Material box of semiconductor structure
By designing the limit device in the semiconductor structure, the problem of the lid and the slipping of the ear lid and the in the operation of the semiconductor structure is solved, and the semiconductor structure is a safe cover and convenient collection of the semiconductor structure.
Patent Information
- Application Number
- CN202310938713.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-27
- Publication Date
- 2025-01-28
AI Technical Summary
The material box of the existing semiconductor structure can easily cause the ear cover to slide during the cap sealing and removal operations, causing the risk of the semiconductor structure to slide, and it is troublesome to operate.
A semiconductor box is designed, which uses a limit device, including the first limits, the second limit component, and the driver component. Through the driver of the drive component, the limited part can be moved to the opening, and the entrance is at its own mouth. Move the cover and remove the semiconductor structure.
Through the setting of the limit device, the semiconductor structure is effectively prevented from slipping, the operation of the block and the removal is simplified, and the safety and convenience of use is improved.
Smart Images
Figure CN119381304A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of semiconductor equipment, and in particular to a material box of a semiconductor structure. Background Art
[0002] In the semiconductor industry, it is common to use a material box to carry and transport semiconductor structures to prevent the semiconductor structures (such as bare chip structures welded on the lead frame) from being damaged. In the related art, after the semiconductor structure enters the material box, two ear covers need to be covered at both ends of the material box to prevent the lead frame from falling out of the material box. However, in this structure, the ear covers are easy to slip off, so that the semiconductor structure is at risk of slipping out of the material box, and the operation of closing and removing the ear covers is relatively troublesome. Summary of the invention
[0003] An embodiment of the present application provides a material box of a semiconductor structure, wherein the material box of the semiconductor structure comprises:
[0004] The material box body has a receiving cavity located inside, the material box body has two ends which are separated from each other in the length direction, and the receiving cavity has a first opening and a second opening respectively located at the two ends;
[0005] A limiting device is provided on the material box body, comprising a first limiting member, a second limiting member, and a driving assembly drivingly connected to the first limiting member and the second limiting member; under the drive of the driving assembly, the first limiting member can move to the first opening, the second limiting member can move to the second opening, and the first limiting member can move away from the first opening, and the second limiting member can move away from the second opening;
[0006] Wherein, when the first limiting member moves to the first opening and the second limiting member moves to the second opening, the semiconductor structure in the accommodating cavity can be limited in the accommodating cavity; when the first limiting member moves away from the first opening and the second limiting member moves away from the second opening, the semiconductor structure can move into the accommodating cavity from one of the first opening and the second opening, or move out of the accommodating cavity from the first opening and the second opening.
[0007] In some embodiments, the first limit member and the second limit member are rotatably provided on the material box body, and the driving component drives the first limit member and the second limit member to rotate, so that the first limit member moves to the first opening, the second limit member moves to the second opening, or the first limit member moves away from the first opening, and the second limit member moves away from the second opening.
[0008] In some embodiments, the limiting device further includes a transmission assembly, wherein the transmission assembly is connected between the driving assembly and the first limiting member, and between the driving assembly and the second limiting member.
[0009] In some embodiments, the material box body has a first wall for forming the accommodating cavity, and a second wall and a third wall connected to the first wall and opposite sides, the driving assembly and the transmission assembly are both arranged on the first wall, and the first limiter and the second limiter are rotatably arranged on the first wall through a rotating shaft respectively;
[0010] Wherein, when the first limit member moves away from the first opening, the first limit member is located outside one end portion of the second wall and the third wall; when the second limit member moves away from the second opening, the second limit member is located outside one end portion of the second wall and the third wall.
[0011] In some embodiments, the first wall is a top wall of a magazine of the semiconductor structure.
