A heat sink for a chip

Abstract

This invention relates to the field of chip heat sink technology, specifically to a heat sink for chips, comprising a base, the base including a heat-conducting plate for contacting the chip; a vapor chamber on the heat-conducting plate, with multiple heat pipes evenly connected around the circumference of the vapor chamber, multiple annular heat dissipation fins fixedly inserted on the heat pipes, the multiple heat dissipation fins being distributed vertically, each heat dissipation fin having a central hole, a cooling pipe rotatably disposed within the central hole of the multiple heat dissipation fins, a fan disposed on the inner side of the top of the cooling pipe, and multiple liquid cooling plates disposed on the outer circumference of the cooling pipe, the liquid cooling plates rotating synchronously with the cooling pipe, each liquid cooling plate being located between two adjacent heat dissipation fins, the cooling pipe having multiple air outlets evenly distributed along the circumference of the cooling pipe and evenly distributed vertically along the cooling pipe, the diameter of the air outlets gradually decreasing from top to bottom, extending the overall service life of the heat dissipation fins.

Description

Technical Field

[0001] The invention relates to the technical field of chip radiators, and in particular to a radiator for a chip. Background Art

[0002] The heat dissipation level of electronic chips and components during operation is directly related to the reliability of electronic equipment. In particular, for independent high heat flux density electronic chips (such as CPU, GPU, LED) with high sensitivity to thermal load, the heat dissipation level significantly affects their working stability and service life.

[0003] In the prior art, heat pipe radiators are usually used to dissipate heat from electronic chips. For example, patent document CN108615714B discloses a gravity reflux hot column chip radiator, in which cooling fins are installed on the hot column. The cooling fins are arranged along the height direction of the hollow column. Since the distances between each cooling fin and the heat source are inconsistent, cooling fins at different heights have different operating temperatures, which affects the consistency of the service life of the surface coating of the cooling fins and reduces the overall service life of the cooling fins. Summary of the invention

[0004] Based on this, it is necessary to provide a heat sink for chips to address the technical problem of low service life of the heat pipe radiator fins.

[0005] The above purpose is achieved through the following technical solutions:

[0006] 10. The heat dissipation device as claimed in claim 9, wherein the bridge has two opposite ends, and one of the ends is disconnected from the mounting plate to form a cutout between the two ends of the heat dissipation device and the mounting plate, the cutouts being connected to the heat dissipation device as the heat dissipation device is connected to the mounting plate.

[0007] Furthermore, the heat dissipation fins are wavy in the circumferential direction of the air-cooling pipe, the heat dissipation fins have wave crests and wave troughs, and the heat pipes are arranged at the wave crests of the heat dissipation fins.

[0008] Furthermore, the liquid cooling plate includes a fixing ring, which is circumferentially connected with a plurality of groups of heat exchange chambers, and the shape of the heat exchange chambers is wavy; each group of heat exchange chambers extends along the radial direction of the cooling fins, and along the up and down directions, the maximum size of the heat exchange chamber is smaller than the maximum distance between two adjacent cooling fins.

[0009] Furthermore, each group of heat exchange chambers includes a first heat exchange chamber and a second heat exchange chamber, the first heat exchange chamber and the second heat exchange chamber are of the same size, and an end of the first heat exchange chamber away from the air-cooling tube is connected to an end of the second heat exchange chamber away from the air-cooling tube, and the flow direction of the cooling liquid in the first heat exchange chamber and the second heat exchange chamber is opposite.

[0010] Furthermore, along the radial direction of the liquid cooling plate, the flow direction of the first heat exchange chamber is from inside to outside, and the flow direction of the second heat exchange chamber is from outside to inside. The upper arc surface of the first heat exchange chamber and the lower arc surface of the second heat exchange chamber are heat-conductive soft films, and the heat-conductive soft films can be deformed in the up and down directions under the action of hydraulic pressure.

[0011] Furthermore, the lower arc surface of the first heat exchange chamber and the upper arc surface of the second heat exchange chamber are metal plates.

