A high-power integrated circuit three-dimensional stacking packaging system

Abstract

The present invention relates to the technical field of integrated circuit packaging, and in particular to a high-power integrated circuit three-dimensional stacking packaging system. The system comprises a housing, wherein a plurality of limit shafts are arranged inside the housing, wherein a plurality of spacer components and a plurality of wafer carrier mechanisms are slidably connected to the plurality of limit shafts, and the plurality of wafer carrier mechanisms and the plurality of spacer components are arranged in an alternating manner; the wafer carrier mechanism comprises a limit frame, wherein an integrated circuit chip is plugged into the limit frame; the spacer component comprises a partition, wherein a plurality of adjustment mechanisms are embeddedly installed on the partition; the integrated circuit chips to be packaged are placed in a group of wafer carrier mechanisms respectively, and the integrated circuit chips are stacked and packaged, and the spacer components are used to electrically connect two adjacent groups of integrated circuit chips, and the distance between the two adjacent groups of integrated circuit chips can be automatically adjusted according to the heating conditions of the integrated circuit chips.

Description

Technical Field

[0001] The present invention belongs to the technical field of integrated circuit packaging, and in particular relates to a high-power integrated circuit three-dimensional stacking packaging system. Background Art

[0002] With the rapid development of information technology, high-performance computing and big data processing have put forward higher performance requirements for integrated circuits (ICs). Especially in the application of smart devices and servers, the power density of integrated circuits continues to increase, and traditional single-layer packaging technology cannot meet the needs of simultaneous electrical connection and packaging of multiple integrated circuit chips.

[0003] After searching, the prior art, announcement number: CN208889643U, announcement date: 2019-05-21, discloses a high-power integrated circuit packaging component that is conducive to heat dissipation, including a shell, a heat sink, an integrated circuit board, and a packaging board, the shell is a cylinder with two ends open, the heat sink is located at the upper part of the shell, the integrated circuit board is located in the middle part of the shell, and the packaging board is located at the lower part of the shell. By setting the shell, the heat sink and the packaging board, the integrated circuit board is packaged, and the heat sink is used to quickly dissipate the heat of the integrated circuit board. A groove is set in the middle of the shell so that the card plate of the heat sink and the packaging board fits with the groove, thereby enhancing the sealing performance of the entire component, and the structure is simple and easy to assemble.

[0004] However, the device still has the following defects: although the sealing performance of the entire component can be enhanced, the packaging component can only perform packaging operations on one group of integrated circuit chips at a time, and cannot meet the needs of simultaneous electrical connection and packaging of multiple dust collection circuit chips. Therefore, the packaging component has great limitations and is not very practical. Summary of the invention

[0005] In view of the above problems, the present invention provides a high-power integrated circuit three-dimensional stacking packaging system, comprising a housing, wherein a plurality of groups of limiting shafts are arranged inside the housing, a plurality of groups of spacing components and a plurality of groups of wafer carrier mechanisms are slidably connected to the plurality of groups of limiting shafts, and the plurality of groups of wafer carrier mechanisms and the plurality of groups of spacing components are arranged in an alternating manner;

[0006] The chip carrier mechanism comprises a limiting frame, and an integrated circuit chip is plugged into the limiting frame;

[0007] The spacing component includes a partition, on which a plurality of adjustment mechanisms are embedded, and the plurality of adjustment mechanisms are respectively attached to two adjacent groups of integrated circuit chips;

[0008] The integrated circuit chips to be packaged are placed in a group of carrier mechanisms respectively, and the integrated circuit chips are stacked and packaged. The two adjacent groups of integrated circuit chips are electrically connected through the spacing components, and the distance between the two adjacent groups of integrated circuit chips can be automatically adjusted according to the heating conditions of the integrated circuit chips.

[0009] Furthermore, a first sealing cover is provided on the shell, a maintenance box is provided on one side wall of the shell, a second sealing cover is provided on the maintenance box, a plurality of detection sockets are provided on the inner wall of the maintenance box, and a plurality of external pins are provided on both side walls of the shell, and the plurality of external pins are electrically connected to the external circuit respectively.

[0010] Furthermore, a heat sink is provided on the other side wall of the shell, a third sealing cover is provided on the heat sink, a heat conducting plate is embedded on the third sealing cover, a heat dissipation plate is installed on the outer side of the heat conducting plate, a plurality of groups of semiconductor refrigeration fins are installed on the inner side of the heat conducting plate, and the heat dissipation ends of the plurality of groups of semiconductor refrigeration fins are in contact with the heat conducting plate.

