Vacuum wafer conveying mechanism and semiconductor detection equipment

Abstract

The invention discloses a vacuum wafer transfer mechanism and semiconductor detection equipment, the vacuum wafer transfer mechanism comprises a first fixing frame, a second fixing frame, a transfer assembly and a jacking mechanism, the first fixing frame is arranged in a buffer chamber, the second fixing frame is arranged in a main chamber, the transfer assembly is used for transferring wafers between the first fixing frame and the second fixing frame, and the jacking mechanism is used for jacking the wafers between the first fixing frame and the second fixing frame. The transferring assembly comprises a machine base and a rotating arm, the rotating arm is movably arranged on the machine base in the height direction, and the rotating arm is rotatably connected with the machine base; the jacking mechanism is arranged in the main cavity and comprises a driving assembly and a jacking block, and the driving assembly is used for driving the jacking block to ascend so as to jack the wafer upwards to be separated from the second fixing frame or driving the jacking block to descend so as to enable the wafer to fall onto the second fixing frame. According to the vacuum wafer conveying mechanism, the wafer is conveyed between the buffer chamber and the main chamber through single-shaft lifting of the transfer assembly, so that the probability of potential difference in the wafer conveying process is reduced, and the wafer conveying precision and the wafer conveying reliability are improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and in particular relates to a vacuum film transmission mechanism and semiconductor detection equipment. Background Art

[0002] During the semiconductor manufacturing and quality inspection process, wafer transfer in a vacuum environment is often involved, for example, transferring unprocessed wafers and processed wafers between a buffer chamber and a vacuum operation chamber. The accuracy of wafer transfer will affect product quality and production rate.

[0003] In the related art, the wafer transfer mechanism includes two lifting mechanisms respectively arranged in the buffer chamber and the vacuum operation chamber and a transfer arm arranged between the two chambers. The two lifting mechanisms are lifted synchronously to lift the wafer on the transfer arm or lower the wafer to the transfer arm.

[0004] However, the two lifting mechanisms may become asynchronous during long-term use, resulting in position differences of the wafers on both sides of the transfer arm, leading to a decrease in wafer transfer accuracy and reliability. Summary of the invention

[0005] The embodiments of the present application provide a vacuum wafer transfer mechanism and a semiconductor inspection device. The vacuum wafer transfer mechanism can realize the transfer of wafers between a buffer chamber and a main chamber by single-axis lifting of a transfer component, thereby avoiding the position difference that may occur in a dual-axis lifting condition and improving the wafer transfer accuracy and reliability.

[0006] In the first aspect, an embodiment of the present application provides a vacuum wafer transfer mechanism for transferring wafers between a buffer chamber and a main chamber, the vacuum wafer transfer mechanism comprising a first fixed frame, a second fixed frame, a transfer assembly and a lifting mechanism, the first fixed frame is arranged in the buffer chamber; the second fixed frame is arranged in the main chamber; the transfer assembly is used to transfer the wafer between the first fixed frame and the second fixed frame, the transfer assembly comprises a machine base and a rotary arm, the rotary arm is movably arranged on the machine base along the height direction, the rotary arm is rotatably connected to the machine base to drive the first receiving part to transfer between the first fixed frame and the second fixed frame; the lifting mechanism is arranged in the main chamber, the lifting mechanism comprises a driving assembly and a lifting block, the driving assembly is used to drive the lifting block to rise, so as to lift the wafer upward to make it separate from the second fixed frame, or drive the lifting block to descend, so that the wafer falls onto the second fixed frame.

[0007] In some embodiments, the first fixing frame includes a plurality of first ejector pins extending in a height direction, and the plurality of first ejector pins are arranged in an array to form a supporting surface, and / or the second fixing frame includes a plurality of second ejector pins extending in a height direction, and the plurality of second ejector pins are arranged in an array to form a supporting surface.

[0008] In some embodiments, the lifting mechanism further includes a guide structure extending in a height direction, and the driving assembly drives the lifting block to reciprocate along the guide structure.