[0012] Furthermore, each fixed ring is provided with a plurality of liquid inlets and liquid outlets extending in the up-and-down directions, the liquid inlet is connected to the first heat exchange chamber, the liquid outlet is connected to the second heat exchange chamber, and in two adjacent liquid cooling plates, the liquid outlet of the upper liquid cooling plate is correspondingly connected to the liquid inlet of the lower liquid cooling plate, and the liquid inlet of the uppermost liquid cooling plate is connected to the liquid outlet of the lowermost liquid cooling plate through a reflux assembly.

[0013] Furthermore, the reflux assembly includes a diverter ring and a reflux pipe, the diverter ring is located on the top liquid cooling plate and is connected to multiple liquid inlets of the top liquid cooling plate, a main liquid inlet is provided above the diverter ring, and the main liquid inlet is connected to the upper end opening of the reflux pipe; the reflux pipe is located inside the air cooling pipe, a reflux cavity is provided at the lower end of the reflux pipe, a plurality of reflux holes are provided in the circumference of the reflux cavity, and the reflux holes are connected to multiple liquid outlets of the bottom liquid cooling plate through a connecting pipe.

[0014] Furthermore, a frame is fixedly provided on the heat conduction plate, a driving motor is provided on the frame, a cover is fixedly provided on the top of the air cooling pipe, a bevel gear ring is provided on the outer periphery of the cover, a bevel gear is installed on the output shaft of the driving motor, and the bevel gear is meshed with the bevel gear ring.

[0015] Furthermore, two splines are provided on the inner side of each of the fixing rings, and two key slots extending in the up-down direction are provided on the air-cooling pipe, and the splines can slide along the key slots.

[0016] The beneficial effects of the present invention are:

[0017] The heat sink for chips provided by the present invention, the air-cooling pipe is located in the central hole of the heat sink fins, so that the wind generated by the fan can be evenly blown in the radial direction of the heat sink fins, so that the temperature of each layer of the heat sink fins is uniform, and the temperature gradient in the same plane is ensured. Since the lower heat sink fins are closer to the chips and thus have a high temperature, the diameter of the air outlet gradually decreases from top to bottom, so that the wind speed of the lower air outlet is high, and the lower heat sink fins cool down faster, while the wind speed of the upper air outlet is low, so that the upper heat sink fins cool down slowly, so that the temperatures of the upper and lower heat sink fins are close, and the temperature gradient of each layer of heat sink fins is reduced, thereby extending the overall service life of the heat sink fins.

[0018] Second, the coolant flows from top to bottom. Since the temperature of the upper cooling fins is low and the temperature of the lower cooling fins is high, the coolant can be fully utilized for cooling. The coolant flows back and forth along the radial direction of the liquid cooling plate, which can evenly cool the radial direction of the cooling fins, making the inner and outer temperatures of the cooling fins along the radial direction close to the same.

[0019] Third, each liquid cooling plate rotates back and forth relative to the heat sink fins. During the rotation process, the heat exchange cavity of the liquid cooling plate is squeezed by the heat sink fins, promoting the flow of coolant in the first heat exchange cavity and the second heat exchange cavity, thereby improving the heat dissipation effect of the liquid cooling plate on the heat sink fins. At the same time, the upper arc surface of the first heat exchange cavity and the lower arc surface of the second heat exchange cavity can be deformed in the up and down directions under the action of hydraulic pressure, so that the first heat exchange cavity vibrates the heat sink fins on the upper side, and the second heat exchange cavity vibrates the heat sink fins on the lower side. The vibration can break the boundary layer of the air layer, increase the flow of gas, and thus improve the heat dissipation efficiency of the heat sink fins.