[0012] In some embodiments, the driving assembly includes a driving gear, the rotating shaft of the first position-limiting member is provided with a first driven gear, and the rotating shaft of the second position-limiting member is provided with a second driven gear;
[0013] The transmission assembly includes a first transmission assembly connected between the driving gear and the first driven gear, and a second transmission assembly connected between the driving gear and the second driven gear; when the driving gear rotates, the first driven gear rotates to drive the first limiting member to rotate, and the second driven gear rotates to drive the second limiting member to rotate through the transmission of the first transmission assembly and the second transmission assembly.
[0014] In some embodiments, the driving assembly further comprises an operating member connected to the driving gear, and the operating member can drive the driving gear to rotate in a first direction or in a second direction opposite to the first direction when subjected to an external force.
[0015] In some embodiments, the operating member is a rotatable operating handle, and the operating handle has different first positions and second positions; when the operating handle is rotated to the first position, the first limit member is outside the first opening, and the second limit member is outside the second opening; when the operating handle is rotated to the second position, the first limit member is located at the first opening, and the second limit member is located at the second opening.
[0016] In some embodiments, at least one of the second wall and the third wall is provided with a first receiving groove and a second receiving groove extending along the height direction of the material box of the semiconductor structure, the first receiving groove and the second receiving groove are respectively close to the two ends of the length direction of the material box of the semiconductor structure, and one of them is used to receive the first limit member, and the other is used to receive the second limit member.
[0017] In some embodiments, the operating handle also has a third position, and the third position and the second position are located on opposite sides of the first position. When the operating handle is located at the third position, one of the first limiting member and the second limiting member is located in the first receiving groove, and the other is located in the second receiving groove.
[0018] The main technical effects achieved by the embodiments of the present application are:
[0019] The material box provided in the embodiment of the present application is provided with a limiting device on the material box body, wherein the limiting device includes a first limiting member, a second limiting member, and a driving assembly connected to the first limiting member and the second limiting member; under the drive of the driving assembly, the first limiting member can move to the first opening, the second limiting member can move to the second opening, and the first limiting member can move away from the first opening, and the second limiting member can move away from the second opening; when the first limiting member moves to the first opening and the second limiting member moves to the second opening, the semiconductor structure in the accommodating cavity can be limited in the accommodating cavity, and when the first limiting member moves away from the first opening and the second limiting member moves away from the second opening, the semiconductor structure can move into the accommodating cavity from one of the first opening and the second opening, or move out of the accommodating cavity from the first opening and the second opening. The setting of the limiting device facilitates the capping and removal of the semiconductor structure at the first opening and the second opening, and can prevent the semiconductor structure from slipping. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 is a three-dimensional structural diagram of a material box of a semiconductor structure provided by an exemplary embodiment of the present application;
[0021] Figure 2 and Figure 3 yes Figure 1 A schematic diagram showing that the first stopper and the second stopper of the material box of the semiconductor structure are located at different positions respectively;
[0022] Figure 4 It is a three-dimensional structural diagram of another semiconductor structure material box provided by an exemplary embodiment of the present application. DETAILED DESCRIPTION
[0023] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.
[0024] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.
[0025] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".
[0026] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0027] The embodiment of the present application provides a material box of a semiconductor structure. The material box of the semiconductor structure includes a material box body and a limiting device. The material box body has an internal accommodating cavity, the material box body has two ends that are mutually opposed in the length direction L, and the accommodating cavity has a first opening and a second opening respectively located at the two ends; the limiting device is arranged on the material box body, including a first limiting member, a second limiting member, and a driving component connected to the first limiting member and the second limiting member; under the drive of the driving component, the first limiting member can move to the first opening, the second limiting member can move to the second opening, and the first limiting member can move away from the first opening, and the second limiting member can move away from the second opening; when the first limiting member moves to the first opening and the second limiting member moves to the second opening, the semiconductor structure in the accommodating cavity can be limited to the accommodating cavity, and when the first limiting member moves away from the first opening and the second limiting member moves away from the second opening, the semiconductor structure can move into the accommodating cavity from one of the first opening and the second opening, or move out of the accommodating cavity from the first opening and the second opening. The arrangement of the upper limit device on the material box of the semiconductor structure facilitates the sealing and removal of the semiconductor structure at the first opening and the second opening, and can prevent the semiconductor structure from slipping.
