Liquid cooling equipment and communication equipment

Abstract

The embodiment of the invention provides a liquid cooling assembly and communication equipment, and the liquid cooling equipment comprises a first liquid cooling assembly which is used for carrying out the heat dissipation of a main control chip in the communication equipment; the second liquid cooling assembly is used for cooling an optical module assembly in the communication equipment; wherein the first liquid cooling assembly is connected with the second liquid cooling assembly through a pipeline, and a liquid cooling medium sequentially flows through the first liquid cooling assembly, the pipeline and the second liquid cooling assembly.

Description

Technical Field

[0001] The present application relates to the technical field of communication equipment, and in particular to a liquid cooling device and a communication device. Background Art

[0002] With the promotion of 5G, the domestic market demand for optical modules has increased. For example, in the construction of large data centers, optical modules are used as a key component to achieve the interconnection of all things. At present, in order to ensure that network data can meet the requirements of faster speed and lower latency, optical modules can be used as core components of optical communication equipment, but their heat dissipation is also the first problem that must be overcome.

[0003] In this regard, in related technologies, the heat dissipation of optical modules mainly relies on air cooling and heat conduction. However, as the heat flux density (or power consumption density) of the optical modules increases, heat dissipation methods such as air cooling and conventional single-phase liquid cooling can no longer meet the heat dissipation requirements. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a liquid cooling component and communication equipment that can meet the heat dissipation requirements of high power consumption density application scenarios.

[0005] To solve the above technical problems, the embodiments of the present application are implemented through the following aspects.

[0006] In a first aspect, an embodiment of the present application provides a liquid cooling device, comprising: a first liquid cooling component, used to dissipate heat from a main control chip in a communication device; a second liquid cooling component, used to dissipate heat from an optical module component in the communication device; wherein the first liquid cooling component is connected to the second liquid cooling component through a pipeline, and the liquid cooling medium flows through the first liquid cooling component, the pipeline and the second liquid cooling component in sequence.

[0007] In a second aspect, an embodiment of the present application provides a communication device, comprising a main control chip, an optical module assembly, and the liquid cooling device described in claims 1-13, wherein a first liquid cooling assembly in the liquid cooling device is arranged on the main control chip, and a second liquid cooling assembly is arranged on the optical module assembly.

[0008] The embodiment of the present application, through the ingenious design of the liquid cooling device, can use the main control chip to preheat the liquid cooling medium in the liquid cooling device to eliminate overcooling, thereby improving the heat dissipation capacity of the second liquid cooling component used for the optical module assembly, and achieving the goal of greatly reducing the thermal resistance of the cold plate heat exchange through phase change heat exchange, thereby meeting the heat dissipation requirements of high power consumption density application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0010] Figure 1 One of the structural schematic diagrams of the liquid cooling device provided in the embodiment of the present application is shown.

[0011] Figure 2a A second structural schematic diagram of the liquid cooling device provided in an embodiment of the present application is shown.

[0012] Figure 2b A third structural schematic diagram of the liquid cooling device provided in an embodiment of the present application is shown.

[0013] Figure 2c A fourth structural schematic diagram of the liquid cooling device provided in an embodiment of the present application is shown.

[0014] Figure 3a A schematic structural diagram of a liquid separation component provided in an embodiment of the present application is shown.

[0015] Figure 3b A schematic structural diagram of a liquid collection component provided in an embodiment of the present application is shown.

[0016] Figure 4 A schematic diagram of an optical module assembly provided in an embodiment of the present application is shown.

[0017] Figure 5 A schematic structural diagram of a second liquid cooling assembly provided in an embodiment of the present application is shown.

[0018] Figure 6 A schematic structural diagram of a liquid cooling plate provided in an embodiment of the present application is shown.

[0019] Figure 7a A schematic structural diagram of a second liquid inlet assembly provided in an embodiment of the present application is shown.

[0020] Figure 7b A schematic structural diagram of a second liquid outlet assembly provided in an embodiment of the present application is shown.

