Mechanical arm with vibration detection and image recognition functions

Abstract

The invention relates to a mechanical arm with vibration detection and image recognition functions. The main structure comprises a wafer carrying device, a mechanical arm pivoted on the wafer carrying device, an image acquisition device arranged on the mechanical arm, at least one first vibration sensor arranged on the mechanical arm, a second vibration sensor arranged in the wafer carrying device, and a monitoring device arranged on one side of the wafer carrying device. And the monitoring device comprises a state detection part which is in information connection with the image acquisition device, and a vibration detection part which is in information connection with the first vibration sensor and the second vibration sensor. By means of the structure, the mechanical arm has the functions of wafer storage state detection, collision sensing, service life prediction and the like, mutual influence of factors such as unstable action of a mechanical structure and detection errors is avoided, and then moving and judging accuracy is improved.

Description

Technical Field

[0001] The present invention provides a robotic arm with vibration detection and image recognition, which enables the robotic arm to have the functions of wafer storage status detection, collision sensing, and life prediction. Background Art

[0002] Before removing the wafers, it is necessary to confirm whether the wafers assembled in the wafer cassette are in any bad storage conditions such as missing, overlapping, skewed or warped to avoid damaging the wafers during the placement and loading process. Therefore, the storage status of the wafers in the wafer cassette will be detected before all the wafers in the wafer cassette are removed. If a wafer is in a bad configuration state, the placement and loading will be suspended until the user can resolve the error state.

[0003] Furthermore, the wafer manufacturing process involves multiple steps, and robotic arms must be used to move wafers between different devices. While there are known methods for detecting the accuracy of robotic arm movements to prevent accidental damage to the wafers, there is generally no monitoring equipment that can ensure the frequency and behavior of the mechanical movements themselves. Therefore, it is impossible to prevent the risk of wafer quality being affected by abnormal mechanical movements.

[0004] Therefore, abnormal movement of the robotic arm may increase the probability of wafer damage during wafer handling, or cause problems such as reduced mechanical operation efficiency or even abnormal movement, thereby affecting the detection of the storage status of the wafers in the wafer boat box. Conversely, the accuracy of identifying the wafer storage status will also affect the movement frequency, path planning, and operation efficiency of the robotic arm.

[0005] However, the above-mentioned robotic arm has the following problems and deficiencies when in use and needs to be improved:

[0006] The failure to integrate the detection of wafer storage status and the judgment of abnormal mechanical movement itself has led to the mutual influence of unstable mechanical structure movement and detection errors.

[0007] Therefore, how to solve the above-mentioned conventional problems and deficiencies has become a research direction that the applicant of the present invention and related manufacturers engaged in this industry are eager to study and improve. Summary of the Invention

[0008] Therefore, in view of the above-mentioned deficiencies, the applicant of the present invention has collected relevant information, conducted multiple evaluations and considerations, and, drawing on years of experience accumulated in this industry, through continuous trials and modifications, has finally designed this invention patent for a robotic arm with vibration detection and image recognition, which enables the robotic arm to have the functions of wafer storage status detection, collision sensing, and life prediction.

[0009] The main purpose of the present invention is to utilize an image capture device and first and second vibration sensors to enable a robotic arm to have the functions of wafer storage status detection, collision sensing, and life prediction, thereby avoiding the mutual influence of factors such as unstable mechanical structure movement and detection error, thereby improving movement and judgment accuracy.

[0010] To achieve the above-mentioned purpose, the main structure of the present invention includes: a wafer handling device, a robotic arm, an image capture device, at least a first vibration sensor, a second vibration sensor, a monitoring device, a status detection unit, and a vibration detection unit, wherein the robotic arm is pivotally mounted on the wafer handling device, the image capture device is mounted on the robotic arm, and its image capture direction is consistent with the grasping direction of the robotic arm to obtain a wafer image, the first vibration sensor is mounted on the robotic arm, the second vibration sensor is mounted in the wafer handling device, the monitoring device is mounted on one side of the wafer handling device, the status detection unit information is connected to the image capture device, and the vibration detection unit information is connected to the first vibration sensor and the second vibration sensor, and the status detection unit determines the storage status of the wafer according to the wafer image, and the storage status includes missing wafers, skewed wafers, overlapping wafers, position and edge bending.