[0028] The following is combined with Figures 1 to 4 The material box of the semiconductor structure is described in detail.
[0029] First, please refer to Figure 1 , and when necessary, combine Figure 2 and Figure 4 As shown, a semiconductor structure material box 100, the semiconductor structure material box 100 comprises a material box body 10 and a limiting device. The material box body 10 has an internal accommodating cavity 1003, the material box body 10 has two ends that are separated from each other in the length direction L, and the accommodating cavity 1003 has a first opening 1001 and a second opening 1002 respectively located at the two ends.
[0030] The limiting device is provided on the magazine body 10, and includes a first limiting member 21, a second limiting member 22, and a driving assembly 23 drivingly connected to the first limiting member 21 and the second limiting member 22. Under the drive of the driving assembly 23, the first limiting member 21 can move to the first opening 1001, the second limiting member 22 can move to the second opening 1002, and the first limiting member 21 can move away from the first opening 1001, and the second limiting member 22 can move away from the second opening 1002. When the first limiting member 21 moves to the first opening 1001 and the second limiting member 22 moves to the second opening 1002, the semiconductor structure in the accommodating cavity 1003 can be limited in the accommodating cavity 1003; when the first limiting member 21 moves away from the first opening 1001 and the second limiting member 22 moves away from the second opening 1002, the semiconductor structure can move into the accommodating cavity 1003 from one of the first opening 1001 and the second opening 1002, or move out of the accommodating cavity 1003 from the first opening 1001 and the second opening 1002.
[0031] Here, the first stopper 21 moving to the first opening 1001 can be understood as the first stopper 21 at least blocking the middle area of the first opening 1001, for example Figure 2 Similarly, the second stopper 22 moving to the second opening 1002 can be understood as the second stopper at least blocking the middle area of the second opening 1002, such as Figure 2 That is, the first limiting member 21 and the second limiting member 22 move to a position where they can limit the semiconductor structure in the accommodating cavity 1003 and prevent the semiconductor structure from falling out of the accommodating cavity 1003 .
[0032] The first limiting member 21 moving away from the first opening 1001 mentioned here can be understood as the first limiting member 21 moving from the middle area of the first opening 1001 to the edge area (for example Figure 1 shown in the position) or move to the outside of the cartridge body 10 (e.g. Figure 3 Similarly, the second stopper 22 moves away from the second opening 1002, which can be understood as the second stopper 22 moving from the middle area of the second opening 1002 to the edge area (such as Figure 1 shown in the position) or move to the outside of the cartridge body 10 (e.g. Figure 3 The position shown in the figure) does not hinder the position where the semiconductor structure passes through the second opening 1002.
[0033] Here, the first limiting member 21 and the second limiting member 22 may be as follows Figure 1The bent rod-shaped limiting structure shown, the first limiting member 21 and the second limiting member 22 have simple structures, are easy to manufacture, move and operate, and are relatively cost-effective. Of course, in some other embodiments, the first limiting member and the second limiting member can also be plate-shaped or other shaped structures that can limit the semiconductor structure located in the accommodating cavity 1003.
[0034] like Figure 1 As shown, in some embodiments, the first limiting member 21 and the second limiting member 22 are rotatably provided on the material box body 10, and the driving assembly 23 drives the first limiting member 21 and the second limiting member 22 to rotate, so that the first limiting member 21 moves to the first opening 1001, the second limiting member 22 moves to the second opening 1002, or the first limiting member 21 moves away from the first opening 1001, and the second limiting member 22 moves away from the second opening 1002.