[0021] Figure 8 A schematic diagram of the heat dissipation path of the liquid cooling device provided in an embodiment of the present application is shown.

[0022] Fig. 9 A schematic diagram of a structural support reaction force calculation process provided in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application.

[0024] like Figure 1 As shown, an embodiment of the present application provides a liquid cooling device 100 for heat dissipation of communication equipment. The liquid cooling device 100 may include a first liquid cooling component 10 and a second liquid cooling component 20. The first liquid cooling component 10 is used to dissipate heat from a main control chip in the communication equipment, and the second liquid cooling component 20 is used to liquid-cool the optical module component in the communication equipment. The first liquid cooling component 10 is connected to the second liquid cooling component 20 through a pipeline 50, and a liquid cooling medium (a phase-change cooling medium such as a fluorinated liquid or a refrigerant) flows through the first liquid cooling component 10, the pipeline 50 and the second liquid cooling component 20 in sequence to achieve liquid cooling of the communication equipment.

[0025] That is to say, in the present application, when the main control chip and the optical module assembly in the communication device are liquid-cooled by the liquid cooling device 100, it is achieved by connecting the front and rear stages in series. Therefore, during the heat dissipation process, the main control chip can be used to preheat the liquid cooling medium in the first liquid cooling assembly 10 to eliminate overcooling, thereby improving the heat dissipation capacity of the second liquid cooling assembly 20 used for heat dissipation of the optical module assembly, thereby greatly reducing the heat exchange thermal resistance of the liquid cooling plate through phase change heat transfer, thereby meeting the heat dissipation requirements of optical module assemblies with low temperature resistance specifications, and meeting the heat dissipation requirements in scenarios with high power consumption density or high heat flux density, so that the service life of the optical module assembly is guaranteed, and at the same time, the output rate of converting electrical signals into optical signals through the optical module assembly can be ensured.

[0026] Optionally, in order to improve the heat dissipation effect, the first liquid cooling component 10 can be attached to the main control chip (such as a central processing unit (CPU), a graphics processing unit (GPU), etc.), and the second liquid cooling component 20 can be attached to the optical module component, and there is no limitation here.

[0027] Based on this, in one implementation, when the first liquid cooling component 10 is used to dissipate heat for the main control chip, the layout of the first liquid cooling component 10 can be set with reference to the layout position, quantity, etc. of the main control chip. For example, in the case where the communication device includes at least two main control chips, the first liquid cooling component 10 may also include at least two liquid cooling sub-components corresponding to the main control chips. According to the liquid cooling heat dissipation requirements, the at least two liquid cooling sub-components may be connected in parallel, in series, at least partially in series, at least partially in parallel, etc., or each liquid cooling sub-component may also include multiple liquid cooling plates arranged in parallel or in series, etc., which are not limited here.

[0028] Here, the scenario in which at least part of the at least two liquid-cooling sub-assemblies are connected in parallel is taken as an example. Considering that the first liquid-cooling assembly 10 and the second liquid-cooling assembly 20 are in a front-to-back series relationship, in order to realize the liquid confluence and liquid separation of multiple liquid-cooling assemblies in parallel, in this embodiment, the liquid cooling device 100 may also include a liquid separation assembly and a liquid confluence assembly. Among them, the liquid inlet of each of the liquid-cooling sub-assemblies is respectively connected to the liquid outlet on the liquid separation assembly through a pipeline, and the liquid outlet is respectively connected to the liquid inlet of each of the liquid confluence assemblies through a pipeline 50, and the liquid outlet of the liquid confluence assembly is connected to the second liquid-cooling assembly 20 through a pipeline.

[0029] That is to say, the liquid cooling medium flowing into the liquid cooling device 100 will first be divided into at least two heat dissipation paths corresponding to the at least two liquid cooling sub-components by the liquid separation component, and then the liquid cooling medium flowing into the at least two heat dissipation paths will be merged by the liquid converging component to form a heat dissipation path and enter the second liquid cooling component, thereby forming a closed liquid cooling circulation system.