[0011] During use, an image capture device is installed on the robotic arm of the wafer handling device, so that the image capture direction is consistent with the gripping direction of the robotic arm. Before each wafer is gripped, the status detection unit of the monitoring device and the wafer image of each wafer can be used to determine whether the storage status of each wafer is normal. During the use of the robotic arm, the first vibration sensor, the second vibration sensor and the vibration detection unit provide functions such as detecting collisions of the robotic arm, predicting vibrations of wafers on the robotic arm, detecting the operating status of the wafer handling device, and predicting the life of components. The monitoring device also integrates abnormal conditions to avoid the mutual influence of unstable mechanical structure movement and detection errors, thereby improving movement and judgment accuracy.

[0012] Through the above technology, it is possible to overcome the problem that conventional robotic arms fail to integrate the detection of wafer storage status with the judgment of abnormal mechanical movements themselves, resulting in the mutual influence of unstable mechanical structure movements and detection errors, thereby achieving the practical progress of the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional perspective view of a preferred embodiment of the present invention.

[0014] Figure 2 Schematic diagram of wafer storage status according to a preferred embodiment of the present invention.

[0015] Figure 3 Schematic diagram of vibration monitoring according to a preferred embodiment of the present invention.

[0016] Figure 4 This is a schematic diagram of another preferred embodiment of the present invention.

[0017] Figure 5 FIG. 1 is a schematic diagram of a wafer contour image according to another preferred embodiment of the present invention.

[0018] Figure 6 This is an exploded view of another preferred embodiment of the present invention.

[0019] Figure 7 This is a schematic diagram of another preferred embodiment of the present invention. DETAILED DESCRIPTION

[0020] In order to achieve the above-mentioned objectives and effects, the technical means and structures adopted by the present invention are illustrated below to illustrate the features and functions of the preferred embodiment of the present invention in detail for a complete understanding.

[0021] See also Figures 1 to 3 As shown, it is a three-dimensional perspective view and a vibration monitoring schematic diagram of a preferred embodiment of the present invention. It can be clearly seen from the figure that the present invention includes:

[0022] A wafer handling device 1, in this embodiment, a wafer conveyor (Equipment Front End Module, EFEM) is used as an example;

[0023] a robotic arm 2 pivotally mounted on the wafer handling device 1 for grabbing a wafer 9;

[0024] An image capture device 3 is provided on the robot arm 2, and its image capture direction is consistent with the gripping direction of the robot arm 2, so as to obtain a wafer image 91. In this embodiment, the image capture device 3 is exemplified by a camera;

[0025] At least one first vibration sensor 21 is provided on the robotic arm 2;

[0026] a second vibration sensor 11 disposed within the wafer handling device 1. In this embodiment, the first vibration sensor 21 and the second vibration sensor 11 are exemplified by relative electric sensors, which are primarily single free oscillation systems composed of a spring, a damper, and an inertial mass. Their primary function is to monitor the vibration of rotating machinery. Each device has its own vibration threshold, and exceeding the threshold indicates a machine malfunction.

[0027] A monitoring device 4 is provided on one side of the wafer handling device 1 and includes a status detection unit 41 connected to the image capture device 3 and a vibration detection unit 42 connected to the first vibration sensor 21 and the second vibration sensor 11. The status detection unit 41 determines the storage status of the wafer 9 based on the wafer image 91. The storage status includes missing wafers, skewed wafers, overlapped wafers, position, and edge bending. In this embodiment, the monitoring device 4 is exemplified by a human-machine interface provided on the wafer handling device 1, and the status detection unit 41 and the vibration detection unit 42 are exemplified by processors in the human-machine interface.