[0011] Furthermore, a vacuum pump is installed on the inner wall of the heat dissipation box, the air inlet end of the vacuum pump is connected to an air inlet pipe, the air inlet end of the air inlet pipe extends to the interior of the shell, the air outlet end of the vacuum pump is connected to a coil, the air outlet end of the coil extends to the interior of the shell, and the coil is in contact with the cooling ends of several groups of semiconductor refrigeration plates.

[0012] Furthermore, a substrate is provided at the bottom end of the inner wall of the shell, and the substrate is electrically connected to several groups of external pins respectively. The top of the substrate is in contact with a group of spacing components. Several groups of limiting shafts are slidably connected with extrusion blocks, and several groups of extrusion springs are provided between the extrusion blocks and the bottom end of the inner wall of the shell. Several groups of extrusion springs are respectively sleeved on several groups of limiting shafts, and several groups of extrusion blocks are movably in contact with a group of spacing components located at the top.

[0013] Furthermore, a flat cable is provided on one side wall of the limit frame, one end of the flat cable is electrically connected to a corresponding group of detection sockets, first limit holes are provided at the four corners of the limit frame, several groups of the first limit holes are movably fitted with a corresponding group of limit shafts, supporting plates are provided on the inner walls on both sides of the limit frame, several groups of conductive sockets are provided on the two groups of supporting plates, several groups of conductive sheets are provided on the limit frame, several groups of the conductive sheets are electrically connected to a corresponding group of conductive sockets, and several groups of the conductive sheets are electrically connected to the flat cable.

[0014] Furthermore, the carrier board and the bottom end of the integrated circuit chip are fitted together, and a plurality of groups of inner pins are provided at the bottom end of the integrated circuit chip, and the plurality of groups of inner pins are respectively movably plugged into a corresponding group of conductive sockets, and the plurality of groups of inner pins are respectively electrically connected to a corresponding group of conductive sockets, and a plurality of groups of conductive contacts are provided at both the upper and lower ends of the integrated circuit chip.

[0015] Furthermore, second limiting holes are opened at the four corners of the partition, and several groups of the second limiting holes are movably fitted with several groups of limiting shafts respectively. The upper and lower ends of the partition are fixedly connected with convex plates, and several groups of through holes are opened on the two groups of convex plates, and several groups of adjustment mechanisms are movably fitted with several groups of through holes on the two groups of convex plates respectively.

[0016] Furthermore, the adjustment mechanism includes a fixed disk, which is set to a conductive material and embedded in the partition. The upper and lower ends of the adjustment mechanism are fixedly connected to limiting cylinders, and inner tubes are provided in the two groups of limiting cylinders. Conductive columns are slidably connected to the two groups of inner tubes.

[0017] Furthermore, a conductive spring is arranged between the conductive column and the fixed plate, and the conductive spring is sleeved on the inner tube. Two groups of sliding plates are sleeved on the two groups of limiting cylinders, and an expansion tube is arranged between the two groups of sliding plates. The expansion tube is configured as a sealed and retractable annular tubular body, and coolant is stored in the expansion tube.

[0018] The beneficial effects of the present invention are:

[0019] 1. By placing the integrated circuit chips to be packaged into a group of carrier mechanisms respectively, and using a spacing component to complete the electrical connection between two adjacent groups of integrated circuit chips, the distance between the two adjacent groups of integrated circuit chips can be automatically adjusted according to the heat generation of the integrated circuit chips to improve the heat dissipation performance of the stacked packaging of the integrated circuit chips. By setting up multiple groups of carrier mechanisms and spacing components, the packaging system can stack and package multiple groups of integrated circuit chips, and the number of integrated circuit chips can be adjusted according to demand, effectively improving the practicality and universality of the packaging system.

[0020] 2. The heat generated by the operation of the integrated circuit chip is absorbed by the coolant in the expansion tube, so that part of the coolant evaporates into gas, the expansion tube expands, and a group of sliding plates squeezes an adjacent group of integrated circuit chips, so that the distance between the two adjacent groups of integrated circuit chips increases, and the heat dissipation speed is accelerated. When the heat generated by a group of integrated circuit chips is too high, the expansion height of the adjacent group of expansion tubes exceeds the preset value, the conductive column is separated from the conductive contact piece, so that the two adjacent groups of integrated circuit chips are disconnected, and overheating protection is achieved to prevent the integrated circuit chips from continuing to operate under the condition of excessively high temperature and causing failures, thereby effectively improving the safety of the packaging system.