[0030] It is worth noting that for each heat dissipation path, the heat dissipation path may also include one or more liquid cooling sub-components connected in series and / or in parallel to be used for heat dissipation of different layout scenarios or different numbers of main control chips.

[0031] For example, assuming that the first liquid cooling component 10 includes Figure 2a The two liquid cooling sub-assemblies 11 and 12 are connected in parallel, and the liquid cooling sub-assembly 11 and the liquid cooling sub-assembly 12 respectively include two liquid cooling plates connected in series (such as Figure 2aThe liquid cooling sub-assembly 11 shown includes liquid cooling plates A and B connected in series, and the liquid cooling sub-assembly 12 includes liquid cooling plates C and D connected in series), and each of the liquid cooling plates is connected by a pipeline 50. When the liquid cooling medium enters the liquid cooling device 100, it flows into the liquid cooling plates in each liquid cooling sub-assembly 11 and the liquid cooling sub-assembly 12 in turn through the liquid separation assembly 31, and enters the second liquid cooling assembly 20 after being mixed by the liquid converging assembly 32, so as to realize liquid cooling of the main control chip, and preheat the liquid cooling medium through the main control chip to eliminate overcooling.

[0032] For another example, assuming that the first liquid cooling component includes Figure 2b The liquid-cooling sub-assembly 11, liquid-cooling sub-assembly 12, liquid-cooling sub-assembly 13, and liquid-cooling sub-assembly 14 are arranged in parallel. When the liquid-cooling medium enters the liquid cooling device 100, it first flows into the liquid cooling plates in each of the liquid-cooling sub-assemblies 11, liquid-cooling sub-assembly 12, liquid-cooling sub-assembly 13, and liquid-cooling sub-assembly 14 in sequence through the liquid separation assembly 31, and then enters the second liquid cooling assembly 20 after being mixed through the liquid converging assembly 32, so as to realize liquid cooling of the main control chip and preheat the liquid cooling medium through the main control chip to eliminate overcooling.

[0033] It should be noted that, in this example, the liquid cooling medium flowing through the four liquid cooling sub-components can enter the second liquid cooling component 20 after passing through a liquid confluence component 32, or can also enter the second liquid cooling component 20 as shown in FIG. Figure 2b As shown, different liquid cooling plates enter the second liquid cooling component 20 after passing through two liquid conduit components 32, such as liquid cooling sub-component 11, liquid cooling sub-component 12 corresponds to one liquid conduit component 32, such as liquid cooling sub-component 13, liquid cooling sub-component 14 corresponds to one liquid conduit component 32, and no limitation is made here.

[0034] It is worth noting that Figure 2a Taking the liquid cooling device 100 shown in FIG. Figure 2a The pipe 50 in the liquid cooling device 100 shown in the figure adopts a connection scheme of a corrugated hose. In the embodiment of the present application, if both the corrugated hose and the hard pipe meet the floating performance, then the hard pipe (such as a copper pipe) can be preferably used as the connection pipe between the components. The connection diagram is shown in FIG. Figure 2c shown.

[0035] Of course, no matter which pipeline or connection method is used, each liquid cooling component in the liquid cooling device 100 must meet the requirements of flow resistance, temperature uniformity and other characteristics to ensure the liquid cooling heat dissipation performance.

[0036] In one implementation, there may be a variety of implementations for the aforementioned liquid separation component 31 and the liquid converging component 32. For example, considering that the liquid separation component 31 can simultaneously realize the diversion of the heat dissipation paths of more than two main control chips, therefore, in this embodiment, the liquid separation component 31 may be composed of a valve block or valve component in the form of T-shape, Y-shape, U-shape, etc., without limitation herein.

[0037] For example, see Figure 2a and Figure 3a ,in, Figure 3a It is a T-shaped three-way liquid separation component, wherein the liquid inlet (not shown) on the T-shaped three-way liquid separation component is used to achieve communication with the total liquid inlet port of the liquid cooling device 100, the liquid outlet 311 can be used to achieve communication with the liquid separation sub-component 11, and the liquid outlet 312 is used to achieve communication with the liquid separation sub-component 12.

