gauge is pasted on each wall of the detection beam, the fixing glue set on the detection beam is melted, and then the strain gauge is placed in the melted fixing glue. The strain gauge on the fixing glue sinks due to its own gravity, and the strain gauge is fixed after the fixing glue solidifies.

[0004] In the related art, when the strain gauges are pasted to each wall surface, the fixing glue on each wall surface is melted at the same time, and then the strain gauges are placed in respectively. However, due to the different positions of the upper, lower, left and right walls, the strain gauges at the lower, left and right walls are affected by gravity, and the fixed positions will be offset, affecting the quality of the product. Summary of the invention

[0005] In view of this, the present invention provides a method for hot-melt manufacturing a strain gauge sensor and a strain gauge sensor, so as to solve the problem that the strain gauge pasting position is offset and affects the product quality.

[0006] To solve the above problems, the technical solution of the present invention is achieved as follows:

[0007] A method for manufacturing a strain gauge sensor by hot melting, for attaching the strain gauge to a carrier, the method comprising the following steps:

[0008] 1) According to the number of patch walls on the carrier where strain gauges need to be attached, select a number of strain gauges that is not less than the number of patch walls, and the number of patch walls is not less than two;

[0009] 2) Selecting the number of fixing glues according to the number of the strain gauges, the number of the fixing glues is not less than the number of the strain gauges, and the melting points of the fixing glues are different;

[0010] 3) heating to melt the fixing glue, so that the strain gauge is adhered to the carrier through the melted fixing glue after cooling;

[0011] The heating temperature is set in descending order according to the melting points of the fixing glues.

[0012] In some embodiments, according to the number of patch walls, fixing glue is selected in descending order of melting point, and the fixing glue currently used is heated and melted to fix the strain gauge on each surface.

[0013] In some embodiments, at least after the strain gauge is placed in the melted fixing glue, the wall surface to which it is currently attached is placed horizontally upward.

[0014] In some embodiments, before the strain gauge is attached to the carrier, the carrier is heated to a temperature at which the currently selected fixing glue can melt, and the fixing glue is placed on the wall surface to be attached and melted.

[0015] In some embodiments, a strain gauge is placed into the currently melted fixing glue, and the strain gauge is sunk into the glue. After the fixing glue is cooled, the strain gauge is fixed, and the pasting of the strain gauge on the current wall is completed.

[0016] In some embodiments, the currently melted fixing glue is cooled and adhered to the current wall surface, thereby completing the pre-setting of the fixing glue on the current wall surface; wherein, according to the number of patch walls, the fixing glue is selected in descending order of melting point, and the pre-setting of the fixing glue on each wall surface is completed one by one, and the types of fixing glue on each wall surface are different.

[0017] In some embodiments, according to the number of patch walls, each wall is pre-installed with fixing glue; the fixing glue is heated and melted in order from high to low melting points, and a strain gauge is placed in the currently melted fixing glue, and the strain gauge is fixed after the fixing glue cools down.

[0018] In some embodiments, before the strain gauge is pasted on the carrier, a corresponding number of strain gauges are fixed one by one in different types of fixing glue according to the number of the patch walls, and then the carrier is heated to a temperature at which the currently selected fixing glue can melt. The fixing glue with the strain gauge pre-fixed is placed on the wall surface to be patched and melted. After the fixing glue cools down, the strain gauge on the current wall surface is pasted.

[0019] In some embodiments, before the patch is applied, at least the wall surface to be patched is treated to increase the surface roughness.

[0020] An embodiment of the present invention also provides a strain gauge sensor, which is prepared by the method for hot-melt manufacturing of a strain gauge sensor described in any of the above embodiments. The strain gauge sensor includes a carrier, and the carrier has no less than two wall surfaces, and at least one strain gauge is adhered to each wall surface by fixing glue.

[0021] A method for manufacturing a strain gauge sensor by hot-melt and a strain gauge sensor provided in an embodiment of the present invention include selecting the number of strain gauges not less than the number of the patch walls according to the number of patch walls on the carrier where the strain gauges need to be attached, and the number of patch walls is not less than two. Then, according to the number of strain gauges, the number of types of fixing glue is selected, the number of types of fixing glue is not less than the number of strain gauges, and the melting points of the fixing glues are different. Then, the fixing glue is heated to melt so that the strain gauge is attached to the carrier through the melted fixing glue after cooling. In an embodiment of the invention, the heating temperature is set in the order of the melting points of the fixing glues from high to low. In this way, the strain gauge is fixed by melting the fixing glue with a high melting point first, and then the fixing glue with a low melting point is melted, and when the fixing glue with a low melting point is heated, the fixing glue with a high melting point will not be melted. According to this heating sequence, the position of the strain gauge that has been attached is better avoided, so that the position of each wall surface can be kept accurate after the strain gauge is attached, thereby improving the product quality and detection accuracy of the strain gauge sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic flow chart of a method for manufacturing a strain gauge sensor by hot melting provided in an embodiment of the present invention;

[0023] Figure 2 It is a schematic diagram of the structure of a strain gauge sensor provided in an embodiment of the present invention.