[0028] Through the above description, the structure of the present technology can be understood, and according to the corresponding coordination of this structure, the robot arm 2 can also have the functions of wafer 9 storage status detection, collision sensing, and life prediction. When the above components are assembled, it can be clearly seen from the figure that structurally, only an image capture device 3 is needed to be fixed on the robot arm 2 of the wafer handling device 1, and the wafer handling device 1 controls the image capture device 3. When setting, the image capture direction of the image capture device 3 is kept consistent with the grasping direction of the robot arm 2. In this way, no matter in which direction or at which height position the robot arm 2 is about to grasp the wafer 9, the image capture device 3 will move and swing synchronously with the robot arm 2, so the storage status of the wafer 9 can be simply identified through a single set of image capture devices 3.

[0029] In actual use, before the robot arm 2 actually grabs, it is first prepared to store multiple wafers 9 and confirm that there is no abnormal storage state for identification, so as to provide the comparison data of the standard storage state to the state detection unit 41 in advance. Similarly, other possible abnormal storage states are also stored in the state detection unit 41. Figure 2 Shown are wafer images 91 of various abnormal storage states, where Figure 2 (A) is a schematic diagram of the tilted storage state of wafer 9, Figure 2 (B) is a schematic diagram of the overlapping storage state of wafer 9, Figure 2 (C) is a schematic diagram of the storage state of wafer 9 when the wafer is missing. Figure 2 (D) is a schematic diagram of the warped storage state of wafer 9.

[0030] As for vibration sensing, the first vibration sensors 21 of this embodiment are respectively arranged at the middle section and the end of the robot arm 2, so the number is four. The robot arm 2 of this embodiment is a double-layer design, so the number can be eight. Even two first vibration sensors 21 can be arranged on a multi-axis arm that is prone to collision, so the total number can be ten. The second vibration sensor 11 is arranged on the lifting mechanism of the wafer handling device 1 to monitor whether there is any installation or setting abnormality of the component (the frequency stably exceeds the standard), whether the part is aging (the frequency gradually exceeds the standard), and whether there is any external force collision (the frequency exceeds the standard instantaneously) by detecting changes in the vibration frequency behavior of the two. Figure 3 (A) abnormal operation, Figure 3 (B) lifespan abnormalities, and Figure 3 (C) Abnormal external force.

[0031] Finally, monitoring device 4 collects and records all sensor data to ensure the quality and safety of wafer 9 transport by robotic arm 2. While ensuring the quality of wafer 9 is not affected, it also monitors the condition of wafer handling device 1 and robotic arm 2 to perform preventive repairs and maintenance. Thus, pre-checking the storage status of wafer 9 before robotic arm 2 grabs it can prevent damage to wafer 9 caused by improper grabbing or accidental collisions by robotic arm 2. It also prevents robotic arm 2 from finding it unable to grab a wafer 9 when it moves to it, thereby reducing unnecessary displacement of robotic arm 2 and indirectly extending the service life of wafer handling device 1. Conversely, by utilizing functions such as detecting collisions with robotic arm 2, predicting vibrations of wafer 9 on robotic arm 2, monitoring the operating status of wafer handling device 1, and predicting the life of components, it is possible to avoid misjudging the storage status of wafer 9 or damaging the wafer 9 itself due to unstable mechanical movements during the wafer 9 handling process.

[0032] Please also refer to Figure 4 and Figure 5 As shown in the figure, it is a schematic diagram of the implementation of another preferred embodiment of the present invention and a schematic diagram of the wafer contour image. It can be clearly seen from the figure that this embodiment is similar to the above embodiment, except that a flash device 5 is provided on one side of the image capture device 3, and its lighting direction is consistent with the image capture direction, and the image capture device 3 is driven when it is actuated. When the light hits the wafer 9, a reflective contour 92 is generated on the wafer 9, and a wafer contour image 93 is captured by the image capture device 3. At least one first angle adjustment member 31 is provided on the image capture device 3, and at least one second angle adjustment member 51 is provided on the flash device 5.