[0009] In some embodiments, the guide structure includes a guide member slidably matched with the second ejector pin, the guide member is connected to the lifting block, and the guide member is slidably connected to the second ejector pin to limit the moving direction of the lifting block.

[0010] In some embodiments, the driving assembly includes a first driving member and an active block, the active block is transmission-connected to the lifting block, and the first driving member drives the active block to move along a first direction to drive the lifting block to move in a height direction.

[0011] In some embodiments, the first direction is a horizontal direction, the active block has a first inclined surface, and the lifting block has a second inclined surface, and the slope of the second inclined surface is consistent with that of the first inclined surface.

[0012] In some embodiments, the driving assembly includes a second driving member, an output end of the second driving member reciprocates along the height direction, and the output end of the second driving member is connected to the lifting block to drive the lifting block to move in the height direction.

[0013] In some embodiments, the swing arm includes a first supporting portion and a second supporting portion distributed along its length direction, and the ends of the two are connected to the rotating shaft of the swing arm. The first supporting portion and the second supporting portion are rotated and alternately located on the first fixed frame or the second fixed frame.

[0014] In some embodiments, the supporting surface of the first receiving portion is flush with the supporting surface of the second receiving portion, and the supporting surface of the first fixing frame is flush with the supporting surface of the second fixing frame.

[0015] In a second aspect, an embodiment of the present application provides a semiconductor testing device, the semiconductor testing device comprising the vacuum film transfer mechanism provided by any of the aforementioned embodiments.

[0016] The vacuum wafer conveying mechanism of the embodiment of the present application sets the first fixed frame and the second fixed frame between the buffer chamber and the main chamber in a relatively fixed form, and realizes the switching of the wafer between the transfer assembly and different chambers by lifting and lowering the transfer assembly in the height direction, thereby avoiding the asynchronous position difference that may occur during the lifting and lowering of the two chambers, and improving the accuracy and reliability of the wafer feeding process. The vacuum wafer conveying mechanism is also provided with a lifting mechanism in the main chamber, which can rise or fall relative to the second fixed frame to switch the position of the wafer between the second fixed frame and the lifting block, so as to reduce the interval time between the wafer conveying and the wafer detection process, and improve the efficiency of the wafer detection operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings: Figure 1 This is a schematic diagram of the structure of the vacuum film transmission mechanism of some embodiments of the present application; Figure 2 for Figure 1 A schematic diagram of a vacuum film transmission mechanism in use; Figure 3 for Figure 1 A schematic diagram of another use state of the vacuum film transmission mechanism shown; Figure 4 It is a schematic diagram of the structure of the vacuum film transmission mechanism of other embodiments of the present application; Figure 5 for Figure 4 A schematic diagram of a vacuum film transmission mechanism in use; Figure 6 for Figure 4 A schematic diagram of another use state of the vacuum film transmission mechanism shown; Figure 7 Schematic diagram of the structure of the vacuum film transfer mechanism of some other embodiments of the present application.

[0018] The reference numerals in the specific implementation manner are as follows: 01. Buffer chamber; 02. Main chamber; 110, first fixing frame; 111, first ejector pin; 120, second fixing frame; 121, second ejector pin; 210, machine base; 220, rotary arm; 221, first receiving portion; 222, second receiving portion; 310, lifting block; 321, first driving member; 322, second driving member; 330, active block. DETAILED DESCRIPTION

[0019] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0021] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0022] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0023] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0024] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0025] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0026] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0027] Due to the high precision requirements of semiconductor products, there are a large number of vacuum operation scenarios in the semiconductor preparation, processing and quality inspection process, and multiple wafer transfer processes are involved in a vacuum environment, such as transferring wafers to be processed or processed wafers between the buffer chamber and the main chamber for vacuum operation. Among them, the accuracy of wafer transfer will affect product quality and production rate.