[0021] 3. The heat generated by the operation of the integrated circuit in the shell enters the vacuum pump through the air inlet pipe, and then flows into the coil. The heat of the gas in the coil is absorbed by the semiconductor refrigeration plate, and then absorbed by the heat conduction plate and dissipated to the outside air through the heat sink. After the heat of the gas in the coil is absorbed, the low-temperature gas enters the shell, which realizes the cooling of the inside of the sealed shell, and effectively prevents the outside air from entering the shell and damaging the integrated circuit in the shell.

[0022] 4. By electrically connecting the integrated circuit chip to the conductive sheet, the integrated circuit chip is electrically connected to a corresponding group of detection sockets. By inserting the detection probe into the detection socket, the integrated circuit chip can be detected without opening the shell. When a group of integrated circuit chips fails, only the group of integrated circuit chips needs to be disassembled and replaced, without the need to disassemble all the integrated circuit chips for detection, which greatly reduces the difficulty of repairing and replacing the integrated circuit chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A schematic diagram of the main structure of an embodiment of the present invention is shown;

[0025] Figure 2 An exploded schematic diagram of the internal structure of a heat sink according to an embodiment of the present invention is shown;

[0026] Figure 3 A perspective view of the internal structure of a housing and an inspection box according to an embodiment of the present invention is shown;

[0027] Figure 4 A schematic diagram showing the positional relationship between the spacing assembly and the slide carrier mechanism according to an embodiment of the present invention is shown;

[0028] Figure 5 A schematic structural diagram of a slide carrier mechanism according to an embodiment of the present invention is shown;

[0029] Figure 6 An exploded schematic diagram of a spacing assembly structure according to an embodiment of the present invention is shown;

[0030] Figure 7 A schematic structural diagram of an adjustment mechanism according to an embodiment of the present invention is shown.

[0031] In the figure: 1, housing; 101, first sealing cover; 2, maintenance box; 201, second sealing cover; 202, detection jack; 3, heat dissipation box; 301, third sealing cover; 302, heat conduction plate; 303, heat dissipation plate; 304, semiconductor refrigeration plate; 305, vacuum pump; 306, air inlet pipe; 307, coil; 4, limit axis; 5, spacing component; 501, partition; 502, second limit hole; 503, convex plate; 504, through hole; 505, adjustment mechanism; 5051, Fixed plate; 5052, limiting cylinder; 5053, inner tube; 5054, conductive column; 5055, conductive spring; 5056, sliding plate; 5057, expansion tube; 6, film carrier mechanism; 601, limiting frame; 602, first limiting hole; 603, carrier plate; 604, conductive jack; 605, conductive sheet; 606, wiring; 7, substrate; 8, external pins; 9, integrated circuit chip; 901, conductive contact sheet; 902, inner pins; 10, extrusion block; 11, extrusion spring. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] The embodiment of the present invention provides a high-power integrated circuit three-dimensional stacking packaging system, including a housing 1; illustratively, as Figure 1-4 shown.

[0034] The housing 1 is provided with a first sealing cover 101, a side wall of the housing 1 is provided with a maintenance box 2, a second sealing cover 201 is provided on the maintenance box 2, and both side walls of the housing 1 are provided with a plurality of groups of external pins 8, and the plurality of groups of external pins 8 are electrically connected to external circuits respectively;

[0035] A heat dissipation box 3 is provided on the other side wall of the shell 1, and a third sealing cover 301 is provided on the heat dissipation box 3. A heat conducting plate 302 is embedded and installed on the third sealing cover 301. A heat dissipation plate 303 is installed on the outer side of the heat conducting plate 302. A plurality of groups of semiconductor cooling sheets 304 are installed on the inner side of the heat conducting plate 302. The heat dissipation ends of the plurality of groups of semiconductor cooling sheets 304 are attached to the heat conducting plate 302. A vacuum pump 305 is installed on the inner side wall of the heat dissipation box 3. The air inlet end of the vacuum pump 305 is connected to an air inlet pipe 306. The air inlet end of the air inlet pipe 306 extends to the interior of the shell 1. The air outlet end of the vacuum pump 305 is connected to a coil 307. The air outlet end of the coil 307 extends to the interior of the shell 1. The coil 307 and the cooling ends of the plurality of groups of semiconductor cooling sheets 304 are attached to each other.

