Silicon light intelligent calculation module

Abstract

The invention discloses a silicon optical intelligent calculation module, and relates to the technical field of artificial intelligence, the silicon optical intelligent calculation module comprises a tube shell, a ceramic packaging plate is arranged in the tube shell, an optical chip is arranged on the ceramic packaging plate, a laser chip is arranged on the optical chip, a plurality of spherical grids are arranged on the ceramic packaging plate, and the spherical grids are arranged on the ceramic packaging plate. And a gold wire is connected between the spherical grating and the optical chip. According to the silicon optical intelligent calculation module, the characteristics of high speed, large bandwidth and low power consumption of a photonic device are utilized, efficient processing of mass data is achieved through parallel transmission and processing of optical signals in the photonic device, the problems of noise and time delay caused by electronic signal transmission are avoided, and therefore the calculation speed and efficiency are improved; the problem that a traditional electronic chip faces a performance bottleneck in a big data and high-speed computing scene is solved, and particularly, the computing power of an electrical artificial intelligence chip is improved, and the power consumption is controlled.

Description

Technical Field

[0001] The present invention relates to the field of artificial intelligence technology, and in particular to a silicon photonic intelligent computing module. Background Art

[0002] With the rapid development of the artificial intelligence industry, the use of a single electronic technology can no longer meet the current performance requirements of artificial intelligence chips, which has greatly restricted the implementation and development of the artificial intelligence industry.

[0003] Traditional electronic computing chips consume a lot of energy during data processing. Optical signals generate a lot of heat during transmission and processing, which leads to a large demand for heat dissipation in the overall equipment, thereby increasing the energy consumption of the overall equipment. Therefore, it is urgent to develop and prepare domestically produced, independently controllable, low-cost, low-energy, and high-computing-power silicon photonics artificial intelligence chips to solve the performance bottleneck problem in big data and high-speed computing scenarios. Summary of the invention

[0004] The purpose of the present invention is to provide a silicon photonics intelligent computing module to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: a silicon photonic intelligent computing module, comprising:

[0006] The tube shell has a ceramic packaging board built in the tube shell, an optical chip is arranged on the ceramic packaging board, a laser chip is arranged on the optical chip, a plurality of spherical grids are arranged on the ceramic packaging board, and gold wires are connected between the spherical grids and the optical chip.

[0007] In a further embodiment, a driver chip, a CDR chip and a TIA chip are also integrated on the ceramic package board.

[0008] In a further embodiment, a total reflection mirror and a lens combination are also installed on the optical chip.

[0009] In a further embodiment, the optical chip is also integrated with a grating coupling located at the side of the total reflection mirror.

[0010] In a further embodiment, edge coupling is also integrated on the ceramic package board.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] The present invention is a silicon photonic intelligent computing module, which utilizes the high speed, large bandwidth and low power consumption characteristics of photonic devices, and realizes efficient processing of massive data through parallel transmission and processing of optical signals in photonic devices, avoiding the noise and delay problems caused by electronic signal transmission, thereby improving computing speed and efficiency; solving the performance bottleneck problem faced by traditional electronic chips in big data and high-speed computing scenarios, especially the computing power improvement and power consumption control operation of electrical artificial intelligence chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0014] Figure 2 It is a schematic diagram of the edge coupling structure of the present invention;

[0015] Figure 3 It is a cross-sectional view of the ceramic packaging board of the present invention.

[0016] In the figure: 1. tube shell; 2. driver chip; 3. CDR chip; 4. TIA chip; 5. ceramic packaging board; 6. optical chip; 7. total reflection mirror; 8. grating coupling; 9. lens combination; 10. laser chip; 11. edge coupling; 12. spherical grid; 13. gold wire. DETAILED DESCRIPTION

[0017] The following will be described clearly and completely in conjunction with the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] Embodiment, this embodiment provides a silicon photonics intelligent computing module, such as Figure 1 and Figure 3 As shown, it includes: a tube shell 1, a ceramic packaging board 5 is built in the tube shell 1, an optical chip 6 is arranged on the ceramic packaging board 5, and the BGA package is a ceramic package. The pin size and spacing are small, which solves the problem that the optical chip 6 is difficult to package with a large number of pins. At the same time, the tube shell 1 can be wired in layers to solve the problems of wiring difficulty, structural instability, etc.

[0019] A laser chip 10 is disposed on the optical chip 6, a plurality of spherical grids 12 are disposed on the ceramic package board 5, and a gold wire 13 is connected between the spherical grids 12 and the optical chip 6. Figure 1As shown, in addition, the ceramic package board 5 is also integrated with a driver chip 2, a CDR chip 3 and a TIA chip 4. The ceramic package board 5 is also integrated with an edge coupling 11. A total reflection mirror 7 and a lens combination 9 are also installed on the optical chip 6. The total reflection mirror 7 is used to reflect and couple the optical signal to the grating to input the optical chip, and the lens combination 9 is used for mode field matching. The optical chip 6 is also integrated with a grating coupling 8 located at the side of the total reflection mirror 7.