[0028] In the related technology, the wafer transfer mechanism includes two lifting mechanisms respectively arranged in the buffer chamber and the main chamber and a transfer arm arranged between the two chambers. The two lifting mechanisms are raised synchronously to push the wafer away from the transfer arm for waiting for operation, and the two lifting mechanisms are lowered synchronously to lower the wafer to the transfer arm for waiting for transfer, thereby realizing the switching of different processes of the wafer.

[0029] However, the two lifting mechanisms may become asynchronous during long-term use. On the one hand, the wafer may not be lifted by the transfer arm to the lifting mechanism or lowered by the lifting mechanism to the transfer arm. On the other hand, it is easy to cause a position difference between the two chambers during the wafer transfer process, which has a significant negative impact on the wafer transfer accuracy and reliability.

[0030] In order to solve the problems in the prior art, the embodiment of the present application provides a vacuum film conveying mechanism and a semiconductor testing device. The vacuum film conveying mechanism provided by the embodiment of the present application is first introduced below.

[0031] See also Figures 1 to 3The vacuum wafer transfer mechanism provided in the embodiment of the present application is used to transfer wafers between the buffer chamber 01 and the main chamber 02. The vacuum wafer transfer mechanism includes a first fixed frame 110, a second fixed frame 120, a transfer assembly and a lifting mechanism. The first fixed frame 110 is arranged in the buffer chamber 01, and the second fixed frame 120 is arranged in the main chamber 02. The transfer assembly is used to transfer wafers between the first fixed frame 110 and the second fixed frame 120. The transfer assembly includes a base 210 and a rotary arm 220. The rotary arm 220 is movably arranged on the base 210 along the height direction, and the rotary arm 220 is rotatably connected to the base 210; the lifting mechanism is arranged in the main chamber 02, and the lifting mechanism includes a driving assembly and a lifting block 310. The driving assembly is used to drive the lifting block 310 to rise, so as to lift the wafer upward to make it separate from the second fixed frame 120, or drive the lifting block 310 to descend, so that the wafer falls to the second fixed frame 120.

[0032] The first fixing frame 110 refers to a component for supporting wafers in the buffer chamber 01, and the first fixing frame 110 is fixedly installed in the buffer chamber 01. The second fixing frame 120 refers to a component for supporting wafers in the main chamber 02, and the second fixing frame 120 is fixedly installed in the buffer chamber 01. The first fixing frame 110 and the second fixing frame 120 are relatively fixed.

[0033] See also Figure 2 , taking a process of transferring a wafer to be tested from the first fixing frame 110 to the second fixing frame 120 as an example, the rotary arm 220 descends to below the first fixing frame 110, and then rotates to below the first fixing frame 110; the rotary arm 220 rises and lifts up the wafer to be tested to separate it from the first fixing frame 110; the rotary arm 220 rotates to transfer the wafer to be tested to above the second fixing frame 120; the rotary arm 220 descends to below the second fixing frame 120, and the wafer to be tested falls steadily to the second fixing frame 120 to be inspected.

[0034] See also Figure 3 , taking a process in which a wafer is inspected in the main chamber 02 as an example, the wafer to be tested is transferred to the second fixed frame 120 by the transfer assembly, the rotary arm 220 rotates to exit the main chamber 02, and the driving assembly drives the lifting block 310 to rise to a position higher than the second fixed frame 120. During the lifting process of the lifting block 310, the wafer to be tested is supported, and the wafer to be tested is inspected with the lifting block 310 as a worktable; after the inspection is completed, the driving device drives the lifting block 310 to descend to a position lower than the second fixed frame 120, and the tested wafer falls steadily to the second fixed frame 120 to be transferred out by the transfer assembly.