[0036] The heat generated by the operation of the integrated circuit in the shell 1 is made to enter the vacuum pump 305 through the air inlet pipe 306, and then flows into the coil 307. The heat of the gas in the coil 307 is absorbed by the semiconductor refrigeration plate 304, and is absorbed by the heat conduction plate 302 and then dissipated to the external air through the heat dissipation plate 303. After the heat of the gas in the coil 307 is absorbed, the low-temperature gas enters the shell 1, thereby cooling the interior of the shell 1 and effectively preventing external air from entering the shell 1 and causing damage to the integrated circuit in the shell 1.

[0037] The inner wall of the inspection box 2 is provided with a plurality of detection jacks 202, and the interior of the shell 1 is provided with a plurality of limit shafts 4, and the plurality of limit shafts 4 are respectively arranged at the four corners of the bottom end of the inner wall of the shell 1, and the plurality of limit shafts 4 are slidably connected with a plurality of spacing components 5 and a plurality of film carrier mechanisms 6, and the plurality of film carrier mechanisms 6 and the plurality of spacing components 5 are staggered, and the bottom end of the inner wall of the shell 1 is provided with a substrate 7, and the substrate 7 is respectively electrically connected with a plurality of external pins 8, and the top end of the substrate 7 is fitted with a plurality of spacing components 5, and the plurality of limit shafts 4 are slidably connected with extrusion blocks 10, and extrusion springs 11 are respectively arranged between the plurality of extrusion blocks 10 and the bottom end of the inner wall of the shell 1, and the plurality of extrusion springs 11 are respectively sleeved on the plurality of limit shafts 4, and the plurality of extrusion blocks 10 are in active contact with a plurality of spacing components 5 located at the top;

[0038] The spacing component 5 includes a partition 501, which is movably fitted with several groups of limit shafts 4. The carrier mechanism 6 includes a limit frame 601, which is movably fitted with several groups of limit shafts 4. A cable 606 is provided on one side wall of the limit frame 601, and one end of the cable 606 is electrically connected to a corresponding group of detection sockets 202.

[0039] For example, Figure 5 shown.

[0040] The four corners of the limit frame 601 are provided with first limit holes 602, and several groups of the first limit holes 602 are movably fitted with a corresponding group of limit shafts 4, and the inner walls of both sides of the limit frame 601 are provided with carrier plates 603, and the two groups of the carrier plates 603 are provided with several groups of conductive plug holes 604, and the limit frame 601 is provided with several groups of conductive sheets 605, and several groups of the conductive sheets 605 are electrically connected with the corresponding group of conductive plug holes 604, and several groups of the conductive sheets 605 are electrically connected with the flat cable 606, and the limit frame 601 is plugged with an integrated circuit chip 9, and the bottom end of the integrated circuit chip 9 is provided with several groups of inner pins 902, and several groups of the inner pins 902 are movably plugged with the corresponding group of conductive plug holes 604, and several groups of the inner pins 902 are electrically connected with the corresponding group of conductive plug holes 604, and several groups of conductive contact sheets 901 are provided at the upper and lower ends of the integrated circuit chip 9;

[0041] Specifically, by placing a group of integrated circuit chips 9 in the limit frame 601, several groups of pins 902 are respectively inserted into the corresponding group of conductive sockets 604, the integrated circuit chip 9 is electrically connected to the conductive sheet 605, and the integrated circuit chip 9 is electrically connected to the corresponding group of detection sockets 202. By inserting the detection probe into the detection socket 202, the integrated circuit chip 9 can be detected without opening the shell 1. When a group of integrated circuit chips 9 fails, only the group of integrated circuit chips 9 needs to be disassembled and replaced, without the need to disassemble all the integrated circuit chips 9 for detection, which greatly reduces the difficulty of repairing and replacing the integrated circuit chips 9.

[0042] For example, Figure 6 and Figure 7 shown.