[0024] Description of reference numerals:

[0025] 1. Strain gauge sensor; 11. Carrying part; 12. Strain gauge; 13. Fixing glue. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0027] The various specific technical features described in the specific embodiments can be combined in any suitable manner without contradiction, for example, different embodiments and technical solutions can be formed by combining different specific technical features. In order to avoid unnecessary repetition, various possible combinations of the specific technical features in the present invention will not be described separately.

[0028] In the following description, the terms "first\second\..." are only used to distinguish different objects, and do not mean that the objects have the same or related points. It should be understood that the directions "above", "below", "outside" and "inside" are all directions in normal use, and the directions "left" and "right" refer to the left and right directions shown in the specific corresponding schematic diagrams, which may be the left and right directions in normal use or not.

[0029] It should be noted that the terms "comprises", "includes" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element. "Multiple" means greater than or equal to two.

[0030] A method for hot-melt manufacturing of a strain gauge sensor provided in an embodiment of the present invention is used to attach the strain gauge to a carrier. The carrier is mainly used to support the strain gauge so that the strain gauge has a stable detection position so as to be able to reliably and accurately detect changes in corresponding detection factors (such as pressure, temperature or humidity, etc.). Specifically, when the strain gauge is used to detect the pressure on the carrier, the carrier will be deformed by the external force, and the strain gauge attached to the carrier will also be deformed accordingly. During the deformation process, the resistance of the strain gauge will change with the increase of strain. By measuring the change in its resistance, the actual strain value can be inferred. The carrier can also be called a detection beam or an elastic beam, etc. The specific setting method and structural principle are basically the same as the existing ones, and will not be repeated here. In the embodiment of the present invention, the carrier is used as an example, and it does not limit the objects to which the strain gauge can be attached.

[0031] like Figure 1 As shown, in an embodiment of the present invention, the method steps include: firstly selecting the number of strain gauges required according to the number of patch walls on the carrier where strain gauges need to be attached, and the number of strain gauges selected is not less than the number of patch walls, so as to ensure that when the strain gauges are lost or damaged, there are still enough strain gauges to replace them to meet the current patch needs. When selecting the carrier, it is necessary to make the carrier have at least two patch walls.

[0032] The number of fixing glues is then selected according to the number of selected strain gauges, and the number of fixing glues is not less than the number of strain gauges. That is, at least one fixing glue is set for each strain gauge to ensure that different types of fixing glues are used to fix the strain gauges on different wall surfaces. Moreover, the different types of fixing glues must have different melting points.

[0033] After selecting the number of required fixing glues according to the number of patch walls and the number of strain gauges, and ensuring that the melting points of the fixing glues used for each strain gauge to be pasted on different wall surfaces are different, the currently selected fixing glue is heated to melt, so that the strain gauge is pasted to the carrier after cooling through the melted fixing glue, and the pasting of the current strain gauge is completed. The remaining strain gauges are pasted in the same way. Specifically, in an embodiment of the present invention, heating to melt each fixing glue is to set the heating temperature in the order of the melting points of each fixing glue from high to low. That is, when pasting the first strain gauge, the fixing glue with the highest melting point is used first, and the heating temperature is not lower than the melting point of the fixing glue, so that the fixing glue can be melted and pasted. When pasting the second strain gauge, the melting point of the fixing glue used is lower than the fixing glue used for the first strain gauge, but higher than the melting point of the fixing glue used for the third strain gauge. In this way, according to this selection method, the strain gauges are pasted to different wall surfaces one by one until at least one strain gauge is pasted on all the wall surfaces where the patches are required.