[0035] Therefore, the vacuum wafer transfer mechanism avoids the dual-axis lifting of the buffer chamber 01 and the main chamber 02, and the wafer can be switched between the transfer assembly and different chambers through the single-axis lifting of the transfer assembly, thereby avoiding the asynchronous position difference that may occur during the lifting of the two chambers, and improving the wafer transfer accuracy and reliability. The vacuum wafer transfer mechanism is also provided with a lifting mechanism in the main chamber 02, and the lifting mechanism is lifted and lowered relative to the second fixed frame 120 in the main chamber 02 to realize the switching of the detection position and the transfer position of the wafer, thereby improving the efficiency of the wafer detection operation.

[0036] It can be understood that the vacuum film transfer mechanism provided in the present application is not only applicable to semiconductor testing equipment, but also applicable to various types of semiconductor processing equipment that perform film transfer operations under vacuum conditions.

[0037] See also Figures 1 to 3 According to some embodiments of the present application, the rotary arm 220 includes a first receiving portion, and the rotary arm 220 drives the first receiving portion 221 to rise and fall to lift or lower the wafer. The rotary arm 220 drives the first receiving portion 221 to rotate to transfer the wafer to the first fixed rack 110 in the buffer chamber 01 or the second fixed rack 120 in the main chamber 02.

[0038] See also Figures 4 to 6 According to some other embodiments of the present application, the swing arm 220 includes a first supporting portion 221 and a second supporting portion 222 distributed along its length direction, and the ends of the first supporting portion 221 and the second supporting portion 222 are connected to the rotating shaft of the swing arm 220, and the first supporting portion 221 and the second supporting portion 222 are rotatably alternately located on the first fixed frame 110 or the second fixed frame 120.

[0039] Specifically, in some embodiments, an isolation valve is separately provided between the buffer chamber 01 and the main chamber 02, the first fixing frame 110 is fixedly provided in the buffer chamber 01, and the second fixing frame 120 is fixedly provided in the main chamber 02, so that the first fixing frame 110 and the second fixing frame 120 are relatively fixedly provided; in other embodiments, the buffer chamber 01 is communicated with the main chamber 02, the first fixing frame 110 and the second fixing frame 120 are directly fixedly connected, and the rotary arm 220 rotates to drive the first receiving portion 221 and the second receiving portion 222 to rotate alternately between the first fixing frame 110 and the second fixing frame 120.

[0040] Optionally, the rotation axis of the rotary arm 220 is located at the midline of the first supporting portion 221 and the second supporting portion 222, and the first supporting portion 221 and the second supporting portion 222 have the same rotation radius, so that the first supporting portion 221 and the second supporting portion 222 are reciprocal, and the rotary arm 220 can continuously complete the position exchange of two different wafers at the first fixing frame 110 and the second fixing frame 120.

[0041] Optionally, the second receiving portion 222 has the same structure as the first receiving portion 221 , or the structure of the second receiving portion 222 is different from that of the first receiving portion 221 .

[0042] Therefore, the first receiving portion 221 and the second receiving portion 222 of the rotary arm 220 can simultaneously support the wafer to be tested and the tested wafer at the first fixed frame 110 and the second fixed frame 120, and realize the position exchange of the wafer to be tested and the tested wafer through rotation, and realize two wafer transfers with only one stroke, which significantly improves the wafer feeding efficiency and further improves the efficiency of the wafer detection operation process.

[0043] According to some embodiments of the present application, the supporting surface of the first fixing frame 110 is flush with the supporting surface of the second fixing frame 120 .

[0044] Optionally, the supporting surface of the second supporting part 222 is arranged flush with the supporting surface of the first supporting part 221. During the lifting and lowering of the rotary arm 220, the wafer to be tested and the wafer that has been tested can be maintained at the same height position and are simultaneously lifted up or lowered to the fixed frame by the rotary arm 220, so as to shorten the operation time of the vacuum wafer feeding mechanism and improve the operation efficiency.

[0045] Optionally, there is a height difference between the supporting surface of the second receiving portion 222 and the supporting surface of the first receiving portion 221 , and the wafer to be tested and the tested wafer can be lifted up or lowered to the fixed frame in the chamber by the rotary arm 220 one after another.