[0043] The four corners of the partition 501 are provided with second limiting holes 502, and several groups of the second limiting holes 502 are respectively movably fitted with several groups of limiting shafts 4. The upper and lower ends of the partition 501 are fixedly connected with convex plates 503, and the two groups of convex plates 503 are provided with several groups of through holes 504. Several groups of adjustment mechanisms 505 are embedded and installed on the partition 501, and several groups of the adjustment mechanisms 505 are respectively movably fitted with several groups of through holes 504 on the two groups of convex plates 503, and several groups of the adjustment mechanisms 505 are respectively fitted with two adjacent groups of integrated circuit chips 9.

[0044] The adjusting mechanism 505 comprises a fixed disk 5051, wherein the fixed disk 5051 is made of a conductive material and embedded in the partition 501. The upper and lower ends of the adjusting mechanism 505 are fixedly connected to the limiting cylinder 5052. The two groups of limiting cylinders 5052 are provided with inner tubes 5053. The two groups of inner tubes 5053 are slidably connected with conductive pillars 5054. The conductive pillars 5054 and the conductive contact pieces 901 on the adjacent group of integrated circuit chips 9 are mutually in conflict. A conductive spring 5055 is provided between the conductive pillars 5054 and the fixed disk 5051. The conductive spring 5055 is sleeved on the inner tube 5053. The two groups of limiting cylinders 5052 are sleeved with two groups of sliding plates 5056. An expansion tube 5057 is provided between the two groups of sliding plates 5056. The expansion tube 5057 is provided as a sealed and retractable annular tubular body. Cooling liquid is stored in the expansion tube 5057.

[0045] Specifically, two groups of conductive pillars 5054 respectively contact with the conductive contact pieces 901 on two adjacent groups of integrated circuit chips 9, and the two adjacent groups of integrated circuit chips 9 are electrically connected through the conductive spring 5055 and the fixed plate 5051. The tension of the conductive spring 5055 makes the conductive pillars 5054 and the conductive contact pieces 901 contact more closely. The coolant in the expansion tube 5057 absorbs the heat generated by the operation of the integrated circuit chip 9, so that part of the coolant evaporates into gas, and the expansion tube 5057 expands, so that a group of sliding plates 5056 squeezes the adjacent group of integrated circuit chips 9, so that the distance between the two adjacent groups of integrated circuit chips 9 is increased, and the heat dissipation speed is accelerated. When the heat generated by one group of integrated circuit chips 9 is too high, and the expansion height of the adjacent group of expansion tubes 5057 exceeds a preset value, the conductive pillars 5054 are separated from the conductive contact pieces 901, so that the two adjacent groups of integrated circuit chips 9 are disconnected, and overheating protection is achieved to prevent the integrated circuit chip 9 from continuing to operate under the condition of excessively high temperature and causing failure.

[0046] The working principle of the high-power integrated circuit three-dimensional stacking packaging system proposed by the present invention is as follows:

[0047] The integrated circuit chips 9 to be packaged are placed in a group of carrier mechanisms 6 respectively. When placing the integrated circuit chips 9, it is necessary to lift the spacing component 5 above the group of carrier mechanisms 6, place the group of integrated circuit chips 9 in the limit frame 601, and insert the pins 902 in the group into the corresponding group of conductive plug holes 604 respectively to limit and fix the integrated circuit chips 9. After the placement of the group of integrated circuit chips 9 is completed, the spacing component 5 above the group of carrier mechanisms 6 is lowered, so that the convex plate 503 on the spacing component 5 fits with the surface of the integrated circuit chip 9, and the two groups of conductive pillars 5054 are used to fix the integrated circuit chips 9. The conductive contacts 901 on the two adjacent groups of integrated circuit chips 9 respectively contact each other, and the two adjacent groups of integrated circuit chips 9 are electrically connected through the conductive spring 5055 and the fixed plate 5051, and the group of integrated circuit chips 9 located at the bottom is connected to the substrate 7 arranged at the bottom end of the inner wall of the shell 1 in the same way, thereby completing the electrical connection between the integrated circuit chips 9 inside the shell 1 and the integrated circuit chip 9 in the shell 1 is electrically connected to the external circuit through the external pin 8, and then the first sealing cover 101 is installed on the shell 1 to complete the stacking package of multiple groups of integrated circuit chips 9.

[0048] By setting up multiple groups of carrier mechanisms 6 and spacing components 5, the packaging system can stack and package multiple groups of integrated circuit chips 9, and at the same time, the number of integrated circuit chips 9 can be adjusted according to needs. By setting up several groups of limit axes 4, the position of the integrated circuit chips 9 will not deviate when the carrier mechanism 6 drives the integrated circuit chips 9 to move up and down, thereby improving the accuracy of the electrical connection between the several groups of integrated circuit chips 9.