[0034] Specifically, when the strain gauges are pasted on different wall surfaces, fixing glues with different melting points are used and heated in order from high to low melting points. At the same time, the heating temperature is set according to the melting point of the fixing glue that needs to be melted at present, so that when the fixing glue is heated and melted, even if the strain gauges that have been pasted are heated together, because the current heating temperature cannot cause the pasted fixing glue to melt, when the next strain gauge is heated and pasted, it will not affect the position of the pasted strain gauge, so that during the operation process of pasting the strain gauges on each wall, the positions of the pasted strain gauges can be kept stable and accurate, and will not affect each other and cause the position of the strain gauges to shift, thereby improving the quality of the product.

[0035] A method for manufacturing a strain gauge sensor by hot melt provided in an embodiment of the present invention includes selecting the number of strain gauges not less than the number of patch walls according to the number of patch walls on which strain gauges need to be attached on a carrier, and the number of patch walls on the carrier is not less than two. Then, according to the number of strain gauges, the number of types of fixing glue is selected, the number of types of fixing glue is not less than the number of strain gauges, and the melting points of the selected fixing glues are set to be different. Then, the fixing glue is heated to melt so that the strain gauge is attached to the carrier through the melted fixing glue after cooling. In an embodiment of the invention, the heating temperature is set in the order of the melting points of each fixing glue from high to low, the fixing glue with the highest melting point is melted first, and then the heating temperature is reduced to melt the fixing glue with a lower melting point than the previous one. In this way, the strain gauge is fixed by melting the fixing glue with a high melting point first, and then the fixing glue with a low melting point is melted, so that when the fixing glue with a low melting point is heated, the fixing glue with a high melting point will not be melted. According to this heating sequence, it is better to avoid the melting of all the fixing glues due to temperature problems, which will cause the position of the strain gauges that have been pasted to shift. Under this preparation method, when the strain gauges are pasted to each wall surface, they will not affect each other during the pasting process and cause the position to shift. The position of the pasted strain gauges can be kept accurate, and the pressure changes on the bearing parts can be accurately detected reliably, thereby improving the quality of the product.

[0036] In some embodiments, when selecting a bearing member on which a strain gauge is to be attached, it is necessary to ensure that the number of walls of the bearing member is at least greater than or equal to two. In addition, the number of walls of the bearing member as a whole should be greater than or equal to the number of walls on which the strain gauge is to be attached. In this way, it is ensured that the selected strain gauges can be attached to different walls.

[0037] In some embodiments, the selected strain gauges are respectively pasted on different wall surfaces, that is, the number of strain gauges corresponds to the number of wall surfaces to be pasted, so that each different wall surface is pasted with a strain gauge. In other embodiments, under the premise of meeting the detection requirements, at least one strain gauge can be pasted on a wall surface, just like two or three equal number of strain gauges are pasted on a wall surface. At this time, when the strain gauges are pasted on the same wall surface, the strain gauges can be pasted separately or simultaneously using a fixing glue with the same melting point. It is also possible to paste each strain gauge with a fixing glue with different melting points. In this way, they are also hot-melted in the order of melting point from high to low, and then pasted separately one by one.

[0038] Specifically, before patching, it is necessary to ensure that the number of patch walls is greater than the number of strain gauges, and the number of fixing glues is greater than the number of strain gauges. In this way, each strain gauge has at least one fixing glue for use, and at least one different wall is maintained for the sticking of the strain gauge.

[0039] In some embodiments, according to the number of patch walls, the fixing glue is selected in the order of melting point from high to low, and the fixing glue currently used is heated and melted to paste the fixed strain gauges one by one. That is, the number of fixing glues required to be used is determined according to the number of patch walls to which the strain gauges need to be pasted, and then the fixing glue with the highest melting point is first used to paste the first fixed sheet, and the fixing glue with the lowest melting point is used to paste the last strain gauge, and each wall is separately pasted. In this way, each heating is only used to paste one strain gauge, and because of the difference in melting points, when a fixing glue with a low melting point melts after heating, even if the previous fixing glue that has been pasted is also heated at the same time, it will not melt because the heating temperature is not satisfied. Therefore, under this preparation method, because fixing glues with different melting points are used respectively, and they are heated one by one in the order of heating from high melting point to low melting point, each strain gauge will not affect the previous one when it is pasted by hot-melt fixing glue, which better ensures that the pasting position of each strain gauge can be kept accurate.