[0020] Fourth, the deformation of the first heat exchange chamber and the second heat exchange chamber can change the flow direction of the airflow on the cooling fins, thereby improving the heat exchange efficiency of the cooling fins; at the same time, due to the rotation of the liquid cooling plate relative to the cooling fins, the upper arc surface of the first heat exchange chamber and the lower arc surface of the second heat exchange chamber can make friction contact with the cooling fins, thereby cleaning the dust on the surface of the cooling fins. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the three-dimensional structure of a heat sink for a chip provided in one embodiment of the present invention;

[0022] Figure 2 A schematic diagram of an exploded structure of a heat sink for a chip provided in one embodiment of the present invention;

[0023] Figure 3 A schematic structural diagram of a base in a heat sink for a chip provided in one embodiment of the present invention;

[0024] Figure 4A schematic diagram of the structure of a heat sink fin in a heat sink for a chip provided by an embodiment of the present invention;

[0025] Figure 5 A schematic structural diagram of a liquid cooling plate in a heat sink for a chip provided in one embodiment of the present invention;

[0026] Figure 6 A schematic structural diagram of a liquid cooling plate and a connecting pipe at the bottom of a heat sink for a chip provided in one embodiment of the present invention;

[0027] Figure 7 A schematic structural diagram of a topmost liquid cooling plate and a diverter ring in a heat sink for a chip provided in an embodiment of the present invention;

[0028] Figure 8 A schematic diagram of a portion of the structure of a liquid cooling plate in a heat sink for a chip provided in one embodiment of the present invention;

[0029] Fig. 9 A partial structural cross-sectional view of a liquid cooling plate in a heat sink for a chip provided in one embodiment of the present invention;

[0030] Fig.10 A schematic diagram of the structure of a heat exchange cavity in a heat sink for a chip provided in one embodiment of the present invention;

[0031] Fig.11 A schematic diagram of the structure of an air cooling tube in a heat sink for a chip provided by an embodiment of the present invention;

[0032] Fig.12 A schematic diagram of the structure of a return pipe in a heat sink for a chip provided by an embodiment of the present invention;

[0033] Fig.13 A schematic structural diagram of an end cover in a heat sink for a chip provided in one embodiment of the present invention;

[0034] Fig.14 A schematic diagram of the cooperation between the heat sink fins and the liquid cooling plate in a heat sink for a chip provided in one embodiment of the present invention;

[0035] Fig.15 for Fig.14 Enlarged view of point A in the middle.

[0036] in:

[0037] 100, base; 110, heat conduction plate; 120, temperature equalizing box; 121, positioning boss; 130, heat pipe; 140, mounting plate; 150, rack; 200, heat sink fin; 201, mounting hole; 300, liquid cooling plate; 301, fixing ring; 302, heat exchange cavity; 3021, first heat exchange cavity; 3022, second heat exchange cavity; 303, soft bend pipe; 304, liquid inlet; 305, liquid outlet; 321, connecting pipe; 331, diverter ring; 33 2. Main liquid inlet; 333. Spline; 400. Air cooling pipe; 401. Limiting groove; 402. Avoiding groove; 403. Air outlet; 404. Mounting ring groove; 405. Threaded hole; 406. Keyway; 500. Return pipe; 501. Return chamber; 502. Return hole; 503. Shield; 600. Fan; 700. Cover; 701. Second ring groove; 702. Bevel gear ring; 703. Locking bolt; 704. First ring groove; 800. Drive motor. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0039] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. are based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0040] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0041] like Figures 1 to 15 As shown, a heat sink for a chip provided by an embodiment of the present invention comprises a base 100, wherein the base 100 comprises a heat conducting plate 110, wherein the heat conducting plate 110 is used to contact the chip; a temperature equalizing box 120 is arranged on the heat conducting plate 110, wherein the circumference of the temperature equalizing box 120 is evenly connected with a plurality of heat pipes 130 extending in the up-down direction, wherein a plurality of annular heat dissipating fins 200 are fixedly penetrated on the heat pipes 130, wherein the plurality of heat dissipating fins 200 are distributed in the up-down direction, wherein the heat dissipating fins 200 have a central hole, wherein an air cooling pipe 400 is rotatably arranged in the central hole of the plurality of heat dissipating fins 200, wherein the top of the air cooling pipe 400 A mounting ring groove 404 is provided, and a fan 600 is provided in the mounting ring groove 404. The fan 600 is used to blow air to the air-cooling pipe 400. A plurality of liquid cooling plates 300 distributed in the up-down direction are provided on the periphery of the air-cooling pipe 400. The liquid cooling plates 300 rotate synchronously with the air-cooling pipe 400. Each of the liquid cooling plates 300 is located between two adjacent heat dissipation fins 200. A plurality of air outlets 403 are provided on the air-cooling pipe 400. The air outlets 403 are evenly distributed along the circumference of the air-cooling pipe 400, and the air outlets 403 are evenly distributed up and down along the air-cooling pipe 400. The diameter of the air outlets 403 gradually decreases from top to bottom. The heat pipe 130 is a prior art, and a plurality of heat dissipation fins 200 have the same structure and are arranged in parallel. A positioning boss 121 is provided on the temperature-averaging box 120, and a limiting groove 401 is provided at the bottom of the air-cooling pipe 400. The limiting groove 401 is positioned and matched with the positioning boss 121.