[0049] Through the tension of the conductive spring 5055, the conductive column 5054 and the conductive contact piece 901 are in closer contact with each other, and the coolant in the expansion tube 5057 absorbs the heat generated by the operation of the integrated circuit chip 9, so that part of the coolant evaporates into gas, causing the expansion tube 5057 to expand, so that a group of sliding plates 5056 squeezes an adjacent group of integrated circuit chips 9, so that the distance between the two adjacent groups of integrated circuit chips 9 increases, and the heat dissipation speed is accelerated. When the heat generated by a group of integrated circuit chips 9 is too high, so that the expansion height of the adjacent group of expansion tubes 5057 exceeds a preset value, the conductive column 5054 is separated from the conductive contact piece 901, so that the two adjacent groups of integrated circuit chips 9 are disconnected, thereby realizing overheating protection and preventing the integrated circuit chip 9 from continuing to operate under the condition of excessively high temperature and causing failure.

[0050] The heat generated by the operation of the integrated circuit in the shell 1 is made to enter the vacuum pump 305 through the air inlet pipe 306, and then flows into the coil 307. The heat of the gas in the coil 307 is absorbed by the semiconductor refrigeration plate 304, and is absorbed by the heat conduction plate 302 and then dissipated to the external air through the heat dissipation plate 303. After the heat of the gas in the coil 307 is absorbed, the low-temperature gas enters the shell 1, thereby cooling the interior of the shell 1 and effectively preventing external air from entering the shell 1 and causing damage to the integrated circuit in the shell 1.

[0051] After the installation of the integrated circuit chip 9 is completed, the integrated circuit chip 9 is electrically connected to the conductive sheet 605, so that the integrated circuit chip 9 is electrically connected to a corresponding group of detection sockets 202. By inserting the detection probe into the detection socket 202, the integrated circuit chip 9 can be detected without opening the shell 1. When a group of integrated circuit chips 9 fails, only the group of integrated circuit chips 9 needs to be disassembled and replaced, without the need to disassemble all the integrated circuit chips 9 for detection, which greatly reduces the difficulty of repairing and replacing the integrated circuit chips 9.

[0052] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-power integrated circuit three-dimensional stacking packaging system, comprising a housing (1), characterized in that: A plurality of groups of limiting shafts (4) are arranged inside the housing (1), and a plurality of groups of spacing components (5) and a plurality of groups of film carrier mechanisms (6) are slidably connected to the plurality of groups of limiting shafts (4), and the plurality of groups of film carrier mechanisms (6) and the plurality of groups of spacing components (5) are arranged in a staggered manner; The chip carrier mechanism (6) comprises a limiting frame (601), and an integrated circuit chip (9) is plugged into the limiting frame (601); The spacing component (5) comprises a partition (501), on which a plurality of groups of adjustment mechanisms (505) are embedded and mounted, and the plurality of groups of adjustment mechanisms (505) are respectively attached to two adjacent groups of integrated circuit chips (9); The integrated circuit chips (9) to be packaged are respectively placed in a group of chip carrier mechanisms (6) to stack and package the integrated circuit chips (9); two adjacent groups of integrated circuit chips (9) are electrically connected by a spacing component (5); and the distance between the two adjacent groups of integrated circuit chips (9) can be automatically adjusted according to the heating conditions of the integrated circuit chips (9); The adjustment mechanism (505) comprises a fixed disk (5051), the fixed disk (5051) is configured to be made of a conductive material, the fixed disk (5051) is embedded in the partition (501), the upper and lower ends of the adjustment mechanism (505) are fixedly connected to limiting cylinders (5052), two groups of limiting cylinders (5052) are each provided with an inner tube (5053), and the two groups of inner tubes (5053) are each slidably connected to a conductive column (5054); A conductive spring (5055) is provided between the conductive column (5054) and the fixed disk (5051), and the conductive spring (5055) is sleeved on the inner tube (5053). Two groups of sliding plates (5056) are sleeved on the two groups of limiting cylinders (5052), and an expansion tube (5057) is provided between the two groups of sliding plates (5056). The expansion tube (5057) is configured as a sealed, retractable annular tubular body, and a coolant is stored in the expansion tube (5057).