[0033] The image capture device 3 and the flash device 5 are also controlled by the wafer handling device 1. Based on the consistency of the image capture direction of the image capture device 3 and the grasping direction of the robot arm 2, the lighting direction of the flash device 5 is also consistent with the image capture direction. This allows the flash device 5 to move and swing synchronously with the robot arm 2. Therefore, the storage status of the wafer 9 can be easily identified using a single set of image capture device 3 and flash device 5. After the flash device 5 is added, its identification action shines light on the wafer 9, creating a reflective outline 92 on the wafer 9. At the same time, the image capture device 3 is driven to capture an image of the reflective outline 92, as shown in FIG. Figure 5 As shown, the left side of the screen represents the capture range of the image capture device 3. The leading edge of the wafer 9 within the direct illumination range of the flash device 5 produces a reflective outline 92. The image capture device 3 captures this reflective outline 92, generating a wafer outline image 93 (as indicated by the dotted box). The status detection unit then compares the wafer outline image 93 with the standard storage state comparison data to determine the storage state of the wafer 9. The identification method of the flash device 5 simplifies the information content and amount of the comparison data. In particular, the use of the wafer outline image 93 to identify edge warpage allows for more accurate determination of abnormal storage conditions involving edge warpage.

[0034] Furthermore, in this embodiment, the first angle adjustment member 31 and the second angle adjustment member 51 are combined with a metal sheet and are each in the form of a hollow arc-shaped track, so that the angle positions of the image capture device 3 and the flash device 5 can be freely adjusted using screws. Moreover, since only one flash device 5 is required in the present invention, the angle adjustment action is very simple, and there is no need to synchronize and align with other light sources, nor is there any need to worry about shadows affecting the recognition accuracy.

[0035] Please also refer to Figure 6 and Figure 7As shown in FIG. 1 , an exploded view and an implementation diagram of another preferred embodiment of the present invention are shown. It can be clearly seen from the figure that this embodiment is similar to the above embodiment, except that a protective housing 6 is provided on the robot arm 2, and the image capture device 3 and the flash device 5 are provided in the protective housing 6. In this embodiment, the image capture device 3 is provided in the protective housing 6 through the first angle adjustment member 31, and the flash device 5 is provided in the protective housing 6 through the second angle adjustment member 51. Therefore, the protective housing 6 has a first positioning hole 61, a second positioning hole 62, and at least A first arc-shaped hole 63 is formed on one side of the first positioning hole 61, and at least one second arc-shaped hole 64 is formed on one side of the second positioning hole 62. The first angle adjustment member 31 is provided on the protective shell 6 and has a first swing axis 311 locked in the first positioning hole 61, and at least one first adjustment portion 312 locked in the first arc-shaped hole 63. The second angle adjustment member 51 is provided on the protective shell 6 and has a second swing axis 511 locked in the second positioning hole 62, and at least one second adjustment portion 512 locked in the second arc-shaped hole 64.

[0036] Among them, the first swing axis 311 is locked on the first positioning hole 61 to serve as the positioning axis for fixing the image capture device 3 on the protective shell 6, and the first adjustment portion 312 is locked on the first arc hole 63 to serve as the second fixed point after adjusting the angle of the image capture device 3. Similarly, the second swing axis 511 is locked on the second positioning hole 62 to serve as the positioning axis for fixing the flash device 5 on the protective shell 6, and the second adjustment portion 512 is locked on the second arc hole 64 to serve as the second fixed point after adjusting the angle of the flash device 5. In other words, the configuration of this embodiment sets the image capture device 3 in the protective housing 6 via the first angle adjustment member 31, and sets the flash device 5 in the protective housing 6 via the second angle adjustment member 51. The protective housing 6 is a U-shaped metal housing. After being installed on the image capture device 3 and the flash device 5, it can be directly fixed on the robotic arm 2. It also has the advantages of simple structure and easy installation. In addition, the protective housing 6 can further provide the image capture device 3 and the flash device 5 with anti-collision, dust-proof and aesthetic effects.