[0038] Please refer to Figure 2a and Figure 3b , wherein the liquid collection component 32 is used to achieve the mixing and distribution of the fluid working medium (i.e., liquid cooling medium) of the two (or more) main control chip heat dissipation branches, eliminate the overcooling for the two-phase liquid cooling in the second liquid cooling component 20, and improve the heat dissipation and temperature equalization capability of the second liquid cooling component 20 corresponding to the optical module component. Based on this, according to the different numbers of liquid cooling plates included in the first liquid cooling component 10 and the second liquid cooling component 20, the liquid collection component 32 is different. For example Figure 3a As shown, it is a schematic diagram of the structure of a possible liquid collection component 32, inlet 321 on the liquid collection component 32 is used to realize the outlet connection of the liquid cooling sub-component 11, inlet 322 is connected with the outlet of the liquid cooling sub-component 12, outlet 323 and outlet 324 are respectively connected with the second liquid cooling component 20, so as to flow the mixed liquid cooling medium into the second liquid cooling component 20 to dissipate heat for the optical module component.

[0039] Of course, in addition to the aforementioned first liquid cooling component 10, liquid separation component 31, and liquid collection component 32, in one implementation, the second liquid cooling component 20 may also be implemented in a variety of ways. For example, according to the different layouts of the optical module components, the second liquid cooling component 20 may include at least one layer of liquid cooling plate, wherein, Figure 2a As shown, each layer of the liquid cooling plate may be provided with a first liquid inlet port assembly 21 and a first liquid outlet port assembly 22 , and each of the first liquid inlet port assemblies 21 is connected to the liquid outlet of the first liquid cooling assembly 10 via a pipeline 50 .

[0040] For example, in one implementation, assuming that the second liquid cooling component 20 includes Figure 4 The two layers of liquid cooling plates 23 are arranged in an upper and lower manner, and the optical module assembly 60 may include Figure 5 The U-shaped cage and the optical module are shown. The U-shaped cage is designed with an inverted U-shaped structure to divide all the optical modules into two groups, upper and lower. Figure 4 The upper liquid cooling plate 23 in the second liquid cooling assembly 20 shown can be directly arranged above the optical module, the lower liquid cooling plate 23 is in direct contact with the first layer of optical module group in the U-shaped cage, and the upper liquid cooling plate 23 is in direct contact with the second layer of optical module group in the U-shaped cage, so as to realize active bonding between the optical module and the liquid cooling plate, so as to liquid-cool the optical module. Optionally, the aforementioned optical module group can be obtained by combining one or more optical modules.

[0041] Of course, please refer to Figure 1 and Figure 3b For the aforementioned situation including the liquid collection component 32, the outlet on the liquid collection component 32 can be connected to the first liquid inlet port 21 on each of the liquid cooling plates in the second liquid cooling component 20, so that the liquid cooling medium preheated by the first liquid cooling component 10 is mixed by the liquid collection component 32 and enters each liquid cooling plate 23 in the second liquid cooling component 20 to achieve heat dissipation for the optical module component 60.

[0042] The difference between the spring force and the supporting reaction force of each liquid cooling plate in the second liquid cooling assembly 20 is greater than the minimum effective pressure value of the interface material, thereby meeting the floating design requirements of the liquid cooling plate and ensuring the heat dissipation effect. The interface material is located between the second liquid cooling assembly and the optical module assembly, such as air, gel, etc.

[0043] In one implementation, when there are at least two layers of liquid cooling plates 23 in the second liquid cooling assembly, at least one limiter may be provided between the liquid cooling plates 23 of adjacent layers to form a space for accommodating the optical module assembly 60 between the liquid cooling plates 23 of adjacent layers, thereby ensuring the installation spacing of the optical modules between adjacent layers, and thereby achieving liquid cooling of the optical module assembly 60.

[0044] In addition, in one implementation, during the liquid cooling process, the liquid cooling plate on each parallel branch in the second liquid cooling component 20 reaches a saturated boiling state to ensure the liquid cooling heat dissipation performance of the second liquid cooling component 20 .