[0046] Thus, the wafer to be tested and the tested wafer can be synchronously lifted or lowered to the fixed frame in the chamber by the rotary arm 220, so as to shorten the transfer time of the wafer between the fixed frame and the rotary arm 220 as much as possible, thereby improving the wafer transfer efficiency and the inspection operation efficiency.

[0047] According to some embodiments of the present application, the first fixing frame 110 includes a plurality of first ejector pins 111 extending in the height direction, and the plurality of first ejector pins 111 are arranged in an array with top ends flush with each other.

[0048] Optionally, the plurality of first ejector pins 111 are evenly distributed along the circumference of the wafer.

[0049] Optionally, the plurality of first ejector pins 111 are evenly distributed along the radial direction of the wafer.

[0050] Thus, the multiple first ejector pins 111 arranged in an array form a supporting surface of the first fixed frame 110 to carry the wafer, reducing the contact area between the first fixed frame 110 and the wafer, thereby reducing the probability of adhesion and adsorption when the wafer is separated from the first fixed frame 110. At the same time, the supporting surface formed by the multiple first ejector pins 111 is perpendicular to the height direction, and can support the wafer from multiple positions, so that the wafer maintains a horizontal position, which helps to improve the reliability of wafer transmission.

[0051] It is understandable that in some other embodiments, the first fixing frame 110 includes a supporting platform whose area is smaller than the area of ​​the wafer so that the bottom of the wafer is partially exposed, so that the rotary arm 220 can support the wafer through the exposed portion of the bottom of the wafer.

[0052] According to some embodiments of the present application, the second fixing frame 120 includes a plurality of second ejector pins 121 extending in the height direction, and the plurality of second ejector pins 121 are arranged in an array with top ends flush with each other.

[0053] Optionally, the top of the second ejector pin 121 is flush with the top of the first ejector pin 111 , so that the supporting surface of the first fixing frame 110 is flush with the supporting surface of the second fixing frame 120 .

[0054] Optionally, the plurality of second ejector pins 121 are evenly distributed along the circumference of the wafer.

[0055] Optionally, the plurality of second ejector pins 121 are evenly distributed along the radial direction of the wafer.

[0056] Optionally, the distribution positions of the plurality of second ejector pins 121 relative to the wafer are the same as the distribution positions of the plurality of first ejector pins 111 relative to the wafer, so that the first fixing frame 110 and the second fixing frame 120 have the same or similar supporting effects for the same wafer.

[0057] Thus, the plurality of second ejector pins 121 arranged in an array form a supporting surface of the second fixing frame 120 to carry the wafer, reducing the contact area between the second fixing frame 120 and the wafer, thereby reducing the probability of adhesion and adsorption when the wafer is separated from the second fixing frame 120. The supporting surface formed by the plurality of second ejector pins 121 is perpendicular to the height direction to keep the wafer in a horizontal position, which helps to improve the stability of the wafer on the second fixing frame 120, thereby improving the reliability of wafer transmission.

[0058] It is understandable that in some other embodiments, the second fixing frame 120 includes a supporting platform whose area is smaller than the wafer so that the bottom of the wafer is partially exposed, so that the rotary arm 220 can support the wafer through the exposed portion of the bottom of the wafer.

[0059] According to certain embodiments of the present application, the lifting mechanism further includes a guide structure extending in the height direction, and the driving assembly drives the lifting block 310 to reciprocate along the guide structure.

[0060] Optionally, the guide structure includes a guide slideway, and the driving assembly directly drives the lifting block 310 to slide in the guide slideway to form a height difference with the second fixing frame 120 .

[0061] Optionally, the guide structure includes a guide block and a guide groove that are used in conjunction with each other, one of the guide block and the guide groove is set on the second fixed frame 120, and the other is set in the main chamber 02. When the driving component drives the lifting block 310 to move, the guide block and the guide groove cooperate to make the lifting block 310 move only in the height direction.