[0040] In some embodiments, at least after the strain gauge is placed in the melted fixing glue, the wall surface to which it is currently attached is placed horizontally upward. Specifically, after the fixing glue is melted, the fixing glue is in a flowable glue state. When the strain gauge is placed in the glue, the strain gauge sinks to a set position in the glue due to the effect of gravity. Therefore, at least after the strain gauge is placed in the glue, the wall surface to which it is previously attached needs to be kept horizontally upward to ensure that the strain gauge can effectively sink under the effect of gravity, and the fixed position can meet the design requirements to ensure the reliability of the detection performance. Avoid the problem that the fixed position of the strain gauge is offset due to the current wall surface being in a non-horizontal state, thereby affecting the performance of the product. If the current wall surface is facing downward, the strain gauge will float up due to the effect of gravity, and the distance from the wall surface will be far, affecting the detection performance.

[0041] In some embodiments, the strain gauge can be attached to the carrier by heating the carrier to a temperature at which the currently selected fixing glue can melt before the strain gauge is attached to the carrier, and placing the fixing glue on the wall surface where the gauge is to be attached and melting it. That is, the wall surface where the strain gauge is to be attached is first heated, and the temperature reached by heating is basically the same as the melting point temperature of the currently selected fixing glue (which may be slightly higher than the melting point temperature of the current fixing glue), and then the selected fixing glue is placed on the corresponding wall surface, and the fixing glue is melted by the heat and adheres to the wall surface. At this point, the preparation of the melt glue before attaching the gauge on the wall surface is completed.

[0042] In some embodiments, after the preparation of the melt adhesive is completed, the fixing adhesive is in a molten state, and the strain gauge can be placed in the currently melted fixing adhesive, and the wall surface currently attached is kept horizontally facing upward, so that the strain gauge sinks into the adhesive due to gravity, and the fixing adhesive is cooled and fixed in the fixing adhesive. Thus, the attachment of the strain gauge on the current wall surface is completed.

[0043] According to the number of patch walls required for patching, the patching operation can be completed on all patch walls by performing separate operations on each wall according to the above preparation method.

[0044] In another possible embodiment, after the fixing glue is hot-melt-adhered to the currently selected wall surface, the currently melted fixing glue is first cooled so that the fixing glue is solidified and adhered to the current wall surface, thereby completing the pre-setting of the fixing glue on the current wall surface. Furthermore, according to the number of patch walls, the fixing glue is selected in order of melting point from high to low, and then the pre-setting of the fixing glue on each wall surface is completed one by one, and the types of fixing glue adhered to each wall surface are different. That is, before placing the strain gauge on the fixing glue, the fixing glue is pre-set on each wall surface. Moreover, at least the types of fixing glue on different wall surfaces are different, so that the melting points can also be kept different.

[0045] In some embodiments, when selecting a preparation method of pre-setting a fixing glue on each wall surface, according to the number of patch walls, a fixing glue is pre-set on each wall surface, and then the fixing glue is heated and melted in order from high to low melting points, and a strain gauge is placed in the currently melted fixing glue, and the fixing glue is cooled and the strain gauge is fixed. That is, a fixing glue is pre-set on each wall surface, and when patching, it is first heated to the temperature with the highest melting point among the fixing glues, and then the strain gauge is placed in the fixing glue with the highest melting point, and after the fixing glue is cooled, the inserted strain gauge will be fixed. In this way, the operation is performed in order from high to low melting points to complete the pasting of the remaining strain gauges. It can be understood that under this operation mode, when heating the fixing glue with a high melting point, the fixing glue with a low melting point will cause the fixing glue with a low melting point to melt, and since the strain gauge is placed in the fixing glue with a high melting point first, even if the fixing glue with a low melting point is melted, since no strain gauge is placed in the fixing glue with a low melting point, the problem of the position of the strain gauge being offset will not occur. In this preparation method, the fixing glue is pre-adhered to each wall surface, so the reliability of the fixing glue adhesion and the accuracy of the set position can be determined in advance, and then the strain gauge is placed accordingly, so that the position of the strain gauge can be kept accurate, which is beneficial to improving the quality of the product. In addition, the low-melting point fixing glue is repeatedly melted, which is beneficial to the loss of internal bubbles, and improves the accuracy of the strain gauge being able to sink to the set depth after the strain gauge is placed.