[0045] Based on this, in one implementation, please refer to Figure 2aFor each liquid cooling plate in the second liquid cooling component 20, a first liquid inlet is opened at a position on the liquid cooling plate corresponding to the first liquid inlet port component 21, and the opening area of ​​the first liquid inlet is larger than the opening area of ​​the first liquid inlet port component 21, and / or the first liquid inlet port component 21 is non-coaxially connected to the first liquid inlet, thereby achieving the purpose of sinking expansion, reducing the resistance of the liquid inlet port, and improving the temperature uniformity characteristics of the second liquid cooling component 20.

[0046] Correspondingly, a first liquid outlet may also be opened at a position on the liquid cooling plate 23 corresponding to the first liquid outlet port assembly, and the opening area of ​​the first liquid outlet is larger than the opening area of ​​the first liquid outlet port assembly 22, and / or the first liquid outlet port assembly 22 is non-coaxially connected to the first liquid outlet, thereby achieving the purpose of sunken expansion, reducing the resistance of the liquid outlet port, and improving the temperature uniformity characteristics of the second liquid cooling assembly 20.

[0047] Optionally, along the length direction of the liquid cooling plate 23, the first liquid outlet port assembly 21 and the first liquid inlet port assembly 22 are respectively located at both ends of the liquid cooling plate 23 to reduce the pressure of the liquid inlet and outlet and improve the temperature uniformity characteristics of the second liquid cooling assembly.

[0048] In addition, fluid connectors may be provided in the first liquid inlet port assembly 21 and the first liquid outlet port assembly 22 to achieve plugging and unplugging under pressure, thereby ensuring the maintainability and safety of the liquid cooling device.

[0049] It is worth noting that the liquid cooling plates in the first liquid cooling assembly 10 and the second liquid cooling assembly 20 are provided with cavities for the circulation of liquid cooling medium. In this embodiment, in order to further achieve better temperature uniformity, the inner wall of the cavity of each liquid cooling plate may be, but is not limited to, Figure 6 The staggered tooth shape shown in the figure can preheat the liquid cooling medium by using the main control chip, and realize the extremely small average temperature characteristic of the optical module by strengthening the boiling surface of the staggered tooth shape, which can effectively solve the pain points in the industry, such as the poor heat dissipation effect when the heat flux density or power consumption density is high.

[0050] Further, in one implementation, please refer again to Figure 2a The liquid cooling device 100 may further include a second liquid inlet port assembly 41 and a second liquid outlet port assembly 42. The second liquid inlet port assembly 41 is connected to the liquid inlet of the first liquid cooling assembly 21 through a pipeline 50, and the second liquid outlet port assembly 42 is connected to the liquid outlet of the second liquid cooling assembly 22 through a pipeline 50.

[0051] In order to realize dynamic pressure plugging and unplugging of a single board and improve the maintainability of the liquid cooling system, a fluid connector may be provided in the second liquid inlet port assembly 41. Figure 7a The second liquid inlet port assembly 41 may include a liquid inlet flange port 411 and a fluid connector liquid inlet port 412, wherein the liquid inlet flange port 411 is used to realize the connection and sealing between the total liquid inlet pipeline in the liquid cooling device 100 and the second liquid inlet port assembly 41, and the fluid connector liquid inlet port 412 is used to realize the connection and sealing between the fluid connector liquid inlet port 412 and the pipeline.

[0052] Corresponding to the second liquid inlet port assembly 41, in this embodiment, in order to realize dynamic pressure plugging and unplugging of a single board to improve maintainability, a fluid connector may also be provided in the second liquid outlet port assembly 42. Figure 7b As shown, the second liquid outlet port assembly 42 may include a liquid outlet flange port 421 and a fluid connector liquid outlet port 422, wherein the liquid outlet flange port 421 is used to connect and seal the liquid outlet pipeline with the second liquid outlet port assembly 42, and the fluid connector liquid outlet port 422 is used to connect and seal the fluid connector liquid outlet port.