[0042] After such configuration, the wind generated by the fan 600 can be evenly blown toward the radial direction of the heat sink fins 200, so that the temperature of each layer of the heat sink fins 200 is uniform, ensuring the temperature gradient on the same plane. Since the lower layer of the heat sink fins 200 is closer to the chip and thus has a higher temperature, the diameter of the air outlet 403 gradually decreases from top to bottom, so that the wind speed of the lower layer of the air outlet 403 is high, and the lower layer of the heat sink fins 200 cools down faster, while the wind speed of the upper layer of the air outlet 403 is low, so that the upper layer of the heat sink fins 200 cools down slowly, so that the temperatures of the upper and lower layers of the heat sink fins 200 are close, and the temperature gradient of each layer of the heat sink fins 200 is reduced, thereby extending the overall service life of the heat sink fins 200.

[0043] In one embodiment, the heat sink fins 200 are wavy in the circumferential direction of the air cooling tube 400, and the heat sink fins 200 have crest positions and trough positions, and the heat pipes 130 are arranged at the crest positions of the heat sink fins 200. There are 2N crest positions, and N heat pipes 130 are arranged. The heat pipes 130 are arranged at one of two adjacent crest positions of the heat sink fins 200. In this embodiment, N is 9. In other embodiments, N can be greater than or equal to 3.

[0044] In this embodiment, a mounting hole 201 is provided at the crest position of the heat sink fin 200, and the mounting hole 201 of the heat sink fin 200 is interference-pierced on the heat pipe 130. The heat pipe 130 is connected to the crest position of the heat sink fin 200, and since the crest position is exposed to more wind, the heat transfer efficiency between the heat pipe 130 and the heat sink fin 200 can be improved.

[0045] In one embodiment, the liquid cooling plate 300 includes a fixing ring 301, and the fixing ring 301 is circumferentially connected with a plurality of heat exchange chambers 302, each of which is wavy in shape and is located between two adjacent heat pipes 130; each group of heat exchange chambers 302 extends along the radial direction of the heat dissipation fins 200, and the maximum size of the heat exchange chamber 302 in the vertical direction is smaller than the maximum distance between two adjacent heat dissipation fins 200. Each group of heat exchange chambers 302 corresponds to the position between two adjacent heat pipes 130, and the heat exchange chamber 302 can reciprocate and circulate between two adjacent heat pipes 130. The diameter of the liquid cooling plate 300 is close to the diameter of the heat dissipation fins 200.

[0046] In one embodiment, each group of heat exchange chambers 302 includes a first heat exchange chamber 3021 and a second heat exchange chamber 3022, the first heat exchange chamber 3021 and the second heat exchange chamber 3022 are of the same size, and the first heat exchange chamber 3021 and the second heat exchange chamber 3022 are connected to each other through an end of the first heat exchange chamber 3021 and the second heat exchange chamber 3022 away from the air-cooling pipe 400 through a soft bend pipe 303, and the flow directions of the coolant in the first heat exchange chamber 3021 and the second heat exchange chamber 3022 are opposite.