2. The high power integrated circuit three-dimensional stacking packaging system according to claim 1, characterized in that: The shell (1) is provided with a first sealing cover (101), a side wall of the shell (1) is provided with a maintenance box (2), a second sealing cover (201) is provided on the maintenance box (2), an inner wall of the maintenance box (2) is provided with a plurality of groups of detection jacks (202), and both side walls of the shell (1) are provided with a plurality of groups of external pins (8), and the plurality of groups of external pins (8) are respectively electrically connected to external circuits.

3. The high power integrated circuit three-dimensional stacking packaging system according to claim 2, characterized in that: A heat dissipation box (3) is provided on the other side wall of the shell (1), a third sealing cover (301) is provided on the heat dissipation box (3), a heat conduction plate (302) is embedded on the third sealing cover (301), a heat dissipation plate (303) is installed on the outer side of the heat conduction plate (302), a plurality of groups of semiconductor cooling fins (304) are installed on the inner side of the heat conduction plate (302), and the heat dissipation ends of the plurality of groups of semiconductor cooling fins (304) are in contact with the heat conduction plate (302).

4. The high power integrated circuit three-dimensional stacking packaging system according to claim 3, characterized in that: A vacuum pump (305) is installed on the inner wall of the heat dissipation box (3); an air inlet end of the vacuum pump (305) is connected to an air inlet pipe (306); the air inlet end of the air inlet pipe (306) extends to the interior of the shell (1); an air outlet end of the vacuum pump (305) is connected to a coil (307); the air outlet end of the coil (307) extends to the interior of the shell (1); the coil (307) and the cooling ends of a plurality of groups of semiconductor cooling sheets (304) are in contact with each other.

5. The high power integrated circuit three-dimensional stacking packaging system according to claim 4, characterized in that: A base plate (7) is provided at the bottom end of the inner wall of the shell (1), and the base plate (7) is electrically connected to a plurality of groups of external pins (8) respectively. The top end of the base plate (7) is in contact with a group of spacing components (5). A plurality of groups of limiting shafts (4) are slidably connected with extrusion blocks (10). A plurality of groups of extrusion blocks (10) are provided between the bottom end of the inner wall of the shell (1). A plurality of groups of extrusion springs (11) are respectively sleeved on a plurality of groups of limiting shafts (4). A plurality of groups of extrusion blocks (10) are in active contact with a group of spacing components (5) located at the top.

6. The high power integrated circuit three-dimensional stacking packaging system according to claim 1, characterized in that : A cable (606) is arranged on one side wall of the limit frame (601), one end of the cable (606) is electrically connected to a corresponding group of detection sockets (202), four corners of the limit frame (601) are provided with first limit holes (602), several groups of the first limit holes (602) are movably fitted with a corresponding group of limit shafts (4), two inner walls of the limit frame (601) are provided with supporting plates (603), two groups of the supporting plates (603) are provided with several groups of conductive sockets (604), the limit frame (601) is provided with several groups of conductive sheets (605), several groups of the conductive sheets (605) are electrically connected to a corresponding group of conductive sockets (604), and several groups of the conductive sheets (605) are electrically connected to the cable (606).

7. The high power integrated circuit three-dimensional stacking packaging system according to claim 6, characterized in that: The carrier plate (603) and the bottom end of the integrated circuit chip (9) are bonded to each other, and the bottom end of the integrated circuit chip (9) is provided with a plurality of groups of inner pins (902), and the plurality of groups of inner pins (902) are respectively movably plugged with a corresponding group of conductive sockets (604), and the plurality of groups of inner pins (902) are respectively electrically connected with a corresponding group of conductive sockets (604), and the upper and lower ends of the integrated circuit chip (9) are both provided with a plurality of groups of conductive contact sheets (901).

8. The high power integrated circuit three-dimensional stacking packaging system according to claim 1, characterized in that: The partition (501) is provided with second limiting holes (502) at four corners, and a plurality of groups of the second limiting holes (502) are movably fitted with a plurality of groups of limiting shafts (4) respectively. The upper and lower ends of the partition (501) are fixedly connected with convex plates (503), and a plurality of groups of through holes (504) are provided on the two groups of convex plates (503). A plurality of groups of the adjustment mechanisms (505) are movably fitted with the plurality of groups of through holes (504) on the two groups of convex plates (503).

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