[0053] In one implementation, considering that the aforementioned pipeline 50 involved in the liquid cooling device 100 can be used to realize the efficient transmission and quantitative distribution of the liquid cooling medium in all liquid cooling components in the liquid cooling device 100, the floating performance when the main control chip is installed independently, the first liquid cooling component 10 and the second liquid cooling component 20 have the decoupling installation performance of independent maintenance, and the floating tolerance requirements when each liquid cooling plate in the second liquid cooling component 20 is installed, etc. Therefore, in this embodiment, the pipeline 50 can be but not limited to a metal corrugated hose or a metal pipe. For example, it can be selected according to the type of liquid cooling medium, such as when the liquid cooling medium is a Freon-type working fluid, the pipeline can be a metal bellows, etc.

[0054] The shapes of the pipelines 50 located at different positions in the liquid cooling device 100 may be, but are not limited to, U-shaped, Z-shaped, L-shaped, or other shapes that can achieve the buffering purpose, thereby ensuring higher heat exchange performance while achieving floating performance.

[0055] In this embodiment, the shape and / or diameter of the pipeline can be determined based on one or more of the total resistance of the branch where the pipeline is located, the branch flow, the branch floating capacity, etc., which will not be repeated here.

[0056] Further, for the aforementioned liquid cooling device 100, this embodiment briefly describes the key performance indicators of the liquid cooling plate (such as thermal resistance, flow resistance, floating performance, etc.) based on the thermal design and floating performance requirements of the liquid cooling plate. For example, assuming that the main control chip is a CPU, then Figure 2a The heat dissipation path in the liquid cooling device 100 shown in FIG. Figure 8 The heat dissipation path schematic diagram is shown. Based on this, the thermal design and floating capacity design of the second liquid cooling component 20 are performed below, and the process involved is as follows.

[0057] (1) Thermal design

[0058] (a) The total flow rate of the liquid cooling medium required by the second liquid cooling assembly 20 can be calculated according to the total dryness of 0.2 to 0.4, and whether the liquid cooling plate on each parallel branch can reach the two-phase heat exchange state (i.e., saturated boiling state) can be calculated. If it is not enough, consider arranging the liquid cooling plate in series with the rear stage of other heating devices to ensure that the two-phase heat exchange state is achieved. The total dryness can be large but not limited to 0.2 to 0.4.

[0059] (b) Preliminarily determine the diameter of the pipeline, calculate the total resistance (total resistance, flow rate, floating capacity) requirements of each branch in the second liquid cooling component (to meet the pump head and flow rate), and determine the feasible series and parallel combination methods (reference resistance, setting space).

[0060] (c) Analyze the components with the largest resistance in the main branch (such as liquid cooling plate, liquid inlet, pipeline, etc.) and consider whether they can be connected in parallel to ensure heat exchange capacity while optimizing local resistance until each main branch meets the resistance requirements.

[0061] (d) Design the tooth shape of the liquid cooling plate structure, the diameter of the liquid inlet and outlet ports, the liquid inlet and outlet methods, the flow channel cavity in the liquid cooling plate, etc., and verify whether the flow resistance and thermal resistance characteristics meet the requirements.

[0062] (e) Sample proofing, test regression, and final structure finalization.

[0063] (2) Design of floating capacity

[0064] Assuming that a hard pipe is used as the pipeline of the liquid cooling equipment, and the input conditions include: the main control chip is bare (die), the chip pressure limit is 20psi, the pipeline connected to the liquid cooling plate is a copper pipe, and the pipeline shape can be regarded as a U-shaped structure, then the calculation of the structural type support reaction force F can be used but not limited to Fig. 9 The formula shown. It can be understood that Fig. 9 In the figure, "D" is the outer diameter of the copper tube (mm), "d" is the inner diameter of the copper tube (mm), "E" is the elastic modulus (MPa), "G" is the trimming modulus (MPa), and "I" is the moment of inertia (m 4 ), “I p ” is the polar moment of inertia (m 4), "L1" is the length of the cantilever beam 1 in the U-shaped structure (mm), "a" is the length of the extended beam in the U-shaped structure (mm), "L2" is the length of the cantilever beam 2 in the U-shaped structure (mm), "Δ" is the end displacement (mm, which can generally be set to 1mm or -1mm), "EI" is the stiffness coefficient, and "GI p ” is the stiffness coefficient and “F” is the support reaction force (N).