[0046] In another possible embodiment, before the strain gauge is pasted on the carrier, the corresponding number of strain gauges are fixed one by one in different types of fixing glue according to the number of patch walls, and then the carrier is heated to the temperature at which the currently selected fixing glue can melt, and the fixing glue with the strain gauge pre-fixed is placed on the wall surface to be patched and melted, and the fixing glue is cooled to complete the pasting of the strain gauge on the current wall surface. That is, the fixing glue is first melted, the strain gauge is pre-fixed in the fixing glue, and then the fixing glue with the strain gauge inside is hot-melted and adhered to the wall surface to be patched, and the fixing glue is cooled again to achieve the pasting of the strain gauge. In this preparation method, the strain gauge can be pre-fixed in different types of fixing glue, and then the corresponding fixing glue is selected for hot-melt pasting according to the different melting points, which is convenient for preparation. Moreover, at this time, the carrier only needs to be heated to the temperature required for the fixing glue with the highest melting point to melt. In the subsequent cooling process, the corresponding fixing glue can be placed accordingly according to the temperature change, which is conducive to improving the efficiency of the overall preparation.

[0047] In some embodiments, before the patch is applied, at least the wall surface to be patched is treated to increase the surface roughness. In this way, by increasing the surface roughness of the wall surface to be patched, when the fixing glue is applied to this position, the bonding force between the two can be improved, thereby improving the firmness of the strain gauge installation. The surface roughness increase treatment can be achieved by providing a pit so that part of the fixing glue is embedded in the pit. It can also be achieved by providing a large number of fine bumps or pits on the wall surface, which can also increase the bonding force with the fixing glue.

[0048] In order to better understand the implementation of the present invention, Figure 2 As shown, the preparation method steps are illustrated by taking the cross-section of the carrier as a rectangle with relative upper and lower walls and relative left and right walls. This preparation method is not limited to carriers with rectangular cross-sections, but can also be applied to carriers of other shapes.

[0049] Specifically, strain gauges are respectively pasted on the four walls of the bearing component, and four fixing glues with different melting points are used, and they are respectively the first fixing glue, the second fixing glue, the third fixing glue and the fourth fixing glue in order from high to low melting points. The melting point of the first fixing glue can be 500℃~600℃, the melting point of the second fixing glue can be 400℃~500℃, the melting point of the third fixing glue can be 300℃~400℃, and the melting point of the fourth fixing glue can be 200℃~300℃. The preparation method is:

[0050] 1) Use the first fixing glue with the highest melting point, and place the wall surface to be pasted horizontally. Heat up until the first fixing glue melts. The strain gauge on the first fixing glue will sink due to its own gravity and sink into the melted first fixing glue to a set depth, so that the temperature drops. Wait until the first fixing glue cools and solidifies, and the pasting of the strain gauge on this wall is completed;

[0051] 2) Use the second fixing glue with the second highest melting point, and place the wall surface to be patched horizontally. Heat up until the second fixing glue melts. The strain gauge on the second fixing glue will sink due to its own gravity and sink into the melted second fixing glue to the set depth. At this time, because the melting point of the second fixing glue is lower than that of the first fixing glue, it will not affect the strain gauge on the first fixing glue.

[0052] 3) Use a third fixing glue with the third highest melting point, and place the wall surface to be patched horizontally. Heat the third fixing glue until it melts. The strain gauge on the third fixing glue will sink due to its own gravity and sink into the melted third fixing glue to a set depth. At this time, because the melting point of the third fixing glue is lower than that of the first fixing glue and the second fixing glue, it will not affect the strain gauges on the first fixing glue and the second fixing glue.

[0053] 4) Use the fourth fixing glue with the lowest melting point, and place the wall surface to be patched horizontally. Heat up until the fourth fixing glue melts. The strain gauge on the fourth fixing glue will sink due to its own gravity and sink into the melted fourth fixing glue to the set depth. At this time, because the melting point of the fourth fixing glue is lower than that of the first fixing glue, the second fixing glue and the third fixing glue, it will not affect the strain gauges on the first fixing glue, the second fixing glue and the third fixing glue.

[0054] Thus, according to the above operation steps, the strain gauge can be pasted on the carrier with four walls. It can be understood that when pasting the strain gauge on the carrier with more walls, it can be done by adding fixing glue with different melting points and operation steps, which will not be described in detail here.

[0055] In the embodiment of the present invention, by using fixing glues with different melting points, and then hot-melting the corresponding fixing glues separately in order of melting points from high to low, the influence of the previous fixing glue during the hot-melting process can be avoided, so that the position of each strain gauge after pasting will not be offset, thereby improving the quality of the product.