[0047] In one embodiment, along the radial direction of the liquid cooling plate 300, the flow direction of the first heat exchange chamber 3021 is from inside to outside, and the flow direction of the second heat exchange chamber 3022 is from outside to inside. The upper arc surface of the first heat exchange chamber 3021 and the lower arc surface of the second heat exchange chamber 3022 are thermally conductive soft films, and the thermally conductive soft films can be deformed in the up and down directions under the action of hydraulic pressure.

[0048] In one embodiment, the lower arc surface of the first heat exchange cavity 3021 and the upper arc surface of the second heat exchange cavity 3022 are metal plates, and the metal plates are not easily deformed.

[0049] In one embodiment, each fixing ring 301 is provided with a plurality of liquid inlets 304 and liquid outlets 305 extending in the up-down direction, the liquid inlet 304 is connected to the first heat exchange cavity 3021, and the liquid outlet 305 is connected to the second heat exchange cavity 3022. In two adjacent liquid cooling plates 300, the liquid outlet 305 of the upper liquid cooling plate 300 is correspondingly connected to the liquid inlet 304 of the lower liquid cooling plate 300, and the liquid inlet 304 of the uppermost liquid cooling plate 300 is connected to the liquid outlet 305 of the lowermost liquid cooling plate 300 through a reflux component.

[0050] In one embodiment, the reflux assembly includes a bypass ring 331 and a reflux pipe 500, the bypass ring 331 is located on the top liquid cooling plate 300 and is connected to multiple liquid inlets 304 of the top liquid cooling plate 300, a main liquid inlet 332 is provided above the bypass ring 331, and the main liquid inlet 332 is connected to the upper end opening of the reflux pipe 500; the reflux pipe 500 is located inside the air cooling pipe 400, and its upper end passes through the center of the fan 600, and a reflux cavity 501 is provided at the lower end of the reflux pipe 500, and multiple reflux holes 502 are provided in the circumference of the reflux cavity 501, and the reflux holes 502 are connected to multiple liquid outlets 305 of the bottom liquid cooling plate 300 through a connecting pipe 321. The bottom of the air cooling pipe 400 is provided with an escape groove 402 for escaping the connecting pipe 321 , and the bottom of the return pipe 500 is provided with a shielding cover 503 , and the shielding cover 503 protects the connecting pipe 321 .

[0051] In one embodiment, a mounting plate 140 is fixedly provided on the heat conducting plate 110, a frame 150 is fixedly provided on the mounting plate 140, a driving motor 800 is provided at the center position of the frame 150, a cover 700 is fixedly provided on the top of the air-cooling tube 400, a bevel gear ring 702 is provided on the outer periphery of the cover 700, a bevel gear is installed on the output shaft of the driving motor 800, and the bevel gear is meshed with the bevel gear ring 702, thereby realizing the rotation of the air-cooling tube 400. The top of the air cooling tube 400 is provided with a plurality of threaded holes 405, the outer periphery of the middle part of the cover 700 is provided with a first annular groove 704, the inner periphery of the lower part of the cover 700 is provided with a second annular groove 701, the second annular groove 701 is matched with the top of the air cooling tube 400 in an upper and lower stop manner, a plurality of locking bolts 703 are passed through between the first annular groove 704 and the second annular groove 701, and the cover 700 is locked and fixed to the top of the air cooling tube 400 by passing the locking bolts 703 through the threaded holes 405. The mounting plate 140 is provided with a fixing hole, which is used to be fixedly connected to the chip.

[0052] In one embodiment, two splines 333 are provided on the inner side of each of the fixing rings 301 , and two keyways 406 extending in the up-down direction are provided on the air-cooling tube 400 , and the splines 333 can slide along the keyways 406 .