[0037] However, the above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the contents of the description and drawings of the present invention should be included in the patent scope of the present invention and are hereby stated.

[0038] In summary, the present invention's robotic arm with vibration detection and image recognition capabilities is capable of achieving its intended purpose when in use. Therefore, the present invention is truly an invention of excellent practicality. In order to meet the application requirements for an invention patent, an application has been filed in accordance with the law. We hope that this invention will be approved as soon as possible to protect the applicant's hard work. If you have any questions, please feel free to write to us and we will do our best to cooperate. We are truly grateful for your assistance.

[0039] Explanation of symbols:

[0040] Wafer handling device: 1

[0041] Second shock sensor: 11

[0042] Robotic arms: 2

[0043] First vibration sensor: 21

[0044] Image capture device: 3

[0045] First angle adjustment piece: 31

[0046] First swing axis: 311

[0047] First adjustment unit: 312

[0048] Monitoring devices: 4

[0049] Status detection unit: 41

[0050] Vibration detection unit: 42

[0051] Flash device: 5

[0052] Second angle adjustment member: 51

[0053] Second swing axis: 511

[0054] Second adjustment unit: 512

[0055] Protective shell: 6

[0056] First positioning hole: 61

[0057] Second positioning hole: 62

[0058] First arc hole: 63

[0059] Second arc hole: 64

[0060] Wafer: 9

[0061] Wafer image:91

[0062] Reflective profile: 92

[0063] Wafer profile image:93.

Claims

1. A robotic arm with vibration detection and image recognition, characterized in that: Mainly include: a wafer handling device; a mechanical arm, pivotally mounted on the wafer handling device, for grabbing a wafer; An image capture device is disposed on the robot arm, and its image capture direction is consistent with the grasping direction of the robot arm, so as to obtain a wafer image; At least one first vibration sensor, disposed on the robotic arm; a second vibration sensor disposed in the wafer handling device; and A monitoring device is arranged on one side of the wafer handling device and includes a status detection unit whose information is connected to the image capture device and a vibration detection unit whose information is connected to the first vibration sensor and the second vibration sensor. The status detection unit determines the storage status of the wafer according to the wafer image, and the storage status includes missing wafers, tilted wafers, overlapped wafers, position and edge bending.

2. The robot arm with vibration detection and image recognition as claimed in claim 1, characterized in that: A flash device is provided on one side of the image capture device, and its lighting direction is consistent with the image capture direction, and the image capture device is driven when it is activated. When the light hits the wafer, a reflective contour is generated on the wafer, and the image capture device captures a wafer contour image.

3. The robot arm with vibration detection and image recognition as claimed in claim 1, wherein: The image capturing device is provided with at least one first angle adjusting member.

4. The robot arm with vibration detection and image recognition as claimed in claim 2, characterized in that: The flash device is provided with at least one second angle adjustment member.

5. The robot arm with vibration detection and image recognition as claimed in claim 2, wherein: A protective shell is arranged on the mechanical arm, and the image capturing device and the flash device are arranged in the protective shell.

6. The robot arm with vibration detection and image recognition as claimed in claim 5, characterized in that: The image capturing device has at least one first angle adjusting component arranged on the protective shell.

7. The robotic arm with vibration detection and image recognition as claimed in claim 6, wherein: The protective shell has a first positioning hole and at least one first arc hole formed on one side of the first positioning hole, and the first angle adjustment member has a first swing axis locked in the first positioning hole and at least one first adjustment portion locked in the first arc hole.

8. The robotic arm with vibration detection and image recognition as claimed in claim 5, wherein: The flash device has at least one second angle adjustment member arranged on the protective housing.

9. The robot arm with vibration detection and image recognition as claimed in claim 8, characterized in that: The protective shell has a second positioning hole and at least one second arc hole formed on one side of the second positioning hole, and the second angle adjustment member has a second swing axis locked in the second positioning hole and at least one second adjustment portion locked in the second arc hole.

Images