[0056] like Figure 2As shown, a strain gauge sensor 1 is also provided in an embodiment of the present invention, which is prepared by the method for manufacturing a strain gauge sensor by hot melting described in any of the above embodiments. Specifically, the strain gauge sensor 1 includes a carrier 11, and the carrier 11 has no less than two wall surfaces. If there are two wall surfaces, the two wall surfaces can be kept relative to each other or adjacent to each other. At least one strain gauge 12 is pasted on each wall surface by a fixing glue 13, that is, one strain gauge 12 can be pasted on the same wall surface, or multiple strain gauges 12 can be pasted, and multiple strain gauges 12 can be detected together or combined in a designed manner. In this way, strain gauges 12 are respectively pasted on different wall surfaces, so that detection can be performed in multiple directions. The strain gauge sensor 1 is prepared by adopting the above method, so that the pasted strain gauge 12 can be kept in an accurate position, and combined with the joint detection in multiple directions, so that the detection performance is highly sensitive, so that the strain gauge sensor 1 has good detection performance and accuracy of the detection results, and the product quality is high.

[0057] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a strain gauge sensor by hot melting, for attaching a strain gauge to a carrier, characterized in that: The method comprises the following steps: 1) According to the number of patch walls on the carrier where strain gauges need to be attached, select a number of strain gauges that is not less than the number of patch walls, and the number of patch walls is not less than two; 2) Selecting the number of fixing glues according to the number of the strain gauges, the number of the fixing glues is not less than the number of the strain gauges, and the melting points of the fixing glues are different; 3) heating to melt the fixing glue, so that the strain gauge is adhered to the carrier through the melted fixing glue after cooling; The heating temperature is set in descending order according to the melting points of the fixing glues, and the fixing glue with the highest melting point corresponding to the strain gauge to be pasted is used first; when the strain gauge is pasted on different patch walls of the carrier, the melting points of the fixing glues used are different; the melting points of the fixing glues used to paste the strain gauges on the same wall are the same; when the fixing glue melts and pastes the corresponding strain gauge to the carrier, the corresponding fixing glue is hot-melted separately.

2. The method for manufacturing a strain gauge sensor by hot melting according to claim 1, characterized in that: According to the number of patch walls, the fixing glue is selected in descending order of melting point, and the fixing glue currently used is heated and melted to fix the strain gauge on each surface.

3. The method for manufacturing a strain gauge sensor by hot melt according to claim 1, characterized in that: At least after the strain gauge has been placed in the melted fixing glue, the wall to which it is currently attached should be placed horizontally facing upwards.

4. The method for manufacturing a strain gauge sensor by hot melt according to claim 1, characterized in that: Before the strain gauge is pasted on the carrier, the carrier is heated to a temperature at which the currently selected fixing glue can melt, and the fixing glue is placed on the wall surface to be pasted and melted.

5. The method for manufacturing a strain gauge sensor by hot melting as claimed in claim 4, characterized in that: Put the strain gauge into the currently melted fixing glue, let the strain gauge sink into it, wait for the fixing glue to cool down, and fix the strain gauge, thus completing the pasting of the strain gauge on the current wall surface.

6. The method for manufacturing a strain gauge sensor by hot melting as claimed in claim 4, characterized in that: The currently melted fixing glue is cooled and adhered to the current wall surface, thereby completing the pre-setting of the fixing glue on the current wall surface; wherein, according to the number of patch walls, the fixing glue is selected in descending order of melting point, and the pre-setting of the fixing glue on each wall surface is completed one by one, and the types of the fixing glue on each wall surface are different.

7. The method for manufacturing a strain gauge sensor by hot melting as claimed in claim 6, characterized in that: According to the number of patch walls, each wall is pre-set with fixing glue; the fixing glue is heated and melted in order from high to low melting points, and a strain gauge is placed in the currently melted fixing glue, and the strain gauge is fixed after the fixing glue is cooled.

8. The method for manufacturing a strain gauge sensor by hot melting as claimed in claim 1, characterized in that: Before the strain gauge is pasted on the carrier, a corresponding number of strain gauges are fixed one by one in different types of fixing glue according to the number of the patch walls, and then the carrier is heated to a temperature at which the currently selected fixing glue can melt, and the fixing glue with the strain gauge pre-fixed is placed on the wall surface to be patched and melted, and the fixing glue is cooled to complete the pasting of the strain gauge on the current wall surface.

9. The method for manufacturing a strain gauge sensor by hot melting as claimed in claim 1, characterized in that: Before the patch is applied, at least the wall surface to be patched is treated to increase the surface roughness.

10. A strain gauge sensor, prepared by the method for manufacturing a strain gauge sensor by hot melting according to any one of claims 1 to 9, characterized in that: The strain gauge sensor comprises a bearing member, wherein the bearing member has no less than two wall surfaces, and at least one strain gauge is adhered to each wall surface by fixing glue.

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