[0035] The first limiting member 21 and the second limiting member 22 may include a limiting body and a connecting portion connecting the limiting body and the driving assembly 23. Figure 1 The second limiting member 22 shown in the figure includes a limiting body 221 and a connecting portion 222. The driving assembly 23 drives the connecting portion to rotate, so that the limiting body rotates with the rotation of the connecting portion. The limiting body is mainly used to limit the semiconductor structure located in the accommodating cavity 1003.
[0036] It is understandable that in some other embodiments, the first limiting member and the second limiting member may also be moved to the first opening and the second opening, or moved away from the first opening and the second opening, by other means such as translation.
[0037] In some embodiments, the limiting device further comprises a transmission assembly connected between the driving assembly 23 and the first limiting member 21 , and between the driving assembly 23 and the second limiting member 22 .
[0038] The transmission assembly mentioned here can be a transmission gear assembly, or a combination structure formed by a transmission gear and a connecting rod and other structures.
[0039] In some embodiments, the material box body 10 has a first wall 101 for forming the accommodating cavity 1003, and a second wall 102 and a third wall 103 connected to the first wall 101 and the opposite sides. The driving assembly 23 and the transmission assembly are both arranged on the first wall 101, and the first limit member 21 and the second limit member 22 are rotatably arranged on the first wall 101 through the rotating shaft 2101 respectively.
[0040] When the first limiting member 21 moves away from the first opening 1001, the first limiting member 21 is located outside one end portion between the second wall 102 and the third wall 103; when the second limiting member 22 moves away from the second opening 1002, the second limiting member 22 is located outside one end portion between the second wall 102 and the third wall 103.
[0041] In some embodiments, the first wall 101 is the top wall of the semiconductor structure material box 100. The first wall 101 is the top wall, which is convenient for the arrangement of the limiting device and the driving component 23 to perform the driving operation.
[0042] In some embodiments, the driving assembly 23 includes a driving gear 231 , a first driven gear 210 is disposed on the rotating shaft of the first limiting member 21 , and a second driven gear 220 is disposed on the rotating shaft of the second limiting member 22 .
[0043] The transmission assembly includes a first transmission assembly 31 connected between the driving gear 231 and the first driven gear 210, and a second transmission assembly 32 connected between the driving gear 231 and the second driven gear; when the driving gear 231 rotates, the first driven gear rotates to drive the first limit member 21 to rotate, and the second driven gear 220 rotates to drive the second limit member 22 to rotate through the transmission of the first transmission assembly 31 and the second transmission assembly 32.
[0044] like Figure 1 As shown, the first transmission assembly 31 includes a transmission rod 313, transmission gears 311 and 314 rotatably disposed at both ends of the transmission rod 313, and a mounting shaft 312. The transmission gear 314 meshes with the first driven gear 210, and the transmission gear 311 meshes with the driving gear 231. The transmission rod 313 is rotatably mounted on the first wall 101 through the mounting shaft 312.
[0045] The second transmission assembly 32 includes a transmission rod 323, transmission gears 321 and 324 rotatably disposed at both ends of the transmission rod 323, and a mounting shaft 322. The transmission gear 324 meshes with the second driven gear 220, and the transmission gear 321 meshes with the driving gear 231. The transmission rod 323 is rotatably mounted on the first wall 101 via the mounting shaft 322.
[0046] It should be noted that the first position-limiting member 21 and the second position-limiting member 22 are driven to move synchronously by the same driving assembly 23, and the overall structure of the driving assembly is relatively simple, and the driving operation is also relatively simple. In some other embodiments, the driving assembly may also include two driving structures for driving the first position-limiting member and the second position-limiting member to move, respectively, so as to drive the first position-limiting member and the second position-limiting member to move.
[0047] In some embodiments, the driving assembly 23 further includes an operating member connected to the driving gear 231 , and the operating member can drive the driving gear 231 to rotate along a first direction R1 or a second direction R2 opposite to the first direction R1 when subjected to an external force.