[0053] In combination with the above embodiments, the use principle and working process of the embodiments of the present invention are as follows:

[0054] Before use, assemble the heat sink for the chip so that the heat sink fins 200 and the liquid cooling plate 300 are arranged in sequence, fix the mounting plate 140 to the chip surface, and apply thermal grease between the heat conducting plate 110 and the chip to increase the thermal conductivity. Under the action of the fan 600, the gas flows to each heat sink fin 200 through the air outlet 403 of the air cooling pipe 400, and each heat sink fin 200 is blown from the inside to the outside to dissipate heat, so that the temperature of each layer of heat sink fins 200 is uniform, and the temperature gradient on the same plane is ensured. Since the diameter of the air outlet 403 gradually decreases from top to bottom, the temperatures of each layer of heat sink fins 200 distributed above and below are close, and the temperature gradient of each layer of heat sink fins 200 is reduced, thereby extending the overall service life of the heat sink fins 200.

[0055] The coolant forms a coolant circulation between each liquid cooling plate 300, and the coolant flows from top to bottom while circulating radially along the liquid cooling plate 300. The specific flow direction is that after the coolant enters the fixed ring 301 through the liquid inlet 304, it flows from inside to outside along the first heat exchange cavity 3021, enters the soft curved pipe 303, flows from outside to inside through the second heat exchange cavity 3022 to the liquid outlet 305, and then enters the lower liquid cooling plate 300 to flow in the same direction, until it flows out from the liquid outlet 305 of the lowermost liquid cooling plate 300, flows through the reflux cavity 501 of the reflux pipe 500, and flows to the liquid inlet 332 of the upper diverter ring 331, and the diversion of the diverter ring 331 realizes the circulation of the coolant. The coolant flows from top to bottom. Since the temperature of the upper heat sink fins 200 is low and the temperature of the lower heat sink fins 200 is high, the coolant can be fully utilized for cooling. The coolant flows back and forth radially along the liquid cooling plate 300, which can uniformly cool the heat sink fins 200 in the radial direction, making the inner and outer temperatures of the heat sink fins 200 along the radial direction nearly consistent.

[0056] Start the drive motor 800, so that the drive motor 800 drives the air cooling tube 400 to rotate back and forth in a cycle, and the rotation angle is smaller than the angle between two adjacent heat pipes 130, thereby driving each liquid cooling plate 300 to rotate back and forth relative to the heat dissipation fins 200. During the rotation process, the heat exchange cavity 302 of the liquid cooling plate 300 is squeezed by the heat dissipation fins 200, which promotes the flow of coolant in the first heat exchange cavity 3021 and the second heat exchange cavity 3022, thereby improving the heat dissipation effect of the liquid cooling plate 300 on the heat dissipation fins 200. At the same time, the upper arc surface of the first heat exchange chamber 3021 and the lower arc surface of the second heat exchange chamber 3022 can be deformed in the up and down directions under the action of hydraulic pressure, so that the first heat exchange chamber 3021 vibrates the heat dissipation fins 200 on the upper side, and the second heat exchange chamber 3022 vibrates the heat dissipation fins 200 on the lower side. The vibration can break the boundary layer of the air layer and increase the flow of gas, thereby improving the heat dissipation efficiency of the heat dissipation fins 200; and the deformation of the first heat exchange chamber 3021 and the second heat exchange chamber 3022 can change the flow direction of the airflow on the heat dissipation fins 200, thereby improving the heat exchange efficiency of the heat dissipation fins 200; at the same time, due to the rotation of the liquid cooling plate 300 relative to the heat dissipation fins 200, the upper arc surface of the first heat exchange chamber 3021 and the lower arc surface of the second heat exchange chamber 3022 can make friction contact with the heat dissipation fins 200, thereby cleaning the dust on the surface of the heat dissipation fins 200.