[0065] Based on this, if the copper tubes used to connect the liquid cooling plates are all 8mm in diameter and 1mm in wall thickness; the support reaction force and spring force are analyzed according to the structural dimensions, weight and minimum effective pressure of the interface material of each liquid cooling plate, and the analysis results are shown in Table 1; the difference between the spring force and the support reaction force of each liquid cooling plate is greater than the minimum effective pressure value of the interface material, which meets the floating design requirements of the liquid cooling plate.

[0066] Table 1

[0067]

[0068] Of course, if the pipeline uses a metal corrugated hose, relevant calculations can be performed according to the floating capacity (floating amount) of the hose per unit length provided by the pipeline supplier. It can be evaluated that the difference between the spring force and the support reaction force of each liquid cooling plate is greater than the minimum effective pressure value of the interface material, thereby meeting the floating design requirements of the liquid cooling plate.

[0069] That is to say, when designing a liquid cooling device, the liquid cooling device needs to meet the above-mentioned requirements of thermal design and floating capacity design, so as to obtain the best liquid cooling heat dissipation effect.

[0070] In the embodiment of the present application, based on the idea of ​​full coverage of the system's global two-phase flow heat dissipation, the main control chip is designed as a supercooled boiling zone, and the optical module component is designed as a saturated boiling zone, so that the main control chip is used to preheat the supercooled liquid, and the staggered tooth-shaped boiling surface is strengthened to achieve the extremely small average temperature characteristic of the optical module, solve the pain points of the optical module heat dissipation industry, and realize the ultimate overall heat dissipation solution with truly low pump work (trunk design, pipeline design), low thermal resistance, and high average temperature characteristics.

[0071] In addition, the liquid cooling equipment proposed in this application is suitable for a pump-driven two-phase circulation system, which uses stainless steel metal corrugated hoses and clever pipeline shape designs (such as T-shape, U-shape, Z-shape, etc.), which can solve the problem of independent floating of the cold plate unit under extremely small bending radius.

[0072] In this case, the liquid cooling device provided in this application is suitable for the following scenarios:

[0073] (a) Liquid cooling scenarios with limited installation space (usually air cooling cannot solve the problem) and high heat flux density, high temperature uniformity, and high chip floating capacity requirements.

[0074] (b) Where certain floating performance requirements are required for chips or devices.

[0075] (c) Compact device layout, a scenario where single-phase liquid cooling has reached its heat dissipation limit.

[0076] (d) Applications with large number of devices and high requirements for temperature uniformity.

[0077] (e) For occasions with high comprehensive requirements on energy consumption, noise and PUE.

[0078] An embodiment of the present application also provides a communication device, which includes a main control chip, an optical module assembly and the aforementioned liquid cooling device, wherein a first liquid cooling assembly in the liquid cooling device is arranged on the main control chip, and a second liquid cooling assembly is arranged on the optical module assembly.

[0079] Optionally, the liquid cooling plate in the first liquid cooling assembly is bonded to the main control chip, and the liquid cooling plate in the second liquid cooling assembly is bonded to the optical module assembly.

[0080] It can be understood that the liquid cooling equipment provided in this embodiment has the same or corresponding technical features as the aforementioned liquid cooling equipment. Therefore, the relevant description of the liquid cooling equipment in this embodiment can refer to the relevant description in the aforementioned liquid cooling equipment embodiment, and achieve the same or corresponding technical effects. To avoid repetition, it will not be repeated here.

[0081] Of course, in addition to the hardware implementation, the communication device of the present application does not exclude other implementation methods, such as logic devices or a combination of software and hardware, etc.