[0048] In some embodiments, the operating member is a rotatable operating handle 232, and the operating handle 232 has different first positions and second positions. When the operating handle 232 is rotated to the first position, the first limiting member 21 is outside the first opening 1001, and the second limiting member 22 is outside the second opening 1002. When the operating handle 232 is rotated to the second position, the first limiting member 21 is located at the first opening 1001, and the second limiting member 22 is located at the second opening 1002.
[0049] for example Figure 1 As shown, the position of the operating handle 232 may be the first position. Figure 2 As shown, the position of the operating handle 232 is the second position.
[0050] In some embodiments, at least one of the second wall 102 and the third wall 103 is provided with two receiving grooves extending along the height direction H of the semiconductor structure magazine 100 to receive the first limiting member 21 and the second limiting member 22 respectively.
[0051] like Figures 1 to 3 As shown, the second wall 102 is provided with a first receiving groove 1021 extending along the height direction H of the semiconductor structure magazine 100. The third wall 103 is provided with a second receiving groove 1022 extending along the height direction H of the semiconductor structure magazine 100. The first receiving groove 1021 and the second receiving groove 1022 are respectively close to the two ends of the length direction L of the semiconductor structure magazine 100, and the first receiving groove 1021 is used to receive the first limiter 21, and the second receiving groove 1022 is used to receive the second limiter 22.
[0052] In some embodiments, the operating handle also has a third position, and the third position and the second position are located on opposite sides of the first position. When the operating handle is located at the third position, one of the first limiting member 21 and the second limiting member 22 is located in the first receiving groove 1021, and the other is located in the second receiving groove 1022.
[0053] for example Figure 3 As shown, the position of the operating handle 232 may be the third position.
[0054] Combination Figures 1 to 3As shown, based on the above description of the semiconductor structure cartridge 100, during use of the semiconductor structure cartridge 100, the initial position of the operating handle 232 can be as follows: Figure 3 The operating handle 232 is in the third position as shown. When the operating handle is in this position, the first limiting member 21 and the second limiting member 22 are in the storage state. The operating handle 232 can rotate from the initial position along the first direction R1 to the position as shown. Figure 1 The operating handle 232 can be moved from the second position to the first position and the third position along the second direction R2. Figure 1 The first position shown is the middle position. When the operating handle 232 is in the middle position, the semiconductor structure can be loaded into or removed from the material box 100. Figure 2 In the second position shown, the first limiting member 21 and the second limiting member 22 are located in the middle regions of the first opening 1001 and the second opening 1002 respectively, that is, at the positions for shielding the semiconductor structure.
[0055] It is understandable that the operating handle 232 can also move or stay at any position between the second position and the third position other than the first position.
[0056] It should be noted that if Figures 1 to 3 In the illustrated embodiment, the first limiting member 21 and the second limiting member 22 rotate in the same direction during operation, and the first limiting member 21 and the second limiting member 22 are received outside two different second walls 102 and third walls 103 .
[0057] In some other embodiments, the first stopper and the second stopper can also be arranged to rotate in opposite directions, and when stored, they are stored outside the same wall of the second wall 102 and the third wall 103. Accordingly, the driving gear 231 can be arranged as two meshing gears, and the two gears are respectively used to drive the first stopper 21 to rotate and the second stopper 22 to rotate. The operating handle can be arranged on one of the gears and rotate synchronously with the arranged gear.
[0058] In addition, if Figure 4 As shown, in other embodiments, the semiconductor structure material box 200 may also have two limiting structures 40, which are used to position the operating handle 232 at the second position and the third position respectively. The limiting structure may be a limiting button, which is in a pressed state during the rotation of the operating handle 232, and does not hinder the rotation of the operating handle 232. When the operating handle 232 is at the second position or the third position, it pops up accordingly to limit the operating handle 232.
[0059] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.
[0060] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.
[0061] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.