[0057] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The above-described embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A heat sink for a chip, characterized in that:

10. The heat dissipation device as described in claim 9, wherein the bridge has two opposite ends, and one of the ends is disconnected from the mounting plate to form a cutout between the two ends of the heat dissipation device and the mounting plate, the wires being collected by the bridge to form a cutout between the two ends. The heat dissipation device as described in claim 9, wherein the bridge has two ends, and the other ends are connected to the mounting plate to form a cutout between the two ends.

2. The heat sink for a chip according to claim 1, characterized in that: The heat dissipation fins are wavy in the circumferential direction of the air cooling tube, the heat dissipation fins have wave crest positions and wave trough positions, and the heat pipes are arranged at the wave crest positions of the heat dissipation fins.

3. The heat sink for a chip according to claim 1, characterized in that: The liquid cooling plate includes a fixed ring, which is circumferentially connected with a plurality of groups of heat exchange chambers, and the shape of the heat exchange chambers is wavy; each group of heat exchange chambers extends along the radial direction of the heat dissipation fins, and along the up and down directions, the maximum size of the heat exchange chamber is smaller than the maximum distance between two adjacent heat dissipation fins.

4. The heat sink for a chip according to claim 3, characterized in that: Each group of heat exchange chambers includes a first heat exchange chamber and a second heat exchange chamber. The first heat exchange chamber and the second heat exchange chamber are of the same size, and an end of the first heat exchange chamber away from the air cooling tube is connected to an end of the second heat exchange chamber away from the air cooling tube. The flow directions of the coolant in the first heat exchange chamber and the second heat exchange chamber are opposite.

5. The heat sink for a chip according to claim 4, characterized in that: Along the radial direction of the liquid cooling plate, the flow direction of the first heat exchange chamber is from inside to outside, and the flow direction of the second heat exchange chamber is from outside to inside. The upper arc surface of the first heat exchange chamber and the lower arc surface of the second heat exchange chamber are heat-conductive soft films, and the heat-conductive soft films can be deformed in the up and down directions under the action of hydraulic pressure.

6. The heat sink for a chip according to claim 5, characterized in that: The lower arc surface of the first heat exchange chamber and the upper arc surface of the second heat exchange chamber are metal plates.

7. The heat sink for a chip according to claim 6, characterized in that: Each fixed ring is provided with a plurality of liquid inlets and liquid outlets extending in the up-and-down directions, the liquid inlet is connected to the first heat exchange chamber, the liquid outlet is connected to the second heat exchange chamber, and in two adjacent liquid cooling plates, the liquid outlet of the upper liquid cooling plate is correspondingly connected to the liquid inlet of the lower liquid cooling plate, and the liquid inlet of the uppermost liquid cooling plate is connected to the liquid outlet of the lowermost liquid cooling plate through a reflux assembly.

8. The heat sink for a chip according to claim 7, characterized in that: The reflux assembly includes a diverter ring and a reflux pipe. The diverter ring is located on the top liquid cooling plate and is connected to multiple liquid inlets of the top liquid cooling plate. A main liquid inlet is provided above the diverter ring, and the main liquid inlet is connected to the upper end opening of the reflux pipe. The reflux pipe is located inside the air cooling pipe, and a reflux cavity is provided at the lower end of the reflux pipe. Multiple reflux holes are provided in the circumference of the reflux cavity, and the reflux holes are connected to multiple liquid outlets of the bottom liquid cooling plate through connecting pipes.

9. The heat sink for a chip according to claim 1, characterized in that: A frame is fixedly provided on the heat conduction plate, a driving motor is provided on the frame, a cover is fixedly provided on the top of the air cooling pipe, a bevel gear ring is provided on the outer periphery of the cover, a bevel gear is installed on the output shaft of the driving motor, and the bevel gear is meshed with the bevel gear ring.

10. The heat sink for a chip according to claim 3, characterized in that: Two splines are arranged on the inner side of each of the fixing rings, and two keyways extending in the up-down direction are arranged on the air-cooling pipe, and the splines can slide along the keyways.

Images