[0062] Optionally, the guide structure includes a guide member that slidably cooperates with the second ejector pin 121, the guide member is connected to the lifting block 310 and is slidably connected to the second ejector pin 121, and when the driving assembly drives the lifting block 310 to rise or fall, the guide member reciprocates along the second ejector pin 121 to limit the movement of the lifting block 310 in the height direction. Exemplarily, the guide member is provided corresponding to one of the second ejector pins 121, or a plurality of guide members are provided, and the plurality of guide members are provided in a one-to-one correspondence with the plurality of second ejector pins 121.

[0063] Thus, the guide structure can limit the moving direction of the driving block to prevent the wafer from moving in the horizontal plane when transferring between the second fixing frame 120 and the driving block, thereby avoiding position difference during wafer transfer and improving wafer feeding accuracy.

[0064] According to some embodiments of the present application, the driving assembly includes a first driving member 321 , and the lifting block 310 is connected to an output end of the first driving member 321 .

[0065] Optionally, the output end of the first driving member 321 moves along a first direction, which is different from the height direction. Specifically, the driving assembly further includes an active block 330, which is directly connected to the output end of the first driving member 321 and cooperates with the lifting block 310. The first driving member 321 drives the active block 330 to move along the first direction to drive the lifting block 310 to move in the height direction.

[0066] In some embodiments, the first direction is a horizontal direction, the active block 330 has a first inclined surface, the lifting block 310 has a second inclined surface, and the slopes of the first inclined surface and the second inclined surface are consistent. Figure 1 The first driving member 321 drives the active block 330 to move to the right, and the active block 330 pushes the lifting block 310 to move through the sliding cooperation between the first inclined surface and the second inclined surface. The lifting block 310 rises under the action of the guide structure to support the wafer on the second fixed frame 120; the first driving member 321 drives the active block 330 to move to the left, and the lifting block 310 falls back in the height direction due to its own weight after being no longer supported by the active block 330, so that the wafer that has completed the inspection is transferred to the second fixed frame 120.

[0067] Exemplarily, the first driving member 321 is a linear motor, which directly drives the active block 330 to move in the horizontal direction to realize the lifting block 310 to rise or fall, or the first driving member 321 is a stepper motor, and the output end of the stepper motor rotates to drive the active block 330 to move in the horizontal direction to realize the lifting block 310 to rise or fall. For example, the output end of the stepper motor is connected to the active block 330 through a ball screw pair.

[0068] Optionally, the lifting mechanism also includes a damping member, which is connected to the lifting block 310 to cushion the process of the lifting block 310 falling back under the action of gravity, thereby reducing the impact on the wafer when it is transferred from the lifting block 310 to the second fixing frame 120 and avoiding cracking of the wafer.

[0069] In some other embodiments, the driving assembly includes a worm gear mechanism, the worm wheel is arranged on the active block 330, the worm is arranged on the lifting block 310, the first direction is the circumferential direction of the worm wheel, the first driving member 321 drives the active block 330 to rotate and drives the worm wheel to rotate, and the worm is raised and lowered under the drive of the worm wheel structure to realize the position switching of the lifting block 310 relative to the second fixed frame 120.

[0070] In some other embodiments, the driving assembly also includes a connecting rod, the first direction is a horizontal direction, the two ends of the connecting rod are respectively hinged to the active block 330 and the lifting block 310, the first driving member 321 drives the active block 330 to reciprocate in the horizontal direction, and the active block 330 pushes the lifting block 310 to rise or pulls the lifting block 310 back through the connecting rod.

[0071] Thus, the first driving member 321 indirectly drives the lifting block 310 to move in the height direction, so as to lift up the wafer to be tested on the second fixing frame 120 or lower the tested wafer to the second fixing frame 120 for wafer transfer.

[0072] See also Figure 7 According to certain embodiments of the present application, the driving assembly includes a second driving member 322, the output end of the second driving member 322 reciprocates along the height direction, and the output end of the second driving member 322 is connected to the lifting block 310 to drive the lifting block 310 to move in the height direction.