Claims
1. A material box of a semiconductor structure, characterized in that: The semiconductor structure material box comprises: The material box body has a receiving cavity located inside, the material box body has two ends which are separated from each other in the length direction, and the receiving cavity has a first opening and a second opening respectively located at the two ends; A limiting device is provided on the material box body, comprising a first limiting member, a second limiting member, and a driving assembly drivingly connected to the first limiting member and the second limiting member; under the drive of the driving assembly, the first limiting member can move to the first opening, the second limiting member can move to the second opening, and the first limiting member can move away from the first opening, and the second limiting member can move away from the second opening; Wherein, when the first limiting member moves to the first opening and the second limiting member moves to the second opening, the semiconductor structure in the accommodating cavity can be limited in the accommodating cavity; when the first limiting member moves away from the first opening and the second limiting member moves away from the second opening, the semiconductor structure can move into the accommodating cavity from one of the first opening and the second opening, or move out of the accommodating cavity from the first opening and the second opening.
2. The semiconductor structure material box according to claim 1, characterized in that: The first limit member and the second limit member are rotatably arranged on the material box body, and the driving component drives the first limit member and the second limit member to rotate, so that the first limit member moves to the first opening, the second limit member moves to the second opening, or the first limit member moves away from the first opening, and the second limit member moves away from the second opening.
3. The semiconductor structure material box according to claim 2, characterized in that: The limiting device further includes a transmission assembly, and the transmission assembly is connected between the driving assembly and the first limiting member, and between the driving assembly and the second limiting member.
4. The semiconductor structure material box according to claim 3, characterized in that: The material box body has a first wall for forming the accommodating cavity, and a second wall and a third wall connected to the first wall and two opposite sides, the driving assembly and the transmission assembly are both arranged on the first wall, and the first limiting member and the second limiting member are rotatably arranged on the first wall through a rotating shaft respectively; Wherein, when the first limit member moves away from the first opening, the first limit member is located outside one end portion of the second wall and the third wall; when the second limit member moves away from the second opening, the second limit member is located outside one end portion of the second wall and the third wall.
5. The semiconductor structure material box according to claim 4, characterized in that: The first wall is a top wall of the material box of the semiconductor structure.
6. The semiconductor structure material box according to claim 4, characterized in that: The driving assembly comprises a driving gear, the rotating shaft of the first position-limiting member is provided with a first driven gear, and the rotating shaft of the second position-limiting member is provided with a second driven gear; The transmission assembly includes a first transmission assembly connected between the driving gear and the first driven gear, and a second transmission assembly connected between the driving gear and the second driven gear; when the driving gear rotates, the first driven gear rotates to drive the first limiting member to rotate, and the second driven gear rotates to drive the second limiting member to rotate through the transmission of the first transmission assembly and the second transmission assembly.
7. The semiconductor structure material box according to claim 6, characterized in that: The driving assembly further comprises an operating member connected to the driving gear, and the operating member can drive the driving gear to rotate in a first direction or in a second direction opposite to the first direction when subjected to an external force.
8. The semiconductor structure material box according to claim 7, characterized in that: The operating member is a rotatable operating handle, and the operating handle has different first positions and second positions; when the operating handle is rotated to the first position, the first limit member is outside the first opening, and the second limit member is outside the second opening; when the operating handle is rotated to the second position, the first limit member is located at the first opening, and the second limit member is located at the second opening.
9. The semiconductor structure material box according to claim 8, characterized in that: At least one of the second wall and the third wall is provided with a first receiving groove and a second receiving groove extending along the height direction of the material box of the semiconductor structure, the first receiving groove and the second receiving groove are respectively close to the two ends of the material box of the semiconductor structure in the length direction, and one of them is used to receive the first limiting member, and the other is used to receive the second limiting member.
10. The semiconductor structure material box according to claim 9, characterized in that: The operating handle also has a third position, and the third position and the second position are located on opposite sides of the first position. When the operating handle is located at the third position, one of the first limiting member and the second limiting member is located in the first receiving groove, and the other is located in the second receiving groove.