[0082] In short, the above description is only a preferred embodiment of the present application and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0083] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0084] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

Claims

1. A liquid cooling device, characterized in that: include: A first liquid cooling component, used to dissipate heat from a main control chip in the communication device; A second liquid cooling component, used for dissipating heat from the optical module component in the communication device; The first liquid cooling component is connected to the second liquid cooling component through a pipeline, and the liquid cooling medium flows through the first liquid cooling component, the pipeline and the second liquid cooling component in sequence.

2. The liquid cooling device according to claim 1, wherein the second liquid cooling component comprises at least one layer of liquid cooling plate, wherein: Each layer of the liquid cooling plate is provided with a first liquid inlet port assembly and a first liquid outlet port assembly; Wherein, each of the first liquid inlet port components is connected to the liquid outlet of the first liquid cooling component through a pipeline.

3. The liquid cooling device according to claim 2, characterized in that: In the case that there are at least two layers of the liquid cooling plates, at least one limiting member is provided between the liquid cooling plates of adjacent layers.

4. The liquid cooling device according to claim 2, characterized in that: For each liquid cooling plate in the second liquid cooling assembly, a first liquid inlet is provided at a position on the liquid cooling plate corresponding to the first liquid inlet port assembly, and an opening area of ​​the first liquid inlet is larger than an opening area of ​​the first liquid inlet port assembly; and / or, A first liquid outlet is provided on the liquid cooling plate at a position corresponding to the first liquid outlet port assembly, and an opening area of ​​the first liquid outlet is larger than an opening area of ​​the first liquid outlet port assembly.

5. The liquid cooling device according to claim 4, characterized in that: The first liquid inlet port assembly is non-coaxially connected to the first liquid inlet.

6. The liquid cooling device according to claim 4, characterized in that: The first liquid outlet port assembly is non-coaxially connected to the first liquid outlet.

7. The liquid cooling device according to claim 2, characterized in that: The first liquid inlet port assembly and the first liquid outlet port assembly are provided with fluid connectors.

8. The liquid cooling device according to claim 1, characterized in that: If there are at least two main control chips, the first liquid cooling component includes at least two liquid cooling sub-components corresponding to the main control chips, and the liquid cooling device further includes a liquid separation component and a liquid collection component; Among them, the liquid inlet of each liquid cooling sub-component is connected to the liquid outlet on the liquid separation component through a pipeline, and the liquid outlet is connected to the liquid inlet of each liquid converging component through a pipeline, and the liquid outlet of the liquid converging component is connected to the second liquid cooling component through a pipeline.

9. The liquid cooling device according to any one of claims 2 to 8, characterized in that: The liquid cooling device also includes a second liquid inlet port assembly and a second liquid outlet port assembly; Wherein, the second liquid inlet port assembly is connected to the liquid inlet of the first liquid cooling assembly through a pipeline, and the second liquid outlet port assembly is connected to the liquid outlet of the second liquid cooling assembly through a pipeline.

10. The liquid cooling device according to claim 9, characterized in that: The second liquid inlet port assembly and the second liquid outlet port assembly are provided with fluid connectors.

11. The liquid cooling device according to any one of claims 1 to 8, characterized in that: The pipeline comprises a metal corrugated hose or a metal pipe.

12. The liquid cooling device according to any one of claims 1 to 8, characterized in that: During the liquid cooling process, the liquid cooling plate on each parallel branch in the second liquid cooling assembly reaches a saturated boiling state.

13. The liquid cooling device according to any one of claims 1 to 8, characterized in that: The difference between the spring force and the supporting reaction force of each liquid cooling plate in the second liquid cooling assembly is greater than the minimum effective pressure value of the interface material, and the interface material is located between the second liquid cooling assembly and the optical module assembly.

14. A communication device, characterized in that: It comprises a main control chip, an optical module assembly and the liquid cooling device described in claims 1-13, wherein a first liquid cooling assembly in the liquid cooling device is arranged on the main control chip, and a second liquid cooling assembly is arranged on the optical module assembly.

15. The communication device according to claim 14, characterized in that The liquid cooling plate in the first liquid cooling component is attached to the main control chip, and the liquid cooling plate in the second liquid cooling component is attached to the optical module component.

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