[0073] Exemplarily, the second driving member 322 is configured as a linear motor or a telescopic cylinder to directly drive the lifting block 310 to move in the height direction.

[0074] Optionally, the driving assembly further includes a moving platform, which is fixed to the output end of the second driving member 322 and is used to carry the wafer.

[0075] In a second aspect, an embodiment of the present application provides a semiconductor testing device, which includes the vacuum film transfer mechanism provided by any of the aforementioned embodiments, so that the semiconductor testing device has all the beneficial effects of the aforementioned vacuum film transfer mechanism.

[0076] It should be understood that the semiconductor testing equipment provided in the present application includes but is not limited to equipment for performing quality testing on semiconductor products or equipment for performing size measurement on semiconductor products.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A vacuum film transmission mechanism, characterized in that: Used to transfer wafers between the buffer chamber and the main chamber, the vacuum wafer transfer mechanism comprises: A first fixing frame, disposed in the buffer chamber; A second fixing frame is disposed in the main chamber; A transfer assembly, used for transferring wafers between the first fixing frame and the second fixing frame, the transfer assembly comprising a base and a rotary arm, the rotary arm being movably arranged on the base along a height direction, the rotary arm being rotatably connected to the base to drive the wafer to transfer between the first fixing frame and the second fixing frame; The lifting mechanism is arranged in the main chamber, and the lifting mechanism includes a driving component and a lifting block. The driving component is used to drive the lifting block to rise so as to lift the wafer upward to make it detach from the second fixing frame, or drive the lifting block to descend so that the wafer falls onto the second fixing frame.

2. The vacuum film transmission mechanism according to claim 1, characterized in that: The first fixing frame includes a plurality of first ejector pins extending in the height direction, and the plurality of first ejector pins are arranged in an array to form a supporting surface, and / or the second fixing frame includes a plurality of second ejector pins extending in the height direction, and the plurality of second ejector pins are arranged in an array to form a supporting surface.

3. The vacuum film transmission mechanism according to claim 2, characterized in that: The lifting mechanism further comprises a guide structure extending in the height direction, and the driving assembly drives the lifting block to reciprocate along the guide structure.

4. The vacuum film transmission mechanism according to claim 3, characterized in that: The guide structure comprises a guide member slidably matched with the second ejector pin, the guide member is connected to the lifting block, and the guide member is slidably connected to the second ejector pin to limit the moving direction of the lifting block.

5. The vacuum film transmission mechanism according to claim 1 or 3, characterized in that: The driving assembly includes a first driving member and an active block, the active block is in transmission connection with the lifting block, and the first driving member drives the active block to move along a first direction to drive the lifting block to move in a height direction.

6. The vacuum film transmission mechanism according to claim 5, characterized in that: The first direction is a horizontal direction, the active block has a first inclined surface, and the lifting block has a second inclined surface, and the slope of the second inclined surface is consistent with that of the first inclined surface.

7. The vacuum film transmission mechanism according to claim 1 or 2, characterized in that: The driving assembly includes a second driving member, an output end of which reciprocates along the height direction, and the output end of the second driving member is connected to the lifting block to drive the lifting block to move in the height direction.

8. The vacuum film transmission mechanism according to claim 1, characterized in that: The swing arm includes a first receiving portion and a second receiving portion distributed along its length direction, and the ends of the first receiving portion and the second receiving portion are connected to the rotating shaft of the swing arm. The first receiving portion and the second receiving portion are rotated and alternately located on the first fixing frame or the second fixing frame.

9. The vacuum film transmission mechanism according to claim 8, characterized in that: The supporting surface of the first receiving portion is flush with the supporting surface of the second receiving portion, and the supporting surface of the first fixing frame is flush with the supporting surface of the second fixing frame.

10. A semiconductor testing device, characterized in that: It comprises a vacuum film transfer mechanism as described in any one of claims 1 to 9.

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