[0020] The laser chip and the optical computing chip are coupled to each other to greatly save packaging space, reduce transmission loss, and enhance the stability of the optical signal. The driver and transimpedance amplifier are integrated on the silicon photonic chip, so only auxiliary designs such as DC-DC need to be provided on the PCB, and no other optical devices are required. This makes the design of the circuit part more compact and miniaturized. Photons are used inside the chip to transmit and calculate information. The calculation is completed in the process of light transmission through the chip. It has extremely high computing power and extremely low power consumption. Compared with electronic computing chips, the computing power and power consumption are dozens of times better, and there is almost no delay. Since photons do not carry electric charge and optical signals are not affected by electromagnetic fields, silicon photonic artificial intelligence chips have the characteristics of anti-electromagnetic interference, low latency, and high confidentiality.

[0021] The silicon photonic intelligent computing module is a high-frequency module. The high-frequency signal path mainly refers to the differential input and output terminals of the laser and the detector. For other control signals, because they do not belong to high-speed transmission signals, there is no need to consider the transmission line effect too much. By controlling the relationship between the high-speed signal line and the AC ground, the loop signal can be transmitted along the minimum impedance path. For the transmitter and receiver of the module, since the driver and transimpedance amplifier are integrated on the silicon photonic chip, only auxiliary designs such as DC-DC need to be provided on the PCB, and no other optical devices are required. This makes the design of the circuit part more compact and more miniaturized. The design of electromagnetic compatibility mainly uses power supply and ground separation for the circuit to ensure the integrity of the ground plane. The high-speed signal line uses impedance-controlled microstrip lines to ensure the transmission quality of the signal, and the isolation design of the transmitting and receiving circuits reduces the crosstalk between the internal circuits. Therefore, as an on-board module, this module can greatly improve the integration of the module and the electrical chip and reduce the length of the transmission line on the PCB.

[0022] Silicon photonic intelligent computing modules utilize the high speed and large bandwidth characteristics of photon transmission to significantly speed up data processing, especially when processing large-scale data sets and complex computing tasks. This high-speed computing capability is essential for realizing real-time data analysis, high-performance computing, and artificial intelligence applications.

[0023] Compared with traditional electronic computing chips, silicon photonics intelligent computing modules consume less energy during data processing. Optical signals generate almost no heat during transmission and processing, which reduces the need for heat dissipation and reduces overall energy consumption. This is of great significance for improving the energy efficiency of data centers, edge computing devices, and mobile devices.

[0024] The silicon photonics intelligent computing module integrates photonic devices and electronic circuits on the same chip, which includes a modulator that converts electrical signals into optical signals; an optical beam splitter connected to the modulator for dividing the optical signal into multiple sub-optical signals; and an optical transmission medium connected to the optical beam splitter and corresponding to the optical signal one by one for transmitting the optical signal, thus realizing a highly integrated computing system. This integration method not only reduces the interconnection delay and power consumption between chips, but also improves the scalability of the system, allowing computing resources to be flexibly configured and expanded according to demand.

[0025] In summary, the silicon photonic intelligent computing module of the present invention is produced by integrating multi-field technological innovations such as artificial intelligence technology, optoelectronic integration technology, and microelectronics technology with silicon photonic artificial intelligence chips, and encapsulating silicon photonic artificial intelligence chips and laser chips together into a silicon photonic intelligent computing module. Moreover, optical devices are used to construct an optical matrix in the silicon photonic artificial intelligence chip, and light is used to complete linear operations that account for more than 90% of the computational load in the artificial intelligence algorithm. In addition, photons are used inside the chip to transmit and calculate information, and the calculation is completed in the process of light transmission through the chip. It has extremely high computing power and extremely low power consumption. Compared with electronic computing chips, the computing power and power consumption have advantages of dozens of times, and there is no delay.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon photonic intelligent computing module, characterized in that: include: A tube shell (1), wherein a ceramic packaging board (5) is built in the tube shell (1), an optical chip (6) is arranged on the ceramic packaging board (5), a laser chip (10) is arranged on the optical chip (6), a plurality of spherical grids (12) are arranged on the ceramic packaging board (5), and gold wires (13) are connected between the spherical grids (12) and the optical chip (6).

2. The silicon photonic intelligent computing module according to claim 1, characterized in that: The ceramic packaging board (5) is also integrated with a driver chip (2), a CDR chip (3) and a TIA chip (4).

3. The silicon photonic intelligent computing module according to claim 1, characterized in that: A total reflection mirror (7) and a lens combination (9) are also mounted on the optical chip (6).

4. The silicon photonic intelligent computing module according to claim 3, characterized in that: The optical chip (6) is also integrated with a grating coupling (8) located at the side of the total reflection mirror (7).

5. The silicon photonic intelligent computing module according to claim 1, characterized in that: The ceramic packaging board (5) is also integrated with an edge coupling (11).

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